JP5653652B2 - Thermosetting resin bonding method and thermosetting resin bonding apparatus - Google Patents

Thermosetting resin bonding method and thermosetting resin bonding apparatus Download PDF

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JP5653652B2
JP5653652B2 JP2010111125A JP2010111125A JP5653652B2 JP 5653652 B2 JP5653652 B2 JP 5653652B2 JP 2010111125 A JP2010111125 A JP 2010111125A JP 2010111125 A JP2010111125 A JP 2010111125A JP 5653652 B2 JP5653652 B2 JP 5653652B2
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thermosetting resin
resin agent
agent
surface portion
light
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JP2011235604A (en
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丈典 大宮
丈典 大宮
諭 大石
諭 大石
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Hamamatsu Photonics KK
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

本発明は、レーザ光の照射によって熱硬化性樹脂剤を硬化させ、部材同士を接合して熱硬化性樹脂接合体を製造する熱硬化性樹脂接合方法及び熱硬化性樹脂接合装置に関する。 The present invention relates to a thermosetting resin bonding method and a thermosetting resin bonding apparatus in which a thermosetting resin agent is cured by laser light irradiation and members are bonded to each other to manufacture a thermosetting resin bonded body.

上記技術分野における従来の熱硬化性樹脂接合方法として、接合すべき部材同士の間に熱硬化性樹脂剤を配置した状態で、少なくとも一方の部材にレーザ光を照射することにより当該部材を発熱させ、その熱によって熱硬化性樹脂剤を硬化させるものが知られている（例えば特許文献１，２参照）。   As a conventional thermosetting resin joining method in the above technical field, in a state where a thermosetting resin agent is arranged between members to be joined, at least one member is irradiated with laser light to cause the member to generate heat. In addition, those that cure the thermosetting resin agent by the heat are known (see, for example, Patent Documents 1 and 2).

特開平５−２９０４９０号公報JP-A-5-290490 特開平２−１９７３８５号公報JP-A-2-197385

しかしながら、上述したような熱硬化性樹脂接合方法では、熱硬化性樹脂剤のうち、発熱した部材に接触する表面部は十分に加熱されて硬化しても、内部は十分に加熱されず硬化しないおそれがある。特に、外部への熱硬化性樹脂剤の露出面積が大きい一方で、部材に対する熱硬化性樹脂剤の接触面積が小さい場合（例えば、接合すべき部材同士によって形成された隅部に熱硬化性樹脂剤が盛られるように配置される場合）には、熱硬化性樹脂剤の内部が硬化しないおそれが高まる。   However, in the thermosetting resin bonding method as described above, even if the surface portion of the thermosetting resin agent that contacts the heated member is sufficiently heated and cured, the inside is not sufficiently heated and is not cured. There is a fear. In particular, when the exposed area of the thermosetting resin agent to the outside is large, but the contact area of the thermosetting resin agent to the member is small (for example, the thermosetting resin at the corner formed by the members to be joined together) In the case where the agents are arranged so as to be stacked, the possibility that the inside of the thermosetting resin agent will not be cured increases.

また、接合すべき部材の光吸収率が低いと、そのような部材は、熱硬化性樹脂剤の全体を硬化させるのに十分な熱を発し得ない。そのため、上述したような熱硬化性樹脂接合方法には、接合すべき部材の光吸収率が高い必要があるといった制約も存在する。   Moreover, when the light absorption rate of the members to be joined is low, such a member cannot generate sufficient heat to cure the entire thermosetting resin agent. Therefore, the thermosetting resin bonding method as described above has a limitation that the light absorption rate of the members to be bonded needs to be high.

なお、レーザ光を熱硬化性樹脂剤に照射して吸収させ、熱硬化性樹脂剤自体の発熱によって熱硬化性樹脂剤を硬化させようとすると、熱硬化性樹脂剤においてレーザ光が入射する表面部に、入熱過多による損傷（気泡、白濁、焼損等）が生じるおそれがある。しかも、熱硬化性接着剤の硬化時に網目状架橋反応が進むこと等が光散乱要因となって、熱硬化性樹脂剤の内部にレーザ光が十分に到達せず、熱硬化性樹脂剤の内部が硬化しないおそれがある。   When the thermosetting resin agent is irradiated and absorbed by the laser beam, and the thermosetting resin agent is cured by the heat generated by the thermosetting resin agent itself, the surface on which the laser beam is incident on the thermosetting resin agent There is a risk that damage (bubbles, cloudiness, burnout, etc.) due to excessive heat input may occur in the part. Moreover, the progress of the network cross-linking reaction during curing of the thermosetting adhesive becomes a light scattering factor, so that the laser beam does not reach the inside of the thermosetting resin agent sufficiently, and the inside of the thermosetting resin agent May not cure.

本発明は、このような事情に鑑みてなされたものであり、レーザ光の照射によって熱硬化性樹脂剤を良好に硬化させることができる熱硬化性樹脂接合方法及び熱硬化性樹脂接合装置を提供することを課題とする。 This invention is made | formed in view of such a situation, and provides the thermosetting resin joining method and thermosetting resin joining apparatus which can harden a thermosetting resin agent favorably by irradiation of a laser beam. The task is to do.

上記課題を解決するために、本発明の熱硬化性樹脂接合方法は、レーザ光の照射によって熱硬化性樹脂剤を硬化させ、第１の部材と第２の部材とを接合して熱硬化性樹脂接合体を製造する熱硬化性樹脂接合方法であって、レーザ光は、熱硬化性樹脂剤の光吸収率が最高となる波長よりも長い波長を有しており、熱硬化性樹脂剤の表面部から熱硬化性樹脂剤の内部に収束するように、表面部から内部に入射させられ、熱硬化性樹脂剤に照射されるレーザ光の強度は、第１の光強度から、第１の光強度よりも低い第２の光強度に変化させられることを特徴とする。また、本発明の熱硬化性樹脂接合装置は、レーザ光の照射によって熱硬化性樹脂剤を硬化させ、第１の部材と第２の部材とを接合して熱硬化性樹脂接合体を製造する熱硬化性樹脂接合装置であって、熱硬化性樹脂剤の光吸収率が最高となる波長よりも長い波長を有するレーザ光を出射する光源と、熱硬化性樹脂剤の表面部から熱硬化性樹脂剤の内部に収束するように、レーザ光を表面部から内部に入射させる集光光学系と、熱硬化性樹脂剤に照射されるレーザ光の強度を、第１の光強度から、第１の光強度よりも低い第２の光強度に変化させる手段と、を備える。 In order to solve the above-mentioned problems, the thermosetting resin bonding method of the present invention cures a thermosetting resin agent by irradiation with laser light, and bonds the first member and the second member to thermosetting. A thermosetting resin bonding method for producing a resin bonded body, wherein the laser beam has a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent is maximum, From the first light intensity, the intensity of the laser beam incident on the inside of the thermosetting resin agent so as to converge from the surface portion to the inside of the thermosetting resin agent is as follows. It is varied in the lower second light intensity than the light intensity, characterized in Rukoto. Moreover, the thermosetting resin joining apparatus of this invention hardens a thermosetting resin agent by irradiation of a laser beam, joins a 1st member and a 2nd member, and manufactures a thermosetting resin joined body. A thermosetting resin bonding apparatus, which emits laser light having a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent is maximum, and thermosetting from the surface portion of the thermosetting resin agent A condensing optical system for allowing laser light to enter the inside from the surface portion so as to converge inside the resin agent, and the intensity of the laser light applied to the thermosetting resin agent from the first light intensity to the first And means for changing to a second light intensity lower than the light intensity.

この熱硬化性樹脂接合方法及び熱硬化性樹脂接合装置では、熱硬化性樹脂剤の光吸収率が最高となる波長よりも長い波長を有するレーザ光が熱硬化性樹脂剤に照射される。これにより、熱硬化性樹脂剤においてレーザ光が入射する表面部で吸収されるレーザ光の光量が減少し、熱硬化性樹脂剤の内部に到達するレーザ光の光量が増加する。加えて、レーザ光が長い波長を有するので、熱硬化性樹脂剤でのレーザ光の散乱が抑制され、熱硬化性樹脂剤の内部にレーザ光が進行し易くなる。従って、熱硬化性樹脂剤の表面部だけでなく内部も十分に加熱されて、熱硬化性樹脂剤の全体が硬化する。更に、レーザ光は、熱硬化性樹脂剤の表面部から内部に収束するように、熱硬化性樹脂剤の表面部から内部に入射させられる。このことと、熱硬化性樹脂剤の表面部で吸収されるレーザ光の光量が減少することが相俟って、熱硬化性樹脂剤の表面部での損傷の発生が防止される。よって、この熱硬化性樹脂接合方法によれば、レーザ光の照射によって熱硬化性樹脂剤を良好に硬化させることができる。また、熱硬化性樹脂剤の温度を硬化開始温度以上に素早く上昇させた後、熱硬化性樹脂剤の温度を硬化開始温度以上かつ損傷発生温度以下に保持して、熱硬化性樹脂剤の全体を良好に硬化させることができる。 In this thermosetting resin bonding method and thermosetting resin bonding apparatus , the thermosetting resin agent is irradiated with laser light having a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent is maximum. Thereby, the light quantity of the laser beam absorbed in the surface part in which a laser beam injects in a thermosetting resin agent reduces, and the light quantity of the laser beam which reaches | attains the inside of a thermosetting resin agent increases. In addition, since the laser beam has a long wavelength, the scattering of the laser beam in the thermosetting resin agent is suppressed, and the laser beam easily proceeds inside the thermosetting resin agent. Therefore, not only the surface portion of the thermosetting resin agent but also the inside is sufficiently heated, and the entire thermosetting resin agent is cured. Furthermore, the laser light is incident on the inside from the surface portion of the thermosetting resin agent so as to converge from the surface portion of the thermosetting resin agent. In combination with this, the amount of laser light absorbed by the surface portion of the thermosetting resin agent is reduced, and the occurrence of damage on the surface portion of the thermosetting resin agent is prevented. Therefore, according to this thermosetting resin bonding method, the thermosetting resin agent can be cured well by irradiation with laser light. In addition, after the temperature of the thermosetting resin agent is quickly raised above the curing start temperature, the temperature of the thermosetting resin agent is maintained above the curing start temperature and below the damage occurrence temperature, and the entire thermosetting resin agent Can be cured well.

ここで、レーザ光は、表面部において、光軸に対して垂直な断面形状が環形状となるように、熱硬化性樹脂剤に照射されることが好ましい。これによれば、熱硬化性樹脂剤におけるレーザ光の照射領域の中心部に、入熱過多による損傷が生じるのを防止することができる。しかも、レーザ光が熱硬化性樹脂剤の表面部から内部に収束しているため、光吸収によって減衰する光密度が補われて、熱硬化性樹脂剤の表面部から内部に至る熱硬化性樹脂剤の全体を硬化させることができる。   Here, it is preferable that the laser beam is irradiated to the thermosetting resin agent so that the cross-sectional shape perpendicular to the optical axis becomes a ring shape on the surface portion. According to this, it is possible to prevent damage due to excessive heat input from occurring in the central portion of the laser light irradiation region in the thermosetting resin agent. Moreover, since the laser beam is converged from the surface portion of the thermosetting resin agent to the inside, the light density attenuated by light absorption is compensated, and the thermosetting resin extending from the surface portion of the thermosetting resin agent to the inside. The entire agent can be cured.

また、本発明の熱硬化性樹脂接合方法は、レーザ光の照射によって熱硬化性樹脂剤を硬化させ、第１の部材と第２の部材とを接合して熱硬化性樹脂接合体を製造する熱硬化性樹脂接合方法であって、レーザ光は、熱硬化性樹脂剤の光吸収率が最高となる波長よりも長い波長を有しており、熱硬化性樹脂剤の表面部から熱硬化性樹脂剤の内部に収束するように、表面部から内部に入射させられ、熱硬化性樹脂剤に照射されるレーザ光の集光スポットの位置は、第１の位置から、第１の位置よりも表面部に近い第２の位置に変化させられることを特徴とする。また、本発明の熱硬化性樹脂接合装置は、レーザ光の照射によって熱硬化性樹脂剤を硬化させ、第１の部材と第２の部材とを接合して熱硬化性樹脂接合体を製造する熱硬化性樹脂接合装置であって、熱硬化性樹脂剤の光吸収率が最高となる波長よりも長い波長を有するレーザ光を出射する光源と、熱硬化性樹脂剤の表面部から熱硬化性樹脂剤の内部に収束するように、レーザ光を表面部から内部に入射させる集光光学系と、熱硬化性樹脂剤に照射されるレーザ光の集光スポットの位置を、第１の位置から、第１の位置よりも表面部に近い第２の位置に変化させる手段と、を備える。
この熱硬化性樹脂接合方法及び熱硬化性樹脂接合装置では、熱硬化性樹脂剤の光吸収率が最高となる波長よりも長い波長を有するレーザ光が熱硬化性樹脂剤に照射される。これにより、熱硬化性樹脂剤においてレーザ光が入射する表面部で吸収されるレーザ光の光量が減少し、熱硬化性樹脂剤の内部に到達するレーザ光の光量が増加する。加えて、レーザ光が長い波長を有するので、熱硬化性樹脂剤でのレーザ光の散乱が抑制され、熱硬化性樹脂剤の内部にレーザ光が進行し易くなる。従って、熱硬化性樹脂剤の表面部だけでなく内部も十分に加熱されて、熱硬化性樹脂剤の全体が硬化する。更に、レーザ光は、熱硬化性樹脂剤の表面部から内部に収束するように、熱硬化性樹脂剤の表面部から内部に入射させられる。このことと、熱硬化性樹脂剤の表面部で吸収されるレーザ光の光量が減少することが相俟って、熱硬化性樹脂剤の表面部での損傷の発生が防止される。よって、この熱硬化性樹脂接合方法によれば、レーザ光の照射によって熱硬化性樹脂剤を良好に硬化させることができる。また、熱硬化性樹脂剤において、レーザ光の進行方向における上流側部分の硬化に起因して、当該方向における下流側部分へのレーザ光の進行が妨げられることを防止して、熱硬化性樹脂剤の全体を良好に硬化させることができる。 Moreover, the thermosetting resin joining method of this invention hardens a thermosetting resin agent by irradiation of a laser beam, joins a 1st member and a 2nd member, and manufactures a thermosetting resin joined body. This is a thermosetting resin bonding method, and the laser beam has a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent is maximized, and the thermosetting resin is cured from the surface portion of the thermosetting resin agent. The position of the condensing spot of the laser beam that is incident inside from the surface portion and irradiates the thermosetting resin agent is converged from the first position to the first position so as to converge inside the resin agent. It is possible to change to a second position close to the surface portion . Moreover, the thermosetting resin joining apparatus of this invention hardens a thermosetting resin agent by irradiation of a laser beam, joins a 1st member and a 2nd member, and manufactures a thermosetting resin joined body. A thermosetting resin bonding apparatus, which emits laser light having a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent is maximum, and thermosetting from the surface portion of the thermosetting resin agent The condensing optical system for making the laser beam enter the inside from the surface portion so as to converge inside the resin agent, and the position of the condensing spot of the laser beam irradiated to the thermosetting resin agent from the first position And a means for changing to a second position closer to the surface portion than the first position.
In this thermosetting resin bonding method and thermosetting resin bonding apparatus, the thermosetting resin agent is irradiated with laser light having a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent is maximum. Thereby, the light quantity of the laser beam absorbed in the surface part in which a laser beam injects in a thermosetting resin agent reduces, and the light quantity of the laser beam which reaches | attains the inside of a thermosetting resin agent increases. In addition, since the laser beam has a long wavelength, the scattering of the laser beam in the thermosetting resin agent is suppressed, and the laser beam easily proceeds inside the thermosetting resin agent. Therefore, not only the surface portion of the thermosetting resin agent but also the inside is sufficiently heated, and the entire thermosetting resin agent is cured. Furthermore, the laser light is incident on the inside from the surface portion of the thermosetting resin agent so as to converge from the surface portion of the thermosetting resin agent. In combination with this, the amount of laser light absorbed by the surface portion of the thermosetting resin agent is reduced, and the occurrence of damage on the surface portion of the thermosetting resin agent is prevented. Therefore, according to this thermosetting resin bonding method, the thermosetting resin agent can be cured well by irradiation with laser light. Further, in the thermosetting resin agent, it is possible to prevent the laser beam from proceeding to the downstream part in the direction caused by the hardening of the upstream part in the laser beam traveling direction. The entire agent can be cured well.

本発明によれば、レーザ光の照射によって熱硬化性樹脂剤を良好に硬化させることができる。   According to the present invention, the thermosetting resin agent can be cured satisfactorily by laser light irradiation.

本発明の一実施形態の熱硬化性樹脂接合方法によって製造された熱硬化性樹脂接合体の斜視図である。It is a perspective view of the thermosetting resin joined body manufactured by the thermosetting resin joining method of one Embodiment of this invention. 本発明の一実施形態の熱硬化性樹脂接合方法に用いられる集光光学系の構成図である。It is a block diagram of the condensing optical system used for the thermosetting resin joining method of one Embodiment of this invention. 図２の集光光学系を通過したレーザ光の集光スポット到達前の光強度プロファイルを示すグラフである。It is a graph which shows the light intensity profile before the condensing spot of the laser beam which passed the condensing optical system of FIG. レーザ光の波長と熱硬化性樹脂剤の光吸収率との関係を示すグラフである。It is a graph which shows the relationship between the wavelength of a laser beam, and the light absorption rate of a thermosetting resin agent. 本発明の一実施形態の熱硬化性樹脂接合方法を説明するための断面図である。It is sectional drawing for demonstrating the thermosetting resin joining method of one Embodiment of this invention. 本発明の一実施形態の熱硬化性樹脂接合方法を説明するための断面図である。It is sectional drawing for demonstrating the thermosetting resin joining method of one Embodiment of this invention. 熱硬化性樹脂剤の表面部からの深さとレーザ光の中心部のエネルギ密度との関係を示すグラフである。It is a graph which shows the relationship between the depth from the surface part of a thermosetting resin agent, and the energy density of the center part of a laser beam. 熱硬化性樹脂剤の温度及びレーザ光のレーザ出力の時間変化を示すグラフである。It is a graph which shows the time change of the temperature of a thermosetting resin agent, and the laser output of a laser beam. 本発明の他の実施形態の熱硬化性樹脂接合方法を説明するための断面図である。It is sectional drawing for demonstrating the thermosetting resin joining method of other embodiment of this invention.

以下、本発明の好適な実施形態について、図面を参照して詳細に説明する。なお、各図において同一又は相当部分には同一符号を付し、重複する説明を省略する。   DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or an equivalent part, and the overlapping description is abbreviate | omitted.

図１は、本発明の一実施形態の熱硬化性樹脂接合方法によって製造された熱硬化性樹脂接合体の斜視図である。図１に示されるように、熱硬化性樹脂接合体１０は、長方形板状の第１の部材１１及び第２の部材１２が熱硬化性樹脂剤１３によって接合されたものである。第１の部材１１と第２の部材１２とは、部材１１の表面１１ｆの一部と部材１２の裏面１２ｒの一部とが接触した状態で接合されている。熱硬化性樹脂剤１３は、第１の部材１１の表面１１ｆと第２の部材１２の端面１２ｅとで形成された隅部に盛られるように配置されている。   FIG. 1 is a perspective view of a thermosetting resin joined body manufactured by the thermosetting resin joining method of one embodiment of the present invention. As shown in FIG. 1, the thermosetting resin joined body 10 is obtained by joining a rectangular plate-shaped first member 11 and a second member 12 with a thermosetting resin agent 13. The 1st member 11 and the 2nd member 12 are joined in the state where a part of surface 11f of member 11 and a part of back 12r of member 12 contact. The thermosetting resin agent 13 is disposed so as to be stacked at the corner formed by the surface 11 f of the first member 11 and the end surface 12 e of the second member 12.

なお、各部材１１，１２の形状としては、長方形板状に限定されず、様々な形状を適用することができる。また、各部材１１，１２の材料としては、ガラス、金属、樹脂等、様々な材料を適用することができ、光吸収率が高い材料であっても、光吸収率が低い材料であってもよい。また、熱硬化性樹脂剤１３による部材１１，１２の接合は、仮接合であっても、本接合であってもよい。   In addition, as a shape of each member 11 and 12, it is not limited to a rectangular plate shape, Various shapes can be applied. Moreover, as materials for the members 11 and 12, various materials such as glass, metal, and resin can be applied. Even if the material has a high light absorption rate or a material with a low light absorption rate. Good. Further, the joining of the members 11 and 12 by the thermosetting resin agent 13 may be temporary joining or actual joining.

図２は、本発明の一実施形態の熱硬化性樹脂接合方法に用いられる集光光学系の構成図である。図２に示されるように、集光光学系１は、レーザ光Ｌの光源ＬＳ側から順に、コリメート用レンズ２、集光用レンズ３及び円錐凹状のアキシコンレンズ４が光軸ＯＡ上に配置されて構成されている。この集光光学系１をレーザ光Ｌが通過すると、光軸ＯＡに対して垂直なレーザ光Ｌの断面形状は、集光スポットＦＳに対して光源ＬＳ側で円環形状となり、集光スポットＦＳに対して光源ＬＳと反対側で中実円形状となる。   FIG. 2 is a configuration diagram of a condensing optical system used in the thermosetting resin bonding method according to an embodiment of the present invention. As shown in FIG. 2, the condensing optical system 1 includes a collimating lens 2, a condensing lens 3, and a conical concave axicon lens 4 arranged on the optical axis OA in order from the light source LS side of the laser light L. Has been configured. When the laser light L passes through the condensing optical system 1, the cross-sectional shape of the laser light L perpendicular to the optical axis OA becomes an annular shape on the light source LS side with respect to the condensing spot FS, and the condensing spot FS. On the other hand, a solid circular shape is formed on the side opposite to the light source LS.

図３は、図２の集光光学系を通過したレーザ光の集光スポット到達前の光強度プロファイルを示すグラフである。図３に示されるように、レーザ光Ｌの光強度プロファイルは、集光スポットＦＳ到達前において、ガウシアン分布やトップハット分布のレーザ光の光強度プロファイルとは逆に、中央部の光強度が周囲部の光強度よりも低いものとなっている。なお、図３の光強度プロファイルは、光軸ＯＡ及びレーザ光Ｌの進行方向と直交する方向にレーザ光Ｌの光強度を積分した場合である。   FIG. 3 is a graph showing a light intensity profile of the laser light that has passed through the condensing optical system of FIG. 2 before reaching the condensing spot. As shown in FIG. 3, the light intensity profile of the laser light L has a light intensity profile at the center portion that is opposite to the light intensity profile of the laser light with the Gaussian distribution or the top hat distribution before reaching the focused spot FS. It is lower than the light intensity of the part. 3 is a case where the light intensity of the laser light L is integrated in the direction orthogonal to the optical axis OA and the traveling direction of the laser light L.

ここで、レーザ光Ｌは、熱硬化性樹脂剤１３の光吸収率が最高となる波長よりも長い波長を有している。図４は、レーザ光の波長と熱硬化性樹脂剤の光吸収率との関係を示すグラフである。図４に示されるように、熱硬化性樹脂剤には、レーザ光の波長が長くなるに従って光吸収率が徐々に低くなるもの（例１）や、所定の波長において光吸収率のピーク値を有するもの（例２）がある。熱硬化性樹脂剤１３が例１や例２の熱硬化性樹脂剤である場合には、レーザ光Ｌとして、半導体レーザで発振可能な近赤外波長（例えば波長９４０ｎｍ）のレーザ光を用いればよい。なお、熱硬化性樹脂剤には、寸法精度や熱伝導率等といった所望の特性を発揮させるべく、金属粉、無機フィラー、樹脂添加物等が入れられるので、例１や例２のように光吸収特性に違いが生じる。   Here, the laser beam L has a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent 13 is maximized. FIG. 4 is a graph showing the relationship between the wavelength of the laser beam and the light absorption rate of the thermosetting resin agent. As shown in FIG. 4, the thermosetting resin agent has a light absorption rate that gradually decreases as the wavelength of the laser beam becomes longer (Example 1), or a peak value of the light absorption rate at a predetermined wavelength. Some have (Example 2). When the thermosetting resin agent 13 is the thermosetting resin agent of Example 1 or Example 2, a laser beam having a near infrared wavelength (for example, a wavelength of 940 nm) that can be oscillated by a semiconductor laser is used as the laser beam L. Good. The thermosetting resin agent contains metal powder, an inorganic filler, a resin additive, etc. in order to exhibit desired characteristics such as dimensional accuracy and thermal conductivity. Differences in absorption characteristics.

次に、集光光学系１を用いて熱硬化性樹脂接合体１０を製造する熱硬化性樹脂接合方法について説明する。まず、図５に示されるように、部材１１の表面１１ｆの一部と部材１２の裏面１２ｒの一部とが接触した状態で部材１１，１２を保持する。そして、部材１１の表面１１ｆと部材１２の端面１２ｅとで形成された隅部に、硬化前の熱硬化性樹脂剤１３を配置する。   Next, a thermosetting resin bonding method for manufacturing the thermosetting resin bonded body 10 using the condensing optical system 1 will be described. First, as shown in FIG. 5, the members 11 and 12 are held in a state where a part of the front surface 11 f of the member 11 and a part of the back surface 12 r of the member 12 are in contact with each other. And the thermosetting resin agent 13 before hardening is arrange | positioned in the corner formed by the surface 11f of the member 11, and the end surface 12e of the member 12. FIG.

続いて、図６に示されるように、外部に露出する熱硬化性樹脂剤１３の表面部１３ｓを光軸ＯＡが通るように集光光学系１を設定する。そして、熱硬化性樹脂剤１３の光吸収率が最高となる波長よりも長い波長を有するレーザ光Ｌを熱硬化性樹脂剤１３に照射する。このとき、レーザ光Ｌは、熱硬化性樹脂剤１３の表面部１３ｓから内部１３ｉに収束するように（すなわち、理論上の（熱硬化性樹脂剤１３による散乱や部材１１，１２の存在を考慮しない場合の）集光スポットＦＳの位置がレーザ光Ｌの入射方向において表面部１３ｉの下流側となるように）、熱硬化性樹脂剤１３の表面部１３ｓから内部１３ｉに入射させられる。これにより、熱硬化性樹脂剤１３自体が発熱し、その熱によって熱硬化性樹脂剤１３が硬化して、熱硬化性樹脂接合体１０が得られる。   Subsequently, as shown in FIG. 6, the condensing optical system 1 is set so that the optical axis OA passes through the surface portion 13s of the thermosetting resin agent 13 exposed to the outside. Then, the thermosetting resin agent 13 is irradiated with a laser beam L having a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent 13 is maximum. At this time, the laser beam L is converged from the surface portion 13s of the thermosetting resin agent 13 to the inside 13i (that is, the theoretical (considering scattering by the thermosetting resin agent 13 and the presence of the members 11 and 12). (If not) so that the position of the condensing spot FS is on the downstream side of the surface portion 13i in the incident direction of the laser beam L), the light is incident on the inside 13i from the surface portion 13s of the thermosetting resin agent 13. Thereby, the thermosetting resin agent 13 itself generates heat, and the thermosetting resin agent 13 is cured by the heat, and the thermosetting resin joined body 10 is obtained.

