JP4609280B2 - Electronic component mounting apparatus, electronic component mounting method, and ultrasonic vibration device - Google Patents
Electronic component mounting apparatus, electronic component mounting method, and ultrasonic vibration device Download PDFInfo
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- JP4609280B2 JP4609280B2 JP2005321947A JP2005321947A JP4609280B2 JP 4609280 B2 JP4609280 B2 JP 4609280B2 JP 2005321947 A JP2005321947 A JP 2005321947A JP 2005321947 A JP2005321947 A JP 2005321947A JP 4609280 B2 JP4609280 B2 JP 4609280B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Description
本発明は、電子部品を回路基板に装着する技術、および、対象物に超音波振動を付与する超音波振動デバイスに関する。 The present invention relates to a technique for mounting an electronic component on a circuit board, and an ultrasonic vibration device that applies ultrasonic vibration to an object.
従来より、プリント基板等の回路基板に電子部品を装着する装置では、部品保持部に保持された電子部品の電極と回路基板の電極とを接合する様々な方法が利用されており、電子部品を短時間で接合することができる方法の１つとして超音波を利用する接合方法（以下、「超音波接合」という。）が知られている。超音波接合では、回路基板に押圧された電子部品に超音波振動を付与することにより振動させ、電子部品の電極（例えば、バンプが形成されている。）と回路基板の電極とを電気的に接合する。また、近年、超音波接合を行う際に部品保持部を加熱することにより、電子部品の装着性能を向上させることも提案されている。 Conventionally, in an apparatus for mounting an electronic component on a circuit board such as a printed circuit board, various methods for joining the electrode of the electronic component held by the component holding unit and the electrode of the circuit board have been used. As one of the methods capable of bonding in a short time, a bonding method using ultrasonic waves (hereinafter referred to as “ultrasonic bonding”) is known. In ultrasonic bonding, the electronic component pressed against the circuit board is vibrated by applying ultrasonic vibration to electrically connect the electrode (for example, bumps) of the electronic component and the electrode of the circuit board. Join. In recent years, it has also been proposed to improve the mounting performance of electronic components by heating the component holding portion when performing ultrasonic bonding.
ところで、超音波振動を発生する一般的な超音波振動デバイスの圧電素子では、圧電板と電極板との間の接着に耐熱性が低い樹脂が用いられるため、圧電素子の温度が過度に上昇すると、超音波振動を発生することができなくなってしまう。そこで、特許文献１では、超音波振動デバイスに取り付けられるホーンに対して、ホーンの中心軸に垂直な一方向に伸びる複数の貫通孔を形成し、これらの貫通孔に除熱用のエアを付与することにより、圧電素子の温度の過度の上昇を防止する手法が開示されている。
ところで、超音波接合において電子部品を効率よく回路基板に装着するには、電子部品の振動特性が重要となる。しかしながら、特許文献１のようにホーンに一方向に伸びる複数の貫通孔を形成した場合には、設計上、電子部品の振動特性の低下を抑制することが容易ではない。 By the way, in order to efficiently mount an electronic component on a circuit board in ultrasonic bonding, vibration characteristics of the electronic component are important. However, when a plurality of through-holes extending in one direction are formed in the horn as in Patent Document 1, it is not easy to suppress the deterioration of the vibration characteristics of the electronic component by design.
本発明は上記課題に鑑みなされたものであり、加熱および超音波振動を併用した電子部品の装着において、圧電素子の温度の過度の上昇を防止しつつ電子部品の振動特性の低下を抑制して、電子部品を安定してかつ効率よく回路基板上に装着することを目的とし、加熱される対象物に超音波振動を付与する超音波振動デバイスにおいて、圧電素子の温度の過度の上昇を防止しつつ対象物の振動特性の低下を抑制することも目的としている。 The present invention has been made in view of the above problems, and suppresses a decrease in vibration characteristics of an electronic component while preventing an excessive increase in the temperature of the piezoelectric element in mounting an electronic component using both heating and ultrasonic vibration. In an ultrasonic vibration device that applies ultrasonic vibration to an object to be heated for the purpose of stably and efficiently mounting electronic components on a circuit board, it prevents an excessive increase in the temperature of the piezoelectric element. However, it is also an object to suppress a decrease in vibration characteristics of the object.
請求項１に記載の発明は、電子部品を回路基板に装着する電子部品装着装置であって、所定の方向に伸びる本体部の一端側に電子部品を保持する保持ツールが取り付けられ、前記本体部の他端側に前記本体部および前記保持ツールを介して前記電子部品に超音波振動を付与する圧電素子が固定された装着ヘッドと、前記装着ヘッドを介して前記電子部品を回路基板に向けて押圧する押圧機構と、前記保持ツールを加熱する加熱部と、前記装着ヘッドにおいて前記加熱部により加熱される部位と前記圧電素子との間の前記本体部の空冷部位にガスを供給して前記空冷部位を冷却するガス供給部とを備え、前記本体部の前記空冷部位に複数の開口に連絡する孔が形成されており、前記空冷部位が、前記本体部の前記所定の方向を向く中心軸を中心としてｎ回回転対称性（ｎは３以上の整数）を有する。 The invention according to claim 1 is an electronic component mounting apparatus for mounting an electronic component on a circuit board, wherein a holding tool for holding the electronic component is attached to one end side of the main body extending in a predetermined direction, and the main body A mounting head in which a piezoelectric element for applying ultrasonic vibration to the electronic component is fixed to the other end side of the electronic component via the main body and the holding tool, and the electronic component is directed to the circuit board via the mounting head. A pressure mechanism for pressing; a heating unit for heating the holding tool; and a gas supply to the air cooling part of the main body part between the part heated by the heating part and the piezoelectric element in the mounting head to provide the air cooling. A gas supply part for cooling the part, and a hole communicating with a plurality of openings is formed in the air cooling part of the main body part, and the air cooling part has a central axis facing the predetermined direction of the main body part. center n-fold rotational symmetry with (n is an integer of 3 or more) with a.
請求項２に記載の発明は、請求項１に記載の電子部品装着装置であって、前記孔が、前記空冷部位の前記中心軸に垂直な断面の中心から外周に向かって放射状に伸びる複数の冷却孔を含む。 A second aspect of the present invention is the electronic component mounting apparatus according to the first aspect, wherein the hole extends radially from the center of the cross section perpendicular to the central axis of the air-cooled portion toward the outer periphery. Includes cooling holes.
請求項３に記載の発明は、請求項１または２に記載の電子部品装着装置であって、前記複数の開口のそれぞれが前記所定の方向に伸びる形状である。 A third aspect of the present invention is the electronic component mounting apparatus according to the first or second aspect, wherein each of the plurality of openings extends in the predetermined direction.
請求項４に記載の発明は、請求項１ないし３のいずれかに記載の電子部品装着装置であって、前記空冷部位の前記電子部品が装着される回路基板側を非接触にて覆うとともに、前記複数の開口から前記回路基板へと向かうガスを遮蔽するカバー部をさらに備える。 Invention of Claim 4 is an electronic component mounting apparatus in any one of Claim 1 thru | or 3, Comprising: While covering the circuit board side in which the said electronic component of the said air cooling site | part is mounted | worn non-contactingly, A cover portion is further provided for shielding gas from the plurality of openings toward the circuit board.
請求項５に記載の発明は、請求項１ないし４のいずれかに記載の電子部品装着装置であって、前記本体部の前記空冷部位を含む前記圧電素子側の部位および前記圧電素子が、前記本体部の他の部位から分離可能な超音波振動デバイスの一部である。 Invention of Claim 5 is an electronic component mounting apparatus in any one of Claim 1 thru | or 4, Comprising: The site | part by the side of the said piezoelectric element including the said air cooling site | part of the said main-body part, and the said piezoelectric element are the said It is a part of the ultrasonic vibration device that can be separated from other parts of the main body.
請求項６に記載の発明は、請求項５に記載の電子部品装着装置であって、前記超音波振動デバイスの前記圧電素子が、複数の圧電板と複数の電極板とを接着用の樹脂を介して交互に積層したものである。 A sixth aspect of the present invention is the electronic component mounting apparatus according to the fifth aspect, wherein the piezoelectric element of the ultrasonic vibration device is made of a resin for bonding a plurality of piezoelectric plates and a plurality of electrode plates. Are alternately stacked.
請求項７に記載の発明は、請求項１ないし６のいずれかに記載の電子部品装着装置であって、前記空冷部位の前記中心軸に垂直な断面の外形が円形である。 A seventh aspect of the present invention is the electronic component mounting apparatus according to any one of the first to sixth aspects, wherein an outer shape of a cross section perpendicular to the central axis of the air-cooled portion is circular.
請求項８に記載の発明は、請求項５または６に記載の電子部品装着装置であって、前記空冷部位の前記中心軸に垂直な断面の外形が正六角形または正八角形である。 The invention according to claim 8 is the electronic component mounting apparatus according to claim 5 or 6, wherein the outer shape of a cross section perpendicular to the central axis of the air-cooled portion is a regular hexagon or a regular octagon.
