JP4735565B2 - Component mounting apparatus and component mounting method - Google Patents

Component mounting apparatus and component mounting method Download PDF

Info

Publication number
JP4735565B2
JP4735565B2 JP2007034817A JP2007034817A JP4735565B2 JP 4735565 B2 JP4735565 B2 JP 4735565B2 JP 2007034817 A JP2007034817 A JP 2007034817A JP 2007034817 A JP2007034817 A JP 2007034817A JP 4735565 B2 JP4735565 B2 JP 4735565B2
Authority
JP
Japan
Prior art keywords
component
mounting
substrate
storage unit
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007034817A
Other languages
Japanese (ja)
Other versions
JP2008198927A (en
Inventor
敬太 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2007034817A priority Critical patent/JP4735565B2/en
Publication of JP2008198927A publication Critical patent/JP2008198927A/en
Application granted granted Critical
Publication of JP4735565B2 publication Critical patent/JP4735565B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

本発明は、部品実装装置および部品実装方法に関するものである。   The present invention relates to a component mounting apparatus and a component mounting method.

半導体チップや抵抗等の部品の種類によっては、部品とプリント配線基板（以下、基板という。）の接合部にクリーム半田やフラックスを必要とするものがある。このような部品にあっては、従来、クリーム半田やフラックスを薄膜状に貯留した転写面にノズルでピックアップした部品を接地させ、接合端子に適量のクリーム半田やフラックスを転写した後に基板に実装する方法が用いられている（特許文献１参照）。
特開２０００−１８８４９８号公報 Some types of components such as semiconductor chips and resistors require cream solder or flux at the joint between the component and a printed wiring board (hereinafter referred to as a substrate). For such parts, conventionally, a part picked up by a nozzle is grounded to a transfer surface in which cream solder or flux is stored in a thin film shape, and an appropriate amount of cream solder or flux is transferred to a joining terminal and then mounted on a substrate. The method is used (refer patent document 1).
JP 2000-188498 A

近年、限られた基板面積により多くの部品を実装する高密度実装が要求されており、３次元方向に実装密度を高めるスタック実装が広く行われるようになってきている。従来のスタック実装においては、基板保持部に保持された基板に一段ずつ部品を積み上げていく手法がとられており、基板に部品を一段実装する度に実装ヘッドが部品収納部と基板の間を往復移動する必要があった。この往復移動はスタック実装される部品の段数に相当する回数だけ行われるため、段数が増える毎に実装ヘッドの移動距離が伸びることになっていた。また、実装ヘッドの移動距離が伸びると１つの基板にスタック実装を終えるまでに要する時間が長くなり、実装装置の一定面積を占有する基板保持部に１つの基板が長時間停滞するため、面積生産性が低下するという問題を招来していた。   In recent years, high-density mounting for mounting many components on a limited board area has been demanded, and stack mounting for increasing the mounting density in a three-dimensional direction has been widely performed. In conventional stack mounting, a method is used in which components are stacked one by one on the substrate held by the substrate holding unit, and the mounting head moves between the component storage unit and the substrate every time one component is mounted on the substrate. It was necessary to move back and forth. Since this reciprocating movement is performed a number of times corresponding to the number of stages of the components to be stacked, the moving distance of the mounting head is increased as the number of stages is increased. In addition, as the movement distance of the mounting head increases, the time required to finish stack mounting on one substrate becomes longer, and one substrate stagnates for a long time in the substrate holding part that occupies a certain area of the mounting device. The problem of the decline of sex was invited.

そこで本発明は、面積生産性を向上させる部品実装装置および部品実装方法を提供することを目的とする。   Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method that improve area productivity.

請求項１記載の部品実装装置は、第１の部品を複数収納するパーツフィーダから成る第１収納部と、第２の部品を平面状に複数収納したトレイを複数段格納したマガジンから成る第２収納部と、第１の部品に半田若しくはフラックスを転写する転写部と、第１収納部と第２収納部と転写部を含む範囲で移動し、第１の部品を第２の部品に実装する実装ヘッドを備え、転写部にて半田若しくはフラックスが転写された第１の部品を第２収納部であるマガジンの最上段に順に移送されたトレイに収納された状態の第２の部品に実装する。 The component mounting apparatus according to claim 1 is a second storage unit including a first storage unit including a parts feeder that stores a plurality of first components, and a magazine that stores a plurality of trays storing a plurality of second components in a planar shape . The storage unit, the transfer unit that transfers solder or flux to the first component, the first storage unit, the second storage unit, and the transfer unit are moved in a range including the first component and the first component is mounted on the second component. comprising a mounting head, the solder or flux at the transfer unit is mounted on the second part in a state of being accommodated in the tray that is transferred in sequence to the top of the magazine is a second housing portion a first component that has been transferred .

