JP4518024B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
- Publication number
- JP4518024B2 JP4518024B2 JP2005517695A JP2005517695A JP4518024B2 JP 4518024 B2 JP4518024 B2 JP 4518024B2 JP 2005517695 A JP2005517695 A JP 2005517695A JP 2005517695 A JP2005517695 A JP 2005517695A JP 4518024 B2 JP4518024 B2 JP 4518024B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit layer
- circuit
- base substrate
- layer
- antenna
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
Description
前記第一又は第二の回路層の少なくとも一方は、アルミニウムもしくは銅による導電層を含むことが好ましい。
以下、図3を用いて、第1の実施の形態を説明する。
以下、図4を用いて、第2の実施の形態を説明する。
以下、図5を用いて、第3の実施の形態を説明する。
以下、図6を用いて、第4の実施の形態を説明する。
Claims (6)
- IC素子と、アンテナ又は短絡板の何れかとして動作する第一及び第二の回路層とを含む電子装置において、
前記IC素子は、珪素からなるベース基板と、前記ベース基板の一方の面に半導体回路が形成された半導体回路層と、前記半導体回路層上に形成された電極とを有し、前記ベース基板の他方の面には電極を有しておらず、
前記第一の回路層が前記ベース基板の他方の面又は前記電極のいずれか一方と、前記第二の回路層が前記ベース基板の他方の面又は前記電極の残る一方と、それぞれ電気的に接続され、
前記ベース基板の他方の面及び前記電極は何れも、加熱圧着することによって前記第一及び第二の回路層の空隙を封止する異方導電性接着剤を介して、前記第一又は第二の回路層と電気的に接続されることを特徴とする電子装置。 - 前記異方導電性接着剤は、マトリクス樹脂と、金属粒子もしくは表面に金属層が形成された有機樹脂粒子からなる導電性粒子とを含有することを特徴とする請求の範囲第1項記載の電子装置。
- 前記IC素子は、前記異方導電接着剤のマトリクス樹脂によって封止されていることを特徴とする請求の範囲第1項又は第2項記載の電子装置。
- 前記第一又は第二の回路層の少なくとも一方は、アルミニウムもしくは銅による導電層を含むことを特徴とする請求の範囲第1項乃至第3項のいずれかに記載の電子装置。
- 前記第一又は第二の回路層の少なくとも一方は、有機樹脂からなるベース基材に支持されており、前記有機樹脂は、塩化ビニル樹脂(PVC)、アクリロニトリルブタジエンスチレン(ABS)、ポリエチレンテレフタレート(PET)、グリコール変性ポリエチレンテレフタレート(PETG)、ポリエチレンナフタレート(PEN)、ポリカーボネート樹脂(PC)、2軸延伸ポリエステル(O−PET)、ポリイミド樹脂から選択されることを特徴とする請求の範囲第1項乃至第4項のいずれかに記載の電子装置。
- 前記第一又は第二の回路層の少なくとも一方は、紙からなるベース基材に支持されていることを特徴とする請求の範囲第1項乃至第4項のいずれかに記載の電子装置。
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JP2004030535 | 2004-02-06 | ||
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PCT/JP2005/001486 WO2005076202A1 (ja) | 2004-02-06 | 2005-02-02 | 電子装置 |
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EP (1) | EP1715445A4 (ja) |
JP (1) | JP4518024B2 (ja) |
KR (1) | KR100879416B1 (ja) |
CN (1) | CN1918583B (ja) |
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FI7351U1 (fi) * | 2006-09-19 | 2007-01-12 | Upm Kymmene Wood Oy | Puulevy |
JP4434311B2 (ja) | 2007-07-18 | 2010-03-17 | 株式会社村田製作所 | 無線icデバイスおよびその製造方法 |
EP2836878B1 (en) * | 2012-04-11 | 2019-02-27 | IMPINJ, Inc. | Rfid integrated circuits and tags with antenna contacts on multiple surfaces |
US10600753B2 (en) * | 2015-08-28 | 2020-03-24 | Texas Instruments Incorporated | Flip chip backside mechanical die grounding techniques |
DE102016103790B8 (de) | 2016-03-03 | 2021-06-02 | Infineon Technologies Ag | Herstellung einer Packung unter Verwendung eines platebaren Verkapselungsmaterials |
MX2018013731A (es) * | 2016-05-11 | 2019-08-01 | Flex Automotive Gmbh | Montaje de circuitos electricos y metodo para la fabricacion del mismo. |
JP2019004266A (ja) * | 2017-06-13 | 2019-01-10 | 富士通株式会社 | アンテナ装置および電子機器 |
WO2020240252A1 (en) * | 2019-05-29 | 2020-12-03 | Stora Enso Oyj | Method and apparatus for producing a radio-frequency identification (rfid) transponder |
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- 2005-02-02 EP EP05709607.5A patent/EP1715445A4/en not_active Withdrawn
- 2005-02-02 KR KR1020067017616A patent/KR100879416B1/ko not_active IP Right Cessation
- 2005-02-02 US US10/588,547 patent/US20090065586A1/en not_active Abandoned
- 2005-02-02 CN CN2005800040811A patent/CN1918583B/zh not_active Expired - Fee Related
- 2005-02-02 WO PCT/JP2005/001486 patent/WO2005076202A1/ja active Application Filing
- 2005-02-02 JP JP2005517695A patent/JP4518024B2/ja not_active Expired - Fee Related
- 2005-02-04 TW TW094103689A patent/TW200527312A/zh unknown
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JPH061096A (ja) * | 1992-06-17 | 1994-01-11 | Omron Corp | カード形基板及びその製造方法 |
WO2000076279A1 (en) * | 1999-06-03 | 2000-12-14 | Toyo Kohan Co.,Ltd. | Process for producing printed wiring board, ic card and printed wiring substrate |
JP2001217380A (ja) * | 2000-02-04 | 2001-08-10 | Hitachi Ltd | 半導体装置およびその製造方法 |
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KR100879416B1 (ko) | 2009-01-19 |
US20090065586A1 (en) | 2009-03-12 |
EP1715445A1 (en) | 2006-10-25 |
TWI295789B (ja) | 2008-04-11 |
JPWO2005076202A1 (ja) | 2007-08-02 |
KR20060126801A (ko) | 2006-12-08 |
EP1715445A4 (en) | 2016-08-31 |
CN1918583A (zh) | 2007-02-21 |
TW200527312A (en) | 2005-08-16 |
CN1918583B (zh) | 2011-06-15 |
WO2005076202A1 (ja) | 2005-08-18 |
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