JP4595378B2 - Resin processing method - Google Patents

Resin processing method Download PDF

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Publication number
JP4595378B2
JP4595378B2 JP2004134132A JP2004134132A JP4595378B2 JP 4595378 B2 JP4595378 B2 JP 4595378B2 JP 2004134132 A JP2004134132 A JP 2004134132A JP 2004134132 A JP2004134132 A JP 2004134132A JP 4595378 B2 JP4595378 B2 JP 4595378B2
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resin
wavelength
transmittance
processing method
processing
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JP2005313475A (en
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英一郎 山田
寛 菅沼
享 井上
麻紀 池知
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Sumitomo Electric Industries Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1645—Laser beams characterised by the way of heating the interface heating both sides of the joint, e.g. by using two lasers or a split beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
    • B29C65/1667—Laser beams characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous laser welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B29C65/1683—Laser beams making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
    • B29C66/952—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the wavelength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Description

本発明は、レーザ光を樹脂に照射して該樹脂を加工する方法に関するものである。
The present invention relates to how to process the resin is irradiated with a laser beam to the resin.

レーザ光を照射して該樹脂を加工する技術として特許文献１〜４に開示されたものが知られている。特許文献１に開示された樹脂加工技術は、レーザ光波長において透過率が高い樹脂を加工するために、樹脂に金属材料を押し付けて、この金属材料にレーザ光を照射して金属材料の温度を上昇させることで、樹脂を加工する。
特開平１０−２３５４８９号公報 As a technique for processing the resin by irradiating a laser beam, those disclosed in Patent Documents 1 to 4 are known. In the resin processing technique disclosed in Patent Document 1, in order to process a resin having a high transmittance at a laser light wavelength, a metal material is pressed against the resin, and the metal material is irradiated with a laser beam so as to control the temperature of the metal material. Resin is processed by raising.
Japanese Patent Laid-Open No. 10-235489

特許文献１に開示された樹脂加工技術は、加工を行うに際して適切な金属材料を選択し該金属材料を樹脂に押し付けてレーザ光を照射する必要があることから、加工作業の際の手間が増え、フレキシブルな加工をすることができない。   In the resin processing technique disclosed in Patent Document 1, it is necessary to select an appropriate metal material when performing processing, press the metal material against the resin and irradiate the laser beam, and thus the labor for processing increases. , Flexible processing is not possible.

本発明は、上記問題点を解消する為になされたものであり、フレキシブルな樹脂加工を容易に行うことができる樹脂加工方法を提供することを目的とする。
The present invention has been made to solve the above problems, and an object thereof is to provide a resin finishing how that can be easily flexible resin processing.

本発明に係る樹脂加工方法は、各々の中心波長が互いに波長幅以上異なる複数の波長のレーザ光を照射して、各々樹脂である第１の加工対象と第２の加工対象とを溶着または接着し、各々樹脂である第２の加工対象と第３の加工対象とを溶着または接着する樹脂加工方法であって、複数の波長として第１波長および第２波長を含み、第１波長において、第１〜第３の加工対象のうち、第１の加工対象と第２の加工対象との溶着または接着の箇所へ至るまでの第１波長のレーザ光の光路上にある加工対象の透過率は、その他の加工対象の透過率より大きく、第２波長において、第１〜第３の加工対象のうち、第２の加工対象と第３の加工対象との溶着または接着の箇所へ至るまでの第２波長のレーザ光の光路上にある加工対象の透過率は、その他の加工対象の透過率より大きく、第１波長のレーザ光を照射することで第１の加工対象と第２の加工対象とを溶着または接着し、第２波長のレーザ光を照射することで第２の加工対象と第３の加工対象とを溶着または接着することを特徴とする。
In the resin processing method according to the present invention, each of the center wavelengths is irradiated with laser beams having a plurality of wavelengths different from each other by a wavelength width or more, and the first processing object and the second processing object, each of which is resin, are welded or bonded. And a resin processing method for welding or bonding a second processing object and a third processing object, each of which is a resin, including a first wavelength and a second wavelength as a plurality of wavelengths, Among the first to third processing targets, the transmittance of the processing target on the optical path of the laser light of the first wavelength until reaching the location where the first processing target and the second processing target are welded or bonded, The second up to the point where the second processing target and the third processing target are welded or bonded to each other in the second wavelength, which is larger than the transmittance of the other processing target and at the second wavelength. The transmittance of the processing target on the optical path of the laser beam of the wavelength is The first processing object and the second processing object are welded or bonded to each other by irradiating the laser beam having the first wavelength larger than the transmittance of the processing object, and the second wavelength laser beam is irradiated to irradiate the first processing object. The second processing object and the third processing object are welded or bonded together.

本発明に係る樹脂加工方法は、加工対象の樹脂として第１樹脂，第２樹脂および第３樹脂を含み、第１樹脂，第２樹脂および第３樹脂がこの順に配置され、複数の波長として第１波長および第２波長を含み、第１波長において第２樹脂の透過率より第１樹脂の透過率が大きく、第２波長において第３樹脂の透過率より第１樹脂および第２樹脂それぞれの透過率が大きく、第１波長のレーザ光を第１樹脂を透過させて第２樹脂に照射して第１樹脂と第２樹脂とを溶着するとともに、第２波長のレーザ光を第１樹脂および第２樹脂を透過させて第３樹脂に照射して第２樹脂と第３樹脂とを溶着するのが好適である。
The resin processing method according to the present invention includes the first resin, the second resin, and the third resin as the resin to be processed, and the first resin, the second resin, and the third resin are arranged in this order, and the first wavelength is set as a plurality of wavelengths. 1 wavelength and 2nd wavelength are included, the transmittance | permeability of 1st resin is larger than the transmittance | permeability of 2nd resin in 1st wavelength, and each transmission of 1st resin and 2nd resin than the transmittance | permeability of 3rd resin in 2nd wavelength The first resin transmits the first resin through the first resin and irradiates the second resin to weld the first resin and the second resin, and the second laser beam is applied to the first resin and the first resin. It is preferable to weld the second resin and the third resin by transmitting the second resin and irradiating the third resin.