請求項２記載の部品実装方法は、パーツフィーダから成る第１収納部に収納された第１の部品を実装ヘッドによりピックアップする工程と、ピックアップされた第１の部品に転写部にて半田若しくはフラックスを転写する工程と、半田若しくはフラックスが転写された第１の部品をマガジンから成る第２収納部の最上段に順に移送されたて第２の部品を平面状に収納したトレイに収納された状態の第２の部品に実装する工程を含む。 The component mounting method according to claim 2 includes a step of picking up a first component housed in a first housing portion comprising a parts feeder by a mounting head, and a solder or flux at the transfer portion to the picked up first component. And a state in which the first component to which the solder or flux is transferred is sequentially transferred to the uppermost stage of the second storage unit made of a magazine and is stored in a tray that stores the second component in a flat shape. Mounting on the second component.

本発明によれば、第１収納部に収納された第１の部品を第２収納部であるマガジンの最上段に順に移送されたトレイに収納された状態の第２の部品に直接実装することで、実装を行うための領域が不要になり面積生産性が向上する。 According to the present invention, the first component stored in the first storage unit is directly mounted on the second component stored in the tray that is sequentially transferred to the uppermost stage of the magazine as the second storage unit. Thus, the area for mounting is not required, and the area productivity is improved.

本発明の実施の形態について図面を参照して説明する。図１は本発明の実施の形態の部品実装装置の構成を示す斜視図、図２は本発明の実施の形態の部品実装装置における実装方法を示す斜視図、図３は本発明の実施の形態の部品実装装置における実装方法を示す斜視図である。   Embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view showing the configuration of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing a mounting method in the component mounting apparatus according to the embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. It is a perspective view which shows the mounting method in the component mounting apparatus.

最初に部品実装装置の構成について説明する。図１において、部品実装装置は、基板１を保持する基板保持部２と、第１の部品３を複数収納する第１収納部４と、第２の部品５を複数収納する第２収納部６と、第１の部品３と第２の部品５の接続端子に半田若しくはフラックスを転写する転写部７と、基板保持部２と第１収納部４と第２収納部６と転写部７を含む範囲で移動する実装ヘッド８とで構成されており、基板１に第１の部品３と第２の部品５をスタック実装する装置である。   First, the configuration of the component mounting apparatus will be described. In FIG. 1, the component mounting apparatus includes a substrate holding unit 2 that holds a substrate 1, a first storage unit 4 that stores a plurality of first components 3, and a second storage unit 6 that stores a plurality of second components 5. A transfer unit 7 that transfers solder or flux to the connection terminals of the first component 3 and the second component 5, a substrate holding unit 2, a first storage unit 4, a second storage unit 6, and a transfer unit 7. The apparatus includes a mounting head 8 that moves within a range, and is a device that stacks the first component 3 and the second component 5 on the substrate 1.

基板保持部２は基板１の両端部を支持した状態で一方向に搬送するとともに所定の位置で一時的に固定して基板１を保持する機能を備えている。第１収納部４はテープフィーダやバルクフィーダ等のパーツフィーダで構成され、第１の部品３を複数個収納している。第２収納部６は第１収納部４に隣接して配置され、第１の部品３より外形が大きい第２の部品５を互いに重ならない平面状に複数個収納したトレイ６ａ、６ｂ、６ｃを複数段格納したマガジンで構成されている。トレイ６ａ、６ｂ、６ｃは順に最上段に移送され、最上段にあるトレイ６ａに収納された全ての第２の部品５が基板１に実装されると、代わって下段のトレイ６ｂが最上段に移送される。   The substrate holding unit 2 has a function of holding the substrate 1 while being transported in one direction while supporting both ends of the substrate 1 and temporarily fixed at a predetermined position. The first storage unit 4 is constituted by a parts feeder such as a tape feeder or a bulk feeder, and stores a plurality of first parts 3. The second storage unit 6 is disposed adjacent to the first storage unit 4 and includes trays 6a, 6b, and 6c that store a plurality of second components 5 having an outer shape larger than that of the first component 3 in a planar shape so as not to overlap each other. It consists of a magazine that stores multiple levels. The trays 6a, 6b, 6c are sequentially transferred to the uppermost stage, and when all the second components 5 housed in the uppermost tray 6a are mounted on the substrate 1, the lower tray 6b is placed on the uppermost stage instead. Be transported.

