JP4733441B2 - Electronic component joining equipment - Google Patents

Electronic component joining equipment Download PDF

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JP4733441B2
JP4733441B2 JP2005186180A JP2005186180A JP4733441B2 JP 4733441 B2 JP4733441 B2 JP 4733441B2 JP 2005186180 A JP2005186180 A JP 2005186180A JP 2005186180 A JP2005186180 A JP 2005186180A JP 4733441 B2 JP4733441 B2 JP 4733441B2
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substrate
terminal portion
insulating resin
electrode portion
electronic component
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JP2007005676A (en
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茂明 川上
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Athlete FA Corp
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Athlete FA Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

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Description

本発明は、基板と電子部品とを接続固定する電子部品の接合装置に関する。   The present invention relates to an electronic component joining apparatus for connecting and fixing a substrate and an electronic component.

従来から、基板に形成された端子部と電子部品に形成された電極部とを電気的に接続させた状態で、基板と電子部品とを接続固定する方法として、種々の方法が採用されている。たとえば、超音波振動等の振動を利用して端子部と電極部とを圧接接合して、基板と電子部品とを接続固定する方法が知られている（たとえば、特許文献１および２参照）。また、端子部と電極部とを当接させた状態で、熱硬化性の絶縁樹脂であるＮＣＰ（Ｎｏｎ Ｃｏｎｄｕｃｔｉｖｅ Ｐａｓｔｅ）等を熱硬化させる接着接合によって、基板と電子部品とを接続固定する方法が知られている（たとえば、特許文献３および４参照）。   Conventionally, various methods have been adopted as a method for connecting and fixing a substrate and an electronic component in a state in which a terminal portion formed on the substrate and an electrode portion formed on the electronic component are electrically connected. . For example, a method of connecting and fixing a substrate and an electronic component by press-contacting a terminal portion and an electrode portion using vibration such as ultrasonic vibration is known (for example, see Patent Documents 1 and 2). Also, there is a method in which the substrate and the electronic component are connected and fixed by adhesive bonding that thermally cures NCP (Non Conductive Paste), which is a thermosetting insulating resin, in a state where the terminal portion and the electrode portion are in contact with each other. Known (for example, see Patent Documents 3 and 4).

振動を利用して端子部と電極部とを圧接接合する電子部品の接合装置は、特許文献１および２に開示されているように、圧接接合時に振動を発生させる圧電素子等の振動子を有する振動ヘッドや、圧接接合時に基板が搭載される基板搭載テーブルを備えている。また、基板搭載テーブルに搭載された基板を加熱するため、基板搭載テーブルにはヒータが配設されている。なお、ヒータによって加熱された基板搭載テーブルの輻射熱が振動子へ伝達されるのを遮断するため、振動ヘッドを覆う断熱性のカバー部材を備えた接合装置も提案されている（たとえば、特許文献５参照）。   An electronic component joining apparatus that press-joins a terminal portion and an electrode portion using vibration includes a vibrator such as a piezoelectric element that generates vibration during press-contact joining as disclosed in Patent Documents 1 and 2. A vibration head and a substrate mounting table on which a substrate is mounted during pressure welding are provided. Further, a heater is disposed on the substrate mounting table in order to heat the substrate mounted on the substrate mounting table. In addition, in order to block the transmission of the radiant heat of the substrate mounting table heated by the heater to the vibrator, there has also been proposed a joining apparatus including a heat insulating cover member that covers the vibration head (for example, Patent Document 5). reference).

熱硬化性の絶縁樹脂を熱硬化させる接着接合によって、基板と電子部品とを接続固定する電子部品の接合装置は、特許文献３に開示されているように、電子部品を基板上へ搬送する搬送ヘッドや、接着接合時に基板が搭載される基板搭載テーブルを備えている。また、絶縁樹脂を熱硬化させるためのヒータが搬送ヘッドおよび基板搭載テーブルに配設されている。   An electronic component joining apparatus for connecting and fixing a substrate and an electronic component by adhesive bonding that thermosets a thermosetting insulating resin, as disclosed in Patent Document 3, conveys the electronic component onto the substrate. A head and a substrate mounting table on which a substrate is mounted at the time of adhesive bonding are provided. In addition, heaters for thermally curing the insulating resin are disposed on the transport head and the substrate mounting table.

特開２００５−３２９４４号公報JP 2005-32944 A 特開２００４−９５７４７号公報JP 2004-95747 A 特開２００１−３５１９４９号公報JP 2001-351949 A 特開２００３−２１１６７７号公報Japanese Patent Laid-Open No. 2003-211677 特許第３４７５８０２号公報Japanese Patent No. 3475802

熱硬化性の絶縁樹脂を熱硬化させる接着接合によって、基板と電子部品とを接続固定する方法では、基板と電子部品とを絶縁樹脂で接着接合するため、接合強度を確保しやすいという利点がある。しかし、この接続固定方法では、端子部と当接する電極部の当接面あるいは、電極部と当接する端子部の当接面に酸化被膜が形成されていたり、汚れがあると、端子部と電極部との導通が安定しないという問題が生じる。また、振動を利用して端子部と電極部とを圧接接合して、基板と電子部品とを接続固定する方法では、振動の初期段階で当接面の酸化被膜や汚れを除去できるため、酸化被膜や汚れによって、端子部と電極部との導通が不安定になることはない。しかし、この方法では、基板と電子部品とが、端子部と電極部との圧接部のみで圧接接合される。そのため、基板と電子部品との接合強度が十分に確保できないという問題が生じやすい。また、その結果、端子部と電極部との導通が不安定になるという問題も生じる。   The method of connecting and fixing the substrate and the electronic component by adhesive bonding in which a thermosetting insulating resin is thermally cured has the advantage that it is easy to ensure the bonding strength because the substrate and the electronic component are bonded and bonded with the insulating resin. . However, in this connection fixing method, if an oxide film is formed on the contact surface of the electrode portion that contacts the terminal portion or the contact surface of the terminal portion that contacts the electrode portion, or if there is dirt, the terminal portion and the electrode There arises a problem that conduction with the part is not stable. In addition, in the method of connecting and fixing the substrate and the electronic component by pressing the terminal part and the electrode part using vibration, the oxide film and dirt on the contact surface can be removed at the initial stage of vibration. The conduction between the terminal portion and the electrode portion does not become unstable due to the coating or dirt. However, in this method, the substrate and the electronic component are pressure bonded only at the pressure contact portion between the terminal portion and the electrode portion. Therefore, the problem that the bonding strength between the substrate and the electronic component cannot be sufficiently secured is likely to occur. As a result, there also arises a problem that conduction between the terminal portion and the electrode portion becomes unstable.

そこで、本発明の課題は、端子部と電極部との導通を安定させることができ、かつ、基板と電子部品との接合強度を確保することができる電子部品の接合装置の具体的な構成を提供することにある。   Then, the subject of this invention is the concrete structure of the joining apparatus of the electronic component which can stabilize conduction | electrical_connection with a terminal part and an electrode part, and can ensure the joining strength of a board | substrate and an electronic component. It is to provide.

上記の課題を解決するため、本発明は、基板に形成された端子部と電子部品に形成された電極部との圧接接合を行う振動ヘッドと、端子部と電極部との圧接接合時に基板が搭載される基板搭載テーブルとを備え、基板と電子部品とを接続固定する電子部品の接合装置において、基板搭載テーブルは、基板が搭載される搭載面が形成された搭載治具と、基板上に配設された熱硬化性の絶縁樹脂を硬化させて基板と電子部品との接着接合を行うため、搭載治具を加熱するテーブル側ヒータとを備え、端子部と電極部との圧接接合および絶縁樹脂による接着接合は、所定の搬送方向へ基板を搬送後、停止させた状態で行われるように構成され、搭載治具には、搬送方向における端子部と電極部との圧接接合時の位置よりも上流側に、端子部と電極部との圧接接合前の絶縁樹脂の熱硬化を防止するため、搭載面から窪んだ窪み部が形成され、基板上に配設された熱硬化性の絶縁樹脂を加熱するヘッド側ヒータを備えた振動ヘッドが支持部材に取り付けられ、端子部と電極部とが圧接接合される位置より基板の搬送方向の上流側で基板上に配設された熱硬化性の絶縁樹脂をヘッド側ヒータで加熱しないように断熱板が支持部材に取り付けられ、端子部と電極部とをテーブル側ヒータとヘッド側ヒータとによって加熱し、かつ端子部と電極部とを振動を利用して圧接接合するとともに、絶縁樹脂によって、基板と電子部品とを接着接合することを特徴とする。 In order to solve the above-described problems, the present invention provides a vibration head that performs pressure bonding between a terminal portion formed on a substrate and an electrode portion formed on an electronic component, and a substrate at the time of pressure bonding between the terminal portion and the electrode portion. In an electronic component joining apparatus that includes a substrate mounting table to be mounted and connects and fixes the substrate and the electronic component, the substrate mounting table includes a mounting jig on which a mounting surface on which the substrate is mounted is formed, and a substrate. In order to perform adhesive bonding between the substrate and the electronic component by curing the thermosetting insulating resin provided, it is equipped with a table-side heater that heats the mounting jig, and press-contact bonding and insulation between the terminal portion and the electrode portion Adhesive bonding with resin is configured to be performed in a state where the substrate is stopped after being transferred in a predetermined transfer direction, and the mounting jig is positioned from the position at the time of press-contact bonding between the terminal portion and the electrode portion in the transfer direction. Also upstream, terminal and electrode To prevent thermal curing of the pressure-bonding before the insulating resin, it is formed recessed recess from the mounting surface, vibration head with head-side heater for heating the disposed thermoset insulating resin on the substrate Is attached to the support member so that the thermosetting insulating resin disposed on the substrate is not heated by the head heater on the upstream side of the substrate conveyance direction from the position where the terminal portion and the electrode portion are pressure-welded. The heat insulating plate is attached to the support member, the terminal portion and the electrode portion are heated by the table side heater and the head side heater, and the terminal portion and the electrode portion are pressure-welded using vibration, and by the insulating resin, The substrate and the electronic component are adhesively bonded.

本発明の接合装置では、端子部と電極部とを振動を利用して圧接接合するとともに、絶縁樹脂によって、基板と電子部品とを接着接合している。そのため、端子部と電極部との導通を安定させることができるとともに、基板と電子部品との接合強度を確保することができる。また、本発明の接合装置では、端子部と電極部との圧接接合時に基板が搭載される基板搭載テーブルを構成する搭載治具には、基板の搬送方向における端子部と電極部との圧接接合時の位置よりも上流側に、端子部と電極部との圧接接合前の絶縁樹脂の熱硬化を防止するため、基板の搭載面から窪んだ窪み部が形成されているとともに振動ヘッドの搬送上流側に断熱板が設けられている。そのため、端子部と電極部との圧接接合前の、基板と搭載面との接触を防止し、ヒータで加熱された搭載面の熱の影響で、基板上に配設された熱硬化性の絶縁樹脂が硬化するのを防止することが可能となる。したがって、硬化した絶縁樹脂の影響で、端子部と電極部との圧接接合が妨げられることがなく、端子部と当接する電極部の当接面あるいは、電極部と当接する端子部の当接面に形成される酸化被膜や汚れを取り除いた状態で、端子部と電極部とを接合させることができる。その結果、端子部と電極部との導通を安定させることができる。また、端子部と電極部とを圧接接合させた直後、あるいは、端子部と電極部とを圧接接合させながら、ヒータで加熱された搭載面の熱で、絶縁樹脂を硬化させて、基板と電子部品とを接着接合することが可能になる。そのため、基板と電子部品との接合強度を確保することができ、端子部と電極部との導通を安定させることができる。すなわち、本発明の接合装置では、適切に、端子部と電極部とを振動を利用して圧接接合するとともに、基板上に配設された熱硬化性の絶縁樹脂によって、基板と電子部品とを接着接合することができる。 In the bonding apparatus of the present invention, the terminal portion and the electrode portion are pressure-welded using vibration, and the substrate and the electronic component are bonded and bonded together with an insulating resin. Therefore, the conduction between the terminal portion and the electrode portion can be stabilized, and the bonding strength between the substrate and the electronic component can be ensured. In the bonding apparatus of the present invention, the mounting jig that constitutes the substrate mounting table on which the substrate is mounted at the time of pressure bonding between the terminal portion and the electrode portion is pressure bonded between the terminal portion and the electrode portion in the substrate transport direction. In order to prevent thermal curing of the insulating resin before the pressure contact bonding between the terminal portion and the electrode portion on the upstream side of the position at the time, a recess portion recessed from the mounting surface of the substrate is formed and the conveyance head of the vibration head is upstream A heat insulating plate is provided on the side . Therefore, the contact between the substrate and the mounting surface is prevented before the terminal portion and the electrode portion are pressure-bonded, and the thermosetting insulation provided on the substrate is affected by the heat of the mounting surface heated by the heater. It is possible to prevent the resin from curing. Therefore, the contact between the terminal part and the electrode part, or the contact part of the electrode part that contacts the terminal part, or the contact part of the terminal part that contacts the electrode part is not hindered by the influence of the cured insulating resin. The terminal portion and the electrode portion can be joined in a state in which the oxide film and dirt formed on the surface are removed. As a result, conduction between the terminal portion and the electrode portion can be stabilized. In addition, the insulating resin is cured by heat of the mounting surface heated by the heater immediately after the terminal portion and the electrode portion are pressure-welded or while the terminal portion and the electrode portion are pressure-welded, so that the substrate and the electron It becomes possible to adhesively bond the parts. Therefore, the bonding strength between the substrate and the electronic component can be ensured, and conduction between the terminal portion and the electrode portion can be stabilized. That is, in the bonding apparatus according to the present invention, the terminal portion and the electrode portion are appropriately pressure-bonded using vibration, and the substrate and the electronic component are bonded by the thermosetting insulating resin disposed on the substrate. Adhesive bonding is possible.

