JP4814016B2 - Piezoelectric vibrator, oscillator including the same, and electronic device - Google Patents

Piezoelectric vibrator, oscillator including the same, and electronic device Download PDF

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JP4814016B2
JP4814016B2 JP2006227743A JP2006227743A JP4814016B2 JP 4814016 B2 JP4814016 B2 JP 4814016B2 JP 2006227743 A JP2006227743 A JP 2006227743A JP 2006227743 A JP2006227743 A JP 2006227743A JP 4814016 B2 JP4814016 B2 JP 4814016B2
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vibrating piece
base member
lid member
piezoelectric
crystal
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JP2008054018A (en
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潔 荒武
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Seiko Instruments Inc
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本発明は、圧電振動子、発振器及び電子機器に関するものである。   The present invention relates to a piezoelectric vibrator, an oscillator, and an electronic device.

近年、携帯電話や携帯情報端末機器には、種々の電子部品、例えば、時刻源や制御信号のタイミング源等として圧電振動子が利用されている。圧電振動子の中には、板状のベース部材と板状の蓋部材とが重ね合わされて構成された密閉容器と、この密閉容器の中に設けられた圧電振動片とを備えたいわゆる表面実装型のものがある。ここで、密閉容器によって内部を密閉するのは、圧電振動片の周辺を真空状態に保つことにより、圧電振動片の振動特性を安定させるためである。   In recent years, piezoelectric vibrators have been used in various electronic components, for example, time sources, timing sources for control signals, and the like, in mobile phones and portable information terminal devices. In the piezoelectric vibrator, a so-called surface mounting provided with a hermetic container formed by superposing a plate-like base member and a plate-like lid member, and a piezoelectric vibrating piece provided in the hermetic container There is a type. Here, the reason why the inside is sealed by the sealed container is to stabilize the vibration characteristics of the piezoelectric vibrating piece by keeping the periphery of the piezoelectric vibrating piece in a vacuum state.

このような表面実装型の圧電振動子では、落下等衝撃の作用によって圧電振動片がたわむ場合に、圧電振動片の先端がベース部材や蓋部材の内面にあたって、圧電振動片の先端に欠けが生じ、圧電振動片の重要な特性のひとつである周波数に大幅な変化をおこすという問題があった。
このような問題に対処するものとして、ベース部材及び蓋部材のそれぞれの内面に、２段階の深さを持つ凹部（キャビティ）を形成したものが提案された（例えば、特許文献１参照。）。この技術によれば、落下等衝撃の作用によって圧電振動片がたわむ場合に、１段目と２段目の境の段差に圧電振動片の中間が当たり、さらなるたわみを抑えることで、圧電振動片の先端が蓋部材等の内面にあたることを防止し、これにより、ある程度の小型化・薄型化を実現しつつ、圧電振動片の先端の欠けを防止することができる。
特開２０００−６８７８０号公報 In such a surface mount type piezoelectric vibrator, when the piezoelectric vibrating piece is bent due to an impact such as dropping, the tip of the piezoelectric vibrating piece comes into contact with the inner surface of the base member or the lid member, and the tip of the piezoelectric vibrating piece is chipped. There has been a problem that the frequency, which is one of the important characteristics of the piezoelectric vibrating piece, is greatly changed.
In order to cope with such a problem, there has been proposed one in which a concave portion (cavity) having two levels of depth is formed on each inner surface of the base member and the lid member (see, for example, Patent Document 1). According to this technique, when the piezoelectric vibrating piece bends due to an impact such as dropping, the middle of the piezoelectric vibrating piece hits the step between the first step and the second step, and further bending is suppressed. The tip of the piezoelectric vibrating piece can be prevented from hitting the inner surface of the lid member or the like, thereby preventing the tip of the piezoelectric vibrating piece from being chipped while achieving a certain size and thickness reduction.
JP 2000-68780 A

近年、圧電振動子のさらなる小型化・薄型化の要求が強くなっており、ベース部材や蓋部材の厚さをより一層薄くすることが求められている。
ところで、前述した従来の技術において、このような要求に応えようとすると、ガラス材料により作られるベース部材や蓋部材の、部材厚に対する凹部（キャビティ）の深さの締める比率が大きくなり、これに起因して強度が低下するという問題が生じる。
また、最近、ベース部材または蓋部材のうち一方の部材にのみ凹部を形成し、そこにチップ（圧電振動片）をマウントした状態で収納する、いわゆるチップマウント方式が考えられているが、この方式を前記従来の技術に適用しようとすると、ベース部材または蓋部材のうちチップを収納する側の部材が、圧電振動片の厚み分のキャビティ深さを負担することとなり、前述の問題がより顕著となる。 In recent years, there is an increasing demand for further downsizing and thinning of the piezoelectric vibrator, and it is required to further reduce the thickness of the base member and the lid member.
By the way, in the above-described conventional technology, when trying to meet such a demand, the ratio of the depth of the concave portion (cavity) to the member thickness of the base member or the lid member made of the glass material is increased. This causes a problem that the strength decreases.
Recently, a so-called chip mount method has been considered in which a recess is formed only in one of the base member and the lid member, and a chip (piezoelectric vibrating piece) is mounted on the recess. Is applied to the conventional technology, the member on the side of the chip, which is the base member or lid member, bears the cavity depth corresponding to the thickness of the piezoelectric vibrating piece, and the above-described problem becomes more prominent. Become.

本発明は、このような事情に鑑みてなされたものであって、強度低下を来たすことなく、小型化・薄型化を実現することができる、圧電振動子、発振器及び電子機器を提供することを目的とする。   The present invention has been made in view of such circumstances, and provides a piezoelectric vibrator, an oscillator, and an electronic device that can be reduced in size and thickness without causing a decrease in strength. Objective.

本発明は、前記課題を解決するために、以下の構成を採用した。
すなわち、本発明に係る圧電振動子は、板状の蓋部材と板状のベース部材とが厚さ方向に重ね合わされて構成された密閉容器と、該密閉容器内に、基端部を前記蓋部材または前記ベース部材に片持ち支持された状態で配置された圧電振動片と、前記蓋部材及び前記ベース部材のそれぞれの内面であって前記圧電振動片の先端部に対応する箇所にそれぞれ設けられた欠け防止用凹部と、前記圧電振動片の先端部であって前記蓋部材または前記ベース部材と対向する面に設けられた周波数調整用の重りと、を備える圧電振動子において、前記周波数調整用の重りが、前記圧電振動片の先端部であって前記蓋部材または前記ベース部材と対向する両面の内いずれか一方の面にのみに設けられ、前記圧電振動片の先端部の周波数調整用の重りが設けられない側の面と対向する前記欠け防止用凹部の前記圧電振動片への接触縁部が、前記圧電振動片の先端部の周波数調整用の重りが設けられた側の面と対向する前記欠け防止用凹部の前記圧電振動片への接触縁部よりも前記圧電振動片の先端側へずらして設けられていることを特徴とする。 The present invention employs the following configuration in order to solve the above problems.
That is, the piezoelectric vibrator according to the present invention includes a sealed container configured by stacking a plate-like lid member and a plate-like base member in the thickness direction, and a base end portion of the lid in the sealed container. A piezoelectric vibrating piece disposed in a cantilevered manner on the member or the base member, and inner surfaces of the lid member and the base member, respectively, at locations corresponding to the tip of the piezoelectric vibrating piece. A piezoelectric vibrator comprising: a chipping-preventing concave portion; and a frequency adjusting weight provided on a surface of the piezoelectric vibrating piece at a front end portion of the piezoelectric vibrating piece and facing the lid member or the base member. The weight is provided only on one of the two surfaces facing the lid member or the base member at the tip of the piezoelectric vibrating piece, and is used for adjusting the frequency of the tip of the piezoelectric vibrating piece. Weight provided The chipping prevention concave portion facing the surface on the side of the tip of the piezoelectric vibrating piece provided with a frequency adjusting weight at the contact edge portion of the chipping prevention concave portion facing the non-chip surface. It is characterized in that the concave portion is provided so as to be shifted from the contact edge to the piezoelectric vibrating piece toward the tip side of the piezoelectric vibrating piece.

本発明によれば、落下等の衝撃が作用する際に圧電振動片がたわむが、周波数調整用の重りが設けられない側にたわむときに、圧電振動片の先端部近傍が欠け防止用凹部の縁部にあたる。この欠け防止用凹部の縁部をあらかじめ圧電振動片の先端側へずらして設けているので、当たった後の、圧電振動片の先端側のたわみをより小さく抑えることができる。このため、欠け防止用凹部の深さを浅く設定することができ、結果的に、圧電振動片の周波数調整用の重りが設けられない側と対向する、ベース部材または蓋部材の欠け防止用凹部を設けることに伴う強度低下を最小限に抑えることができる。
ところで、圧電振動片が、周波数調整用の重りが設けられない側にたわむときに、その先端部近傍が欠け防止用凹部の縁部にあたるが、もともと、この部分には周波数調整用の重りを設けていないので、欠け防止用凹部の縁部との接触により、周波数調整用の重りの一部が欠落して周波数が変わるといった事態は生じない。 According to the present invention, the piezoelectric vibrating piece bends when an impact such as a drop is applied, but when bent to the side where the weight for adjusting the frequency is not provided, the vicinity of the tip of the piezoelectric vibrating piece has a chipping prevention recess. Hit the edge. Since the edge portion of the chipping prevention concave portion is previously shifted to the tip side of the piezoelectric vibrating piece, the deflection on the tip side of the piezoelectric vibrating piece after hitting can be further reduced. For this reason, the depth of the chipping prevention concave part can be set shallow, and as a result, the chipping prevention concave part of the base member or the lid member facing the side where the weight for adjusting the frequency of the piezoelectric vibrating piece is not provided. It is possible to minimize a decrease in strength due to the provision of.
By the way, when the piezoelectric vibrating piece bends to the side where the weight for adjusting the frequency is not provided, the vicinity of the tip corresponds to the edge of the recess for preventing chipping. Originally, this part is provided with the weight for adjusting the frequency. Therefore, there is no situation in which a part of the weight for adjusting the frequency is lost and the frequency is changed due to the contact with the edge of the recess for preventing chipping.

