JP4458137B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
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- JP4458137B2 JP4458137B2 JP2007234549A JP2007234549A JP4458137B2 JP 4458137 B2 JP4458137 B2 JP 4458137B2 JP 2007234549 A JP2007234549 A JP 2007234549A JP 2007234549 A JP2007234549 A JP 2007234549A JP 4458137 B2 JP4458137 B2 JP 4458137B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10787—Leads having protrusions, e.g. for retention or insert stop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10848—Thinned leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10871—Leads having an integral insert stop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
(第1実施形態)
図1は、第1実施形態に係る電子制御装置の概略構成を説明するための、組み付け前の状態を示す分解図である。図2は、コネクタをプリント基板に実装した状態のコネクタ周辺の断面図である。図3は、コネクタをプリント基板との接続側から見た平面図である。図4は、コネクタを外部コネクタとの接続側から見た平面図である。図5は、図2のV−V線に沿う断面図である。図6は、コネクタの分岐状端子とプリント基板とのランドとの接続部周辺の平面図である。図7は、図6のVII−VII線に沿う断面図である。図8は、図6のVIII−VIII線に沿う断面図である。図9は、図6のIX−IX線に沿う断面図である。なお、図5及び図6においては、便宜上、はんだを省略して図示している。また、図7〜図9においては、便宜上、ソルダレジストを省略して図示している。
次に、本発明に係る参考例を、図19に基づいて説明する。図19は、参考例としての電子制御装置のうち、コネクタの分岐状端子とプリント基板との接続構造を示す断面図であり、第1実施形態に示した図7に対応している。
33・・・貫通孔
34・・・表面用ランド
50・・・コネクタ(電子部品)
51・・・ハウジング(本体部)
52・・・端子(分岐状端子)
59・・・挿入部
60・・・表面部
61・・・下面
62・・・凹部
72・・・はんだ
100・・・電子制御装置(電子装置)
Claims (12)
- ランドを有するプリント基板と、
本体部に対して複数の端子が配列された電子部品とを備え、
前記端子の前記本体部から延出された端部がはんだを介して前記ランドと接続された電子装置であって、
前記プリント基板は、電子部品配置面からその裏面に貫通する貫通孔と、前記ランドとして前記電子部品配置面に設けられた表面用ランド及び前記貫通孔の壁面及び前記貫通孔の開口周辺に一体的に設けられた挿入用ランドとを有し、
前記電子部品は、前記表面用ランド上に配置され、前記はんだを介して前記表面用ランドと接続される表面部と、該表面部から略垂直に延び、前記貫通孔に挿入された状態で、前記貫通孔内に前記電子部品配置面側から供給されたはんだを介して前記挿入用ランドと接続される挿入部とを前記端部として合わせもつ分岐状端子を、前記端子として少なくとも含み、
前記表面部における前記プリント基板の電子部品配置面と対向する側の平坦な下面の一部であって前記貫通孔上における部分を少なくとも含む部分に、角のない丸みを帯びた形状の凹部が形成され、前記凹部は前記下面の縁部まで延設されていることを特徴とする電子装置。 - 前記凹部は、前記表面部における前記挿入部との分岐部分に隣接して形成されていることを特徴とする請求項1に記載の電子装置。
- 前記凹部は、前記端子の配列方向において、前記表面部における下面の少なくとも一方の縁部まで延設されていることを特徴とする請求項1又は請求項2に記載の電子装置。
- 前記表面部は、前記端子の配列方向の厚さが他の領域よりも薄い薄肉領域を有し、該薄肉領域に前記凹部の周辺領域を少なくとも含むことを特徴とする請求項3に記載の電子装置。
- ランドを有するプリント基板と、
本体部に対して複数の端子が配列された電子部品とを備え、
前記端子の前記本体部から延出された端部がはんだを介して前記ランドと接続された電子装置であって、
前記プリント基板は、電子部品配置面からその裏面に貫通する貫通孔と、前記ランドとして前記電子部品配置面に設けられた表面用ランド及び前記貫通孔の壁面及び前記貫通孔の開口周辺に一体的に設けられた挿入用ランドとを有し、
前記電子部品は、前記貫通孔に挿入された状態で、前記貫通孔内に前記電子部品配置面側から供給されたはんだを介して前記挿入用ランドと接続される挿入部と、前記表面用ランド上に配置され、前記はんだを介して前記表面用ランドと接続される表面部とを前記端部として合わせもつ分岐状端子を、前記端子として少なくとも含み、
前記表面部における前記プリント基板の電子部品配置面と対向する側の下面の一部であって前記貫通孔上における部分を少なくとも含む部分に凹部が形成され、前記凹部は、前記端子の配列方向において、前記表面部における下面の少なくとも一方の縁部まで延設されており、
前記表面部は、前記端子の配列方向の厚さが他の領域よりも薄い薄肉領域を有し、該薄肉領域に前記凹部の周辺領域を少なくとも含むことを特徴とする電子装置。 - 前記表面部における下面は、前記凹部を除く部分が略面一となっていることを特徴とする請求項5に記載の電子装置。
- 前記表面部において、前記凹部の周辺領域を含む前記下面から所定高さの範囲が、前記薄肉領域とされていることを特徴とする請求項4〜6いずれか1項に記載の電子装置。
- 前記端子の配列方向において、前記挿入部の厚さが前記薄肉領域よりも厚くされていることを特徴とする請求項4〜7いずれか1項に記載の電子装置。
- 前記表面部における薄肉領域は、前記端子の配列方向の厚さが前記プリント基板の電子部品配置面側に向けて薄くなるテーパ状とされていることを特徴とする請求項4〜8いずれか1項に記載の電子装置。
- 前記表面部における薄肉領域は、前記端子の配列方向の厚さが一定であり、
前記薄肉領域と前記他の領域との境界部分において、前記端子の配列方向の厚さが前記薄肉領域と前記他の領域とで異なり、前記境界部分が段差状とされていることを特徴とする請求項4〜8いずれか1項に記載の電子装置。 - 前記分岐状端子は、平板を打ち抜いて形成された打ち抜き端子であることを特徴とする請求項1〜10いずれか1項に記載の電子装置。
- 前記電子部品は、前記端子の少なくとも一部のうち、前記本体部から延出された一方の端部が前記ランドと電気的に接続され、前記本体部から延出された他方の端部が外部コネクタと電気的に接続されるコネクタであることを特徴とする請求項1〜11いずれか1項に記載の電子装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007234549A JP4458137B2 (ja) | 2007-09-10 | 2007-09-10 | 電子装置 |
EP08013851.4A EP2034809B1 (en) | 2007-09-10 | 2008-08-01 | Electronic device including printed circuit board and electronic element mounted on the printed circuit board |
US12/222,321 US7578681B2 (en) | 2007-09-10 | 2008-08-07 | Electronic device including printed circuit board and electronic element mounted on the printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007234549A JP4458137B2 (ja) | 2007-09-10 | 2007-09-10 | 電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009070854A JP2009070854A (ja) | 2009-04-02 |
JP4458137B2 true JP4458137B2 (ja) | 2010-04-28 |
Family
ID=40185056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007234549A Active JP4458137B2 (ja) | 2007-09-10 | 2007-09-10 | 電子装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7578681B2 (ja) |
EP (1) | EP2034809B1 (ja) |
JP (1) | JP4458137B2 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7563112B2 (en) * | 2006-12-13 | 2009-07-21 | Denso Corporation | Electronic device |
EP2690936A4 (en) * | 2012-05-30 | 2016-03-09 | Panasonic Ip Man Co Ltd | ELECTRONIC DEVICE |
JP2014187177A (ja) * | 2013-03-22 | 2014-10-02 | Fujitsu Ltd | 電子部品の実装方法 |
US9564697B2 (en) * | 2014-11-13 | 2017-02-07 | Lear Corporation | Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same |
US9942993B2 (en) * | 2014-12-26 | 2018-04-10 | DISH Technologies L.L.C. | Method for back-drilling a through-hole onto a printed circuit board (PCB) |
WO2017211402A1 (en) * | 2016-06-08 | 2017-12-14 | Arcelik Anonim Sirketi | An improved printed circuit board surface mount hole connection structure |
DE102016118527A1 (de) * | 2016-09-29 | 2018-03-29 | Phoenix Contact Gmbh & Co. Kg | Bauelement, Positioniervorrichtung und Verfahren zur Lötbefestigung des Bauelements |
US11057995B2 (en) * | 2018-06-11 | 2021-07-06 | Amphenol Corporation | Backplane footprint for high speed, high density electrical connectors |
US11330722B2 (en) * | 2018-07-10 | 2022-05-10 | Haier Us Appliance Solutions, Inc. | Appliance control panel with in-molded electronic film directly mounted to printed circuit board |
EP3599675B1 (en) * | 2018-07-26 | 2021-06-30 | Rogers BV | Busbar and method for manufacturing a busbar |
JP7420482B2 (ja) * | 2019-05-14 | 2024-01-23 | ダイヤゼブラ電機株式会社 | 電子機器 |
CN118265223A (zh) * | 2022-12-26 | 2024-06-28 | 荣耀终端有限公司 | 电路板组件和电子设备 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2828231A1 (de) * | 1978-06-28 | 1980-01-03 | Stettner & Co | Elektrisches bauelement mit anschlussdraehten zum einstecken in bohrungen einer schaltungsplatte |
IT1111291B (it) * | 1978-03-23 | 1986-01-13 | Stettner & Co | Elemento costruttivo elettrico con fili di connessione per l'inserimento in fori di una piastra circuitale |
NL8200533A (nl) * | 1982-02-12 | 1983-09-01 | Philips Nv | Elektrische component met gestuikte aansluitdraden. |
US5281166A (en) * | 1991-10-28 | 1994-01-25 | Foxconn International, Inc. | Electrical connector with improved connector pin support and improved mounting to a PCB |
JPH0785931A (ja) * | 1993-09-17 | 1995-03-31 | Kel Corp | 電気コネクタ |
JPH11111407A (ja) * | 1997-10-03 | 1999-04-23 | Fujitsu Ltd | コネクタの表面実装方法およびコネクタ |
JPH11317265A (ja) | 1998-04-30 | 1999-11-16 | Smk Corp | プリント配線板実装構造 |
US6552277B1 (en) * | 2000-09-08 | 2003-04-22 | Emc Corporation | Techniques for forming a connection between a pin and a circuit board |
JP2002246721A (ja) | 2001-02-14 | 2002-08-30 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JP2006059654A (ja) * | 2004-08-19 | 2006-03-02 | Tokai Rika Co Ltd | 端子の製造方法 |
JP2006202617A (ja) * | 2005-01-20 | 2006-08-03 | Tokai Rika Co Ltd | コネクタ端子の製造方法及びコネクタ端子 |
JP2006256448A (ja) * | 2005-03-16 | 2006-09-28 | Tyco Electronics Amp Kk | 自動車用コネクタ組立体 |
JP4754287B2 (ja) * | 2005-07-15 | 2011-08-24 | 矢崎総業株式会社 | オンボードコネクタ |
JP4631669B2 (ja) | 2005-11-25 | 2011-02-16 | セイコーエプソン株式会社 | 印刷システム及び印刷制御プログラム |
EP1821587B1 (en) * | 2006-02-20 | 2017-08-02 | Denso Corporation | Electronic component mounting structure |
US7563112B2 (en) * | 2006-12-13 | 2009-07-21 | Denso Corporation | Electronic device |
JP4470980B2 (ja) * | 2007-09-10 | 2010-06-02 | 株式会社デンソー | 電子装置 |
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2007
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US7578681B2 (en) | 2009-08-25 |
EP2034809B1 (en) | 2013-06-26 |
EP2034809A3 (en) | 2011-08-31 |
JP2009070854A (ja) | 2009-04-02 |
EP2034809A2 (en) | 2009-03-11 |
US20090068864A1 (en) | 2009-03-12 |
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