JP4683226B2 - アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法 - Google Patents
アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法 Download PDFInfo
- Publication number
- JP4683226B2 JP4683226B2 JP2006088889A JP2006088889A JP4683226B2 JP 4683226 B2 JP4683226 B2 JP 4683226B2 JP 2006088889 A JP2006088889 A JP 2006088889A JP 2006088889 A JP2006088889 A JP 2006088889A JP 4683226 B2 JP4683226 B2 JP 4683226B2
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- film
- actuator device
- layer
- zirconium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 40
- 238000000034 method Methods 0.000 title claims description 27
- 239000007788 liquid Substances 0.000 title claims description 15
- 229910052726 zirconium Inorganic materials 0.000 claims description 45
- 239000013078 crystal Substances 0.000 claims description 42
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 41
- 239000012212 insulator Substances 0.000 claims description 34
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 28
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 238000004544 sputter deposition Methods 0.000 claims description 14
- 230000003647 oxidation Effects 0.000 claims description 8
- 238000007254 oxidation reaction Methods 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- 238000002441 X-ray diffraction Methods 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 51
- 239000000463 material Substances 0.000 description 16
- 230000001681 protective effect Effects 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 238000001878 scanning electron micrograph Methods 0.000 description 14
- 239000002245 particle Substances 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000004891 communication Methods 0.000 description 7
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 150000003754 zirconium Chemical class 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000000018 DNA microarray Methods 0.000 description 1
- 208000016169 Fish-eye disease Diseases 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical class O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/055—Devices for absorbing or preventing back-pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14419—Manifold
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Description
かかる第1の態様では、結晶性に優れ且つ粒径が整ったジルコニウム層を形成でき、このように形成したジルコニウム層を所定の条件下で熱酸化することで、下側の膜である酸化シリコンからなる弾性膜との密着性に優れた絶縁体膜を形成することができる。
かかる第2の態様では、酸化ジルコニウム層は結晶が所定の優先配向しており、その所定の配向が(−111)面に優先配向していることで、下側の膜との密着性がさらに優れた絶縁体膜とすることができる。
(実施形態1)
図1は、本発明の実施形態1に係るアクチュエータ装置を備えたインクジェット式記録ヘッドを示す分解斜視図であり、図2は、図1の平面図及び断面図である。図示するように、本発明における基板の一例である流路形成基板10は、本実施形態では面方位(110)のシリコン単結晶基板からなり、その一方の面には予め熱酸化により形成した二酸化シリコンからなる、厚さ1〜2μmの弾性膜50が形成されている。流路形成基板10には、複数の圧力発生室12がその幅方向に並設されている。また、流路形成基板10の圧力発生室12の長手方向外側の領域には連通部13が形成され、連通部13と各圧力発生室12とが、各圧力発生室12毎に設けられたインク供給路14を介して連通されている。なお、連通部13は、後述する保護基板のリザーバ部と連通して各圧力発生室12の共通のインク室となるリザーバの一部を構成する。インク供給路14は、圧力発生室12よりも狭い幅で形成されており、連通部13から圧力発生室12に流入するインクの流路抵抗を一定に保持している。