一方、落下等の衝撃が作用する際に、圧電振動片の先端部近傍は、周波数調整用の重りが設けられた側にもたわむこととなるが、周波数調整用の重りが設けられた側と対向する欠け防止用凹部は、圧電振動片の基端側へずらして設けられている。したがって、衝撃によりたとえたわんだとしても、欠け防止用凹部内でたわむだけであって、圧電振動片の先端が蓋部材やベース部材に当たったり、周波数調整用の重りが欠け防止用凹部の縁部にあたったりすることはない。   On the other hand, when an impact such as dropping is applied, the vicinity of the tip of the piezoelectric vibrating piece will bend to the side where the frequency adjusting weight is provided, but the side where the frequency adjusting weight is provided Opposing chipping prevention concave portions are provided so as to be shifted toward the base end side of the piezoelectric vibrating piece. Therefore, even if it bends due to an impact, it only bends in the chipping prevention recess, and the tip of the piezoelectric vibrating piece hits the lid member or the base member, or the frequency adjusting weight has an edge of the chipping prevention recess. I won't hit you.

本発明に係る圧電振動子は、前記圧電振動片が前記ベース部材の内面に設けられた振動片収納用凹部に収納され、前記圧電振動片の先端部の前記蓋部材と対向する面に前記周波数調整用の重りが設けられ、前記ベース部材の前記欠け防止用凹部の前記圧電振動片への接触縁部が、前記蓋部材の前記欠け防止用凹部の前記圧電振動片への接触縁部よりも前記圧電振動片の先端側へずらして設けられていることを特徴とする。
本発明によれば、ベース部材に振動片収納用凹部を設けそこに圧電振動片を収納する、いわゆるチップマウント方式の圧電振動子において、振動片収納用凹部が設けられたベース部材側に設ける欠け防止用凹部の圧電振動片への接触縁部を圧電振動片の先端側へずらして設けており、これにより、前述した理由から、該ベース部材側の欠け防止用凹部の深さを浅く設定することができる。つまり、ベース部材には、振動片収納用凹部と欠け防止用凹部とを重ねて設けているが、欠け防止用凹部の深さを浅く設定できる分、それら凹部を設けることに伴うベース部材の強度低下を防止することができる。 In the piezoelectric vibrator according to the present invention, the piezoelectric vibration piece is housed in a vibration piece housing recess provided on an inner surface of the base member, and the frequency of the piezoelectric vibration piece on a surface facing the lid member at a tip portion of the piezoelectric vibration piece. An adjustment weight is provided, and the contact edge portion of the chipping prevention recess of the base member with respect to the piezoelectric vibrating piece is more than the contact edge portion of the lid member with the chipping prevention recess of the base member. The piezoelectric vibrating piece is provided so as to be shifted toward the tip side.
According to the present invention, in a so-called chip-mount type piezoelectric vibrator in which a resonator element storing recess is provided in a base member and a piezoelectric resonator element is stored therein, the chip provided on the base member side provided with the resonator element storing recess is provided. The contact edge portion of the prevention concave portion with respect to the piezoelectric vibrating piece is shifted to the tip side of the piezoelectric vibration piece, and for this reason, the depth of the chipping prevention concave portion on the base member side is set shallow. be able to. In other words, the base member is provided with the concave portion for storing the resonator element and the concave portion for preventing chipping. However, the strength of the base member due to the provision of the concave portion can be set to a shallow depth. A decrease can be prevented.

本発明に係る圧電振動子は、前記圧電振動片の先端部の周波数調整用の重りが設けられない側の面と対向する前記欠け防止用凹部の前記圧電振動片への接触縁部が、前記圧電振動片の先端を越えない範囲で前記圧電振動片の先端側へずらして設けられていることを特徴とする。
本発明によれば、圧電振動片の先端部の周波数調整用の重りが設けられない側の面と対向する欠け防止用凹部の前記圧電振動片接触縁部を、前記圧電振動片の先端を越えない範囲で前記圧電振動片の先端側へずらして設けている。このようにずらして設けているにもかかわらず、圧電振動片の先端は必ず欠け防止用凹部に対応する位置にある。したがって、落下等の衝撃が作用する際に圧電振動片が、周波数調整用の重りが設けられない側にたわむときに、該圧電振動片の先端は、欠け防止用凹部の縁部にあたったり、ベース部材や蓋部材の内面に当たったりすることはない。 In the piezoelectric vibrator according to the present invention, the contact edge portion of the chipping prevention concave portion facing the surface of the tip portion of the piezoelectric vibrating piece on which the frequency adjusting weight is not provided is provided on the piezoelectric vibrating piece. The piezoelectric vibrating piece is provided so as to be shifted toward the tip side of the piezoelectric vibrating piece within a range not exceeding the tip of the piezoelectric vibrating piece.
According to the present invention, the piezoelectric vibrating reed contact edge of the chip preventing recess facing the surface of the tip of the piezoelectric vibrating reed on which the frequency adjusting weight is not provided extends beyond the front end of the piezoelectric vibrating reed. The piezoelectric vibrating reed is provided so as to be shifted toward the tip side of the piezoelectric vibrating piece within a range. Despite being provided in this way, the tip of the piezoelectric vibrating piece is always in a position corresponding to the chipping prevention recess. Therefore, when the piezoelectric vibrating piece bends to the side where the weight for adjusting the frequency is not provided when an impact such as dropping is applied, the tip of the piezoelectric vibrating piece hits the edge of the recess for preventing chipping, It does not hit the inner surface of the base member or the lid member.

本発明にかかる発振器は、請求項１〜３のいずれか一項に記載の圧電振動子が、発振子として集積回路に電気的に接続されていることを特徴とする。
本発明にかかる電子機器は、請求項１〜請求項３のいずれか一項に記載の圧電振動子を備えることを特徴とする。
これらの発明にかかる発振器、電子機器は、請求項１〜３のいずれか１項に記載の圧電振動子と同様な効果を奏する。 An oscillator according to the present invention is characterized in that the piezoelectric vibrator according to any one of claims 1 to 3 is electrically connected to an integrated circuit as an oscillator.
An electronic apparatus according to the present invention includes the piezoelectric vibrator according to any one of claims 1 to 3.
The oscillator and the electronic device according to these inventions have the same effect as the piezoelectric vibrator according to any one of claims 1 to 3.

本発明によれば、落下等の衝撃が作用する際に圧電振動片がたわむが、周波数調整用の重りが設けられない側にたわむときに、欠け防止用凹部の縁部をあらかじめ圧電振動片の先端側へずらして設けているので、当たった後の圧電振動片の先端側のたわみをより小さく抑えることができ、このため、欠け防止用凹部の深さを浅く設定することができる。この結果、圧電振動片の周波数調整用の重りが設けられない側と対向するベース部材または蓋部材の強度低下を最小限に抑えることができ、もって、強度低下を来たすことなく、小型化・薄型化を実現することができる   According to the present invention, the piezoelectric vibrating piece bends when an impact such as a drop is applied, but when bent to the side where the weight for adjusting the frequency is not provided, the edge of the chipping prevention recess is previously attached to the piezoelectric vibrating piece. Since it is provided so as to be shifted toward the tip side, the deflection on the tip side of the piezoelectric vibrating piece after hitting can be further reduced, and therefore the depth of the chipping prevention recess can be set shallow. As a result, it is possible to minimize the strength reduction of the base member or the lid member facing the side where the weight for adjusting the frequency of the piezoelectric vibrating piece is not provided, so that the size and thickness can be reduced without causing the strength reduction. Can be realized

＜第１実施形態＞
以下、本発明の第１実施形態における水晶振動子（圧電振動子）について、図面を参照して説明する。図１（ａ）は水晶振動子の断面図、図１（ｂ）は図１（ａ）のＡ部分の拡大図である。図１において、符号１は水晶振動子を示すものである。なお、この実施形態では、圧電振動片として、水晶により形成された水晶振動片を例に挙げて説明するが、これに限られることなく、圧電振動片は、タンタル酸リチウムやニオム酸リチウム等の圧電材料によって作ったものであってもよい。 <First Embodiment>
Hereinafter, a crystal resonator (piezoelectric resonator) according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a cross-sectional view of a crystal resonator, and FIG. 1B is an enlarged view of a portion A in FIG. In FIG. 1, reference numeral 1 denotes a crystal resonator. In this embodiment, the piezoelectric vibrating piece is described by taking a quartz vibrating piece formed of quartz as an example. However, the piezoelectric vibrating piece is not limited to this, and the piezoelectric vibrating piece may be a lithium tantalate or a lithium niomate. It may be made of a piezoelectric material.