なお、本明細書において、「圧接接合」とは、端子部に電極部を押し当て加圧しながら超音波振動等の振動を加え、端子部と電極部とを接続して固定することをいう。   In this specification, “pressure welding” refers to connecting and fixing the terminal portion and the electrode portion by applying vibration such as ultrasonic vibration while pressing the electrode portion against the terminal portion and applying pressure.

本発明において、窪み部では、搬送方向における搭載面の上流側端から搭載面に直交する直交面が形成されていることが好ましい。このように構成すると、端子部と電極部との圧接接合前の絶縁樹脂の熱硬化を効果的に防止することができる。すなわち、窪み部では、搭載面の上流側端から上流側に向かって傾斜する傾斜面を形成することも可能であり、この場合には、傾斜面からの輻射熱で基板上の絶縁樹脂が熱硬化しやすくなる。しかし、窪み部で、搭載面の上流側端から直交面を形成する場合には、直交面の輻射熱の絶縁樹脂への伝達を抑制することができる。そのため、端子部と電極部との圧接接合前の絶縁樹脂の熱硬化を効果的に防止することができる。   In the present invention, it is preferable that an orthogonal surface orthogonal to the mounting surface is formed from the upstream end of the mounting surface in the transport direction in the recess. If comprised in this way, the thermosetting of the insulating resin before the press-contact joining of a terminal part and an electrode part can be prevented effectively. That is, it is possible to form an inclined surface that inclines toward the upstream side from the upstream end of the mounting surface in the depression, and in this case, the insulating resin on the substrate is thermoset by the radiant heat from the inclined surface. It becomes easy to do. However, in the case where the orthogonal surface is formed from the upstream end of the mounting surface in the recess, transmission of the radiant heat of the orthogonal surface to the insulating resin can be suppressed. Therefore, it is possible to effectively prevent the thermosetting of the insulating resin before the pressure contact bonding between the terminal portion and the electrode portion.

また、上記の課題を解決するため、本発明は、基板に形成された端子部と電子部品に形成された電極部との圧接接合を行う振動ヘッドと、端子部と電極部との圧接接合時に基板が搭載される基板搭載テーブルとを備え、基板と電子部品とを接続固定する電子部品の接合装置において、基板搭載テーブルは、基板が搭載される搭載面が形成された搭載治具と、基板上に配設された熱硬化性の絶縁樹脂を硬化させて基板と電子部品との接着接合を行うため、搭載治具を加熱するテーブル側ヒータとを備え、基板上に配設された熱硬化性の絶縁樹脂を加熱するヘッド側ヒータを備えた振動ヘッドが支持部材に取り付けられ、端子部と電極部とが圧接接合される位置より基板の搬送方向の上流側で基板上に配設された熱硬化性の絶縁樹脂をヘッド側ヒータで加熱しないように断熱板が支持部材に取り付けられ、端子部と電極部との圧接接合および絶縁樹脂による接着接合は、所定の搬送方向へ基板を搬送後、停止させた状態で行われるように構成され、基板の搬送方向には、所定の配置間隔で絶縁樹脂が配設され、搬送方向における端子部と電極部との圧接接合時の位置より上流側の搭載面の搬送方向の幅は、絶縁樹脂の配置間隔以下に形成され、端子部と電極部とをテーブル側ヒータとヘッド側ヒータとによって加熱し、かつ端子部と電極部とを振動を利用して圧接接合するとともに、絶縁樹脂によって、基板と電子部品とを接着接合することを特徴とする。 In order to solve the above-described problem, the present invention provides a vibration head that performs pressure welding between a terminal portion formed on a substrate and an electrode portion formed on an electronic component, and a pressure welding between the terminal portion and the electrode portion. In an electronic component joining apparatus that includes a substrate mounting table on which a substrate is mounted, and that connects and fixes the substrate and the electronic component, the substrate mounting table includes a mounting jig on which a mounting surface on which the substrate is mounted is formed, and a substrate A table-side heater that heats the mounting jig is provided to cure the thermosetting insulating resin disposed on the substrate and perform adhesive bonding between the substrate and the electronic component, and the thermosetting disposed on the substrate. A vibration head equipped with a head-side heater for heating the insulating insulating resin is attached to the support member, and is disposed on the substrate on the upstream side in the substrate transport direction from the position where the terminal portion and the electrode portion are pressure-welded. Use thermosetting insulating resin on the head side Heat insulating plate so as not to heat the other is attached to the support member, the adhesive bonded by pressure bonding and insulating resin between the terminal portion and the electrode portion, after transporting the substrate in a predetermined conveying direction, so that takes place in a state of stopping Insulating resin is arranged at a predetermined arrangement interval in the conveyance direction of the substrate, and the width in the conveyance direction of the mounting surface upstream from the position at the time of pressure welding of the terminal portion and the electrode portion in the conveyance direction is The terminal portion and the electrode portion are heated by the table-side heater and the head-side heater, and the terminal portion and the electrode portion are pressure-welded using vibration, and the insulating resin is formed. In this way, the substrate and the electronic component are adhesively bonded.

本発明の接合装置では、端子部と電極部とを振動を利用して圧接接合するとともに、絶縁樹脂によって、基板と電子部品とを接着接合している。そのため、端子部と電極部との導通を安定させることができるとともに、基板と電子部品との接合強度を確保することができる。また、本発明の接合装置では、基板搭載テーブルが、端子部と電極部との圧接接合時に基板が搭載される搭載面が形成された搭載治具を備え、基板の搬送方向における端子部と電極部との圧接接合時の位置より上流側の搭載面の搬送方向の幅は、基板の搬送方向に配設された絶縁樹脂の配置間隔以下に形成されている。そのため、端子部と電極部との圧接接合時に、その圧接接合時の位置よりも上流側に位置する絶縁樹脂が硬化するのを防止することができる。すなわち、ヒータで加熱された搭載面の熱の影響で、端子部と電極部との圧接接合前に、基板上に配設された熱硬化性の絶縁樹脂が硬化するのを防止することができる。したがって、硬化した絶縁樹脂の影響で、端子部と電極部との圧接接合が妨げられることがなく、端子部と当接する電極部の当接面あるいは、電極部と当接する端子部の当接面に形成される酸化被膜や汚れを取り除いた状態で、端子部と電極部とを接合させることができる。その結果、端子部と電極部との導通を安定させることができる。また、端子部と電極部とを圧接接合させた直後、あるいは、端子部と電極部とを圧接接合させながら、ヒータで加熱された搭載面の熱で、絶縁樹脂を硬化させて、基板と電子部品とを接着接合することができる。そのため、基板と電子部品との接合強度を確保することができ、端子部と電極部との導通を安定させることができる。すなわち、本発明の接合装置では、適切に、端子部と電極部とを振動を利用して圧接接合するとともに、基板上に配設された熱硬化性の絶縁樹脂によって、基板と電子部品とを接着接合することができる。   In the bonding apparatus of the present invention, the terminal portion and the electrode portion are pressure-welded using vibration, and the substrate and the electronic component are bonded and bonded together with an insulating resin. Therefore, the conduction between the terminal portion and the electrode portion can be stabilized, and the bonding strength between the substrate and the electronic component can be ensured. In the bonding apparatus of the present invention, the substrate mounting table includes a mounting jig on which a mounting surface on which the substrate is mounted at the time of press-contact bonding between the terminal portion and the electrode portion is formed, and the terminal portion and the electrode in the substrate transport direction The width in the transport direction of the mounting surface upstream from the position at the time of pressure welding with the part is formed to be equal to or smaller than the arrangement interval of the insulating resin disposed in the transport direction of the substrate. For this reason, it is possible to prevent the insulating resin positioned upstream from the position at the time of the pressure welding when the terminal portion and the electrode portion are pressure bonded. That is, it is possible to prevent the thermosetting insulating resin disposed on the substrate from being cured before the press contact between the terminal portion and the electrode portion due to the influence of the heat of the mounting surface heated by the heater. . Therefore, the contact between the terminal part and the electrode part, or the contact part of the electrode part that contacts the terminal part, or the contact part of the terminal part that contacts the electrode part is not hindered by the influence of the cured insulating resin. The terminal portion and the electrode portion can be joined in a state in which the oxide film and dirt formed on the surface are removed. As a result, conduction between the terminal portion and the electrode portion can be stabilized. In addition, the insulating resin is cured by heat of the mounting surface heated by the heater immediately after the terminal portion and the electrode portion are pressure-welded or while the terminal portion and the electrode portion are pressure-welded, so that the substrate and the electron The parts can be adhesively bonded. Therefore, the bonding strength between the substrate and the electronic component can be ensured, and conduction between the terminal portion and the electrode portion can be stabilized. That is, in the bonding apparatus according to the present invention, the terminal portion and the electrode portion are appropriately pressure-bonded using vibration, and the substrate and the electronic component are bonded by the thermosetting insulating resin disposed on the substrate. Adhesive bonding is possible.

以上説明したように、本発明にかかる電子部品の接合装置では、端子部と電極部との導通を安定させることができ、かつ、基板と電子部品との接合強度を確保することができる。   As described above, in the electronic device bonding apparatus according to the present invention, the conduction between the terminal portion and the electrode portion can be stabilized, and the bonding strength between the substrate and the electronic component can be ensured.

以下、本発明を実施するための最良の形態を図面に基づいて説明する。   Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.

図１は、本発明の実施の形態にかかる電子部品の接合装置１の主要部の概略構成を示す側面図である。図２は、図１の矢印Ｘ方向から接合装置１の主要部の概略構成を示す図である。図３は、図１の矢印Ｙ方向から接合装置１の主要部の概略構成を示す図である。図４は、本発明の実施の形態にかかる電子部品４の接合前後の基板２を示す平面図である。図５は、本発明の実施の形態にかかる基板２と電子部品４との接合状態を示す部分拡大断面図である。図６は、本発明の実施の形態にかかるヘッド側ヒータ８を示す斜視図である。図７は、図３のＺ部を拡大して示す部分拡大断面図である。図８は、図７のＷ−Ｗ断面を示す部分拡大断面図である。   FIG. 1 is a side view showing a schematic configuration of a main part of an electronic component bonding apparatus 1 according to an embodiment of the present invention. FIG. 2 is a diagram showing a schematic configuration of a main part of the bonding apparatus 1 from the direction of the arrow X in FIG. FIG. 3 is a diagram showing a schematic configuration of a main part of the bonding apparatus 1 from the direction of arrow Y in FIG. FIG. 4 is a plan view showing the substrate 2 before and after joining of the electronic component 4 according to the embodiment of the present invention. FIG. 5 is a partially enlarged cross-sectional view showing a joined state between the substrate 2 and the electronic component 4 according to the embodiment of the present invention. FIG. 6 is a perspective view showing the head-side heater 8 according to the embodiment of the present invention. FIG. 7 is a partially enlarged cross-sectional view showing the Z portion of FIG. 3 in an enlarged manner. FIG. 8 is a partially enlarged cross-sectional view showing the WW cross section of FIG. 7.