本発明に係る樹脂加工方法は、加工対象の樹脂として第１樹脂，第２樹脂，第３樹脂および第４樹脂を含み、第４樹脂，第３樹脂，第１樹脂および第２樹脂がこの順に配置され、複数の波長として第１波長および第２波長を含み、第１波長において第２樹脂の透過率より第１樹脂，第３樹脂および第４樹脂それぞれの透過率が大きく、第２波長において第４樹脂の透過率が１５％以上であり、第１波長のレーザ光を第１樹脂，第３樹脂および第４樹脂を透過させて第２樹脂に照射して第１樹脂と第２樹脂とを溶着するとともに、第２波長のレーザ光を第４樹脂を透過させて第３樹脂に照射して第３樹脂により第１樹脂と第４樹脂とを接着するのが好適である。
The resin processing method according to the present invention includes a first resin, a second resin, a third resin, and a fourth resin as resins to be processed, and the fourth resin, the third resin, the first resin, and the second resin are in this order. Arranged, including a first wavelength and a second wavelength as a plurality of wavelengths, wherein the first resin, the third resin, and the fourth resin have higher transmittances than the second resin at the first wavelength, and at the second wavelength, The transmittance of the fourth resin is 15% or more, the first resin, the third resin, and the fourth resin are transmitted through the first resin, and the second resin is irradiated with the first resin, the second resin, It is preferable that the first resin and the fourth resin are bonded by the third resin by welding the third resin through the fourth resin through the fourth resin.

本発明に係る樹脂加工方法は、加工対象の樹脂として第１樹脂，第２樹脂および第３樹脂を含み、第１樹脂，第２樹脂および第３樹脂がこの順に配置され、複数の波長として第１波長および第２波長を含み、第１波長において第２樹脂の透過率より第１樹脂の透過率が大きく、第２波長において第２樹脂の透過率より第３樹脂の透過率が大きく、第１波長のレーザ光を第１樹脂を透過させて第２樹脂に照射して第１樹脂と第２樹脂とを溶着するとともに、第２波長のレーザ光を第３樹脂を透過させて第２樹脂に照射して第２樹脂と第３樹脂とを溶着するのが好適である。
The resin processing method according to the present invention includes the first resin, the second resin, and the third resin as the resin to be processed, and the first resin, the second resin, and the third resin are arranged in this order, and the first wavelength is set as a plurality of wavelengths. Including the first wavelength and the second wavelength, the transmittance of the first resin is greater than the transmittance of the second resin at the first wavelength, the transmittance of the third resin is greater than the transmittance of the second resin at the second wavelength, The first resin is transmitted through the first resin to irradiate the second resin to weld the first resin and the second resin, and the second resin is transmitted through the third resin with the second wavelength laser light. It is preferable that the second resin and the third resin are welded by irradiating the resin.

本発明に係る樹脂加工方法は、加工対象の樹脂として第１樹脂，第２樹脂，第３樹脂および第４樹脂を含み、第４樹脂，第３樹脂，第１樹脂および第２樹脂がこの順に配置され、複数の波長として第１波長および第２波長を含み、第１波長において第１樹脂の透過率より第２樹脂の透過率が大きく、第２波長において第４樹脂の透過率が１５％以上であり、第１波長のレーザ光を第２樹脂を透過させて第１樹脂に照射して第１樹脂と第２樹脂とを溶着するとともに、第２波長のレーザ光を第４樹脂を透過させて第３樹脂に照射して第３樹脂により第１樹脂と第４樹脂とを接着するのが好適である。
The resin processing method according to the present invention includes a first resin, a second resin, a third resin, and a fourth resin as resins to be processed, and the fourth resin, the third resin, the first resin, and the second resin are in this order. Arranged, including a first wavelength and a second wavelength as a plurality of wavelengths, the transmittance of the second resin is larger than the transmittance of the first resin at the first wavelength, and the transmittance of the fourth resin at the second wavelength is 15%. The first resin is transmitted through the second resin and irradiated to the first resin to weld the first resin and the second resin, and the second laser beam is transmitted through the fourth resin. It is preferable that the third resin is irradiated and the first resin and the fourth resin are bonded by the third resin.

本発明に係る樹脂加工方法は、複数の波長のレーザ光をバンドルファイバにより導光して樹脂に照射するのが好適である。   In the resin processing method according to the present invention, it is preferable that laser light having a plurality of wavelengths is guided by a bundle fiber and irradiated onto the resin.

本発明に係る樹脂加工方法は、複数の波長のレーザ光のうちの少なくとも２波長のレーザ光を一定時間に亘り同時に樹脂に照射するのが好適である。   In the resin processing method according to the present invention, it is preferable to irradiate the resin simultaneously with a laser beam having at least two wavelengths out of a plurality of wavelengths.

本発明によれば、フレキシブルな樹脂加工を容易に行うことができる。   According to the present invention, flexible resin processing can be easily performed.

以下、添付図面を参照して、本発明を実施するための最良の形態を詳細に説明する。なお、図面の説明において同一の要素には同一の符号を付し、重複する説明を省略する。   The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

図１は、本実施形態に係る樹脂加工装置１の構成図である。この図に示される樹脂加工装置１は、光源１１，１２、レンズ２１，２２、バンドルファイバ３０およびレンズ４０を備え、樹脂５０を加工するものである。   FIG. 1 is a configuration diagram of a resin processing apparatus 1 according to the present embodiment. The resin processing apparatus 1 shown in this figure includes light sources 11 and 12, lenses 21 and 22, a bundle fiber 30 and a lens 40, and processes the resin 50.

光源１１は中心波長λ１のレーザ光Ｌ１を出力し、光源１２は中心波長λ２のレーザ光Ｌ２を出力する。中心波長λ１と中心波長λ２とは互いに異なる。光源１１から出力されるレーザ光Ｌ１の波長幅（半値全幅）をＷ１とし、光源１２から出力されるレーザ光Ｌ２の波長幅（半値全幅）をＷ２とすると、中心波長λ１と中心波長λ２とは互いに「Ｗ１＋Ｗ２」以上異なる。或いは、中心波長λ１と中心波長λ２とは互いに１００ｎｍ以上異なる。光源１１，１２それぞれは好適には半導体レーザ光源である。   The light source 11 outputs a laser beam L1 having a center wavelength λ1, and the light source 12 outputs a laser beam L2 having a center wavelength λ2. The center wavelength λ1 and the center wavelength λ2 are different from each other. When the wavelength width (full width at half maximum) of the laser light L1 output from the light source 11 is W1, and the wavelength width (full width at half maximum) of the laser light L2 output from the light source 12 is W2, the center wavelength λ1 and the center wavelength λ2 are They differ from each other by “W1 + W2” or more. Alternatively, the center wavelength λ1 and the center wavelength λ2 are different from each other by 100 nm or more. Each of the light sources 11 and 12 is preferably a semiconductor laser light source.