請求項９に記載の発明は、電子部品を回路基板に装着する電子部品装着方法であって、ａ）装着ヘッドの所定の方向に伸びる本体部の一端側に取り付けられた保持ツールにて電子部品を保持する工程と、ｂ）前記本体部の他端側に固定された圧電素子により前記本体部および前記保持ツールを介して前記電子部品に超音波振動を付与する工程と、ｃ）前記ｂ）工程に並行して、前記装着ヘッドを介して前記電子部品を回路基板に向けて押圧する工程と、ｄ）前記ａ）ないしｃ）工程に並行して、前記保持ツールを加熱部により加熱する工程と、ｅ）前記ｄ）工程に並行して、前記装着ヘッドにおいて前記加熱部により加熱される部位と前記圧電素子との間の前記本体部の空冷部位にガスを供給して前記空冷部位を冷却する工程とを備え、前記本体部の前記空冷部位に複数の開口に連絡する孔が形成されており、前記空冷部位が、前記本体部の前記所定の方向を向く中心軸を中心としてｎ回回転対称性（ｎは３以上の整数）を有する。 The invention according to claim 9 is an electronic component mounting method for mounting an electronic component on a circuit board, wherein: a) the electronic component is held by a holding tool attached to one end of a main body extending in a predetermined direction of the mounting head. B) a step of applying ultrasonic vibration to the electronic component via the main body and the holding tool by a piezoelectric element fixed to the other end of the main body, and c) b) In parallel with the step, the step of pressing the electronic component toward the circuit board via the mounting head, and d) The step of heating the holding tool by the heating unit in parallel with the steps a) to c) E) In parallel with the step d), gas is supplied to the air-cooling part of the main body part between the part heated by the heating part in the mounting head and the piezoelectric element to cool the air-cooling part. Comprising the steps of: Holes communicating with a plurality of openings are formed in the air-cooling part of the body part, and the air-cooling part has n-fold rotational symmetry about the central axis facing the predetermined direction of the body part (n is 3 or more) Integer).
請求項１０に記載の発明は、対象物に超音波振動を付与する超音波振動デバイスであって、所定の中心軸に沿う方向の一端側に加熱される対象物が取り付けられるとともに除熱用のガスが付与される補助部材と、前記補助部材の他端側に固定される圧電素子とを備え、前記補助部材に複数の開口に連絡する孔が形成されており、前記補助部材が、前記中心軸を中心としてｎ回回転対称性（ｎは３以上の整数）を有する。 The invention according to claim 10 is an ultrasonic vibration device that applies ultrasonic vibration to an object, and the object to be heated is attached to one end side in a direction along a predetermined central axis and is used for heat removal. An auxiliary member to which gas is applied; and a piezoelectric element fixed to the other end of the auxiliary member, wherein the auxiliary member has a hole communicating with a plurality of openings, and the auxiliary member has the center It has n-fold rotational symmetry about the axis (n is an integer of 3 or more).
請求項１ないし９の発明では、加熱および超音波振動を併用した電子部品の装着において、圧電素子の温度の過度の上昇を防止しつつ電子部品の振動特性の低下を抑制して、電子部品を安定してかつ効率よく回路基板上に装着することができる。 According to the first to ninth aspects of the present invention, in the mounting of the electronic component using both heating and ultrasonic vibration, the electronic component is controlled by suppressing the deterioration of the vibration characteristic of the electronic component while preventing the temperature of the piezoelectric element from excessively increasing. It can be mounted on the circuit board stably and efficiently.
また、請求項３の発明では、圧電素子の温度の過度の上昇をさらに防止することができ、請求項４の発明では、開口からのガスにより装着途上の電子部品が冷却されて装着性能が低下してしまうことを防止することができ、請求項５の発明では、超音波振動デバイスの一部に複数の開口に連絡する孔を形成することにより、空冷部位以外の本体部の形状を変更することなく圧電素子の温度上昇を抑制することができる。 According to the invention of claim 3, the temperature of the piezoelectric element can be prevented from excessively rising. In the invention of claim 4, the electronic component being mounted is cooled by the gas from the opening, and the mounting performance is deteriorated. In the invention of claim 5, the shape of the main body portion other than the air-cooled portion is changed by forming holes communicating with the plurality of openings in a part of the ultrasonic vibration device. Therefore, the temperature rise of the piezoelectric element can be suppressed.
また、請求項７の発明では、電子部品の振動特性を向上することができ、請求項８の発明では、電子部品の振動特性を向上しつつ、超音波振動デバイスを容易に組み立てることができる。 In the invention of claim 7, the vibration characteristics of the electronic component can be improved, and in the invention of claim 8, the ultrasonic vibration device can be easily assembled while improving the vibration characteristics of the electronic component.
請求項１０の発明では、加熱される対象物に超音波振動を付与する超音波振動デバイスにおいて、圧電素子の温度の過度の上昇を防止しつつ対象物の振動特性の低下を抑制することができる。 According to the invention of claim 10, in the ultrasonic vibration device that applies ultrasonic vibration to the object to be heated, it is possible to suppress a decrease in vibration characteristics of the object while preventing an excessive increase in the temperature of the piezoelectric element. .
図１は、本発明の一の実施の形態に係る電子部品装着装置１を示す正面図であり、図２は電子部品装着装置１の平面図である。電子部品装着装置１は、発光ダイオード（ＬＥＤ）チップ等の微細な電子部品を反転した後に、プリント基板等の回路基板９上への電子部品の装着と電極の接合（すなわち、実装）とを同時に行う、いわゆる、フリップチップ実装装置である。 FIG. 1 is a front view showing an electronic component mounting apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a plan view of the electronic component mounting apparatus 1. The electronic component mounting apparatus 1 simultaneously mounts an electronic component on a circuit board 9 such as a printed circuit board and bonds (ie, mounts) an electrode after reversing a fine electronic component such as a light emitting diode (LED) chip. This is a so-called flip chip mounting apparatus.
電子部品装着装置１は、回路基板９を保持する基板保持部２を備え、基板保持部２の上方（図１中に示す（＋Ｚ）側）には、基板保持部２に保持された回路基板９に電子部品を装着する部品装着ユニット３が設けられ、基板保持部２の（−Ｘ）側には、部品装着ユニット３に電子部品を供給する部品供給部４が設けられる。また、基板保持部２と部品供給部４との間には、部品供給部４により部品装着ユニット３に供給された電子部品を撮像する撮像部６０が設けられ、回路基板９の（＋Ｘ）側には、部品装着ユニット３の装着ヘッド５において電子部品に当接する先端部を研磨する研磨部７が設けられる。電子部品装着装置１では、これらの機構が制御部１０により制御されることにより、回路基板９に対する電子部品の装着が行われる。 The electronic component mounting apparatus 1 includes a board holding unit 2 that holds a circuit board 9, and a circuit board held by the board holding unit 2 above the board holding unit 2 (on the (+ Z) side in FIG. 1). 9, a component mounting unit 3 for mounting electronic components is provided, and a component supply unit 4 for supplying electronic components to the component mounting unit 3 is provided on the (−X) side of the board holding unit 2. An imaging unit 60 that images the electronic component supplied to the component mounting unit 3 by the component supply unit 4 is provided between the substrate holding unit 2 and the component supply unit 4, and is on the (+ X) side of the circuit board 9. In the mounting head 5 of the component mounting unit 3, a polishing portion 7 is provided for polishing the tip portion that contacts the electronic component. In the electronic component mounting apparatus 1, these mechanisms are controlled by the control unit 10, so that the electronic component is mounted on the circuit board 9.
基板保持部２は、回路基板９を保持するステージ２１、および、ステージ２１を図１中のＹ方向に移動するステージ移動機構２２を備える。研磨部７はステージ２１の（＋Ｘ）側に取り付けられており、ステージ移動機構２２によりステージ２１と一体的にＹ方向に移動する。研磨部７は、平らで水平な研磨面７１１を有するシート状の研磨部材７１、および、研磨部材７１を保持する研磨部材保持部７２を備える。 The substrate holding unit 2 includes a stage 21 that holds the circuit board 9 and a stage moving mechanism 22 that moves the stage 21 in the Y direction in FIG. The polishing unit 7 is attached to the (+ X) side of the stage 21 and moves in the Y direction integrally with the stage 21 by the stage moving mechanism 22. The polishing unit 7 includes a sheet-like polishing member 71 having a flat and horizontal polishing surface 711, and a polishing member holding unit 72 that holds the polishing member 71.
部品装着ユニット３は、部品装着部３１および部品装着部３１をＸ方向に移動する装着部移動機構３２を備え、部品装着部３１は、電子部品を保持しつつ回路基板９に装着する装着ヘッド５を有する。部品装着部３１には、装着ヘッド５を昇降する昇降機構３３が設けられる。 The component mounting unit 3 includes a component mounting unit 31 and a mounting unit moving mechanism 32 that moves the component mounting unit 31 in the X direction. The component mounting unit 31 mounts the circuit board 9 while holding the electronic component. Have The component mounting portion 31 is provided with a lifting mechanism 33 that lifts and lowers the mounting head 5.
