JP4735528B2 - 車載用の電子機器の冷却構造 - Google Patents
車載用の電子機器の冷却構造 Download PDFInfo
- Publication number
- JP4735528B2 JP4735528B2 JP2006344502A JP2006344502A JP4735528B2 JP 4735528 B2 JP4735528 B2 JP 4735528B2 JP 2006344502 A JP2006344502 A JP 2006344502A JP 2006344502 A JP2006344502 A JP 2006344502A JP 4735528 B2 JP4735528 B2 JP 4735528B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- substrate
- heat
- heat spreader
- cooling structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (5)
- 上面に発熱性部品及びその周辺の部品が実装された基板の上部に、前記発熱性部品と熱的に接続されたヒートスプレッダを備えると共に、前記ヒートスプレッダを冷却するためのファン装置を備えてなる車載用の電子機器の冷却構造であって、
前記ヒートスプレッダに、前記基板の上面側に向けて延びる複数本の冷却用フィンが一体に形成されていることにより、該基板上面との間に通風路が形成されていると共に、
前記ファン装置は、吸気口から排気口に向けて前記通風路内に冷却風を流すように構成されており、
更に、前記ヒートスプレッダの外縁部には、前記吸気口及び排気口部分を除いて、前記基板の上面側に向けて延び、前記通風路内を通る冷却風の漏れを防止するための遮蔽壁が一体に設けられ、その遮蔽壁の下端部と前記基板上面との間に一定のクリアランス(C1)が形成されることを特徴とする車載用の電子機器の冷却構造。 - 前記冷却用フィンの下端部は、前記基板上に実装されている部品の高さに応じて、前記クリアランス(C1)よりも大きい所定のクリアランス(C2)を確保するように段差を有して設けられていることを特徴とする請求項1記載の車載用の電子機器の冷却構造。
- 前記吸気口の近傍には、前記冷却用フィンを配置しない圧力室が設けられ、その圧力室から複数の通風路に対して冷却風が配分されるように構成されていることを特徴とする請求項1または2記載の車載用の電子機器の冷却構造。
- 前記発熱性部品の周囲には、前記冷却用フィンを配置しない空間部が形成され、その空間部内を冷却風が流れるように構成されていることを特徴とする請求項1ないし3のいずれかに記載の車載用の電子機器の冷却構造。
- 前記ヒートスプレッダには、下方に凸となり、前記発熱性部品に熱的に接触する接触部が一体に形成されており、その接触部は、円柱状に形成されていることを特徴とする請求項1ないし4のいずれかに記載の車載用の電子機器の冷却構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006344502A JP4735528B2 (ja) | 2006-12-21 | 2006-12-21 | 車載用の電子機器の冷却構造 |
DE102007058706A DE102007058706B4 (de) | 2006-12-21 | 2007-12-06 | Kühlanordnung und die Kühlanordnung aufweisendes elektrisches Gerät |
US12/000,207 US7606027B2 (en) | 2006-12-21 | 2007-12-11 | Electronic apparatus cooling structure |
CN2007101597096A CN101208003B (zh) | 2006-12-21 | 2007-12-20 | 电子设备冷却结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006344502A JP4735528B2 (ja) | 2006-12-21 | 2006-12-21 | 車載用の電子機器の冷却構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008159688A JP2008159688A (ja) | 2008-07-10 |
JP4735528B2 true JP4735528B2 (ja) | 2011-07-27 |
Family
ID=39465956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006344502A Expired - Fee Related JP4735528B2 (ja) | 2006-12-21 | 2006-12-21 | 車載用の電子機器の冷却構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7606027B2 (ja) |
JP (1) | JP4735528B2 (ja) |
CN (1) | CN101208003B (ja) |
DE (1) | DE102007058706B4 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11711909B2 (en) | 2017-03-16 | 2023-07-25 | Kioxia Corporation | Electronic device |
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US7800904B2 (en) * | 2008-01-15 | 2010-09-21 | Mcgough William L | Electronic assembly and heat sink |
DE202008003516U1 (de) * | 2008-03-12 | 2008-07-03 | Nft Nanofiltertechnik Gmbh | Kühlgerät für elektronische Bauelemente |
US7778033B2 (en) * | 2008-10-30 | 2010-08-17 | Astec International Limited | Thermally conductive covers for electric circuit assemblies |
US8576565B2 (en) * | 2009-08-18 | 2013-11-05 | Panasonic Corporation | Electronic device cooling structure |
JP5299205B2 (ja) * | 2009-10-01 | 2013-09-25 | 株式会社デンソー | 電子装置およびその冷却装置 |
US20110108250A1 (en) * | 2009-11-09 | 2011-05-12 | Alex Horng | Heat Dissipating device |
JP5347931B2 (ja) * | 2009-12-07 | 2013-11-20 | パナソニック株式会社 | 放熱ユニットおよびこれを用いた電子機器 |
CO6140027A1 (es) * | 2010-01-28 | 2010-03-19 | Jairo Botia | Sistema de cajoneras para productos farmaceuticos y medico-quirurgicos que incorpora dispositivos publicitarios dinamicos |
