JP4656235B2 - アンテナ内蔵電子回路モジュールの製造方法 - Google Patents
アンテナ内蔵電子回路モジュールの製造方法 Download PDFInfo
- Publication number
- JP4656235B2 JP4656235B2 JP2008513236A JP2008513236A JP4656235B2 JP 4656235 B2 JP4656235 B2 JP 4656235B2 JP 2008513236 A JP2008513236 A JP 2008513236A JP 2008513236 A JP2008513236 A JP 2008513236A JP 4656235 B2 JP4656235 B2 JP 4656235B2
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- antenna
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
- H01Q9/27—Spiral antennas
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
- H01Q7/08—Ferrite rod or like elongated core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Electromagnetism (AREA)
- Details Of Aerials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Description
図1Aと図1Bは、本発明の実施の形態におけるアンテナ内蔵電子回路モジュールを説明する図である。図1Aは、アンテナ内蔵電子回路モジュール1の裏面から見た図であり、内部が見えるように筐体の下面を省略して示している。また、図1Bは、図1Aの1B−1B線で切断した断面図である。
2 配線基板
2a,11a 第1の主面
2b,11b 第2の主面
3 配線パターン
4 外部接続端子
5a,5b 貫通電極
6,8,48,49 半導体素子
7,9 電極
10 受動部品
11 樹脂シート基板
12,43 アンテナパターン
12a Cu箔
13 開口(第1の開口)
14 磁性体層
15a 第1の端子
15b 第2の端子
16 筐体
17,30 実装モジュール
19 圧力
20 一体化構造体
22 キャリアテープ
23 第2の開口
24 切断線
31 メモリ素子
32 CPU素子
33 接続線
34 粘着体
35 アンテナ
41 ベースプレート
42 アンテナ基板
46 回路基板
50 導体リード
51 配線導体
Claims (1)
- 配線パターンと前記配線パターンに接続された複数の貫通電極とを主面に有する配線基板に受動部品と半導体素子を実装する実装モジュール基板の形成ステップと、
樹脂シート基板の主面にアンテナパターンを銅箔で形成し、前記アンテナパターンの一端は前記樹脂シート基板の主面に設けた開口部側へ突出させ、かつ、前記アンテナパターンの他端は前記樹脂シート基板の主面から外部へ突出させる樹脂シート基板の形成ステップと、
前記樹脂シート基板の前記主面の反対側面と前記実装モジュール基板の前記主面の反対側面との間に、前記開口部を除いて、磁性体粒子の表面を絶縁性の被膜で被覆し、樹脂と混合して作製された磁性体シートを設け、前記磁性体シートを介して、前記樹脂シート基板と前記実装モジュール基板とを接着し、その後、前記アンテナパターンの前記一端と前記他端のそれぞれを前記実装モジュールの異なる前記貫通電極に導電性接着剤で接続し、前記実装モジュール基板と前記樹脂シート基板と前記磁性体シートとを一体化するステップと、
前記一体化したものを筐体内に収納するステップと、
を含むことを特徴とするアンテナ内蔵電子回路モジュールの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006125500 | 2006-04-28 | ||
JP2006125500 | 2006-04-28 | ||
PCT/JP2007/058928 WO2007125948A1 (ja) | 2006-04-28 | 2007-04-25 | アンテナ内蔵電子回路モジュールとその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007125948A1 JPWO2007125948A1 (ja) | 2009-09-10 |
JP4656235B2 true JP4656235B2 (ja) | 2011-03-23 |
Family
ID=38655474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008513236A Expired - Fee Related JP4656235B2 (ja) | 2006-04-28 | 2007-04-25 | アンテナ内蔵電子回路モジュールの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090051606A1 (ja) |
JP (1) | JP4656235B2 (ja) |
CN (1) | CN101432926B (ja) |
WO (1) | WO2007125948A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10249934B2 (en) | 2015-11-30 | 2019-04-02 | Toshiba Memory Corporation | Wirelessly-communicable memory card |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7775446B2 (en) * | 2006-03-10 | 2010-08-17 | Panasonic Corporation | Card type information device and method for manufacturing same |
JP5029605B2 (ja) * | 2006-04-03 | 2012-09-19 | パナソニック株式会社 | アンテナ内蔵半導体メモリモジュール |
JP4849064B2 (ja) * | 2007-12-11 | 2011-12-28 | 日本電気株式会社 | 非接触icユニットとその製造方法 |
EP2840648B1 (en) * | 2008-05-21 | 2016-03-23 | Murata Manufacturing Co., Ltd. | Wireless IC device |
TWI405366B (zh) * | 2009-05-18 | 2013-08-11 | Quanta Comp Inc | 無線通訊裝置及應用其之可攜式電子裝置 |
CN102088132A (zh) * | 2009-12-08 | 2011-06-08 | 深圳富泰宏精密工业有限公司 | 电子装置壳体及其制作方法 |
CN102834970B (zh) | 2010-04-26 | 2014-11-26 | 株式会社村田制作所 | 通信终端及卡式天线模块 |
JP5186633B2 (ja) * | 2010-09-13 | 2013-04-17 | 大日本印刷株式会社 | バイオセンサ及びその製造方法 |
JP5901130B2 (ja) | 2011-03-29 | 2016-04-06 | 富士通コンポーネント株式会社 | アンテナ装置、回路基板及びメモリカード |
JP5901154B2 (ja) | 2011-06-13 | 2016-04-06 | 富士通コンポーネント株式会社 | メモリカード |
BR112014003130A2 (pt) * | 2011-08-08 | 2017-06-06 | Féinics Amatech Teoranta | aperfeiçoamentos de acoplamento em e para cartões inteligentes rfid |