水晶振動子１は、略矩形に形成された密閉容器２と、この密閉容器２の中に設けられた水晶振動片（圧電振動片）３とを備えている。
水晶振動片３は、平行に延びる一対の振動腕部３ａ（図１２に示す）がそれぞれ基端側で一体的に接続された音叉型振動片として構成されている。水晶振動片３の基端部は、蓋部材６の後述する接続部１５に接続されていて、これにより、電気的に接続されるとともに、密閉容器２の中で機械的に片持ち支持された状態で固定されている。また、水晶振動片３は、水晶からなり、電圧を印加することにより、所定の周波数で振動するようになっている。
水晶振動片３の表面には、一対の振動腕部３ａを互いに接近または離間する方向へ所定の共振周波数で振動させる励磁電極４を備える。また、水晶振動片３の先端部には、振動腕部３ａの共振周波数を調整するための周波数調整用の重り５が、蓋部材６またはベース部材７と対向する両面の内いずれか一方の面にのみ、ここでは、蓋部材６と対向する面３ａａにのみ設けられている。周波数調整用の重り５は、粗調用の重り５ａと微調用の重り５ｂとから構成されている。これら重り５ａ、５ｂが、例えばレーザ光を照射される等によって必要量だけ除去されることにより、振動腕部３ａの共振周波数が所定範囲内に収まるように調整される。 The crystal resonator 1 includes a sealed container 2 formed in a substantially rectangular shape, and a crystal vibrating piece (piezoelectric vibrating piece) 3 provided in the sealed container 2.
The quartz crystal vibrating piece 3 is configured as a tuning fork type vibrating piece in which a pair of vibrating arm portions 3a (shown in FIG. 12) extending in parallel are integrally connected on the base end side. The base end portion of the crystal vibrating piece 3 is connected to a connecting portion 15 to be described later of the lid member 6, thereby being electrically connected and mechanically cantilevered in the sealed container 2. It is fixed in the state. The crystal vibrating piece 3 is made of crystal, and vibrates at a predetermined frequency by applying a voltage.
An excitation electrode 4 is provided on the surface of the crystal vibrating piece 3 to vibrate the pair of vibrating arm portions 3a at a predetermined resonance frequency in a direction approaching or separating from each other. Further, a weight 5 for adjusting the frequency for adjusting the resonance frequency of the vibrating arm 3 a is provided at one end of both surfaces facing the lid member 6 or the base member 7 at the tip of the crystal vibrating piece 3. Here, it is provided only on the surface 3aa facing the lid member 6 here. The frequency adjusting weight 5 includes a coarse adjusting weight 5a and a fine adjusting weight 5b. These weights 5a and 5b are adjusted so that the resonance frequency of the vibrating arm portion 3a falls within a predetermined range by removing a necessary amount, for example, by irradiating laser light.

密閉容器２は、それぞれ略矩形板状に形成された蓋部材６とベース部材７とが、互いに厚さ方向に重ね合わされて構成されている。
蓋部材６の両主面のうち、一方の主面（蓋部材６がベース部材７に対して重ね合わされるとき内面となる主面）６ａには、矩形状の欠け防止用凹部８が形成されている（図２、図３参照）。同様にして、ベース部材７の一方の主面（ベース部材７が蓋部材６に対して重ね合わされるとき内面となる主面）７ａには、水晶振動片３を収納する矩形状の振動片収納用凹部９と矩形状の欠け防止用凹部１０が、密閉容器２の一端側で互いに重ね合わされるように形成されている（図４、図５参照。）そして、蓋部材６とベース部材７とは、双方の欠け防止用凹部８，１０が対向した状態で、一方の主面６ａと一方の主面７ａとが重ね合わされて接合されている。すなわち、蓋部材側の一方の主面６ａは、蓋部材６の重ね合わせ面として機能し、ベース部材側の一方の主面７ａは、ベース部材７の重ね合わせ面として機能する。そして、重ねあわされた蓋部材６とベース部材７との間には、前記振動片収納用凹部９及び前記欠け防止用凹部８，１０によってキャビティ１２が形成され、このキャビティ１２によって、水晶振動片３が振動を許容された状態で収納されている。密閉容器２の中は気密封止されており、キャビティ１２は真空状態に保持されている。 The sealed container 2 is configured by a lid member 6 and a base member 7 each formed in a substantially rectangular plate shape being overlapped with each other in the thickness direction.
Of the two main surfaces of the lid member 6, one of the main surfaces (the main surface that becomes the inner surface when the lid member 6 is overlaid on the base member 7) 6a is formed with a rectangular chipping prevention recess 8. (See FIGS. 2 and 3). Similarly, in one main surface of the base member 7 (a main surface that becomes an inner surface when the base member 7 is overlapped with the lid member 6) 7a, a rectangular vibrating piece housing the crystal vibrating piece 3 is accommodated. The recess 9 for preventing chipping and the recess 10 for preventing chipping are formed so as to overlap each other on one end side of the sealed container 2 (see FIGS. 4 and 5), and the lid member 6 and the base member 7 The one main surface 6a and the one main surface 7a are overlapped and joined in a state in which both of the chipping preventing recesses 8 and 10 face each other. That is, one main surface 6 a on the lid member side functions as an overlapping surface of the lid member 6, and one main surface 7 a on the base member side functions as an overlapping surface of the base member 7. A cavity 12 is formed between the overlapped lid member 6 and the base member 7 by the recess 9 for storing the resonator element and the recesses 8 and 10 for preventing chipping. 3 is housed in a state where vibration is allowed. The sealed container 2 is hermetically sealed, and the cavity 12 is kept in a vacuum state.

前記欠け防止用凹部８，１０のうち、ベース部材側に設けられる欠け防止用凹部１０が、蓋部材側に設けられる欠け防止用凹部８よりも、水晶振動片３の先端側に寄って形成されている（図１（ｂ）参照）。すなわち、ベース部材側に設けられる欠け防止用凹部１０の水晶振動片先端側縁部１０ａは、蓋部材側に設けられる欠け防止用凹部８の水晶振動片先端側縁部８ａとほぼ同じ箇所に設けられているが、ベース部材側に設けられる欠け防止用凹部１０の水晶振動片基端側縁部１０ｂ（この縁部は、水晶振動片３が大きくたわむときに水晶振動片３と接触するため、以下、水晶振動片への接触縁部１０ｂと呼ぶ）は、蓋部材側に設けられる欠け防止用凹部８の水晶振動片基端側縁部８ｂ（この縁部は、水晶振動片３が大きくたわむときに水晶振動片３と接触するため、以下、水晶振動片への接触縁部８ｂと呼ぶ）よりも、水晶振動片の先端側（図１（ｂ）における右側）にずらして設けられている。
このベース部材側に設けられる欠け防止用凹部１０の水晶振動片への接触縁部１０ｂのずれ量は、蓋部材側に設けられる欠け防止用凹部８の水晶振動片への接触縁部８ｂに対して、水晶振動片３の先端を越えない範囲で設定されている。 Of the chipping prevention recesses 8 and 10, the chipping prevention concave part 10 provided on the base member side is formed closer to the tip side of the crystal vibrating piece 3 than the chipping prevention concave part 8 provided on the lid member side. (See FIG. 1B). That is, the crystal vibration piece front end side edge portion 10a of the chipping prevention concave portion 10 provided on the base member side is provided at substantially the same position as the crystal vibration piece front end side edge portion 8a of the chip prevention concave portion 8 provided on the lid member side. However, the crystal vibration piece base end side edge portion 10b of the chipping prevention recess 10 provided on the base member side (this edge portion is in contact with the crystal vibration piece 3 when the crystal vibration piece 3 is largely bent. Hereinafter, the crystal vibrating piece base contact side edge portion 8b of the chipping prevention recess 8 provided on the lid member side (hereinafter referred to as the contact edge portion 10b to the quartz vibrating piece) is greatly bent by the crystal vibrating piece 3. Since it sometimes contacts the quartz crystal vibrating piece 3, it is provided so as to be shifted to the tip side of the quartz crystal vibrating piece (the right side in FIG. 1B) rather than the contact edge 8b to the quartz crystal vibrating piece. .
The displacement amount of the contact edge portion 10b of the chipping prevention concave portion 10 provided on the base member side with respect to the crystal vibration piece is in contrast to the contact edge portion 8b of the chip prevention concave portion 8 provided on the lid member side. Thus, it is set in a range not exceeding the tip of the crystal vibrating piece 3.