（電子部品の接合装置の構成）
本形態の電子部品の接合装置１は、図４および図５に示すように、基板２上に形成された端子部３と、電子部品４に形成された電極部５とを超音波振動を利用して圧接接合するとともに、基板２上に配設された熱硬化性の絶縁樹脂６によって、基板２と電子部品４とを接着接合するように構成されている。この接合装置１は、図１から図３に示すように、端子部３と電極部５との圧接接合を行う振動ヘッド７と、絶縁樹脂６を熱硬化させて基板２と電子部品４との接着接合を行うため、振動ヘッド７に取り付けられたヘッド側ヒータ８と、基板２と振動ヘッド７との間に配設された断熱部材９とを備えている。また、接合装置１は、図１等に示すように、基板２の下方に配設され、端子部３と電極部５との圧接接合時に基板２が搭載される基板搭載テーブル１０や、端子部３と電極部５とが圧接接合された状態を検査するためのカメラユニット３５を備えている。 (Configuration of electronic component joining device)
As shown in FIGS. 4 and 5, the electronic component bonding apparatus 1 according to the present embodiment uses ultrasonic vibrations between the terminal portion 3 formed on the substrate 2 and the electrode portion 5 formed on the electronic component 4. Thus, the substrate 2 and the electronic component 4 are bonded and bonded together by a thermosetting insulating resin 6 disposed on the substrate 2. As shown in FIGS. 1 to 3, the bonding apparatus 1 includes a vibration head 7 that performs pressure-contact bonding between the terminal portion 3 and the electrode portion 5, and an insulating resin 6 that is thermally cured to connect the substrate 2 and the electronic component 4. In order to perform adhesive bonding, a head-side heater 8 attached to the vibration head 7 and a heat insulating member 9 disposed between the substrate 2 and the vibration head 7 are provided. Further, as shown in FIG. 1 and the like, the bonding apparatus 1 is disposed below the substrate 2, and has a substrate mounting table 10 on which the substrate 2 is mounted when the terminal portion 3 and the electrode portion 5 are pressed and bonded, and a terminal portion. 3 and the electrode unit 5 are provided with a camera unit 35 for inspecting the state in which they are press-welded.

本形態における基板２は、フレキシブルな樹脂基板であるＣＯＦ（Ｃｈｉｐ Ｏｎ Ｆｉｌｍ ｏｒ Ｃｈｉｐ Ｏｎ Ｆｌｅｘｉｂｌｅ Ｃｉｒｃｕｉｔ Ｂｏａｒｄ）テープである。したがって、以下では、基板２をＣＯＦテープ２と表記する。また、本形態における電子部品４はＩＣチップである。したがって、以下では、電子部品４をＩＣチップ４と表記する。   The substrate 2 in this embodiment is a COF (Chip On Film or Chip On Flexible Circuit Board) tape that is a flexible resin substrate. Therefore, hereinafter, the substrate 2 is referred to as a COF tape 2. Further, the electronic component 4 in this embodiment is an IC chip. Therefore, hereinafter, the electronic component 4 is expressed as an IC chip 4.

ＣＯＦテープ２は、図４に示すように長尺状に形成されている。より具体的には、ＣＯＦテープ２は、その長手方向（図示左右方向）に複数の基板片２ａが連なるように長尺状に形成されている。各基板片２ａの表面には、図５に示すように、予め所定の配線パターン２ｂが形成されている。また、各基板片２ａの表面には、ＣＯＦテープ２とＩＣチップ４との接合工程よりも前の工程で、端子部３および絶縁樹脂６が配設されるようになっている。すなわち、圧接接合前のＣＯＦテープ２には、長手方向に所定の配置間隔Ｐで端子部３および絶縁樹脂６が配設されている。端子部３は、配線パターン２ｂと導通した状態で各基板片２ａに配設されている。なお、図４および図５では、便宜上、端子部３を模式的に図示しているが、実際は、図示したものより小さな端子部３が数十個、各基板片２ａの表面に配設されている。また、各基板片２ａの表面には、百個を超える端子部３が配設されることもある。   The COF tape 2 is formed in a long shape as shown in FIG. More specifically, the COF tape 2 is formed in a long shape so that a plurality of substrate pieces 2a are continuous in the longitudinal direction (the left-right direction in the drawing). As shown in FIG. 5, a predetermined wiring pattern 2b is formed on the surface of each substrate piece 2a in advance. Further, on the surface of each substrate piece 2a, the terminal portion 3 and the insulating resin 6 are arranged in a step before the bonding step between the COF tape 2 and the IC chip 4. That is, the terminal portion 3 and the insulating resin 6 are arranged at a predetermined arrangement interval P in the longitudinal direction on the COF tape 2 before the pressure welding. The terminal portion 3 is disposed on each substrate piece 2a in a state of being electrically connected to the wiring pattern 2b. 4 and 5, the terminal portions 3 are schematically shown for convenience. Actually, however, dozens of smaller terminal portions 3 than those shown are actually arranged on the surface of each substrate piece 2a. Yes. In addition, over 100 terminal portions 3 may be disposed on the surface of each substrate piece 2a.

端子部３と電極部５との圧接接合および絶縁樹脂６によるＣＯＦテープ２（基板片２ａ）とＩＣチップ４との接着接合は、ＣＯＦテープ２の長手方向の一方向となる所定の搬送方向Ｖ（図示右方向）へ、ＣＯＦテープ２を配置間隔Ｐ分だけ搬送して停止させた状態で行われるようになっている。この搬送と停止とは繰り返し行われ、ＣＯＦテープ２とＩＣチップ４との接合（接続固定）が次々と行われるようになっている。すなわち、端子部３と電極部５との圧接接合および絶縁樹脂６によるＣＯＦテープ２とＩＣチップ４との接着接合は、搬送方向ＶへＣＯＦテープ２を配置間隔Ｐ分だけ搬送後、停止させるたびに行われるようになっている。各基板片２ａは、ＩＣチップ４が接合された後の所定の工程を経て、分離部２ｃで分離されるようになっている。また、ＣＯＦテープ２の図示上下端側のそれぞれには、基板搬送機構の係合突起（図示省略）と係合して、ＣＯＦテープ２を搬送方向Ｖへ搬送するための係合孔２ｄが所定の間隔で長手方向に形成されている。より具体的には、配置間隔Ｐの中に、たとえば、５個の係合孔２ｄが等間隔で形成されている。なお、図４では便宜上、一部の基板片２ａ、一部の分離部２ｃおよび一部の係合孔２ｄにのみ符号を付している。   The pressure bonding of the terminal portion 3 and the electrode portion 5 and the adhesive bonding of the COF tape 2 (substrate piece 2a) and the IC chip 4 with the insulating resin 6 are performed in a predetermined transport direction V which is one direction in the longitudinal direction of the COF tape 2. The operation is performed in a state where the COF tape 2 is conveyed by the arrangement interval P in the direction (right direction in the drawing) and stopped. This conveyance and stop are repeated, and the COF tape 2 and the IC chip 4 are joined (fixed) one after another. In other words, the pressure bonding between the terminal portion 3 and the electrode portion 5 and the adhesive bonding between the COF tape 2 and the IC chip 4 using the insulating resin 6 are stopped after the COF tape 2 is conveyed by the arrangement interval P in the conveying direction V. To be done. Each substrate piece 2a is separated by the separation part 2c through a predetermined process after the IC chip 4 is bonded. Each of the upper and lower ends of the COF tape 2 shown in the figure has engagement holes 2d for engaging the engagement protrusions (not shown) of the substrate transport mechanism and transporting the COF tape 2 in the transport direction V. Are formed in the longitudinal direction at intervals of. More specifically, in the arrangement interval P, for example, five engagement holes 2d are formed at equal intervals. In FIG. 4, for the sake of convenience, only some of the substrate pieces 2a, some of the separation portions 2c, and some of the engagement holes 2d are denoted by reference numerals.

本形態の絶縁樹脂６は、熱硬化前の状態がペースト状態となっているＮＣＰである。すなわち、絶縁樹脂６は、端子部３と電極部５との圧接接合後、ヘッド側ヒータ８や後述のテーブル側ヒータ３３の熱で熱硬化する前は、ペースト状態になっている。また、絶縁樹脂６は、たとえば、５０℃から６０℃で硬化が始まり、１５０℃から２００℃で硬化が終わるようになっている。   Insulating resin 6 of this embodiment is NCP in which the state before thermosetting is in a paste state. That is, the insulating resin 6 is in a paste state after the pressure contact bonding between the terminal portion 3 and the electrode portion 5 and before thermosetting with the heat of the head side heater 8 or the table side heater 33 described later. Moreover, the insulating resin 6 starts to be cured at, for example, 50 ° C. to 60 ° C. and ends at 150 ° C. to 200 ° C.

振動ヘッド７は、超音波振動を発生させて端子部３と電極部５との圧接接合を行うように構成されている。この振動ヘッド７は、超音波振動の発生源となる圧電素子等の振動子（図示省略）を有する振動発生部１２と、振動発生部１２で発生させた超音波振動を増幅する振動ホーンからなる振動増幅部１３と、振動増幅部１３に固定され、端子部３と電極部５とを圧接させる圧接部１４と、振動増幅部１３に固定され、振動ヘッド７の振動時に後述の摺動部材２０と摺動する扁平な直方体形状の摺動部１５とを備えている。   The vibration head 7 is configured to generate ultrasonic vibration and perform pressure contact bonding between the terminal portion 3 and the electrode portion 5. The vibration head 7 includes a vibration generation unit 12 having a vibrator (not shown) such as a piezoelectric element that is a generation source of ultrasonic vibration, and a vibration horn that amplifies the ultrasonic vibration generated by the vibration generation unit 12. The vibration amplifying unit 13, the pressure amplifying unit 14 fixed to the vibration amplifying unit 13, and the terminal 3 and the electrode unit 5 are pressed against each other, and the vibration amplifying unit 13, and a sliding member 20 described later when the vibration head 7 vibrates And a flat rectangular parallelepiped sliding portion 15 that slides.

振動増幅部１３は、図１および図２に示すように、ＣＯＦテープ２の長手方向を長手方向とする細長の直方体状に形成されている。この振動増幅部１３は、ＣＯＦテープ２の表面と略平行になるように配設される底面１３ａと、ＣＯＦテープ２の、ＩＣチップ４が接合される表面に略直交するとともに長手方向（搬送方向Ｖ）に向かって形成された２つの側面１３ｂ、１３ｃとを備えている。振動増幅部１３の図１に示す左側面は、振動発生部１２に取り付けられている。また、振動増幅部１３の底面１３ａにおける長手方向の略中心位置には、圧接部１４が一体で形成され、振動増幅部１３の上面における長手方向の略中心位置には、摺動部１５が一体で形成されている。   As shown in FIGS. 1 and 2, the vibration amplifying unit 13 is formed in an elongated rectangular parallelepiped shape having the longitudinal direction of the COF tape 2 as the longitudinal direction. The vibration amplifying unit 13 includes a bottom surface 13a disposed so as to be substantially parallel to the surface of the COF tape 2, and a surface that is substantially orthogonal to the surface of the COF tape 2 to which the IC chip 4 is bonded and a longitudinal direction (conveying direction). V) and two side surfaces 13b and 13c formed toward the surface. The left side surface of the vibration amplifying unit 13 shown in FIG. 1 is attached to the vibration generating unit 12. Further, the pressure contact portion 14 is integrally formed at a substantially central position in the longitudinal direction on the bottom surface 13 a of the vibration amplifying portion 13, and the sliding portion 15 is integrally formed at a substantially central position in the longitudinal direction on the top surface of the vibration amplifying portion 13. It is formed with.

