JP4651993B2 - Easy-cut laminated film - Google Patents
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- JP4651993B2 JP4651993B2 JP2004240180A JP2004240180A JP4651993B2 JP 4651993 B2 JP4651993 B2 JP 4651993B2 JP 2004240180 A JP2004240180 A JP 2004240180A JP 2004240180 A JP2004240180 A JP 2004240180A JP 4651993 B2 JP4651993 B2 JP 4651993B2
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- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 58
- 239000005977 Ethylene Substances 0.000 claims description 58
- 229920005604 random copolymer Polymers 0.000 claims description 54
- 239000010410 layer Substances 0.000 claims description 41
- 239000000203 mixture Substances 0.000 claims description 28
- 229920001684 low density polyethylene Polymers 0.000 claims description 25
- 239000004702 low-density polyethylene Substances 0.000 claims description 25
- 239000004711 α-olefin Substances 0.000 claims description 25
- 229920000573 polyethylene Polymers 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 18
- 239000012793 heat-sealing layer Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 239000005001 laminate film Substances 0.000 claims 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 46
- 238000000034 method Methods 0.000 description 28
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 26
- 238000002844 melting Methods 0.000 description 17
- 230000008018 melting Effects 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 11
- -1 oxy compound Chemical class 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 238000003851 corona treatment Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 229920006280 packaging film Polymers 0.000 description 5
- 239000012785 packaging film Substances 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920000092 linear low density polyethylene Polymers 0.000 description 4
- 239000004707 linear low-density polyethylene Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000008431 aliphatic amides Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001687 destabilization Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000009474 immediate action Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000012968 metallocene catalyst Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 235000011888 snacks Nutrition 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Description
本発明は易カット性、透明性、耐衝撃性、ヒートシール性に優れた包装用フィルムに好適な易カット性積層フィルムに関する。 The present invention relates to an easy-cut laminated film suitable for a packaging film excellent in easy-cut property, transparency, impact resistance, and heat sealability.
エチレン・α−オレフィンランダム共重合体、所謂線状低密度ポリエチレン（ＬＬＤＰＥ）は、高圧法低密度ポリエチレンに比べ、透明性、耐ストレスクラッキング性、低温ヒートシール性、ヒートシール強度、耐衝撃性等に優れておりその特徴を活かして食品包装用のシーラントとして広く用いられている。中でも、シングルサイト触媒で重合されたエチレン・α−オレフィンランダム共重合体は、更に透明性、低温ヒートシール性、夾雑物シール性、ホットタック性にも優れている。
一方、ＬＬＤＰＥは上記特性、即ち引裂き強度等の機械的強度が優れるが故に、包装用フィルムに用いた場合は被包装物を取出す際には易引裂き性（易カット性）に劣るという欠点がある。ＬＬＤＰＥからなるフィルムの易引裂き性を改良する方法として、高密度ポリエチレン層とエチレンと１−ブテンとの共重合による直鎖状低密度ポリエチレン層とを含む積層フィルムが提案されている（特許文献１）が、かかる積層フィルムは易引裂き性は改良されるものの、ＬＬＤＰＥフィルム本来の特徴である耐衝撃性が低下する場合がある。他の方法として、密度が０．８９０〜０．９１５ｇ／ｃｍ３の超低密度ポリエチレンと低密度ポリエチレンとの組成物からなるヒートシール層を有する易引裂き性を有するシーラントフィルムが提案されている（特許文献２）が、ヒートシール層に用いられる低密度ポリエチレンの密度が低すぎるためか、易カット性は不十分である。
Ethylene / α-olefin random copolymer, so-called linear low density polyethylene (LLDPE) is more transparent, stress cracking resistance, low temperature heat sealability, heat seal strength, impact resistance, etc. than high pressure method low density polyethylene It is widely used as a sealant for food packaging taking advantage of its characteristics. Among them, the ethylene / α-olefin random copolymer polymerized with a single site catalyst is further excellent in transparency, low-temperature heat sealability, contaminant sealability, and hot tack property.
On the other hand, LLDPE has the above-mentioned characteristics, that is, mechanical strength such as tear strength, etc., and therefore, when used for a packaging film, it has a disadvantage that it is inferior in easy tearability (easy cutability) when taking out the package. . As a method for improving the easy tearability of a film made of LLDPE, a laminated film including a high-density polyethylene layer and a linear low-density polyethylene layer by copolymerization of ethylene and 1-butene has been proposed (Patent Document 1). However, although such a laminated film has improved easy tearability, the impact resistance, which is an inherent characteristic of the LLDPE film, may be reduced. As another method, an easily tearable sealant film having a heat seal layer composed of a composition of ultra-low density polyethylene having a density of 0.890 to 0.915 g / cm 3 and low density polyethylene has been proposed ( Patent Document 2) shows that the easy-cut property is insufficient because the density of the low-density polyethylene used for the heat seal layer is too low.
本発明は、本来エチレン・α―オレフィンランダム共重合体からなるフィルムが有する耐衝撃性、ヒートシール性を損なうことなく、易カット性に優れた包装用フィルムに好適な積層フィルムを開発することを目的とする。 The present invention is to develop a laminated film suitable for a packaging film that is excellent in easy-cut properties without impairing the impact resistance and heat-sealability inherent in a film made of an ethylene / α-olefin random copolymer. Objective.
本発明は、密度が０．９１０〜０．９４０ｇ／ｃｍ３のエチレン・１−ブテンランダム共重合体（Ａ）から得られるフィルム基材の片面に、密度が０．９１６〜０．９３５ｇ／ｃｍ３のエチレンと炭素数５以上のα―オレフィンとのエチレン・α―オレフィンランダム共重合体（Ｂ）９５〜７０重量％と高圧法低密度ポリエチレン（Ｃ）５〜３０重量％とからなるエチレン系重合体組成物（Ｃ）から得られる熱融着層を有してなることを特徴とする易カット性積層フィルムに関する。 The present invention, on one surface of the film substrate density can be obtained from the ethylene-1-butene random copolymer 0.910~0.940g / cm 3 (A), density 0.916~0.935g / cm Ethylene / α-olefin random copolymer (B) of 3 ethylene and α-olefin having 5 or more carbon atoms (B) 95 to 70 wt% and high pressure method low density polyethylene (C) 5 to 30 wt% The present invention relates to an easy-cut laminated film characterized by having a heat-fusible layer obtained from the polymer composition (C).
本発明の易カット性積層フィルムは、透明性、易カット性、耐衝撃性、ヒートシール性に優れた包装用フィルムに好適な積層フィルムである。 The easy-cut laminated film of the present invention is a laminated film suitable for a packaging film excellent in transparency, easy-cut property, impact resistance, and heat sealability.
