JP4826305B2 - Temperature measurement method for color filter manufacturing process - Google Patents
Temperature measurement method for color filter manufacturing process Download PDFInfo
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本発明は、温度センサー付きＲＦＩＤ埋め込みカラーフィルタ基板型温度測定器及びそれを用いたカラーフィルタ製造工程の温度測定方法及びその温度管理システムに関する。 The present invention relates to an RFID embedded color filter substrate type temperature measuring device with a temperature sensor, a temperature measuring method of a color filter manufacturing process using the temperature measuring method, and a temperature management system thereof.
近年、液晶表示装置は、その表示画面の画素数が増加し高精細化となり、その表示画面が大型化となる傾向が顕著となり、その傾向が加速されている。そのために、液晶表示装置に用いるカラーフィルタでも画素パターンの微細化と、その基板の大型化に対応するための技術開発が要望されている。 In recent years, the number of pixels on the display screen of a liquid crystal display device has been increased and the definition has been increased, and the tendency of the display screen to become larger has become remarkable, and this tendency has been accelerated. For this reason, there is a demand for the development of technology for coping with the miniaturization of pixel patterns and the enlargement of the substrate of color filters used in liquid crystal display devices.
従来のフォトリソグラフィ法を用いた表示装置用のカラーフィルタの製造においては、そのプロセス温度の管理が重要となる。 In manufacturing a color filter for a display device using a conventional photolithography method, it is important to manage the process temperature.
フォトリソグラフィ法を用いたカラーフィルタの製造では、画素パターンは感光性レジストからなるパターンで形成されている。画素パターンを形成する感光性レジストは、感光性の樹脂等に着色したもので、例えばアクリル系樹脂を用いて、基板上の１〜５μｍ厚の薄膜レジスト層を形成後、フォトマスクを介して画素用パターンを転写しレジストパターンを形成する。前記薄膜レジスト層を形成したあと、該レジスト層にプリベークの処理を実行する。図３（ａ）に示すように、プリベーク処理は、前半に高い温度で加熱処理され、後半は室温近傍の所定温度まで冷却するプロセス温度の管理する製造工程がある。前半では、レジストの感度を調整する処理であり、基板自身の温度を正確な温度及び正確な時間に維持することが重要である。なお、前記製造工程では、高温の曝す処理の工程と、室温近傍の一定温度に維持する工程の分かれ、図３に示すように混在するライン構成である。 In the manufacture of a color filter using a photolithography method, the pixel pattern is formed by a pattern made of a photosensitive resist. The photosensitive resist that forms the pixel pattern is colored photosensitive resin or the like. For example, an acrylic resin is used to form a thin film resist layer having a thickness of 1 to 5 μm on the substrate, and then the pixel pattern is passed through a photomask. The pattern for use is transferred to form a resist pattern. After forming the thin film resist layer, a pre-bake process is performed on the resist layer. As shown in FIG. 3A, the pre-bake process includes a manufacturing process in which the first half is heated at a high temperature, and the second half is a process temperature controlled to a predetermined temperature near room temperature. The first half is a process for adjusting the sensitivity of the resist, and it is important to maintain the temperature of the substrate itself at an accurate temperature and at an accurate time. Note that the manufacturing process has a mixed line configuration as shown in FIG. 3, which is divided into a high temperature exposure process and a constant temperature process near room temperature.
フォトリソグラフィ法を用いたカラーフィルタの製造では、カラーフィルタ用の基板の大型化は、基板自身温度による熱膨張による長寸法の変動の増加する問題がある。図３（ａ）に示すプリベークの後半が、冷却不足により標準温度より高い温度の基板となり、該基板を次工程の露光工程に搬送された場合、露光工程の内の基板温度は、不安定となり、その変動により長寸法のバラツキが増加する場合もあり、問題となる。 In the manufacture of a color filter using a photolithographic method, an increase in the size of a substrate for a color filter has a problem in that a change in a long dimension due to thermal expansion due to the temperature of the substrate itself increases. When the second half of the pre-bake shown in FIG. 3A becomes a substrate having a temperature higher than the standard temperature due to insufficient cooling, and the substrate is transported to the next exposure step, the substrate temperature in the exposure step becomes unstable. The variation in the long dimension may increase due to the variation, which is a problem.