JP6077207B2 (ja) | 2011-10-18 | 2017-02-08 | 富士通コンポーネント株式会社 | メモリカード |
JP6144871B2 (ja) * | 2011-11-15 | 2017-06-07 | ブラックカード・エルエルシーBlackcard Llc | アラミドトランザクションカード |
CN107278029A (zh) | 2012-12-21 | 2017-10-20 | 华为终端有限公司 | 电子装置和栅格阵列模块 |
JP2014154777A (ja) * | 2013-02-12 | 2014-08-25 | Toshiba Corp | 接続装置 |
US9324489B2 (en) * | 2014-03-31 | 2016-04-26 | International Business Machines Corporation | Thin film inductor with extended yokes |
KR20160014938A (ko) * | 2014-07-30 | 2016-02-12 | 삼성전기주식회사 | 자성체 안테나 |
TWI583046B (zh) * | 2015-05-06 | 2017-05-11 | 佳邦科技股份有限公司 | 用於通訊模組的天線結構及其製作方法 |
CN106529653B (zh) * | 2015-09-09 | 2019-09-13 | 东芝存储器株式会社 | 包含通信功能的存储卡 |
JP6408540B2 (ja) * | 2016-12-01 | 2018-10-17 | 太陽誘電株式会社 | 無線モジュール及び無線モジュールの製造方法 |
JP6463323B2 (ja) * | 2016-12-01 | 2019-01-30 | 太陽誘電株式会社 | 無線モジュール、およびその製造方法 |
JP6569826B2 (ja) * | 2017-01-12 | 2019-09-04 | 株式会社村田製作所 | アンテナモジュール |
JP2020154886A (ja) * | 2019-03-20 | 2020-09-24 | キオクシア株式会社 | 半導体装置及びアンテナラベル |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001352208A (ja) * | 2000-06-07 | 2001-12-21 | Sony Corp | 通信端末装置 |
Family Cites Families (16)
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EP1028483B1 (en) * | 1999-02-10 | 2006-09-27 | AMC Centurion AB | Method and device for manufacturing a roll of antenna elements and for dispensing said antenna elements |
JP2001084348A (ja) * | 1999-09-09 | 2001-03-30 | Mitsui High Tec Inc | 非接触型記録媒体 |
EP1172760B1 (en) * | 2000-06-23 | 2004-12-01 | Toyo Aluminium Kabushiki Kaisha | Antenna coil for IC card and manufacturing method thereof |
US6630906B2 (en) * | 2000-07-24 | 2003-10-07 | The Furukawa Electric Co., Ltd. | Chip antenna and manufacturing method of the same |
JP2002135041A (ja) * | 2000-10-26 | 2002-05-10 | Tdk Corp | パッチアンテナおよびそれを含むrfユニット |
JP3642029B2 (ja) * | 2001-02-06 | 2005-04-27 | 日本電気株式会社 | 携帯電話機 |
JP2003078324A (ja) * | 2001-09-06 | 2003-03-14 | Mitsubishi Cable Ind Ltd | 面状アンテナ |
US6734827B2 (en) * | 2002-06-27 | 2004-05-11 | Harris Corporation | High efficiency printed circuit LPDA |
WO2004107262A1 (ja) * | 2003-05-28 | 2004-12-09 | Hitachi, Ltd. | 無線認識半導体装置及びその製造方法 |
JP2004364199A (ja) * | 2003-06-06 | 2004-12-24 | Sony Corp | アンテナモジュール及びこれを備えた携帯型通信端末 |
JP2005018154A (ja) * | 2003-06-23 | 2005-01-20 | Dainippon Printing Co Ltd | 非接触icタグ、その製造方法およびキャリアテープ |
JP2005025514A (ja) * | 2003-07-02 | 2005-01-27 | Fcm Kk | アンテナ内蔵非接触型icカード用の導電性シートおよびアンテナ内蔵非接触型icカード |
JP2005064938A (ja) * | 2003-08-14 | 2005-03-10 | Nec Access Technica Ltd | 小型無線機用アンテナ装置 |
JP2005086603A (ja) * | 2003-09-10 | 2005-03-31 | Tdk Corp | 電子部品モジュールおよびその製造方法 |
JP2005129038A (ja) * | 2003-10-01 | 2005-05-19 | Matsushita Electric Ind Co Ltd | リコール対象機器特定方法および加熱方法 |
JP2005236585A (ja) * | 2004-02-18 | 2005-09-02 | Sony Corp | アンテナモジュール及びこれを備えた携帯情報端末 |
-
2007
- 2007-04-25 US US12/296,509 patent/US20090051606A1/en not_active Abandoned
- 2007-04-25 CN CN200780015421XA patent/CN101432926B/zh not_active Expired - Fee Related
- 2007-04-25 WO PCT/JP2007/058928 patent/WO2007125948A1/ja active Application Filing
- 2007-04-25 JP JP2008513236A patent/JP4656235B2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001352208A (ja) * | 2000-06-07 | 2001-12-21 | Sony Corp | 通信端末装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10249934B2 (en) | 2015-11-30 | 2019-04-02 | Toshiba Memory Corporation | Wirelessly-communicable memory card |
Also Published As
Publication number | Publication date |
---|---|
CN101432926A (zh) | 2009-05-13 |
JPWO2007125948A1 (ja) | 2009-09-10 |
WO2007125948A1 (ja) | 2007-11-08 |
US20090051606A1 (en) | 2009-02-26 |
CN101432926B (zh) | 2013-10-09 |
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