図３は、装着ヘッド５近傍を拡大して示す図である。装着ヘッド５は図３中のＺＸ平面に平行かつＸ軸に対して僅かに傾斜した中心軸Ｊ１に沿って伸びる本体部５１を有し、本体部５１の一端には圧電素子５２が固定される。本体部５１の他端側には保持ツール５３が着脱可能に取り付けられ、保持ツール５３は電子部品８を吸着保持する先端部５３１を有する。本体部５１は保持ツール５３が圧電素子５２よりも（−Ｚ）側に位置するように所定の傾斜角にてヘッド支持部３４に取り付けられており、ヘッド支持部３４はシャフト３５に固定される。図３に示す状態において、先端部５３１は本体部５１から下方へと柱状に突出する。保持ツール５３（先端部５３１を含む。）はステンレス鋼等にて形成される。昇降機構３３（図１参照）によりシャフト３５がＺ方向に移動することにより、装着ヘッド５が回路基板９や研磨面７１１に対して相対的に昇降する。なお、正確には、装着ヘッド５は、圧電素子５２からの超音波振動に対するいわゆるノーダルポイントにてヘッド支持部３４により支持されている。 FIG. 3 is an enlarged view showing the vicinity of the mounting head 5. The mounting head 5 has a main body 51 extending along a central axis J1 parallel to the ZX plane in FIG. 3 and slightly inclined with respect to the X axis, and a piezoelectric element 52 is fixed to one end of the main body 51. . A holding tool 53 is detachably attached to the other end side of the main body 51, and the holding tool 53 has a tip portion 531 that holds the electronic component 8 by suction. The main body 51 is attached to the head support 34 at a predetermined inclination angle so that the holding tool 53 is positioned on the (−Z) side of the piezoelectric element 52, and the head support 34 is fixed to the shaft 35. . In the state shown in FIG. 3, the distal end portion 531 protrudes downward from the main body portion 51 in a columnar shape. Holding tool 53 (including tip 531) is formed of stainless steel or the like. When the shaft 35 is moved in the Z direction by the elevating mechanism 33 (see FIG. 1), the mounting head 5 is moved up and down relatively with respect to the circuit board 9 and the polishing surface 711. To be precise, the mounting head 5 is supported by the head support portion 34 at a so-called nodal point with respect to ultrasonic vibration from the piezoelectric element 52.
本体部５１は、保持ツール５３側の部材であるホーン５１１、および、圧電素子５２側の部材である補助部材５１２を有し、ホーン５１１の中心軸Ｊ１に垂直な断面の外形は矩形とされ、補助部材５１２の中心軸Ｊ１に垂直な断面の外形は円形とされている（後述する図４参照）。保持ツール５３、および、ホーン５１１の保持ツール５３側の部位には、加熱部３６の棒状のヒータ３６１が中心軸Ｊ１に沿って設けられる。内部に電熱線を有するヒータ３６１は電流供給部３６２に接続され、ヒータ３６１により保持ツール５３が所定の温度に加熱される。 The main body 51 includes a horn 511 that is a member on the holding tool 53 side and an auxiliary member 512 that is a member on the piezoelectric element 52 side, and the outer shape of the cross section perpendicular to the central axis J1 of the horn 511 is rectangular, The outer shape of the cross section perpendicular to the central axis J1 of the auxiliary member 512 is circular (see FIG. 4 described later). A bar-shaped heater 361 of the heating unit 36 is provided along the central axis J1 at a portion of the holding tool 53 and the horn 511 on the holding tool 53 side. The heater 361 having a heating wire inside is connected to the current supply unit 362, and the holding tool 53 is heated to a predetermined temperature by the heater 361.
図４は、図３中の矢印Ａ−Ａの位置における補助部材５１２の断面図である。補助部材５１２には、図４中の断面が中心軸Ｊ１を中心とする円形の中心孔５１３が中心軸Ｊ１に沿って形成されており、中心孔５１３の内部には後述するボルト５４１が挿入されている。補助部材５１２には、中心孔５１３の側面から外周に向かって放射状に伸びる複数の冷却孔５１４（図４の断面における冷却孔５１４の幅は、例えば０．５ｍｍとされる。）が形成されており、複数の冷却孔５１４は中心孔５１３の側面とボルト５４１の外周面との間の間隙を介して互いに連通している。正確には、複数の冷却孔５１４は、中心軸Ｊ１を中心として周方向に４５度だけ回転した位置に順次形成されており、補助部材５１２は中心軸Ｊ１を中心として８回回転対称性を有している。また、図３に示すように、各冷却孔５１４の開口は中心軸Ｊ１に沿う側面において中心軸Ｊ１に沿う方向に伸びる形状となっている。実際には、図４の補助部材５１２の作製時に各冷却孔５１４は中心軸Ｊ１を挟んで対向する他の冷却孔５１４と共にワイヤ加工等の手法にて貫通孔として一度に形成される。以上のように、補助部材５１２には複数の開口を有する孔が形成されており、この孔は補助部材５１２の断面の中心から外周に向かって放射状に伸びる複数の冷却孔５１４を含む構造となっている。 4 is a cross-sectional view of the auxiliary member 512 at the position of the arrow AA in FIG. In the auxiliary member 512, a circular center hole 513 whose cross section in FIG. 4 is centered on the center axis J1 is formed along the center axis J1, and a bolt 541 described later is inserted into the center hole 513. ing. The auxiliary member 512 is formed with a plurality of cooling holes 514 extending radially from the side surface of the center hole 513 toward the outer periphery (the width of the cooling hole 514 in the cross section of FIG. 4 is, for example, 0.5 mm). The plurality of cooling holes 514 communicate with each other via a gap between the side surface of the center hole 513 and the outer peripheral surface of the bolt 541. Precisely, the plurality of cooling holes 514 are sequentially formed at positions rotated by 45 degrees in the circumferential direction around the central axis J1, and the auxiliary member 512 has eight-fold rotational symmetry about the central axis J1. is doing. Moreover, as shown in FIG. 3, the opening of each cooling hole 514 has a shape extending in the direction along the central axis J1 on the side surface along the central axis J1. Actually, when the auxiliary member 512 of FIG. 4 is manufactured, each cooling hole 514 is formed as a through hole at a time by a method such as wire processing together with other cooling holes 514 opposed to each other across the central axis J1. As described above, a hole having a plurality of openings is formed in the auxiliary member 512, and the hole includes a plurality of cooling holes 514 extending radially from the center of the cross section of the auxiliary member 512 toward the outer periphery. ing.
図３に示すように、補助部材５１２の上方にはガス供給部３７に接続されたパイプ３７１が設けられ、補助部材５１２に除熱用のガス（例えば、エア）が供給される。図４の補助部材５１２において、ガス供給部３７から供給されるガスは上部の冷却孔５１４を介して内部へと導かれ、他の冷却孔５１４から外部へと排出される。補助部材５１２の下方には、補助部材５１２を非接触にて覆うとともに、下部の冷却孔５１４から補助部材５１２の下方へと排出されるガスを遮蔽するカバー部３８が設けられる。 As shown in FIG. 3, a pipe 371 connected to the gas supply unit 37 is provided above the auxiliary member 512, and a heat removal gas (for example, air) is supplied to the auxiliary member 512. In the auxiliary member 512 of FIG. 4, the gas supplied from the gas supply unit 37 is guided to the inside through the upper cooling hole 514 and discharged from the other cooling hole 514 to the outside. Below the auxiliary member 512, a cover portion 38 that covers the auxiliary member 512 in a non-contact manner and shields gas discharged from the lower cooling hole 514 to the lower side of the auxiliary member 512 is provided.
図３の圧電素子５２は、複数の圧電板５２１（例えば、ＰＺＴ（チタン酸ジルコン酸鉛）にて形成される圧電板）および複数の電極板５２２を有し、複数の圧電板５２１および複数の電極板５２２は接着用の樹脂５２３を介して交互に積層される。なお、図３では、１つの圧電板５２１および１つの電極板５２２並びにこれらの間に介在する樹脂５２３のみに符号を付している。圧電素子５２の本体部５１とは反対側には、ベース部材５４が取り付けられる。実際には、固定用のボルト５４１により、補助部材５１２とベース部材５４とが圧電素子５２を挟んで固定されており、圧電素子５２に対して中心軸Ｊ１に沿う圧縮応力（いわゆる、予圧）が付与されている。このように、装着ヘッド５では本体部５１の補助部材５１２、圧電素子５２およびベース部材５４が、本体部５１のホーン５１１から分離可能な超音波振動デバイス５５（例えば、ランジュバン振動子型の超音波振動デバイス）となっている。なお、圧電板５２１は、ＰＺＴ以外の他の圧電材料にて形成されてもよい。 3 includes a plurality of piezoelectric plates 521 (for example, a piezoelectric plate formed of PZT (lead zirconate titanate)) and a plurality of electrode plates 522, and the plurality of piezoelectric plates 521 and the plurality of piezoelectric plates 521 are included. The electrode plates 522 are alternately stacked via an adhesive resin 523. In FIG. 3, only one piezoelectric plate 521, one electrode plate 522, and resin 523 interposed therebetween are denoted by reference numerals. A base member 54 is attached to the opposite side of the piezoelectric element 52 from the main body 51. Actually, the auxiliary member 512 and the base member 54 are fixed by the fixing bolt 541 with the piezoelectric element 52 interposed therebetween, and a compressive stress (so-called preload) along the central axis J1 is applied to the piezoelectric element 52. Has been granted. As described above, in the mounting head 5, the auxiliary member 512, the piezoelectric element 52, and the base member 54 of the main body portion 51 can be separated from the horn 511 of the main body portion 51 (for example, a Langevin transducer type ultrasonic wave). Vibration device). The piezoelectric plate 521 may be formed of a piezoelectric material other than PZT.