カラーフィルタの製造工程において、各々製造装置でのカラーフィルタ用基板に加わる温度の測定は、カラーフィルタ用基板等に熱電対を装着して、その温度を測定する方法が一般的である。
In the color filter manufacturing process, the temperature applied to the color filter substrate in each manufacturing apparatus is generally measured by attaching a thermocouple to the color filter substrate or the like and measuring the temperature.
前記熱電対を用いたカラーフィルタ用基板（以下基板と記す）の温度の測定では以下の問題がある。
Measurement of the temperature of a color filter substrate (hereinafter referred to as a substrate) using the thermocouple has the following problems.
カラーフィルタの製造工程は、ウエットプロセス、例えばレジストの塗布処理、レジストの現像処理、エッチング溶液によるエッチング処理及びそのレジストの剥膜処理の場合、液体がカラーフィルタ用基板に掛かるため、熱電対での温度測定が困難である。
The manufacturing process of color filters, wet process, for example, resist coating treatment, development treatment of the resist, in the case of the etching solution etching treatment and剥膜processing of the resist, since the liquid is applied to the substrate for a color filter, a thermocouple It is difficult to measure the temperature.
また、カラーフィルタの製造工程は、ドライプロセスとウエットプロセスが混在するため、熱電対を装着した基板を順番に工程内を搬送しながら、連続して温度を測定することが不可能である。
In addition, since the dry process and the wet process are mixed in the color filter manufacturing process, it is impossible to continuously measure the temperature while sequentially transporting the substrate on which the thermocouple is mounted in the process.
従来の熱電対を装着した基板を用いた温度測定は、温度測定基板を製造工程内へ投入し、順番に工程内を搬送しながら、予め設定した時間毎、又は設定した装置毎に不連続に温度を測定することが不可能である。従って、従来の熱電対を装着した基板を用いた温度測定は、全工程内での温度負荷、例えば温度の変化率等を監視することが困難となる問題がある。
Temperature measurement using a substrate equipped with a conventional thermocouple, was charged with the temperature measurement substrate into the manufacturing process, while conveying the process sequentially, preset time each, or set the discontinuity for each device It is impossible to measure the temperature. Therefore, there is a problem that it is difficult to monitor the temperature load, for example, the rate of change in temperature, in the entire process, in the temperature measurement using the substrate on which the conventional thermocouple is mounted.
以下に公知文献を記す。
本発明の課題は、フォトリソグラフィ法を用いた表示装置用のカラーフィルタの製造においては、その装置での温度測定が容易なカラーフィルタ基板の温度測定器を提供うることであり、設定した時間毎、又は設定した装置毎に温度を測定する温度測定方法を提供することである。 SUMMARY OF THE INVENTION An object of the present invention is to provide a color filter substrate temperature measuring device that can easily measure temperature in a device for manufacturing a color filter for a display device using a photolithographic method. Or providing a temperature measuring method for measuring the temperature for each set device.
