JP4456149B2 - スプリング接触子及び基板 - Google Patents
スプリング接触子及び基板 Download PDFInfo
- Publication number
- JP4456149B2 JP4456149B2 JP2007513492A JP2007513492A JP4456149B2 JP 4456149 B2 JP4456149 B2 JP 4456149B2 JP 2007513492 A JP2007513492 A JP 2007513492A JP 2007513492 A JP2007513492 A JP 2007513492A JP 4456149 B2 JP4456149 B2 JP 4456149B2
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- Prior art keywords
- ring
- spring contact
- substrate
- protrusion
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims description 48
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 239000010408 film Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 12
- 230000004888 barrier function Effects 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 238000001459 lithography Methods 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005201 scrubbing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000014443 Pyrus communis Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000000809 air pollutant Substances 0.000 description 1
- 231100001243 air pollutant Toxicity 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01R12/71—Coupling devices for rigid printing circuits or like structures
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10946—Leads attached onto leadless component after manufacturing the component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Claims (20)
- 電子デバイスの回路と平坦な実装面上の回路とを相互接続するためのスプリング接触子であって、幾何学的な点の周囲に延在する柔軟性材料から形成される連続的リングを有し、該リングは中空内部を取囲む胴体を備え、該胴体が内部表面と外部表面とを含み、少なくとも1つの突出部がリング胴体の外部表面から延出しており、該突出部は前記リング胴体の外部表面から延在して交差し該突出部の頂点を形成する2つの側面を備え、前記リングに圧縮力が加えられたときに前記リングの頂点が直線的に移動するスプリング接触子。
- 前記突出部の断面が本質的にドロップドオージブの形状を呈する、請求項1に記載のスプリング接触子。
- ドロップドオージブは実質的に第1の円弧の割線上に置かれた頂点を有し、前記第1の円弧の割線は、リングの円形断面上にある円弧の扇形の第1の半径を、第2の半径が第1の円弧に出会う点においてリング断面の第2の半径に対して実質的に直交するラインに出会うまで延長することにより形成される、請求項2に記載のスプリング接触子。
- 前記突出部の断面が放物線形状を呈する、請求項1に記載のスプリング接触子。
- 内部にH形開口部が形成された非導電性シートを更に含み、H形開口部は第1のキャリアフラップ及び第2のキャリアフラップを形成し、リング胴体が前記H形開口部内に収容され、第1のキャリアフラップ及び第2のキャリアフラップが前記リングの中空内部に少なくとも部分的に延在している、請求項1に記載のスプリング接触子。
- 前記シートがポリイミド薄膜である、請求項5に記載のスプリング接触子。
- 前記シートが可撓性材料から形成される、請求項5に記載のスプリング接触子。
- 前記リングが金属リングである、請求項1に記載のスプリング接触子。
- 前記リングがプラスチックリングであり、リングの外部表面が導電性を有するようにコーティングされている、請求項1に記載のスプリング接触子。
- 前記リングがリソグラフィによって形成される、請求項1に記載のスプリング接触子。
- 前記リング胴体は、少なくとも前記外部表面に配置され、前記リングの円周に沿って互いに離間された第1及び第2のはんだバリアを含む、請求項1に記載のスプリング接触子。
- 前記第1及び第2のはんだバリアが前記リングの円周上において略反対側に配置された、請求項11に記載のスプリング接触子。
- 前記はんだバリアがニッケルから形成される、請求項11に記載のスプリング接触子。
- 前記リングの直径が約500マイクロメータ〜1000マイクロメータである、請求項1に記載のスプリング接触子。
- 前記リングが前記突出部と反対側に配置された拡張ベース部を含む、請求項1に記載のスプリング接触子。
- 電子デバイスに接続するための基板であって、
電気信号を伝送可能な複数の導電性トレースを備えた平面基板と、
複数の導電性中空リングであり、各々のリングが平面基板上の少なくとも1つの導電性トレースと結合され、各々のリングが、幾何学的な点の周囲を延在して中空内部を含む柔軟性材料から構成された複数の導電性リングと、を有し、
該リングが外部表面から延在している突出部を備え、前記突出部が、前記リング外部表面に配置された頂点を備えるとともに、電子デバイスが前記リング上に押付けられたとき頂点が直線的に移動するように配置された基板。 - 前記突出部の断面がドロップドオージブの形状を呈する、請求項16に記載の基板。
- 内部に複数のH形開口部が形成された非導電性シートを更に含み、各々のH形開口部はシートに、対向する第1のキャリアフラップ及び第2のキャリアフラップを形成し、各々の前記H形開口部は1つのリングを収容し、第1のキャリアフラップ及び第2のキャリアフラップが前記リングの中空内部に延在している、請求項16に記載の基板。
- 前記シートが可撓性フィルムである、請求項16に記載の基板。
