JP4674548B2 - Bonding apparatus and bonding tool - Google Patents

Bonding apparatus and bonding tool Download PDF

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JP4674548B2
JP4674548B2 JP2006009568A JP2006009568A JP4674548B2 JP 4674548 B2 JP4674548 B2 JP 4674548B2 JP 2006009568 A JP2006009568 A JP 2006009568A JP 2006009568 A JP2006009568 A JP 2006009568A JP 4674548 B2 JP4674548 B2 JP 4674548B2
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substrate
bonding
film
pressing
suction
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JP2007194314A (en
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省ニ 酒見
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H01L2224/75304—Shape of the pressing surface being curved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head

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  • Wire Bonding (AREA)

Description

本発明は、フィルム状基板をボンディング対象物にボンディングするボンディング装置及びボンディングツールに関するものである。   The present invention relates to a bonding apparatus and a bonding tool for bonding a film-like substrate to a bonding object.

近年の電子機器等の小型化、軽量化の要請に対応するため、電子機器等に内蔵される複数のモジュール基板の接合にフィルム状基板（フレキシブル基板ともいう）が広く用いられている。例えば、表示パネルを備えた電子機器の組み立てにおいては、ＴＣＰ（Ｔａｐｅ Ｃａｒｒｉｅｒ Ｐａｃｋａｇｅ）のフィルム状基板の一端を表示パネルに接合するとともに他端をモジュール基板に接合することにより、表示パネルとモジュール基板の配置の自由度を高めて省スペース化を図っている。フィルム状基板とモジュール基板の接合を行う装置として、吸着したフィルム状基板をモジュール基板に形成された電極等の接合面に重ね、この重なり合った部分を加熱押圧することによりフィルム状基板とモジュール基板の接合を行うボンディング装置が知られている（特許文献１参照）。
特開平７−２９７５９５号公報 In order to meet the recent demand for downsizing and weight reduction of electronic devices and the like, a film-like substrate (also referred to as a flexible substrate) is widely used for joining a plurality of module substrates built in the electronic device or the like. For example, in assembling an electronic device equipped with a display panel, one end of a TCP (Tape Carrier Package) film substrate is bonded to the display panel and the other end is bonded to the module substrate. Space-saving is achieved by increasing the degree of freedom of arrangement. As an apparatus for bonding a film substrate and a module substrate, the adsorbed film substrate is stacked on a bonding surface such as an electrode formed on the module substrate, and the overlapping portion is heated and pressed to heat the film substrate and the module substrate. A bonding apparatus that performs bonding is known (see Patent Document 1).
JP-A-7-297595

しかしながら、特許文献１に開示されたボンディング装置においては、フィルム状基板を吸着する吸着部と加熱押圧する押圧部が独立して可動できるように構成されているので、フィルム状基板を吸着する箇所と押圧する箇所が離れた状態になっている。そのため、フィルム状基板には、吸着された箇所から押圧される箇所にかけて自重による撓みが生じ、フィルム状基板の押圧箇所とモジュール基板の接合面との位置合わせが困難であった。   However, in the bonding apparatus disclosed in Patent Document 1, since the suction part that sucks the film-like substrate and the pressing part that heats and presses are configured to be independently movable, The part to be pressed is in a separated state. Therefore, the film-like substrate is bent by its own weight from the adsorbed portion to the pressed portion, and it is difficult to align the pressed portion of the film-like substrate and the joint surface of the module substrate.

そこで本発明は、フィルム状基板をボンディング対象物にボンディングする際の位置合わせ精度を向上させたボンディング装置及びボンディングツールを提供することを目的とする。   Then, an object of this invention is to provide the bonding apparatus and bonding tool which improved the alignment precision at the time of bonding a film-form board | substrate to a bonding target object.