圧接部１４は、硬度の高い超硬の材料またはセラミックス材料から形成されており、図２に示すように、ＩＣチップ４を真空吸着するための複数の吸着孔１４ａが形成された吸着面１４ｂを備えている。吸着孔１４ａは、ＣＯＦテープ２の搬送方向Ｖに直交する方向（図２の上下方向）に直線状に配置され、かつ、互いが隣接するように複数形成されている。吸着面１４ｂは、図２の上下方向を長手方向とする長方形状に形成されており、その長手方向の幅は、振動増幅部１３の図２の上下方向の幅とほぼ同じになっている。   The pressure contact portion 14 is formed of a hard material such as a super hard material or a ceramic material. As shown in FIG. 2, the pressure contact portion 14 includes a suction surface 14b on which a plurality of suction holes 14a for vacuum suction of the IC chip 4 are formed. I have. A plurality of the suction holes 14a are linearly arranged in a direction (vertical direction in FIG. 2) perpendicular to the conveyance direction V of the COF tape 2, and are formed in a plurality so as to be adjacent to each other. The suction surface 14b is formed in a rectangular shape whose longitudinal direction is the vertical direction of FIG. 2, and the width in the longitudinal direction is substantially the same as the vertical width of the vibration amplification unit 13 in FIG.

振動ヘッド７は、ヘッド支持部材１６によって支持されている。より具体的には、振動ヘッド７は、図１および図３に示すように、断熱部材１７、取付部材１８および２本のスペーサ１９を介してヘッド支持部材１６によって支持されている。   The vibration head 7 is supported by a head support member 16. More specifically, as shown in FIGS. 1 and 3, the vibration head 7 is supported by a head support member 16 via a heat insulating member 17, a mounting member 18, and two spacers 19.

ヘッド支持部材１６は、ステンレス鋼等の金属部材から矩形の平板状に形成されている。このヘッド支持部１６は、図示を省略する駆動機構に連結されており、図１の上下方向、左右方向および紙面垂直方向に移動可能になっている。すなわち、ヘッド支持部材１６に支持された振動ヘッド７は、図１の上下方向、左右方向および紙面垂直方向に移動可能になっている。なお、搬送方向Ｖでは、図１に示す振動ヘッド７の位置が、ＩＣチップ４をＣＯＦテープ２へ接続固定する際の振動ヘッド７の配置位置になっている。すなわち、図１に示す吸着面１４ｂの搬送方向Ｖの略中心位置（すなわち、図１で、吸着面１４ｂの図示下方に配置されるＩＣチップ４の搬送方向Ｖの略中心位置）が、搬送方向Ｖにおける端子部３と電極部５との圧接接合時の位置Ａとなっている。   The head support member 16 is formed in a rectangular flat plate shape from a metal member such as stainless steel. The head support 16 is connected to a drive mechanism (not shown) and is movable in the vertical direction, the horizontal direction, and the direction perpendicular to the paper in FIG. That is, the vibration head 7 supported by the head support member 16 is movable in the vertical direction, the horizontal direction, and the direction perpendicular to the paper surface of FIG. In the transport direction V, the position of the vibration head 7 shown in FIG. 1 is the arrangement position of the vibration head 7 when the IC chip 4 is connected and fixed to the COF tape 2. That is, the approximate center position in the transport direction V of the suction surface 14b shown in FIG. 1 (that is, the approximate center position in the transport direction V of the IC chip 4 arranged below the suction surface 14b in FIG. 1) is the transport direction. V is a position A at the time of pressure welding of the terminal portion 3 and the electrode portion 5 at V.

断熱部材１７は、加工性に優れたマシナブルセラミックスから矩形の平板状に形成されている。この断熱部材１７は、ヘッド側ヒータ８で生じた熱のヘッド支持部材１６への伝達を防止するため、ヘッド支持部材１６の図示下面に固定されている。取付部材１８は、図１等に示すように、ステンレス鋼等の金属部材から矩形の平板状に形成されており、断熱部材１７の図示下面に固定されている。この取付部材１８には、図１に示すように、紙面垂直方向に貫通する２つの空隙部１８ａが形成されている。   The heat insulating member 17 is formed in a rectangular flat plate shape from machinable ceramics excellent in workability. The heat insulation member 17 is fixed to the lower surface of the head support member 16 in order to prevent the heat generated by the head side heater 8 from being transmitted to the head support member 16. As shown in FIG. 1 and the like, the mounting member 18 is formed in a rectangular flat plate shape from a metal member such as stainless steel, and is fixed to the lower surface of the heat insulating member 17 in the drawing. As shown in FIG. 1, the attachment member 18 is formed with two gap portions 18a penetrating in the direction perpendicular to the paper surface.

図１および図３に示すように、２本のスペーサ１９の上端はそれぞれ、図１における取付部材１８の左右両方向端側で、かつ、図３における取付部材１８の左右方向の略中心位置に取り付けられている。また、２本のスペーサ１９の下端には振動増幅部１３が取り付けられている。より具体的には、振動増幅部１３の図１の左右方向の略中心位置と、取付部材１８の図１の左右方向の略中心位置とがほぼ一致するように、振動増幅部１３がスペーサ１９の下端に取り付けられている。   As shown in FIGS. 1 and 3, the upper ends of the two spacers 19 are respectively attached to the left and right ends of the attachment member 18 in FIG. 1 and at the substantially central position in the left and right direction of the attachment member 18 in FIG. It has been. A vibration amplification unit 13 is attached to the lower ends of the two spacers 19. More specifically, the vibration amplifying unit 13 is arranged in the spacer 19 so that the substantially center position in the left-right direction in FIG. 1 of the vibration amplifying unit 13 and the substantially center position in the left-right direction in FIG. It is attached to the lower end.

また、取付部材１８の下面の略中心位置には、矩形の平板状に形成され、潤滑性を有する潤滑面を備えた摺動部材２０が固定されている。この摺動部材２０は、振動ヘッド７の摺動部１５の上面と当接して、振動ヘッド７の振動時に摺動部１５と摺動するようになっている。   Further, a sliding member 20 that is formed in a rectangular flat plate shape and has a lubricating surface having lubricity is fixed at a substantially central position on the lower surface of the mounting member 18. The sliding member 20 is in contact with the upper surface of the sliding portion 15 of the vibration head 7 so as to slide with the sliding portion 15 when the vibration head 7 vibrates.

ここで、振動ヘッド７の長手方向では、２本のスペーサ１９が配置される部分がそれぞれ、振動ヘッド７の振幅がほぼ零となるいわゆる節の部分となっている。また、振動ヘッド７の長手方向では、圧接部１４が配置される部分（すなわち、摺動部１５や摺動部材２０が配置される部分）が、振動ヘッド７の振幅が最大となるいわゆる腹の部分となっている。そのため、２本のスペーサ１９の上端がそれぞれ取り付けられた取付部材１８は、振動ヘッド７が振動しても、ほとんど振動しないようになっている。また、振動ヘッド７の振幅が最大となる摺動部１５と摺動部材２０との当接部では、振動ヘッド７が振動する際に、摺動部１５と摺動部材２０とが滑らかに摺動するようになっている。   Here, in the longitudinal direction of the vibration head 7, the portions where the two spacers 19 are arranged are so-called node portions where the amplitude of the vibration head 7 is substantially zero. Further, in the longitudinal direction of the vibration head 7, a portion where the pressure contact portion 14 is disposed (that is, a portion where the sliding portion 15 and the sliding member 20 are disposed) is a so-called belly where the amplitude of the vibration head 7 is maximized. It has become a part. For this reason, the attachment members 18 to which the upper ends of the two spacers 19 are attached are configured to hardly vibrate even when the vibration head 7 vibrates. Further, at the contact portion between the sliding portion 15 and the sliding member 20 where the amplitude of the vibration head 7 is maximized, the sliding portion 15 and the sliding member 20 slide smoothly when the vibration head 7 vibrates. It comes to move.

ヘッド側ヒータ８は、図１に示すように、縦辺部２１ａと横辺部２１ｂとを有するＴ型状に形成されたヒータ保持部材２１に保持された状態で、振動ヘッド７に取り付けられている。より具体的には、振動増幅部１３の２つの側面１３ｂ、１３ｃに、それぞれ１つずつ計２つのヒータ保持部材２１が配設されており、２つのヒータ保持部材２１にはそれぞれ、２つのヘッド側ヒータ８が保持されている。ヘッド側ヒータ８はいずれも、等しい熱量を発生するように構成されている。   As shown in FIG. 1, the head side heater 8 is attached to the vibration head 7 while being held by a heater holding member 21 formed in a T shape having a vertical side portion 21a and a horizontal side portion 21b. Yes. More specifically, a total of two heater holding members 21 are disposed on each of the two side surfaces 13b and 13c of the vibration amplifying unit 13, and each of the two heater holding members 21 has two heads. A side heater 8 is held. All of the head side heaters 8 are configured to generate an equal amount of heat.

各ヒータ保持部材２１には、図３および図７等に示すように、ヘッド側ヒータ８を保持するため、ヒータ保持部材２１の内側面から外側に向かって窪んだ保持空間２１ｃが２つ形成されている。この２つの保持空間２１ｃが形成された部分にはそれぞれ、ヘッド側ヒータ８を振動増幅部１３に付勢する付勢部材としての圧縮コイルバネ２３を保持する円筒状のバネ保持部材２２が取り付けられている。このバネ保持部材２２の内周側に圧縮コイルバネ２３が圧縮された状態で保持されており、圧縮コイルバネ２３は、ヘッド側ヒータ８を振動増幅部１３に付勢している。   As shown in FIGS. 3 and 7, each heater holding member 21 is formed with two holding spaces 21 c that are recessed outward from the inner surface of the heater holding member 21 in order to hold the head-side heater 8. ing. A cylindrical spring holding member 22 that holds a compression coil spring 23 as a biasing member that biases the head side heater 8 to the vibration amplifying unit 13 is attached to each of the portions where the two holding spaces 21c are formed. Yes. A compression coil spring 23 is held in a compressed state on the inner peripheral side of the spring holding member 22, and the compression coil spring 23 biases the head side heater 8 toward the vibration amplifying unit 13.

ヘッド側ヒータ８は、ニクロム線等の発熱体（図示省略）をセラミックの内部に埋め込んだセラミックヒータであり、図６に示すように、矩形の平板状に形成されている。このヘッド側ヒータ８は、図示を省略する発熱体に接続された２本のリード線２４を備えている。リード線２４の先端部２４ａは、図６に示すように、絶縁被膜２４ｂが剥かれて芯線が剥き出した状態になっている。   The head side heater 8 is a ceramic heater in which a heating element (not shown) such as a nichrome wire is embedded in a ceramic, and is formed in a rectangular flat plate shape as shown in FIG. The head-side heater 8 includes two lead wires 24 connected to a heating element (not shown). As shown in FIG. 6, the leading end 24a of the lead wire 24 is in a state where the insulating coating 24b is peeled off and the core wire is exposed.

ヘッド側ヒータ８の周囲には、緩衝部材２５が配設されている。より具体的には、図７および図８に示すように、箔状の金属部材であるアルミニウム箔２６と、薄い膜状の絶縁部材であるポリイミドフィルム（ポリイミドテープ）２７とからなる緩衝部材２５がヘッド側ヒータ８の周囲に巻かれている。図７に示すように、アルミニウム箔２６は、ヘッド側ヒータ８の外周に時計方向で１周半、巻かれ、ポリイミドフィルム２７は、アルミニウム箔２６の外周に半時計方向で１周半、巻かれている。そして、図７に示すように、振動増幅部１３に当接するヘッド側ヒータ８の内側面（図７では左側の面）と振動増幅部１３との間には、アルミニウム箔２６およびポリイミドフィルム２７がそれぞれ２層ずつ配設されている。   A buffer member 25 is disposed around the head side heater 8. More specifically, as shown in FIG. 7 and FIG. 8, a buffer member 25 composed of an aluminum foil 26 that is a foil-like metal member and a polyimide film (polyimide tape) 27 that is a thin film-like insulating member is provided. It is wound around the head side heater 8. As shown in FIG. 7, the aluminum foil 26 is wound around the outer circumference of the head-side heater 8 one and a half times in the clockwise direction, and the polyimide film 27 is wound around the outer circumference of the aluminum foil 26 one and a half times in the counterclockwise direction. ing. As shown in FIG. 7, an aluminum foil 26 and a polyimide film 27 are interposed between the inner surface (the left surface in FIG. 7) of the head side heater 8 in contact with the vibration amplification unit 13 and the vibration amplification unit 13. Two layers each are provided.