- 前記突出部が、お互いに離間された複数のワイパーアームを含むとともに前記リングの外部表面から外側に延在している、請求項16に記載の基板。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57534704P | 2004-05-28 | 2004-05-28 | |
US57534804P | 2004-05-28 | 2004-05-28 | |
US61477404P | 2004-09-30 | 2004-09-30 | |
PCT/US2005/018946 WO2005119849A1 (en) | 2004-05-28 | 2005-05-27 | Flexible scrub ring contact |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007537579A JP2007537579A (ja) | 2007-12-20 |
JP4456149B2 true JP4456149B2 (ja) | 2010-04-28 |
Family
ID=34971402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007513492A Expired - Fee Related JP4456149B2 (ja) | 2004-05-28 | 2005-05-27 | スプリング接触子及び基板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7284991B2 (ja) |
EP (1) | EP1749334B1 (ja) |
JP (1) | JP4456149B2 (ja) |
KR (1) | KR100883455B1 (ja) |
DE (1) | DE602005003351T2 (ja) |
WO (1) | WO2005119849A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005119848A1 (en) * | 2004-05-28 | 2005-12-15 | Molex Incorporated | Flexible ring interconnection system |
JP5064205B2 (ja) * | 2007-12-27 | 2012-10-31 | タイコエレクトロニクスジャパン合同会社 | コンタクトおよびインタポーザ |
JP5360900B2 (ja) * | 2009-11-04 | 2013-12-04 | 北川工業株式会社 | 導電部品 |
DE102011003887A1 (de) * | 2011-02-09 | 2012-08-09 | Robert Bosch Gmbh | Elektrische Direktkontaktierungsanordnung für Kontaktflächen auf einer Leiterplatte |
US9512863B2 (en) * | 2012-04-26 | 2016-12-06 | California Institute Of Technology | Silicon alignment pins: an easy way to realize a wafer-to-wafer alignment |
JP6256129B2 (ja) * | 2014-03-14 | 2018-01-10 | オムロン株式会社 | 圧接端子 |
JP6684419B2 (ja) * | 2016-03-02 | 2020-04-22 | 北川工業株式会社 | コンタクト |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3985413A (en) * | 1973-11-26 | 1976-10-12 | Amp Incorporated | Miniature electrical connector |
US4035628A (en) * | 1975-10-24 | 1977-07-12 | Westinghouse Electric Corporation | Analog transversal filtering and correlation with progressive summation of analog signals |
GB1536589A (en) | 1976-05-15 | 1978-12-20 | Int Computers Ltd | Electrical connectors and to methods for making electrical connectors |
US4421370A (en) | 1981-07-16 | 1983-12-20 | Accutest Corporation | Contact array |
US4805885A (en) | 1982-12-21 | 1989-02-21 | Amp Incorporated | Sinuous spring |
US4927369A (en) | 1989-02-22 | 1990-05-22 | Amp Incorporated | Electrical connector for high density usage |
US5071359A (en) | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
US5035628A (en) | 1990-05-29 | 1991-07-30 | Amp Incorporated | Electrical connector for electrically interconnecting two parallel surfaces |
US5199889A (en) * | 1991-11-12 | 1993-04-06 | Jem Tech | Leadless grid array socket |
US5214563A (en) | 1991-12-31 | 1993-05-25 | Compaq Computer Corporation | Thermally reactive lead assembly and method for making same |
US5334804A (en) * | 1992-11-17 | 1994-08-02 | Fujitsu Limited | Wire interconnect structures for connecting an integrated circuit to a substrate |
JP3236975B2 (ja) * | 1993-05-24 | 2001-12-10 | 日本航空電子工業株式会社 | フィルム状コネクタ |
