JP4744972B2 - 建築用硬化性ポリオルガノシロキサン組成物 - Google Patents
建築用硬化性ポリオルガノシロキサン組成物 Download PDFInfo
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- JP4744972B2 JP4744972B2 JP2005222478A JP2005222478A JP4744972B2 JP 4744972 B2 JP4744972 B2 JP 4744972B2 JP 2005222478 A JP2005222478 A JP 2005222478A JP 2005222478 A JP2005222478 A JP 2005222478A JP 4744972 B2 JP4744972 B2 JP 4744972B2
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- 239000000203 mixture Substances 0.000 title claims description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 35
- 238000002156 mixing Methods 0.000 claims description 19
- 239000000377 silicon dioxide Substances 0.000 claims description 17
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 8
- 150000001282 organosilanes Chemical class 0.000 claims description 7
- 230000007062 hydrolysis Effects 0.000 claims description 5
- 238000006460 hydrolysis reaction Methods 0.000 claims description 5
- 239000003566 sealing material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229920005601 base polymer Polymers 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- -1 polysiloxane Polymers 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- NAQQTJZRCYNBRX-UHFFFAOYSA-N n-pentan-3-ylidenehydroxylamine Chemical compound CCC(CC)=NO NAQQTJZRCYNBRX-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WXWYJCSIHQKADM-ZNAKCYKMSA-N (e)-n-[bis[[(e)-butan-2-ylideneamino]oxy]-ethenylsilyl]oxybutan-2-imine Chemical compound CC\C(C)=N\O[Si](O\N=C(/C)CC)(O\N=C(/C)CC)C=C WXWYJCSIHQKADM-ZNAKCYKMSA-N 0.000 description 1
- OGZPYBBKQGPQNU-DABLZPOSSA-N (e)-n-[bis[[(e)-butan-2-ylideneamino]oxy]-methylsilyl]oxybutan-2-imine Chemical compound CC\C(C)=N\O[Si](C)(O\N=C(/C)CC)O\N=C(/C)CC OGZPYBBKQGPQNU-DABLZPOSSA-N 0.000 description 1
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- MMEDJBFVJUFIDD-UHFFFAOYSA-N 2-[2-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=CC=C1CC(O)=O MMEDJBFVJUFIDD-UHFFFAOYSA-N 0.000 description 1
- IHEDBVUTTQXGSJ-UHFFFAOYSA-M 2-[bis(2-oxidoethyl)amino]ethanolate;titanium(4+);hydroxide Chemical compound [OH-].[Ti+4].[O-]CCN(CC[O-])CC[O-] IHEDBVUTTQXGSJ-UHFFFAOYSA-M 0.000 description 1
- KTXWGMUMDPYXNN-UHFFFAOYSA-N 2-ethylhexan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCC(CC)C[O-].CCCCC(CC)C[O-].CCCCC(CC)C[O-].CCCCC(CC)C[O-] KTXWGMUMDPYXNN-UHFFFAOYSA-N 0.000 description 1
- HNUKTDKISXPDPA-UHFFFAOYSA-N 2-oxopropyl Chemical group [CH2]C(C)=O HNUKTDKISXPDPA-UHFFFAOYSA-N 0.000 description 1