図８に示すように、アルミニウム箔２６は、その一端（図８では右端）がヘッド側ヒータ８のリード線２４が接続された端面とほぼ一致するように、ヘッド側ヒータ８の外周に巻かれている。また、ポリイミドフィルム２７は、その一端（図８では右端）がヘッド側ヒータ８のリード線２４が接続された端面よりも図示右側へ突出し、少なくともリード線２４の先端部２４ａを覆うように、アルミニウム箔２６の外周に巻かれている。このように、ポリイミドフィルム２７は、振動増幅部１３に当接するヘッド側ヒータ８と振動増幅部１３との間で緩衝機能を果たすとともに、ヘッド側ヒータ８と振動ヘッド７とを電気的に絶縁する絶縁機能も果たしている。   As shown in FIG. 8, the aluminum foil 26 is wound around the outer periphery of the head side heater 8 so that one end (right end in FIG. 8) substantially coincides with the end surface to which the lead wire 24 of the head side heater 8 is connected. ing. Further, the polyimide film 27 is made of aluminum so that one end (the right end in FIG. 8) protrudes to the right side of the drawing from the end surface to which the lead wire 24 of the head side heater 8 is connected, and covers at least the tip 24a of the lead wire 24. The foil 26 is wound around the outer periphery. As described above, the polyimide film 27 performs a buffering function between the head-side heater 8 that contacts the vibration amplification unit 13 and the vibration amplification unit 13, and electrically insulates the head-side heater 8 from the vibration head 7. It also performs an insulating function.

なお、本形態では、アルミニウム箔２６がヘッド側ヒータ８の外周に巻かれ、ポリイミドフィルム２７がアルミニウム箔２６の外周に巻かれるように構成されているが、ポリイミドフィルム２７がヘッド側ヒータ８の外周に巻かれ、アルミニウム箔２６がポリイミドフィルム２７の外周に巻かれるように構成されても良い。また、アルミニウム箔２６に代えて、銅箔や銀箔、あるいは、金箔を用いて緩衝部材２５を構成しても良いし、ポリイミドフィルム２７に代えて、ポリエーテルケトンフィルムを用いて緩衝部材２５を構成しても良い。   In this embodiment, the aluminum foil 26 is wound around the outer periphery of the head side heater 8 and the polyimide film 27 is wound around the outer periphery of the aluminum foil 26. However, the polyimide film 27 is wound around the outer periphery of the head side heater 8. The aluminum foil 26 may be wound around the outer periphery of the polyimide film 27. Moreover, it may replace with the aluminum foil 26, and you may comprise the buffer member 25 using copper foil, silver foil, or gold foil, and it replaces with the polyimide film 27, and comprises the buffer member 25 using the polyether ketone film. You may do it.

ヒータ保持部材２１は、緩衝部材２５が巻かれたヘッド側ヒータ８を保持空間２１ｃに保持した状態で、取付部材１８に固定されている。また、この状態では、圧縮コイルバネ２３は、ヘッド側ヒータ８の中心部に当接して、ヘッド側ヒータ８を振動増幅部１３に付勢し、ヘッド側ヒータ８は、緩衝部材２５を介して振動ヘッド７に当接している。すなわち、ヒータ保持部材２１は、圧縮コイルバネ２３の付勢力によって、緩衝部材２５を介してヘッド側ヒータ８を振動ヘッド７に当接させた状態で、振動増幅部１３の２つの側面１３ｂ、１３ｃに配設されている。   The heater holding member 21 is fixed to the mounting member 18 in a state where the head side heater 8 around which the buffer member 25 is wound is held in the holding space 21c. In this state, the compression coil spring 23 abuts against the center portion of the head side heater 8 to urge the head side heater 8 toward the vibration amplifying unit 13, and the head side heater 8 vibrates via the buffer member 25. It is in contact with the head 7. That is, the heater holding member 21 is applied to the two side surfaces 13b and 13c of the vibration amplifying unit 13 in a state where the head side heater 8 is brought into contact with the vibration head 7 via the buffer member 25 by the biasing force of the compression coil spring 23. It is arranged.

断熱部材９は、端子部３と電極部５との圧接接合前の絶縁樹脂６の熱硬化を防止するために設けられている。この断熱部材９は、ヘッド側ヒータ８の熱の影響によって発塵しない無機材料で平板状に形成されている。また、断熱部材９は、ヘッド支持部材１６に取り付けられている。本形態では、図１等に示すように、断熱部材９は、その表面がＣＯＦテープ２の表面と平行になるように、ヘッド支持部１６に固定された２本の柱状のスペーサ３１に取り付けられている。また、図１等に示すように、断熱部材９は、搬送方向Ｖにおいて、吸着面１４ｂよりも上流側にのみ配設されている。   The heat insulating member 9 is provided in order to prevent thermosetting of the insulating resin 6 before the pressure contact bonding between the terminal portion 3 and the electrode portion 5. The heat insulating member 9 is formed in a flat plate shape using an inorganic material that does not generate dust due to the heat of the head side heater 8. The heat insulating member 9 is attached to the head support member 16. In this embodiment, as shown in FIG. 1 and the like, the heat insulating member 9 is attached to the two columnar spacers 31 fixed to the head support portion 16 so that the surface thereof is parallel to the surface of the COF tape 2. ing. Moreover, as shown in FIG. 1 etc., the heat insulation member 9 is arrange | positioned only in the conveyance direction V upstream from the adsorption | suction surface 14b.

スペーサ３１は、ＳＵＳや黄銅等の金属材料から六角柱状に形成されている。２本のスペーサ３１は、図１の紙面垂直方向（すなわち、図２の上下方向）の間隔を保持して互いが平行になるように、かつ、振動増幅部１３の２つの側面１３ｂ、１３ｃに隣接するように、ヘッド支持部材１６に固定されている。   The spacer 31 is formed in a hexagonal column shape from a metal material such as SUS or brass. The two spacers 31 are arranged on the two side surfaces 13b and 13c of the vibration amplifying unit 13 so as to be parallel to each other while maintaining a distance in the direction perpendicular to the paper surface of FIG. 1 (that is, the vertical direction in FIG. 2). It is fixed to the head support member 16 so as to be adjacent.

基板搭載テーブル１０は、端子部３と電極部５との圧接接合時に、ＣＯＦテープ２が搭載される搭載面３２ａが形成された搭載治具３２と、ヘッド側ヒータ８とともに絶縁樹脂６を熱硬化させるため、搭載治具３２を加熱するテーブル側ヒータ３３とを備えている。また、基板搭載テーブル１０は、図示を省略する駆動機構を備えており、基板搭載テーブル１０は、図１の上下方向に移動可能となっている。   The substrate mounting table 10 thermosets the insulating resin 6 together with the mounting jig 32 formed with the mounting surface 32a on which the COF tape 2 is mounted and the head side heater 8 when the terminal portion 3 and the electrode portion 5 are pressure bonded. Therefore, a table-side heater 33 that heats the mounting jig 32 is provided. Further, the substrate mounting table 10 includes a drive mechanism (not shown), and the substrate mounting table 10 is movable in the vertical direction in FIG.

搭載治具３２は、図１に示すように搭載面３２ａをその上面としている。また、搭載治具３２の図１における紙面垂直方向の幅は、一定の幅Ｌとなっている（図３参照）。この幅Ｌは、圧接部１４やＣＯＦテープ２の図１における紙面垂直方向の幅よりも広くなっている。また、搭載治具３２は、図１の左側部分が低くなるような階段状に形成されている。すなわち、搭載治具３２には、搬送方向Ｖにおける端子部３と電極部５との圧接接合時の位置Ａよりも上流側に、搭載面３２ａから図示下方に窪んだ窪み部３２ｂが形成されている。より具体的には、窪み部３２ｂでは、搬送方向Ｖにおける搭載面３２ａの上流側端３２ａ１から搭載面３２ａに直交するように直交面３２ｃが形成されている。また、窪み部３２ｂでは、直交面３２ｃの図示下端から搭載面３２ａと平行にかつ、搬送方向Ｖの上流側に向かって、段差面３２ｄが形成されている。この窪み部３２ｂは、端子部３と電極部５との圧接接合前の絶縁樹脂６の熱硬化を防止するために形成されている。   As shown in FIG. 1, the mounting jig 32 has a mounting surface 32a as its upper surface. Further, the width of the mounting jig 32 in the direction perpendicular to the paper surface in FIG. 1 is a constant width L (see FIG. 3). This width L is wider than the width in the direction perpendicular to the paper surface of FIG. Further, the mounting jig 32 is formed in a stepped shape such that the left portion of FIG. 1 is lowered. That is, the mounting jig 32 is formed with a recessed portion 32b that is recessed downward from the mounting surface 32a on the upstream side of the position A at the time of the pressure welding of the terminal portion 3 and the electrode portion 5 in the transport direction V. Yes. More specifically, in the recess 32b, an orthogonal surface 32c is formed so as to be orthogonal to the mounting surface 32a from the upstream end 32a1 of the mounting surface 32a in the transport direction V. Further, in the recess 32b, a step surface 32d is formed in parallel with the mounting surface 32a from the lower end of the orthogonal surface 32c in the drawing and toward the upstream side in the transport direction V. The recess 32b is formed to prevent the thermosetting of the insulating resin 6 before the press contact bonding between the terminal portion 3 and the electrode portion 5.

図１に示すように、搬送方向Ｖにおける端子部３と電極部５との圧接接合時の位置Ａより上流側の搭載面３２ａの搬送方向Ｖの幅Ｈ１は、ＣＯＦテープ２上の端子部３および絶縁樹脂６の配置間隔Ｐ以下となっている。たとえば、幅Ｈ１は、上流側の絶縁樹脂６を加熱しないような幅となっている。また、搬送方向Ｖにおける端子部３と電極部５との圧接接合時の位置Ａより下流側の搭載面３２ａの搬送方向Ｖの幅Ｈ２も、ＣＯＦテープ２上の端子部３および絶縁樹脂６の配置間隔Ｐ以下となっている。たとえば、幅Ｈ２は、下流側に配設されるカメラユニット３５を加熱しないような幅となっている。さらに、幅Ｈ１と幅Ｈ２との和は、絶縁樹脂６の搬送方向Ｖの幅よりも若干大きくなっており、たとえば、配置間隔Ｐの約１／５となっている。なお、図１では、便宜上、搭載面３２ａの幅は実際よりも広く図示されている。   As shown in FIG. 1, the width H <b> 1 in the transport direction V of the mounting surface 32 a upstream from the position A at the time of pressure welding of the terminal portion 3 and the electrode portion 5 in the transport direction V is the terminal portion 3 on the COF tape 2. And the arrangement interval P of the insulating resin 6 is less than or equal to. For example, the width H1 is a width that does not heat the upstream insulating resin 6. In addition, the width H2 in the transport direction V of the mounting surface 32a downstream of the position A at the time of pressure welding of the terminal part 3 and the electrode part 5 in the transport direction V is also the same as that of the terminal part 3 and the insulating resin 6 on the COF tape 2. The arrangement interval P or less. For example, the width H2 is a width that does not heat the camera unit 35 disposed on the downstream side. Furthermore, the sum of the width H1 and the width H2 is slightly larger than the width of the insulating resin 6 in the transport direction V, for example, about 1/5 of the arrangement interval P. In FIG. 1, for the sake of convenience, the width of the mounting surface 32a is shown wider than the actual width.

テーブル側ヒータ３３は、図示を省略する加熱部を備え、搭載治具３２の図示下面に接触した状態で配設されている。テーブル側ヒータ３３に設けられた加熱部には、たとえば、鞘状の金属ケースの中に発熱体（たとえば、ニクロム線）を保持し、その隙間に熱伝導のよい高純度の無機絶縁物の粉末を充填したシースヒータを用いることができる。   The table-side heater 33 includes a heating unit (not shown) and is disposed in contact with the lower surface of the mounting jig 32. In the heating part provided in the table side heater 33, for example, a heating element (for example, nichrome wire) is held in a sheath-like metal case, and a high-purity inorganic insulating powder having good heat conduction in the gap. Can be used.