本発明の請求項１に係る発明は、温度センサー付きＲＦＩＤ埋め込みカラーフィルタ基板型温度測定器を用いた、ウエットプロセスとドライプロセスとが混在したカラーフィルタ製造工程内での基板に加わる温度の温度測定方法であって、
前記温度センサー付きＲＦＩＤ埋め込みカラーフィルタ基板型温度測定器は、形状が、カラーフィルタ基板と同一形状であり、カラーフィルタ基板型温度測定器の表面には、複数箇所に温度センサーと、配線層と、少なくとも１個のＲＦＩＤが埋め込まれており、表面が基板の表面高さまで覆われ防水処理されており、前記温度センサーは配線層を介してＲＦＩＤと導通され、前記カラーフィルタ基板型温度測定器をテストピースとして、所定の間隔毎に製造工程のラインへ投入し、予め設定された製造工程中の通過点位置または装置毎にセンサーの読み取り温度と、その測定時間及び通過点位置名または装置名の情報をＲＦＩＤに記録し、前記ＲＦＩＤは、ＩＣチップとアンテナ及び電源等制御回路を備え、前記アンテナを介して製造工程ラインの周辺位置に配置したＩＣタグリーダへ記録した情報を非接触により通信し、各々工程の通過点または装置毎にその温度情報を、操作表示端末装置、データベース及びＷｅｂサーバにネットワーク化された前記ＩＣタグリーダで読み取り、該温度情報を操作表示端末装置に出力し、開示することを特徴とするカラーフィルタ製造工程の温度測定方法である。
The invention according to claim 1 of the present invention is a temperature measurement of temperature applied to a substrate in a color filter manufacturing process in which a wet process and a dry process are mixed, using an RFID embedded color filter substrate type temperature measuring device with a temperature sensor. A method ,
RFID embedded color filter substrate type temperature measuring instrument with the temperature sensor, shape, a color filter board the same shape, on the surface of the color filter substrate type temperature measuring apparatus, and a temperature sensor at a plurality of locations, wirings Layer and at least one RFID are embedded, the surface is covered to the surface height of the substrate and waterproofed, and the temperature sensor is electrically connected to the RFID through the wiring layer, and the color filter substrate type temperature measurement The test piece is put into the production process line at predetermined intervals as a test piece, and the sensor reading temperature, the measurement time, and the passing point position name or device for each passing point position or device in the manufacturing process set in advance. Name information is recorded on the RFID, and the RFID includes an IC chip, an antenna, a control circuit such as a power supply, and the manufacturing process via the antenna. The information recorded in the IC tag reader arranged in the peripheral position of the in-line is communicated in a non-contact manner, and the temperature information for each process passing point or device is networked to the operation display terminal device, the database and the Web server. A temperature measurement method in a color filter manufacturing process, which is disclosed by reading with a tag reader, outputting the temperature information to an operation display terminal device, and disclosing the temperature information.
本発明の請求項２に係る発明は、装置間、又は処理間の通過点には、予めチェックポイントを設け、当該チェックポイントで処理名、装置名を新規登録し、温度情報等データをＲＦＩＤに記録する場合、その情報データ、その測定時間、装置名を併せて記録することを特徴とする請求項１に記載のカラーフィルタ製造工程の温度測定方法である。
In the invention according to claim 2 of the present invention, a checkpoint is provided in advance at a passing point between devices or between processes, a process name and a device name are newly registered at the checkpoint, and data such as temperature information is stored in the RFID. 2. The temperature measurement method of a color filter manufacturing process according to claim 1, wherein the information data, the measurement time, and the device name are recorded together when recording .
本発明によれば、カラーフィルタの製造工程のラインの各装置での温度がＩＣタグリー
ダで読み取られ、リアルタイムでそれらの情報がデータベースに登録され、不良発生の監視、又はその発生要因の分析データとして活用でき、さらに不良発生を早期発見等により不良品の発生を防止し、良品率の向上につながる効果がある。
According to the present invention, the temperature at each device in the color filter manufacturing process line is read by an IC tag reader, and the information is registered in a database in real time to monitor the occurrence of defects or as analysis data of the cause of the occurrence. In addition, it is possible to prevent the occurrence of defective products by early detection of the occurrence of defects, leading to an improvement in the yield rate.
本発明によれば、各装置間での通過したことをＩＣタグリーダで読み取られ、リアルタイムにそれらの情報が開示され、その装置内での温度情報がすぐに把握できる。 According to the present invention, the passage between the devices is read by the IC tag reader, the information is disclosed in real time, and the temperature information in the device can be immediately grasped.
本発明によれば、ウエットプロセス内の通過点での基板の温度情報、又は処理溶液の温度情報をＩＣタグリーダで読み取られ、リアルタイムでそれらの情報が開示され、その装置内での温度情報がすぐに把握できる。 According to the present invention, the temperature information of the substrate at the passing point in the wet process or the temperature information of the processing solution is read by the IC tag reader, the information is disclosed in real time, and the temperature information in the apparatus is immediately available. Can grasp.
本発明によれば、本発明のカラーフィルタ基板型温度測定器をテストピースとして、製造ラインへ投入し、該基板型温度測定器を搬送しながら温度測定することができ、センサーの読み取り温度、測定時間等の情報をＲＦＩＤに記録するため正確な温度推移が把握でき、予め設定した基準温度グラフと、前記実測した温度との差を監視し、異常時の早期発見を検出することが可能となる。 According to the present invention, the color filter substrate-type temperature measuring device of the present invention can be used as a test piece, put into a production line, and measured while the substrate-type temperature measuring device is being transported. Since information such as time is recorded in the RFID, accurate temperature transition can be grasped, and the difference between the preset reference temperature graph and the actually measured temperature can be monitored to detect early detection at the time of abnormality. .