エチレン・１−ブテンランダム共重合体（Ａ）
本発明の易カット性積層フィルムのフィルム基材を構成するエチレン・１−ブテンランダム共重合体（Ａ）は、密度が０．９１０〜０．９４０ｇ／ｃｍ３、好ましくは０．９１５〜０．９２５ｇ／ｃｍ３の範囲にある。
密度が０．９１０ｇ／ｃｍ３未満のエチレン・１−ブテンランダム共重合体をフィルム基材として用いる積層フィルムは、易カット性に劣る虞があり、一方、密度が０．９４０ｇ／ｃｍ３を超えるエチレン・１−ブテンランダム共重合体をフィルム基材として用いる積層フィルムは、耐衝撃性に劣る虞がある。とくに、密度が０．９１５〜０．９２５ｇ／ｃｍ３の範囲のエチレン・１−ブテンランダム共重合体（Ａ）から得られるフィルムをフィルム基材として用いる積層フィルムは、易カット性と耐衝撃性のバランスに優れるので好ましい。
本発明のエチレン・１−ブテンランダム共重合体（Ａ）は、好ましくは示差走査熱量計（ＤＳＣ）を用い、昇温速度１０℃／分で測定した熱融解曲線から求めた融点（Ｔｍ）が１１０〜１３０℃、より好ましくは１１５〜１２５℃の範囲にある。
本発明のエチレン・１−ブテンランダム共重合体（Ａ）における１−ブテンの含有量は、密度及び好ましくは融点が上記範囲にある限りとくに限定はされないが、通常、０．５〜６モル％、好ましくは３〜５モル％の範囲にある。
本発明のエチレン・１−ブテンランダム共重合体（Ａ）のメルトフローレート（ＭＦＲ：ＡＳＴＭ Ｄ１２３８ 荷重２１６０ｇ、温度１９０℃）は、フィルム形成能がある限りとくに限定はされないが、通常０．５〜５ｇ／１０分、好ましくは１〜３ｇ／１０分の範囲にある。ＭＦＲが０．５ｇ／１０分未満のエチレン・１−ブテンランダム共重合体を積層フィルムのフィルム基材に用いる場合は、製膜時の押出機内負荷による製膜速度の低下、樹脂温度上昇によるゲル化、メルトフラクチャー、層界面の不安定化が起こる虞があり、一方、５ｇ／１０分を超えるエチレン・１−ブテンランダム共重合体を積層フィルムのフィルム基材に用いる場合は、得られる包装体（袋）の耐衝撃性（破袋強度）が劣る虞がある。とくにエチレン・１−ブテンランダム共重合体（Ａ）として、ＭＦＲが１〜３ｇ／１０分の範囲にある共重合体をフィルム基材に用いてなる積層フィルムは、易カット性と耐衝撃性のバランスに優れている。
Ethylene / 1-butene random copolymer (A)
The ethylene / 1-butene random copolymer (A) constituting the film substrate of the easy-cut laminated film of the present invention has a density of 0.910 to 0.940 g / cm 3 , preferably 0.915 to 0.00. It is in the range of 925 g / cm 3 .
A laminated film using an ethylene / 1-butene random copolymer having a density of less than 0.910 g / cm 3 as a film base may be inferior in easy-cut property, while the density exceeds 0.940 g / cm 3 . A laminated film using an ethylene / 1-butene random copolymer as a film substrate may be inferior in impact resistance. In particular, a laminated film using a film obtained from an ethylene / 1-butene random copolymer (A) having a density in the range of 0.915 to 0.925 g / cm 3 as a film substrate is easy to cut and impact resistant. This is preferable because of its excellent balance.
The ethylene / 1-butene random copolymer (A) of the present invention preferably has a melting point (Tm) determined from a thermal melting curve measured using a differential scanning calorimeter (DSC) at a heating rate of 10 ° C./min. It is in the range of 110 to 130 ° C, more preferably 115 to 125 ° C.
The content of 1-butene in the ethylene / 1-butene random copolymer (A) of the present invention is not particularly limited as long as the density and preferably the melting point is in the above range, but usually 0.5 to 6 mol%. Preferably, it exists in the range of 3-5 mol%.
The melt flow rate (MFR: ASTM D1238 load 2160 g, temperature 190 ° C.) of the ethylene / 1-butene random copolymer (A) of the present invention is not particularly limited as long as it has a film-forming ability. It is in the range of 5 g / 10 min, preferably 1-3 g / 10 min. When an ethylene / 1-butene random copolymer having an MFR of less than 0.5 g / 10 min is used as the film base material of the laminated film, the film formation speed decreases due to the load in the extruder during film formation, and the gel increases due to the resin temperature increase , Melt fracture, and destabilization of the layer interface may occur. On the other hand, when an ethylene / 1-butene random copolymer exceeding 5 g / 10 min is used for the film substrate of the laminated film, the resulting package There is a possibility that the impact resistance (bag breaking strength) of (bag) is inferior. In particular, as an ethylene / 1-butene random copolymer (A), a laminated film using a copolymer having a MFR in the range of 1 to 3 g / 10 min as a film substrate is easy to cut and impact resistant. Excellent balance.
エチレン・α―オレフィンランダム共重合体（Ｂ）
本発明の易カット性積層フィルムの熱融着層を構成する成分であるエチレン・α―オレフィンランダム共重合体（Ｂ）は、密度が０．９１６〜０．９３５ｇ／ｃｍ３、好ましくは０．９１６〜０．９２５ｇ／ｃｍ３の範囲にあるエチレンと炭素数５以上のα―オレフィン、例えば、１−ヘプテン、１−ヘキセン、１−オクテン、４−メチル−１−ペンテン等のα−オレフィン、好ましくは炭素数が６以上のα―オレフィンとのランダム共重合体である。
密度が０．９１６未満のエチレン・α―オレフィンランダム共重合体を熱融着層として用いる積層フィルムは、易カット性に劣る虞があり、一方、密度が０．９３５ｇ／ｃｍ３を超えるエチレン・α―オレフィンランダム共重合体を熱融着層として用いる積層フィルムは、耐衝撃性に劣る虞がある。
本発明のエチレン・α―オレフィンランダム共重合体（Ｂ）は、好ましくは示差走査熱量計（ＤＳＣ）を用い、昇温速度１０℃／分で測定した熱融解曲線から求めた融点（Ｔｍ）が１１０〜１２５℃、より好ましくは１１５〜１２０℃の範囲にある。
本発明のエチレン・α―オレフィンランダム共重合体（Ｂ）におけるα―オレフィンの含有量は、密度及び好ましくは融点が上記範囲にある限りとくに限定はされないが、通常、１〜５モル％、好ましくは２〜５モル％の範囲にある。
エチレン・α―オレフィンランダム共重合体（Ｂ）のメルトフローレート（ＭＦＲ：ＡＳＴＭ Ｄ１２３８ 荷重２１６０ｇ、温度１９０℃）は、後述の高圧法低密度ポリエチレン（Ｃ）とのエチレン系重合体組成物を用いた際に、フィルム形成能がある限りとくに限定はされないが、通常０．５〜２０ｇ／１０分、好ましくは１〜１０ｇ／１０分の範囲にある。
又、かかるエチレン・α―オレフィンランダム共重合体（Ｂ）は、分子量分布（重量平均分子量：Ｍｗ、と数平均分子量：Ｍｎ、との比：Ｍｗ／Ｍｎで表示）が通常１．５〜４．０、好ましくは１．８〜３．５の範囲にある。このＭｗ／Ｍｎはゲル透過クロマトグラフィー（ＧＰＣ）によって測定できる。
Ethylene / α-olefin random copolymer (B)
The ethylene / α-olefin random copolymer (B), which is a component constituting the heat-fusible layer of the easy-cut laminated film of the present invention, has a density of 0.916 to 0.935 g / cm 3 , preferably 0.8. Ethylene and α-olefin having 5 or more carbon atoms in the range of 916 to 0.925 g / cm 3 , for example, α-olefin such as 1-heptene, 1-hexene, 1-octene, 4-methyl-1-pentene, A random copolymer with an α-olefin having 6 or more carbon atoms is preferred.