上述したインクジェット式記録ヘッドの製造において、弾性膜50上に、DCスパッタリングにより、成膜温度を室温とし、パワー密度を5kW/m2、スパッタ圧力0.5Paで成膜したジルコニウム層を形成し、その後、20℃/秒の昇温レートで加熱し、900℃で5分間保持するという条件で熱酸化して酸化ジルコニウムからなる絶縁体膜55を形成した。
成膜温度を150℃とした以外は実施例と同様にしてジルコニウム層を形成し、その後、実施例と同様な条件で熱酸化して酸化ジルコニウムからなる絶縁体膜55を形成した。
成膜温度を室温、出力1kWで、パワー密度を10kW/m2、スパッタ圧力4Paで成膜したジルコニウム層を形成し、その後、実施例と同様な条件で熱酸化して酸化ジルコニウムからなる絶縁体膜55を形成した。
成膜温度を150℃とした以外は比較例2と同様にしてジルコニウム層を形成し、その後、比較例2と同様な条件で熱酸化して酸化ジルコニウムからなる絶縁体膜55を形成した。
実施例及び比較例1〜3の半価幅と密着力を図10に示す。
この結果と図6〜図9から明らかなように、実施例のように、結晶粒径の平均が20〜50nmであり且つXRDパターンの(002)面ピークの半価幅が0.4以下であるジルコニウム層を形成すると、下面から上面まで連続的な柱状結晶を有する酸化ジルコニウム層を形成することができることがわかった。一方、比較例1のように半価幅が小さくても粒径が50nmを超えるものについては、酸化ジルコニウム層の密着力が小さいことがわかった。また、ジルコニウム層の粒径がさらに大きくなると、半価幅が大きくても(比較例2)、小さくても(比較例3)、酸化ジルコニウム層の密着力が小さいことが確認された。
以上、本発明の各実施形態を説明したが、本発明は、上述した実施形態に限定されるものではない。例えば、上述の実施形態では、弾性膜50上に絶縁体膜55を形成するようにしたが、絶縁体膜55は、弾性膜50よりも圧電体層70側に設けられていればよく、例えば、弾性膜50と絶縁体膜55との間に他の層が設けられていてもよい。また、上述した実施形態においては、液体噴射ヘッドの一例としてインクジェット式記録ヘッドを例示して本発明を説明したが、液体噴射ヘッドの基本的構成は上述したものに限定されるものではない。本発明は、広く液体噴射ヘッドの全般を対象としたものであり、インク以外の液体を噴射するものにも勿論適用することができる。その他の液体噴射ヘッドとしては、例えば、プリンタ等の画像記録装置に用いられる各種の記録ヘッド、液晶ディスプレー等のカラーフィルタの製造に用いられる色材噴射ヘッド、有機ELディスプレー、FED(面発光ディスプレー)等の電極形成に用いられる電極材料噴射ヘッド、バイオchip製造に用いられる生体有機物噴射ヘッド等が挙げられる。
Claims (9)
- 酸化シリコンからなる弾性膜を形成する工程と、
前記弾性膜上に、成膜温度が室温〜100℃、スパッタ圧力が0.3〜1Pa、パワー密度が1〜20kW/m 2 の条件で、柱状結晶を有し、表面の結晶粒径の平均が20〜50nmであり且つXRDパターンの(002)面ピークの半価幅が0.4以下のジルコニウム層をスパッタリング法により形成する工程と、
前記ジルコニウム層を前記結晶粒径の平均が維持されるように熱酸化させることにより、柱状結晶からなり、表面の結晶粒径の平均が20〜50nmである酸化ジルコニウムからなる絶縁体膜を形成する工程と、
前記絶縁体膜上に、下電極、圧電体層および上電極を有する圧電素子を形成する工程と、を備えることを特徴とするアクチュエータ装置の製造方法。 - 前記酸化ジルコニウム層は、(−111)面に優先配向していることを特徴とする請求項1に記載のアクチュエータ装置の製造方法。
- 前記下電極は、白金およびイリジウムからなることを特徴とする請求項1又は2に記載のアクチュエータ装置の製造方法。
- 前記パワー密度が、5kW/m 2 であることを特徴とする請求項1〜3の何れか一項に記載のアクチュエータ装置の製造方法。
- 前記ジルコニウム層を、600〜1000℃に加熱した拡散炉内に300mm/min以上のスピードで挿入し、昇温レートを20℃/秒として熱酸化させることを特徴とする請求項1〜4の何れか一項に記載のアクチュエータ装置の製造方法。
- 前記熱酸化において、900℃で5分間保持することを特徴とする請求項5に記載のアクチュエータ装置の製造方法。
- 前記ジルコニウム層の結晶粒径は、30nmであることを特徴とする請求項1〜6の何れか一項に記載のアクチュエータ装置の製造方法。
- 前記絶縁体膜と前記弾性膜との密着性が、350mNを超えていることを特徴とする請求項1〜7の何れか一項に記載のアクチュエータ装置の製造方法。
- 請求項1〜8の何れか一項に記載のアクチュエータ装置の製造方法によりアクチュエータ装置を製造する工程を有することを特徴とする液体噴射ヘッドの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006088889A JP4683226B2 (ja) | 2006-03-28 | 2006-03-28 | アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法 |
US11/692,037 US7827658B2 (en) | 2006-03-28 | 2007-03-27 | Method for manufacturing actuator device and liquid ejecting head including actuator device prepared by the method |
CN200710088474A CN100577424C (zh) | 2006-03-28 | 2007-03-27 | 促动器装置的制造方法及液体喷射头 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006088889A JP4683226B2 (ja) | 2006-03-28 | 2006-03-28 | アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007266274A JP2007266274A (ja) | 2007-10-11 |
JP4683226B2 true JP4683226B2 (ja) | 2011-05-18 |
Family