バンドルファイバ３０は、複数本の光ファイバが束ねられたものであり、光源１１，１２から出力されたレーザ光Ｌ１，Ｌ２を第１端面に入力して導光し第２端面から出力する。バンドルファイバ３０の第１端面と光源１１，１２との間にはレンズ２１，２２が挿入されている。レンズ２１は、光源１１から出力された波長λ１のレーザ光を集光してバンドルファイバ３０の第１端面に入射させる。レンズ２２は、光源１２から出力された波長λ２のレーザ光を集光してバンドルファイバ３０の第１端面に入射させる。バンドルファイバ３０の第２端面の側にはレンズ４０が設けられている。このレンズ４０は、バンドルファイバ３０の第２端面から出射されたレーザ光Ｌ１，Ｌ２を集光して樹脂５０に照射させる。   The bundle fiber 30 is a bundle of a plurality of optical fibers. The laser beams L1 and L2 output from the light sources 11 and 12 are input to the first end face, guided, and output from the second end face. Lenses 21 and 22 are inserted between the first end face of the bundle fiber 30 and the light sources 11 and 12. The lens 21 condenses the laser light having the wavelength λ <b> 1 output from the light source 11 and makes it incident on the first end face of the bundle fiber 30. The lens 22 condenses the laser light having the wavelength λ <b> 2 output from the light source 12 and makes it incident on the first end face of the bundle fiber 30. A lens 40 is provided on the second end face side of the bundle fiber 30. The lens 40 collects the laser beams L1 and L2 emitted from the second end face of the bundle fiber 30 and irradiates the resin 50 with the condensed light.

次に、本実施形態に係る樹脂加工装置１の動作を説明するとともに、本実施形態に係る樹脂加工方法について説明する。光源１１から出力された波長λ１のレーザ光Ｌ１は、レンズ２１により集光されてバンドルファイバ３０の第１端面に入射する。光源１２から出力された波長λ２のレーザ光Ｌ２は、レンズ２２により集光されてバンドルファイバ３０の第１端面に入射する。バンドルファイバ３０の第１端面に入射したレーザ光Ｌ１，Ｌ２は、バンドルファイバ３０により導光されて第２端面から出力され、レンズ４０により集光されて樹脂５０に照射される。このとき、２波長のレーザ光は、互いに異なる時間に樹脂５０に照射されてもいいが、一定時間に亘り同時に樹脂５０に照射されるのが好適である。   Next, the operation of the resin processing apparatus 1 according to the present embodiment will be described, and the resin processing method according to the present embodiment will be described. The laser light L1 having the wavelength λ1 output from the light source 11 is collected by the lens 21 and enters the first end face of the bundle fiber 30. The laser beam L2 having the wavelength λ2 output from the light source 12 is collected by the lens 22 and enters the first end face of the bundle fiber 30. The laser beams L1 and L2 incident on the first end face of the bundle fiber 30 are guided by the bundle fiber 30 and output from the second end face, and are collected by the lens 40 and applied to the resin 50. At this time, the two-wavelength laser beams may be irradiated to the resin 50 at different times, but it is preferable that the resin 50 is simultaneously irradiated for a certain time.

このようにして、樹脂５０は、複数の波長のレーザ光が照射されることで加工される。複数の波長のレーザ光を樹脂５０に照射して樹脂５０を加工することにより、フレキシブルな樹脂加工を容易に行うことができる。ここで、樹脂５０の加工とは、硬化、加熱、溶着、穿孔、掘削および切断の何れかである。また、加工対象の樹脂５０として、１または２以上のものが含まれる。樹脂へのレーザ光の照射に際しては、本実施形態のようにバンドルファイバ３０を用いることでレーザ光照射が容易となるが、必ずしもバンドルファイバを用いる必要はなく、適当な光学系を経てレーザ光を樹脂に照射させてもよい。   In this way, the resin 50 is processed by being irradiated with laser beams having a plurality of wavelengths. By irradiating the resin 50 with laser beams having a plurality of wavelengths to process the resin 50, flexible resin processing can be easily performed. Here, the processing of the resin 50 is any of curing, heating, welding, drilling, excavation, and cutting. Further, one or two or more resins 50 to be processed are included. When the resin is irradiated with the laser beam, the bundle fiber 30 is used to facilitate the laser beam irradiation as in the present embodiment, but the bundle fiber is not necessarily used, and the laser beam is not transmitted through an appropriate optical system. The resin may be irradiated.

以下では、樹脂加工として硬化、加熱、溶着、穿孔、掘削および切断の何れかを行う実施形態について説明する。   Hereinafter, an embodiment in which any of curing, heating, welding, drilling, excavation, and cutting is performed as the resin processing will be described.

（樹脂加工方法の第１実施形態）
図２は、第１実施形態に係る樹脂加工方法の説明図である。この第１実施形態に係る樹脂加工方法は、基材６０の上の樹脂５０を硬化させるものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。波長λ１のレーザ光Ｌ１を樹脂５０に照射して樹脂５０の温度を上昇させ、波長λ２のレーザ光Ｌ２を樹脂５０に照射して樹脂５０を硬化させる。レーザ光Ｌ１，Ｌ２は、樹脂５０の全体に照射される。なお、レーザ光Ｌ１によって基材６０の温度を上昇させ、間接的に樹脂５０を加熱してもよい。 (First embodiment of resin processing method)
FIG. 2 is an explanatory diagram of a resin processing method according to the first embodiment. The resin processing method according to the first embodiment cures the resin 50 on the substrate 60 and uses a laser beam L1 having a wavelength λ1 and a laser beam L2 having a wavelength λ2. The resin 50 is irradiated with laser light L1 having a wavelength λ1 to increase the temperature of the resin 50, and the resin 50 is irradiated with laser light L2 having a wavelength λ2 to cure the resin 50. The laser beams L1 and L2 are applied to the entire resin 50. In addition, the temperature of the base material 60 may be raised by the laser beam L1, and the resin 50 may be indirectly heated.

レーザ光Ｌ１は、樹脂５０または基材６０の温度を上昇させるためのものであり、例えば波長λ１が波長範囲８００ｎｍ〜１１００ｎｍ内の何れかの波長である。レーザ光Ｌ２は、樹脂５０を硬化させるためのものであり、例えば波長λ２が波長５００ｎｍ以下の何れかの波長である。このように、レーザ光Ｌ１の照射により樹脂５０の温度を上昇させることにより、レーザ光Ｌ２の照射による樹脂５０の硬化反応が促進されるので、短時間に硬化を終了させることができて、樹脂劣化を低減することができる。   The laser beam L1 is for increasing the temperature of the resin 50 or the substrate 60. For example, the wavelength λ1 is any wavelength within the wavelength range of 800 nm to 1100 nm. The laser light L2 is for curing the resin 50, and for example, the wavelength λ2 is any wavelength of 500 nm or less. Thus, by raising the temperature of the resin 50 by the irradiation of the laser beam L1, the curing reaction of the resin 50 by the irradiation of the laser beam L2 is promoted, so that the curing can be completed in a short time, and the resin Deterioration can be reduced.

（樹脂加工方法の第２実施形態）
図３は、第２実施形態に係る樹脂加工方法の説明図である。この第２実施形態に係る樹脂加工方法は、樹脂５０を穿孔、掘削または切断するものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。波長λ１のレーザ光Ｌ１を樹脂５０に照射して樹脂５０の温度を上昇させ、波長λ２のレーザ光Ｌ２を樹脂５０に照射して樹脂５０の分子結合を切断する。 (Second Embodiment of Resin Processing Method)
FIG. 3 is an explanatory diagram of a resin processing method according to the second embodiment. The resin processing method according to the second embodiment is for drilling, excavating or cutting the resin 50, and uses a laser beam L1 having a wavelength λ1 and a laser beam L2 having a wavelength λ2. The resin 50 is irradiated with the laser beam L1 having the wavelength λ1 to increase the temperature of the resin 50, and the laser beam L2 having the wavelength λ2 is irradiated to the resin 50 to break the molecular bond of the resin 50.

レーザ光Ｌ１は樹脂５０の全体に照射される。一方、レーザ光Ｌ２は、樹脂５０のうちの加工位置（または加工領域）に選択的に照射され、微小ビーム径とされて樹脂５０への照射位置が走査されてもよいし、加工領域形状と同一のビーム形状とされて樹脂５０に照射されてもよい。   The laser beam L1 is applied to the entire resin 50. On the other hand, the laser beam L2 may be selectively applied to a processing position (or processing region) of the resin 50, the diameter of the laser beam L2 may be scanned, and the irradiation position on the resin 50 may be scanned. The resin 50 may be irradiated with the same beam shape.

レーザ光Ｌ１は、樹脂５０の温度を上昇させためのものであり、例えば波長λ１が波長範囲８００ｎｍ〜１１００ｎｍ内の何れかの波長である。レーザ光Ｌ２は、樹脂５０を穿孔、掘削または切断するためのものであり、例えば波長λ２が波長５００ｎｍ以下の何れかの波長である。   The laser beam L1 is for increasing the temperature of the resin 50. For example, the wavelength λ1 is any wavelength within the wavelength range of 800 nm to 1100 nm. The laser light L2 is used for drilling, excavating, or cutting the resin 50. For example, the wavelength λ2 is any wavelength of 500 nm or less.

このように、レーザ光Ｌ１の照射により樹脂５０の温度を上昇させることにより、レーザ光Ｌ２の照射による樹脂５０の分子結合切断が促進されるので、短時間に加工を終了させることができて、樹脂劣化を低減することができるとともに、加工エッジを鋭くすることができる。   Thus, by raising the temperature of the resin 50 by irradiation with the laser light L1, the molecular bond cutting of the resin 50 by irradiation with the laser light L2 is promoted, so that the processing can be completed in a short time, Resin deterioration can be reduced, and the processing edge can be sharpened.

また、波長λ２における樹脂５０の透過率が１５％以上である場合にも、温度上昇による分子結合切断促進効果により、最適な加工を行うことができる。   Even when the transmittance of the resin 50 at the wavelength λ2 is 15% or more, the optimum processing can be performed due to the effect of promoting the molecular bond breakage due to the temperature rise.

（樹脂加工方法の第３実施形態）
図４は、第３実施形態に係る樹脂加工方法の説明図である。この第３実施形態に係る樹脂加工方法は、樹脂５１と樹脂５２とを溶着するものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。 (Third embodiment of resin processing method)
FIG. 4 is an explanatory diagram of a resin processing method according to the third embodiment. In the resin processing method according to the third embodiment, the resin 51 and the resin 52 are welded, and the laser beam L1 having the wavelength λ1 and the laser beam L2 having the wavelength λ2 are used.

波長λ１において樹脂５２の透過率より樹脂５１の透過率が大きく、波長λ１のレーザ光Ｌ１は樹脂５１を透過して樹脂５２に照射される。また、波長λ２において樹脂５１の透過率より樹脂５２の透過率が大きく、波長λ２のレーザ光Ｌ２は樹脂５２を透過して樹脂５１に照射される。波長λ１における樹脂５１の透過率は１５％以上であるのが好適であり、波長λ２における樹脂５２の透過率は１５％以上であるのが好適である。レーザ光Ｌ１，Ｌ２は、樹脂５１と樹脂５２とを溶着すべき領域の全体に照射される。   The transmittance of the resin 51 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 having the wavelength λ1 passes through the resin 51 and is irradiated onto the resin 52. Further, the transmittance of the resin 52 is larger than the transmittance of the resin 51 at the wavelength λ <b> 2, and the laser light L <b> 2 of the wavelength λ <b> 2 passes through the resin 52 and is irradiated to the resin 51. The transmittance of the resin 51 at the wavelength λ1 is preferably 15% or more, and the transmittance of the resin 52 at the wavelength λ2 is preferably 15% or more. The laser beams L1 and L2 are applied to the entire region where the resin 51 and the resin 52 are to be welded.

このように、レーザ光Ｌ１が樹脂５２により吸収されるとともに、レーザ光Ｌ２が樹脂５１により吸収されることで、樹脂５１と樹脂５２との間に溶着層Ａが形成されて、樹脂５１と樹脂５２とが溶着されるので、均一な溶着が可能である。   As described above, the laser beam L1 is absorbed by the resin 52 and the laser beam L2 is absorbed by the resin 51, whereby the weld layer A is formed between the resin 51 and the resin 52, and the resin 51 and the resin 52 is welded, so uniform welding is possible.

（樹脂加工方法の第４実施形態）
図５は、第４実施形態に係る樹脂加工方法の説明図である。この第４実施形態に係る樹脂加工方法は、樹脂５１と樹脂５２とを溶着するとともに、樹脂５２と樹脂５３とを溶着するものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。樹脂５１，樹脂５２および樹脂５３は、この順に配置されている。 (Fourth embodiment of resin processing method)
FIG. 5 is an explanatory diagram of a resin processing method according to the fourth embodiment. In the resin processing method according to the fourth embodiment, the resin 51 and the resin 52 are welded, and the resin 52 and the resin 53 are welded. The laser light L1 having the wavelength λ1 and the laser light L2 having the wavelength λ2 are welded. Is used. Resin 51, resin 52, and resin 53 are arranged in this order.

波長λ１において樹脂５２の透過率より樹脂５１の透過率が大きく、波長λ１のレーザ光Ｌ１は樹脂５１を透過して樹脂５２に照射されて、樹脂５１と樹脂５２とが溶着される。また、波長λ２において樹脂５３の透過率より樹脂５１および樹脂５２それぞれの透過率が大きく、波長λ２のレーザ光Ｌ２は樹脂５１および樹脂５２を透過して樹脂５３に照射されて、樹脂５２と樹脂５３とが溶着される。   The transmittance of the resin 51 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 having the wavelength λ1 passes through the resin 51 and is irradiated to the resin 52, so that the resin 51 and the resin 52 are welded. Further, the transmittance of each of the resin 51 and the resin 52 is larger than that of the resin 53 at the wavelength λ2, and the laser light L2 having the wavelength λ2 passes through the resin 51 and the resin 52 and is irradiated to the resin 53. 53 is welded.

このように、レーザ光Ｌ１が樹脂５２により吸収されることで、樹脂５１と樹脂５２との間に溶着層Ａ１が形成されて、樹脂５１と樹脂５２とが溶着され、これと同時に、レーザ光Ｌ２が樹脂５３により吸収されることで、樹脂５２と樹脂５３との間に溶着層Ａ２が形成されて、樹脂５２と樹脂５３とが溶着される。   As described above, the laser light L1 is absorbed by the resin 52, so that the welding layer A1 is formed between the resin 51 and the resin 52, and the resin 51 and the resin 52 are welded. As L2 is absorbed by the resin 53, a welding layer A2 is formed between the resin 52 and the resin 53, and the resin 52 and the resin 53 are welded.

（樹脂加工方法の第５実施形態）
図６は、第５実施形態に係る樹脂加工方法の説明図である。この第５実施形態に係る樹脂加工方法は、樹脂５１と樹脂５２とを溶着するとともに、樹脂５３を硬化させるものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。樹脂５３，樹脂５１および樹脂５２がこの順に配置されている。 (Fifth embodiment of resin processing method)
FIG. 6 is an explanatory diagram of a resin processing method according to the fifth embodiment. In the resin processing method according to the fifth embodiment, the resin 51 and the resin 52 are welded and the resin 53 is cured, and the laser beam L1 having the wavelength λ1 and the laser beam L2 having the wavelength λ2 are used. Resin 53, resin 51, and resin 52 are arranged in this order.

波長λ１において樹脂５２の透過率より樹脂５１の透過率が大きく、波長λ１のレーザ光Ｌ１は樹脂５１を透過して樹脂５２に照射されて、樹脂５１と樹脂５２との間に溶着層Ａが形成され、樹脂５１と樹脂５２とが溶着される。また、波長λ２のレーザ光Ｌ２は樹脂５３に照射されて、樹脂５３は硬化する。このように溶着と硬化とが同時に行われる。   The transmittance of the resin 51 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 of the wavelength λ1 passes through the resin 51 and is irradiated to the resin 52, so that the welding layer A is formed between the resin 51 and the resin 52. The resin 51 and the resin 52 are welded. Further, the resin 53 is irradiated with the laser beam L2 having the wavelength λ2, and the resin 53 is cured. Thus, welding and hardening are performed simultaneously.

（樹脂加工方法の第６実施形態）
図７は、第６実施形態に係る樹脂加工方法の説明図である。この第６実施形態に係る樹脂加工方法は、樹脂５１と樹脂５２とを溶着するとともに、樹脂５１と樹脂５４とを接着するものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。樹脂５４，樹脂５３，樹脂５１および樹脂５２がこの順に配置されている。 (Sixth embodiment of resin processing method)
FIG. 7 is an explanatory diagram of a resin processing method according to the sixth embodiment. In the resin processing method according to the sixth embodiment, the resin 51 and the resin 52 are welded, and the resin 51 and the resin 54 are bonded to each other. The laser light L1 having the wavelength λ1 and the laser light L2 having the wavelength λ2 are bonded. Is used. Resin 54, resin 53, resin 51, and resin 52 are arranged in this order.

波長λ１において樹脂５２の透過率より樹脂５１，樹脂５３および樹脂５４それぞれの透過率が大きく、波長λ１のレーザ光Ｌ１は樹脂５４，樹脂５３および樹脂５１を透過して樹脂５２に照射されて、樹脂５１と樹脂５２との間に溶着層Ａが形成され、樹脂５１と樹脂５２とが溶着される。また、波長λ２において樹脂５４の透過率が１５％以上であり、波長λ２のレーザ光Ｌ２は樹脂５４を透過して樹脂５３に照射されて、樹脂５３により樹脂５１と樹脂５４とが接着される。このように溶着と接着とが同時に行われる。   The transmittance of each of the resin 51, the resin 53, and the resin 54 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 of the wavelength λ1 passes through the resin 54, the resin 53, and the resin 51 and is irradiated to the resin 52. The welding layer A is formed between the resin 51 and the resin 52, and the resin 51 and the resin 52 are welded. Further, the transmittance of the resin 54 at the wavelength λ 2 is 15% or more, and the laser light L 2 of the wavelength λ 2 passes through the resin 54 and is irradiated to the resin 53, and the resin 51 and the resin 54 are bonded by the resin 53. . Thus, welding and adhesion are performed simultaneously.

（樹脂加工方法の第７実施形態）
図８は、第７実施形態に係る樹脂加工方法の説明図である。この第７実施形態に係る樹脂加工方法は、樹脂５１と樹脂５２とを溶着するとともに、樹脂５１を掘削、切断または穿孔するものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。 (Seventh embodiment of resin processing method)
FIG. 8 is an explanatory diagram of a resin processing method according to the seventh embodiment. In the resin processing method according to the seventh embodiment, the resin 51 and the resin 52 are welded, and the resin 51 is excavated, cut, or perforated. The laser beam L1 having the wavelength λ1 and the laser beam L2 having the wavelength λ2 are used. Is used.

波長λ１において樹脂５２の透過率より樹脂５１の透過率が大きく、波長λ１のレーザ光Ｌ１は樹脂５１を透過し樹脂５２に照射されて、樹脂５１と樹脂５２との間に溶着層Ａが形成され、樹脂５１と樹脂５２とが溶着される。また、波長λ２のレーザ光Ｌ２は樹脂５１に照射されて、樹脂５１は掘削、切断または穿孔される。   The transmittance of the resin 51 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 of the wavelength λ1 passes through the resin 51 and is irradiated to the resin 52, so that a weld layer A is formed between the resin 51 and the resin 52. Then, the resin 51 and the resin 52 are welded. In addition, the laser beam L2 having the wavelength λ2 is applied to the resin 51, and the resin 51 is excavated, cut, or perforated.

レーザ光Ｌ２は、樹脂５１のうちの加工位置（または加工領域）に選択的に照射され、微小ビーム径とされて樹脂５１への照射位置が走査されてもよいし、加工領域形状と同一のビーム形状とされて樹脂５１に照射されてもよい。
このように溶着と掘削等とが同時に行われる。 The laser beam L2 may be selectively irradiated to a processing position (or processing region) of the resin 51 to have a small beam diameter, and the irradiation position on the resin 51 may be scanned, or the same as the processing region shape. The resin 51 may be irradiated with a beam shape.
In this way, welding and excavation are performed simultaneously.

（樹脂加工方法の第８実施形態）
図９は、第８実施形態に係る樹脂加工方法の説明図である。この第８実施形態に係る樹脂加工方法は、樹脂５１と樹脂５２とを溶着するものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。 (Eighth embodiment of resin processing method)
FIG. 9 is an explanatory diagram of a resin processing method according to the eighth embodiment. In the resin processing method according to the eighth embodiment, the resin 51 and the resin 52 are welded, and the laser beam L1 having the wavelength λ1 and the laser beam L2 having the wavelength λ2 are used.

波長λ１および波長λ２それぞれにおいて樹脂５２の透過率より樹脂５１の透過率が大きい。波長λ１のレーザ光Ｌ１は樹脂５１を透過して樹脂５２に照射されて、樹脂５２は予加熱される。また、波長λ２のレーザ光Ｌ２は樹脂５１を透過して樹脂５２に照射されて、樹脂５２は本加熱される。これにより、樹脂５１と樹脂５２との間に溶着層Ａが形成され、樹脂５１と樹脂５２とが溶着される。   The transmittance of the resin 51 is greater than the transmittance of the resin 52 at each of the wavelengths λ1 and λ2. The laser beam L1 having the wavelength λ1 passes through the resin 51 and is applied to the resin 52, and the resin 52 is preheated. In addition, the laser beam L2 having the wavelength λ2 passes through the resin 51 and is irradiated onto the resin 52, and the resin 52 is heated. Thereby, the welding layer A is formed between the resin 51 and the resin 52, and the resin 51 and the resin 52 are welded.

（樹脂加工方法の第９実施形態）
図１０は、第９実施形態に係る樹脂加工方法の説明図である。この第９実施形態に係る樹脂加工方法は、基材６０の上の樹脂５０を加熱するものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。または、基材６０を加熱し、樹脂５０を間接的に加熱する。波長λ１のレーザ光Ｌ１によって樹脂５０は予加熱され、また、波長λ２のレーザ光Ｌ２によって樹脂５０は本加熱される。このように予加熱と本加熱とを同時に行うことができるので、加熱時間の短縮が可能となり、樹脂劣化を低減することができる。 (Ninth embodiment of resin processing method)
FIG. 10 is an explanatory diagram of a resin processing method according to the ninth embodiment. The resin processing method according to the ninth embodiment heats the resin 50 on the substrate 60, and uses a laser beam L1 having a wavelength λ1 and a laser beam L2 having a wavelength λ2. Alternatively, the substrate 60 is heated and the resin 50 is indirectly heated. The resin 50 is preheated by the laser beam L1 having the wavelength λ1, and the resin 50 is fully heated by the laser beam L2 having the wavelength λ2. Thus, since preheating and main heating can be performed simultaneously, heating time can be shortened and resin degradation can be reduced.

（樹脂加工方法の第１０実施形態）
図１１は、第１０実施形態に係る樹脂加工方法の説明図である。この第１０実施形態に係る樹脂加工方法は、樹脂５１と樹脂５２とを溶着するとともに、樹脂５２と樹脂５３とを溶着するものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。樹脂５１，樹脂５２および樹脂５３は、この順に配置されている。 (10th Embodiment of Resin Processing Method)
FIG. 11 is an explanatory diagram of a resin processing method according to the tenth embodiment. In the resin processing method according to the tenth embodiment, the resin 51 and the resin 52 are welded, and the resin 52 and the resin 53 are welded. The laser light L1 having the wavelength λ1 and the laser light L2 having the wavelength λ2 are welded. Is used. Resin 51, resin 52, and resin 53 are arranged in this order.

波長λ１において樹脂５２の透過率より樹脂５１の透過率が大きく、波長λ１のレーザ光Ｌ１は樹脂５１を透過して樹脂５２に照射されて、樹脂５１と樹脂５２とが溶着される。また、波長λ２において樹脂５２の透過率より樹脂５３の透過率が大きく、波長λ２のレーザ光Ｌ２は樹脂５３を透過して樹脂５２に照射されて、樹脂５２と樹脂５３とが溶着される。   The transmittance of the resin 51 is larger than the transmittance of the resin 52 at the wavelength λ1, and the laser light L1 having the wavelength λ1 passes through the resin 51 and is irradiated to the resin 52, so that the resin 51 and the resin 52 are welded. Further, the transmittance of the resin 53 is larger than that of the resin 52 at the wavelength λ2, and the laser light L2 having the wavelength λ2 passes through the resin 53 and is irradiated to the resin 52, so that the resin 52 and the resin 53 are welded.

このように、レーザ光Ｌ１が樹脂５２により吸収されることで、樹脂５１と樹脂５２との間に溶着層Ａ１が形成されて、樹脂５１と樹脂５２とが溶着され、これと同時に、レーザ光Ｌ２が樹脂５２により吸収されることで、樹脂５２と樹脂５３との間に溶着層Ａ２が形成されて、樹脂５２と樹脂５３とが溶着される。   As described above, the laser light L1 is absorbed by the resin 52, so that the welding layer A1 is formed between the resin 51 and the resin 52, and the resin 51 and the resin 52 are welded. As L2 is absorbed by the resin 52, a welding layer A2 is formed between the resin 52 and the resin 53, and the resin 52 and the resin 53 are welded.

（樹脂加工方法の第１１実施形態）
図１２は、第１１実施形態に係る樹脂加工方法の説明図である。この第１１実施形態に係る樹脂加工方法は、樹脂５１と樹脂５２とを溶着するとともに、樹脂５１と樹脂５４とを接着するものであって、波長λ１のレーザ光Ｌ１および波長λ２のレーザ光Ｌ２を用いる。樹脂５４，樹脂５３，樹脂５１および樹脂５２がこの順に配置されている。 (Eleventh Embodiment of Resin Processing Method)
FIG. 12 is an explanatory diagram of a resin processing method according to the eleventh embodiment. In the resin processing method according to the eleventh embodiment, the resin 51 and the resin 52 are welded, and the resin 51 and the resin 54 are bonded to each other. The laser light L1 having the wavelength λ1 and the laser light L2 having the wavelength λ2 are bonded. Is used. Resin 54, resin 53, resin 51, and resin 52 are arranged in this order.

波長λ１において樹脂５１の透過率より樹脂５２の透過率が大きく、波長λ１のレーザ光Ｌ１は樹脂５２を透過して樹脂５１に照射されて、樹脂５１と樹脂５２との間に溶着層Ａが形成され、樹脂５１と樹脂５２とが溶着される。また、波長λ２において樹脂５４の透過率が１５％以上であり、波長λ２のレーザ光Ｌ２は樹脂５４を透過して樹脂５３に照射されて、樹脂５３により樹脂５１と樹脂５４とが接着される。このように溶着と接着とが同時に行われる。   The transmittance of the resin 52 is larger than the transmittance of the resin 51 at the wavelength λ1, and the laser light L1 of the wavelength λ1 passes through the resin 52 and is irradiated to the resin 51, so that the welding layer A is formed between the resin 51 and the resin 52. The resin 51 and the resin 52 are welded. Further, the transmittance of the resin 54 at the wavelength λ 2 is 15% or more, and the laser light L 2 of the wavelength λ 2 passes through the resin 54 and is irradiated to the resin 53, and the resin 51 and the resin 54 are bonded by the resin 53. . Thus, welding and adhesion are performed simultaneously.

本実施形態に係る樹脂加工装置１の構成図である。It is a block diagram of the resin processing apparatus 1 which concerns on this embodiment. 第１実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 1st Embodiment. 第２実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 2nd Embodiment. 第３実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 3rd Embodiment. 第４実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 4th Embodiment. 第５実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 5th Embodiment. 第６実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 6th Embodiment. 第７実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 7th Embodiment. 第８実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 8th Embodiment. 第９実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 9th Embodiment. 第１０実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 10th Embodiment. 第１１実施形態に係る樹脂加工方法の説明図である。It is explanatory drawing of the resin processing method which concerns on 11th Embodiment.

符号の説明Explanation of symbols

１…樹脂加工装置、１１，１２…光源、２１，２２…レンズ、３０…バンドルファイバ、４０…レンズ、５０〜５４…樹脂。   DESCRIPTION OF SYMBOLS 1 ... Resin processing apparatus, 11, 12 ... Light source, 21, 22 ... Lens, 30 ... Bundle fiber, 40 ... Lens, 50-54 ... Resin.

Claims (7)