請求項１記載の発明は、ボンディングツールの下面に吸着して保持したフィルム状基板を接合用部材が予め施されたボンディング対象物である基板の電極形成面に押圧してボンディングするボンディング装置であって、前記ボンディングツールの下面に、フィルム状基板を吸着する吸着溝が形成された吸着面と、前記吸着面に吸着された前記フィルム状基板を前記電極形成面に押圧する押圧面とを備え、前記吸着面が、前記押圧面から側方へ向かって上り勾配で傾斜して成り、前記押圧面により押圧されて押し出された前記接合用部材が固着する側方へ向かって末広がり状の空間を前記電極形成面と前記フィルム状基板との間に形成する。 The invention described in claim 1 is a bonding apparatus for pressing and bonding a film-like substrate adsorbed and held on a lower surface of a bonding tool to an electrode forming surface of a substrate, which is a bonding object to which a bonding member has been applied in advance. A suction surface on which a suction groove for sucking the film-like substrate is formed on the lower surface of the bonding tool, and a pressing surface for pressing the film-like substrate sucked on the suction surface against the electrode forming surface , The suction surface is inclined upward from the pressing surface toward the side, and the space that is widened toward the side to which the bonding member pressed and pushed out by the pressing surface is fixed It forms between an electrode formation surface and the said film-like board | substrate .

請求項２記載の発明は、請求項１記載の発明において、前記押圧面が前記ボンディングツールの下面の略中央に形成されるとともに前記吸着面が前記ボンディングツールの下面の両側に前記押圧面を挟んで形成されている。 According to a second aspect of the present invention, in the first aspect of the invention, the pressing surface is formed substantially at the center of the lower surface of the bonding tool, and the suction surface sandwiches the pressing surface on both sides of the lower surface of the bonding tool. It is formed with.

請求項３記載の発明は、フィルム状基板を接合用部材が予め施されたボンディング対象物である基板の電極形成面に押圧してボンディングするボンディング装置に装着されるボンディングツールであって、フィルム状基板を吸着する吸着溝が形成された吸着面と、前記吸着面に吸着された前記フィルム状基板を前記電極形成面に押圧する押圧面とを有する下面を備え、前記吸着面が、前記押圧面から側方へ向かって上り勾配で傾斜して成り、前記押圧面により押圧されて押し出された前記接合用部材が固着する側方へ向かって末広がり状の空間を前記電極形成面と前記フィルム状基板との間に形成する。 The invention according to claim 3 is a bonding tool to be mounted on a bonding apparatus for pressing and bonding a film-like substrate to an electrode forming surface of a substrate, which is a bonding object to which a bonding member has been applied in advance. It includes a bottom surface having a suction surface which suction grooves for sucking the substrate is formed, and a pressing surface for pressing the film-like substrate attracted to the suction surface to the electrode forming surface, the suction surface, the pressing surface The electrode-forming surface and the film-like substrate are formed in a slanting manner toward the side from the side, and are formed by inclining at an upward slope, and are spread outwardly toward the side to which the bonding member pressed and pushed out by the pressing surface is fixed. Form between .

請求項４記載の発明は、請求項３記載の発明において、前記押圧面が前記下面の略中央に形成されるとともに前記吸着面が前記下面の両側に前記押圧面を挟んで形成されている。 According to a fourth aspect of the present invention, in the third aspect of the present invention, the pressing surface is formed substantially at the center of the lower surface, and the suction surface is formed on both sides of the lower surface with the pressing surface interposed therebetween.

本発明によれば、フィルム状基板を吸着して保持する吸着面と保持されたフィルム状基板をボンディング対象物である基板の電極形成面に押圧する押圧面を１つのボンディングツールの下面に形成し、フィルム状基板の吸着箇所から押圧箇所にかけて自重による撓みがほとんど生じることがないようにしているので、フィルム状基板を基板の電極形成面にボンディングする際の位置合わせ精度を向上させることができる。 According to the present invention, the shape of the pressing surface for pressing the film-shaped substrate held a suction surface for holding by adsorbing a film-shaped substrate on the electrode formation surface of the substrate is a bonding object on the lower surface of one of the bonding tool formation In addition, since the bending due to its own weight hardly occurs from the adsorbed portion to the pressed portion of the film-like substrate, it is possible to improve the alignment accuracy when bonding the film-like substrate to the electrode forming surface of the substrate. .

