JP4591399B2 - 部品接合方法ならびに部品接合構造 - Google Patents
部品接合方法ならびに部品接合構造 Download PDFInfo
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- JP4591399B2 JP4591399B2 JP2006101778A JP2006101778A JP4591399B2 JP 4591399 B2 JP4591399 B2 JP 4591399B2 JP 2006101778 A JP2006101778 A JP 2006101778A JP 2006101778 A JP2006101778 A JP 2006101778A JP 4591399 B2 JP4591399 B2 JP 4591399B2
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- component
- terminal
- solder
- oxide film
- thermosetting resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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Description
基板1において第1の端子2が形成された接続面側には、図1(b)に示すように、半田ペースト3をディスペンサ4によって第1の端子2を覆って塗布する。
2a、8a、5aが部分的に活性剤6の作用によって除去された酸化膜除去部2b、8b、5bが、活性剤6の配合比率に応じた割合で形成される。
形成が有効に防止される。このことは、熱硬化性樹脂3a中に導電性粒子としての半田粒子5を含有させた異方性導電剤において、通常の配合よりも導電性粒子の配合比率を多くしても絶縁性が損なわれないことを意味している。したがって、導通性を向上させることを目的として導電性粒子の密度を高めると絶縁性が損なわれるという二律背反の関係にある課題を解決することが可能となっている。
ている。そして得られた部品接合構造のそれぞれについて、「短絡」、「導通」、「粒子融着」の3つの項目について評価を行った。
(5%、15%、30%、45%、60%、75%、90%)に変化させて、(表1)の例と同様に部品接合を実行している。そして得られた部品接合構造のそれぞれについて、(表1)と同様の方法・基準に従って、「短絡」、「導通」、「粒子融着」の3つの項目について評価を行っている。
2 第1の端子
2a 酸化膜
3 半田ペースト
3a 熱硬化性樹脂
5 半田粒子
6 活性剤
7 フレキシブル基板(第2の部品)
8 第2の端子
8a 酸化膜
Claims (7)
- 第1の部品および第2の部品にそれぞれ設けられ、少なくともどちらか一方の表面が自然酸化膜で覆われた第1の端子および第2の端子を相互に電気的に接続するとともに、前記第1の部品と第2の部品とを相互に接着する部品接合方法であって、
錫(Sn)を主成分とする半田を粒状にした半田粒子を熱硬化性樹脂に30〜75wt%の比率で含有させた半田ペーストを前記第1の部品と前記第2の部品との間に介在させる工程と、
前記第1の部品およびまたは第2の部品を加熱しながら前記第1の端子と第2の端子とを相互に押圧することにより、前記第1の端子と第2の端子とを前記半田粒子によって電気的に接続するとともに前記熱硬化性樹脂を硬化させて前記第1の部品と第2の部品とを相互に接着する工程とを含み、
前記半田ペーストは、前記熱硬化性樹脂を硬化させる硬化剤としての酸無水物を含み、さらに前記自然酸化膜および前記半田粒子の酸化膜を除去する活性剤を、前記半田粒子を除いた残部に対して1wt%以下の比率で含み、
前記活性剤によって前記自然酸化膜が部分的に除去された酸化膜除去部が存在する範囲で溶融した半田を濡れ拡がらせて前記第1の端子と前記第2の端子を相互に電気的に接続し、
前記半田部の形成に寄与しなかった半田粒子の表面は、前記活性剤によって除去されずに残った酸化膜によって覆われており、
前記活性剤によって除去されずに残った自然酸化膜および半田粒子の酸化膜を残したまま前記熱硬化性樹脂を硬化させることを特徴とする部品接合方法。 - 第1の部品および第2の部品にそれぞれ設けられ、少なくともどちらか一方の表面が自然酸化膜で覆われた第1の端子および第2の端子を相互に電気的に接続するとともに、前記第1の部品と第2の部品とを相互に接着する部品接合方法であって、
錫(Sn)を主成分とする半田を粒状にした半田粒子を熱硬化性樹脂に30〜75wt%の比率で含有させた半田ペーストを前記第1の部品と前記第2の部品との間に介在させる工程と、
前記第1の部品およびまたは第2の部品を加熱しながら前記第1の端子と第2の端子とを相互に押圧することにより、前記第1の端子と第2の端子とを前記半田粒子によって電気的に接続するとともに前記熱硬化性樹脂を硬化させて前記第1の部品と第2の部品とを相互に接着する工程とを含み、
前記半田ペーストは、前記熱硬化性樹脂を硬化させる潜在性硬化剤を含み、さらに、前記自然酸化膜および前記半田粒子の酸化膜を除去する活性剤を、前記半田粒子を除いた残部に対して1〜5wt%の比率で含み、
前記活性剤によって前記自然酸化膜が部分的に除去された酸化膜除去部が存在する範囲で溶融した半田を濡れ拡がらせて前記第1の端子と前記第2の端子を相互に電気的に接続し、
前記半田部の形成に寄与しなかった半田粒子の表面は、前記活性剤によって除去されずに残った酸化膜によって覆われており、
