JP4465295B2 - 半導体レーザーダイオード - Google Patents
半導体レーザーダイオード Download PDFInfo
- Publication number
- JP4465295B2 JP4465295B2 JP2005097003A JP2005097003A JP4465295B2 JP 4465295 B2 JP4465295 B2 JP 4465295B2 JP 2005097003 A JP2005097003 A JP 2005097003A JP 2005097003 A JP2005097003 A JP 2005097003A JP 4465295 B2 JP4465295 B2 JP 4465295B2
- Authority
- JP
- Japan
- Prior art keywords
- laser diode
- frame
- semiconductor laser
- air passage
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0232—Lead-frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Description
１１５ サブマウント
１２０ フレーム部
１２０a 素子配置部
１２０b、１２０c 左右翼部
１２０d リードフレーム
１２０e 補助フレーム
１３０ 樹脂部
１３０a 樹脂枠
１３０b 裏面樹脂
１４０ 空気通路部
１４１ 単一凹溝
１４２ 分割凹溝
１４３ 折曲型凹溝
１４３a 入口
１４３b 出口
１４３c 連結溝
X 出射軸
Claims (9)
- レーザー素子と、上記レーザー素子が上部面に搭載されるサブマウントと、上記サブマウントが搭載されるフレーム部と、上記フレーム部を固定する樹脂部とを設け、本体中央に挿入孔を貫通形成したホルダーに組立てられる半導体レーザーダイオードであって、
上記フレーム部の上部に安着され、上記フレーム部の前方に配置される上記レーザー素子を外部に露出させる出射孔が形成された樹脂枠と、
上記樹脂枠において、上記出射孔と連通して上記ホルダーとの組立時上記挿入孔内に空気流路を形成する空気通路部と、を備える半導体レーザーダイオード。 - 上記空気通路部は、三角、四角などの多角断面状で形成される、請求項１に記載の半導体レーザーダイオード。
- 上記空気通路部は、弧断面状で形成される、請求項１に記載の半導体レーザーダイオード。
- 上記空気通路部は、出射軸とほぼ同一な直線型で形成される、請求項１に記載の半導体レーザーダイオード。
- 上記空気通路部は、上記出射窓の幅とほぼ同一な大きさの幅で上記樹脂枠の前面に出射軸方向へ凹設される単一凹溝で構成される、請求項１に記載の半導体レーザーダイオード。
- 上記単一凹溝の幅中心は、上記レーザー素子とほぼ同一な垂直軸上に配される、請求項５に記載の半導体レーザーダイオード。
- 上記空気通路部は、上記出射窓の幅より小さい幅で上記樹脂枠の前面に出射軸方向へ少なくとも２個以上凹設される分割凹溝で構成される、請求項１に記載の半導体レーザーダイオード。
- 上記複数個の分割凹溝のうちいずれか一つは、上記レーザー素子とほぼ同一な垂直軸上に配される、請求項７に記載の半導体レーザーダイオード。
- 上記空気通路部は、上記出射窓の幅より小さい幅を有する入口と出口とが上記樹脂枠の前面に幅方向へ凹設される連結溝を通して連結される折曲型凹溝で構成される、請求項１に記載の半導体レーザーダイオード。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040086483A KR100568321B1 (ko) | 2004-10-28 | 2004-10-28 | 반도체 레이저 다이오드 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006128604A JP2006128604A (ja) | 2006-05-18 |
| JP4465295B2 true JP4465295B2 (ja) | 2010-05-19 |
Family
ID=36261999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005097003A Expired - Fee Related JP4465295B2 (ja) | 2004-10-28 | 2005-03-30 | 半導体レーザーダイオード |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20060093284A1 (ja) |
| JP (1) | JP4465295B2 (ja) |
| KR (1) | KR100568321B1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3985562B2 (ja) * | 2002-02-25 | 2007-10-03 | 株式会社日立製作所 | 光ヘッド及び光ディスク装置 |
| WO2012029209A1 (ja) * | 2010-08-30 | 2012-03-08 | パナソニック株式会社 | 半導体レーザ装置および光ピックアップ装置 |
| JP2016058407A (ja) * | 2013-01-31 | 2016-04-21 | パナソニック株式会社 | 半導体レーザ装置 |
| JP6958098B2 (ja) * | 2017-08-10 | 2021-11-02 | 住友電気工業株式会社 | 光モジュール |
| CN111755364B (zh) * | 2020-08-13 | 2023-04-07 | 抚州华成半导体科技有限公司 | 一种半导体二极管生产设备 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3723426B2 (ja) | 2000-07-28 | 2005-12-07 | 三洋電機株式会社 | 半導体レーザ装置 |
| JP3723425B2 (ja) | 2000-07-26 | 2005-12-07 | 三洋電機株式会社 | 半導体レーザ装置 |
| JP2002023028A (ja) | 2001-06-08 | 2002-01-23 | Hitachi Ltd | 光通信装置 |
| JP4070969B2 (ja) | 2001-08-10 | 2008-04-02 | シャープ株式会社 | 半導体レーザ装置 |
-
2004
- 2004-10-28 KR KR1020040086483A patent/KR100568321B1/ko not_active IP Right Cessation
-
2005
- 2005-03-25 US US11/089,778 patent/US20060093284A1/en not_active Abandoned
- 2005-03-30 JP JP2005097003A patent/JP4465295B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20060093284A1 (en) | 2006-05-04 |
| KR100568321B1 (ko) | 2006-04-05 |
| JP2006128604A (ja) | 2006-05-18 |
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