本発明の実施の形態について図面を参照して説明する。図１は本発明の一実施の形態におけるボンディング装置の構成を示す側面図、図２は本発明の一実施の形態におけるボンディング装置の一部を拡大した側面図、図３は本発明の一実施の形態におけるボンディングツールを示す斜視図、図４（ａ）、（ｂ）は本発明の一実施の形態におけるボンディング動作を示す説明図、図５は本発明の他の実施の形態におけるボンディングツールを示す側面図である。   Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view showing a configuration of a bonding apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged side view of a part of the bonding apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4A and FIG. 4B are explanatory views showing a bonding operation in one embodiment of the present invention, and FIG. 5 shows a bonding tool in another embodiment of the present invention. FIG.

図１において、ボンディングツール１は、フィルム状基板２を吸着して保持するとともにボンディング対象物であるモジュール基板３（以下、単に基板３と称す）に押圧する機能を有し、ツールホルダ４に着脱自在に装着されている。ツールホルダ４は昇降機構５により昇降自在となっている。昇降機構５の昇降動作を制御することにより、ツールホルダ４に装着されたボンディングツール１を昇降させることができる。ツールホルダ４の下方には、基板３を保持する基板保持部であるテーブル６が配設されている。テーブル６は基板位置決め機構であるＸテーブル７及びＹテーブル８に積層されて水平移動自在となっている。Ｘテーブル７及びＹテーブル８の駆動を制御することにより、テーブル６に保持された基板３の任意の位置をボンディングツール１に保持されたフィルム状基板２の下方に位置決めすることができる。   In FIG. 1, a bonding tool 1 has a function of adsorbing and holding a film-like substrate 2 and pressing a module substrate 3 (hereinafter simply referred to as a substrate 3) that is a bonding target, and is attached to and detached from a tool holder 4. It is installed freely. The tool holder 4 can be moved up and down by a lifting mechanism 5. By controlling the lifting operation of the lifting mechanism 5, the bonding tool 1 mounted on the tool holder 4 can be lifted and lowered. Below the tool holder 4, a table 6 that is a substrate holding unit for holding the substrate 3 is disposed. The table 6 is stacked on an X table 7 and a Y table 8 which are substrate positioning mechanisms, and can be moved horizontally. By controlling the driving of the X table 7 and the Y table 8, an arbitrary position of the substrate 3 held on the table 6 can be positioned below the film-like substrate 2 held on the bonding tool 1.

次に、ボンディングツール１について詳説する。図２において、ボンディングツール１が装着されるツールホルダ４は、本体部１０と調整部１１から構成され、ねじ１２等の締結手段により調整部１１を本体部１０に近接させて両者の間にボンディングツール１を挟持するようになっている。調整部１１とボンディングツール１の接触部において、調整部１１側には凸部１１ａが形成され、ボンディングツール１側には凸部１１ａに係合する凹部１ａが形成されており、ボンディングツール１が容易に脱落することがないようになっている。本体部１０のボンディングツール１の近傍となる位置には、ボンディングツール１を加熱する加熱手段であるヒータ１３が備えられており、ボンディングツール１全体を加熱するようになっている。ボンディングツール１には、下面１４に開口する２つの通気孔１５が形成されており、通気孔１５の他端はボンディングツール１の上部に開口し、ボンディングツール１が本体部１０に装着された状態において本体部１０に形成された通気孔１６と連通している。通気孔１６は図示しない吸排気機構と接続されており、通気孔１５内の吸排気を行うようになっている。   Next, the bonding tool 1 will be described in detail. In FIG. 2, the tool holder 4 to which the bonding tool 1 is mounted is composed of a main body portion 10 and an adjustment portion 11, and the adjustment portion 11 is brought close to the main body portion 10 by a fastening means such as a screw 12 and bonded between them. The tool 1 is clamped. In the contact portion between the adjustment portion 11 and the bonding tool 1, a convex portion 11a is formed on the adjustment portion 11 side, and a concave portion 1a that engages with the convex portion 11a is formed on the bonding tool 1 side. It does not fall off easily. A heater 13 which is a heating means for heating the bonding tool 1 is provided at a position in the vicinity of the bonding tool 1 of the main body 10 so that the entire bonding tool 1 is heated. The bonding tool 1 is formed with two vent holes 15 that are opened in the lower surface 14, the other end of the vent hole 15 is opened at the top of the bonding tool 1, and the bonding tool 1 is mounted on the main body 10. In FIG. 1, the air passage 16 communicates with the air holes 16 formed in the main body 10. The vent hole 16 is connected to an intake / exhaust mechanism (not shown), and performs intake / exhaust in the vent hole 15.