図１および図２に示すように、部品供給部４は、所定の位置に電子部品を配置する部品配置部４１、部品配置部４１から電子部品を取り出して保持する供給ヘッド４２、供給ヘッド４２をＸ方向に移動する供給ヘッド移動機構４３、および、供給ヘッド４２を回動および僅かに昇降する回動機構４４を備える。部品配置部４１は、多数の電子部品が載置される部品トレイ４１１、部品トレイ４１１を保持するステージ４１２、並びに、部品トレイ４１１をステージ４１２と共にＸ方向およびＹ方向に移動するトレイ移動機構４１３を備える。供給ヘッド４２は、吸着により保持した電子部品を部品装着部３１の装着ヘッド５に供給する供給コレット４２１（図１参照）を備える。供給コレット４２１は、先端に形成された吸引口から吸引を行うことによって電子部品を吸着して保持する。 As shown in FIGS. 1 and 2, the component supply unit 4 includes a component placement unit 41 that places electronic components at predetermined positions, a supply head 42 that takes out and holds electronic components from the component placement unit 41, and a supply head 42. A supply head moving mechanism 43 that moves in the X direction and a rotation mechanism 44 that rotates and slightly raises and lowers the supply head 42 are provided. The component placement unit 41 includes a component tray 411 on which a large number of electronic components are placed, a stage 412 that holds the component tray 411, and a tray moving mechanism 413 that moves the component tray 411 together with the stage 412 in the X direction and the Y direction. Prepare. The supply head 42 includes a supply collet 421 (see FIG. 1) for supplying the electronic component held by suction to the mounting head 5 of the component mounting unit 31. The supply collet 421 sucks and holds the electronic component by performing suction from a suction port formed at the tip.
部品供給部４では、回路基板９に装着される予定の多数の電子部品が、回路基板９に接合されるバンプが形成された側の面（実装後の状態における下面であり、以下、「接合面」という。）を（＋Ｚ）側に向けて（すなわち、回路基板９に装着される向きとは反対向きに）部品トレイ４１１上に載置されている。 In the component supply unit 4, a large number of electronic components to be mounted on the circuit board 9 are surfaces on the side on which bumps to be bonded to the circuit board 9 are formed (the lower surface in a state after mounting. Surface ”) is placed on the component tray 411 with the (+ Z) side facing (that is, in the direction opposite to the direction of mounting on the circuit board 9).
撮像部６０は、装着部移動機構３２による部品装着部３１（特に、装着ヘッド５）の移動経路上であって部品装着部３１の移動と干渉しない位置（本実施の形態では移動経路の真下）に設けられ、装着ヘッド５に保持された電子部品を（−Ｚ）側から撮像する。 The imaging unit 60 is on the movement path of the component mounting unit 31 (particularly, the mounting head 5) by the mounting unit moving mechanism 32 and does not interfere with the movement of the component mounting unit 31 (in this embodiment, directly below the movement path). The electronic component that is provided on the mounting head 5 is imaged from the (−Z) side.
次に、電子部品装着装置１が電子部品を回路基板９上に装着する動作について図５を参照しつつ説明を行う。電子部品装着装置１では、まず、図３の加熱部３６による保持ツール５３の加熱およびガス供給部３７による補助部材５１２へのガスの供給が開始される（ステップＳ１１，Ｓ１２）。これにより、保持ツール５３が、例えば２００℃となるのに対して、圧電素子５２は６０℃以下に保たれる。このとき、図４に示すように、多数の冷却孔５１４が補助部材５１２の中心軸Ｊ１に垂直な断面の中心から外周に向かって放射状に伸びているため、補助部材５１２はほぼ均一に冷却され、補助部材５１２の各部位に温度差が生じて補助部材５１２が歪むことが抑制される。 Next, the operation of mounting the electronic component on the circuit board 9 by the electronic component mounting apparatus 1 will be described with reference to FIG. In the electronic component mounting apparatus 1, first, heating of the holding tool 53 by the heating unit 36 of FIG. 3 and supply of gas to the auxiliary member 512 by the gas supply unit 37 are started (steps S11 and S12). As a result, the holding tool 53 becomes 200 ° C., for example, while the piezoelectric element 52 is kept at 60 ° C. or less. At this time, as shown in FIG. 4, the many cooling holes 514 extend radially from the center of the cross section perpendicular to the central axis J <b> 1 of the auxiliary member 512 toward the outer periphery, so that the auxiliary member 512 is cooled substantially uniformly. In addition, it is possible to prevent the auxiliary member 512 from being distorted due to a temperature difference in each part of the auxiliary member 512.
一方で、図１の部品供給部４では、多数の電子部品が接合面を（＋Ｚ）側に向けて載置された部品トレイ４１１が、予め図１中の（−Ｘ）側に位置している供給ヘッド４２の下方にてトレイ移動機構４１３により移動し、電子部品の接合面が供給コレット４２１により吸着保持される。次に、供給ヘッド４２が反転しつつ供給ヘッド移動機構４３により（＋Ｘ）方向へと移動し、図１中に二点鎖線にて示す位置に位置する。このとき、供給コレット４２１と、図１中に二点鎖線にて示す受渡位置に位置する部品装着部３１の装着ヘッド５とが対向する。 On the other hand, in the component supply unit 4 of FIG. 1, a component tray 411 on which a large number of electronic components are placed with the bonding surface facing the (+ Z) side is previously positioned on the (−X) side in FIG. The moving surface is moved by the tray moving mechanism 413 below the supply head 42, and the joint surface of the electronic component is sucked and held by the supply collet 421. Next, the supply head 42 moves in the (+ X) direction by the supply head moving mechanism 43 while being reversed, and is positioned at a position indicated by a two-dot chain line in FIG. At this time, the supply collet 421 and the mounting head 5 of the component mounting portion 31 located at the delivery position indicated by the two-dot chain line in FIG. 1 face each other.
続いて、昇降機構３３により装着ヘッド５が僅かに下降し、電子部品の上面が装着ヘッド５により吸引吸着されるとともに供給コレット４２１による吸引が停止され、装着ヘッド５が供給コレット４２１から電子部品を受け取って先端部５３１（図３参照）にて吸着保持する（ステップＳ１３）。電子部品の供給が完了すると、昇降機構３３により装着ヘッド５が僅かに上昇し、供給ヘッド４２が、元の位置へと退避する。供給ヘッド４２の退避と並行して、部品装着部３１が撮像部６０の真上へと移動し、撮像部６０により装着ヘッド５の先端部５３１に保持される電子部品が撮像される。撮像部６０からの出力である画像データは制御部１０に送られ、制御部１０では画像データに基づいて部品装着部３１が制御され、装着ヘッド５がＺ方向に伸びる軸を中心に回動して電子部品の姿勢が補正される。 Subsequently, the mounting head 5 is slightly lowered by the elevating mechanism 33, the upper surface of the electronic component is sucked and sucked by the mounting head 5, and suction by the supply collet 421 is stopped, and the mounting head 5 removes the electronic component from the supply collet 421. It is received and sucked and held at the tip 531 (see FIG. 3) (step S13). When the supply of the electronic components is completed, the mounting head 5 is slightly raised by the lifting mechanism 33, and the supply head 42 is retracted to the original position. In parallel with the withdrawal of the supply head 42, the component mounting unit 31 moves right above the imaging unit 60, and the electronic component held by the tip end portion 531 of the mounting head 5 is imaged by the imaging unit 60. Image data that is an output from the imaging unit 60 is sent to the control unit 10, where the component mounting unit 31 is controlled based on the image data, and the mounting head 5 rotates around an axis extending in the Z direction. Thus, the posture of the electronic component is corrected.
部品装着部３１は、装着部移動機構３２によりさらに（＋Ｘ）方向へと移動し、回路基板９上の電子部品の装着予定位置の上方に位置する。装着ヘッド５は回路基板９に向けて下降して接合面に形成されたバンプと回路基板９上の電極とが接触し、押圧機構である昇降機構３３により電子部品が、基板保持部２に保持される回路基板９に対して押圧される（ステップＳ１４）。この状態で（すなわち、電子部品の回路基板９への押圧に並行して）、図３に示す圧電素子５２により本体部５１および保持ツール５３を介して超音波振動が電子部品８に付与されることにより（ステップＳ１５）、電子部品８のバンプが回路基板９の電極に対して電気的に接合され、電子部品８の装着と同時に接合（すなわち、実装）が行われる。このとき、電子部品８が加熱されていることにより、質の高い接合を行うことができる。 The component mounting unit 31 is further moved in the (+ X) direction by the mounting unit moving mechanism 32 and is located above the planned mounting position of the electronic component on the circuit board 9. The mounting head 5 is lowered toward the circuit board 9 so that the bumps formed on the bonding surface come into contact with the electrodes on the circuit board 9, and the electronic component is held on the board holding unit 2 by the lifting mechanism 33 that is a pressing mechanism. The circuit board 9 to be pressed is pressed (step S14). In this state (that is, in parallel with the pressing of the electronic component to the circuit board 9), ultrasonic vibration is applied to the electronic component 8 through the main body 51 and the holding tool 53 by the piezoelectric element 52 shown in FIG. As a result (step S15), the bumps of the electronic component 8 are electrically bonded to the electrodes of the circuit board 9, and bonding (ie, mounting) is performed simultaneously with the mounting of the electronic component 8. At this time, since the electronic component 8 is heated, high-quality bonding can be performed.