前記活性剤によって除去されずに残った自然酸化膜および半田粒子の酸化膜を残したまま前記熱硬化性樹脂を硬化させることを特徴とする部品接合方法。 - 前記第1の端子および第2の端子は、銅(Cu)または銅系の合金より成ることを特徴とする請求項1または2記載の部品接合方法。
- 前記熱硬化性樹脂は、前記半田の融点温度よりも高い温度で熱硬化することを特徴とする請求項1または2記載の部品接合方法。
- 前記加熱において、前記熱硬化性樹脂の硬化温度よりも高い温度で加熱することを特徴とする請求項1乃至4のいずれかに記載の部品接合方法。
- 錫(Sn)を主成分とする半田を粒状にした半田粒子を熱硬化性樹脂に30〜75wt%の比率で含有させた半田ペーストを前記第1の部品と前記第2の部品との間に介在させ、前記第1の部品およびまたは第2の部品を加熱するとともに、第1の部品および第2の部品にそれぞれ設けられ少なくとも一方の表面が自然酸化膜で覆われた第1の端子および第2の端子を相互に押圧して形成された部品接合構造であって、
前記半田粒子が溶融して前記第1の端子および第2の端子のいずれにも半田接合されることにより形成され、前記第1の端子および第2の端子を相互に電気的に接続する半田部と、
前記熱硬化性樹脂が硬化することにより形成され、前記第1の部品および第2の部品とを相互に接着し、前記半田部の形成に寄与しない前記半田粒子を相互に融着していない状態で内包する樹脂部とを備え、
前記半田部の形成に寄与しなかった半田粒子の表面は、活性剤によって除去されずに残った酸化膜によって覆われており、
前記自然酸化膜が部分的に除去された酸化膜除去部が存在する範囲で溶融した半田を濡れ拡がらせて前記第1の端子と前記第2の端子を相互に電気的に接続することを特徴とする部品接合構造。 - 前記第1の端子および第2の端子は、銅(Cu)または銅系の合金より成ることを特徴とする請求項6記載の部品接合構造。
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US12/279,026 US8018074B2 (en) | 2006-04-03 | 2007-04-03 | Components joining method and components joining structure |
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PCT/JP2007/057801 WO2007116990A1 (en) | 2006-04-03 | 2007-04-03 | Components joining method and components joining structure |
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KR101880053B1 (ko) * | 2017-04-26 | 2018-07-20 | (주)노피온 | 갭퍼를 포함하는 이방성 도전 접착제의 제조방법 및 갭퍼를 이용하는 부품 실장방법 |
US10636761B2 (en) | 2017-08-29 | 2020-04-28 | Electronics And Telecommunications Reearch Institute | Method of fabricating a semiconductor package |
JP6766087B2 (ja) * | 2018-03-23 | 2020-10-07 | 株式会社タムラ製作所 | 熱硬化性フラックス組成物および電子基板の製造方法 |
US11488841B2 (en) * | 2019-02-20 | 2022-11-01 | Electronics And Telecommunications Research Institute | Method for manufacturing semiconductor package |
CN113145960B (zh) * | 2021-05-06 | 2022-11-11 | 昆山联滔电子有限公司 | 一种电子产品焊接方法 |
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JPH04262890A (ja) * | 1990-09-27 | 1992-09-18 | Motorola Inc | フラックス剤および金属粒子を有する接着剤 |
JP2005059028A (ja) * | 2003-08-08 | 2005-03-10 | Toshiba Corp | 熱硬化性フラックス及びはんだペースト |
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EP2002698A1 (en) | 2008-12-17 |
US8018074B2 (en) | 2011-09-13 |
US20110284265A1 (en) | 2011-11-24 |
JP2007280999A (ja) | 2007-10-25 |
WO2007116990A1 (en) | 2007-10-18 |
CN101416568A (zh) | 2009-04-22 |
US8188605B2 (en) | 2012-05-29 |
US20090047534A1 (en) | 2009-02-19 |
TW200803666A (en) | 2008-01-01 |
KR20090004850A (ko) | 2009-01-12 |
CN101416568B (zh) | 2011-04-13 |
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