- RBLNICCKPGGVJW-UHFFFAOYSA-N C(C)O[Si](O[Sn])(OCC)OCC Chemical compound C(C)O[Si](O[Sn])(OCC)OCC RBLNICCKPGGVJW-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- VXPYSZQGFPMWQU-UHFFFAOYSA-L [acetyloxy(diphenyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.C=1C=CC=CC=1[Sn+2]C1=CC=CC=C1 VXPYSZQGFPMWQU-UHFFFAOYSA-L 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- NBJODVYWAQLZOC-UHFFFAOYSA-L [dibutyl(octanoyloxy)stannyl] octanoate Chemical compound CCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCC NBJODVYWAQLZOC-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- UKRVECBFDMVBPU-UHFFFAOYSA-N ethyl 3-oxoheptanoate Chemical compound CCCCC(=O)CC(=O)OCC UKRVECBFDMVBPU-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- XZZXKVYTWCYOQX-UHFFFAOYSA-J octanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O XZZXKVYTWCYOQX-UHFFFAOYSA-J 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000001367 organochlorosilanes Chemical class 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
が、その効果が十分でないと共に、コスト面、配合された添加物の組成物強度への影響等の点で満足すべきものではなかった。
基本的に(A)一般式:
(B)一般式:
(C)比表面積100〜300m2/gの未処理の微粉末シリカ5〜20重量部、および
(D)硬化用触媒0.01〜5重量部を構成成分とし、
前記(A)成分のポリオルガノシロキサン100重量部のうち95.0〜99.5重量部と(B)成分のオルガノシランおよび/またはその部分加水分解物のみを予め所定の比率で湿気を断った状態で混合し、この混合物に(C)成分の微粉末シリカと(D)成分の硬化用触媒を混合し、次いで(A)、(B)、(C)、(D)成分の混合後8時間以内にこの混合物に前記(A)成分の残り0.5〜5.0重量部および任意成分を所定の比率で配合して得られる艶消し状表面の硬化物を形成する建築用硬化性ポリオルガノシロキサン組成物である。
実施例1〜4
表1に示した配合比(重量部)でベースポリマーと架橋剤(オキシムシラン)を湿気を遮断した混合器に投入し、この状態で混合して均一にした。
実施例5
後配合のタイミングを4.0時間後に変更した以外は実施例1と同様にして組成物を得た。
比較例1
後配合のベースポリマーの投入がないこと以外は実施例1と同様にして組成物を得て評価した。
比較例2
後配合のタイミングを10.0時間後に変更した以外は実施例1と同様にして組成物を得て評価した。
比較例3
微粉末シリカとしてオクタメチルシクロテトラシロキサンで表面処理した処理粉末を用いた以外は実施例1と同様にして組成物を得て評価した。
Claims (1)
- 基本的に(A)一般式:
(B)一般式:
(C)比表面積100〜300m2/gの未処理の微粉末シリカ5〜20重量部、および
(D)硬化用触媒0.01〜5重量部を構成成分とし、
前記(A)成分のポリオルガノシロキサン100重量部のうち95.0〜99.5重量部と(B)成分のオルガノシランおよび/またはその部分加水分解縮合物のみを湿気を断った状態で混合し、この混合物に(C)成分の微粉末シリカと(D)成分の硬化用触媒を湿気を断った状態で混合し、次いで(A)、(B)、(C)、(D)成分の混合後8時間以内にこの混合物に前記(A)成分の残り0.5〜5.0重量部および任意成分を湿気を断った状態で混合して得られる艶消し状表面の硬化物を形成する建築用硬化性ポリオルガノシロキサン組成物。
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JP2005222478A JP4744972B2 (ja) | 2005-08-01 | 2005-08-01 | 建築用硬化性ポリオルガノシロキサン組成物 |
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JP2005222478A JP4744972B2 (ja) | 2005-08-01 | 2005-08-01 | 建築用硬化性ポリオルガノシロキサン組成物 |
Publications (2)
Publication Number | Publication Date |
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JP2007039485A JP2007039485A (ja) | 2007-02-15 |
JP4744972B2 true JP4744972B2 (ja) | 2011-08-10 |
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JP2005222478A Expired - Fee Related JP4744972B2 (ja) | 2005-08-01 | 2005-08-01 | 建築用硬化性ポリオルガノシロキサン組成物 |
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JP (1) | JP4744972B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0718320D0 (en) * | 2007-09-20 | 2007-10-31 | Tyco Electronics Ltd Uk | Product and method for wire seal |