本発明の温度センサー付きＲＦＩＤ埋め込みカラーフィルタ基板型温度測定器及びそれを用いた温度測定方法を一実施形態に基づいて以下説明する。 An RFID embedded color filter substrate type temperature measuring device with a temperature sensor of the present invention and a temperature measuring method using the same will be described below based on an embodiment.
図１は、本発明の温度センサー付きＲＦＩＤ埋め込みカラーフィルタ基板型温度測定器の一実施例を説明する部分拡大図であり、（ａ）は、上面図で、（ｂ）は側断面図である。 FIG. 1 is a partially enlarged view for explaining an embodiment of an RFID embedded color filter substrate type temperature measuring device with a temperature sensor according to the present invention, wherein (a) is a top view and (b) is a side sectional view. .
図１（ａ）は、温度センサー付きＲＦＩＤ埋め込みカラーフィルタ基板型温度測定器（以下基板型温度測定器１００と記す）であり、基板型温度測定器の基板（以下測定器基板１と記す）形状は、カラーフィルタ用基板（以下基板と記す）と同一とし、すなわち長さ幅及び厚さが同じ寸法である。また測定器基板１の基材もカラス基材で形成した。基板型温度測定器の測定器基板表面には、複数箇所に温度センサー１０が埋め込まれ、少なくとも１個のＲＦＩＤ２０が埋め込まれている。前記温度センサー１０は、ＲＦＩＤ２０と配線層３０を介して導通されている。 FIG. 1A shows an RFID-embedded color filter substrate type temperature measuring device (hereinafter referred to as a substrate type temperature measuring device 100) with a temperature sensor, and the shape of the substrate type temperature measuring device (hereinafter referred to as a measuring device substrate 1). Is the same as the color filter substrate (hereinafter referred to as substrate), that is, the length, width and thickness are the same. Moreover, the base material of the measuring device board | substrate 1 was also formed with the crow base material. The temperature sensor 10 is embedded in a plurality of locations on the surface of the measuring instrument substrate of the substrate type temperature measuring instrument, and at least one RFID 20 is embedded. The temperature sensor 10 is electrically connected to the RFID 20 via the wiring layer 30.
前記測定器基板１の基材は、ガラス基板を用いたが、耐熱性樹脂基板を用いることもある。 Although the glass substrate was used as the base material of the measuring instrument substrate 1, a heat resistant resin substrate may be used.
図１（ａ）では、測定器基板１の四隅に温度センサー１０が配置されている。各々温度センサー１０は地番が配付され、各々の温度センサー毎に温度を測定し、記録され、当該温度情報を表示する機能を備えている。 In FIG. 1 (a), temperature sensors 10 are arranged at the four corners of the measuring instrument substrate 1. Each temperature sensor 10 is assigned a lot number, and has a function of measuring and recording the temperature for each temperature sensor and displaying the temperature information.
前記ＲＦＩＤ２０は、測定器基板の一方側の端部の中央部に配置されている。前記位置は、基板搬送方向を図上の上方に向け、その両側端部の一方側、例えば操作側端部に配置することが好ましい。 The RFID 20 is arranged at the center of one end of the measuring instrument substrate. The position is preferably arranged on one side of both side end portions, for example, operation side end portions, with the substrate transport direction facing upward in the drawing.
前記配線層３０は、測定器基板の表面近傍に設け、ＲＦＩＤ２０と温度センサー１０とを導通するための配線層が配置されている。前記配線層の形成方法は、公知の方法で、例えば金属薄膜を成膜、又は銅線を敷設する等を用いて形成する。 The wiring layer 30 is provided in the vicinity of the surface of the measuring instrument substrate, and a wiring layer for conducting the RFID 20 and the temperature sensor 10 is disposed. The wiring layer is formed by a known method, for example, by forming a metal thin film or laying a copper wire.