転写部７は第１収納部４および第２収納部６と基板保持部２の間に配置され、フラックスやクリーム状の半田等の溶剤を上部に貯留している。実装ヘッド８は第１の部品３および第２の部品５を吸装着するノズル８ａを備え、基板保持部２と第１収納部４と第２収納部６と転写部７を含む範囲の上方で水平移動可能に構成されている。ノズル８ａは実装ヘッド８から下方に向けて装着され、実装ヘッド８に対して相対的な昇降が可能に構成されている。第１収納部４、第２収納部６の上方でノズル８ａを昇降させることで第１の部品３、第２の部品５のピックアップを行い、所定の実装位置の上方でノズル８ａを昇降させることで第１の部品３、第２の部品５の実装を行う。また、転写部７の上方で第１の部品３をピックアップしたノズル８ａを昇降させることで第１の部品３の接続端子に溶剤を転写することができる。   The transfer unit 7 is disposed between the first storage unit 4 and the second storage unit 6 and the substrate holding unit 2 and stores a solvent such as flux or cream-like solder in the upper part. The mounting head 8 includes a nozzle 8 a for sucking and mounting the first component 3 and the second component 5, and above the range including the substrate holding unit 2, the first storage unit 4, the second storage unit 6, and the transfer unit 7. It is configured to be horizontally movable. The nozzle 8a is mounted downward from the mounting head 8, and is configured to be able to move up and down relative to the mounting head 8. The first part 3 and the second part 5 are picked up by moving the nozzle 8a up and down above the first storage part 4 and the second storage part 6, and the nozzle 8a is moved up and down above a predetermined mounting position. Then, the first component 3 and the second component 5 are mounted. Further, the solvent can be transferred to the connection terminal of the first component 3 by moving the nozzle 8 a picking up the first component 3 above and below the transfer portion 7.

実装ヘッド８には、鉛直下方を撮像する撮像手段であるカメラ９が装着されている。実装ヘッド８は、カメラ９により撮像された基板１、第１の部品３、第２の部品５の画像解析結果に基づいて位置制御され、第１の部品３を第２の部品５の所定の実装位置に正確に実装するとともに、第２の部品５を基板１の所定の実装位置に正確に実装する。   The mounting head 8 is equipped with a camera 9 which is an image pickup means for picking up an image in the vertically downward direction. The mounting head 8 is position-controlled based on the image analysis results of the substrate 1, the first component 3, and the second component 5 captured by the camera 9, and the first component 3 is a predetermined component of the second component 5. The second component 5 is accurately mounted at a predetermined mounting position on the substrate 1 while being accurately mounted at the mounting position.

次に、部品実装装置における部品実装方法について説明する。第１の部品３と第２の部品５はリフロー工程における半田接合により両接合端子同士が接合されるため、第１の部品３を第２の部品５の上部にスタック実装する際に荷重を加える必要はなく、位置ずれしない程度に搭載されていればよい。そのため、基板１に既に実装された第２の部品５ではなく、耐荷重性のないトレイ６ａ、６ｂ、６ｃに収納した状態の第２の部品５に第１の部品３を直接搭載するこが可能である。従って部品実装においては、図２において、まず第１収納部４からピックアップした第１の部品３を転写部７に移送し（矢印ａ参照）、接続
端子に溶剤を転写させた第１の部品３を第２収納部６に移送し（矢印ｂ参照）、トレイ６ａ、６ｂ、６ｃに収納された状態の第２の部品５に実装する。第２の部品５に複数の第１の部品３を実装する必要があるときは、全ての第１の部品３の実装が完了した段階で既に実装された第１の部品３とともにピックアップした第２の部品５を基板保持部に移送し（矢印ｃ参照）、基板１に実装する。 Next, a component mounting method in the component mounting apparatus will be described. Since both joint terminals of the first component 3 and the second component 5 are joined to each other by solder joining in the reflow process, a load is applied when the first component 3 is stacked on the upper part of the second component 5. It is not necessary, and it only needs to be mounted so as not to be displaced. Therefore, the first component 3 can be directly mounted not on the second component 5 already mounted on the substrate 1 but on the second component 5 stored in the trays 6a, 6b, 6c having no load resistance. Is possible. Therefore, in the component mounting, in FIG. 2, first the first component 3 picked up from the first storage portion 4 is first transferred to the transfer portion 7 (see arrow a), and the first component 3 having the solvent transferred to the connection terminal is transferred. Is transferred to the second storage section 6 (see arrow b) and mounted on the second component 5 stored in the trays 6a, 6b, 6c. When it is necessary to mount a plurality of first components 3 on the second component 5, the second components picked up together with the already mounted first components 3 when all the first components 3 have been mounted. The component 5 is transferred to the substrate holder (see arrow c) and mounted on the substrate 1.