A laminated film using an ethylene / α-olefin random copolymer having a density of less than 0.916 as a heat-fusible layer may be inferior in easy-cut property, while an ethylene / density exceeding 0.935 g / cm 3. A laminated film using an α-olefin random copolymer as a heat-sealing layer may be inferior in impact resistance.
The ethylene / α-olefin random copolymer (B) of the present invention preferably has a melting point (Tm) determined from a thermal melting curve measured at a heating rate of 10 ° C./min using a differential scanning calorimeter (DSC). It is in the range of 110 to 125 ° C, more preferably 115 to 120 ° C.
The α-olefin content in the ethylene / α-olefin random copolymer (B) of the present invention is not particularly limited as long as the density and preferably the melting point is within the above range, but usually 1 to 5 mol%, preferably Is in the range of 2 to 5 mol%.
The melt flow rate (MFR: ASTM D1238 load 2160 g, temperature 190 ° C.) of the ethylene / α-olefin random copolymer (B) is an ethylene polymer composition with a high-pressure low-density polyethylene (C) described later. The film is not particularly limited as long as it has film-forming ability, but is usually in the range of 0.5 to 20 g / 10 minutes, preferably 1 to 10 g / 10 minutes.
The ethylene / α-olefin random copolymer (B) usually has a molecular weight distribution (weight average molecular weight: Mw, number average molecular weight: Mn, ratio: expressed as Mw / Mn), usually 1.5-4. 0.0, preferably in the range of 1.8 to 3.5. This Mw / Mn can be measured by gel permeation chromatography (GPC).
上記のようなエチレン・α―オレフィンランダム共重合体（Ｂ）は、チーグラー触媒、シングルサイト触媒等を用いた従来公知の製造法により調整することができるが、シングルサイト触媒（メタロセン触媒）により得られた共重合体がとくに好ましい。このメタロセン化合物を含む触媒は、（ａ）遷移金属のメタロセン化合物と、（ｂ）有機アルミニウムオキシ化合物と、（ｃ）担体とから形成されることが好ましく、さらに必要に応じて、これらの成分と（ｄ）有機アルミニウム化合物および／または有機ホウ素化合物とから形成さていてもよい。
なお、このようなメタロセン化合物を含むオレフィン重合用触媒、および触媒を用いたエチレン・α―オレフィン共重合体（Ｂ）の調整方法は、たとえば特開平８−２６９２７０号公報に記載されている。
The ethylene / α-olefin random copolymer (B) as described above can be prepared by a conventionally known production method using a Ziegler catalyst, a single site catalyst or the like, but can be obtained by a single site catalyst (metallocene catalyst). The copolymers obtained are particularly preferred. The catalyst containing the metallocene compound is preferably formed from (a) a transition metal metallocene compound, (b) an organoaluminum oxy compound, and (c) a carrier, and if necessary, these components and (D) It may be formed from an organoaluminum compound and / or an organoboron compound.
An olefin polymerization catalyst containing such a metallocene compound and a method for adjusting the ethylene / α-olefin copolymer (B) using the catalyst are described in, for example, JP-A-8-269270.
高圧法低密度ポリエチレン（Ｃ）
本発明の易カット性積層フィルムの熱融着層を構成する他の成分である高圧法低密度ポリエチレン（Ｃ）は通常、密度が０．９０５〜０．９３０ｇ／ｃｍ３、好ましくは０．９１０〜０．９２５ｇ／ｃｍ３、ＭＦＲ（ＡＳＴＭ Ｄ１２３８ 荷重２１６０ｇ、温度１９０℃）が通常、０．５〜３０ｇ／１０分、好ましくは１〜１０ｇ／１０分の高圧下で重合されるエチレンの単独重合体、若しくは５重量％以下の、他のα−オレフィンあるいは酢酸ビニル等のビニル化合物との共重合体で、通常高圧法低密度ポリエチレンと呼ばれている低密度ポリエチレンの範疇に入るエチレン系重合体である。
本発明の高圧法低密度ポリエチレン（Ｃ）は、通常、示差走査熱量計（ＤＳＣ）を用い、昇温速度１０℃／分で測定した熱融解曲線から求めた融点（Ｔｍ）が９５〜１２０℃、より好ましくは１００〜１１５℃の範囲にある。
High pressure low density polyethylene (C)
The high-pressure method low-density polyethylene (C), which is another component constituting the heat-sealing layer of the easy-cut laminated film of the present invention, usually has a density of 0.905 to 0.930 g / cm 3 , preferably 0.910. ˜0.925 g / cm 3 , MFR (ASTM D1238 load 2160 g, temperature 190 ° C.) usually 0.5 to 30 g / 10 min, preferably 1 to 10 g / 10 min. An ethylene polymer that falls within the category of low-density polyethylene, usually called high-pressure low-density polyethylene, and a copolymer with other α-olefins or vinyl compounds such as vinyl acetate. It is.
The high-pressure method low-density polyethylene (C) of the present invention usually has a melting point (Tm) of 95 to 120 ° C. determined from a thermal melting curve measured with a differential scanning calorimeter (DSC) at a heating rate of 10 ° C./min. More preferably, it exists in the range of 100-115 degreeC.