JP5284631B2 (ja) * | 2007-12-11 | 2013-09-11 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 室温硬化性ポリオルガノシロキサン組成物 |
JP2015113377A (ja) * | 2013-12-10 | 2015-06-22 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物の製造方法、シーリング材及び物品 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04353565A (ja) * | 1991-05-31 | 1992-12-08 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物の製造方法 |
JPH06157910A (ja) * | 1992-11-27 | 1994-06-07 | Toray Dow Corning Silicone Co Ltd | 室温硬化性ポリオルガノシロキサン組成物 |
JPH06322315A (ja) * | 1993-03-30 | 1994-11-22 | Dow Corning Corp | 塗装したシリコーンエラストマーの形成方法 |
JPH07188560A (ja) * | 1993-12-27 | 1995-07-25 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
JPH08208991A (ja) * | 1995-11-17 | 1996-08-13 | Toshiba Silicone Co Ltd | 垂れ落ち性を改良した室温硬化性ポリオルガノシロキサン組成物の製造方法 |
JP2000086896A (ja) * | 1998-09-10 | 2000-03-28 | Dow Corning Toray Silicone Co Ltd | 硬化性シリコーン組成物 |
JP2000114600A (ja) * | 1998-10-01 | 2000-04-21 | Dow Corning Toray Silicone Co Ltd | Led表示装置 |
JP2000129128A (ja) * | 1998-10-23 | 2000-05-09 | Dow Corning Toray Silicone Co Ltd | 硬化性シリコーン組成物 |
JP2000129240A (ja) * | 1998-10-23 | 2000-05-09 | Dow Corning Toray Silicone Co Ltd | 表示装置用充填・接着剤 |
JP2000169711A (ja) * | 1998-12-11 | 2000-06-20 | Ge Toshiba Silicones Co Ltd | 建築用硬化性ポリシロキサン組成物 |
JP2002194216A (ja) * | 2000-12-26 | 2002-07-10 | Ge Toshiba Silicones Co Ltd | 室温硬化性ポリオルガノシロキサン組成物の製造方法 |
-
2005
- 2005-08-01 JP JP2005222478A patent/JP4744972B2/ja not_active Expired - Fee Related
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04353565A (ja) * | 1991-05-31 | 1992-12-08 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物の製造方法 |
JPH06157910A (ja) * | 1992-11-27 | 1994-06-07 | Toray Dow Corning Silicone Co Ltd | 室温硬化性ポリオルガノシロキサン組成物 |
JPH06322315A (ja) * | 1993-03-30 | 1994-11-22 | Dow Corning Corp | 塗装したシリコーンエラストマーの形成方法 |
JPH07188560A (ja) * | 1993-12-27 | 1995-07-25 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
JPH08208991A (ja) * | 1995-11-17 | 1996-08-13 | Toshiba Silicone Co Ltd | 垂れ落ち性を改良した室温硬化性ポリオルガノシロキサン組成物の製造方法 |
JP2000086896A (ja) * | 1998-09-10 | 2000-03-28 | Dow Corning Toray Silicone Co Ltd | 硬化性シリコーン組成物 |
JP2000114600A (ja) * | 1998-10-01 | 2000-04-21 | Dow Corning Toray Silicone Co Ltd | Led表示装置 |
JP2000129128A (ja) * | 1998-10-23 | 2000-05-09 | Dow Corning Toray Silicone Co Ltd | 硬化性シリコーン組成物 |
JP2000129240A (ja) * | 1998-10-23 | 2000-05-09 | Dow Corning Toray Silicone Co Ltd | 表示装置用充填・接着剤 |
JP2000169711A (ja) * | 1998-12-11 | 2000-06-20 | Ge Toshiba Silicones Co Ltd | 建築用硬化性ポリシロキサン組成物 |
JP2002194216A (ja) * | 2000-12-26 | 2002-07-10 | Ge Toshiba Silicones Co Ltd | 室温硬化性ポリオルガノシロキサン組成物の製造方法 |
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