ID=38556756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006088889A Expired - Fee Related JP4683226B2 (ja) | 2006-03-28 | 2006-03-28 | アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7827658B2 (ja) |
JP (1) | JP4683226B2 (ja) |
CN (1) | CN100577424C (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5083499B2 (ja) * | 2006-11-13 | 2012-11-28 | セイコーエプソン株式会社 | アクチュエータ装置の製造方法及び液体噴射ヘッド |
JP2009196354A (ja) * | 2008-01-21 | 2009-09-03 | Seiko Epson Corp | 液体噴射ヘッドの製造方法及び液体噴射装置 |
JP2010021375A (ja) * | 2008-07-10 | 2010-01-28 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置並びに圧電素子 |
US7944121B2 (en) * | 2008-08-21 | 2011-05-17 | The United States Of America As Represented By The Secretary Of The Army | Negative vertical deflection piezoelectric MEMS actuators and method of fabrication |
US8237334B2 (en) | 2009-04-22 | 2012-08-07 | Parker-Hannifin Corporation | Piezo actuator |
CN101564935B (zh) * | 2009-04-29 | 2010-06-02 | 哈尔滨工业大学 | 纺织喷印用氧化锆陶瓷喷嘴的制造方法 |
JP2012020422A (ja) * | 2010-07-12 | 2012-02-02 | Seiko Epson Corp | 液体噴射ヘッド、液体噴射ヘッドユニット及び液体噴射装置 |
JP2012059770A (ja) * | 2010-09-06 | 2012-03-22 | Seiko Epson Corp | 圧電素子、液滴噴射ヘッドおよび液滴噴射装置ならびにそれらの製造方法 |
US8866367B2 (en) | 2011-10-17 | 2014-10-21 | The United States Of America As Represented By The Secretary Of The Army | Thermally oxidized seed layers for the production of {001} textured electrodes and PZT devices and method of making |
US9761785B2 (en) | 2011-10-17 | 2017-09-12 | The United States Of America As Represented By The Secretary Of The Army | Stylo-epitaxial piezoelectric and ferroelectric devices and method of manufacturing |
US9254651B2 (en) * | 2012-03-27 | 2016-02-09 | Seiko Epson Corporation | Liquid ejecting head, liquid ejecting apparatus, piezoelectric element, and methods of manufacturing liquid ejecting head, liquid ejecting apparatus, and piezoelectric element |
CA2791935A1 (en) * | 2012-03-30 | 2013-09-30 | Disternet Technology, Inc. | Transcoding system and method |
KR20150023086A (ko) * | 2013-08-22 | 2015-03-05 | (주)와이솔 | 압전 소자 기반 진동 모듈 |
US9970831B2 (en) | 2014-02-10 | 2018-05-15 | Texas Instruments Incorporated | Piezoelectric thin-film sensor |
CN106541706B (zh) * | 2016-09-30 | 2019-04-16 | 西安交通大学 | 一种直通式压电喷墨打印头及其制造方法 |
JP7275743B2 (ja) | 2019-03-27 | 2023-05-18 | セイコーエプソン株式会社 | 液体吐出ヘッドおよびプリンター |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1126296A (ja) * | 1997-06-30 | 1999-01-29 | Tdk Corp | 膜構造体、電子デバイス、記録媒体および酸化物導電性薄膜の製造方法 |
JP2005176433A (ja) * | 2003-12-08 | 2005-06-30 | Seiko Epson Corp | アクチュエータ装置及び液体噴射ヘッド並びに液体噴射装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3734176B2 (ja) | 1995-04-03 | 2006-01-11 | セイコーエプソン株式会社 | インクジェット記録用プリンタヘッドの製造方法及びアクチュエータの製造方法 |
JPH11204849A (ja) | 1998-01-20 | 1999-07-30 | Ricoh Co Ltd | 圧電アクチュエータ |
JP2005236337A (ja) * | 2001-05-11 | 2005-09-02 | Ube Ind Ltd | 薄膜音響共振器及びその製造方法 |
