JP4667018B2 - レチクル搬送容器 - Google Patents
レチクル搬送容器 Download PDFInfo
- Publication number
- JP4667018B2 JP4667018B2 JP2004339375A JP2004339375A JP4667018B2 JP 4667018 B2 JP4667018 B2 JP 4667018B2 JP 2004339375 A JP2004339375 A JP 2004339375A JP 2004339375 A JP2004339375 A JP 2004339375A JP 4667018 B2 JP4667018 B2 JP 4667018B2
- Authority
- JP
- Japan
- Prior art keywords
- reticle
- retainer
- transport container
- pod
- door
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Library & Information Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Buffer Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Description
Claims (4)
- 一端に開口を有しレクチルを収納する内部を有するポッドと、当該ポッドの前記開口を覆って塞ぐ扉と、前記扉で前記ポッドを塞いだときに内部を気密にシールするシール材とを備えたレチクル搬送容器であって、
上記ポッド及び扉の各内側面に一対のリテーナーを有し、
当該各リテーナーは、リテーナー受け部と、当該リテーナー受け部に支持されたリテーナー板部とから構成され、
当該各リテーナー板部が、弾性部材で成形されると共に、上記レチクルの周縁の上側角部又は下側角部に当接する傾斜面部を備え、
前記リテーナー受け部が、前記傾斜面部に対向する辺に、上記レチクルの周縁の上側角部又は下側角部が当接したときに上記傾斜面部の撓みを許容する隙間を作る凹部を備えたことを特徴とするレチクル搬送容器。 - 請求項1に記載のレチクル搬送容器において、
上記ポッド又は扉の少なくとも1カ所にメンブレンフィルター取り付け部が形成され、当該メンブレンフィルター取り付け部にメンブレンフィルターが取り付けられていることを特徴とするレチクル搬送容器。 - 請求項1又は2に記載のレチクル搬送容器において、
上記扉又はポッドの外側表面の少なくとも1カ所に無線タグが取り付けられていることを特徴とするレチクル搬送容器。 - 請求項3に記載のレチクル搬送容器において、
上記無線タグが、上記扉又はポッドの外側表面に、密封収納されたことを特徴とするレチクル搬送容器。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004339375A JP4667018B2 (ja) | 2004-11-24 | 2004-11-24 | レチクル搬送容器 |
TW094137795A TWI345545B (en) | 2004-11-24 | 2005-10-28 | Reticle-carrying container |
EP05024325A EP1662324A3 (en) | 2004-11-24 | 2005-11-08 | Reticle-carrying container |
US11/282,575 US7450219B2 (en) | 2004-11-24 | 2005-11-21 | Reticle-carrying container |
KR1020050111834A KR101077719B1 (ko) | 2004-11-24 | 2005-11-22 | 레티클 반송용기 |
CN2005101272555A CN1781826B (zh) | 2004-11-24 | 2005-11-24 | 模版输送容器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004339375A JP4667018B2 (ja) | 2004-11-24 | 2004-11-24 | レチクル搬送容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006146079A JP2006146079A (ja) | 2006-06-08 |
JP4667018B2 true JP4667018B2 (ja) | 2011-04-06 |
Family
ID=35541843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004339375A Expired - Fee Related JP4667018B2 (ja) | 2004-11-24 | 2004-11-24 | レチクル搬送容器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7450219B2 (ja) |
EP (1) | EP1662324A3 (ja) |
JP (1) | JP4667018B2 (ja) |
KR (1) | KR101077719B1 (ja) |
CN (1) | CN1781826B (ja) |
TW (1) | TWI345545B (ja) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006173276A (ja) | 2004-12-14 | 2006-06-29 | Miraial Kk | レチクル処理システム |
JP2006173273A (ja) | 2004-12-14 | 2006-06-29 | Miraial Kk | レチクル搬送容器 |
JP4789566B2 (ja) * | 2005-09-30 | 2011-10-12 | ミライアル株式会社 | 薄板保持容器及び薄板保持容器用処理装置 |
JP2008040810A (ja) * | 2006-08-07 | 2008-02-21 | Shin Etsu Polymer Co Ltd | Rfidシステム用成形品 |
