JP4490305B2 - 銅粉 - Google Patents
銅粉 Download PDFInfo
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- JP4490305B2 JP4490305B2 JP2005041712A JP2005041712A JP4490305B2 JP 4490305 B2 JP4490305 B2 JP 4490305B2 JP 2005041712 A JP2005041712 A JP 2005041712A JP 2005041712 A JP2005041712 A JP 2005041712A JP 4490305 B2 JP4490305 B2 JP 4490305B2
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- JP
- Japan
- Prior art keywords
- copper powder
- particle size
- copper
- cuprous oxide
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 74
- 239000002245 particle Substances 0.000 claims description 81
- 239000010949 copper Substances 0.000 claims description 38
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims description 37
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims description 37
- 229940112669 cuprous oxide Drugs 0.000 claims description 37
- 150000002500 ions Chemical class 0.000 claims description 11
- 230000009467 reduction Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 description 16
- 238000006722 reduction reaction Methods 0.000 description 15
- 150000001879 copper Chemical class 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 13
- 239000002994 raw material Substances 0.000 description 11
- 238000009826 distribution Methods 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000000084 colloidal system Substances 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 9
- 239000003638 chemical reducing agent Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000008139 complexing agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 3
- 229940045803 cuprous chloride Drugs 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 230000001376 precipitating effect Effects 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 241000978776 Senegalia senegal Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- RFKZUAOAYVHBOY-UHFFFAOYSA-M copper(1+);acetate Chemical compound [Cu+].CC([O-])=O RFKZUAOAYVHBOY-UHFFFAOYSA-M 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- -1 hydrazine compound Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0063—Hydrometallurgy
- C22B15/0084—Treating solutions
- C22B15/0089—Treating solutions by chemical methods
- C22B15/0091—Treating solutions by chemical methods by cementation
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Description
平均粒径3μmの電解亜酸化銅を用意した。これは全粒子数の50%以上が3μm±1μmの範囲を外れるブロードな粒度分布を有するものである。また、この電解亜酸化銅中にはSnが0.01質量%含まれている。この電解亜酸化銅135gを純水3750g中に分散させ、水溶性銅塩として塩化第一銅7.5g、保護コロイドとしてポリビニルアルコール15gを加えて攪拌しながら40℃に加温した。その後、還元剤として80%水化ヒドラジン100g、錯化剤として酢酸22.5gを加え、60℃まで1時間かけて加温し、さらに60℃で1時間保持しながら還元反応を進行させた。反応後の液を固液分離し、回収された固形分を水洗、乾燥して銅粉を得た。この銅粉を走査型電子顕微鏡(SEM)で観察することにより、視野中の粒子の粒径を測定した。その結果、平均粒径DMは0.3μmであり、少なくとも全粒子数の80%以上の粒子の粒径が0.5DM〜1.5DMの範囲にあることが確認された。図1に、この銅粉のSEM写真を示してある。
水溶性銅塩として塩化第一銅7.5g、保護コロイドとしてポリビニルアルコール15gを純水3750gに加えて攪拌しながら40℃に加温したのち、還元剤として水化ヒドラジン100gを加えた。この反応液に実施例1で採用したのと同じ電解亜酸化銅135gと、錫塩として塩化錫0.43gを加え、さらに錯化剤として酢酸22.5gを加え、60℃まで1時間かけて加温し、さらに60℃で1時間保持しながら還元反応を進行させた。反応後の液を固液分離し、回収された固形分を水洗、乾燥して銅粉を得た。この銅粉を走査型電子顕微鏡(SEM)観察することにより、視野中の粒子の粒径を測定した。その結果、平均粒径DMは0.3μmであり、少なくとも全粒子数の80%以上の粒子の粒径が0.5DM〜1.5DMの範囲にあることが確認された。
硫酸銅110gを純水330gに溶解し、水酸化ナトリウム90gを加えて中和したのち、60%ブドウ糖溶液440gを添加し、70℃で還元反応を進めることにより亜酸化銅を析出させた。この亜酸化銅のスラリーに水化ヒドラジン120gを加え、90℃まで3時間かけて加温することにより還元反応を進行させた。反応後の液を固液分離し、回収された固形分を水洗、乾燥して銅粉を得た。この銅粉を走査型電子顕微鏡(SEM)観察することにより、視野中の粒子の粒径を測定した。その結果、平均粒径DMは0.3μmであった。
実施例1、2、比較例1で得られた銅粉を、それぞれ恒温室内で大気中に曝し、一定期間後の酸素量を不活性ガス中融解−赤外線吸収法により測定することで、25℃、R.H.30%における大気中での酸素吸収量の経時変化を調べた。結果を図2に示す。
Claims (6)
- Snイオン存在下でCuイオンを還元することにより金属Cuを析出させてSn含有量を10〜20000ppmとした銅粉。
- Sn含有量10〜1000ppmの亜酸化銅を還元することにより金属Cuを析出させて得られるSn含有銅粉。
- Sn含有亜酸化銅を還元することにより金属Cuを析出させてSn含有量を10〜20000ppmとした銅粉。
- 銅粉のSn含有量が100〜2000ppmである請求項1〜3のいずれかに記載の銅粉。
- 平均粒径DMが0.1〜2μmである請求項1〜4のいずれかに記載の銅粉。
- 平均粒径DMが0.1〜2μmであり、少なくとも全粒子数の80%以上の粒子の粒径が0.5DM〜1.5DMの範囲にある請求項1〜4のいずれかに記載の銅粉。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005041712A JP4490305B2 (ja) | 2005-02-18 | 2005-02-18 | 銅粉 |
TW095103991A TWI319341B (en) | 2005-02-18 | 2006-02-07 | Copper powder |