US7411339B2 (en) * | 2003-11-28 | 2008-08-12 | Seiko Epson Corporation | Manufacturing method of actuator device and liquid jet apparatus provided with actuator device formed by manufacturing method of the same |
JP4645024B2 (ja) | 2003-11-28 | 2011-03-09 | セイコーエプソン株式会社 | アクチュエータ装置の製造方法 |
-
2006
- 2006-03-28 JP JP2006088889A patent/JP4683226B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-27 US US11/692,037 patent/US7827658B2/en not_active Expired - Fee Related
- 2007-03-27 CN CN200710088474A patent/CN100577424C/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1126296A (ja) * | 1997-06-30 | 1999-01-29 | Tdk Corp | 膜構造体、電子デバイス、記録媒体および酸化物導電性薄膜の製造方法 |
JP2005176433A (ja) * | 2003-12-08 | 2005-06-30 | Seiko Epson Corp | アクチュエータ装置及び液体噴射ヘッド並びに液体噴射装置 |
Also Published As
Publication number | Publication date |
---|---|
CN100577424C (zh) | 2010-01-06 |
CN101045383A (zh) | 2007-10-03 |
JP2007266274A (ja) | 2007-10-11 |
US20070226974A1 (en) | 2007-10-04 |
US7827658B2 (en) | 2010-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4683226B2 (ja) | アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法 | |
JP4296441B2 (ja) | アクチュエータ装置の製造方法 | |
JP4737375B2 (ja) | アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法並びに液体噴射装置の製造方法 | |
JP5110052B2 (ja) | アクチュエータ装置及び液体噴射ヘッド並びに液体噴射装置 | |
JP4380310B2 (ja) | アクチュエータ装置及び液体噴射ヘッド並びに液体噴射装置 | |
KR100666101B1 (ko) | 액추에이터 장치의 제조 방법 및 그 제조 방법에 의해형성된 액추에이터 장치를 구비한 액체 분사 장치 | |
JP4614068B2 (ja) | 液体噴射ヘッド及びその製造方法並びに液体噴射装置 | |
JP2007073931A (ja) | アクチュエータ装置の製造方法及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置 | |
JP4858670B2 (ja) | アクチュエータ装置の製造方法及び液体噴射装置 | |
JP4645024B2 (ja) | アクチュエータ装置の製造方法 | |
JP2004090637A (ja) | シリコンデバイスの製造方法及び液体噴射ヘッドの製造方法並びに液体噴射ヘッド | |
US9662881B2 (en) | Liquid ejecting head | |
JP2006093312A (ja) | 圧電素子、液体噴射ヘッド、液体噴射装置及び圧電素子の製造方法 | |
JP2004130558A (ja) | 液体噴射ヘッドの製造方法 | |
JP2007266273A (ja) | アクチュエータ装置、それを備えた液体噴射ヘッド及び液体噴射装置並びにアクチュエータ装置の製造方法 | |
JP5083499B2 (ja) | アクチュエータ装置の製造方法及び液体噴射ヘッド | |
JP2005260003A (ja) | アクチュエータ装置の製造方法及び液体噴射装置 | |
JP2005209912A (ja) | 圧電素子及び液体噴射ヘッド並びに圧電素子の製造方法 | |
JP5024564B2 (ja) | アクチュエーター装置及び液体噴射ヘッド | |
JP2004066537A (ja) | 液体噴射ヘッドの製造方法 | |
JP4433787B2 (ja) | 液体噴射ヘッド及びその製造方法並びに液体噴射装置 | |
JP2008124277A (ja) | アクチュエータ装置の製造方法及び液体噴射ヘッド | |
JP2006021392A (ja) | アクチュエータ装置及びその製造方法並びに液体噴射装置 | |
JP2004034555A (ja) | 液体噴射ヘッドの製造方法 | |
JP2007180249A (ja) | アクチュエータ装置の製造方法及び液体噴射装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100729 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100804 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100930 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101020 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101216 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110112 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110125 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140218 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |