JP4526316B2 - 被加工物搬送装置 - Google Patents
被加工物搬送装置 Download PDFInfo
- Publication number
- JP4526316B2 JP4526316B2 JP2004210066A JP2004210066A JP4526316B2 JP 4526316 B2 JP4526316 B2 JP 4526316B2 JP 2004210066 A JP2004210066 A JP 2004210066A JP 2004210066 A JP2004210066 A JP 2004210066A JP 4526316 B2 JP4526316 B2 JP 4526316B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- wafer
- pin
- support member
- coin stack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012546 transfer Methods 0.000 title claims description 31
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 94
- 238000006073 displacement reaction Methods 0.000 description 9
- 239000000969 carrier Substances 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- XXUZFRDUEGQHOV-UHFFFAOYSA-J strontium ranelate Chemical compound [Sr+2].[Sr+2].[O-]C(=O)CN(CC([O-])=O)C=1SC(C([O-])=O)=C(CC([O-])=O)C=1C#N XXUZFRDUEGQHOV-UHFFFAOYSA-J 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
21 作動アーム
22 上下可動手段
23 旋回手段
24 第1アーム
25 第2アーム
26 水平部
30 保持手段
31 本体部
32 吸着パッド
40 退避手段
41 ピン
42 ピン支持部材
43 軸支部材
44 ローラ
Claims (1)
- 被加工物を保持する保持手段を備えた被加工物搬送装置であって;
前記保持手段は,
本体部と;
前記本体部に装着され,前記被加工物を非接触状態で吸着して保持する複数の吸着パッドと;
前記本体部の外周部に設けられ,前記吸着された被加工物の外周部と当接して,前記吸着された被加工物の水平方向への移動を制限する複数のピンと;
前記各ピンに対応してそれぞれ設けられ、前記被加工物を着脱するときに,前記ピンを,前記被加工物の水平方向への移動を制限する位置から退避させる複数の退避手段と;
を備え,
前記退避手段は,
前記本体部に回動可能に設けられ,前記ピンを支持するピン支持部材と;
前記ピン支持部材に配設され,前記被加工物を収容する収容器の外周に接触することによって,前記各ピンを,前記被加工物の水平方向への移動を制限する位置から退避させるように,前記ピン支持部材を回動させる接触部材と;
を有し,
前記収容器は,コインスタックキャリアであることを特徴とする被加工物搬送装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004210066A JP4526316B2 (ja) | 2004-07-16 | 2004-07-16 | 被加工物搬送装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004210066A JP4526316B2 (ja) | 2004-07-16 | 2004-07-16 | 被加工物搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006032687A JP2006032687A (ja) | 2006-02-02 |
JP4526316B2 true JP4526316B2 (ja) | 2010-08-18 |
Family
ID=35898658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004210066A Expired - Lifetime JP4526316B2 (ja) | 2004-07-16 | 2004-07-16 | 被加工物搬送装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4526316B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010114108A (ja) * | 2008-11-04 | 2010-05-20 | Ngk Spark Plug Co Ltd | 配線基板の非接触搬送装置及び方法 |
JP2010263010A (ja) * | 2009-04-30 | 2010-11-18 | Fujitsu Ltd | 搬送装置および搬送方法 |
JP5488037B2 (ja) * | 2010-02-23 | 2014-05-14 | 村田機械株式会社 | 移載装置及びワーク載置装置 |
CN114655702B (zh) * | 2022-04-19 | 2023-11-28 | 烽禾升医疗设备(昆山)有限公司 | 一种弹片取料装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11265926A (ja) * | 1997-12-16 | 1999-09-28 | Sez Semiconductor Equip Zubehoer Fuer Die Halbleiterfertigung Ag | 薄い円板状物体の移送装置 |
JP2002064130A (ja) * | 2000-06-09 | 2002-02-28 | Harmotec Corp | 非接触搬送装置 |
JP2004193195A (ja) * | 2002-12-09 | 2004-07-08 | Shinko Electric Ind Co Ltd | 搬送装置 |
-
2004
- 2004-07-16 JP JP2004210066A patent/JP4526316B2/ja not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11265926A (ja) * | 1997-12-16 | 1999-09-28 | Sez Semiconductor Equip Zubehoer Fuer Die Halbleiterfertigung Ag | 薄い円板状物体の移送装置 |
JP2002064130A (ja) * | 2000-06-09 | 2002-02-28 | Harmotec Corp | 非接触搬送装置 |
JP2004193195A (ja) * | 2002-12-09 | 2004-07-08 | Shinko Electric Ind Co Ltd | 搬送装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2006032687A (ja) | 2006-02-02 |
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