エチレン系重合体組成物
本発明の易カット性積層フィルムの熱融着層を構成するエチレン系重合体組成物は、前記エチレン・α―オレフィンランダム共重合体（Ｂ）９５〜７０重量％、好ましくは９０〜８０重量％と高圧法低密度ポリエチレン（Ｃ）５〜３０重量％、好ましくは１０〜２０重量％とからなる組成物である。
高圧法低密度ポリエチレン（Ｃ）の量が５重量％未満のエチレン系重合体組成物を熱融着層として用いる積層フィルムは、易カット性に劣る虞があり、一方、３０重量％を超えるエチレン系重合体組成物を熱融着層として用いる積層フィルムは、ヒートシール性の低下、耐衝撃性の低下、透明性の低下等が起こる虞がある。
エチレン系重合体組成物のメルトフローレート（ＭＦＲ：ＡＳＴＭ Ｄ１２３８ 荷重２１６０ｇ、温度１９０℃）は、フィルム形成能がある限りとくに限定はされないが、通常０．５〜２０ｇ／１０分、好ましくは１〜１０ｇ／１０分の範囲にある。
Ethylene polymer composition The ethylene polymer composition constituting the heat-sealing layer of the easy-cut laminated film of the present invention is 95 to 70% by weight of the ethylene / α-olefin random copolymer (B), preferably Is a composition comprising 90 to 80% by weight and 5 to 30% by weight, preferably 10 to 20% by weight of high-pressure low-density polyethylene (C).
A laminated film using an ethylene polymer composition having an amount of low-density polyethylene (C) of less than 5% by weight as a heat-fusible layer is likely to be inferior in easy-cutting properties, while ethylene exceeding 30% by weight. A laminated film using the polymer composition as a heat-sealing layer may cause a decrease in heat sealability, a decrease in impact resistance, a decrease in transparency, and the like.
The melt flow rate (MFR: ASTM D1238 load 2160 g, temperature 190 ° C.) of the ethylene polymer composition is not particularly limited as long as it has a film-forming ability, but usually 0.5 to 20 g / 10 min, preferably 1 to It is in the range of 10 g / 10 minutes.
本発明に係わるエチレン・１−ブテンランダム共重合体（Ａ）、エチレン・α―オレフィンランダム共重合体（Ｂ）、高圧法低密度ポリエチレン（Ｃ）あるいはエチレン系重合体組成物には本発明の目的を損なわない範囲で、通常用いられる酸化防止剤、耐候安定剤、帯電防止剤、防曇剤、ブロッキング防止剤、滑剤、核剤、顔料等の添加剤或いは他の重合体を必要に応じて配合することができる。
中でも、易カット性積層フィルムのフィルム基材を構成するエチレン・１−ブテンランダム共重合体（Ａ）にはシリカ、タルク、雲母、ゼオライトや更には金属アルコキシドを焼成して得た金属酸化物等の無機化合物粒子、ポリメタクリル酸メチル、メラミンホルマリン樹脂、メラミン尿素樹脂、ポリエステル樹脂等の有機化合物粒子等、種々公知のブロッキング防止剤を０．０１〜１重量％添加しておくと、更に耐ブロッキング性が改良されたフィルムが得られるので好ましい。これらの中でも、シリカ、ポリメタクリル酸メチルが耐ブロッキング性、透明性の面から特に好ましい。
The ethylene / 1-butene random copolymer (A), the ethylene / α-olefin random copolymer (B), the high pressure method low density polyethylene (C) or the ethylene polymer composition according to the present invention may be used in the present invention. As long as the purpose is not impaired, additives such as antioxidants, weathering stabilizers, antistatic agents, anti-fogging agents, anti-blocking agents, lubricants, nucleating agents, pigments, etc. or other polymers are used as necessary. Can be blended.
Among them, the ethylene / 1-butene random copolymer (A) constituting the film substrate of the easy-cut laminated film is a metal oxide obtained by firing silica, talc, mica, zeolite, and further metal alkoxide. Inorganic compound particles, organic compound particles such as polymethyl methacrylate, melamine formalin resin, melamine urea resin, polyester resin, etc., and various other known anti-blocking agents are added in an amount of 0.01 to 1% by weight, further blocking resistance This is preferable because a film having improved properties can be obtained. Among these, silica and polymethyl methacrylate are particularly preferable in terms of blocking resistance and transparency.
又、易カット性積層フィルムのフィルム基材を構成するエチレン・１−ブテンランダム共重合体（Ａ）には、炭化水素系、脂肪酸系、高級アルコ−ル系、脂肪族アミド系、金属石鹸系、エステル系等、種々公知の滑剤を０．０１〜１重量％添加しておくと、更にスリップ性が改良されたフィルムが得られるので好ましい。これらの中でも即効性のあるエルカ酸アミドと遅効性のビスオレイン酸アミドあるいはベヘニン酸アミド等の併用系にするとフィルム成形直後とその後の裁断加工時、更には印刷、ラミネ−ト、製袋加工時等の作業性をバランス良く改善することができる。 The ethylene / 1-butene random copolymer (A) constituting the film base of the easy-cut laminated film includes hydrocarbon-based, fatty acid-based, higher alcohol-based, aliphatic amide-based, metal soap-based It is preferable to add 0.01 to 1% by weight of various known lubricants such as ester-based films because a film with improved slip properties can be obtained. Of these, the combination of immediate action erucic acid amide and slow-acting bisoleic acid amide or behenic acid amide can be used immediately after film formation and at the time of subsequent cutting, as well as printing, lamination and bag making. Etc. can be improved in a balanced manner.
易カット性積層フィルム
本発明の易カット性積層フィルムは、前記エチレン・１−ブテンランダム共重合体（Ａ）から得られるフィルム基材の片面に、前記エチレン・α―オレフィンランダム共重合体（Ｂ）と高圧法低密度ポリエチレン（Ｃ）とからなるエチレン系重合体組成物から得られる熱融着層を有してなる積層フィルムである。
易カット性積層フィルムの厚さは用途により種々決定され得るが、通常フィルム基材の厚さが１６〜１２０μｍ、好ましくは２４〜８０μｍ、熱融着層の厚さが４〜３０μｍ、好ましくは６〜２０μｍ範囲にあり、多層フィルム全体の厚さが、２０〜１５０μｍ、好ましくは３０〜１００μｍの範囲にある。
易カット性積層フィルムのフィルム基材は、単層でもよいが、中間層と裏面層の二層あるいは三層以上の多層であってもよい。フィルム基材を中間層と裏面層にする場合は、通常中間層の厚さが１２〜９０μｍ、好ましくは１８〜６０μｍ、裏面層の厚さが４〜３０μｍ、好ましくは６〜２０μｍ範囲にある。
本発明の易カット性積層フィルムは、好ましくは縦方向（機械方向：ＭＤ）の引裂強度が１７０Ｎ／ｃｍ以下、より好ましくは１２０〜１６０Ｎ／ｃｍの範囲にある。引裂強度が１７０Ｎ／ｃｍを超える積層フィルムは易カット性に劣る虞があり、引裂強度が１２０Ｎ／ｃｍを下回ると耐衝撃性が極端に低下する虞がある。
本発明の易カット性積層フィルムは、印刷性あるいは後述の基材層を含め他のフィルムとの接着性を改良するために、フィルム基材の表面を、例えば、コロナ処理、火炎処理、プラズマ処理、アンダーコート処理等の表面活性化処理を行っておいてもよい。
Easy-cut multilayer film The easy-cut multilayer film of the present invention has an ethylene / α-olefin random copolymer (B) on one side of a film substrate obtained from the ethylene / 1-butene random copolymer (A). ) And a high-pressure method low-density polyethylene (C). A laminated film having a heat-sealing layer obtained from an ethylene polymer composition.