また、ベース部材側に設けられる欠け防止用凹部１０の深さＤａは、蓋部材側に設けられる欠け防止用凹部８の深さＤｂよりも浅く設定されている。例えば、ベース部材側に設けられる欠け防止用凹部１０の深さＤａは、この深さＤａと前記振動片収納用凹部９の深さＤｃとを足した値が、蓋部材側に設けられる欠け防止用凹部８の深さＤｂとほぼ同程度になるように設定されている。   Further, the depth Da of the chipping prevention concave portion 10 provided on the base member side is set to be shallower than the depth Db of the chipping prevention concave portion 8 provided on the lid member side. For example, the depth Da of the chipping prevention recess 10 provided on the base member side is the chipping prevention provided on the lid member side by a value obtained by adding the depth Da and the depth Dc of the vibration piece storage recess 9. It is set to be approximately the same as the depth Db of the concave portion 8 for use.

また、前記蓋部材に設けられる欠け防止用凹部８は、振動等の作用によって前記水晶振動片３の先端が大きくたわむ場合であっても、該欠け防止用凹部８内に前記周波数調整用の重り５が収まる程度に、周波数調整用の重り５に対する大きさが設定されている。   Further, the chipping prevention recess 8 provided in the lid member is a weight for adjusting the frequency in the chipping prevention recess 8 even when the tip of the crystal vibrating piece 3 is greatly bent by the action of vibration or the like. The size with respect to the weight 5 for frequency adjustment is set so that 5 can be accommodated.

蓋部材６の一方の主面６ａ上には、水晶振動片３が電気的に接続された接続部１５と、この接続部１５を一方の主面６ａの縁部にまで延在させる引き出し電極１６とが設けられている（図６、図７参照）。
接続部１５は例えば金などの導電性部材からなっていて、引き出し電極１６は例えばＣｒやＴｉなどの導電性部材からなっている。接続部１５は、図６に示すように、水晶振動片３の基端部が配置される箇所に二つ設けられており、これら二つの接続部１５が、水晶振動片３に電圧を印加するための正負の電極端子として機能するようになっている。引き出し電極１６は、２つに分かれ蓋部材６の隅部まで至るように設けられている。両端の引き出し電極１６のうち、一の引き出し電極１６は一の接続部１５と接続されており、他の引き出し電極１６は他の接続部１５に接続されている。 On one main surface 6a of the lid member 6, a connection portion 15 to which the crystal vibrating piece 3 is electrically connected, and a lead electrode 16 for extending the connection portion 15 to an edge portion of the one main surface 6a. Are provided (see FIGS. 6 and 7).
The connecting portion 15 is made of a conductive member such as gold, and the lead electrode 16 is made of a conductive member such as Cr or Ti. As shown in FIG. 6, two connection portions 15 are provided at a location where the base end portion of the crystal vibrating piece 3 is disposed, and these two connection portions 15 apply a voltage to the crystal vibrating piece 3. Therefore, it functions as a positive and negative electrode terminal. The extraction electrode 16 is divided into two and provided so as to reach the corner of the lid member 6. Of the extraction electrodes 16 at both ends, one extraction electrode 16 is connected to one connection portion 15, and the other extraction electrode 16 is connected to the other connection portion 15.

また、本実施形態における水晶振動子１は、例えばＳｉＯ2やＳｉ3Ｎ4などからなる絶縁膜２２を備えている（図８、図９参照）。絶縁膜２２は、引き出し電極１６が設けられる四隅と前記接続部１５が設けられる中間部とを除く、蓋部材６の一方の主面６ａのほぼ全域を覆うように設けられている。 Further, the crystal resonator 1 in the present embodiment includes an insulating film 22 made of, for example, SiO 2 or Si 3 N 4 (see FIGS. 8 and 9). The insulating film 22 is provided so as to cover substantially the entire area of the one principal surface 6a of the lid member 6 except for the four corners where the extraction electrode 16 is provided and the intermediate part where the connection portion 15 is provided.

また、蓋部材の一方の主面の絶縁膜２２のさらに上側には、例えばＣｒやシリコンなどからなる接合膜２４が設けられている（図１０、図１１参照）。接合膜２４は、中央部分が取り除かれて、かつ四隅がそれぞれ分断された状態で形成されている。
なお、図１においては、引き出し電極１６、絶縁膜２２、接合膜２４が層状に重ねられている部分の膜全体の厚みが、水晶振動片３の厚みよりも厚く示されているが、これは、膜の構成を分り易く誇張して描いているためであり、実際には、水晶振動片３の方が膜全体より厚い。
本実施形態における前記蓋部材６及びベース部材７は、例えばガラスからなっており、これら蓋部材６とベース部材７とが、接合膜２４を介して陽極接合されている。 Further, a bonding film 24 made of, for example, Cr or silicon is provided on the upper side of the insulating film 22 on one main surface of the lid member (see FIGS. 10 and 11). The bonding film 24 is formed in a state where the central portion is removed and the four corners are divided.
In FIG. 1, the thickness of the entire film where the extraction electrode 16, the insulating film 22, and the bonding film 24 are layered is shown to be thicker than the thickness of the crystal vibrating piece 3. This is because the configuration of the film is drawn in an exaggerated manner so that the crystal vibrating piece 3 is actually thicker than the entire film.
The lid member 6 and the base member 7 in the present embodiment are made of glass, for example, and the lid member 6 and the base member 7 are anodically bonded via a bonding film 24.

また、ベース部材７の他方の主面７ｂには外部端子２７が設けられている（図１５、図１６参照）。この外部端子２７は、ベース部材７の隅部を、４分割の円錐台状に形状に切り欠かれた切り欠き部分７ｃに設けられた導電部２８を介して蓋部材６側の前記引き出し電極１６に電気的に接続されている。また、外部端子２７は対をなして形成されている。すなわち、外部端子２７は、図１５に示すように、ベース部材７の四隅に設けられた導電部２８のうち、幅方向Ｗの一端側に形成された二つの導電部２８間にわたって延在しており、同様に、幅方向Ｗの他端側に形成された二つの導電部２８間にわたって延在している。そして、これら外部端子２７は、導電部２８を介して上述の一の引き出し電極１６または他の引き出し電極１６にそれぞれ接続されており、水晶振動片３に電圧を印加するための正負の外部電極として機能するようになっている。   Further, an external terminal 27 is provided on the other main surface 7b of the base member 7 (see FIGS. 15 and 16). The external terminal 27 has the lead electrode 16 on the lid member 6 side through a conductive portion 28 provided in a cutout portion 7c in which a corner portion of the base member 7 is cut out in a shape of a truncated cone of four divisions. Is electrically connected. The external terminals 27 are formed in pairs. That is, as shown in FIG. 15, the external terminal 27 extends between two conductive portions 28 formed on one end side in the width direction W among the conductive portions 28 provided at the four corners of the base member 7. Similarly, it extends across the two conductive portions 28 formed on the other end side in the width direction W. These external terminals 27 are connected to the above-described one extraction electrode 16 or another extraction electrode 16 via the conductive portion 28, respectively, and serve as positive and negative external electrodes for applying a voltage to the crystal vibrating piece 3. It is supposed to function.

次に、本実施形態における水晶振動子１の製造方法について説明する。
まず、蓋部材６を形成加工する。すなわち、図２及び図３に示すように、ガラスかならなる蓋部材用ウエハ３０を所定の厚さになるまで研磨加工して洗浄する。そして、最表面の加工変質層をエッチングなどによって除去する。さらに、蓋部材用ウエハ３０の一方の主面３０ａに、エッチングなどにより、欠け防止用凹部８を形成する。なお、図２及び図３には、簡略化のため、一つの欠け防止用凹部８しか明示されていないが、実際には蓋部材用ウエハ３０の一方の主面３０ａ全面に、複数の欠け防止用凹部８が行列方向に連続的に形成される。つまり、蓋部材用ウエハ３０は、蓋部材６が複数配列されて一体的に形成されたものであり、ここでは蓋部材用ウエハ３０は蓋部材６に相当するものである。さらに、蓋部材用ウエハ３０の一方の主面３０ａは、蓋部材６の一方の主面６ａ、すなわち、蓋部材６の重ね合わせ面に相当する。 Next, a method for manufacturing the crystal unit 1 in the present embodiment will be described.
First, the lid member 6 is formed and processed. That is, as shown in FIGS. 2 and 3, the lid member wafer 30 made of glass is polished and cleaned until it reaches a predetermined thickness. Then, the work-affected layer on the outermost surface is removed by etching or the like. Further, the chipping preventing recess 8 is formed on one main surface 30a of the lid member wafer 30 by etching or the like. 2 and 3, for the sake of simplification, only one notch prevention recess 8 is clearly shown, but in practice, a plurality of notch preventions are provided on the entire main surface 30a of the lid member wafer 30. The concave portions 8 are formed continuously in the matrix direction. That is, the lid member wafer 30 is formed by integrally forming a plurality of lid members 6, and here the lid member wafer 30 corresponds to the lid member 6. Further, one main surface 30 a of the lid member wafer 30 corresponds to one main surface 6 a of the lid member 6, that is, the overlapping surface of the lid member 6.

