JP4809714B2 - 薄板収納容器 - Google Patents
薄板収納容器 Download PDFInfo
- Publication number
- JP4809714B2 JP4809714B2 JP2006133868A JP2006133868A JP4809714B2 JP 4809714 B2 JP4809714 B2 JP 4809714B2 JP 2006133868 A JP2006133868 A JP 2006133868A JP 2006133868 A JP2006133868 A JP 2006133868A JP 4809714 B2 JP4809714 B2 JP 4809714B2
- Authority
- JP
- Japan
- Prior art keywords
- protective cover
- flange
- top flange
- thin plate
- flange portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
- B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
- B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
以上のように構成された薄板収納容器1は、次のようにして使用される。
保護カバー41の一対の当接部42と一対の係止爪43が、フランジ部25の各辺に当接して保護カバー41をトップフランジ5に対して位置決めをした状態で、さらに、一対の係止爪43がフランジ部25に係止して、保護カバー41をトップフランジ5に固定するため、保護カバー41をトップフランジ5のフランジ部25に容易に取り付けることができ、真空包装の際に袋がトップフランジ5のエッジ部に接触して破損するのを確実に防止することができる。
(1) 上記実施形態では、当接部42及び係止爪43を平坦板状に形成したが、これら当接部42及び係止爪43とフランジ部25との間に、嵌合部及び被嵌合部を設けてもよい。この場合、トップフランジ5のフランジ部25に、嵌合部としてのV溝25A(図6,7参照)を設ける。このV溝25Aは、フランジ部25の各辺の中央位置をV字型に切り欠いて形成されている。保護カバー41の当接部42及び係止爪43には、前記V溝25Aに嵌合する被嵌合部としてV型突起片(図示せず)を設ける。
Claims (3)
- トップフランジと、当該トップフランジを覆う保護カバーとを備え、
前記トップフランジがほぼ四角形平板状のフランジ部を有し、
前記保護カバーが、前記フランジ部全体を覆う四角形皿状に形成されると共に、前記フランジ部の対向する2つの辺に当接して一方向の位置決めをする一対の当接部と、当該各当接部と直交する前記フランジ部の2つの辺に当接して他方向の位置決めをすると共に当該2つの辺に係止する一対の係止爪とを備えて構成され、
前記保護カバーの周縁の端部から前記係止爪の両側の位置まで2つのスリットを設けて当該係止爪を撓みやすくすると共に、前記2つのスリットで仕切られた保護カバーの周縁部と前記係止爪との間に当該係止爪を開閉させる取っ手部を設けたことを特徴とする薄板収納容器。 - 請求項1に記載の薄板収納容器において、
前記保護カバーの外側面形状が、なだらかな傾斜を描くように形成されたことを特徴とする薄板収納容器。 - 請求項1又は2に記載の薄板収納容器において、
前記トップフランジのフランジ部の4つの辺に嵌合部を設けると共に、
前記一対の当接部又は一対の係止爪のいずれか一方の2箇所又は両方の4箇所に被嵌合部を設けたことを特徴とする薄板収納容器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006133868A JP4809714B2 (ja) | 2006-05-12 | 2006-05-12 | 薄板収納容器 |
PCT/JP2007/059592 WO2007132711A1 (ja) | 2006-05-12 | 2007-05-09 | 薄板収納容器用トップフランジ保護カバー及びこれを備えた薄板収納容器 |
US12/227,168 US20090277816A1 (en) | 2006-05-12 | 2007-05-09 | Top Flange Protective Cover for Thin Plate Container and Thin Plate Container Provided Therewith |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006133868A JP4809714B2 (ja) | 2006-05-12 | 2006-05-12 | 薄板収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007302311A JP2007302311A (ja) | 2007-11-22 |
JP4809714B2 true JP4809714B2 (ja) | 2011-11-09 |
Family
ID=38693806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006133868A Expired - Fee Related JP4809714B2 (ja) | 2006-05-12 | 2006-05-12 | 薄板収納容器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090277816A1 (ja) |
JP (1) | JP4809714B2 (ja) |
WO (1) | WO2007132711A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5234742B2 (ja) * | 2008-02-28 | 2013-07-10 | Hoya株式会社 | 磁気ディスクの製造方法 |
JP5234741B2 (ja) * | 2008-02-28 | 2013-07-10 | Hoya株式会社 | 磁気ディスク用ガラス基板の製造方法 |
JP4825241B2 (ja) * | 2008-06-17 | 2011-11-30 | 信越ポリマー株式会社 | 基板収納容器 |
US20130270152A1 (en) * | 2010-10-19 | 2013-10-17 | Entegris, Inc. | Front opening wafer container with robotic flange |
JP7032086B2 (ja) * | 2017-09-15 | 2022-03-08 | アキレス株式会社 | 板状物搬送容器 |
JP7336923B2 (ja) * | 2019-09-05 | 2023-09-01 | 信越ポリマー株式会社 | 基板収納容器 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0546771U (ja) * | 1991-11-29 | 1993-06-22 | 岩崎電気株式会社 | ランプの包装体 |
JPH05213366A (ja) * | 1992-01-29 | 1993-08-24 | Ricoh Co Ltd | 熱転写インクリボン又はシート巻体の包装物 |
US5873468A (en) * | 1995-11-16 | 1999-02-23 | Sumitomo Sitix Corporation | Thin-plate supporting container with filter means |
JP3538204B2 (ja) * | 1998-02-06 | 2004-06-14 | 三菱住友シリコン株式会社 | 薄板支持容器 |
US6474474B2 (en) * | 1998-02-06 | 2002-11-05 | Sumitomo Metal Industries, Ltd. | Sheet support container |
JP4321950B2 (ja) * | 2000-06-12 | 2009-08-26 | 信越ポリマー株式会社 | 基板収納容器の蓋体 |
US20030015534A1 (en) * | 2001-01-25 | 2003-01-23 | Lown John M. | Container and sealing cover |
JP4146718B2 (ja) * | 2002-12-27 | 2008-09-10 | ミライアル株式会社 | 薄板支持容器 |
US7131248B2 (en) * | 2003-07-14 | 2006-11-07 | Peak Plastic & Metal Products (Int'l) Limited | Wafer shipper with orientation control |
USD502319S1 (en) * | 2003-07-15 | 2005-03-01 | Gsl Solutions, Inc. | Lid for a storage container |
JP2005057078A (ja) * | 2003-08-05 | 2005-03-03 | Trecenti Technologies Inc | 半導体装置の製造方法 |
US7528936B2 (en) * | 2005-02-27 | 2009-05-05 | Entegris, Inc. | Substrate container with pressure equalization |
-
2006
- 2006-05-12 JP JP2006133868A patent/JP4809714B2/ja not_active Expired - Fee Related
-
2007
- 2007-05-09 WO PCT/JP2007/059592 patent/WO2007132711A1/ja active Application Filing
- 2007-05-09 US US12/227,168 patent/US20090277816A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20090277816A1 (en) | 2009-11-12 |
WO2007132711A1 (ja) | 2007-11-22 |
JP2007302311A (ja) | 2007-11-22 |
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