JP4762934B2 - ホーン取付用アーム - Google Patents
ホーン取付用アーム Download PDFInfo
- Publication number
- JP4762934B2 JP4762934B2 JP2007050218A JP2007050218A JP4762934B2 JP 4762934 B2 JP4762934 B2 JP 4762934B2 JP 2007050218 A JP2007050218 A JP 2007050218A JP 2007050218 A JP2007050218 A JP 2007050218A JP 4762934 B2 JP4762934 B2 JP 4762934B2
- Authority
- JP
- Japan
- Prior art keywords
- horn mounting
- mounting arm
- horn
- ultrasonic horn
- fiber reinforced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004918 carbon fiber reinforced polymer Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 229920002430 Fibre-reinforced plastic Polymers 0.000 claims description 9
- 239000011151 fibre-reinforced plastic Substances 0.000 claims description 9
- 125000006850 spacer group Chemical group 0.000 claims description 9
- 239000012783 reinforcing fiber Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000011152 fibreglass Substances 0.000 claims description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 17
- 239000000956 alloy Substances 0.000 description 16
- 229910045601 alloy Inorganic materials 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 238000005452 bending Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 238000013016 damping Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
- H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/78822—Rotational mechanism
- H01L2224/78823—Pivoting mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Description
Claims (7)
- 一端が駆動部に固定され、他端に超音波ホーンが取り付けられるボンディング装置のホーン取付用アームであって、
一端側に配置された固定用ブラケットと、
他端側に配置された超音波ホーン取付用ブラケットと、
長手方向の強度が幅方向の強度よりも大きい繊維強化プラスチックで構成され、固定用ブラケットと超音波ホーン取付用ブラケットとを接続するアーム部材は、
固定用ブラケットと超音波ホーン取付用ブラケットとを挟み込んで固定する2枚の平板と、
各平板の間に固定され、各平板の間隔を保持する平板間隔保持部材と、
を備えることを特徴とするホーン取付用アーム。 - 請求項1に記載のホーン取付用アームであって、
繊維強化プラスチック間に挟まれている固定用ブラケット材質及び超音波ホーン取付用ブラケット材質は軽量金属であること、
を備えていることを特徴とするホーン取付用アーム。 - 請求項1に記載のホーン取付用アームであって、
平板間隔保持部材は、各平板に固定されるフランジと各フランジ間を接続するウェブとを有し、一端側の固定用ブラケットと他端側の超音波ホーン取付用ブラケットとの間に延びる長手構造部材であること、
を特徴とするホーン取付用アーム。 - 請求項1に記載のホーン取付用アームであって、
平板間隔保持部材は、一端側の固定用ブラケットと他端側の超音波ホーン取付用ブラケットとの間に固定されたスペーサであること、
を特徴とするホーン取付用アーム。 - 請求項4に記載のホーン取付用アームであって、
スペーサは、ハニカム構造材であること
を特徴とするホーン取付用アーム。 - 請求項1から5のいずれか1項に記載のホーン取付用アームであって、
繊維強化プラスチックは、炭素繊維強化プラスチック又はガラス繊維強化プラスチックであること、
を特徴とするホーン取付用アーム。 - 請求項1から6のいずれか1項に記載のホーン取付用アームであって、
繊維強化プラスチックは、長手方向の強化繊維の数が幅方向の強化繊維の数よりも多いこと、
を特徴とするホーン取付用アーム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007050218A JP4762934B2 (ja) | 2007-02-28 | 2007-02-28 | ホーン取付用アーム |
TW096131001A TW200836270A (en) | 2007-02-28 | 2007-08-22 | Horn attachment arm |
KR1020070123355A KR101013913B1 (ko) | 2007-02-28 | 2007-11-30 | 호른 부착용 암 |
CN200810005595A CN100590827C (zh) | 2007-02-28 | 2008-02-14 | 模具安装用臂 |
US12/072,380 US7780056B2 (en) | 2007-02-28 | 2008-02-26 | Horn attachment arm |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007050218A JP4762934B2 (ja) | 2007-02-28 | 2007-02-28 | ホーン取付用アーム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008218506A JP2008218506A (ja) | 2008-09-18 |
JP4762934B2 true JP4762934B2 (ja) | 2011-08-31 |
Family
ID=39714747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007050218A Active JP4762934B2 (ja) | 2007-02-28 | 2007-02-28 | ホーン取付用アーム |
Country Status (5)
Country | Link |
---|---|
US (1) | US7780056B2 (ja) |
JP (1) | JP4762934B2 (ja) |
KR (1) | KR101013913B1 (ja) |
CN (1) | CN100590827C (ja) |
TW (1) | TW200836270A (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7614540B2 (en) * | 2007-05-04 | 2009-11-10 | Asm Technology Singapore Pte Ltd. | Thermal insulation for a bonding tool |
JP4311582B1 (ja) * | 2008-04-07 | 2009-08-12 | 株式会社アドウェルズ | 共振器の支持装置 |
TWI392039B (zh) * | 2009-05-26 | 2013-04-01 | Adwelds Corp | 共振器之支持裝置 |
JP4759094B1 (ja) * | 2010-12-28 | 2011-08-31 | 株式会社進興製作所 | Xyテーブル |
JP5764408B2 (ja) * | 2011-06-30 | 2015-08-19 | 株式会社ユーシン精機 | 成形品取出機 |