図３において、ボンディングツール１の下面１４は、押圧領域と吸着領域の２つの領域を備えている。下面１４は３区画に分割されており、中央の押圧面１４ａは、フィルム状基板２をテーブル６に保持されて位置決めされた基板３に押圧する押圧領域となっている。また、押圧面１４ａを挟む両側の吸着面１４ｂは、フィルム状基板２を吸着する吸着領域となっている。２つの吸着面１４ｂには、それぞれ吸着溝１５ａが形成されており、上述した２つの通気孔１５が各吸着溝１５ａに開口している。吸排気機構により通気孔１５内を吸気すると、通気孔１５と連通する吸着溝１５ａ内が負圧となってフィルム状基板２
を吸着することができる。 In FIG. 3, the lower surface 14 of the bonding tool 1 includes two areas, a pressing area and an adsorption area. The lower surface 14 is divided into three sections, and the central pressing surface 14 a is a pressing region that presses the film-like substrate 2 against the substrate 3 positioned by being held by the table 6. Further, the suction surfaces 14b on both sides sandwiching the pressing surface 14a are suction regions for sucking the film substrate 2. Adsorption grooves 15a are formed on the two adsorption surfaces 14b, respectively, and the two vent holes 15 described above open to the adsorption grooves 15a. When the inside of the air vent 15 is sucked by the intake / exhaust mechanism, the inside of the suction groove 15a communicating with the air vent 15 becomes negative pressure, and the film-like substrate 2
Can be adsorbed.

図１に示すように、ボンディングツール１がツールホルダ４に装着された状態において、押圧面１４ａは基板３に対して略平行となるように形成されている。また、吸着面１４ｂは、押圧面１４ａから離れるにしたがって上方に傾斜するように形成されている。すなわち、図４（ａ）に示すように、吸着面１４ｂは押圧面１４ａから側方へ向かって上り勾配で傾斜して形成されている（傾斜角度θ）。フィルム状基板２は可撓性のフレキシブルな基板であるので、押圧面１４ａの両側に角度θの傾斜をなす吸着面１４ｂに吸着されると、ボンディングツール１の下面１４の形状に沿って変形した状態で保持される。 As shown in FIG. 1, the pressing surface 14 a is formed to be substantially parallel to the substrate 3 when the bonding tool 1 is mounted on the tool holder 4. Further, the suction surface 14b is formed so as to incline upward as the distance from the pressing surface 14a increases. That is, as shown in FIG. 4 (a), the suction surfaces 14b are formed by inclined obliquely with upward gradient toward the pressing surface 14a to the side (inclined angle theta). Since the film-like substrate 2 is a flexible flexible substrate, it is deformed along the shape of the lower surface 14 of the bonding tool 1 when adsorbed to the adsorbing surface 14b having an angle θ on both sides of the pressing surface 14a. Held in a state.