WO1995004387A1 (en) | 1993-07-27 | 1995-02-09 | Citizen Watch Co., Ltd. | An electrical connecting structure and a method for electrically connecting terminals to each other |
US5971253A (en) | 1995-07-31 | 1999-10-26 | Tessera, Inc. | Microelectronic component mounting with deformable shell terminals |
US5573435A (en) | 1995-08-31 | 1996-11-12 | The Whitaker Corporation | Tandem loop contact for an electrical connector |
JPH10228966A (ja) | 1997-02-12 | 1998-08-25 | Hirose Electric Co Ltd | 中間電気コネクタ |
US5879172A (en) | 1997-04-03 | 1999-03-09 | Emulation Technology, Inc. | Surface mounted adapter using elastomeric conductors |
US6200141B1 (en) | 1997-08-19 | 2001-03-13 | Aries Electronics, Inc. | Land grid array connector |
JP4025885B2 (ja) | 1998-02-06 | 2007-12-26 | 協伸工業株式会社 | コネクタチップ及びテーピングコネクタチップ |
US6027346A (en) | 1998-06-29 | 2000-02-22 | Xandex, Inc. | Membrane-supported contactor for semiconductor test |
US6019610A (en) | 1998-11-23 | 2000-02-01 | Glatts, Iii; George F. | Elastomeric connector |
US6193523B1 (en) * | 1999-04-29 | 2001-02-27 | Berg Technology, Inc. | Contact for electrical connector |
EP1363363B1 (en) | 1999-07-02 | 2004-09-22 | Shin-Etsu Polymer Co., Ltd. | Tubular circuit connector |
US6794890B1 (en) * | 1999-07-27 | 2004-09-21 | Mitsubishi Denki Kabushiki Kaisha | Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested |
EP1094556B1 (en) * | 1999-10-20 | 2003-05-02 | Fci | Low profile high density sockets |
DE19963406A1 (de) * | 1999-12-28 | 2001-07-12 | Nokia Mobile Phones Ltd | Kontaktelement |
JP4323055B2 (ja) * | 2000-03-22 | 2009-09-02 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置試験用コンタクタ及びその製造方法 |
US6722896B2 (en) | 2001-03-22 | 2004-04-20 | Molex Incorporated | Stitched LGA connector |
US6730134B2 (en) * | 2001-07-02 | 2004-05-04 | Intercon Systems, Inc. | Interposer assembly |
US6781390B2 (en) | 2001-07-20 | 2004-08-24 | Nhk Spring Co., Ltd. | Conductive coil contact member |
TW547771U (en) | 2002-07-23 | 2003-08-11 | Via Tech Inc | Elastic electrical contact package structure |
WO2005119848A1 (en) | 2004-05-28 | 2005-12-15 | Molex Incorporated | Flexible ring interconnection system |
-
2005
- 2005-05-27 DE DE602005003351T patent/DE602005003351T2/de not_active Expired - Fee Related
- 2005-05-27 EP EP05755116A patent/EP1749334B1/en not_active Expired - Fee Related
- 2005-05-27 US US11/140,232 patent/US7284991B2/en not_active Expired - Fee Related
- 2005-05-27 WO PCT/US2005/018946 patent/WO2005119849A1/en active IP Right Grant
- 2005-05-27 JP JP2007513492A patent/JP4456149B2/ja not_active Expired - Fee Related
- 2005-05-27 KR KR1020067024814A patent/KR100883455B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100883455B1 (ko) | 2009-02-16 |
JP2007537579A (ja) | 2007-12-20 |
US20050277309A1 (en) | 2005-12-15 |
WO2005119849A1 (en) | 2005-12-15 |
EP1749334A1 (en) | 2007-02-07 |
DE602005003351T2 (de) | 2008-09-11 |
DE602005003351D1 (de) | 2007-12-27 |
EP1749334B1 (en) | 2007-11-14 |
KR20070012725A (ko) | 2007-01-26 |
US7284991B2 (en) | 2007-10-23 |
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