US7581372B2 (en) * | 2006-08-17 | 2009-09-01 | Microtome Precision, Inc. | High cleanliness article transport system |
US20100025277A1 (en) | 2006-11-24 | 2010-02-04 | Miraial Co., Ltd. | Thin plate storage transport system and reticle case using the same |
TWI308550B (en) * | 2006-12-29 | 2009-04-11 | Ind Tech Res Inst | A clean container with elastic fixing structure |
US20090152162A1 (en) * | 2007-12-13 | 2009-06-18 | Silicon Genesis Corporation | Carrier apparatus and method for shaped sheet materials |
TWI344926B (en) * | 2008-12-05 | 2011-07-11 | Gudeng Prec Industral Co Ltd | Reticle pod |
TWI411563B (zh) | 2009-09-25 | 2013-10-11 | Gudeng Prec Industral Co Ltd | 光罩盒 |
JP2011126546A (ja) * | 2009-12-15 | 2011-06-30 | Shin-Etsu Chemical Co Ltd | ガラス基板搬送用ケースおよびガラス基板搬送用台車 |
TWI378887B (en) * | 2009-12-29 | 2012-12-11 | Gudeng Prec Industral Co Ltd | Reticle pod and supporting components therebetween |
JP2011203309A (ja) * | 2010-03-24 | 2011-10-13 | Shin-Etsu Chemical Co Ltd | ペリクルの収納容器およびペリクル収納容器の搬送用台車 |
TWI389828B (zh) * | 2010-07-21 | 2013-03-21 | Gudeng Prec Industral Co Ltd | 具有感測器之光罩盒 |
JP5585726B2 (ja) * | 2011-05-02 | 2014-09-10 | 村田機械株式会社 | 向き調整装置及び向き調整方法 |
JP5843190B2 (ja) * | 2011-06-29 | 2016-01-13 | 株式会社荒川樹脂 | マスクケースのマスク係止具 |
US8925290B2 (en) | 2011-09-08 | 2015-01-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask storage device for mask haze prevention and methods thereof |
CN107924858B (zh) | 2015-07-13 | 2023-05-30 | 恩特格里斯公司 | 具有增强型容纳的衬底容器 |
JP6514603B2 (ja) * | 2015-08-07 | 2019-05-15 | アキレス株式会社 | 基板収納容器 |
JP6662068B2 (ja) * | 2016-02-02 | 2020-03-11 | いすゞ自動車株式会社 | 保管容器 |
EP3504591B1 (en) | 2016-08-27 | 2022-05-11 | Entegris, Inc. | Reticle pod having side containment of reticle |
TWI623810B (zh) * | 2017-01-26 | 2018-05-11 | 家登精密工業股份有限公司 | 光罩盒 |
WO2019018281A1 (en) | 2017-07-21 | 2019-01-24 | Entegris, Inc. | CONTAINER FOR CONTAINING AND TRANSPORTING RETICLES HAVING A TRANSPARENT WINDOW ASSEMBLY |
US11508592B2 (en) * | 2018-10-29 | 2022-11-22 | Gudeng Precision Industrial Co., Ltd | Reticle retaining system |
TWI803860B (zh) * | 2020-04-30 | 2023-06-01 | 美商恩特葛瑞斯股份有限公司 | 光罩盒密封 |
TWI755795B (zh) * | 2020-07-23 | 2022-02-21 | 家登精密工業股份有限公司 | 具有導位構件的光罩盒 |
US11822257B2 (en) * | 2021-03-12 | 2023-11-21 | Gudeng Precision Industrial Co., Ltd. | Reticle storage pod and method for securing reticle |
CN118159906A (zh) * | 2021-10-25 | 2024-06-07 | 恩特格里斯公司 | 极紫外光内盒密封间隙 |
US12013648B2 (en) | 2021-11-09 | 2024-06-18 | Entegris, Inc. | Reticle pod including motion limiting features and method of assembling same |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1010705A (ja) * | 1996-06-25 | 1998-01-16 | Nikon Corp | レチクルケース |
JPH10305894A (ja) * | 1997-03-03 | 1998-11-17 | Nikon Corp | 基板収納ケースおよび半導体製造プロセス |
JPH11255332A (ja) * | 1998-03-10 | 1999-09-21 | Sigma Meltec Kk | 基板収納ケース |