JP5296233B2 (ja) * | 2012-02-07 | 2013-09-25 | 株式会社新川 | ワイヤボンディング装置 |
US9165902B2 (en) | 2013-12-17 | 2015-10-20 | Kulicke And Soffa Industries, Inc. | Methods of operating bonding machines for bonding semiconductor elements, and bonding machines |
CN113020742B (zh) * | 2021-05-28 | 2021-08-17 | 广东阿达智能装备有限公司 | 一种提高焊接精准度的焊线机 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5451475A (en) * | 1977-09-30 | 1979-04-23 | Toshiba Corp | Wire bonding unit |
JPS62150731A (ja) * | 1985-12-24 | 1987-07-04 | Toshiba Corp | ボンデイング装置 |
JPS63261724A (ja) * | 1987-04-20 | 1988-10-28 | Toshiba Corp | ボンデイング面位置検出回路 |
JPH04293668A (ja) * | 1991-03-25 | 1992-10-19 | Mitsubishi Rayon Co Ltd | 強化プラスチック製の台車 |
JP2005129673A (ja) * | 2003-10-23 | 2005-05-19 | Shinkawa Ltd | ボンディング装置 |
JP2005216922A (ja) * | 2004-01-27 | 2005-08-11 | Taiheiyo Cement Corp | ボンディングアーム |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4976392A (en) * | 1989-08-11 | 1990-12-11 | Orthodyne Electronics Corporation | Ultrasonic wire bonder wire formation and cutter system |
JPH0582577A (ja) | 1991-09-20 | 1993-04-02 | Matsushita Electric Ind Co Ltd | ワイヤボンデイング装置 |
TW334622B (en) * | 1996-04-17 | 1998-06-21 | Esec Sa | Apparatus for making wire connections on semiconductor chips |
JP2000164624A (ja) | 1998-11-30 | 2000-06-16 | Sony Corp | ワイヤボンディング装置 |
JP3329312B2 (ja) * | 1999-05-14 | 2002-09-30 | 日本電気株式会社 | 画像表示装置及び画像表示方法 |
JP2000332050A (ja) | 1999-05-24 | 2000-11-30 | Matsushita Electric Ind Co Ltd | ワイヤボンディング装置 |
AU6875000A (en) * | 1999-09-10 | 2001-04-17 | Nikon Corporation | Exposure device with laser device |
JP4282214B2 (ja) * | 2000-08-07 | 2009-06-17 | パナソニック株式会社 | 超音波ホーンの取付方法 |
JP2003197686A (ja) * | 2001-10-18 | 2003-07-11 | Nec Corp | 電子部品実装装置及び電子部品実装方法 |
US6676003B2 (en) * | 2001-12-18 | 2004-01-13 | Kimberly-Clark Worldwide, Inc. | Rigid isolation of rotary ultrasonic horn |
JP3818932B2 (ja) | 2002-03-04 | 2006-09-06 | 株式会社カイジョー | ワイヤボンディング装置 |
JP3666592B2 (ja) * | 2002-05-23 | 2005-06-29 | 株式会社新川 | ボンディング装置 |
JP2004006465A (ja) * | 2002-05-31 | 2004-01-08 | Renesas Technology Corp | 半導体装置の製造方法 |
US7159751B2 (en) * | 2003-06-06 | 2007-01-09 | Esec Trading Sa | Wire bonder |
DE102005044048B4 (de) * | 2004-09-30 | 2007-05-03 | Unaxis International Trading Ltd. | Wire Bonder |
US7377415B2 (en) * | 2005-06-15 | 2008-05-27 | Kulicke And Soffa Industries, Inc. | Bond head link assembly for a wire bonding machine |
US7614540B2 (en) * | 2007-05-04 | 2009-11-10 | Asm Technology Singapore Pte Ltd. | Thermal insulation for a bonding tool |
-
2007
- 2007-02-28 JP JP2007050218A patent/JP4762934B2/ja active Active
- 2007-08-22 TW TW096131001A patent/TW200836270A/zh unknown
- 2007-11-30 KR KR1020070123355A patent/KR101013913B1/ko active IP Right Grant
-
2008
- 2008-02-14 CN CN200810005595A patent/CN100590827C/zh active Active
- 2008-02-26 US US12/072,380 patent/US7780056B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5451475A (en) * | 1977-09-30 | 1979-04-23 | Toshiba Corp | Wire bonding unit |
JPS62150731A (ja) * | 1985-12-24 | 1987-07-04 | Toshiba Corp | ボンデイング装置 |
JPS63261724A (ja) * | 1987-04-20 | 1988-10-28 | Toshiba Corp | ボンデイング面位置検出回路 |
JPH04293668A (ja) * | 1991-03-25 | 1992-10-19 | Mitsubishi Rayon Co Ltd | 強化プラスチック製の台車 |
JP2005129673A (ja) * | 2003-10-23 | 2005-05-19 | Shinkawa Ltd | ボンディング装置 |
JP2005216922A (ja) * | 2004-01-27 | 2005-08-11 | Taiheiyo Cement Corp | ボンディングアーム |
Also Published As
Publication number | Publication date |
---|---|
CN101256974A (zh) | 2008-09-03 |
KR101013913B1 (ko) | 2011-02-14 |
KR20080079984A (ko) | 2008-09-02 |
US20080203136A1 (en) | 2008-08-28 |
TW200836270A (en) | 2008-09-01 |
US7780056B2 (en) | 2010-08-24 |
JP2008218506A (ja) | 2008-09-18 |
CN100590827C (zh) | 2010-02-17 |
TWI343609B (ja) | 2011-06-11 |
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