さらに、ベース部材７を形成加工する。すなわち、蓋部材６と同様にして、図４、図５に示すガラスからなるベース部材用ウエハ３１の一方の主面３１ａに振動片収納用凹部９及び欠け防止用凹部１０を複数形成する。ここでもベース部材用ウエハ３１はベース部材７に相当するものであり、ベース部材用ウエハ３１の一方の主面３１ａは、ベース部材７の一方の主面７ａに相当するものである。
次いで、それぞれの欠け防止用凹部１０を所定の大きさで矩形に取り囲んだときの、その矩形の四隅のそれぞれに図５、図１５に示すスルーホール３２を設ける。なお、スルーホール３２は、後述するダイシング工程において４分割されるが、その４分割された部位にＣｒ等の金属材料がコーティングされることによって、上述の導電部２８となる。 Further, the base member 7 is formed and processed. That is, in the same manner as the lid member 6, a plurality of vibration piece storage recesses 9 and chipping prevention recesses 10 are formed on one main surface 31 a of the base member wafer 31 made of glass shown in FIGS. 4 and 5. Here, the base member wafer 31 corresponds to the base member 7, and one main surface 31 a of the base member wafer 31 corresponds to one main surface 7 a of the base member 7.
Next, through holes 32 shown in FIG. 5 and FIG. 15 are provided at the four corners of each of the chipping prevention recesses 10 when they are enclosed in a rectangular shape with a predetermined size. The through hole 32 is divided into four parts in a dicing process described later. The conductive part 28 is formed by coating a metal material such as Cr on the four parts.

さらに、人工水晶に研磨、エッチングなどを施して、音叉型の水晶振動片３を形成加工する。
それから、図６及び図７に示すように、蓋部材用ウエハ３０の一方の主面３０ａに、接続部１５や引き出し電極１６を形成する（電極形成工程）。すなわち、スパッタリングや蒸着などによって、一方の主面３０ａに、引き出し電極層を形成し、エッチングなどにより、引き出し電極１６を一体的にパターニングする。さらに、引き出し電極１６の上側に、引き出し電極１６を形成するときと同様な手法により例えばＡｕからなる接続部１５を形成する。 Further, the tuning quartz fork crystal vibrating piece 3 is formed and processed by polishing or etching the artificial quartz crystal.
Then, as shown in FIGS. 6 and 7, the connecting portion 15 and the extraction electrode 16 are formed on one main surface 30a of the lid member wafer 30 (electrode forming step). That is, an extraction electrode layer is formed on one main surface 30a by sputtering or vapor deposition, and the extraction electrode 16 is integrally patterned by etching or the like. Further, the connection portion 15 made of, for example, Au is formed on the upper side of the extraction electrode 16 by the same method as that for forming the extraction electrode 16.

さらに、図８及び図９に示すように、絶縁膜２２を形成する（絶縁膜形成工程）。すなわち、引き出し電極１６の表面を含む一方の主面３０ａの縁部全周に、スパッタリングや蒸着あるいは気相成長法や塗布法などによって、絶縁膜２２を形成する。なお、絶縁膜２２の厚さとしては、引き出し電極１６の厚さよりも厚く、数μｍ程度である。このとき、公知の平坦化手段によって、絶縁膜２２の上面の平坦化を図る。
なお、絶縁膜２２を形成する際、ベース部材用ウエハ３１に形成されるスルーホール３２に合わせて、図６に示すように、フォトリソグラフィによるパターニングにより絶縁膜２２の四隅を円弧状に取り去る。また、同様に、接続部１５及びその近傍の中間部の絶縁膜も取り去る。 Further, as shown in FIGS. 8 and 9, an insulating film 22 is formed (insulating film forming step). That is, the insulating film 22 is formed on the entire periphery of the edge of the one main surface 30a including the surface of the extraction electrode 16 by sputtering, vapor deposition, vapor phase growth, coating, or the like. The insulating film 22 is thicker than the extraction electrode 16 and is about several μm. At this time, the upper surface of the insulating film 22 is flattened by a known flattening means.
When forming the insulating film 22, the four corners of the insulating film 22 are removed in an arc shape by patterning by photolithography, as shown in FIG. 6, in accordance with the through holes 32 formed in the base member wafer 31. Similarly, the insulating film in the intermediate portion in the vicinity of the connecting portion 15 is also removed.

次いで、図１０及び図１１に示すように、接合膜２４を形成する（接合膜形成工程）。すなわち、絶縁膜２２上に、スパッタリングや蒸着などによって、接合膜２４を形成する。そして、フォトリソグラフィによるパターニングにより、接合膜２４の中央部分を取り去る。また、隅部を電気的に分離できるよう接合膜の隅部近傍を円弧状に取り去る。
さらに、図１２、図１３に示すように、接続部１５に水晶振動片３の基端部を電気的に接続する（接続工程）。これにより、水晶振動片３が固定される。この接続方法としては、超音波を利用した金―金接合やハンダ接合、あるいは導電性接着材を用いる方法などが選択される。 Next, as shown in FIGS. 10 and 11, a bonding film 24 is formed (bonding film forming step). That is, the bonding film 24 is formed on the insulating film 22 by sputtering or vapor deposition. Then, the central portion of the bonding film 24 is removed by patterning by photolithography. Further, the vicinity of the corner of the bonding film is removed in an arc shape so that the corner can be electrically separated.
Further, as shown in FIGS. 12 and 13, the base end portion of the crystal vibrating piece 3 is electrically connected to the connection portion 15 (connection process). Thereby, the crystal vibrating piece 3 is fixed. As this connection method, gold-gold bonding or solder bonding using ultrasonic waves, or a method using a conductive adhesive is selected.

次いで、図１４に示すように、蓋部材用ウエハ３０と上述のベース部材用ウエハ３１とを陽極接合する（接合工程）。すなわち、真空中において、蓋部材用ウエハ３０に、水晶振動片３などを覆うようにして、上述のベース部材用ウエハ３１を重ね合わせる。このとき、それぞれの欠け防止用凹部８と欠け防止用凹部１０とが対向し、これら欠け防止用凹部８，１０と振動片収納用凹部９とがキャビティ１２を形成する。このキャビティ１２内で、水晶振動片３が振動を許容された状態で収納される。
また、このとき例えばシリコンからなる接合膜２４と、ガラスからなるベース部材用ウエハ３１の一方の主面３１ａが密着した状態になる。 Next, as shown in FIG. 14, the lid member wafer 30 and the base member wafer 31 are anodically bonded (bonding step). That is, in the vacuum, the base member wafer 31 is overlaid on the lid member wafer 30 so as to cover the crystal vibrating piece 3 and the like. At this time, each of the chipping prevention concave portions 8 and the chipping prevention concave portions 10 face each other, and the chipping prevention concave portions 8 and 10 and the vibration piece storage concave portion 9 form a cavity 12. In the cavity 12, the crystal vibrating piece 3 is housed in a state where vibration is allowed.
At this time, for example, the bonding film 24 made of silicon and the one main surface 31a of the base member wafer 31 made of glass are brought into close contact with each other.

この状態で、蓋部材用ウエハ３０及びベース部材用ウエハ３１を所定の温度に加熱し、かつ所定の電圧を印加する。この結果、接合膜２４は、一方の主面３１ａとの間に静電引力が生じて両者が強く密着し、陽極接合される。これにより、キャビティ１２が気密封止され、行列方向に連続した密閉容器２が形成される。それから、電圧の印加を停止し、蓋部材用ウエハ３０及びベース部材用ウエハ３１を除冷して常温に戻す。これら蓋部材用ウエハ３０及びベース部材用ウエハ３１の温度が上昇してから常温に戻されるまでの間、蓋部材用ウエハ３０及びベース部材用ウエハ３１は、温度上昇によって熱膨張し、除冷によって収縮して元に戻される。   In this state, the lid member wafer 30 and the base member wafer 31 are heated to a predetermined temperature and a predetermined voltage is applied. As a result, the bonding film 24 is electrostatically attracted to one main surface 31a, and both are strongly adhered to each other and are anodically bonded. Thereby, the cavity 12 is hermetically sealed, and the hermetic container 2 continuous in the matrix direction is formed. Then, the voltage application is stopped, and the lid member wafer 30 and the base member wafer 31 are cooled to return to room temperature. During the period from when the temperature of the lid member wafer 30 and the base member wafer 31 rises to the return to room temperature, the lid member wafer 30 and the base member wafer 31 thermally expand as the temperature rises, Shrink and return.

それから、図１５及び図１６に示すように、それぞれの密閉容器２に外部端子２７を設ける（外部電極形成工程）。すなわち、ベース部材用ウエハ３１の他方の主面に、金属マスクを施し、スパッタリングや蒸着などによって薄膜を形成する。これにより、スルーホール３２の内面からベース部材用ウエハ３１の他方の主面にまで延在する一対の外部端子２７が設けられる。この外部端子２７は、スルーホール３２に形成された導電部２８を介して、引き出し電極１６の四隅に接続されている。   Then, as shown in FIGS. 15 and 16, external terminals 27 are provided in the respective sealed containers 2 (external electrode forming step). That is, a metal mask is applied to the other main surface of the base member wafer 31, and a thin film is formed by sputtering or vapor deposition. Thus, a pair of external terminals 27 extending from the inner surface of the through hole 32 to the other main surface of the base member wafer 31 are provided. The external terminal 27 is connected to the four corners of the extraction electrode 16 through a conductive portion 28 formed in the through hole 32.