JP2003222992A (ja) * | 2002-01-31 | 2003-08-08 | Arakawa Jushi:Kk | マスクケース |
JP2004071729A (ja) * | 2002-08-05 | 2004-03-04 | Sendai Nikon:Kk | レチクル保持方法、レチクル保持装置及び露光装置 |
JP2004165249A (ja) * | 2002-11-11 | 2004-06-10 | Sony Corp | 露光装置及び露光方法 |
JP2005321529A (ja) * | 2004-05-07 | 2005-11-17 | Arakawa Jushi:Kk | マスクケース |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4511038A (en) * | 1984-01-30 | 1985-04-16 | Ekc Technology, Inc. | Container for masks and pellicles |
US4827110A (en) * | 1987-06-11 | 1989-05-02 | Fluoroware, Inc. | Method and apparatus for monitoring the location of wafer disks |
JPH08236605A (ja) * | 1995-02-28 | 1996-09-13 | Komatsu Electron Metals Co Ltd | 半導体ウェハ収納ケース |
JPH0961111A (ja) * | 1995-08-28 | 1997-03-07 | Nikon Corp | パターン座標測定方法および装置 |
JP3919260B2 (ja) * | 1996-07-05 | 2007-05-23 | 信越ポリマー株式会社 | ペリクル収納容器 |
JPH10163094A (ja) | 1996-12-03 | 1998-06-19 | Nikon Corp | 露光装置及び露光方法並びに搬送装置 |
US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
US7304720B2 (en) * | 2002-02-22 | 2007-12-04 | Asml Holding N.V. | System for using a two part cover for protecting a reticle |
US6825916B2 (en) * | 2002-07-05 | 2004-11-30 | Entegris, Inc. | Reticle carrier with positioning cover |
-
2004
- 2004-11-24 JP JP2004339375A patent/JP4667018B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-28 TW TW094137795A patent/TWI345545B/zh not_active IP Right Cessation
- 2005-11-08 EP EP05024325A patent/EP1662324A3/en not_active Withdrawn
- 2005-11-21 US US11/282,575 patent/US7450219B2/en not_active Expired - Fee Related
- 2005-11-22 KR KR1020050111834A patent/KR101077719B1/ko not_active IP Right Cessation
- 2005-11-24 CN CN2005101272555A patent/CN1781826B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1010705A (ja) * | 1996-06-25 | 1998-01-16 | Nikon Corp | レチクルケース |
JPH10305894A (ja) * | 1997-03-03 | 1998-11-17 | Nikon Corp | 基板収納ケースおよび半導体製造プロセス |
JPH11255332A (ja) * | 1998-03-10 | 1999-09-21 | Sigma Meltec Kk | 基板収納ケース |
JP2003222992A (ja) * | 2002-01-31 | 2003-08-08 | Arakawa Jushi:Kk | マスクケース |
JP2004071729A (ja) * | 2002-08-05 | 2004-03-04 | Sendai Nikon:Kk | レチクル保持方法、レチクル保持装置及び露光装置 |
JP2004165249A (ja) * | 2002-11-11 | 2004-06-10 | Sony Corp | 露光装置及び露光方法 |
JP2005321529A (ja) * | 2004-05-07 | 2005-11-17 | Arakawa Jushi:Kk | マスクケース |
Also Published As
Publication number | Publication date |
---|---|
EP1662324A2 (en) | 2006-05-31 |
JP2006146079A (ja) | 2006-06-08 |
US20060109449A1 (en) | 2006-05-25 |
KR101077719B1 (ko) | 2011-10-27 |
EP1662324A3 (en) | 2007-06-27 |
TWI345545B (en) | 2011-07-21 |
TW200621596A (en) | 2006-07-01 |
KR20060058021A (ko) | 2006-05-29 |
US7450219B2 (en) | 2008-11-11 |
CN1781826A (zh) | 2006-06-07 |
CN1781826B (zh) | 2010-06-09 |
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