KR1020060015167A KR101236246B1 (ko) | 2005-02-18 | 2006-02-16 | 구리 분말 |
CN2006100998795A CN1876281B (zh) | 2005-02-18 | 2006-02-17 | 铜粉 |
US11/355,888 US20060185474A1 (en) | 2005-02-18 | 2006-02-17 | Copper powder |
US12/285,968 US7909908B2 (en) | 2005-02-18 | 2008-10-17 | Method of improving the weatherability of copper powder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005041712A JP4490305B2 (ja) | 2005-02-18 | 2005-02-18 | 銅粉 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006225731A JP2006225731A (ja) | 2006-08-31 |
JP4490305B2 true JP4490305B2 (ja) | 2010-06-23 |
Family
ID=36911226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005041712A Active JP4490305B2 (ja) | 2005-02-18 | 2005-02-18 | 銅粉 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20060185474A1 (ja) |
JP (1) | JP4490305B2 (ja) |
KR (1) | KR101236246B1 (ja) |
CN (1) | CN1876281B (ja) |
TW (1) | TWI319341B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8116341B2 (en) * | 2007-05-31 | 2012-02-14 | Electro Scientific Industries, Inc. | Multiple laser wavelength and pulse width process drilling |
US9439293B2 (en) | 2007-11-21 | 2016-09-06 | Xerox Corporation | Galvanic process for making printed conductive metal markings for chipless RFID applications |
US10384314B2 (en) * | 2015-04-22 | 2019-08-20 | Hitachi Metals, Ltd. | Metal particle and method for producing the same, covered metal particle, and metal powder |
JP6597008B2 (ja) * | 2015-07-16 | 2019-10-30 | 株式会社村田製作所 | 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法 |
JP6451679B2 (ja) * | 2016-03-24 | 2019-01-16 | カシオ計算機株式会社 | 銅ナノ粒子の製造方法 |
JP6868627B2 (ja) * | 2016-08-03 | 2021-05-12 | 株式会社Adeka | 銅粉の製造方法 |
RU2691474C1 (ru) * | 2018-08-15 | 2019-06-14 | Марина Владимировна Пузанова | Медный порошок для очистки технического тетрахлорида титана от примеси окситрихлорида ванадия |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2286237A (en) * | 1940-06-15 | 1942-06-16 | Metals Disintegrating Co | Copper powder |
US2294895A (en) * | 1940-07-15 | 1942-09-08 | Glidden Co | Copper powder |
NL301992A (ja) * | 1963-01-02 | |||
JPS62140305A (ja) * | 1985-12-13 | 1987-06-23 | 古河電気工業株式会社 | 導電性ペ−スト |
JPS6355807A (ja) * | 1986-08-27 | 1988-03-10 | 古河電気工業株式会社 | 導電性ペ−スト |
IT1196620B (it) * | 1986-09-11 | 1988-11-16 | Metalli Ind Spa | Lega metallica a base di rame di tipo perfezionato,particolarmente per la costruzione di componenti elettronici |
JPH0784605B2 (ja) | 1988-05-17 | 1995-09-13 | 福田金属箔粉工業株式会社 | 銅微粉末の製造方法 |
JPH02200746A (ja) | 1989-01-27 | 1990-08-09 | Sumitomo Metal Mining Co Ltd | リードフレーム用銅合金材の製造方法 |
JPH0557324A (ja) | 1991-08-29 | 1993-03-09 | Nippon Steel Corp | 圧延材の加熱装置 |
US5470373A (en) * | 1993-11-15 | 1995-11-28 | The United States Of America As Represented By The Secretary Of The Navy | Oxidation resistant copper |
US6679937B1 (en) * | 1997-02-24 | 2004-01-20 | Cabot Corporation | Copper powders methods for producing powders and devices fabricated from same |
JP2911429B2 (ja) | 1997-06-04 | 1999-06-23 | 三井金属鉱業株式会社 | 銅微粉末の製造方法 |
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2005
- 2005-02-18 JP JP2005041712A patent/JP4490305B2/ja active Active
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2006
- 2006-02-07 TW TW095103991A patent/TWI319341B/zh active
- 2006-02-16 KR KR1020060015167A patent/KR101236246B1/ko active IP Right Grant
- 2006-02-17 CN CN2006100998795A patent/CN1876281B/zh not_active Expired - Fee Related
- 2006-02-17 US US11/355,888 patent/US20060185474A1/en not_active Abandoned
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2008
- 2008-10-17 US US12/285,968 patent/US7909908B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1876281B (zh) | 2013-10-16 |
KR20060093045A (ko) | 2006-08-23 |
TWI319341B (en) | 2010-01-11 |
JP2006225731A (ja) | 2006-08-31 |
TW200631703A (en) | 2006-09-16 |
US7909908B2 (en) | 2011-03-22 |
KR101236246B1 (ko) | 2013-02-22 |
CN1876281A (zh) | 2006-12-13 |
US20090050857A1 (en) | 2009-02-26 |
US20060185474A1 (en) | 2006-08-24 |
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