なお、レーザ光Ｌの集光スポットＦＳは、熱硬化性樹脂剤１３の外部に位置していてもよし、熱硬化性樹脂剤１３の内部１３ｉに位置していてもよい。また、レーザ光Ｌは、熱硬化性樹脂剤１３の表面部１３ｓだけでなく、各部材１１，１２の一部を含むように照射されてもよい。   The condensing spot FS of the laser light L may be located outside the thermosetting resin agent 13 or may be located inside the thermosetting resin agent 13. Further, the laser beam L may be irradiated so as to include not only the surface portion 13 s of the thermosetting resin agent 13 but also a part of each member 11, 12.

以上の熱硬化性樹脂接合方法によれば、次に説明するように、レーザ光Ｌの照射によって熱硬化性樹脂剤１３を良好に硬化させることができる。   According to the above thermosetting resin bonding method, the thermosetting resin agent 13 can be satisfactorily cured by irradiation with the laser light L as will be described below.

すなわち、熱硬化性樹脂剤１３には、熱硬化性樹脂剤１３の光吸収率が最高となる波長よりも長い波長を有するレーザ光Ｌが照射される。これにより、熱硬化性樹脂剤１３においてレーザ光Ｌが入射する表面部１３ｓで吸収されるレーザ光Ｌの光量が減少し、熱硬化性樹脂剤１３の内部１３ｉに到達するレーザ光Ｌの光量が増加する。加えて、レーザ光Ｌが長い波長を有するので、熱硬化性樹脂剤１３でのレーザ光Ｌの散乱が抑制され、熱硬化性樹脂剤１３の内部１３ｉにレーザ光Ｌが進行し易くなる。従って、熱硬化性樹脂剤１３の表面部１３ｓだけでなく内部１３ｉも十分に加熱されて、熱硬化性樹脂剤１３の全体が硬化する。   In other words, the thermosetting resin agent 13 is irradiated with laser light L having a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent 13 is maximum. As a result, the light amount of the laser light L absorbed by the surface portion 13s on which the laser light L is incident in the thermosetting resin agent 13 is reduced, and the light amount of the laser light L reaching the inside 13i of the thermosetting resin agent 13 is reduced. To increase. In addition, since the laser beam L has a long wavelength, the scattering of the laser beam L in the thermosetting resin agent 13 is suppressed, and the laser beam L easily proceeds to the inside 13 i of the thermosetting resin agent 13. Accordingly, not only the surface portion 13s of the thermosetting resin agent 13 but also the inside 13i is sufficiently heated, and the entire thermosetting resin agent 13 is cured.

更に、レーザ光Ｌは、熱硬化性樹脂剤１３の表面部１３ｓから内部１３ｉに収束するように、熱硬化性樹脂剤１３の表面部１３ｓから内部１３ｉに入射させられる。このことと、熱硬化性樹脂剤１３の表面部１３ｓで吸収されるレーザ光Ｌの光量が減少することが相俟って、熱硬化性樹脂剤１３の表面部１３ｓでの損傷の発生が防止される。   Further, the laser beam L is incident on the inside 13i from the surface portion 13s of the thermosetting resin agent 13 so as to converge from the surface portion 13s of the thermosetting resin agent 13 to the inside 13i. In combination with this, the amount of laser light L absorbed by the surface portion 13s of the thermosetting resin agent 13 is reduced, thereby preventing the occurrence of damage on the surface portion 13s of the thermosetting resin agent 13. Is done.

このような熱硬化性樹脂接合方法は、特に、外部への熱硬化性樹脂剤１３の露出面積が大きい一方で、接合すべき部材１１，１２に対する熱硬化性樹脂剤１３の接触面積が小さい上記実施形態のような場合に、特に有効である。   In such a thermosetting resin joining method, in particular, the exposed area of the thermosetting resin agent 13 to the outside is large, while the contact area of the thermosetting resin agent 13 to the members 11 and 12 to be joined is small. This is particularly effective in the case of the embodiment.

また、レーザ光Ｌは、熱硬化性樹脂剤１３に入射する表面部１３ｓにおいて、光軸ＯＡに対して垂直な断面形状が円環形状等の環形状となるように、熱硬化性樹脂剤１３に照射される。これにより、熱硬化性樹脂剤１３におけるレーザ光Ｌの照射領域の中心部に、入熱過多による損傷が生じるのを防止することができる。しかも、レーザ光Ｌが熱硬化性樹脂剤１３の表面部１３ｓから内部１３ｉに収束しているため、光吸収によって減衰する光密度が補われて、熱硬化性樹脂剤１３の表面部１３ｓから内部１３ｉに至る熱硬化性樹脂剤１３の全体を確実に硬化させることができる。   Further, the laser light L is irradiated on the thermosetting resin agent 13 so that the cross-sectional shape perpendicular to the optical axis OA becomes a ring shape such as an annular shape on the surface portion 13 s incident on the thermosetting resin agent 13. Is irradiated. Thereby, it is possible to prevent damage due to excessive heat input from occurring in the central portion of the irradiation region of the laser light L in the thermosetting resin agent 13. In addition, since the laser beam L is converged from the surface portion 13s of the thermosetting resin agent 13 to the inside 13i, the light density attenuated by light absorption is compensated, and the inside of the surface portion 13s of the thermosetting resin agent 13 is compensated. The entire thermosetting resin agent 13 reaching 13i can be reliably cured.

図７は、熱硬化性樹脂剤の表面部からの深さとレーザ光の中心部のエネルギ密度との関係を示すグラフである。図７では、光軸ＯＡに対して垂直な断面形状が熱硬化性樹脂剤１３の表面部１３ｓにおいて円環形状となり、かつ熱硬化性樹脂剤１３の表面部１３ｓから内部１３ｉに収束するように、レーザ光Ｌが熱硬化性樹脂剤１３の表面部１３ｓから内部１３ｉに入射させられている。図７に示されるように、熱硬化性樹脂剤１３の表面部１３ｓからの深さが５ｍｍの位置では、レーザ光Ｌの中心部のエネルギ密度が、開口数（ＮＡ）０．１で１０倍を超え、開口数５で１００倍を超えている。このことから、熱硬化性樹脂剤１３の表面部１３ｓ（特に、レーザ光Ｌの照射領域の中心部）に入熱過多による損傷が生じるのを防止し得ること、及び光吸収によって減衰する光密度が補われて熱硬化性樹脂剤１３の全体を確実に硬化させ得ることが分かる。   FIG. 7 is a graph showing the relationship between the depth from the surface portion of the thermosetting resin agent and the energy density of the center portion of the laser beam. In FIG. 7, the cross-sectional shape perpendicular to the optical axis OA has an annular shape at the surface portion 13 s of the thermosetting resin agent 13 and converges from the surface portion 13 s of the thermosetting resin agent 13 to the inside 13 i. The laser beam L is incident on the inside 13 i from the surface portion 13 s of the thermosetting resin agent 13. As shown in FIG. 7, at a position where the depth from the surface portion 13s of the thermosetting resin agent 13 is 5 mm, the energy density of the central portion of the laser light L is 10 times as large as the numerical aperture (NA) 0.1. And a numerical aperture of 5 is over 100 times. From this, it is possible to prevent the surface portion 13s of the thermosetting resin agent 13 (particularly the central portion of the irradiation region of the laser light L) from being damaged due to excessive heat input, and the light density attenuated by light absorption. It can be seen that the entire thermosetting resin agent 13 can be cured reliably.

以上、本発明の一実施形態について説明したが、本発明は、上記実施形態に限定されるものではない。   Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment.

例えば、図８に示されるように、熱硬化性樹脂剤１３に照射されるレーザ光Ｌの強度を、第１の光強度Ｉ１から、第１の光強度Ｉ１よりも低い第２の光強度Ｉ２に変化させてもよい。これによれば、熱硬化性樹脂剤１３の温度を硬化開始温度Ｔ１以上に素早く上昇させた後、熱硬化性樹脂剤１３の温度を硬化開始温度Ｔ１以上かつ損傷発生温度Ｔ２以下に保持して、熱硬化性樹脂剤１３の全体を良好に硬化させることができる。なお、レーザ光Ｌの強度は、熱硬化性樹脂剤１３の温度が硬化開始温度Ｔ１に達したときにレーザ出力を切り替えることにより、第１の光強度Ｉ１から第２の光強度Ｉ２に変化させることができる。   For example, as shown in FIG. 8, the intensity of the laser light L irradiated to the thermosetting resin agent 13 is changed from the first light intensity I1 to the second light intensity I2 lower than the first light intensity I1. It may be changed to. According to this, after the temperature of the thermosetting resin agent 13 is quickly raised to the curing start temperature T1 or higher, the temperature of the thermosetting resin agent 13 is maintained at the curing start temperature T1 or higher and the damage occurrence temperature T2 or lower. The entire thermosetting resin agent 13 can be cured satisfactorily. The intensity of the laser light L is changed from the first light intensity I1 to the second light intensity I2 by switching the laser output when the temperature of the thermosetting resin agent 13 reaches the curing start temperature T1. be able to.

また、図９に示されるように、熱硬化性樹脂剤１３に照射されるレーザ光Ｌの集光スポットＦＳの位置を、第１の位置Ｐ１から、第１の位置Ｐ１よりも熱硬化性樹脂剤１３の表面部１３ｓに近い第２の位置Ｐ２に変化させてもよい。これによれば、熱硬化性樹脂剤１３において、レーザ光Ｌの進行方向における上流側部分の硬化に起因して（例えば、網目状架橋反応が進むこと等が光散乱要因となって）、当該方向における下流側部分へのレーザ光Ｌの進行が妨げられることを防止して、熱硬化性樹脂剤１３の全体を良好に硬化させることができる。   Further, as shown in FIG. 9, the position of the condensing spot FS of the laser light L irradiated to the thermosetting resin agent 13 is changed from the first position P1 to the thermosetting resin more than the first position P1. You may change to the 2nd position P2 near the surface part 13s of the agent 13. FIG. According to this, in the thermosetting resin agent 13, due to the curing of the upstream portion in the traveling direction of the laser light L (for example, the progress of the network cross-linking reaction is a light scattering factor), the It is possible to prevent the laser light L from proceeding to the downstream portion in the direction, and to cure the entire thermosetting resin agent 13 satisfactorily.

１０…熱硬化性樹脂接合体、１１…第１の部材、１２…第２の部材、１３…熱硬化性樹脂剤、１３ｓ…表面部、１３ｉ…内部、ＯＡ…光軸、Ｌ…レーザ光、ＦＳ…集光スポット。   DESCRIPTION OF SYMBOLS 10 ... Thermosetting resin joined body, 11 ... 1st member, 12 ... 2nd member, 13 ... Thermosetting resin agent, 13s ... Surface part, 13i ... Inside, OA ... Optical axis, L ... Laser beam, FS ... Focus spot.

