JP4782522B2 - 光機能素子パッケージ及びその製造方法 - Google Patents
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Description
請求項2記載の発明は、請求項1記載の発明において、前記光機能素子が、前記外部接続端子に対しワイヤーボンディング法によって電気的に接続されているものである。
請求項3記載の発明は、請求項1又は2のいずれか1項記載の発明において、前記パッケージ構成部材の孔部を覆う保護用被覆部材が当該パッケージ構成部材上に設けられているものである。
請求項4記載の発明は、請求項3記載の発明において、前記保護用被覆部材が、前記パッケージ構成部材から剥離可能な保護フィルムであるものである。
請求項5記載の発明は、所定の端子パターンが形成されたリードフレームの素子非実装側面に耐熱フィルムを貼り付ける工程と、前記リードフレームの素子実装側面に所定の光機能素子を実装する工程と、前記リードフレーム上の前記光機能素子の周囲に、液状封止樹脂を堰き止めるための突堤部を設ける工程と、前記突堤部の内側に液状封止樹脂を滴下する工程と、前記突堤部の内側の前記光機能素子との間に液状封止樹脂を滴下した後、前記光機能素子の機能部に対応する孔部を有するパッケージ構成部材を、当該孔部を前記光機能素子の機能部に対向させた状態で前記突堤部に当接させることにより当該パッケージ構成部材を前記液状封止樹脂に接触させる工程と、前記液状封止樹脂を硬化させる工程と、前記耐熱フィルムを当該リードフレームから剥離する工程と、前記突堤部を切断除去する工程とを有する光機能素子パッケージの製造方法である。
請求項6記載の発明は、請求項5記載の発明において、複数の実装領域を有するリードフレームと、前記リードフレームの各実装領域に対応する複数の突堤部を有する枠部材を用いるものである。
請求項7記載の発明は、請求項5又は6のいずれか1項記載の発明において、前記光機能素子として、当該機能部の近傍に前記液状封止樹脂を堰き止めるための堰き止め部を有する光機能素子を用いるものである。
また、本発明によれば、光機能素子の諸特性を確実に発揮させることが可能な光機能素子パッケージを安価に提供することができる。
図1(a)〜(e)は、本発明に係る光機能素子パッケージの製造方法の実施の形態を示す断面構成図、図2〜図7は、同実施の形態の工程を示す斜視図である。
図2に示すように、本実施の形態においては、まず、ICチップ用の取付部1a及び外部接続端子1bを有する実装領域がマトリクス状に複数配置されたリードフレーム1を用意する。
本発明の場合、耐熱フィルム2の種類は特に限定されることはないが、耐熱性確保とコストダウンの観点からは、ポリエステル樹脂からなるものを用いることが好ましい。
この耐熱フィルム2は、後述する液状封止樹脂6を支持するとともに、リードフレーム1実装面の液状樹脂による汚染を防止するためのものである。
さらに、図1(c)に示すように、リードフレーム1上の光機能素子3の周囲に、液状封止樹脂6を堰き止めるための突堤部5を設ける。
なお、突堤部5の高さは、その上端部分が金線4の上端部の位置より高い位置となるように条件を設定する。
本発明の場合、液状封止樹脂6としては、熱硬化型又は紫外線硬化型のいずれを用いることもでき、その種類は特に限定されない。
また、液状封止樹脂6として透光性の樹脂を用いることが必要である。
これにより、図1(e)及び図7に示すように、目的とする光機能素子パッケージ10を得る。
そして、図8(c)に示すように、上述した枠部材50を用い、リードフレーム1上の各光機能素子3の周囲に、液状封止樹脂6を堰き止めるための突堤部5を設ける。
そして、光機能素子3と突堤部5との間に液状封止樹脂6を滴下して光機能素子3と前記突堤部5との間にこの液状封止樹脂6を充填する。
このパッケージ構成部材7は、例えばプリント配線板、プラスチック板等からなる板状の部材で、例えばその中央部分に光機能素子3の機能部30に対応する孔部7aが設けられており、この孔部7aを当該機能部30の直上に配置して押圧を行う。
また、同様の観点から、光機能素子3の上面とパッケージ構成部材7の下面のクリアランスは、200〜400μmに設定することが好ましい。