電子部品８の装着が終了すると、吸引を停止した装着ヘッド５が昇降機構３３により電子部品８から離れて上昇し、続いて、先端部５３１（正確には、先端部５３１の電子部品８に当接する面）の研磨が必要か否かが確認される。先端部５３１の研磨は、先端部５３１に凝着した電子部品８の基板の成分を除去するために行われる。研磨が必要であると判断された場合には、装着ヘッド５が研磨部７の上方へと移動し、先端部５３１が研磨部材７１に押圧されつつ圧電素子５２により振動が付与されることにより、先端部５３１の研磨が行われる。 When the mounting of the electronic component 8 is completed, the mounting head 5 that has stopped sucking is lifted away from the electronic component 8 by the elevating mechanism 33, and then the tip 531 (more precisely, the electronic component 8 of the tip 531 is contacted). It is confirmed whether or not the contact surface) needs to be polished. The tip portion 531 is polished in order to remove components of the substrate of the electronic component 8 adhered to the tip portion 531. When it is determined that polishing is necessary, the mounting head 5 moves above the polishing unit 7, and vibration is applied by the piezoelectric element 52 while the tip 531 is pressed by the polishing member 71. The tip portion 531 is polished.
先端部５３１の研磨が終了すると、あるいは、研磨が不要であると判断された場合には、部品装着部３１が受渡位置へと移動し、取り出された電子部品が装着ヘッド５の先端部５３１にて吸着保持され、回路基板９に電子部品を装着する動作が繰り返される。 When the polishing of the front end portion 531 is completed, or when it is determined that the polishing is unnecessary, the component mounting portion 31 moves to the delivery position, and the extracted electronic component is transferred to the front end portion 531 of the mounting head 5. The operation of attaching the electronic component to the circuit board 9 is repeated.
以上に説明したように、電子部品装着装置１では、装着ヘッド５において加熱部３６により加熱される保持ツール５３と圧電素子５２との間の本体部５１の部位である補助部材５１２に複数の開口に連絡する孔（すなわち、中心孔５１３から放射状に伸びる複数の冷却孔５１４を含む孔）が形成される。そして、これらの開口から除熱用のガスが供給されて補助部材５１２が冷却されることにより、圧電素子５２の温度の過度の上昇が防止され、電子部品を安定して回路基板９に装着することが実現される。 As described above, in the electronic component mounting apparatus 1, a plurality of openings are formed in the auxiliary member 512 that is a part of the main body 51 between the holding tool 53 and the piezoelectric element 52 that are heated by the heating unit 36 in the mounting head 5. (That is, a hole including a plurality of cooling holes 514 extending radially from the center hole 513) is formed. Then, the heat removal gas is supplied from these openings and the auxiliary member 512 is cooled, so that an excessive increase in the temperature of the piezoelectric element 52 is prevented and the electronic component is stably mounted on the circuit board 9. Is realized.
ここで、電子部品装着装置１では、電子部品に効率よく超音波振動を付与するために、圧電素子５２にて発生させる振動の周波数を変化させて装着ヘッド５の共振周波数を検出する動作がキャリブレーションとして行われる。この場合において、仮に、中心軸に垂直な一方向に伸びる複数の貫通孔を補助部材に設けたときには、経験上、副共振が現れ易くなる。その結果、この副共振が発生する周波数を共振周波数と誤って検出してしまい、超音波接合時の電子部品の振幅が小さくなってしまう場合がある。これに対し、図１の電子部品装着装置１では、補助部材５１２が中心軸Ｊ１を中心として８回回転対称性を有することにより、補助部材５１２において、それぞれが外周に沿って互いに隣接する２つの冷却孔５１４により挟まれる複数の部位（すなわち、中心軸Ｊ１に垂直な断面が同じ扇形となる複数の部位）において圧電素子５２からの振動が同様に伝播されて副共振の発生が抑制され（万一、発生した場合でも、そのピークが小さくなり）、共振周波数を精度よく検出することが可能となる。このようにして、電子部品の振動特性が低下すること（すなわち、電子部品の振幅の減少、あるいは、振動スペクトルのピークの低下や分散等）が抑制され、その結果、加熱および超音波振動を併用した電子部品の装着において、良好な接合品質にて電子部品を効率よく回路基板上に装着することができる。 Here, in the electronic component mounting apparatus 1, the operation of detecting the resonance frequency of the mounting head 5 by changing the frequency of the vibration generated by the piezoelectric element 52 is calibrated in order to efficiently apply ultrasonic vibration to the electronic component. As an action. In this case, if a plurality of through holes extending in one direction perpendicular to the central axis are provided in the auxiliary member, sub-resonance is likely to appear from experience. As a result, the frequency at which this sub-resonance occurs is erroneously detected as the resonance frequency, and the amplitude of the electronic component during ultrasonic bonding may be reduced. On the other hand, in the electronic component mounting apparatus 1 in FIG. 1, the auxiliary member 512 has eight-fold rotational symmetry about the central axis J <b> 1, so that each of the auxiliary members 512 is adjacent to each other along the outer periphery. Vibrations from the piezoelectric element 52 are similarly propagated in a plurality of portions sandwiched by the cooling holes 514 (that is, a plurality of portions having the same fan-shaped cross section perpendicular to the central axis J1), thereby suppressing the occurrence of sub-resonance (ten thousand). Even if it occurs, the peak becomes small), and the resonance frequency can be detected with high accuracy. In this way, the vibration characteristics of the electronic component are reduced (that is, the amplitude of the electronic component is reduced, or the peak of the vibration spectrum is reduced or dispersed). As a result, heating and ultrasonic vibration are used in combination. In the mounting of the electronic components, the electronic components can be efficiently mounted on the circuit board with good bonding quality.
また、複数の開口（およびその内部）のそれぞれが中心軸Ｊ１方向に伸びる形状とされることにより、圧電素子５２の温度の過度の上昇がより防止される。さらに、補助部材５１２の回路基板９側に設けられるカバー部３８により複数の開口を有する孔から回路基板９へと向かうガスが遮蔽されるため、開口からのガスにより装着途上の電子部品が冷却されて装着性能が低下することが防止される。 In addition, since each of the plurality of openings (and the inside thereof) has a shape extending in the direction of the central axis J1, an excessive increase in the temperature of the piezoelectric element 52 is further prevented. Further, since the gas from the holes having a plurality of openings toward the circuit board 9 is shielded by the cover portion 38 provided on the circuit board 9 side of the auxiliary member 512, the electronic components being mounted are cooled by the gas from the openings. This prevents the mounting performance from deteriorating.
なお、上記電子部品の装着動作では、保持ツール５３の加熱および補助部材５１２の冷却（ステップＳ１１，Ｓ１２）は、電子部品の保持、電子部品の回路基板９に対する押圧および電子部品への超音波振動の付与（ステップＳ１３〜Ｓ１５）に先行して行われているが、保持ツール５３の加熱および補助部材５１２の冷却は電子部品の装着動作中、継続して行われるため、図５中のステップＳ１１，Ｓ１２は実際にはステップＳ１３〜Ｓ１５に並行して行われている。 In the mounting operation of the electronic component, the heating of the holding tool 53 and the cooling of the auxiliary member 512 (steps S11 and S12) are performed by holding the electronic component, pressing the electronic component against the circuit board 9, and ultrasonic vibration of the electronic component. However, since heating of the holding tool 53 and cooling of the auxiliary member 512 are continuously performed during the mounting operation of the electronic component, step S11 in FIG. 5 is performed. , S12 is actually performed in parallel with steps S13 to S15.
図６は、装着ヘッドの他の例を示す図である。図６の装着ヘッド５ａは、図６中のＸ方向に平行な中心軸Ｊ２に沿って伸びる本体部５１ａを有し、本体部５１ａの一端には圧電素子５２が取り付けられる。また、本体部５１ａの他端側（実際には、他端側の端部から僅かに内側の部分）には図６中のＺ方向に沿う棒状の保持ツール５３ａが設けられる。保持ツール５３ａは、電子部品の装着において好適な振動特性および振動伝達特性を有するステンレス鋼により形成されており、中心部に電子部品の吸引吸着に利用される真空吸引用の吸引路５３２を有する。吸引路５３２は図示省略のポンプに接続されており、図３の装着ヘッド５と同様に柱状に突出する先端部５３１にて電子部品が保持される。 FIG. 6 is a diagram illustrating another example of the mounting head. The mounting head 5a in FIG. 6 has a main body 51a extending along a central axis J2 parallel to the X direction in FIG. 6, and a piezoelectric element 52 is attached to one end of the main body 51a. Further, a rod-like holding tool 53a along the Z direction in FIG. 6 is provided on the other end side of the main body 51a (actually, a portion slightly inside from the end on the other end side). The holding tool 53a is made of stainless steel having vibration characteristics and vibration transmission characteristics suitable for mounting electronic components, and has a suction path 532 for vacuum suction that is used for suction suction of electronic components at the center. The suction path 532 is connected to a pump (not shown), and an electronic component is held by a tip portion 531 protruding like a column like the mounting head 5 of FIG.