US8189331B2 (en) * | 2010-05-25 | 2012-05-29 | Hewlett-Packard Development Company, L.P. | Thermal management systems and methods |
US8936072B2 (en) * | 2010-06-11 | 2015-01-20 | Hewlett-Packard Development Company, L.P. | Thermal distribution systems and methods |
JP5295202B2 (ja) * | 2010-11-08 | 2013-09-18 | フリージア・マクロス株式会社 | 放熱構造 |
US20120292005A1 (en) * | 2011-05-19 | 2012-11-22 | Laird Technologies, Inc. | Thermal interface materials and methods for processing the same |
US20130027885A1 (en) * | 2011-07-25 | 2013-01-31 | International Business Machines Corporation | Heat spreader for multi-chip modules |
DE102012013741A1 (de) | 2011-08-02 | 2013-02-28 | Sew-Eurodrive Gmbh & Co. Kg | Anordnung zum Kühlen, Elektrogerät und Verwendung einer Anordnung zum Kühlen |
WO2013092535A1 (en) | 2011-12-21 | 2013-06-27 | Tyst Design Ved Iver Munk | A heat bus |
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KR101388845B1 (ko) * | 2012-07-10 | 2014-04-23 | 삼성전기주식회사 | 다단 히트 싱크를 구비한 냉각 시스템 및 그 제어방법 |
US9773718B2 (en) * | 2013-08-07 | 2017-09-26 | Oracle International Corporation | Winged heat sink |
DE102014211959A1 (de) * | 2014-06-23 | 2015-12-24 | Volkswagen Aktiengesellschaft | Vorrichtung zum Herstellen eines Druckausgleichs und zum Verhindern eines Eindringens von Luftfeuchtigkeit für ein System-Gehäuse |
US11744041B2 (en) | 2014-06-24 | 2023-08-29 | David Lane Smith | System and method for fluid cooling of electronic devices installed in an enclosure |
US11191186B2 (en) | 2014-06-24 | 2021-11-30 | David Lane Smith | System and method for fluid cooling of electronic devices installed in an enclosure |
US9560789B2 (en) * | 2014-06-24 | 2017-01-31 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
US9643233B2 (en) * | 2014-09-22 | 2017-05-09 | Dell Products, L.P. | Bi-directional airflow heatsink |
US10317960B2 (en) * | 2014-09-28 | 2019-06-11 | Intel Corporation | Passive radiator cooling for electronic devices |
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TWM507143U (zh) * | 2015-06-01 | 2015-08-11 | Cooler Master Technology Inc | 電腦機箱 |
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DE102016109078A1 (de) * | 2016-05-18 | 2017-11-23 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Elektronikanordnung |
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CN108112216B (zh) * | 2016-11-24 | 2020-10-02 | 研能科技股份有限公司 | 气冷散热装置 |
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JP2021086985A (ja) * | 2019-11-29 | 2021-06-03 | 日立Astemo株式会社 | 電子制御装置 |
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2006
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-
2007
- 2007-12-06 DE DE102007058706A patent/DE102007058706B4/de not_active Expired - Fee Related
- 2007-12-11 US US12/000,207 patent/US7606027B2/en active Active
- 2007-12-20 CN CN2007101597096A patent/CN101208003B/zh not_active Expired - Fee Related
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11711909B2 (en) | 2017-03-16 | 2023-07-25 | Kioxia Corporation | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
JP2008159688A (ja) | 2008-07-10 |
DE102007058706A1 (de) | 2008-07-03 |
US20080151501A1 (en) | 2008-06-26 |
CN101208003A (zh) | 2008-06-25 |
CN101208003B (zh) | 2010-09-01 |
US7606027B2 (en) | 2009-10-20 |
DE102007058706B4 (de) | 2010-02-11 |
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