カメラユニット３５は、図１に示すように、端子部３と電極部５とが圧接接合された状態を撮影する撮像部３６と、圧接接合後のＣＯＦテープ２と撮像部３６との間に配設された光学系（図示省略）を保持する保持部３７とを備えている。また、カメラユニット３５は、基板搭載テーブル１０よりも搬送方向Ｖの下流側で、かつ、ＣＯＦテープ２の下方に配設されている。このカメラユニット３５では、撮像部３６で撮影された画像データを、図示を省略する制御部へ送信して、端子部３と電極部５との圧接接合状態の良否が判断されるようになっている。   As shown in FIG. 1, the camera unit 35 is arranged between an imaging unit 36 that captures a state in which the terminal unit 3 and the electrode unit 5 are press-welded, and between the COF tape 2 and the image-pickup unit 36 after press-welding. And a holding portion 37 that holds the optical system (not shown). The camera unit 35 is disposed downstream of the substrate mounting table 10 in the transport direction V and below the COF tape 2. In this camera unit 35, the image data photographed by the imaging unit 36 is transmitted to a control unit (not shown), and the quality of the press-contact state between the terminal unit 3 and the electrode unit 5 is determined. Yes.

撮像部３６は、ＣＣＤ（Ｃｈａｒｇｅ Ｃｏｕｐｌｅｄ Ｄｅｖｉｃｅ）等の撮像素子を備えている。この撮像部３６は、搬送方向Ｖの下流側で保持部３７に固定されている。また、保持部３７には、端子部３と電極部５とが圧接接合された状態の像を取り込む開口部３８や、プリズム（図示省略）等が保持されている。図１に示すように、開口部３８の光軸は、図示上下方向を向くとともに、搬送方向Ｖで、端子部３と電極部５との圧接接合時の位置Ａから下流側に配置間隔Ｐだけ離れた位置に配置されている。また、プリズム（図示省略）は、開口部３８から取り込まれた像を図示上下方向から搬送方向Ｖへ曲げ、撮像部３６へ導くようになっている。このように、開口部３８の光軸を、搬送方向Ｖで、端子部３と電極部５との圧接接合時の位置Ａから下流側に配置間隔Ｐだけ離れた位置に配置することで、圧接接合後、すぐに端子部３と電極部５との圧接接合部分の良否を判断できるようになっている。すなわち、圧接接合後、配置間隔Ｐだけ搬送して停止させた状態の端子部３と電極部５との圧接接合部分の良否を判断できるようになっている。   The imaging unit 36 includes an imaging element such as a CCD (Charge Coupled Device). The imaging unit 36 is fixed to the holding unit 37 on the downstream side in the transport direction V. The holding portion 37 holds an opening 38 for taking in an image in a state in which the terminal portion 3 and the electrode portion 5 are pressure-bonded, a prism (not shown), and the like. As shown in FIG. 1, the optical axis of the opening portion 38 is directed in the vertical direction in the drawing, and in the transport direction V, the arrangement interval P is downstream from the position A when the terminal portion 3 and the electrode portion 5 are joined by pressure contact. It is located at a distance. Further, the prism (not shown) is configured to bend the image taken from the opening 38 in the conveying direction V from the vertical direction in the figure and guide it to the imaging unit 36. In this way, the optical axis of the opening 38 is arranged at a position spaced apart by the arrangement interval P on the downstream side from the position A at the time of the pressure welding of the terminal part 3 and the electrode part 5 in the conveying direction V. Immediately after the joining, it is possible to judge the quality of the press-joining portion between the terminal portion 3 and the electrode portion 5. That is, it is possible to determine whether or not the press-contacting portion between the terminal portion 3 and the electrode portion 5 in the state where the terminal portion 3 and the electrode portion 5 are stopped after being transported by the arrangement interval P after the press-contacting.

（ＣＯＦテープとＩＣチップの接合方法）
以上のように構成された接合装置１では、以下のように、ＣＯＦテープ２とＩＣチップ４との接続固定が行われる。 (Joining method of COF tape and IC chip)
In the joining apparatus 1 configured as described above, the COF tape 2 and the IC chip 4 are connected and fixed as follows.

まず、振動ヘッド７の上流側で、絶縁樹脂６がＣＯＦテープ２の端子部３の周辺にポッティング（塗布）される。ポッティングされた部分は、図示を省略する基板搬送機構によって、ＣＯＦテープ２が搬送、停止を繰り返すことで、所定位置まで搬送される。すなわち、搬送方向Ｖで、振動ヘッド７に吸着保持されたＩＣチップ４に形成された電極部５の位置と、ＣＯＦテープ２上に形成された端子部３とがほぼ一致する位置に、ＣＯＦテープ２が搬送される。なお、ＣＯＦテープ２の搬送時には、振動ヘッド７は上昇した状態、かつ、搭載治具３２には下降した状態になっており、ＣＯＦテープ２の搬送を妨げないようになっている。その後、搭載治具３２が上昇して搭載面３２ａにＣＯＦテープ２が搭載される。また、図示を省略する位置合わせ用のカメラユニットを用いて、ＣＯＦテープ２の位置合わせが行われる。なお、搭載治具３２は、テーブル側ヒータ３３によって予め、たとえば、１００℃に加熱されている。   First, the insulating resin 6 is potted (applied) around the terminal portion 3 of the COF tape 2 on the upstream side of the vibration head 7. The potted portion is transported to a predetermined position by the substrate transport mechanism (not shown) repeatedly transporting and stopping the COF tape 2. That is, in the transport direction V, the position of the electrode portion 5 formed on the IC chip 4 attracted and held by the vibration head 7 and the position of the terminal portion 3 formed on the COF tape 2 are substantially coincident with each other. 2 is conveyed. When the COF tape 2 is transported, the vibration head 7 is in a raised state and is lowered in the mounting jig 32 so as not to interfere with the transport of the COF tape 2. Thereafter, the mounting jig 32 is raised and the COF tape 2 is mounted on the mounting surface 32a. Further, the alignment of the COF tape 2 is performed using an alignment camera unit (not shown). The mounting jig 32 is preheated to, for example, 100 ° C. by the table side heater 33.

一方、振動ヘッド７は、吸着面１４ｂにＩＣチップ４を保持している。より具体的には、図示を省略する反転装置が、図示を省略する細かく切断された半導体ウェハ部材から１つのＩＣチップ４を取り出して、このＩＣチップ４の表裏を反転させるとともに、ＩＣチップ４を振動ヘッド７の吸着面１４ｂまで搬送する。そして、振動ヘッド７は、吸着面１４ｂでＩＣチップ４を吸着することで、反転装置からＩＣチップ４を受け取って、吸着面１４ｂにＩＣチップ４を保持している。なお、振動ヘッド７は、ヘッド側ヒータ８によって予め、たとえば、２１０℃に加熱されている。   On the other hand, the vibration head 7 holds the IC chip 4 on the suction surface 14b. More specifically, a reversing device (not shown) takes out one IC chip 4 from a finely cut semiconductor wafer member (not shown), reverses the front and back of the IC chip 4, and It is conveyed to the suction surface 14b of the vibration head 7. The vibration head 7 sucks the IC chip 4 with the suction surface 14b, thereby receiving the IC chip 4 from the reversing device and holding the IC chip 4 on the suction surface 14b. Note that the vibration head 7 is heated to 210 ° C. in advance by the head-side heater 8, for example.

そして、ＣＯＦテープ２の位置合わせが終了すると、振動ヘッド７が下降して、吸着面１４ｂに保持されたＩＣチップ４の電極部５を端子部３に押し当て加圧しながら、端子部３と電極部５との当接部に超音波振動を加え、端子部３と電極部５とを圧接接合する。この圧接接合時に端子部３と電極部５との当接部に加えられる超音波振動の周波数は、たとえば、１０ｋＨｚから６０ｋＨｚになっている。また、端子部３と電極部５との当接部には、たとえば、５〜６ｋｇ／ｃｍ２の圧力で、たとえば、０．１〜０．３秒間（０．５秒以下）、超音波振動が加えられる。 Then, when the alignment of the COF tape 2 is completed, the vibration head 7 is lowered, and the electrode portion 5 of the IC chip 4 held on the suction surface 14b is pressed against the terminal portion 3 while being pressed. Ultrasonic vibration is applied to the contact portion with the portion 5 to press-contact the terminal portion 3 and the electrode portion 5 together. The frequency of ultrasonic vibration applied to the contact portion between the terminal portion 3 and the electrode portion 5 at the time of the pressure welding is, for example, 10 kHz to 60 kHz. In addition, the contact portion between the terminal portion 3 and the electrode portion 5 is subjected to ultrasonic vibration at a pressure of 5 to 6 kg / cm 2 , for example, for 0.1 to 0.3 seconds (0.5 seconds or less). Is added.

端子部３と電極部５とを圧接接合する際には、ヘッド側ヒータ８によって加熱された振動ヘッド７の熱がＩＣチップ４を介してＣＯＦテープ２上の絶縁樹脂６に伝達される。また、ヘッド側ヒータ８の熱が輻射熱として、ＣＯＦテープ２上の絶縁樹脂６に伝達される。さらに、テーブル側ヒータ３３によって加熱された搭載治具３２の熱がＣＯＦテープ２を介して、また、輻射熱として、ＣＯＦテープ２上の絶縁樹脂６に伝達される。そして、端子部３と電極部５との圧接接合が終了した後に（たとえば、超音波振動を約０．５秒以下加えた後に）、絶縁樹脂６が熱硬化し始めて、ＣＯＦテープ２とＩＣチップ４とが熱硬化した絶縁樹脂６によって接着接合される。絶縁樹脂６によってＣＯＦテープ２とＩＣチップ４とが接着接合されると、ＣＯＦテープ２とＩＣチップ４との接続固定が終了する。   When the terminal portion 3 and the electrode portion 5 are pressure bonded, the heat of the vibration head 7 heated by the head side heater 8 is transmitted to the insulating resin 6 on the COF tape 2 via the IC chip 4. Further, the heat of the head side heater 8 is transmitted to the insulating resin 6 on the COF tape 2 as radiant heat. Further, the heat of the mounting jig 32 heated by the table side heater 33 is transmitted to the insulating resin 6 on the COF tape 2 through the COF tape 2 and as radiant heat. Then, after the pressure bonding between the terminal portion 3 and the electrode portion 5 is completed (for example, after applying ultrasonic vibration for about 0.5 seconds or less), the insulating resin 6 begins to be thermally cured, and the COF tape 2 and the IC chip. 4 are bonded to each other by the thermally cured insulating resin 6. When the COF tape 2 and the IC chip 4 are adhesively bonded by the insulating resin 6, the connection and fixing between the COF tape 2 and the IC chip 4 is completed.

ＣＯＦテープ２とＩＣチップ４との接続固定が終了すると、振動ヘッド７は上昇し、また、搭載治具３２は下降する。そして、ＣＯＦテープ２が所定の配置間隔Ｐだけ搬送され、上記と同様に、ＣＯＦテープ２と次のＩＣチップ４との接続固定が行われる。また、カメラユニット３５によって、端子部３と電極部５との圧接接合状態の良否が判断される。   When the connection and fixing of the COF tape 2 and the IC chip 4 are completed, the vibration head 7 is raised and the mounting jig 32 is lowered. Then, the COF tape 2 is conveyed by a predetermined arrangement interval P, and the connection and fixing between the COF tape 2 and the next IC chip 4 are performed in the same manner as described above. Further, the camera unit 35 determines whether or not the press-contact bonding state between the terminal portion 3 and the electrode portion 5 is good.

（本形態の主な効果）
以上説明したように、本形態の接合装置１では、基板搭載テーブル１０の搭載治具３２に、ＣＯＦテープ２の搬送方向Ｖにおける端子部３と電極部５との圧接接合時の位置Ａよりも上流側に、端子部３と電極部５との圧接接合前の絶縁樹脂６の熱硬化を防止するため、搭載面３２ａから窪んだ窪み部３２ｂが形成されている。また、本形態の接合装置１では、搬送方向Ｖにおける端子部３と電極部５との圧接接合時の位置Ａより上流側の搭載面３２ａの搬送方向Ｖの幅Ｈ１は、ＣＯＦテープ２上の端子部３および絶縁樹脂６の配置間隔Ｐ以下となっている。 (Main effects of this form)
As described above, in the bonding apparatus 1 of the present embodiment, the mounting jig 32 of the substrate mounting table 10 is placed on the mounting jig 32 more than the position A at the time of the pressure bonding of the terminal portion 3 and the electrode portion 5 in the transport direction V of the COF tape 2. In order to prevent thermosetting of the insulating resin 6 before the pressure bonding of the terminal portion 3 and the electrode portion 5, a recessed portion 32 b that is recessed from the mounting surface 32 a is formed on the upstream side. Further, in the bonding apparatus 1 of the present embodiment, the width H1 in the transport direction V of the mounting surface 32a upstream from the position A at the time of pressure welding of the terminal portion 3 and the electrode unit 5 in the transport direction V is on the COF tape 2. The arrangement interval P between the terminal portion 3 and the insulating resin 6 is less than or equal to P.