The thickness of the easy-cut laminated film can be variously determined depending on the application. Usually, the thickness of the film base is 16 to 120 μm, preferably 24 to 80 μm, and the thickness of the heat-sealing layer is 4 to 30 μm, preferably 6 The thickness of the entire multilayer film is in the range of 20 to 150 μm, preferably 30 to 100 μm.
The film substrate of the easy-cut laminated film may be a single layer, but may be a multilayer of two layers or three or more layers of an intermediate layer and a back layer. When the film base is used as the intermediate layer and the back layer, the intermediate layer usually has a thickness of 12 to 90 μm, preferably 18 to 60 μm, and the back layer has a thickness of 4 to 30 μm, preferably 6 to 20 μm.
The easy-cut laminated film of the present invention preferably has a tear strength in the machine direction (machine direction: MD) of 170 N / cm or less, more preferably in the range of 120 to 160 N / cm. A laminated film having a tear strength exceeding 170 N / cm may be inferior in easy-cut property, and if the tear strength is less than 120 N / cm, the impact resistance may be extremely lowered.
In order to improve the printability or the adhesion with other films including the base material layer described below, the easy-cut laminated film of the present invention is treated with, for example, corona treatment, flame treatment, plasma treatment on the surface of the film base material. In addition, surface activation treatment such as undercoat treatment may be performed.
本発明の易カット性積層フィルムは、フィルム基材の片面（熱融着層が形成されていない面）に熱可塑性樹脂からなるシート状またはフィルム状のもの、紙、アルミニウム箔等からなる基材層を積層してもよい。
かかる基材層として熱可塑性樹脂は用いる場合は、種々公知の熱可塑性樹脂、例えば、ポリオレフィン（ポリエチレン、ポリプロピレン、ポリ４−メチル・１−ペンテン、ポリブテン等）、ポリエステル（ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等）、ポリアミド（ナイロン−６、ナイロン−６６、ポリメタキシレンアジパミド等）、ポリ塩化ビニル、ポリイミド、エチレン・酢酸ビニル共重合体もしくはその鹸化物、ポリビニルアルコール、ポリアクリロニトリル、ポリカーボネート、ポリスチレン、アイオノマー、あるいはこれらの混合物等を例示することができる。これらのうちでは、ポリプロピレン、ポリエチレンテレフタレート、ポリアミド等、延伸性、透明性が良好な熱可塑性樹脂が好ましい。
又、かかる熱可塑性樹脂フィルムからなる基材層は、無延伸フィルムであっても、延伸フィルムであっても良いし、１種或いは２種以上の共押し出し成形、押出しラミネート、ドライラミネート、サーマルラミネート等で得られる積層体であっても良い。中でも、二軸延伸熱可塑性フィルム、とくにポリプロピレン、ポリエチレンテレフタレート、ポリアミドからなる二軸延伸熱可塑性フィルムが好ましい。
又、基材層の片面あるいは両面を、本発明の易カット性フィルムのフィルム基材との接着性を改良するために、例えば、コロナ処理、火炎処理、プラズマ処理、アンダーコート処理等の表面活性化処理を行っておいてもよい。基材層の厚さは、通常５〜１０００μｍ、好ましくは７〜１００μｍの範囲にある。
The easy-cut laminated film of the present invention is a substrate made of a sheet or film made of a thermoplastic resin, paper, aluminum foil, etc. on one side of the film substrate (the surface on which no heat-bonding layer is formed). Layers may be stacked.
When a thermoplastic resin is used as the base material layer, various known thermoplastic resins such as polyolefin (polyethylene, polypropylene, poly-4-methyl / 1-pentene, polybutene, etc.), polyester (polyethylene terephthalate, polybutylene terephthalate, Polyethylene naphthalate, etc.), polyamide (nylon-6, nylon-66, polymetaxylene adipamide, etc.), polyvinyl chloride, polyimide, ethylene / vinyl acetate copolymer or saponified product thereof, polyvinyl alcohol, polyacrylonitrile, polycarbonate , Polystyrene, ionomer, or a mixture thereof. Of these, thermoplastic resins having good stretchability and transparency, such as polypropylene, polyethylene terephthalate, and polyamide, are preferable.
In addition, the base material layer made of such a thermoplastic resin film may be an unstretched film or a stretched film, or one or two or more types of coextrusion molding, extrusion lamination, dry lamination, thermal lamination. The laminated body obtained by etc. may be sufficient. Among them, a biaxially stretched thermoplastic film, particularly a biaxially stretched thermoplastic film made of polypropylene, polyethylene terephthalate, or polyamide is preferable.
Moreover, in order to improve the adhesiveness of one side or both sides of the base material layer to the film base material of the easy-cut film of the present invention, for example, surface activity such as corona treatment, flame treatment, plasma treatment, undercoat treatment, etc. It is also possible to carry out the conversion process. The thickness of the base material layer is usually 5 to 1000 μm, preferably 7 to 100 μm.
本発明の易カット性積層フィルムを製造する方法は種々公知のフィルム成形方法、例えば、多層Ｔ−ダイフィルム成形方法、多層インフレーションフィルム成形方法を採用し得る。その際、フィルム成形する前に、熱融着層を構成する上記組成のエチレン系重合体組成物を予め用意しておいてもよいし、エチレン・α―オレフィンランダム共重合体（Ｂ）及び高圧法低密度ポリエチレン（Ｃ）を所定量計量して直接フィルム成形機に投入してもよい。かかる積層フィルムは夫々別個にフィルムを成形後貼り合せてもよいが、二台あるいは三台以上の押出機を用い、マルチマニホールドあるいはフィードブロックを備えたＴ−ダイを用いて共押出し成形による方法、逐次合流タイプ、逐次・同時併用合流タイプあるいは同時合流タイプの多層インフレーションダイを用いて共押出し成形による方法が好ましく、とくにＴ−ダイを用いる方法が、より透明性に優れた積層フィルムが得られる。
Ｔ−ダイを用いて共押出し成形による方法を用いる場合は、通常、１９０℃〜２５０℃の押出温度でＴ−ダイより共押出し、３０℃〜７０℃のキャスティングロールで急冷した後、ラミネート層をコロナ処理する方法を採用し得る。また、Ｔ−ダイより共押出し、３０℃〜７０℃のキャスティングロールで急冷する前に、共押出しされた溶融状態の積層フィルムを引き伸ばすことにより、より易カット性に優れた積層フィルムが得られる。
As a method for producing the easy-cut laminated film of the present invention, various known film forming methods, for example, a multilayer T-die film forming method and a multilayer inflation film forming method can be adopted. At that time, before forming the film, an ethylene polymer composition having the above composition constituting the heat-sealing layer may be prepared in advance, or the ethylene / α-olefin random copolymer (B) and the high pressure may be prepared. A predetermined amount of the method low density polyethylene (C) may be weighed and directly fed into a film forming machine. Such laminated films may be laminated separately after forming the film, respectively, using two or three or more extruders, a method by coextrusion molding using a T-die equipped with a multi-manifold or a feed block, A method of co-extrusion using a sequential merging type, a sequential / simultaneous combined merging type or a simultaneous merging type multilayer inflation die is preferred, and a method using a T-die in particular provides a laminated film with better transparency.