前記の温度センサー１０、ＲＦＩＤ２０及び配線層３０は、測定器基板の表面近傍に公知の方法、例えばレーザー照射による穿孔法等を用いて、凹状の溝を彫り、該凹状の溝内
に温度センサー１０、ＲＦＩＤ２０及び配線層３０を実装したあと埋め込まれており、その表面がガラス材質で覆われ防水加工されている。
The temperature sensor 10, the RFID 20, and the wiring layer 30 are formed by carving a concave groove in the vicinity of the surface of the measuring instrument substrate using a known method, for example, a perforation method by laser irradiation, and the temperature sensor 10 in the concave groove. It is embedded after mounting the RFID 20 and the wiring layer 30, and its surface is covered with a glass material and waterproofed.
図１（ｂ）は、図１（ａ）の基板型温度測定器のＸ−Ｘ’の側断面図であり、温度センサー１０、ＲＦＩＤ２０及び配線層３０を埋め込まれた測定器基板の表面近傍の部分拡大図である。測定器基板の端部中央にＲＦＩＤ２０が配置され、両隅に温度センサー１０が配置され、ＲＦＩＤ２０と各々温度センサー１０は、配線層３０で回路を形成した構造である。ＲＦＩＤ２０、温度センサー１０、及び配線層３０はその表面上にガラス、又は耐熱性樹脂、例えばポリイミド材質で測定器基板の表面高さまで覆われている。 FIG. 1B is a cross-sectional side view taken along the line XX ′ of the substrate type temperature measuring device of FIG. 1A, and shows the vicinity of the surface of the measuring device substrate in which the temperature sensor 10, the RFID 20 and the wiring layer 30 are embedded. It is a partial enlarged view. The RFID 20 is arranged at the center of the end of the measuring instrument substrate, the temperature sensors 10 are arranged at both corners, and the RFID 20 and each temperature sensor 10 have a structure in which a circuit is formed by the wiring layer 30. The RFID 20, the temperature sensor 10, and the wiring layer 30 are covered to the surface height of the measuring instrument substrate with glass or a heat-resistant resin such as polyimide.
前記ＲＦＩＤ２０は、ＩＣチップ２１と、アンテナ２２を備え、該アンテナ２２を介して周辺装置２００と非接触により情報を通信する電源等制御回路２３を装備している。 The RFID 20 includes an IC chip 21 and an antenna 22, and a power source control circuit 23 that communicates information with the peripheral device 200 through the antenna 22 in a non-contact manner.
前記ＩＣチップ２１は、温度測定に係わる情報データを記録及び該データの入出力を管理する役割を備えている。前記電源等制御回路２３は、記録データを外部の周辺装置へ出力、又は周辺装置からの情報データをＩＣチップ２１へ入力と、非接触の通信及び電源の確保等の制御全般を担う役割を備えている。前記アンテナ２２は、非接触の通信を担う役割を備えている。なお、前記測定器基板及びＲＦＩＤは、耐熱性に優れた基材を選択する必要があり、その耐熱性の目安の温度は２７０度摂氏位で選択することが好ましい。 The IC chip 21 has a role of recording information data related to temperature measurement and managing input / output of the data. The power supply control circuit 23 has a role of performing overall control such as output of recording data to an external peripheral device or input of information data from the peripheral device to the IC chip 21 and non-contact communication and securing of power supply. ing. The antenna 22 has a role of performing non-contact communication. In addition, it is necessary to select the base material excellent in heat resistance for the measuring instrument substrate and the RFID, and it is preferable to select the temperature of the standard of heat resistance at about 270 degrees Celsius.
本発明の基板型温度測定器の使用方法は、実生産のカラーフィルタの基板と同じように製造工程に投入して、使用するテストピースのようなものであり、例えば生産ロット間に、又は製造条件出しのときに製造ラインへ投入され、製造工程内の温度負荷を把握するためのものである。本発明の基板型温度測定器１００は、何度も繰り返し使用するものである。 The method of using the substrate-type temperature measuring device of the present invention is like a test piece that is put into a manufacturing process and used in the same manner as a substrate of an actual color filter, for example, between production lots or manufactured. It is put into the production line when the conditions are set, and is used to grasp the temperature load in the production process. The substrate-type temperature measuring device 100 of the present invention is used repeatedly over and over.