Claims (5)

レーザ光の照射によって熱硬化性樹脂剤を硬化させ、第１の部材と第２の部材とを接合して熱硬化性樹脂接合体を製造する熱硬化性樹脂接合方法であって、
前記レーザ光は、前記熱硬化性樹脂剤の光吸収率が最高となる波長よりも長い波長を有しており、前記熱硬化性樹脂剤の表面部から前記熱硬化性樹脂剤の内部に収束するように、前記表面部から前記内部に入射させられ、
前記熱硬化性樹脂剤に照射される前記レーザ光の強度は、第１の光強度から、前記第１の光強度よりも低い第２の光強度に変化させられることを特徴とする熱硬化性樹脂接合方法。 A thermosetting resin joining method for producing a thermosetting resin joined body by curing a thermosetting resin agent by irradiation of laser light, joining a first member and a second member,
The laser beam has a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent is maximized, and converges from the surface portion of the thermosetting resin agent to the inside of the thermosetting resin agent. So as to be incident on the inside from the surface portion ,
The intensity of the laser light radiated on the thermosetting resin agent, thermosetting of the first light intensity, wherein Rukoto be varied to a second light intensity lower than the first light intensity Resin bonding method. レーザ光の照射によって熱硬化性樹脂剤を硬化させ、第１の部材と第２の部材とを接合して熱硬化性樹脂接合体を製造する熱硬化性樹脂接合方法であって、A thermosetting resin joining method for producing a thermosetting resin joined body by curing a thermosetting resin agent by irradiation of laser light, joining a first member and a second member,
前記レーザ光は、前記熱硬化性樹脂剤の光吸収率が最高となる波長よりも長い波長を有しており、前記熱硬化性樹脂剤の表面部から前記熱硬化性樹脂剤の内部に収束するように、前記表面部から前記内部に入射させられ、The laser beam has a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent is maximized, and converges from the surface portion of the thermosetting resin agent to the inside of the thermosetting resin agent. So as to be incident on the inside from the surface portion,
前記熱硬化性樹脂剤に照射される前記レーザ光の集光スポットの位置は、第１の位置から、前記第１の位置よりも前記表面部に近い第２の位置に変化させられることを特徴とする熱硬化性樹脂接合方法。The position of the focused spot of the laser beam irradiated to the thermosetting resin agent is changed from the first position to a second position closer to the surface portion than the first position. A thermosetting resin bonding method. 前記レーザ光は、前記表面部において、光軸に対して垂直な断面形状が環形状となるように、前記熱硬化性樹脂剤に照射されることを特徴とする請求項１又は２記載の熱硬化性樹脂接合方法。 3. The heat according to claim 1, wherein the laser beam is applied to the thermosetting resin agent so that a cross-sectional shape perpendicular to the optical axis is a ring shape on the surface portion. 4. Curable resin bonding method. レーザ光の照射によって熱硬化性樹脂剤を硬化させ、第１の部材と第２の部材とを接合して熱硬化性樹脂接合体を製造する熱硬化性樹脂接合装置であって、A thermosetting resin bonding apparatus for manufacturing a thermosetting resin joined body by curing a thermosetting resin agent by irradiation with laser light and joining a first member and a second member,
前記熱硬化性樹脂剤の光吸収率が最高となる波長よりも長い波長を有する前記レーザ光を出射する光源と、A light source that emits the laser light having a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent is maximum;
前記熱硬化性樹脂剤の表面部から前記熱硬化性樹脂剤の内部に収束するように、前記レーザ光を前記表面部から前記内部に入射させる集光光学系と、A condensing optical system that causes the laser light to enter the inside from the surface portion so as to converge from the surface portion of the thermosetting resin agent to the inside of the thermosetting resin agent;
前記熱硬化性樹脂剤に照射される前記レーザ光の強度を、第１の光強度から、前記第１の光強度よりも低い第２の光強度に変化させる手段と、を備える、熱硬化性樹脂接合装置。Means for changing the intensity of the laser light applied to the thermosetting resin agent from a first light intensity to a second light intensity lower than the first light intensity. Resin bonding equipment. レーザ光の照射によって熱硬化性樹脂剤を硬化させ、第１の部材と第２の部材とを接合して熱硬化性樹脂接合体を製造する熱硬化性樹脂接合装置であって、A thermosetting resin bonding apparatus for manufacturing a thermosetting resin joined body by curing a thermosetting resin agent by irradiation with laser light and joining a first member and a second member,
前記熱硬化性樹脂剤の光吸収率が最高となる波長よりも長い波長を有する前記レーザ光を出射する光源と、A light source that emits the laser light having a wavelength longer than the wavelength at which the light absorption rate of the thermosetting resin agent is maximum;
前記熱硬化性樹脂剤の表面部から前記熱硬化性樹脂剤の内部に収束するように、前記レーザ光を前記表面部から前記内部に入射させる集光光学系と、A condensing optical system that causes the laser light to enter the inside from the surface portion so as to converge from the surface portion of the thermosetting resin agent to the inside of the thermosetting resin agent;
前記熱硬化性樹脂剤に照射される前記レーザ光の集光スポットの位置を、第１の位置から、前記第１の位置よりも前記表面部に近い第２の位置に変化させる手段と、を備える、熱硬化性樹脂接合装置。Means for changing the position of the focused spot of the laser beam irradiated on the thermosetting resin agent from the first position to a second position closer to the surface portion than the first position; A thermosetting resin bonding apparatus.
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