In the case of using the method by coextrusion molding using a T-die, it is usually coextruded from a T-die at an extrusion temperature of 190 ° C. to 250 ° C. and rapidly cooled with a casting roll of 30 ° C. to 70 ° C. A method of corona treatment may be employed. Moreover, before co-extrusion from a T-die and quenching with a casting roll at 30 ° C. to 70 ° C., the laminated film in a molten state that has been co-extruded is stretched to obtain a laminated film with better cutability.
次に本発明を、実施例を通して説明するが、本発明はそれら実施例によって限定されるものではない。 EXAMPLES Next, although this invention is demonstrated through an Example, this invention is not limited by these Examples.
本発明における各種試験法および評価法は次の通りである。
（１）密度（ｇ／ｃｍ３）
ＪＩＳ Ｋ ７２１０に準拠したＭＦＲ測定装置にて作製したストランドを、蒸留水が沸騰してから６０分間煮沸後、６０分かけて室温まで徐冷した後、ＪＩＳ Ｋ ７１１２に準拠し、Ｄ法（密度勾配管）により測定した。
（２）融点（℃）
測定には、示差走査熱量計（ＤＳＣ）としてティ・エイ・インスツルメント社製 Q１００を用いた。試料約５ｍｇを精秤し，ＪＩＳ K ７１２１に準拠し，１０℃から加熱速度：１０℃／分で１８０℃迄昇温して試料を一旦融解させた後，１８０℃に１０分間維持し，冷却速度：１０℃／分で１０℃迄降温して結晶化させた後，１０℃に５分間維持した後，再度加熱速度：１０℃／分で１８０℃迄昇温して熱融解曲線を得た時の融解ピークの頂点温度を融点（Ｔｍ）とした。
（３）引裂強度（Ｎ／ｃｍ）
東洋精機製作所製の軽荷重引裂試験機を使用して、引裂強度を測定した。（測定器はＪＩＳ Ｐ ８１１６ 及び ＡＳＴＭ１９２２を参考に設計）。積層フィルムから長辺が積層フィルムの機械方向（ＭＤ）となるようにして長辺６３．５ｍｍ、短辺が５０ｍｍの長方形に切り出し、短辺の中心に１２．７ｍｍの切り込みを入れて引裂強度を測定した。
（４）破袋強度（回）
積層フィルムのコロナ処理したフィルム基材層面にウレタン型接着剤〔武田薬品工業製：商品名 タケラックＡ９６８；２０％、タケラックＡ８；２０％及び酢酸エチル；６０％〕を塗布・乾燥後、厚さ１５μｍの二軸延伸ポリアミドフィルムを貼り合わせ（ドライラミネート）して多層フィルムを用意した。得られた多層フィルムの熱融着層面を内側にして縦１５０ｍｍ×横１３０ｍｍの３方シール袋に加工し、この３方シール袋に水２５０ｍｌを充填して密封した。その後５℃雰囲気下に２４時間以上放置し、同雰囲気下にて重さ１ｋｇの重りを載せて０．７ｍの高さから水平落下させ、破袋するまでの落袋回数を計測した。
（５）ヘイズ（％）
ＪＩＳ Ｋ ７１３６に準拠し、積層フィルム１枚のヘイズ（％）を測定した。測定装置はＨａｚｅ Ｍｅｔｅｒ（日本電色工業社製 ＮＤＨ−２０００）を使用した。
Various test methods and evaluation methods in the present invention are as follows.
(1) Density (g / cm 3 )
The strand produced by the MFR measuring device based on JIS K 7210 was boiled for 60 minutes after boiling distilled water, and then gradually cooled to room temperature over 60 minutes. Then, according to JIS K 7112, the method D (density Gradient tube).
(2) Melting point (° C)
For the measurement, Q100 manufactured by TA Instruments Inc. was used as a differential scanning calorimeter (DSC). About 5 mg of the sample is precisely weighed, and in accordance with JIS K 7121, the sample is heated from 10 ° C. to 180 ° C. at a heating rate of 10 ° C./minute to melt the sample once, then maintained at 180 ° C. for 10 minutes, and cooled. Rate: Crystallized by cooling to 10 ° C. at 10 ° C./min, maintained at 10 ° C. for 5 minutes, then heated again to 180 ° C. at 10 ° C./min to obtain a thermal melting curve The peak temperature of the melting peak at that time was defined as the melting point (Tm).
(3) Tear strength (N / cm)
The tear strength was measured using a light load tear tester manufactured by Toyo Seiki Seisakusho. (The measuring instrument is designed with reference to JIS P 8116 and ASTM 1922). Cut the laminated film into a rectangle with a long side of 63.5 mm and a short side of 50 mm so that the long side is in the machine direction (MD) of the laminated film, and make a 12.7 mm cut in the center of the short side to increase the tear strength. It was measured.
(4) Bag breaking strength (times)
After applying and drying a urethane type adhesive (product name: Takeda A968; 20%, Takelac A8; 20% and ethyl acetate; 60%) on the surface of the film base layer subjected to corona treatment of the laminated film, the thickness is 15 μm. The biaxially stretched polyamide film was laminated (dry laminated) to prepare a multilayer film. The resulting multilayer film was processed into a three-sided seal bag measuring 150 mm in length and 130 mm in width with the heat-sealing layer surface inside, and the three-side seal bag was filled with 250 ml of water and sealed. Thereafter, the sample was left in a 5 ° C. atmosphere for 24 hours or more, and a weight of 1 kg was placed in the same atmosphere, dropped horizontally from a height of 0.7 m, and the number of dropped bags until the bag was broken was measured.
(5) Haze (%)
Based on JIS K7136, the haze (%) of one laminated film was measured. As a measuring apparatus, Haze Meter (Nippon Denshoku Industries Co., Ltd. NDH-2000) was used.