従来のスタック実装では、最初に第２の部品５を基板１に実装した後に全ての第１の部品３を基板１に実装された状態の第２の部品５に実装していたため、実装ヘッド８はスタック実装の段数および第１の部品３の実装点数に相当する回数だけ第１収納部４と基板保持部２の間を往復移動する必要があった。これに対し、上記の順序でスタック実装を行う場合、実装ヘッド８は、第１収納部４、転写部７、第２収納部６の順に移動し、トレイ６ａ、６ｂ、６ｃに収納された状態の第２の部品５に全ての第１の部品３をスタック実装した後、基板保持部２に移動し、既に実装された第１の部品３とともに第２の部品５を基板１に実装するため、同じ段数のスタック実装を行うために要する実装ヘッド８の移動距離を従来のそれに比べ短縮できるという利点がある。これによりスタック実装における実装タクトが短縮され、生産効率が向上する。   In the conventional stack mounting, since the second component 5 is first mounted on the substrate 1 and then all the first components 3 are mounted on the second component 5 mounted on the substrate 1, the mounting head 8 Required to reciprocate between the first storage unit 4 and the board holding unit 2 by the number of times corresponding to the number of stack mounting stages and the number of mounting points of the first component 3. On the other hand, when stack mounting is performed in the above order, the mounting head 8 moves in the order of the first storage unit 4, the transfer unit 7, and the second storage unit 6 and is stored in the trays 6a, 6b, and 6c. In order to stack all the first components 3 on the second components 5, move to the substrate holding unit 2, and mount the second components 5 on the substrate 1 together with the already mounted first components 3. There is an advantage that the moving distance of the mounting head 8 required for stack mounting with the same number of stages can be shortened compared to the conventional method. As a result, the mounting tact time in stack mounting is shortened and the production efficiency is improved.

本実施の形態では基板１に第１の部品３と第２の部品５を２段にスタック実装する場合を例に説明を行っているが、本発明はさらに複数段のスタック実装を行う場合にも適用することが可能である。例えば、第１の部品３の上部にさらに小型の第３の部品を実装する場合、第３の部品を複数個収納する第３収納部を第１収納部４、第２収納部６の並びに配置し、トレイ６ａ、６ｂ、６ｃに収納された状態の第２の部品５に既に実装された第１の部品３にさらに第３の部品を実装し、第２の部品５は全ての第１の部品３および第３の部品が実装された後に基板１に実装される。   In this embodiment, the case where the first component 3 and the second component 5 are stacked and mounted in two stages on the substrate 1 is described as an example. Can also be applied. For example, when a further small third component is mounted on the upper part of the first component 3, the third storage portion for storing a plurality of third components is arranged in a sequence of the first storage portion 4 and the second storage portion 6. The third component is further mounted on the first component 3 already mounted on the second component 5 in the state of being accommodated in the trays 6a, 6b, and 6c. The component 3 and the third component are mounted on the substrate 1 after being mounted.