さらに、ダイシング工程において、蓋部材用ウエハ３０及びベース部材用ウエハ３１を切断する。すなわち、外部電極形成工程後の蓋部材用ウエハ３０及びベース部材用ウエハ３１を、ダイシングソーに設置し、スルーホール３２を結ぶ直線上を行列方向にダイシングブレードによって切断する。
そして、それら切断された一つ一つの上下を反転させると、図１に示す水晶振動子１となる。 Further, in the dicing process, the lid member wafer 30 and the base member wafer 31 are cut. That is, the lid member wafer 30 and the base member wafer 31 after the external electrode forming step are placed on a dicing saw, and a straight line connecting the through holes 32 is cut in a matrix direction by a dicing blade.
Then, when the top and bottom of each cut are inverted, the crystal resonator 1 shown in FIG. 1 is obtained.

本実施形態における水晶振動子１によれば、対を成す外部端子２７に所定の電圧を印加すると、その電圧は、導電部２８、引き出し電極１６及び接続部１５を介して、水晶振動片３に印加される。すると、圧電効果により、振動腕部３ａが互いに接近または離隔する方向に、即ち逆相のモードで、所定の周期を持って振動片収納用凹部９内で屈曲運動する。   According to the crystal resonator 1 in the present embodiment, when a predetermined voltage is applied to the paired external terminals 27, the voltage is applied to the crystal vibrating piece 3 via the conductive portion 28, the extraction electrode 16, and the connection portion 15. Applied. Then, due to the piezoelectric effect, the vibrating arms 3a bend and move in the vibrating piece housing recess 9 with a predetermined period in a direction in which the vibrating arms 3a approach or separate from each other, that is, in a reverse phase mode.

ところで、落下等の衝撃が作用する場合には水晶振動片３がたわむが、周波数調整用の重り５が設けられない側、つまりベース部材７側にたわむときに、水晶振動片の先端部近傍が欠け防止用凹部の水晶振動片への接触縁部１０ｂにあたる。この水晶振動片への接触縁部１０ｂをあらかじめ水晶振動片の先端側へずらして設けているので、当たった後の、水晶振動片３の先端側のたわみをより小さく抑えることができる。このため、欠け防止用凹部の深さＤａを浅く設定することができる。   By the way, when an impact such as dropping is applied, the crystal vibrating piece 3 bends, but when the frequency adjusting weight 5 is not provided, that is, when bent to the base member 7 side, the vicinity of the tip of the crystal vibrating piece is It corresponds to the contact edge portion 10b of the recess for preventing chipping to the quartz crystal vibrating piece. Since the contact edge portion 10b to the quartz crystal vibrating piece is provided by being shifted in advance to the tip side of the quartz crystal vibrating piece, the deflection on the tip side of the quartz crystal vibrating piece 3 after hitting can be further reduced. For this reason, the depth Da of the recess for preventing chipping can be set shallow.

加えて、本実施形態では、ベース部材７に振動片収納用凹部９を設けそこに水晶振動片３を収納する、いわゆるチップマウント方式を採用しており、したがって、ベース部材７には、欠け防止用凹部１０の他に振動片収納用凹部９を備え、それら凹部９，１０を重ねた状態で備えている。このため、これら重ねられた凹部９，１０を設けるゆえに強度が低下するおそれがあるが、前述したように欠け防止用凹部１０の深さＤａを浅く設定できる分、それら凹部９，１０を備えることに伴うベース部材７の強度低下を防止することができる。
現に、ベース部材７は、両凹部９、１０を重ねた状態で備えているにも拘わらず、それら凹部の重ねた深さＤａ＋Ｄｃは、蓋部材６の欠け防止用の凹部８の深さＤｂと同程度に設定されている。つまり、予め、ベース部材７と蓋部材６の板厚を同程度に設定しておけば、ベース部材７の強度を蓋部材６の強度と同程度に維持できる。 In addition, in the present embodiment, a so-called chip mount method is adopted in which the base member 7 is provided with the recess 9 for storing the resonator element and the crystal resonator element 3 is stored therein. In addition to the concave portion 10 for the vibration, the concave portion 9 for storing the resonator element is provided, and the concave portions 9 and 10 are provided in a stacked state. For this reason, there is a possibility that the strength may be reduced due to the provision of the overlapped recesses 9 and 10. However, as described above, the recesses 9 and 10 are provided to the extent that the depth Da of the recess prevention recess 10 can be set shallow. Accordingly, it is possible to prevent the strength of the base member 7 from being lowered.
Actually, although the base member 7 is provided with the concave portions 9 and 10 being stacked, the overlapping depth Da + Dc of the concave portions is equal to the depth Db of the concave portion 8 for preventing the cover member 6 from being chipped. It is set to the same level. That is, if the plate thickness of the base member 7 and the lid member 6 is set to the same level in advance, the strength of the base member 7 can be maintained at the same level as the strength of the lid member 6.

ところで、水晶振動片３が、周波数調整用の重り５が設けられない側、つまりベース部材７側にたわむときに、前述したように、その先端部近傍が欠け防止用凹部の水晶振動片への接触縁部１０ｂにあたるが、もともと、この部分には周波数調整用の重り５を設けていないので、欠け防止用凹部の水晶振動片への接触縁部１０ｂとの接触により、周波数調整用の重り５の一部が欠落して周波数が変わるといった事態は生じない。   By the way, when the crystal vibrating piece 3 bends to the side where the frequency adjusting weight 5 is not provided, that is, to the base member 7 side, as described above, the vicinity of the tip portion thereof is connected to the crystal vibrating piece of the chipping prevention recess. Although it corresponds to the contact edge portion 10b, since the weight 5 for adjusting the frequency is not originally provided in this portion, the weight 5 for adjusting the frequency is brought into contact with the contact edge portion 10b of the recess for preventing chipping with the crystal vibrating piece. There is no situation where the frequency is changed due to a part of.

一方、落下等の衝撃が作用する場合に水晶振動片３の先端部近傍は、周波数調整用の重り５が設けられた側つまり蓋部材６側にもたわむこととなるが、蓋部材６の欠け防止用凹部８は、水晶振動片３の基端側へずらして設けられている。したがって、衝撃等によりたとえ水晶振動子の先端がたわんだとしても、欠け防止用凹部８内でたわむだけであって、水晶振動片３の先端が蓋部材６に当たったり、周波数調整用の重り５が欠け防止用凹部８の縁部８ｂにあたったりすることはない。   On the other hand, when an impact such as dropping is applied, the vicinity of the tip of the quartz crystal vibrating piece 3 is bent toward the side where the frequency adjusting weight 5 is provided, that is, the lid member 6 side. The prevention recess 8 is provided so as to be shifted toward the base end side of the crystal vibrating piece 3. Therefore, even if the tip of the crystal resonator is bent due to an impact or the like, it is only bent in the chipping prevention recess 8, and the tip of the crystal vibrating piece 3 hits the lid member 6 or the weight 5 for adjusting the frequency. Does not hit the edge 8b of the recess prevention recess 8.

＜第２実施形態＞
次に、本発明の第２実施形態について、図１７を参照して説明する。
図１７において、符号３８は、本発明の第２実施形態に係る発振器を示すものである。
発振器３８は、上記第１または第２の実施形態の水晶振動子１が発振子として用いられて構成されたものである。
発振器３８は、コンデンサなどの電子部品３９が実装された基板４０を備えている。基板４０には、発振器用の集積回路４３が実装されており、この集積回路４３の近傍に、水晶振動子１が実装されている。そして、これら電子部品３９、集積回路４３及び水晶振動子１は、不図示の配線パターンによって電気的に接続されている。なお、各構成部品は、不図示の樹脂によりモールドされている。 Second Embodiment
Next, a second embodiment of the present invention will be described with reference to FIG.
In FIG. 17, the code | symbol 38 shows the oscillator which concerns on 2nd Embodiment of this invention.
The oscillator 38 is configured by using the crystal resonator 1 of the first or second embodiment as an oscillator.
The oscillator 38 includes a substrate 40 on which an electronic component 39 such as a capacitor is mounted. An integrated circuit 43 for an oscillator is mounted on the substrate 40, and the crystal unit 1 is mounted in the vicinity of the integrated circuit 43. The electronic component 39, the integrated circuit 43, and the crystal unit 1 are electrically connected by a wiring pattern (not shown). Each component is molded with a resin (not shown).

このような構成のもと、水晶振動子１に電圧を印加すると、上述の水晶振動片が振動し、その振動が、水晶の持つ圧電特性により電気信号に変換されて、集積回路４３に電気信号として入力される。この入力された電気信号は、集積回路４３によって、各種処理がなされ、周波数信号として出力される。これにより、水晶振動子１が発振子として機能する。
また、集積回路４３の構成を、例えばＲＴＣ（リアルタイムクロック）モジュール等を要求に応じて選択的に設定することにより、時計用単機能発振器などの他、当該機器や外部機器の動作日や時刻を制御したり、時刻やカレンダーなどを提供したりする機能を付与することができる。 Under such a configuration, when a voltage is applied to the crystal resonator 1, the above-described crystal vibrating piece vibrates, and the vibration is converted into an electric signal by the piezoelectric characteristics of the crystal, and the electric signal is supplied to the integrated circuit 43. Is entered as The input electrical signal is subjected to various processes by the integrated circuit 43 and output as a frequency signal. Thereby, the crystal unit 1 functions as an oscillator.
Further, by selectively setting the configuration of the integrated circuit 43, for example, an RTC (real-time clock) module or the like as required, the operating date and time of the device and external device can be set in addition to a single-function oscillator for a clock. Functions such as control and provision of time and calendar can be provided.