本発明の実施例及び比較例で用いた重合体及び組成物は次の通りである。
（１） エチレン・１−ブテンランダム共重合体（ＥＢ−１）
密度；０．９１９ｇ／ｃｍ３、ＭＦＲ；２．０ｇ／１０分、融点；１１７℃。
（２）エチレン・１−ヘキセンランダム共重合体（ＥＯ−１）
密度；０．９１８ｇ／ｃｍ３、ＭＦＲ；３．８ｇ／１０分、融点；１１５℃。
（３）エチレン・１−ヘキセンランダム共重合体（ＥＯ−２）
密度；０．９１３ｇ／ｃｍ３、ＭＦＲ；３．８ｇ／１０分、融点；１１４℃。
（４）高圧法低密度ポリエチレン（ＨＰＬ−１）
密度；０．９１８ｇ／ｃｍ３、ＭＦＲ；１．１ｇ／１０分、融点；１０８℃。
（５）高圧法低密度ポリエチレン（ＨＰＬ−２）
密度；０．９２３ｇ／ｃｍ３、ＭＦＲ；４．２ｇ／１０分、融点；１１１℃。
The polymers and compositions used in the examples and comparative examples of the present invention are as follows.
(1) Ethylene / 1-butene random copolymer (EB-1)
Density: 0.919 g / cm 3 , MFR; 2.0 g / 10 min, melting point: 117 ° C.
(2) Ethylene / 1-hexene random copolymer (EO-1)
Density: 0.918 g / cm 3 , MFR: 3.8 g / 10 min, melting point: 115 ° C.
(3) Ethylene / 1-hexene random copolymer (EO-2)
Density: 0.913 g / cm 3 , MFR: 3.8 g / 10 min, melting point: 114 ° C.
(4) High pressure method low density polyethylene (HPL-1)
Density: 0.918 g / cm 3 , MFR; 1.1 g / 10 min, melting point: 108 ° C.
(5) High pressure method low density polyethylene (HPL-2)
Density: 0.923 g / cm 3 , MFR; 4.2 g / 10 min, melting point: 111 ° C.
実施例１
フィルム基材用の重合体としてエチレン・１−ブテンランダム共重合体（ＥＢ−１）及び熱融着層用の重合体組成物としてエチレン・１−ヘキセンランダム共重合体（ＥＯ−１）８５重量％及び高圧法低密度ポリエチレン（ＨＰＬ−１）１５重量％からなるエチレン系重合体組成物を用意し、それぞれ二台の４０ｍｍφ押出機を用いて２１０℃で溶融した後、フィードブロックを備えたダイ幅０．４ｍのＴ−ダイより２１０℃で共押出しし、５５℃のキャスティングロールで急冷した後、フィルム基材の表面をコロナ処理して、層比がフィルム基材層：８０％及び熱融着層：２０％からなる厚さ４０μｍの積層フィルムを得た。
得られた積層フィルムを前記方法で評価した。評価結果を表１に示す。
Example 1
Ethylene / 1-butene random copolymer (EB-1) as the polymer for the film substrate and 85 weight by weight of ethylene / 1-hexene random copolymer (EO-1) as the polymer composition for the heat fusion layer And a high-pressure method low-density polyethylene (HPL-1) 15% by weight of an ethylene polymer composition, each melted at 210 ° C. using two 40 mmφ extruders, and then a die provided with a feed block After co-extrusion from a 0.4m wide T-die at 210 ° C and quenching with a casting roll at 55 ° C, the surface of the film substrate was subjected to corona treatment, and the layer ratio was 80% and the film was melted. Adhesion layer: A laminated film having a thickness of 40 μm consisting of 20% was obtained.
The obtained laminated film was evaluated by the above method. The evaluation results are shown in Table 1.
実施例２
実施例１で用いたエチレン系重合体組成物に代え、熱融着層用の重合体組成物としてエチレン・１−ヘキセンランダム共重合体（ＥＯ−１）８５重量％及び高圧法低密度ポリエチレン（ＨＰＬ−２）１５重量％からなるエチレン系重合体組成物を用い、層比をフィルム基材層：８５％及び熱融着層：１５％とする以外は、実施例１と同様に行い、厚さ４０μｍの積層フィルムを得た。
得られた積層フィルムの評価結果を表１に示す。
Example 2
Instead of the ethylene polymer composition used in Example 1, 85% by weight of ethylene / 1-hexene random copolymer (EO-1) and high pressure method low density polyethylene ( HPL-2) The same procedure as in Example 1 was carried out except that an ethylene polymer composition consisting of 15% by weight was used, and the layer ratio was set to 85% for the film base layer and 15% for the heat fusion layer. A laminated film having a thickness of 40 μm was obtained.
The evaluation results of the obtained laminated film are shown in Table 1.
比較例１
実施例１で用いたエチレン系重合体組成物に代え、熱融着層用の重合体組成物としてエチレン・１−ヘキセンランダム共重合体（ＥＯ−１）６５重量％及び高圧法低密度ポリエチレン（ＨＰＬ−２）３５重量％からなるエチレン系重合体組成物を用いる以外は実施例１と同様に行い、厚さ４０μｍの積層フィルムを得た。
得られた積層フィルムの評価結果を表１に示す。
Comparative Example 1
Instead of the ethylene polymer composition used in Example 1, 65% by weight of ethylene / 1-hexene random copolymer (EO-1) and high pressure method low density polyethylene ( HPL-2) A laminated film having a thickness of 40 μm was obtained in the same manner as in Example 1 except that an ethylene polymer composition consisting of 35% by weight was used.
The evaluation results of the obtained laminated film are shown in Table 1.
比較例２
実施例１で用いたエチレン系重合体組成物に代え、熱融着層用の重合体組成物としてエチレン・１−ヘキセンランダム共重合体（ＥＯ−２）８０重量％及び高圧法低密度ポリエチレン（ＨＰＬ−２）２０重量％からなるエチレン系重合体組成物を用いる以外は実施例１と同様に行い、厚さ４０μｍの積層フィルムを得た。
得られた積層フィルムの評価結果を表１に示す。
Comparative Example 2
Instead of the ethylene polymer composition used in Example 1, 80% by weight of ethylene / 1-hexene random copolymer (EO-2) and high pressure method low density polyethylene ( HPL-2) A laminated film having a thickness of 40 μm was obtained in the same manner as in Example 1 except that an ethylene polymer composition composed of 20% by weight was used.
The evaluation results of the obtained laminated film are shown in Table 1.
比較例３
実施例１で用いたエチレン系重合体組成物に代え、熱融着層用の共重合体としてエチレン・１−ヘキセンランダム共重合体（ＥＯ−１）を単独で用いる以外は実施例１と同様に行い、厚さ４０μｍの積層フィルムを得た。
得られた積層フィルムの評価結果を表１に示す。
Comparative Example 3
It replaces with the ethylene-type polymer composition used in Example 1, and is the same as that of Example 1 except using ethylene / 1-hexene random copolymer (EO-1) independently as a copolymer for heat-fusion layers. And a laminated film having a thickness of 40 μm was obtained.
The evaluation results of the obtained laminated film are shown in Table 1.