なお、上述した部品実装装置では、図３に示すように第２の部品を小型基板１０に代えることで基板保持部２を使用せずに第１の部品３の実装を行うことが可能である。従来、小型基板を取り扱う場合、複数個を平面状に連結させた多面取り基板として取り扱うことが多く、基板保持部２に保持された多面取り基板に部品を実装した後に個別の小型基板に分割している。しかし、実装ヘッド８が第１収納部４と基板保持部２の間を何度も往復する必要が生じるため実装タクトの面で不利であり、また、結果として基板保持部２に多面取り基板が長時間停滞することになるため、部品実装装置の一定面積を占有する基板保持部２を有効活用することができず、面積生産性の面でも不利となっていた。   In the component mounting apparatus described above, it is possible to mount the first component 3 without using the substrate holder 2 by replacing the second component with the small substrate 10 as shown in FIG. . Conventionally, when handling a small board, it is often handled as a multi-sided board in which a plurality of boards are connected in a plane, and after mounting components on the multi-sided board held by the board holding part 2, it is divided into individual small boards. ing. However, it is disadvantageous in terms of mounting tact because the mounting head 8 needs to reciprocate between the first storage portion 4 and the substrate holding portion 2 many times. As a result, the substrate holding portion 2 has a multi-chamfered substrate. Since it will be stagnant for a long time, the board | substrate holding | maintenance part 2 which occupies the fixed area of a component mounting apparatus cannot be used effectively, but it was disadvantageous also in terms of area productivity.

これに対し、トレイ６ａ、６ｂ、６ｃに収納された状態の小型基板１０に第１の部品３を直接実装すると（矢印ｄ、ｅ参照）、実装ヘッド８の移動距離が短縮されるので生産効率が向上し、基板保持部２には他の基板の保持に使用することができるので面積生産性の向上が期待できる。   On the other hand, when the first component 3 is directly mounted on the small substrate 10 stored in the trays 6a, 6b, and 6c (see arrows d and e), the moving distance of the mounting head 8 is shortened, so that the production efficiency is improved. And the substrate holding part 2 can be used for holding other substrates, so that the area productivity can be improved.

本発明によれば、第１収納部に収納された第１の部品を第２収納部であるマガジンの最上段に順に移送されたトレイに収納された状態の第２の部品に直接実装することで、実装を行うための領域が不要になり面積生産性が向上するという利点を有し、小型基板に微小部品を実装する分野において特に有用である。 According to the present invention, the first component stored in the first storage unit is directly mounted on the second component stored in the tray that is sequentially transferred to the uppermost stage of the magazine as the second storage unit. Thus, there is an advantage that the area for mounting is not required and the area productivity is improved, and this is particularly useful in the field of mounting micro components on a small substrate.

本発明の実施の形態の部品実装装置の構成を示す斜視図The perspective view which shows the structure of the component mounting apparatus of embodiment of this invention 本発明の実施の形態の部品実装装置における実装方法を示す斜視図The perspective view which shows the mounting method in the component mounting apparatus of embodiment of this invention 本発明の実施の形態の部品実装装置における実装方法を示す斜視図The perspective view which shows the mounting method in the component mounting apparatus of embodiment of this invention

符号の説明Explanation of symbols

３ 第１の部品
４ 第１収納部
５ 第２の部品
６ 第２収納部
７ 転写部
８ 実装ヘッド 3 First part 4 First storage part 5 Second part 6 Second storage part 7 Transfer part 8 Mounting head

Claims (2)

第１の部品を複数収納するパーツフィーダから成る第１収納部と、第２の部品を平面状に複数収納したトレイを複数段格納したマガジンから成る第２収納部と、第１の部品に半田若しくはフラックスを転写する転写部と、第１収納部と第２収納部と転写部を含む範囲で移動し、第１の部品を第２の部品に実装する実装ヘッドを備え、
転写部にて半田若しくはフラックスが転写された第１の部品を第２収納部であるマガジンの最上段に順に移送されたトレイに収納された状態の第２の部品に実装する部品実装装置。 A first storage portion comprising a parts feeder for storing a plurality of first components; a second storage portion comprising a magazine storing a plurality of trays storing a plurality of second components in a planar shape; and soldering the first components Alternatively, a transfer unit that transfers the flux, and a mounting head that moves within a range including the first storage unit, the second storage unit, and the transfer unit, and mounts the first component on the second component,
Component mounting apparatus for mounting the second part of the state of the solder or flux at the transfer unit is accommodated in the tray that is transferred in sequence to the top of the magazine is a first component second housing portion has been transferred. パーツフィーダから成る第１収納部に収納された第１の部品を実装ヘッドによりピックアップする工程と、ピックアップされた第１の部品に転写部にて半田若しくはフラックスを転写する工程と、半田若しくはフラックスが転写された第１の部品をマガジンから成る第２収納部の最上段に順に移送されて第２の部品を平面上に収納したトレイに収納された状態の第２の部品に実装する工程を含む部品実装方法。 A step of picking up a first component housed in a first housing portion comprising a parts feeder by a mounting head, a step of transferring solder or flux to the picked up first component by a transfer portion , and solder or flux And transferring the transferred first part to the uppermost stage of the second storage unit composed of a magazine and mounting the second part on the second part stored in a tray stored on a flat surface. Component mounting method.
JP2007034817A 2007-02-15 2007-02-15 Component mounting apparatus and component mounting method Active JP4735565B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007034817A JP4735565B2 (en) 2007-02-15 2007-02-15 Component mounting apparatus and component mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007034817A JP4735565B2 (en) 2007-02-15 2007-02-15 Component mounting apparatus and component mounting method