図４（ａ）において、基板３の上面の所定の箇所は電極形成面３ａとなっており、電極形成面３ａには、ＡＣＦテープや半田粒を含んだ熱硬化性樹脂等の接合用部材１７が予め施されている。フィルム状基板２の下面には、電極形成面３ａの電極配列パターンに対応するリード２ａが形成されている。従って、フィルム状基板２を基板３にボンディングするに際しては、フィルム状基板２の接合箇所２ｂが押圧面１４ａの下方の位置となるようにフィルム状基板２をボンディングツール１に保持し、基板３の電極形成面３ａを押圧面１４ａの下方に位置決めした後に、ボンディングツール１を下降させ、押圧面１４ａによりフィルム状基板２のリード２ａを電極形成面３ａに押圧する。このとき、ボンディングツール１はヒータ１３により加熱されているので、押圧面１４ａにより押圧されている部分の接合用部材１７は熱融解し、図４（ｂ）に示すように、吸着面１４ｂが側方へ向かって上り勾配で傾斜していることにより電極形成面３ａとフィルム状基板２との間に形成された側方へ向かって末広がり状の空間に押し出され、その後、ボンディングツール１を上昇させると、この空間に押し出された接合用部材１７がこの空間において固着してフィルム状基板２の接合箇所２ｂと電極形成面３ａの接合が完了する。 In FIG. 4A, a predetermined portion of the upper surface of the substrate 3 is an electrode forming surface 3a, and the electrode forming surface 3a has a bonding member 17 such as an ACF tape or a thermosetting resin containing solder particles. Is given in advance. Leads 2a corresponding to the electrode arrangement pattern of the electrode formation surface 3a are formed on the lower surface of the film substrate 2. Therefore, when bonding the film-like substrate 2 to the substrate 3, the film-like substrate 2 is held on the bonding tool 1 so that the joining portion 2b of the film-like substrate 2 is positioned below the pressing surface 14a. After positioning the electrode forming surface 3a below the pressing surface 14a, the bonding tool 1 is lowered, and the lead 2a of the film-like substrate 2 is pressed against the electrode forming surface 3a by the pressing surface 14a. At this time, since the bonding tool 1 is heated by the heater 13, the portion of the bonding member 17 pressed by the pressing surface 14a is melted by heat, so that the suction surface 14b is on the side as shown in FIG. By inclining in the upward direction, it is pushed out into a laterally diverging space formed between the electrode forming surface 3a and the film-like substrate 2, and then the bonding tool 1 is raised. Then, the bonding member 17 pushed into this space is fixed in this space, and the bonding between the bonding portion 2b of the film-like substrate 2 and the electrode forming surface 3a is completed.

このように、本実施の形態におけるボンディングツール１は、押圧面１４ａと吸着面１４ｂを1つのボンディングツール１の下面１４に近接して形成しているので、フィルム状基板２を吸着する箇所と押圧する箇所が近接している。これにより、フィルム状基板２の吸着箇所から押圧箇所にかけて自重による撓みがほとんど生じることがない。特に、本実施の形態における場合のように、押圧面１４ａを挟む位置にそれぞれ吸着面１４ｂを形成することにより、フィルム状基板２には撓みが発生しない。そのため、フィルム状基板２の接合箇所２ｂと電極形成面３ａの位置合わせ精度が向上し、押圧面１４ａは、フィルム状基板２の接合箇所２ｂを電極形成面３ａに対して正確な位置で押圧することができる。また、吸着面１４ｂの傾斜により電極形成面３ａとフィルム状基板２との間に形成された空間に押し出された接合用部材１７ａが固着することにより、フィルム状基板２と基板３のボンディングにおける強度が向上する。   Thus, since the bonding tool 1 in this Embodiment forms the press surface 14a and the adsorption | suction surface 14b close to the lower surface 14 of one bonding tool 1, the location and pressure which adsorb | suck the film-like board | substrate 2 are pressed. The locations to be close are close. Thereby, the bending by self weight hardly arises from the adsorption | suction location of the film-like board | substrate 2 to a press location. In particular, as in the case of the present embodiment, the film-like substrate 2 is not bent by forming the suction surfaces 14b at positions sandwiching the pressing surface 14a. Therefore, the alignment accuracy of the joining location 2b of the film-like substrate 2 and the electrode forming surface 3a is improved, and the pressing surface 14a presses the joining location 2b of the film-like substrate 2 at an accurate position against the electrode forming surface 3a. be able to. Further, the bonding member 17a pushed out into the space formed between the electrode forming surface 3a and the film substrate 2 due to the inclination of the adsorption surface 14b adheres, so that the strength in bonding of the film substrate 2 and the substrate 3 is increased. Will improve.