前記測定器基板１は、その表面に実生産のカラーフィルタの基板と同じようにフォトリソグラフィ法のプロセス処理が施され、例えば、レジスト塗布処理、処理溶液を用いた現像処理等による皮膜が形成される。次いで、製造工程内から回収後に、前記皮膜の剥膜処理及び洗浄と、ＲＦＩＤ２０の記録データの初期化が実行される。次いで、再度次の製造工程への投入となる。以上のように繰り返し使用されるものである。従って、基板型温度測定器基板１００は、前記各々の処理に対応する耐性が必要となり、前記測定器基板では、対応する耐性を備えるように工夫されている。 The measuring instrument substrate 1 is subjected to a photolithography process process on the surface in the same manner as an actually produced color filter substrate. For example, a film is formed by a resist coating process, a developing process using a processing solution, or the like. The Next, after recovering from the manufacturing process, the film is removed and washed, and the recording data of the RFID 20 is initialized. Then, it is input again to the next manufacturing process. As described above, it is used repeatedly. Therefore, the substrate-type temperature measuring device substrate 100 needs to have resistance corresponding to each of the processes, and the measuring device substrate is devised to have corresponding resistance.
図２は、本発明の基板型温度測定器１００のシステムの一実施例の構成図である。 FIG. 2 is a configuration diagram of an embodiment of the system of the substrate type temperature measuring device 100 of the present invention.
前記基板型温度測定器１００のＲＦＩＤ２０は、アンテナ２２を介して製造工程の周辺に配置した周辺装置２００のＩＣタグリーダ４０へ記録した情報を非接触により通信する。前記ＩＣタグリーダ４０は、装置の一方側、例えば操作側に配置し、ＩＣタグリーダ４０相互の間隔は、ＲＦＩＤ２０の装置性能に従う方法で配置することが好ましい。前記周辺装置２００は、ＩＣタグリーダ４０を窓口とし、ＩＣタグリーダ４０を中心に端末表示装置４１、データベース４２及びＷｅｂサーバ４３をネット回線で結ばれている。周辺装置２００は、ＲＦＩＤ２０に記録した情報データをＩＣタグリーダ４０によって読み取り、各々工程の通過点、又は装置毎にその温度等情報データを、所定の方法によりデータベース化し記録したデータベースと、表示端末装置及びＷｅｂサーバのネットワークを介してデータベースからの情報データを開示する機能を備えている。前記ＩＣタグリーダは読み取り専用であり、必要時には、ＩＣタグリーダに替えてＩＣタグリーダ／ライタを用いることもある。前記ＩＣタグリーダ／ライタは、ＲＦＩＤから読み取りと、ＲＦＩＤへの書き込みが可能な装置である。 The RFID 20 of the substrate-type temperature measuring device 100 communicates the recorded information to the IC tag reader 40 of the peripheral device 200 arranged around the manufacturing process via the antenna 22 in a non-contact manner. The IC tag reader 40 is preferably arranged on one side of the apparatus, for example, on the operation side, and the IC tag reader 40 is preferably arranged in a manner according to the apparatus performance of the RFID 20. The peripheral device 200 has an IC tag reader 40 as a window, and a terminal display device 41, a database 42, and a web server 43 are connected by a net line with the IC tag reader 40 as a center. The peripheral device 200 reads the information data recorded in the RFID 20 with the IC tag reader 40, and a database in which information data such as the passing point of each process or each device is converted into a database by a predetermined method, a display terminal device, It has a function of disclosing information data from a database via a network of Web servers. The IC tag reader is read-only, and when necessary, an IC tag reader / writer may be used instead of the IC tag reader. The IC tag reader / writer is a device that can read from and write to an RFID.
すなわち周辺装置２００は、温度等情報データをデータ開示する役割である。本発明のカラーフィルタ製造工程の温度測定方法は、基板型温度測定器１００により負荷温度を測定及び記録し、基板型温度測定器１００から非接触の通信により周辺装置２００へ温度等情報データを伝達し、周辺装置２００により該温度等情報データを開示する方法である。 That is, the peripheral device 200 serves to disclose information data such as temperature. The temperature measurement method of the color filter manufacturing process of the present invention measures and records the load temperature by the substrate type temperature measuring device 100, and transmits the temperature and other information data from the substrate type temperature measuring device 100 to the peripheral device 200 by non-contact communication. The temperature information information data is disclosed by the peripheral device 200.