これにより、図8(e)に示すように、目的とする光機能素子パッケージ11を得る。
図9に示すように、本実施の形態の光機能素子パッケージ12は、図8(e)に示す光機能素子パッケージ11のパッケージ構成部材7上に、例えば板状の保護用被覆部材8を、孔部7aを覆うように例えば接着剤を用いて貼り合わせたものである。これにより、光機能素子3の機能部30の上方に機能部露出用空間20が形成される。
その他の構成及び作用効果については上述の実施の形態と同一であるのでその詳細な説明を省略する。
図10に示すように、本実施の形態の光機能素子パッケージ13は、図8(e)に示す光機能素子パッケージ11のパッケージ構成部材7上に、例えば樹脂材料からなる保護フィルム9を、孔部7aを覆うように例えば接着剤を用いて貼り合わせたものである。
また、保護フィルム9の接着に用いる接着剤は接着力が弱くパッケージ構成部材7から保護フィルム9が剥離可能なものを用いる。
例えば、上述の実施の形態においては、耐熱フィルムをリードフレームから剥離した後に突堤部を切断除去するようにしたが、本発明はこれに限られず、突堤部を切断除去した後に耐熱フィルムを剥離することも可能である。
また、本発明においては、液状封止樹脂として光(例えば紫外線)硬化型の樹脂を用い、光によって硬化させることも可能である。この場合にはパッケージ構成部材を光透過性の材料から構成し、このパッケージ構成部材を介して光を液状封止樹脂に照射する。
Claims (7)
- 所定の機能部を有する光機能素子と、
固化された液状封止樹脂によって構成され、前記光機能素子を封止するためのパッケージ本体と、
前記光機能素子に対して電気的に接続され、所定のリードフレーム材料からなる外部接続端子とを有し、
前記光機能素子の機能部に対応する孔部を有するパッケージ構成部材が前記パッケージ本体上に固着され、当該パッケージ本体に、前記光機能素子の機能部を露出させるための機能部露出用空間が設けられている光機能素子パッケージ。 - 前記光機能素子が、前記外部接続端子に対しワイヤーボンディング法によって電気的に接続されている請求項1記載の光機能素子パッケージ。
- 前記パッケージ構成部材の孔部を覆う保護用被覆部材が当該パッケージ構成部材上に設けられている請求項1又は2のいずれか1項記載の光機能素子パッケージ。
- 前記保護用被覆部材が、前記パッケージ構成部材から剥離可能な保護フィルムである請求項3記載の光機能素子パッケージ。
- 所定の端子パターンが形成されたリードフレームの素子非実装側面に耐熱フィルムを貼り付ける工程と、
前記リードフレームの素子実装側面に所定の光機能素子を実装する工程と、
前記リードフレーム上の前記光機能素子の周囲に、液状封止樹脂を堰き止めるための突堤部を設ける工程と、
前記突堤部の内側に液状封止樹脂を滴下する工程と、
前記突堤部の内側の前記光機能素子との間に液状封止樹脂を滴下した後、前記光機能素子の機能部に対応する孔部を有するパッケージ構成部材を、当該孔部を前記光機能素子の機能部に対向させた状態で前記突堤部に当接させることにより当該パッケージ構成部材を前記液状封止樹脂に接触させる工程と、
前記液状封止樹脂を硬化させる工程と、
前記耐熱フィルムを当該リードフレームから剥離する工程と、
前記突堤部を切断除去する工程とを有する光機能素子パッケージの製造方法。 - 複数の実装領域を有するリードフレームと、前記リードフレームの各実装領域に対応する複数の突堤部を有する枠部材を用いる請求項5記載の光機能素子パッケージの製造方法。
- 前記光機能素子として、当該機能部の近傍に前記液状封止樹脂を堰き止めるための堰き止め部を有する光機能素子を用いる請求項5又は6のいずれか1項記載の光機能素子パッケージの製造方法。
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CN102464293B (zh) * | 2010-11-04 | 2014-09-03 | 无锡华润安盛科技有限公司 | 一种封盖辅助装置 |
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