なお、図５に示すボンディングツール２０のように、下面２１を下凸の円弧状に形成することもできる。この場合、吸着溝１５ａが形成された箇所の周辺が吸着領域２１ｂとなり、吸着領域２１ｂに挟まれた箇所が押圧領域２１ａとなる。 In addition, like the bonding tool 20 shown in FIG. 5, the lower surface 21 can also be formed in a downward convex arc shape. In this case, the periphery of the portion where the suction groove 15a is formed becomes the suction region 21b, and the portion sandwiched between the suction regions 21b becomes the pressing region 21a .

図３に示すボンディングツール１において、吸着面１４ｂは必ずしも押圧面１４ａの両側に形成する必要はなく、何れか一方のみであってもよい。図５に示すボンディングツール２０についても同様であり、吸着領域２１ｂは何れか一方のみであってもよい。   In the bonding tool 1 shown in FIG. 3, the suction surface 14b is not necessarily formed on both sides of the pressing surface 14a, and may be only one of them. The same applies to the bonding tool 20 shown in FIG. 5, and only one of the suction regions 21b may be provided.

本発明のボンディング装置及びボンディングツールによれば、フィルム状基板を吸着して保持する吸着面と保持されたフィルム状基板をボンディング対象物である基板の電極形成面に押圧する押圧面を１つのボンディングツールの下面に形成し、フィルム状基板の吸着箇所から押圧箇所にかけて自重による撓みがほとんど生じることがないようにしているので、フィルム状基板を基板の電極形成面にボンディングする際の位置合わせ精度を向上させることができるという利点を有し、フィルム状基板を基板の電極形成面にボンディングする分野において有用である。 According to the bonding apparatus and the bonding tool of the present invention, one adhering surface for adsorbing and holding the film-like substrate and a pressing surface for pressing the held film-like substrate against the electrode forming surface of the substrate as a bonding target are combined. form shape on the lower surface of the tool, since the deflection due to its own weight from the adsorption portion of the film-like substrate toward the pressing position is not to allow the almost occur, the positioning accuracy when bonding the film-shaped substrate on the electrode formation surface of the substrate And is useful in the field of bonding a film-like substrate to the electrode forming surface of the substrate .

本発明の一実施の形態におけるボンディング装置の構成を示す側面図The side view which shows the structure of the bonding apparatus in one embodiment of this invention 本発明の一実施の形態におけるボンディング装置の一部を拡大した側面図The side view which expanded a part of bonding apparatus in one embodiment of this invention 本発明の一実施の形態におけるボンディングツールを示す斜視図The perspective view which shows the bonding tool in one embodiment of this invention （ａ）、（ｂ）本発明の一実施の形態におけるボンディング動作を示す説明図(A), (b) Explanatory drawing which shows the bonding operation | movement in one embodiment of this invention. 本発明の他の実施の形態におけるボンディングツールを示す側面図The side view which shows the bonding tool in other embodiment of this invention

符号の説明Explanation of symbols

１、２０ ボンディングツール
２ フィルム状基板
３ ボンディング対象物
１４、２１ 下面
１４ａ、２１ａ 押圧領域
１４ｂ、２１ｂ 吸着領域 DESCRIPTION OF SYMBOLS 1,20 Bonding tool 2 Film-like board | substrate 3 Bonding object 14, 21 Lower surface 14a, 21a Press area 14b, 21b Adsorption area

Claims (4)