そのため、ＩＣチップ４をＣＯＦテープ２に接合するため、テーブル側ヒータ３３によって予め加熱された搭載治具３２を上昇させても、圧接接合時の位置Ａより上流側では、ＣＯＦテープ２と搭載面３２ａとの接触を防止することができる。したがって、端子部３と電極部５との圧接接合時に、圧接接合時の位置Ａよりも上流側に位置する絶縁樹脂６が硬化するのを防止することができる。すなわち、テーブル側ヒータ３３で加熱された搭載面３２ａの熱の影響で、端子部３と電極部５との圧接接合前に、ＣＯＦテープ２上に配設された絶縁樹脂６が硬化するのを防止することができる。その結果、硬化した絶縁樹脂６の影響で、端子部３と電極部５との圧接接合が妨げられることがなく、端子部３と当接する電極部５の当接面あるいは、電極部５と当接する端子部３の当接面に形成される酸化被膜や汚れを取り除いた状態で、端子部３と電極部５とを接合させることができ、端子部３と電極部５との導通を安定させることができる。また、端子部３と電極部５とを圧接接合させた直後に、テーブル側ヒータ３３で加熱された搭載面３２ａ等の熱によって、絶縁樹脂６を硬化させて、ＣＯＦテープ２とＩＣチップ４とを接着接合することが可能になる。そのため、ＣＯＦテープ２とＩＣチップ４との接合強度を確保することができ、端子部３と電極部５との導通を安定させることができる。すなわち、本形態の接合装置１では、適切に、端子部３と電極部５とを振動を利用して圧接接合するとともに、絶縁樹脂６によって、ＣＯＦテープ２とＩＣチップ４とを接着接合することができる。   Therefore, in order to join the IC chip 4 to the COF tape 2, even if the mounting jig 32 heated in advance by the table-side heater 33 is raised, the COF tape 2 and the mounting surface are positioned upstream from the position A at the time of pressure welding. Contact with 32a can be prevented. Therefore, it is possible to prevent the insulating resin 6 positioned upstream from the position A at the time of the pressure welding at the time of the pressure welding of the terminal portion 3 and the electrode portion 5 from being cured. In other words, the insulating resin 6 disposed on the COF tape 2 is cured before the press contact between the terminal portion 3 and the electrode portion 5 due to the heat of the mounting surface 32a heated by the table side heater 33. Can be prevented. As a result, the contact between the terminal portion 3 and the electrode portion 5 is not hindered by the influence of the cured insulating resin 6, and the contact surface of the electrode portion 5 that contacts the terminal portion 3 or the electrode portion 5 is not contacted. The terminal part 3 and the electrode part 5 can be joined with the oxide film and dirt formed on the contact surface of the terminal part 3 in contact removed, and the conduction between the terminal part 3 and the electrode part 5 is stabilized. be able to. Further, immediately after the terminal portion 3 and the electrode portion 5 are pressure-welded, the insulating resin 6 is cured by heat of the mounting surface 32a heated by the table side heater 33, and the COF tape 2 and the IC chip 4 Can be adhesively bonded. Therefore, the bonding strength between the COF tape 2 and the IC chip 4 can be ensured, and conduction between the terminal portion 3 and the electrode portion 5 can be stabilized. That is, in the bonding apparatus 1 of this embodiment, the terminal unit 3 and the electrode unit 5 are appropriately pressure-bonded using vibration, and the COF tape 2 and the IC chip 4 are bonded and bonded by the insulating resin 6. Can do.

本形態において、搭載治具３２の窪み部３２ｂでは、搭載面３２ａの上流側端３２ａ１から搭載面３２ａに直交する直交面３２ｃが形成されている。そのため、絶縁樹脂６へ伝達されるテーブル側ヒータ３３からの輻射熱の量を抑制し、端子部３と電極部５との圧接接合前の絶縁樹脂６の熱硬化を効果的に防止することができる。すなわち、窪み部３２ｂで、搭載面３２ａの上流側端３２ａ１から上流側に向かって傾斜する傾斜面を形成する場合に、この傾斜面から絶縁樹脂６に伝達される輻射熱の量に比べ、直交面３２ｃから絶縁樹脂６へ伝達される輻射熱の量を抑制することができる。その結果、端子部３と電極部５との圧接接合前の絶縁樹脂６の熱硬化を効果的に防止することができる。   In this embodiment, in the recess 32b of the mounting jig 32, an orthogonal surface 32c orthogonal to the mounting surface 32a is formed from the upstream end 32a1 of the mounting surface 32a. Therefore, the amount of radiant heat from the table-side heater 33 transmitted to the insulating resin 6 can be suppressed, and the thermosetting of the insulating resin 6 before the press contact bonding between the terminal portion 3 and the electrode portion 5 can be effectively prevented. . That is, in the case of forming an inclined surface that is inclined toward the upstream side from the upstream end 32a1 of the mounting surface 32a in the recess 32b, the orthogonal surface is compared with the amount of radiant heat transmitted from the inclined surface to the insulating resin 6. The amount of radiant heat transmitted from 32c to the insulating resin 6 can be suppressed. As a result, it is possible to effectively prevent the thermosetting of the insulating resin 6 before the press contact bonding between the terminal portion 3 and the electrode portion 5.

（他の実施の形態）
上述した形態は、本発明の好適な形態の一例ではあるが、これに限定されるものではなく本発明の要旨を変更しない範囲において種々変形可能である。たとえば、上述した形態では、搭載治具３２には、搬送方向Ｖにおける端子部３と電極部５との圧接接合時の位置Ａよりも上流側に窪んだ窪み部３２ｂが形成されている。しかし、搭載治具は、図９に示すように、窪み部が形成されていない直方体形状の搭載治具４２であっても良い。なお、この場合にも、上述した実施の形態と同様に、搬送方向Ｖにおける端子部３と電極部５との圧接接合時の位置Ａより上流側の搭載面４２ａの搬送方向Ｖの幅Ｈ１は、ＣＯＦテープ２上の端子部３および絶縁樹脂６の配置間隔Ｐ以下となっていることが好ましい。 (Other embodiments)
The above-described embodiment is an example of a preferred embodiment of the present invention, but is not limited thereto, and various modifications can be made without departing from the scope of the present invention. For example, in the above-described form, the mounting jig 32 is formed with a recessed portion 32b that is recessed upstream from the position A when the terminal portion 3 and the electrode portion 5 are joined in the conveying direction V. However, as shown in FIG. 9, the mounting jig may be a rectangular parallelepiped mounting jig 42 in which no depression is formed. In this case as well, as in the above-described embodiment, the width H1 in the transport direction V of the mounting surface 42a on the upstream side from the position A at the time of pressure welding of the terminal portion 3 and the electrode portion 5 in the transport direction V is as follows. It is preferable that the distance between the terminal portion 3 and the insulating resin 6 on the COF tape 2 is equal to or less than the arrangement interval P.

なお、搬送方向Ｖにおける端子部３と電極部５との圧接接合時の位置Ａより上流側の搭載面３２ａ、４２ａの搬送方向Ｖの幅Ｈ１は、以下のようにすることがより好ましい。すなわち、図１０に示すように、搭載面３２ａ、４２ａの搬送方向Ｖの幅Ｈ１は、圧接接合時の位置Ａに配置された絶縁樹脂６に搬送方向Ｖの上流側で隣接する絶縁樹脂６の下流側端６ａと圧接接合時の位置Ａとの距離Ｐ１以下とすることがより好ましい。このように構成すると、より確実に端子部３と電極部５との圧接接合前の絶縁樹脂６の硬化を防止することができる。また、搭載面３２ａ、４２ａの搬送方向Ｖの幅Ｈ１は、圧接接合時の位置Ａに配置された絶縁樹脂６の上流側端６ｂと圧接接合時の位置Ａの距離Ｐ２以上とすることが好ましい。このように構成すると、端子部３と電極部５との圧接接合後に絶縁樹脂６をより確実に硬化させることができる。   In addition, it is more preferable that the width H1 in the transport direction V of the mounting surfaces 32a and 42a upstream from the position A at the time of pressure welding of the terminal portion 3 and the electrode portion 5 in the transport direction V is as follows. That is, as shown in FIG. 10, the width H1 of the mounting surfaces 32a and 42a in the transport direction V is equal to that of the insulating resin 6 adjacent to the insulating resin 6 disposed at the position A at the time of pressure welding on the upstream side in the transport direction V. It is more preferable to set the distance P1 or less between the downstream end 6a and the position A at the time of pressure welding. If comprised in this way, hardening of the insulating resin 6 before the press-contact joining of the terminal part 3 and the electrode part 5 can be prevented more reliably. Further, the width H1 of the mounting surfaces 32a and 42a in the transport direction V is preferably equal to or greater than the distance P2 between the upstream end 6b of the insulating resin 6 disposed at the position A at the time of pressure welding and the position A at the time of pressure welding. . If comprised in this way, the insulation resin 6 can be hardened more reliably after the press-contact joining of the terminal part 3 and the electrode part 5. FIG.

また、上述した形態では、端子部３と電極部５との圧接接合時の位置Ａより下流側の搭載面３２ａの搬送方向Ｖの幅Ｈ２は、ＣＯＦテープ２上の端子部３および絶縁樹脂６の配置間隔Ｐ以下となっている。しかし、搭載面３２ａの幅Ｈ２は、配置間隔Ｐより大きくても良い。この場合には、カメラユニット３５を上述した形態よりも下流側に配設して、端子部３と電極部５との圧接接合状態の良否を判断することができる。   In the above-described form, the width H2 in the transport direction V of the mounting surface 32a downstream from the position A at the time of pressure welding of the terminal portion 3 and the electrode portion 5 is equal to the terminal portion 3 on the COF tape 2 and the insulating resin 6. Is less than or equal to the arrangement interval P. However, the width H2 of the mounting surface 32a may be larger than the arrangement interval P. In this case, the camera unit 35 can be disposed on the downstream side of the above-described configuration, and it can be determined whether or not the pressure contact state between the terminal portion 3 and the electrode portion 5 is good.

さらに、上述した形態では、搭載治具３２の窪み部３２ｂで、搭載面３２ａの上流側端３２ａ１から搭載面３２ａに直交する直交面３２ｃが形成されている。しかし、窪み部３２ｂで、搭載面３２ａの上流側端３２ａ１から上流側に向かって、かつ、図１の下方向に向かって傾斜する傾斜面を形成しても良い。   Further, in the above-described form, an orthogonal surface 32c orthogonal to the mounting surface 32a is formed from the upstream end 32a1 of the mounting surface 32a in the recess 32b of the mounting jig 32. However, an inclined surface that is inclined from the upstream end 32a1 of the mounting surface 32a toward the upstream side and downward in FIG.

さらにまた、上述した形態では、基板２は、長尺状に形成されたＣＯＦテープ２であったが、基板２は、長尺状には形成されず予め分割されていても良い。この場合には、分割された基板２を所定の搬送方向Ｖへ搬送後、停止させた状態で、端子部３と電極部５との圧接接合および絶縁樹脂６による接着接合が行われる。なお、この場合であっても、搬送方向Ｖにおける端子部３と電極部５との圧接接合時の位置Ａより上流側の搭載面３２ａ、４２ａの搬送方向Ｖの幅Ｈ１は、搬送方向Ｖで隣接する基板２に配設された絶縁樹脂の配置間隔以下になっている。   Furthermore, in the above-described embodiment, the substrate 2 is the COF tape 2 formed in a long shape, but the substrate 2 may not be formed in a long shape and may be divided in advance. In this case, after the divided substrate 2 is transported in the predetermined transport direction V, the terminal portion 3 and the electrode portion 5 are joined by pressure welding and the adhesive resin 6 is bonded and bonded in a stopped state. Even in this case, the width H1 in the transport direction V of the mounting surfaces 32a and 42a on the upstream side from the position A at the time of pressure welding of the terminal part 3 and the electrode part 5 in the transport direction V is the transport direction V. It is less than the arrangement interval of the insulating resin arranged on the adjacent substrate 2.