本体部５１ａは、保持ツール５３ａ側の部材であるホーン５１１ａ、および、圧電素子５２側の部材である補助部材５１２を有する。図６の補助部材５１２は、図４の補助部材５１２と同様に中心軸Ｊ２に垂直な断面の外形は円形とされ、その断面において中央部から外周に向かって放射状に伸びる複数の冷却孔５１４が形成されている。圧電素子５２の構造は上記と同様であり、装着ヘッド５ａにおいても、本体部５１ａの補助部材５１２、圧電素子５２およびベース部材５４が、本体部５１ａのホーン５１１ａから分離可能な超音波振動デバイス５５となっている。 The main body 51a includes a horn 511a that is a member on the holding tool 53a side and an auxiliary member 512 that is a member on the piezoelectric element 52 side. The auxiliary member 512 in FIG. 6 has a circular outer shape in a cross section perpendicular to the central axis J2 as in the auxiliary member 512 in FIG. 4, and a plurality of cooling holes 514 extending radially from the center to the outer periphery in the cross section. Is formed. The structure of the piezoelectric element 52 is the same as described above. Also in the mounting head 5a, the ultrasonic vibration device 55 in which the auxiliary member 512, the piezoelectric element 52, and the base member 54 of the main body 51a can be separated from the horn 511a of the main body 51a. It has become.
図６の本体部５１ａはヘッド支持部３４を介してシャフト３５に取り付けられる。本体部５１ａのホーン５１１ａの内部には、中心軸Ｊ２に沿って加熱部の棒状のヒータ３６１が設けられ、ヒータ３６１によりホーン５１１ａを介して保持ツール５３ａが加熱される。 The main body 51a of FIG. 6 is attached to the shaft 35 via the head support 34. Inside the horn 511a of the main body 51a, a rod-shaped heater 361 of the heating unit is provided along the central axis J2, and the holding tool 53a is heated by the heater 361 via the horn 511a.
図６の装着ヘッド５ａにおいても、補助部材５１２の上方にはガス供給部３７に接続されたパイプ３７１が設けられ、補助部材５１２の下方にはカバー部３８が設けられる。これにより、電子部品を回路基板９に装着する際に、補助部材５１２に除熱用のガスを供給して圧電素子５２の温度が過度に上昇することを防止しつつ、冷却孔５１４からのガスにより装着途上の電子部品が冷却されて装着性能が低下してしまうことが防止される。また、補助部材５１２が中心軸Ｊ２を中心として８回回転対称性を有することにより、電子部品の振動特性の低下が抑制される。その結果、電子部品を安定して、かつ、効率よく回路基板９上に装着することができる。 Also in the mounting head 5 a of FIG. 6, a pipe 371 connected to the gas supply unit 37 is provided above the auxiliary member 512, and a cover unit 38 is provided below the auxiliary member 512. Accordingly, when the electronic component is mounted on the circuit board 9, the gas from the cooling hole 514 is supplied while the heat removal gas is supplied to the auxiliary member 512 to prevent the temperature of the piezoelectric element 52 from excessively rising. As a result, it is possible to prevent the mounting performance from being deteriorated due to the cooling of the electronic components being mounted. In addition, since the auxiliary member 512 has eight-fold rotational symmetry about the central axis J2, a reduction in vibration characteristics of the electronic component is suppressed. As a result, the electronic component can be mounted on the circuit board 9 stably and efficiently.
図７は、装着ヘッドにおける補助部材の他の例を示す図であり、図４に対応する補助部材の断面図である。図７の補助部材５１２ａでは中心軸Ｊ１に垂直な断面の外形が正六角形とされており、断面の中心から外周に向かって放射状に伸びる複数の冷却孔５１４が形成される。各冷却孔５１４は図７の断面の外形の各辺に対して垂直に伸びている。補助部材５１２ａは中心軸Ｊ１を中心として６回回転対称性を有し、実際には、各冷却孔５１４の開口は中心軸Ｊ１に沿って長くなっている。このような構造により、補助部材５１２ａを有する装着ヘッドでは、圧電素子５２の温度の過度の上昇を防止しつつ、電子部品の振動特性の低下が抑制される。 FIG. 7 is a view showing another example of the auxiliary member in the mounting head, and is a cross-sectional view of the auxiliary member corresponding to FIG. In the auxiliary member 512a of FIG. 7, the outer shape of the cross section perpendicular to the central axis J1 is a regular hexagon, and a plurality of cooling holes 514 extending radially from the center of the cross section toward the outer periphery are formed. Each cooling hole 514 extends perpendicular to each side of the outer shape of the cross section of FIG. The auxiliary member 512a has six-fold rotational symmetry about the central axis J1, and in fact, the opening of each cooling hole 514 is elongated along the central axis J1. With such a structure, in the mounting head having the auxiliary member 512a, an excessive increase in the temperature of the piezoelectric element 52 is prevented, and a decrease in vibration characteristics of the electronic component is suppressed.
また、図７の補助部材５１２ａを有する超音波振動デバイスでは、補助部材５１２ａにおいて複数の冷却孔５１４が形成される部位よりも圧電素子５２側に固定用のボルトが挿入されるネジ孔が形成されている。この超音波振動デバイスを組み立てる際には、当該ボルトと補助部材５１２ａとを締結することにより、補助部材５１２ａとベース部材５４との間に挟まれた圧電素子５２に予圧を付与しつつ、補助部材５１２ａおよび圧電素子５２がベース部材５４に固定される。このとき、補助部材５１２ａでは、断面の外形が六角形とされることにより補助部材５１２ａとボルトとをレンチ等を用いて簡単に締結することができ、補助部材５１２ａを有する超音波振動デバイスを容易に組み立てることが可能となる。超音波振動デバイスを容易に組み立てるという観点では、中心軸Ｊ１に垂直な断面の外形が正八角形とされる補助部材が用いられてもよい。 Further, in the ultrasonic vibration device having the auxiliary member 512a of FIG. 7, a screw hole into which a fixing bolt is inserted is formed closer to the piezoelectric element 52 than a portion where the plurality of cooling holes 514 are formed in the auxiliary member 512a. ing. When assembling the ultrasonic vibration device, the auxiliary member 512a is fastened to the piezoelectric element 52 sandwiched between the auxiliary member 512a and the base member 54 by fastening the bolt and the auxiliary member 512a. 512 a and the piezoelectric element 52 are fixed to the base member 54. At this time, in the auxiliary member 512a, the outer shape of the cross section is hexagonal, whereby the auxiliary member 512a and the bolt can be easily fastened using a wrench or the like, and an ultrasonic vibration device having the auxiliary member 512a can be easily obtained. It becomes possible to assemble. From the viewpoint of easily assembling the ultrasonic vibration device, an auxiliary member whose outer shape in a cross section perpendicular to the central axis J1 is a regular octagon may be used.
以上、本発明の実施の形態について説明してきたが、本発明は上記実施の形態に限定されるものではなく、様々な変形が可能である。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made.
上記実施の形態では、ガス供給部３７からの除熱用のガスが供給される補助部材５１２は、本体部５１，５１ａの中心軸を中心として８回回転対称性を有するものとされるが、装着ヘッドでは、図８．Ａに示すように、その中心軸Ｊ１に垂直な断面において格子状に形成された複数の冷却孔５１４ａを含む補助部材５１２ｂや（ただし、冷却孔５１４ａは中心孔５１３とは交わらない。）、図８．Ｂに示すように、中心軸Ｊ１に垂直な断面においてそれぞれが外周を３等分した各端部と中心軸Ｊ１の位置とを結ぶ複数の冷却孔５１４を含む孔が形成される補助部材５１２ｃが用いられてもよい。なお、補助部材５１２ｂは４回回転対称性を有し、補助部材５１２ｃは３回回転対称性を有する。 In the above embodiment, the auxiliary member 512 to which the heat removal gas from the gas supply unit 37 is supplied has eight-fold rotational symmetry about the central axis of the main body 51, 51a. In the mounting head, FIG. As shown in A, an auxiliary member 512b including a plurality of cooling holes 514a formed in a lattice shape in a cross section perpendicular to the central axis J1 (however, the cooling holes 514a do not intersect with the central hole 513), FIG. 8). As shown in B, an auxiliary member 512c in which a hole including a plurality of cooling holes 514 connecting each end portion of the outer periphery divided into three equal parts and the position of the central axis J1 in a cross section perpendicular to the central axis J1 is formed. May be used. The auxiliary member 512b has four-fold rotational symmetry, and the auxiliary member 512c has three-fold rotational symmetry.