比較例４
実施例１で用いたエチレン系重合体組成物に代え、熱融着層用の共重合体としてエチレン・１−ブテンランダム共重合体（ＥＢ−１）を単独で用いる以外は実施例１と同様に行い、厚さ４０μｍの積層フィルムを得た。
得られた積層フィルムの評価結果を表１に示す。
Comparative Example 4
It replaces with the ethylene-type polymer composition used in Example 1, and is the same as that of Example 1 except using ethylene / 1-butene random copolymer (EB-1) alone as a copolymer for heat-fusion layers. And a laminated film having a thickness of 40 μm was obtained.
The evaluation results of the obtained laminated film are shown in Table 1.
比較例５
実施例１で用いたエチレン・１−ブテンランダム共重合体（ＥＢ−１）に代えてフィルム基材用共重合体としてエチレン・１−ヘキセンランダム共重合体（ＥＯ−１）及び熱融着層用の共重合体としてエチレン・１−ヘキセンランダム共重合体（ＥＯ−１）を単独で用いる以外は実施例１と同様に行い、厚さ４０μｍの積層フィルムを得た。
得られた積層フィルムの評価結果を表１に示す。
Comparative Example 5
Instead of the ethylene / 1-butene random copolymer (EB-1) used in Example 1, an ethylene / 1-hexene random copolymer (EO-1) and a heat fusion layer as a copolymer for a film substrate A laminated film having a thickness of 40 μm was obtained in the same manner as in Example 1 except that ethylene / 1-hexene random copolymer (EO-1) was used alone as a copolymer for use.
The evaluation results of the obtained laminated film are shown in Table 1.
表１から明らかなように、フィルム基材用の共重合体として密度が０．９１０〜０．９４０ｇ／ｃｍ３の範囲のエチレン・１−ブテンランダム共重合体を、熱融着層として密度が０．９１６〜０．９３５ｇ／ｃｍ３の範囲のエチレン・１―ヘキセンランダム共重合体：９５〜７０重量％と高圧法低密度ポリエチレン：５〜３０重量％とからなるエチレン系重合体組成物を用いることにより、引裂強度が低く（易カット性に優れ）且つ破袋強度に優れた積層フィルム（実施例１及び実施例２）が得られる。
それに比べ、熱融着層として高圧法低密度ポリエチレンの量を３５重量％とした積層フィルム（比較例１）は、易カット性は優れるものの、破袋強度及び透明性が劣り、一方、熱融着層として高圧法低密度ポリエチレンを添加しない場合（比較例３）は、破袋強度は優れるものの易カット性に劣り、いずれも易カット性及び破袋強度がともに優れた積層フィルムは得られないことが明らかである。
また、熱融着層を構成するエチレン系重合体組成物の成分として密度が０．９１３ｇ／ｃｍ３と０．９１６ｇ／ｃｍ３未満のエチレン・１―ヘキセンランダム共重合体を用いた積層フィルム（比較例２）は、破袋強度は優れるものの、易カット性が劣る。
また、全層にエチレン・１−ブテンランダム共重合体を用いた（積層）フィルム（比較例４）は、易カット性は優れるものの破袋強度が劣り、全層にエチレン・１―ヘキセンランダム共重合体を用いた（積層）フィルム（比較例５）は、破袋強度は優れるものの易カット性が劣る。
As is apparent from Table 1, an ethylene / 1-butene random copolymer having a density in the range of 0.910 to 0.940 g / cm 3 as a copolymer for a film substrate, and a density as a heat fusion layer. An ethylene polymer composition comprising an ethylene / 1-hexene random copolymer in a range of 0.916 to 0.935 g / cm 3 : 95 to 70% by weight and a high-pressure low-density polyethylene: 5 to 30% by weight. By using, laminated films (Example 1 and Example 2) having low tear strength (excellent cutability) and excellent bag breaking strength can be obtained.
In contrast, a laminated film (Comparative Example 1) in which the amount of high-pressure low-density polyethylene is 35% by weight as a heat-sealing layer is excellent in easy-cutting properties but is inferior in bag breaking strength and transparency. When no high-pressure low-density polyethylene is added as a deposition layer (Comparative Example 3), although the bag breaking strength is excellent, it is inferior in easy-cutting properties, and in any case, a laminated film having both easy cutting properties and excellent bag breaking strength is not obtained. It is clear.
Further, a laminated film using an ethylene / 1-hexene random copolymer having a density of less than 0.913 g / cm 3 and less than 0.916 g / cm 3 as a component of the ethylene polymer composition constituting the heat-sealing layer ( In Comparative Example 2), although the bag breaking strength is excellent, the easy-cut property is inferior.
In addition, the (laminated) film (Comparative Example 4) using ethylene / 1-butene random copolymer for all layers is excellent in easy-cut property but has poor bag breaking strength, and all layers have ethylene / 1-hexene random copolymer. The (laminated) film using the polymer (Comparative Example 5) has excellent bag breaking strength but is inferior in easy-cut property.
本発明の易カット性積層フィルムは、易カット性、透明性、耐衝撃性及びヒートシール性に優れるので、かかる特徴を活かして単独でもあるいは基材層と積層して、易カット性を求められる食品、菓子、スナック、薬品等の包装袋やカット性テープ、スタンディングパウチ、チューブ等として使用される易カット性の包装用フィルムとして用い得る。 Since the easy-cut laminated film of the present invention is excellent in easy-cut property, transparency, impact resistance, and heat-sealability, it is required to have easy-cut properties by itself or by laminating with a base material layer taking advantage of such characteristics. It can be used as an easy-cut packaging film used as packaging bags for foods, confectionery, snacks, medicines, etc., cut tapes, standing pouches, tubes and the like.
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| JP5338062B2 (en) * | 2007-09-28 | 2013-11-13 | 大日本印刷株式会社 | Multilayer laminated film |
| JP2012187884A (en) * | 2011-03-14 | 2012-10-04 | Shikoku Kako Kk | Packaging bag for hydrogen sulfide gas corrosive product |
| JP6079103B2 (en) * | 2012-09-28 | 2017-02-15 | 大日本印刷株式会社 | Sealant film, and packaging material and packaging bag using the same |
| JP6993424B2 (en) * | 2017-10-24 | 2022-01-13 | 株式会社プライムポリマー | Easy-to-open sealant film and its uses |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001064456A (en) * | 1999-08-26 | 2001-03-13 | Ube Ind Ltd | Readily tearable film |
| JP2002127333A (en) * | 2000-10-30 | 2002-05-08 | Ube Ind Ltd | Multi-layer film and laminate |
| JP2004025562A (en) * | 2002-06-25 | 2004-01-29 | Toyobo Co Ltd | Polyolefin polymer laminated film and package |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001064456A (en) * | 1999-08-26 | 2001-03-13 | Ube Ind Ltd | Readily tearable film |
| JP2002127333A (en) * | 2000-10-30 | 2002-05-08 | Ube Ind Ltd | Multi-layer film and laminate |
| JP2004025562A (en) * | 2002-06-25 | 2004-01-29 | Toyobo Co Ltd | Polyolefin polymer laminated film and package |
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| JP2006056129A (en) | 2006-03-02 |
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