また、上述した形態では、絶縁樹脂６は、熱硬化前の状態がペースト状態となっているＮＣＰであったが、絶縁樹脂６は、ＮＣＦ（Ｎｏｎ Ｃｏｎｄｕｃｔｉｖｅ Ｆｉｌｍ）であっても良い。さらにまた、基板２は、フレキシブルな樹脂基板には限定されず、セラミックス等の硬度の高い基板であっても、本発明の構成を適用することは可能である。また、基板２に接合される電子部品４は、ＩＣチップには限定されず、表面弾性波素子、抵抗素子等の他の電子部品であっても良い。   In the embodiment described above, the insulating resin 6 is an NCP in which the state before thermosetting is in a paste state, but the insulating resin 6 may be an NCF (Non Conductive Film). Furthermore, the board | substrate 2 is not limited to a flexible resin board | substrate, Even if it is a board | substrate with high hardness, such as ceramics, it is possible to apply the structure of this invention. The electronic component 4 bonded to the substrate 2 is not limited to an IC chip, and may be another electronic component such as a surface acoustic wave element or a resistance element.

また、上述した形態では、端子部３と電極部５との圧接接合が終了した後に、絶縁樹脂６が熱硬化し始めて、ＣＯＦテープ２とＩＣチップ４とが熱硬化した絶縁樹脂６によって接着接合されるように構成されている。しかし、端子部３と電極部５とを圧接接合させながら、絶縁樹脂６が熱硬化し始めるように構成しても良い。すなわち、端子部３と電極部５との圧接接合とほぼ同時に絶縁樹脂６が熱硬化し始めるように構成しても良い。   In the above-described embodiment, the insulation resin 6 begins to be thermally cured after the press-contact joining between the terminal portion 3 and the electrode portion 5 is completed, and the COF tape 2 and the IC chip 4 are adhesively joined by the insulation resin 6 that is thermally cured. It is configured to be. However, the insulating resin 6 may be configured to start thermosetting while the terminal portion 3 and the electrode portion 5 are pressure-bonded to each other. In other words, the insulating resin 6 may be configured to start to thermoset substantially simultaneously with the press-contact joining between the terminal portion 3 and the electrode portion 5.

本発明の実施の形態にかかる電子部品の接合装置の主要部の概略構成を示す側面図である。It is a side view showing a schematic structure of the principal part of a joining device of electronic parts concerning an embodiment of the invention. 図１の矢印Ｘ方向から接合装置の主要部の概略構成を示す図である。It is a figure which shows schematic structure of the principal part of a joining apparatus from the arrow X direction of FIG. 図１の矢印Ｙ方向から接合装置の主要部の概略構成を示す図である。It is a figure which shows schematic structure of the principal part of a joining apparatus from the arrow Y direction of FIG. 本発明の実施の形態にかかる電子部品の接合前後の基板を示す平面図である。It is a top view which shows the board | substrate before and behind joining of the electronic component concerning embodiment of this invention. 本発明の実施の形態にかかる基板と電子部品との接合状態を示す部分拡大断面図である。It is a partial expanded sectional view which shows the joining state of the board | substrate and electronic component concerning embodiment of this invention. 本発明の実施の形態にかかるヘッド側ヒータを示す斜視図である。It is a perspective view which shows the head side heater concerning embodiment of this invention. 図３のＺ部を拡大して示す部分拡大断面図である。It is a partial expanded sectional view which expands and shows the Z section of FIG. 図７のＷ−Ｗ断面を示す部分拡大断面図である。It is a partial expanded sectional view which shows the WW cross section of FIG. 本発明の他の実施の形態にかかる搭載治具とその周辺の構成を示す拡大側面図である。It is an expanded side view which shows the mounting jig concerning other embodiment of this invention, and the structure of the periphery. 本発明の他の実施の形態にかかる搭載治具の構成を説明するための説明図である。It is explanatory drawing for demonstrating the structure of the mounting jig concerning other embodiment of this invention.

符号の説明Explanation of symbols

１ 接合装置
２ ＣＯＦテープ（基板）
３ 端子部
４ ＩＣチップ（電子部品）
５ 電極部
６ 絶縁樹脂
７ 振動ヘッド
１０ 基板搭載テーブル
３２ 搭載治具
３２ａ 搭載面
３２ａ１ 上流側端
３２ｂ 窪み部
３２ｃ 直交面
３３ テーブル側ヒータ（ヒータ）
Ａ 圧接接合時の位置
Ｐ 配置間隔
Ｖ 搬送方向 1 Joining device 2 COF tape (substrate)
3 Terminal 4 IC chip (electronic component)
DESCRIPTION OF SYMBOLS 5 Electrode part 6 Insulation resin 7 Vibration head 10 Board | substrate mounting table 32 Mounting jig 32a Mounting surface 32a1 Upstream side end 32b Indentation part 32c Right angle 33 Table side heater (heater)
A Position at pressure welding P Arrangement interval V Transport direction

Claims (3)

基板に形成された端子部と電子部品に形成された電極部との圧接接合を行う振動ヘッドと、上記端子部と上記電極部との圧接接合時に上記基板が搭載される基板搭載テーブルとを備え、上記基板と上記電子部品とを接続固定する電子部品の接合装置において、
上記基板搭載テーブルは、上記基板が搭載される搭載面が形成された搭載治具と、上記基板上に配設された熱硬化性の絶縁樹脂を硬化させて上記基板と上記電子部品との接着接合を行うため、上記搭載治具を加熱するテーブル側ヒータとを備え、
上記端子部と上記電極部との圧接接合および上記絶縁樹脂による接着接合は、所定の搬送方向へ上記基板を搬送後、停止させた状態で行われるように構成され、
上記搭載治具には、上記搬送方向における上記端子部と上記電極部との圧接接合時の位置よりも上流側に、上記端子部と上記電極部との圧接接合前の上記絶縁樹脂の熱硬化を防止するため、上記搭載面から窪んだ窪み部が形成され、
上記基板上に配設された熱硬化性の絶縁樹脂を加熱するヘッド側ヒータを備えた上記振動ヘッドが支持部材に取り付けられ、
上記端子部と上記電極部とが圧接接合される位置より上記基板の搬送方向の上流側で上記基板上に配設された熱硬化性の絶縁樹脂を上記ヘッド側ヒータで加熱しないように断熱板が上記支持部材に取り付けられ、
上記端子部と上記電極部とを上記テーブル側ヒータと上記ヘッド側ヒータとによって加熱し、かつ上記端子部と上記電極部とを振動を利用して圧接接合するとともに、上記絶縁樹脂によって、上記基板と上記電子部品とを接着接合する
ことを特徴とする電子部品の接合装置。 A vibration head that performs pressure contact bonding between a terminal portion formed on a substrate and an electrode portion formed on an electronic component, and a substrate mounting table on which the substrate is mounted at the time of pressure contact bonding between the terminal portion and the electrode portion. In the electronic component joining apparatus for connecting and fixing the substrate and the electronic component ,
The upper SL substrate mounting table, the mounting surface where the substrate is mounted is formed mounting jig and, curing the arranged thermoset insulating resin on the substrate between the substrate and the electronic component In order to perform adhesive bonding, a table side heater for heating the mounting jig is provided,
The pressure bonding of the terminal portion and the electrode portion and the adhesive bonding with the insulating resin are configured to be performed in a state where the substrate is stopped after being transferred in a predetermined transfer direction,
In the mounting jig, on the upstream side of the position at the time of pressure welding of the terminal portion and the electrode portion in the transport direction, the thermosetting of the insulating resin before the pressure welding of the terminal portion and the electrode portion. In order to prevent this, a hollow portion recessed from the mounting surface is formed,
The vibration head provided with a head-side heater for heating a thermosetting insulating resin disposed on the substrate is attached to a support member,
A heat insulating plate so as not to heat the thermosetting insulating resin disposed on the substrate upstream of the position where the terminal portion and the electrode portion are pressure-welded to each other in the transport direction of the substrate by the head heater. Is attached to the support member,
The terminal portion and the electrode portion are heated by the table-side heater and the head-side heater, and the terminal portion and the electrode portion are pressure-welded using vibrations, and the substrate is formed by the insulating resin. A bonding apparatus for electronic parts, wherein the electronic part and the electronic parts are bonded together. 前記窪み部では、前記搬送方向における前記搭載面の上流側端から該搭載面に直交する直交面が形成されていることを特徴とする請求項１記載の電子部品の接合装置。   The electronic component joining apparatus according to claim 1, wherein an orthogonal surface orthogonal to the mounting surface is formed from an upstream end of the mounting surface in the transport direction in the recess portion. 基板に形成された端子部と電子部品に形成された電極部との圧接接合を行う振動ヘッドと、上記端子部と上記電極部との圧接接合時に上記基板が搭載される基板搭載テーブルとを備え、上記基板と上記電子部品とを接続固定する電子部品の接合装置において、
上記基板搭載テーブルは、上記基板が搭載される搭載面が形成された搭載治具と、上記基板上に配設された熱硬化性の絶縁樹脂を硬化させて上記基板と上記電子部品との接着接合を行うため、上記搭載治具を加熱するテーブル側ヒータとを備え、
上記基板上に配設された熱硬化性の絶縁樹脂を加熱するヘッド側ヒータを備えた上記振動ヘッドが支持部材に取り付けられ、
上記端子部と上記電極部とが圧接接合される位置より上記基板の搬送方向の上流側で上記基板上に配設された熱硬化性の絶縁樹脂を上記ヘッド側ヒータで加熱しないように断熱板が上記支持部材に取り付けられ、
上記端子部と上記電極部との圧接接合および上記絶縁樹脂による接着接合は、所定の搬送方向へ上記基板を搬送後、停止させた状態で行われるように構成され、
上記基板の搬送方向には、所定の配置間隔で上記絶縁樹脂が配設され、
上記搬送方向における上記端子部と上記電極部との圧接接合時の位置より上流側の上記搭載面の上記搬送方向の幅は、上記絶縁樹脂の配置間隔以下に形成され、
上記端子部と上記電極部とを上記テーブル側ヒータと上記ヘッド側ヒータとによって加熱し、かつ上記端子部と上記電極部とを振動を利用して圧接接合するとともに、上記絶縁樹脂によって、上記基板と上記電子部品とを接着接合する
ことを特徴とする電子部品の接合装置。 A vibration head that performs pressure contact bonding between a terminal portion formed on a substrate and an electrode portion formed on an electronic component, and a substrate mounting table on which the substrate is mounted at the time of pressure contact bonding between the terminal portion and the electrode portion. In the electronic component joining apparatus for connecting and fixing the substrate and the electronic component ,
The upper SL substrate mounting table, the mounting surface where the substrate is mounted is formed mounting jig and, curing the arranged thermoset insulating resin on the substrate between the substrate and the electronic component In order to perform adhesive bonding, a table side heater for heating the mounting jig is provided,
The vibration head provided with a head-side heater for heating a thermosetting insulating resin disposed on the substrate is attached to a support member,
A heat insulating plate so as not to heat the thermosetting insulating resin disposed on the substrate upstream of the position where the terminal portion and the electrode portion are pressure-welded to each other in the transport direction of the substrate by the head heater. Is attached to the support member,
The pressure bonding of the terminal portion and the electrode portion and the adhesive bonding with the insulating resin are configured to be performed in a state where the substrate is stopped after being transferred in a predetermined transfer direction,
In the transport direction of the substrate, the insulating resin is disposed at a predetermined arrangement interval,
The width in the transport direction of the mounting surface on the upstream side from the position at the time of pressure welding between the terminal portion and the electrode portion in the transport direction is formed to be equal to or less than the arrangement interval of the insulating resin,
The terminal portion and the electrode portion are heated by the table-side heater and the head-side heater, and the terminal portion and the electrode portion are pressure-welded using vibrations, and the substrate is formed by the insulating resin. A bonding apparatus for electronic parts, wherein the electronic part and the electronic parts are bonded together.
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