各々の中心波長が互いに波長幅以上異なる複数の波長のレーザ光を照射して、各々樹脂である第１の加工対象と第２の加工対象とを溶着または接着し、各々樹脂である前記第２の加工対象と第３の加工対象とを溶着または接着する樹脂加工方法であって、
前記複数の波長として第１波長および第２波長を含み、
前記第１波長において、前記第１〜前記第３の加工対象のうち、前記第１の加工対象と前記第２の加工対象との溶着または接着の箇所へ至るまでの前記第１波長のレーザ光の光路上にある加工対象の透過率は、その他の加工対象の透過率より大きく、
前記第２波長において、前記第１〜前記第３の加工対象のうち、前記第２の加工対象と前記第３の加工対象との溶着または接着の箇所へ至るまでの前記第２波長のレーザ光の光路上にある加工対象の透過率は、その他の加工対象の透過率より大きく、
前記第１波長のレーザ光を照射することで前記第１の加工対象と前記第２の加工対象とを溶着または接着し、
前記第２波長のレーザ光を照射することで前記第２の加工対象と前記第３の加工対象とを溶着または接着する、
ことを特徴とする樹脂加工方法。 Each of the central wavelengths is irradiated with laser beams having a plurality of wavelengths different from each other by a wavelength width or more, and the first processing object and the second processing object, each of which is a resin, are welded or bonded to each other, and the second each of which is a resin. A resin processing method for welding or bonding the processing object and the third processing object ,
Including a first wavelength and a second wavelength as the plurality of wavelengths;
Laser light of the first wavelength from the first to third processing objects up to the position where the first processing object and the second processing object are welded or bonded at the first wavelength. The transmittance of the processing object on the optical path of is larger than the transmittance of other processing objects,
Laser light of the second wavelength from the first to third processing objects up to the position where the second processing object and the third processing object are welded or bonded at the second wavelength. The transmittance of the processing object on the optical path of is larger than the transmittance of other processing objects,
The first processing object and the second processing object are welded or bonded by irradiating the laser light of the first wavelength,
Welding or bonding the second processing object and the third processing object by irradiating the laser light of the second wavelength;
The resin processing method characterized by the above-mentioned. 加工対象の前記樹脂として第１樹脂，第２樹脂および第３樹脂を含み、前記第１樹脂，前記第２樹脂および前記第３樹脂がこの順に配置され、前記複数の波長として第１波長および第２波長を含み、前記第１波長において前記第２樹脂の透過率より前記第１樹脂の透過率が大きく、前記第２波長において前記第３樹脂の透過率より前記第１樹脂および前記第２樹脂それぞれの透過率が大きく、
前記第１波長のレーザ光を前記第１樹脂を透過させて前記第２樹脂に照射して前記第１樹脂と前記第２樹脂とを溶着するとともに、
前記第２波長のレーザ光を前記第１樹脂および前記第２樹脂を透過させて前記第３樹脂に照射して前記第２樹脂と前記第３樹脂とを溶着する、
ことを特徴とする請求項１記載の樹脂加工方法。 The first resin, the second resin, and the third resin are included as the resin to be processed, and the first resin, the second resin, and the third resin are arranged in this order, and the first wavelength and the second resin are the plurality of wavelengths. Including two wavelengths, the transmittance of the first resin is greater than the transmittance of the second resin at the first wavelength, and the first resin and the second resin are greater than the transmittance of the third resin at the second wavelength. Each transmittance is large,
The first resin is transmitted through the first resin and irradiated to the second resin to weld the first resin and the second resin;
Irradiating the third resin with the second wavelength laser light transmitted through the first resin and the second resin to weld the second resin and the third resin;
The resin processing method according to claim 1 . 加工対象の前記樹脂として第１樹脂，第２樹脂，第３樹脂および第４樹脂を含み、前記第４樹脂，前記第３樹脂，前記第１樹脂および前記第２樹脂がこの順に配置され、前記複数の波長として第１波長および第２波長を含み、前記第１波長において前記第２樹脂の透過率より前記第１樹脂，前記第３樹脂および前記第４樹脂それぞれの透過率が大きく、前記第２波長において前記第４樹脂の透過率が１５％以上であり、
前記第１波長のレーザ光を前記第１樹脂，前記第３樹脂および前記第４樹脂を透過させて前記第２樹脂に照射して前記第１樹脂と前記第２樹脂とを溶着するとともに、
前記第２波長のレーザ光を前記第４樹脂を透過させて前記第３樹脂に照射して前記第３樹脂により前記第１樹脂と前記第４樹脂とを接着する、
ことを特徴とする請求項１記載の樹脂加工方法。 The resin to be processed includes a first resin, a second resin, a third resin, and a fourth resin, and the fourth resin, the third resin, the first resin, and the second resin are arranged in this order, The plurality of wavelengths includes a first wavelength and a second wavelength, and each of the first resin, the third resin, and the fourth resin has a transmittance greater than the transmittance of the second resin at the first wavelength. The transmittance of the fourth resin at 15 wavelengths is 15% or more,
The first resin, the third resin and the fourth resin are transmitted through the first resin, the second resin is irradiated to the second resin, and the first resin and the second resin are welded.
Irradiating the third resin with the laser light of the second wavelength through the fourth resin, and bonding the first resin and the fourth resin by the third resin;
The resin processing method according to claim 1 . 加工対象の前記樹脂として第１樹脂，第２樹脂および第３樹脂を含み、前記第１樹脂，前記第２樹脂および前記第３樹脂がこの順に配置され、前記複数の波長として第１波長および第２波長を含み、前記第１波長において前記第２樹脂の透過率より前記第１樹脂の透過率が大きく、前記第２波長において前記第２樹脂の透過率より前記第３樹脂の透過率が大きく、
前記第１波長のレーザ光を前記第１樹脂を透過させて前記第２樹脂に照射して前記第１樹脂と前記第２樹脂とを溶着するとともに、
前記第２波長のレーザ光を前記第３樹脂を透過させて前記第２樹脂に照射して前記第２樹脂と前記第３樹脂とを溶着する、
ことを特徴とする請求項１記載の樹脂加工方法。 The first resin, the second resin, and the third resin are included as the resin to be processed, and the first resin, the second resin, and the third resin are arranged in this order, and the first wavelength and the second resin are the plurality of wavelengths. Including two wavelengths, the transmittance of the first resin is greater than the transmittance of the second resin at the first wavelength, and the transmittance of the third resin is greater than the transmittance of the second resin at the second wavelength. ,
The first resin is transmitted through the first resin and irradiated to the second resin to weld the first resin and the second resin;
Irradiating the second resin with laser light of the second wavelength through the third resin to weld the second resin and the third resin;
The resin processing method according to claim 1 . 加工対象の前記樹脂として第１樹脂，第２樹脂，第３樹脂および第４樹脂を含み、前記第４樹脂，前記第３樹脂，前記第１樹脂および前記第２樹脂がこの順に配置され、前記複数の波長として第１波長および第２波長を含み、前記第１波長において前記第１樹脂の透過率より前記第２樹脂の透過率が大きく、前記第２波長において前記第４樹脂の透過率が１５％以上であり、
前記第１波長のレーザ光を前記第２樹脂を透過させて前記第１樹脂に照射して前記第１樹脂と前記第２樹脂とを溶着するとともに、
前記第２波長のレーザ光を前記第４樹脂を透過させて前記第３樹脂に照射して前記第３樹脂により前記第１樹脂と前記第４樹脂とを接着する、
ことを特徴とする請求項１記載の樹脂加工方法。 The resin to be processed includes a first resin, a second resin, a third resin, and a fourth resin, and the fourth resin, the third resin, the first resin, and the second resin are arranged in this order, The first wavelength and the second wavelength are included as a plurality of wavelengths, the transmittance of the second resin is larger than the transmittance of the first resin at the first wavelength, and the transmittance of the fourth resin at the second wavelength. 15% or more,
The first resin is transmitted through the second resin and irradiated to the first resin to weld the first resin and the second resin;
Irradiating the third resin with the laser light of the second wavelength through the fourth resin, and bonding the first resin and the fourth resin by the third resin;
The resin processing method according to claim 1 . 前記複数の波長のレーザ光をバンドルファイバにより導光して前記樹脂に照射することを特徴とする請求項１記載の樹脂加工方法。 Resin processing method according to claim 1, wherein the irradiating the resin with guided by a bundle fiber laser beam of the plurality of wavelengths. 前記複数の波長のレーザ光のうちの少なくとも２波長のレーザ光を一定時間に亘り同時に前記樹脂に照射することを特徴とする請求項１記載の樹脂加工方法。
Resin processing method according to claim 1, wherein applying the laser beam of the at least two wavelengths simultaneously the resin over a period of time of the laser beam of the plurality of wavelengths.
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