ボンディングツールの下面に吸着して保持したフィルム状基板を接合用部材が予め施されたボンディング対象物である基板の電極形成面に押圧してボンディングするボンディング装置であって、
前記ボンディングツールの下面に、フィルム状基板を吸着する吸着溝が形成された吸着面と、前記吸着面に吸着された前記フィルム状基板を前記電極形成面に押圧する押圧面とを備え、
前記吸着面が、前記押圧面から側方へ向かって上り勾配で傾斜して成り、前記押圧面により押圧されて押し出された前記接合用部材が固着する側方へ向かって末広がり状の空間を前記電極形成面と前記フィルム状基板との間に形成することを特徴とするボンディング装置。 A bonding apparatus that presses and bonds a film-like substrate that is adsorbed and held on the lower surface of a bonding tool to an electrode forming surface of a substrate that is a bonding object to which a bonding member has been applied in advance ,
Provided on the lower surface of the bonding tool, the suction surface of the suction grooves for sucking the film-shaped substrate is formed and a pressing surface for pressing the film-like substrate attracted to the suction surface to the electrode forming surface,
The suction surface is inclined upward from the pressing surface toward the side, and the space that is widened toward the side to which the bonding member pressed and pushed out by the pressing surface is fixed A bonding apparatus formed between an electrode forming surface and the film-like substrate . 前記押圧面が前記ボンディングツールの下面の略中央に形成されるとともに前記吸着面が前記ボンディングツールの下面の両側に前記押圧面を挟んで形成されていることを特徴とする請求項１記載のボンディング装置。 Bonding according to claim 1, wherein the pressing surface is formed to sandwich the pressing surface on each side of the lower surface of the suction surface are the bonding tool is formed in a substantially center of the lower surface of the bonding tool apparatus. フィルム状基板を接合用部材が予め施されたボンディング対象物である基板の電極形成面に押圧してボンディングするボンディング装置に装着されるボンディングツールであって、
フィルム状基板を吸着する吸着溝が形成された吸着面と、前記吸着面に吸着された前記フィルム状基板を前記電極形成面に押圧する押圧面とを有する下面を備え、
前記吸着面が、前記押圧面から側方へ向かって上り勾配で傾斜して成り、前記押圧面により押圧されて押し出された前記接合用部材が固着する側方へ向かって末広がり状の空間を前記電極形成面と前記フィルム状基板との間に形成することを特徴とするボンディングツール。 A bonding tool that is attached to a bonding apparatus that presses and bonds a film substrate to an electrode forming surface of a substrate, which is a bonding object to which a bonding member has been applied in advance ,
A lower surface having an adsorption surface formed with an adsorption groove for adsorbing the film-like substrate and a pressing surface for pressing the film-like substrate adsorbed on the adsorption surface against the electrode forming surface ;
The suction surface is inclined upward from the pressing surface toward the side, and the space that is widened toward the side to which the bonding member pressed and pushed out by the pressing surface is fixed A bonding tool formed between an electrode forming surface and the film-like substrate . 前記押圧面が前記下面の略中央に形成されるとともに前記吸着面が前記下面の両側に前記押圧面を挟んで形成されていることを特徴とする請求項３記載のボンディングツール。 The bonding tool according to claim 3, wherein the pressing surface is formed at substantially the center of the lower surface, and the suction surface is formed on both sides of the lower surface with the pressing surface interposed therebetween.
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JPH0513507A (en) * 1991-07-08 1993-01-22 Matsushita Electric Ind Co Ltd Carrier tape regulating device
JP2003203964A (en) * 2001-12-21 2003-07-18 Esec Trading Sa Pickup tool for mounting semiconductor chip
JP2004235305A (en) * 2003-01-29 2004-08-19 Sharp Corp Semiconductor manufacturing apparatus

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JPH0513507A (en) * 1991-07-08 1993-01-22 Matsushita Electric Ind Co Ltd Carrier tape regulating device
JP2003203964A (en) * 2001-12-21 2003-07-18 Esec Trading Sa Pickup tool for mounting semiconductor chip
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