以上より、本実施形態における発振器３８によれば、上記第１の実施形態に係る水晶振動子１と同様の効果を奏することができるだけでなく、長期にわたって安定した高精度な周波数信号を得ることができる。   As described above, according to the oscillator 38 in the present embodiment, not only can the same effect as the crystal resonator 1 according to the first embodiment be obtained, but also a stable and highly accurate frequency signal can be obtained over a long period of time. it can.

＜第３実施形態＞
次に、本発明の第３実施形態について説明する。
本実施形態では、上記第１の実施形態における水晶振動子１を備える電子機器として、携帯情報機器について説明する。
図１８において、符号４６は、携帯情報機器を示すものであり、図１８を参照して、携帯情報機器４６の機能的構成について説明する。 <Third Embodiment>
Next, a third embodiment of the present invention will be described.
In the present embodiment, a portable information device will be described as an electronic device including the crystal unit 1 in the first embodiment.
In FIG. 18, the code | symbol 46 shows a portable information device, The functional structure of the portable information device 46 is demonstrated with reference to FIG.

携帯情報機器４６は、電力を供給するための電源部４７を備えている。電源部４７は、例えばリチウム二次電池からなっている。
電源部４７には、各種制御を行う制御部４８と、時刻等のカウントを行う計時部５１と、外部との通信を行う通信部５２と、各種情報を表示する表示部５６と、それぞれの機能部の電圧を検出する電圧検出部５３と、が並列に接続されている。そして、電源部４７によって、各機能部に電力が供給されるようになっている。 The portable information device 46 includes a power supply unit 47 for supplying power. The power supply unit 47 is made of, for example, a lithium secondary battery.
The power supply unit 47 includes a control unit 48 that performs various controls, a clock unit 51 that counts time, a communication unit 52 that communicates with the outside, a display unit 56 that displays various types of information, and respective functions. A voltage detection unit 53 for detecting the voltage of the unit is connected in parallel. The power supply unit 47 supplies power to each functional unit.

制御部４８は、各機能部を制御して、音声データの送信及び受信、現在時刻の計測や表示など、システム全体の動作制御を行う。また、制御部４８は、あらかじめプログラムが書き込まれたＲＯＭと、このＲＯＭに書き込まれたプログラムを読み出して実行するＣＰＵと、このＣＰＵのワークエリアとして使用されるＲＡＭなどを備えている。   The control unit 48 controls each function unit to control the operation of the entire system such as transmission and reception of audio data, measurement and display of the current time, and the like. The control unit 48 includes a ROM in which a program is written in advance, a CPU that reads and executes the program written in the ROM, and a RAM that is used as a work area for the CPU.

計時部５１は、発振回路、レジスタ回路、カウンタ回路及びインターフェイス回路などを内蔵する集積回路と、水晶振動子１とを備えている。水晶振動子１に電圧を印加すると、上述の水晶振動片が振動し、その振動が、水晶の持つ圧電特性により電気信号に変換されて、発振回路に電気信号として入力される。発振回路の出力は２値化され、レジスタ回路とカウンタ回路とにより計数される。そして、インターフェイス回路を介して、制御部４８と信号の送受信が行われ、表示部５６に、現在時刻や現在日付あるいはカレンダー情報などが表示される。   The timer unit 51 includes an integrated circuit including an oscillation circuit, a register circuit, a counter circuit, an interface circuit, and the like, and the crystal unit 1. When a voltage is applied to the crystal unit 1, the above-described crystal vibrating piece vibrates, and the vibration is converted into an electric signal by the piezoelectric characteristics of the crystal and is input to the oscillation circuit as an electric signal. The output of the oscillation circuit is binarized and counted by a register circuit and a counter circuit. Then, signals are transmitted to and received from the control unit 48 via the interface circuit, and the current time, current date, calendar information, etc. are displayed on the display unit 56.

通信部５２は、従来の携帯電話と同様の機能を有し、無線部５７、音声処理部５８、切替部６１、増幅部６２、音声入出力部６３、電話番号入力部６６、着信音発生部６７及び呼制御メモリ部６８を備えている。
無線部５７は、音声データ等の各種データを、アンテナを介して基地局と送受信のやりとりを行う。音声処理部５８は、無線部５７または増幅部６２から入力された音声信号を符号化及び復号化する。増幅部６２は、音声処理部５８または音声入出力部６３から入力された信号を所定のレベルまで増幅する。音声入出力部６３は、スピーカやマイクロフォンなどからなり、着信音や受話音声を拡声したり、話者音声を集音したりする。 The communication unit 52 has functions similar to those of a conventional mobile phone, and includes a radio unit 57, a voice processing unit 58, a switching unit 61, an amplification unit 62, a voice input / output unit 63, a telephone number input unit 66, and a ring tone generation unit. 67 and a call control memory unit 68.
The wireless unit 57 exchanges various data such as audio data with the base station via an antenna. The audio processing unit 58 encodes and decodes the audio signal input from the radio unit 57 or the amplification unit 62. The amplifying unit 62 amplifies the signal input from the audio processing unit 58 or the audio input / output unit 63 to a predetermined level. The voice input / output unit 63 includes a speaker, a microphone, and the like, and amplifies a ringtone and a received voice or collects a speaker voice.

また、着信音発生部６７は、基地局からの呼び出しに応じて着信音を生成する。切替部６１は、着信時に限って、音声処理部５８に接続されている増幅部６２を着信音発生部６７に切り替えることによって、着信音発生部６７において生成された着信音が、増幅部６２を介して音声入出力部６３に出力される。なお、呼制御メモリ部６８は、通信の発着呼制御に係るブログラムを格納する。また、電話番号入力部６６は、例えば０から９の番号キー及びその他のキーを備えており、これら番号キーなどを押下することにより、通話先の電話番号などが入力される。   In addition, the ring tone generator 67 generates a ring tone in response to a call from the base station. The switching unit 61 switches the amplifying unit 62 connected to the voice processing unit 58 to the ringing tone generating unit 67 only when an incoming call is received, so that the ringing tone generated in the ringing tone generating unit 67 causes the amplifying unit 62 to be switched. To the voice input / output unit 63. The call control memory unit 68 stores a program related to incoming / outgoing call control of communication. The telephone number input unit 66 includes, for example, number keys from 0 to 9 and other keys. By pressing these number keys, the telephone number of the call destination is input.

電圧検出部５３は、電源部４７によって制御部４８などの各機能部に対して加えられている電圧が、所定の値を下回った場合に、その電圧降下を検出して制御部４８に通知する。このときの所定の電圧値は、通信部５２を安定して動作させるために必要な最低限の電圧としてあらかじめ設定されている値であり、例えば３Ｖ程度となる。電圧検出部５３から電圧降下の通知を受けた制御部４８は、無線部５７、音声処理部５８、切替部６１及び着信音発生部６７の動作を禁止する。特に、消費電力の大きな無線部５７の動作停止は必須となる。さらに、表示部５６に、通信部５２が電池残量の不足により使用不能になった旨が表示される。   When the voltage applied to each functional unit such as the control unit 48 by the power supply unit 47 falls below a predetermined value, the voltage detection unit 53 detects the voltage drop and notifies the control unit 48 of the voltage drop. . The predetermined voltage value at this time is a value set in advance as a minimum voltage necessary to stably operate the communication unit 52, and is, for example, about 3V. Upon receiving the voltage drop notification from the voltage detection unit 53, the control unit 48 prohibits the operations of the radio unit 57, the voice processing unit 58, the switching unit 61, and the ring tone generation unit 67. In particular, it is essential to stop the operation of the wireless unit 57 with high power consumption. Further, the display unit 56 displays that the communication unit 52 has become unusable due to insufficient battery power.

すなわち、電圧検出部５３と制御部４８とによって、通信部５２の動作を禁止し、その旨を表示部５６に表示することができる。この表示は、文字メッセージであってもよいが、より直感的な表示として、表示部５６の表示面の上部に表示された電話アイコンに、×（バツ）印を付けるようにしてもよい。
なお、水晶振動子１は、通信部５２の機能に係る部分の電源を、選択的に遮断することができる電源遮断部６９を備えており、この電源遮断部６９によって、通信部５２の機能が確実に停止される。 That is, the operation of the communication unit 52 can be prohibited by the voltage detection unit 53 and the control unit 48, and that effect can be displayed on the display unit 56. This display may be a text message, but as a more intuitive display, a x (X) mark may be attached to the telephone icon displayed at the top of the display surface of the display unit 56.
In addition, the crystal unit 1 includes a power cutoff unit 69 that can selectively cut off the power supply of the portion related to the function of the communication unit 52, and the function of the communication unit 52 can be reduced by the power cutoff unit 69. Stop surely.