このように、複数の開口を有する孔が形成された補助部材の中心軸に垂直な断面において、中心軸の位置と、その外周を均等に分割した多数の部分のそれぞれの両端とを結ぶ部分領域（すなわち、図８．Ａおよび図８．Ｂにおいて、二点鎖線にて仕切られる各領域）の形状が同一とされ、補助部材において中心軸を中心として外周に沿って同じ断面形状の部位が多数回繰り返されている、すなわち、補助部材が多数回の回転対称性を有することにより、互いに同じ断面形状の複数の部位で圧電素子からの振動が同様に伝播され、電子部品の振動特性の低下が抑制される。ここで、一定の方向に伸びる複数の貫通孔が設けられて２回回転対称性を有する補助部材を、圧電素子からの振動を適切に伝播するように設計することは容易ではないことが経験的に判っている。したがって、装着ヘッドの設計を容易に行うには、装着ヘッドにおいて、ガス供給部からのガスが供給されて冷却される空冷部位は、中心軸を中心としてｎ回回転対称性（ｎは３以上の整数）を有することが重要となる。 Thus, in the cross section perpendicular to the central axis of the auxiliary member in which holes having a plurality of openings are formed, a partial region connecting the position of the central axis and the respective ends of a number of portions obtained by equally dividing the outer periphery thereof That is, the shape of each region divided by a two-dot chain line in FIG. 8.A and FIG. 8.B is the same, and the auxiliary member has many portions having the same cross-sectional shape along the outer periphery around the central axis. Since the auxiliary member has a rotational symmetry many times, vibrations from the piezoelectric element are similarly propagated in a plurality of parts having the same cross-sectional shape, and the vibration characteristics of the electronic component are deteriorated. It is suppressed. Here, it is empirically that it is not easy to design an auxiliary member provided with a plurality of through holes extending in a certain direction and having two-fold rotational symmetry so as to appropriately propagate vibration from the piezoelectric element. I know. Therefore, in order to easily design the mounting head, in the mounting head, the air-cooled portion that is cooled by being supplied with the gas from the gas supply unit has n-fold rotational symmetry (n is 3 or more) about the central axis. It is important to have an integer).
また、本体部において除熱用のガスが供給されて冷却される空冷部位は、加熱部により加熱される部位と圧電素子５２との間に設けられるのであれば、ホーンの一部とされてもよい。図９は、ホーン５１１ｂに複数の冷却孔５１４ｂが形成された場合におけるホーン５１１ｂの中心軸Ｊ１に垂直な断面図である。図９のホーン５１１ｂの断面の外形は矩形とされ、複数の冷却孔５１４ｂは断面の中心から放射状に伸びており、ホーン５１１ｂは中心軸Ｊ１を中心として４回転対称性を有する。ただし、電子部品の振動特性に比較的大きな影響を及ぼすホーンの形状を変更することなく圧電素子５２の温度上昇を抑制するには、ホーンから分離可能な超音波振動デバイス５５の一部であって、本体部の空冷部位を含む圧電素子５２側の部位である補助部材に冷却孔を設けることが好ましい。また、電子部品の振動特性をさらに向上するには、空冷部位の中心軸に垂直な断面の外形は円形、または、円形に近似した正六角形もしくは正八角形であることが好ましい。 In addition, the air-cooled portion that is cooled by supplying the heat removal gas in the main body portion may be a part of the horn as long as it is provided between the portion heated by the heating portion and the piezoelectric element 52. Good. FIG. 9 is a cross-sectional view perpendicular to the central axis J1 of the horn 511b when a plurality of cooling holes 514b are formed in the horn 511b. The outer shape of the cross section of the horn 511b in FIG. 9 is rectangular, the plurality of cooling holes 514b extend radially from the center of the cross section, and the horn 511b has four-fold symmetry about the central axis J1. However, in order to suppress the temperature rise of the piezoelectric element 52 without changing the shape of the horn that has a relatively large influence on the vibration characteristics of the electronic component, the ultrasonic vibration device 55 is a part of the ultrasonic vibration device 55 that can be separated from the horn. In addition, it is preferable to provide a cooling hole in the auxiliary member that is a part on the piezoelectric element 52 side including the air cooling part of the main body. In order to further improve the vibration characteristics of the electronic component, the outer shape of the cross section perpendicular to the central axis of the air-cooled portion is preferably a circle, or a regular hexagon or regular octagon that approximates a circle.
保持ツールを加熱する加熱部は、棒状のヒータを有するもの以外に、例えばシート状の発熱体を有するものであってもよい。また、ガス供給部はパイプ３７１を介して補助部材にガスを供給するもの以外に、例えば、周囲のエアを補助部材に向けて送出するファンであってもよい。 The heating unit that heats the holding tool may have, for example, a sheet-like heating element in addition to the rod-like heater. The gas supply unit may be, for example, a fan that sends out ambient air toward the auxiliary member in addition to supplying gas to the auxiliary member via the pipe 371.
例えば、装着時の電子部品は、上記実施の形態のような吸引による吸着のほか、機械的なチャックや静電チャックにより保持されてもよい。また、本体部のホーンは図３および図６に示す形状には限定されず、様々な形状とされてよい。 For example, the electronic component at the time of mounting may be held by a mechanical chuck or an electrostatic chuck in addition to suction by suction as in the above embodiment. Further, the horn of the main body is not limited to the shape shown in FIGS. 3 and 6, and may be various shapes.
上記実施の形態では、サファイア基板やＧａＮ（ガリウムナイトライド）基板上に形成されたＬＥＤチップが回路基板上への装着対象とされるが、電子部品装着装置１では加熱を伴う超音波接合を適切に行うことが可能であるため、超音波振動のみでは接合が容易ではない脆弱なＧａＮ基板上に形成されたＬＥＤチップ（例えば、赤色ＬＥＤチップ）のフリップチップ実装に特に適している。また、電子部品装着装置１による回路基板上への装着対象は、加熱による影響が生じない他の電子部品（例えば半導体基板上に形成されるチップ）であってもよく、回路基板は、ガラス、半導体等の樹脂以外の材料により形成されたものであってもよい。また、バンプは、電子部品の電極上に設けられる代わりに、回路基板９の電極上に設けられてもよい。 In the above embodiment, LED chips formed on a sapphire substrate or a GaN (gallium nitride) substrate are to be mounted on a circuit board. However, in the electronic component mounting apparatus 1, ultrasonic bonding with heating is appropriately performed. Therefore, it is particularly suitable for flip chip mounting of an LED chip (for example, a red LED chip) formed on a fragile GaN substrate that is not easily bonded by ultrasonic vibration alone. Further, the mounting target on the circuit board by the electronic component mounting apparatus 1 may be another electronic component (for example, a chip formed on a semiconductor substrate) that is not affected by heating, and the circuit board is made of glass, It may be formed of a material other than a resin such as a semiconductor. Further, the bumps may be provided on the electrodes of the circuit board 9 instead of being provided on the electrodes of the electronic component.
また、上記実施の形態において、補助部材および圧電素子を有する超音波振動デバイスは、電子部品に超音波振動を付与する以外の他の用途に用いられてもよい。例えば、超音波振動デバイスにおいて補助部材の圧電素子とは反対側が、回路基板を保持するとともに加熱されるステージに接続される。そして、電子部品が回路基板に向けて押圧された状態で、補助部材に除熱用のガスが付与されつつステージに超音波振動が付与されることにより、加熱を伴う超音波接合が行われてもよい。このように、超音波振動デバイスでは、加熱される対象物に超音波振動を付与する際に、圧電素子の温度の過度の上昇を防止しつつ対象物の振動特性の低下を抑制することができる。また、複数の開口に連絡する冷却用の孔が形成される超音波振動デバイスは、超音波接合以外の他の用途に用いることも可能である。 Moreover, in the said embodiment, the ultrasonic vibration device which has an auxiliary member and a piezoelectric element may be used for other uses other than providing an ultrasonic vibration to an electronic component. For example, the side opposite to the piezoelectric element of the auxiliary member in the ultrasonic vibration device is connected to a stage that holds the circuit board and is heated. Then, in a state where the electronic component is pressed against the circuit board, ultrasonic vibration with heating is performed by applying ultrasonic vibration to the stage while applying heat removal gas to the auxiliary member. Also good. As described above, in the ultrasonic vibration device, when applying ultrasonic vibration to the object to be heated, it is possible to suppress a decrease in vibration characteristics of the object while preventing an excessive increase in the temperature of the piezoelectric element. . In addition, the ultrasonic vibration device in which the cooling holes communicating with the plurality of openings are formed can be used for applications other than ultrasonic bonding.
本発明は、半導体発光素子、他の半導体ベアチップ、さらには他の種類の電子部品を、超音波を利用して回路基板に装着する電子部品装着装置に利用可能であり、さらに、超音波振動デバイスは加熱および超音波振動を併用した様々な用途に利用可能である。 INDUSTRIAL APPLICABILITY The present invention is applicable to an electronic component mounting apparatus that mounts a semiconductor light emitting element, another semiconductor bare chip, and other types of electronic components on a circuit board using ultrasonic waves, and further an ultrasonic vibration device. Can be used for various applications using both heating and ultrasonic vibration.
