JP4576503B2 - 平面研削方法 - Google Patents
平面研削方法 Download PDFInfo
- Publication number
- JP4576503B2 JP4576503B2 JP2004223042A JP2004223042A JP4576503B2 JP 4576503 B2 JP4576503 B2 JP 4576503B2 JP 2004223042 A JP2004223042 A JP 2004223042A JP 2004223042 A JP2004223042 A JP 2004223042A JP 4576503 B2 JP4576503 B2 JP 4576503B2
- Authority
- JP
- Japan
- Prior art keywords
- grindstone
- shaft
- grinding
- grinding wheel
- current value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
2:研削砥石
4:砥石軸
5:砥石軸駆動モータ
10:電歪素子又は磁歪素子
e:予め定めた基準値
f:砥石軸の回転方向
i:砥石軸負荷電流値
Claims (1)
- シリコンウエーハを含む硬脆材料の被加工物の平面研削方法において、砥石を電歪素子又は磁歪素子を介して砥石軸に連結し、研削加工中の砥石軸負荷電流値をモニタリングし、前記砥石軸負荷電流値が予め定めた基準値以上に達したとき、前記砥石軸に連結した電歪素子又は磁歪素子を瞬時に起動させ、10〜20μmだけ砥石軸の反切込方向に砥石軸を上昇させて前記砥石を退避させ、その後、さらに前記砥石軸に連結した電歪素子又は磁歪素子を起動させ、砥石軸に高周波振動を加えながら前記砥石を前記硬脆材料の被加工物に接触させ、砥石の自生を促した後、研削加工することを特徴とする平面研削方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004223042A JP4576503B2 (ja) | 2004-07-30 | 2004-07-30 | 平面研削方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004223042A JP4576503B2 (ja) | 2004-07-30 | 2004-07-30 | 平面研削方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006035406A JP2006035406A (ja) | 2006-02-09 |
JP4576503B2 true JP4576503B2 (ja) | 2010-11-10 |
Family
ID=35900929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004223042A Expired - Fee Related JP4576503B2 (ja) | 2004-07-30 | 2004-07-30 | 平面研削方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4576503B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5219569B2 (ja) * | 2008-03-21 | 2013-06-26 | 株式会社東京精密 | ウェーハ研削装置における加工良否判定方法およびウェーハ研削装置 |
JP5350127B2 (ja) * | 2009-08-13 | 2013-11-27 | 株式会社ディスコ | 被加工物の研削方法 |
JP2011143516A (ja) * | 2010-01-15 | 2011-07-28 | Disco Abrasive Syst Ltd | 加工装置 |
JP6510374B2 (ja) * | 2015-09-16 | 2019-05-08 | 光洋機械工業株式会社 | ワークの平面研削方法及び平面研削盤 |
CN115415857B (zh) * | 2022-09-14 | 2023-10-20 | 大连理工大学 | 一种光电化学机械抛光装置及材料高效去除调整方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02232163A (ja) * | 1989-03-03 | 1990-09-14 | Rikagaku Kenkyusho | 電解ドレス振動研削加工方法及び装置 |
JPH0929630A (ja) * | 1995-07-19 | 1997-02-04 | Tokyo Seimitsu Co Ltd | 表面研削方法 |
JPH1110498A (ja) * | 1997-06-18 | 1999-01-19 | Sumitomo Heavy Ind Ltd | 固体アクチュエータを用いた面振れ修正機構を持つ加工装置 |
JP2001079761A (ja) * | 1999-09-07 | 2001-03-27 | Sumitomo Metal Ind Ltd | 段付き管の外面研磨方法 |
JP2001113405A (ja) * | 1999-10-18 | 2001-04-24 | Miyanaga:Kk | ダイヤモンドドリル用シャンクユニット |
-
2004
- 2004-07-30 JP JP2004223042A patent/JP4576503B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02232163A (ja) * | 1989-03-03 | 1990-09-14 | Rikagaku Kenkyusho | 電解ドレス振動研削加工方法及び装置 |
JPH0929630A (ja) * | 1995-07-19 | 1997-02-04 | Tokyo Seimitsu Co Ltd | 表面研削方法 |
JPH1110498A (ja) * | 1997-06-18 | 1999-01-19 | Sumitomo Heavy Ind Ltd | 固体アクチュエータを用いた面振れ修正機構を持つ加工装置 |
JP2001079761A (ja) * | 1999-09-07 | 2001-03-27 | Sumitomo Metal Ind Ltd | 段付き管の外面研磨方法 |
JP2001113405A (ja) * | 1999-10-18 | 2001-04-24 | Miyanaga:Kk | ダイヤモンドドリル用シャンクユニット |
Also Published As
Publication number | Publication date |
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JP2006035406A (ja) | 2006-02-09 |
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