以上より、本実施形態における携帯情報機器４６によれば、上記第１または第２実施形態に係る水晶振動子１と同様の効果を奏することができるだけでなく、長期にわたって安定した高精度な計時情報を表示することができる。   As described above, according to the portable information device 46 in the present embodiment, not only can the same effect as the crystal resonator 1 according to the first or second embodiment described above be achieved, but also highly accurate timekeeping information that is stable over a long period of time. Can be displayed.

なお、本発明の技術範囲は上記の実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において、種々の変更を加えることが可能である。
前述した第１実施形態では、ベース部材７に振動片収納用凹部９を設けそこに水晶振動片３をマウントした状態で収納する、いわゆるチップマウント方式を例に挙げて説明したが、本発明が適用されるものは、チップマウント方式の圧電振動子に限定されるものではなく、ベース部材と蓋部材それぞれに振動収納用凹部を設けたものにも勿論適用可能である。
また、前記第１実施形態では、蓋部材６とベース部材７の板厚をほぼ同程度に設定しているが、これに限られること無く、それら蓋部材６とベース部材７の板厚を変えてもよい。 The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
In the first embodiment described above, a so-called chip mount method in which the resonator element storing recess 9 is provided in the base member 7 and the crystal resonator element 3 is mounted in the recess 9 is described as an example. The application is not limited to the chip mount type piezoelectric vibrator, but can of course be applied to the base member and the lid member provided with the vibration housing recesses.
In the first embodiment, the plate thickness of the lid member 6 and the base member 7 is set to be approximately the same. However, the present invention is not limited to this, and the plate thickness of the lid member 6 and the base member 7 is changed. May be.

本発明の第１実施形態としての水晶振動子を示すもので、（ａ）は側面から観たときの様子を示す断面図、（ｂ）は（ａ）のＡ円部の拡大断面図である。1A and 1B show a crystal resonator according to a first embodiment of the present invention, in which FIG. 1A is a cross-sectional view showing a state when viewed from a side surface, and FIG. . 図１の水晶振動子の製造工程において、蓋部材用ウエハに欠け防止用凹部を形成した様子を示す平面図である。FIG. 3 is a plan view showing a state in which a chipping prevention recess is formed in the lid member wafer in the manufacturing process of the crystal unit of FIG. 1. 図２の蓋部材用ウエハを示す断面図である。It is sectional drawing which shows the wafer for lid | cover members of FIG. 図１の水晶振動子の製造工程において、ベース部材用ウエハに振動片収納用凹部及び欠け防止用凹部を形成した様子を示す平面図である。FIG. 5 is a plan view showing a state in which a resonator element housing recess and a chip prevention recess are formed in a base member wafer in the manufacturing process of the crystal unit of FIG. 1. 図４のベース部材用ウエハを示す断面図である。It is sectional drawing which shows the wafer for base members of FIG. 図１の水晶振動子の製造工程において、蓋部材用ウエハに引き出し電極及び接続部を形成した様子を示す平面図である。FIG. 7 is a plan view showing a state in which lead electrodes and connection portions are formed on the lid member wafer in the manufacturing process of the crystal unit of FIG. 1. 図６のＡＡ線矢視断面図である。FIG. 7 is a cross-sectional view taken along line AA in FIG. 6. 図１の水晶振動子の製造工程において、蓋部材用ウエハに絶縁膜を形成した様子を示す平面図である。FIG. 3 is a plan view showing a state in which an insulating film is formed on the lid member wafer in the manufacturing process of the crystal unit of FIG. 1. 図８のＡＡ線矢視断面図である。It is AA arrow sectional drawing of FIG. 図１の水晶振動子の製造工程において、蓋部材用ウエハに接合膜を形成した様子を示す平面図である。FIG. 4 is a plan view showing a state in which a bonding film is formed on the lid member wafer in the manufacturing process of the crystal unit of FIG. 1. 図１０のＡＡ線矢視断面図である。It is AA arrow sectional drawing of FIG. 図１の水晶振動子の製造工程において、蓋部材用ウエハに振動片を設けた様子を示す平面図である。FIG. 3 is a plan view showing a state in which a resonator element is provided on a lid member wafer in the manufacturing process of the crystal unit of FIG. 1. 図１２のＡＡ線矢視断面図である。It is AA arrow sectional drawing of FIG. 図１の水晶振動子の製造工程において、蓋部材用ウエハにベース部材用ウエハを重ね合わせた様子を示す側面図である。FIG. 3 is a side view showing a state in which a base member wafer is superposed on a lid member wafer in the manufacturing process of the crystal unit of FIG. 1. 図１の水晶振動子の製造工程において、ベース部材用ウエハに外部電極を形成した様子を示す平面図である。FIG. 2 is a plan view showing a state in which external electrodes are formed on a base member wafer in the manufacturing process of the crystal unit of FIG. 1. 図１５の蓋部材用ウエハやベース部材用ウエハなどを示す側面図である。FIG. 16 is a side view illustrating the lid member wafer, the base member wafer, and the like of FIG. 15. 本発明の第２実施形態としての発振器を示す平面図である。It is a top view which shows the oscillator as 2nd Embodiment of this invention. 本発明の第３実施形態としての携帯情報機器を示すブロック図である。It is a block diagram which shows the portable information device as 3rd Embodiment of this invention.

符号の説明Explanation of symbols

１水晶振動子（圧電振動子） ２密閉容器 ３水晶振動片（圧電振動片） ５周波数調整用の重り ５ａ粗調用の重り ５ｂ微調用の重り ６蓋部材 ６ａ一方の主面（内面） ７ベース部材 ７ａ一方の主面（内面） ８欠け防止用凹部 ８ｂ水晶振動片（圧電振動片）への接触縁部 ９振動片収納用凹部 １０欠け防止用凹部 １０ｂ水晶振動片（圧電振動片）への接触縁部 １５接続部 １６引き出し電極 ２２絶縁膜 ２４接合膜 ３８発振器 ４３集積回路 ４６携帯情報機器（電子機器） DESCRIPTION OF SYMBOLS 1 Quartz crystal vibrator (piezoelectric vibrator) 2 Airtight container 3 Quartz crystal vibration piece (piezoelectric vibration piece) 5 Weight for frequency adjustment 5a Weight for coarse adjustment 5b Weight for fine adjustment 6 Lid member 6a One main surface (inner surface) 7 Base Member 7a One main surface (inner surface) 8 Chipping prevention recess 8b Contact edge to crystal vibrating piece (piezoelectric vibrating piece) 9 Vibration piece storage recess 10 Chipping prevention recess 10b Crystal vibrating piece (piezoelectric vibrating piece) Contact edge 15 Connection 16 Extraction electrode 22 Insulating film 24 Bonding film 38 Oscillator 43 Integrated circuit 46 Portable information device (electronic device)

Claims (3)

板状の蓋部材と板状のベース部材とが厚さ方向に重ね合わされて構成された密閉容器と、
該密閉容器内に、基端部を前記蓋部材または前記ベース部材に片持ち支持された状態で配置された圧電振動片と、
前記蓋部材及び前記ベース部材の内面であって、前記圧電振動片の先端部に対応する箇所にそれぞれ設けられた欠け防止用凹部と、
前記圧電振動片の先端部に設けられた周波数調整用の重りと、
を備える圧電振動子において、
前記圧電振動片が前記ベース部材の内面に設けられた振動片収納用凹部に収納され、
前記圧電振動片の先端部の前記蓋部材と対向する面にのみ前記周波数調整用の重りが設けられ、
前記ベース部材の前記欠け防止用凹部の前記圧電振動片への接触縁部が、前記蓋部材の前記欠け防止用凹部の前記圧電振動片への接触縁部よりも前記圧電振動片の先端側へずらして設けられていることを特徴とする圧電振動子。 A hermetically sealed container configured by overlapping a plate-like lid member and a plate-like base member in the thickness direction;
A piezoelectric vibrating piece arranged in a state where the base end is cantilevered by the lid member or the base member in the sealed container;
On the inner surface of the lid member and the base member, a chipping-preventing recess provided respectively at a position corresponding to the tip of the piezoelectric vibrating piece;
A weight for adjusting the frequency provided at the tip of the piezoelectric vibrating piece;
In a piezoelectric vibrator comprising:
The piezoelectric vibrating piece is housed in a recessed portion for vibrating piece storage provided on the inner surface of the base member,
The weight for adjusting the frequency is provided only on the surface of the tip portion of the piezoelectric vibrating piece facing the lid member,
The contact edge portion of the base member with the chip-preventing recess is closer to the distal end side of the piezoelectric vibration piece than the contact edge portion of the cap member with the chip-prevention recess is contacted with the piezoelectric vibration piece. A piezoelectric vibrator characterized by being provided in a shifted manner . 請求項１に記載の圧電振動子が、発振子として集積回路に電気的に接続されていることを特徴とする発振器。 2. An oscillator, wherein the piezoelectric vibrator according to claim 1 is electrically connected to an integrated circuit as an oscillator. 請求項１に記載の圧電振動子を備えることを特徴とする電子機器。 An electronic apparatus comprising the piezoelectric vibrator according to claim 1 .
JP2006227743A 2006-08-24 2006-08-24 Piezoelectric vibrator, oscillator including the same, and electronic device Expired - Fee Related JP4814016B2 (en)

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