Publications (2)

Publication Number Publication Date
JP2008198927A JP2008198927A (en) 2008-08-28
JP4735565B2 true JP4735565B2 (en) 2011-07-27

Family

ID=39757582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007034817A Active JP4735565B2 (en) 2007-02-15 2007-02-15 Component mounting apparatus and component mounting method

Country Status (1)

Country Link
JP (1) JP4735565B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6549710B2 (en) * 2015-05-29 2019-07-24 株式会社Ｆｕｊｉ Component mounting device and component mounting method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004288796A (en) * 2003-03-20 2004-10-14 Matsushita Electric Ind Co Ltd Equipment and method for mounting component
JP2005175263A (en) * 2003-12-12 2005-06-30 Seiko Epson Corp Semiconductor device, manufacturing method therefor, and electronic equipment
WO2005112535A1 (en) * 2004-05-13 2005-11-24 Matsushita Electric Industrial Co., Ltd. Plate storing body for supplying component and component supplying apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004288796A (en) * 2003-03-20 2004-10-14 Matsushita Electric Ind Co Ltd Equipment and method for mounting component
JP2005175263A (en) * 2003-12-12 2005-06-30 Seiko Epson Corp Semiconductor device, manufacturing method therefor, and electronic equipment
WO2005112535A1 (en) * 2004-05-13 2005-11-24 Matsushita Electric Industrial Co., Ltd. Plate storing body for supplying component and component supplying apparatus

Also Published As

Publication number Publication date
JP2008198927A (en) 2008-08-28

Similar Documents

Publication Publication Date Title
EP1943833B1 (en) Wafer based camera module and method of manufacture
JP6250999B2 (en) Alignment method and alignment apparatus
US7163137B2 (en) Method of manufacturing mounting boards
JP4801558B2 (en) Mounting machine and component imaging method thereof
JP4735564B2 (en) Component mounting apparatus and component mounting method
JP4735565B2 (en) Component mounting apparatus and component mounting method
JP2004363546A (en) Automatic electronic component mounting unit, electronic component feeding units, electronic component sequencer unit, and electronic component mounting method
JP6571176B2 (en) Component mounter and component supply method for component mounter
JP2003318599A (en) Method and system for mounting component
JP2017034153A (en) Component mounting device
US20100165590A1 (en) Electronic device, electronic component, and method of manufacturing electronic device
JP6796363B2 (en) Parts mounting machine
JPH0997973A (en) Carrier and manufacture of electronic component as well as mounting method for electronic component
JP4715726B2 (en) Electronic component mounting method
US20180174871A1 (en) Bonding apparatus
US11330751B2 (en) Board work machine
JP2010182983A (en) Component mounting device, and component mounting method
JP4914326B2 (en) Board production line, board production management device and surface mounter
JP4537943B2 (en) Display device assembling apparatus and assembling method
JP2002026592A (en) Mounting device and mounting method for electronic part
JP7105350B2 (en) suction nozzle
JP6632877B2 (en) Component mounting equipment
KR101577026B1 (en) Assembly and transfer apparatus of substrate zig for solder reflow
KR20200123182A (en) Mounting device
JP6855113B2 (en) Parts data conversion support device, parts data conversion support method, parts data conversion support program, recording medium

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090223

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20091127

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110118

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110304

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110329

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110411

R151 Written notification of patent or utility model registration

Ref document number: 4735565

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140513

Year of fee payment: 3