図３は、本発明のカラーフィルタ製造工程の温度測定方法の一実施例を説明する製造工程の加熱履歴グラフであり、（ａ）は設定温度であり、（ｂ）は，実測温度を併記したグラフである。縦軸は加熱温度であり、横軸は、装置又は工程である。 FIG. 3 is a heating history graph of the manufacturing process for explaining an embodiment of the temperature measuring method of the color filter manufacturing process of the present invention, (a) is the set temperature, and (b) is the measured temperature. It is a graph. The vertical axis represents the heating temperature, and the horizontal axis represents the apparatus or process.
前記基板型温度測定器を用いたカラーフィルタ製造工程の温度測定方法では、測定器基板１をテストピースとして、製造ラインへ投入し、予め設定された装置毎にセンサーの読み取り温度、測定時間、読み取り装置名の情報をＲＦＩＤに記録する。この場合、測定器基板１は、表面のレジスト薄膜を形成後、面内均一なレジスト感度とするためのホットプレートによる加熱処理（図上Ａ）と、クールプレートによる冷却処理（図上Ｂ）と、露光光を照射する露光装置（図上Ｃ）と、現像処理液による現像処理（図上Ｄ）と、レジストパターンの膜物性を強化する加熱によるポストベーク（図上Ｅ）のライン内を処理されながら、順次搬送され、温度測定を実行し、該実測した温度情報をＲＦＩＤ２０に記録する。なお、装置間、又は処理間の通過点には、チェックポイントが予め設けられており、装置又は処理の切り替え時点で装置名を新規登録するし、温度情報等データをＲＦＩＤ２０に記録する場合、その情報データ、その測定時間、装置名を併せて記録する。 In the temperature measurement method of the color filter manufacturing process using the substrate-type temperature measuring device, the measuring device substrate 1 is used as a test piece and is input to the manufacturing line, and the sensor reading temperature, measuring time, and reading are set for each preset device. Record device name information in RFID. In this case, after forming the resist thin film on the surface, the measuring instrument substrate 1 includes a heating process using a hot plate (A in the figure) and a cooling process using a cool plate (B in the figure) to obtain uniform resist sensitivity in the surface. , Processing in the line of the exposure apparatus (C in the figure) for irradiating the exposure light, development processing with the developing solution (D in the figure), and post-baking (E in the figure) by heating to enhance the film properties of the resist pattern While being carried, the temperature is measured and the actually measured temperature information is recorded in the RFID 20. Note that checkpoints are provided in advance at the passing points between devices or between processes, and when a device name is newly registered at the time of switching between devices or processes, and data such as temperature information is recorded in the RFID 20, Information data, its measurement time, and device name are recorded together.
図３（ａ）に示す縦軸の温度は、予め設定した測定器基板の表面温度を経時変化、又は一定温度で表示した温度グラフである。製造ラインの図上Ａ〜Ｅ間では、測定器基板の表面温度、又はその温度変化を測定し、その測定毎に実測した温度データを周辺装置に情報通信し、周辺装置は、その測定温度データの変化推移と、予め設定した設定温度データとの差を監視し、管理限界の外のデータを監視する。 The temperature on the vertical axis shown in FIG. 3A is a temperature graph in which the surface temperature of the measuring instrument substrate set in advance is displayed as a change with time or at a constant temperature. Between the drawings A to E on the production line, the surface temperature of the measuring instrument substrate or its temperature change is measured, and the measured temperature data is communicated to the peripheral device for each measurement, and the peripheral device measures the measured temperature data. The difference between the change transition and the preset temperature data is monitored, and data outside the control limit is monitored.