１ 電子部品装着装置
５，５ａ 装着ヘッド
８ 電子部品
９ 回路基板
３３ 昇降機構
３６ 加熱部
３７ ガス供給部
３８ カバー部
５１，５１ａ 本体部
５２ 圧電素子
５３，５３ａ 保持ツール
５５ 超音波振動デバイス
５１１，５１１ａ，５１１ｂ ホーン
５１２，５１２ａ〜５１２ｃ 補助部材
５１４，５１４ａ，５１４ｂ 冷却孔
５２１ 圧電板
５２２ 電極板
５２３ 樹脂
Ｊ１，Ｊ２ 中心軸
Ｓ１１〜Ｓ１５ ステップ
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5,5a Mounting head 8 Electronic component 9 Circuit board 33 Lifting mechanism 36 Heating part 37 Gas supply part 38 Cover part 51,51a Main body part 52 Piezoelectric element 53,53a Holding tool 55 Ultrasonic vibration device 511,511a , 511b Horn 512, 512a-512c Auxiliary member 514, 514a, 514b Cooling hole 521 Piezoelectric plate 522 Electrode plate 523 Resin J1, J2 Central axis S11-S15 Step
Claims (10)
所定の方向に伸びる本体部の一端側に電子部品を保持する保持ツールが取り付けられ、前記本体部の他端側に前記本体部および前記保持ツールを介して前記電子部品に超音波振動を付与する圧電素子が固定された装着ヘッドと、
前記装着ヘッドを介して前記電子部品を回路基板に向けて押圧する押圧機構と、
前記保持ツールを加熱する加熱部と、
前記装着ヘッドにおいて前記加熱部により加熱される部位と前記圧電素子との間の前記本体部の空冷部位にガスを供給して前記空冷部位を冷却するガス供給部と、
を備え、
前記本体部の前記空冷部位に複数の開口に連絡する孔が形成されており、前記空冷部位が、前記本体部の前記所定の方向を向く中心軸を中心としてｎ回回転対称性（ｎは３以上の整数）を有することを特徴とする電子部品装着装置。 An electronic component mounting apparatus for mounting an electronic component on a circuit board,
A holding tool for holding an electronic component is attached to one end side of the main body extending in a predetermined direction, and ultrasonic vibration is applied to the electronic component via the main body and the holding tool on the other end of the main body. A mounting head to which a piezoelectric element is fixed;
A pressing mechanism that presses the electronic component toward the circuit board via the mounting head;
A heating unit for heating the holding tool;
A gas supply unit configured to supply gas to an air cooling part of the main body between the part heated by the heating unit in the mounting head and cool the air cooling part;
With
A hole communicating with a plurality of openings is formed in the air-cooling portion of the main body, and the air-cooling portion has n-fold rotational symmetry (n is 3) around the central axis facing the predetermined direction of the main body. An electronic component mounting apparatus characterized by having an integer above.
前記孔が、前記空冷部位の前記中心軸に垂直な断面の中心から外周に向かって放射状に伸びる複数の冷却孔を含むことを特徴とする電子部品装着装置。 The electronic component mounting apparatus according to claim 1,
The electronic component mounting apparatus, wherein the hole includes a plurality of cooling holes extending radially from the center of a cross section perpendicular to the central axis of the air-cooled portion toward the outer periphery.
前記複数の開口のそれぞれが前記所定の方向に伸びる形状であることを特徴とする電子部品装着装置。 The electronic component mounting apparatus according to claim 1 or 2,
Each of the plurality of openings has a shape extending in the predetermined direction.
前記空冷部位の前記電子部品が装着される回路基板側を非接触にて覆うとともに、前記複数の開口から前記回路基板へと向かうガスを遮蔽するカバー部をさらに備えることを特徴とする電子部品装着装置。 The electronic component mounting apparatus according to any one of claims 1 to 3,
The electronic component mounting further comprising a cover portion that covers the circuit board side on which the electronic component of the air-cooled portion is mounted in a non-contact manner and shields gas from the plurality of openings toward the circuit board. apparatus.
前記本体部の前記空冷部位を含む前記圧電素子側の部位および前記圧電素子が、前記本体部の他の部位から分離可能な超音波振動デバイスの一部であることを特徴とする電子部品装着装置。 An electronic component mounting apparatus according to any one of claims 1 to 4,
The electronic component mounting apparatus, wherein the piezoelectric element side portion including the air cooling portion of the main body portion and the piezoelectric element are part of an ultrasonic vibration device separable from other portions of the main body portion. .
前記超音波振動デバイスの前記圧電素子が、複数の圧電板と複数の電極板とを接着用の樹脂を介して交互に積層したものであることを特徴とする電子部品装着装置。 The electronic component mounting apparatus according to claim 5,
The electronic component mounting apparatus, wherein the piezoelectric element of the ultrasonic vibration device is obtained by alternately laminating a plurality of piezoelectric plates and a plurality of electrode plates via an adhesive resin.
前記空冷部位の前記中心軸に垂直な断面の外形が円形であることを特徴とする電子部品装着装置。 The electronic component mounting apparatus according to any one of claims 1 to 6,
An electronic component mounting apparatus, wherein an outer shape of a cross section perpendicular to the central axis of the air-cooled portion is circular.
前記空冷部位の前記中心軸に垂直な断面の外形が正六角形または正八角形であることを特徴とする電子部品装着装置。 The electronic component mounting apparatus according to claim 5 or 6,
An electronic component mounting apparatus, wherein an outer shape of a cross section perpendicular to the central axis of the air-cooled portion is a regular hexagon or a regular octagon.
ａ）装着ヘッドの所定の方向に伸びる本体部の一端側に取り付けられた保持ツールにて電子部品を保持する工程と、
ｂ）前記本体部の他端側に固定された圧電素子により前記本体部および前記保持ツールを介して前記電子部品に超音波振動を付与する工程と、
ｃ）前記ｂ）工程に並行して、前記装着ヘッドを介して前記電子部品を回路基板に向けて押圧する工程と、
ｄ）前記ａ）ないしｃ）工程に並行して、前記保持ツールを加熱部により加熱する工程と、
ｅ）前記ｄ）工程に並行して、前記装着ヘッドにおいて前記加熱部により加熱される部位と前記圧電素子との間の前記本体部の空冷部位にガスを供給して前記空冷部位を冷却する工程と、
を備え、
前記本体部の前記空冷部位に複数の開口に連絡する孔が形成されており、前記空冷部位が、前記本体部の前記所定の方向を向く中心軸を中心としてｎ回回転対称性（ｎは３以上の整数）を有することを特徴とする電子部品装着方法。 An electronic component mounting method for mounting an electronic component on a circuit board,
a) holding the electronic component with a holding tool attached to one end of the main body extending in a predetermined direction of the mounting head;
b) applying ultrasonic vibration to the electronic component via the main body and the holding tool by a piezoelectric element fixed to the other end of the main body;
c) In parallel with the step b), the step of pressing the electronic component toward the circuit board via the mounting head;
d) In parallel with the steps a) to c), the step of heating the holding tool by a heating unit;
e) In parallel with the step d), a step of cooling the air-cooled portion by supplying gas to the air-cooled portion of the main body portion between the portion heated by the heating portion and the piezoelectric element in the mounting head. When,
With
A hole communicating with a plurality of openings is formed in the air-cooling portion of the main body, and the air-cooling portion has n-fold rotational symmetry (n is 3) around the central axis facing the predetermined direction of the main body. An electronic component mounting method characterized by having an integer above.
所定の中心軸に沿う方向の一端側に加熱される対象物が取り付けられるとともに除熱用のガスが付与される補助部材と、
前記補助部材の他端側に固定される圧電素子と、
を備え、
前記補助部材に複数の開口に連絡する孔が形成されており、前記補助部材が、前記中心軸を中心としてｎ回回転対称性（ｎは３以上の整数）を有することを特徴とする超音波振動デバイス。 An ultrasonic vibration device for applying ultrasonic vibration to an object,
An auxiliary member to which an object to be heated is attached to one end side in a direction along a predetermined central axis and to which a heat removal gas is applied;
A piezoelectric element fixed to the other end of the auxiliary member;
With
The auxiliary member is formed with holes communicating with a plurality of openings, and the auxiliary member has n-fold rotational symmetry about the central axis (n is an integer of 3 or more). Vibration device.
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| JP2003282632A (en) * | 2002-03-27 | 2003-10-03 | Matsushita Electric Ind Co Ltd | Method and system for packaging electronic component |
| JP2003282644A (en) * | 2002-03-27 | 2003-10-03 | Matsushita Electric Ind Co Ltd | Ultrasonic head |
| JP3664155B2 (en) * | 2002-08-01 | 2005-06-22 | 松下電器産業株式会社 | Electronic component bonding apparatus and bonding tool |
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| JP2002118152A (en) * | 2000-10-06 | 2002-04-19 | Kaijo Corp | Bonding head and bonding apparatus provided therewith |
| JP2003282632A (en) * | 2002-03-27 | 2003-10-03 | Matsushita Electric Ind Co Ltd | Method and system for packaging electronic component |
| JP2003282644A (en) * | 2002-03-27 | 2003-10-03 | Matsushita Electric Ind Co Ltd | Ultrasonic head |
| JP3664155B2 (en) * | 2002-08-01 | 2005-06-22 | 松下電器産業株式会社 | Electronic component bonding apparatus and bonding tool |
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