図３（ｂ）の場合では、予め設定温度をＩＣタグリーダ／ライタによってＲＦＩＤに書き込み、実測した温度データを記録と、常時、実測温度グラフ８０と前記設定温度グラフ７０を対比しその差の大小を比較し、大きければ自動的にアラームを発報する方法であり、カラーフィルタの製造工程内での温度履歴の定時監視の基板型温度測定器及びそれを用いた温度測定方法である。 In the case of FIG. 3B, the preset temperature is written in the RFID by the IC tag reader / writer in advance and the actually measured temperature data is recorded, and the measured temperature graph 80 and the set temperature graph 70 are always compared and the magnitude of the difference is shown. In comparison, a method of automatically issuing an alarm if the size is larger is a substrate-type temperature measuring device for on-time monitoring of a temperature history in a color filter manufacturing process, and a temperature measuring method using the same.
１…測定器基板
１０…温度センサー
１１…温度センサー感度部
１３…ガラス材質
２０…ＲＦＩＤ
２１…ＩＣチップ
２２…アンテナ
２３…電源等制御回路
３０…配線層
３１…配線
４０…ＩＣタグリーダ
４１…表示端末装置
４２…データベース
４３…Ｗｅｂサーバ
５０…非接触の通信
６０…設定温度グラフ
７０…実測温度グラフ
１００…基板型温度測定器
２００…周辺装置
DESCRIPTION OF SYMBOLS 1 ... Measuring device board | substrate 10 ... Temperature sensor 11 ... Temperature sensor sensitivity part 13 ... Glass material 20 ... RFID
DESCRIPTION OF SYMBOLS 21 ... IC chip 22 ... Antenna 23 ... Power supply control circuit 30 ... Wiring layer 31 ... Wiring 40 ... IC tag reader 41 ... Display terminal device 42 ... Database 43 ... Web server 50 ... Non-contact communication 60 ... Set temperature graph 70 ... Actual measurement Temperature graph 100 ... Substrate type temperature measuring instrument 200 ... Peripheral device
Claims (2)
前記温度センサー付きＲＦＩＤ埋め込みカラーフィルタ基板型温度測定器は、形状が、カラーフィルタ基板と同一形状であり、カラーフィルタ基板型温度測定器の表面には、複数箇所に温度センサーと、配線層と、少なくとも１個のＲＦＩＤが埋め込まれており、その表面が基板の表面高さまで覆われ防水処理され、前記温度センサーは配線層を介してＲＦＩＤと導通されており、前記カラーフィルタ基板型温度測定器をテストピースとして、所定の間隔毎に製造工程のラインへ投入し、予め設定された製造工程中の通過点位置または装置毎にセンサーの読み取り温度と、その測定時間及び通過点位置名または装置名の情報をＲＦＩＤに記録し、前記ＲＦＩＤは、ＩＣチップとアンテナ及び電源等制御回路を備え、前記アンテナを介して製造工程ラインの周辺位置に配置したＩＣタグリーダへ記録した情報を非接触により通信し、各々工程の通過点または装置毎にその温度情報を、操作表示端末装置、データベース及びＷｅｂサーバにネットワーク化された前記ＩＣタグリーダで読み取り、該温度情報を操作表示端末装置に出力し、開示することを特徴とするカラーフィルタ製造工程の温度測定方法。 Temperature using a sensor with RFID embedded color filter substrate type temperature measuring apparatus, a temperature measuring method of the temperature at which the wet process and the dry process applied to the substrate in the color filter in the manufacturing process are mixed,
The RFID embedded color filter substrate type temperature measuring device with temperature sensor has the same shape as the color filter substrate, and the surface of the color filter substrate type temperature measuring device has temperature sensors, wiring layers, and a plurality of locations. At least one RFID is embedded, its surface is covered to the surface height of the substrate and waterproofed, and the temperature sensor is electrically connected to the RFID through a wiring layer, and the color filter substrate type temperature measuring device is The test piece is inserted into the manufacturing process line at a predetermined interval, and the sensor reading temperature, the measurement time, the passing point position name or the device name are set for each passing point position or device in the manufacturing process set in advance. information is recorded on RFID, the RFID is provided with an IC chip and an antenna and a power supply such as a control circuit, manufactured via the antenna The information recorded in the IC tag reader arranged at the peripheral position of the line is communicated in a non-contact manner, and the temperature information for each process passing point or each device is networked to the operation display terminal device, the database and the Web server. A temperature measurement method in a color filter manufacturing process , which is disclosed by reading with an IC tag reader, outputting the temperature information to an operation display terminal device .
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