JP4441671B2 - 金属−セラミックス接合回路基板の製造方法 - Google Patents
金属−セラミックス接合回路基板の製造方法 Download PDFInfo
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- JP4441671B2 JP4441671B2 JP2003329278A JP2003329278A JP4441671B2 JP 4441671 B2 JP4441671 B2 JP 4441671B2 JP 2003329278 A JP2003329278 A JP 2003329278A JP 2003329278 A JP2003329278 A JP 2003329278A JP 4441671 B2 JP4441671 B2 JP 4441671B2
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- 239000000919 ceramic Substances 0.000 title claims description 105
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 238000000034 method Methods 0.000 title claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 139
- 239000002184 metal Substances 0.000 claims description 139
- 239000000758 substrate Substances 0.000 claims description 74
- 238000005530 etching Methods 0.000 claims description 27
- 238000001816 cooling Methods 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000009413 insulation Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
下側鋳型部材の底面に、回路パターンに略対応する部分の厚さが0.6mmであり、隣接するパターン間の部分の厚さが0.3mmであり且つそれらの間隔が0.8mmである回路用金属板(図3(a)を参照)と略等しい形状および大きさの凹部である回路用金属板形成部が形成され、この回路用金属板形成部の上部に隣接して、32.5mm×40mm×0.635mmの大きさのセラミックス基板と略等しい形状および大きさの凹部であるセラミックス基板収容部が形成され、このセラミックス基板収容部の上部に隣接して、金属ベース板形成部が形成され、金属ベース板形成部と回路用金属板形成部との間に延びる溶湯流路が形成されたカーボン製の鋳型を用意した。
セラミックス基板の大きさを32.5mm×74mm×0.635mm(実施例2)、32.5mm×40mm×0.25mm(実施例3)、32.5mm×74mm×0.25mm(実施例4)とし、下側鋳型部材のセラミックス基板収容部の大きさをそれぞれのセラミックス基板の大きさと略等しい大きさにした以外は、実施例1と同様の方法により、金属−セラミックス接合回路基板を得た。
セラミックス基板をアルミナ基板にした以外は、実施例1〜4と同様の方法により、金属−セラミックス接合回路基板を得た。
図4(a)に示すように、回路用金属板12の隣接するパターン間の間隔を0.3mmとし、隣接するパターンに印刷するエッチングレジスト16の間隔を0.5mmとした以外は、実施例1と同様の方法により、図4(b)に示すように、隣接するパターンのパターンボトム間の距離(絶縁距離)が1.0mmの所望の回路パターンの金属回路板12を有する金属−セラミックス接合回路基板を得た。
セラミックス基板の大きさを32.5mm×74mm×0.635mm(実施例10)、32.5mm×40mm×0.25mm(実施例11)、32.5mm×74mm×0.25mm(実施例12)とし、下側鋳型部材のセラミックス基板収容部の大きさをそれぞれのセラミックス基板の大きさと略等しい大きさにした以外は、実施例1と同様の方法により、金属−セラミックス接合回路基板を得た。
セラミックス基板をアルミナ基板にした以外は、実施例9〜12と同様の方法により、金属−セラミックス接合回路基板を得た。
回路用金属板形成部の深さを0.6mmの一定の深さにした以外は実施例1〜8と同様の方法により、金属−セラミックス接合回路基板を得た。
12 回路用金属板(金属回路板)
14 金属ベース板
16 エッチングレジスト
100 下側鋳型部材
100a 底面部
100b 側壁部
100c 凹部
100d 回路用金属板形成部
100e セラミックス基板収容部
100f 金属ベース板形成部
Claims (8)
- 内部にセラミックス基板と略等しい形状および大きさのセラミックス基板収容部とこのセラミックス基板収容部に隣接する金属板形成部が形成された鋳型を使用して、金属溶湯をセラミックス基板の一方の面に接触するように鋳型の金属板形成部内に注湯した後に冷却して固化させることによりセラミックス基板の一方の面に金属板を接合し、この金属板をエッチング処理して所望の回路パターンの金属回路板を形成することにより金属−セラミックス接合回路基板を製造する方法において、金属板をセラミックス基板に接合する際に、金属板の形状が回路パターンに類似した形状になり且つ回路パターンに略対応する部分以外の厚さが回路パターンに略対応する部分の厚さよりも薄くなるように金属板を形成することを特徴とする、金属−セラミックス接合回路基板の製造方法。
- 前記回路パターンに略対応する部分以外の厚さを、前記回路パターンに略対応する部分の厚さの1/2以下にすることを特徴とする、請求項1に記載の金属−セラミックス接合回路基板の製造方法。
- 前記回路パターンに略対応する部分の厚さが0.1〜0.3mmであることを特徴とする、請求項1または2に記載の金属−セラミックス接合回路基板の製造方法。
- 前記金属板形成部が、前記金属回路板の回路パターンに類似し且つ回路パターンに略対応する部分以外の深さを回路パターンに略対応する部分の深さよりも浅くした形状を有することを特徴とする、請求項1に記載の金属−セラミックス接合回路基板の製造方法。
- 内部にセラミックス基板と略等しい形状および大きさのセラミックス基板収容部とこのセラミックス基板収容部に隣接する金属板形成部が形成された鋳型を用意し、この鋳型のセラミックス基板収容部内にセラミックス基板を設置した後、金属溶湯をセラミックス基板の一方の面に接触するように鋳型の金属板形成部内に注湯し、冷却して固化させることによりセラミックス基板の一方の面に金属板を接合し、この金属板をエッチング処理して所望の回路パターンの金属回路板を形成することにより金属−セラミックス接合回路基板を製造する方法において、鋳型の金属板形成部が、回路パターンに類似し且つ回路パターンに略対応する部分以外の深さを回路パターンに略対応する部分の深さよりも浅くした形状を有することを特徴とする、金属−セラミックス接合回路基板の製造方法。
- 前記回路パターンに略対応する部分以外の深さが0.1〜0.3mmであることを特徴とする、請求項5に記載の金属−セラミックス接合回路基板の製造方法。
- 前記金属溶湯を前記セラミックス基板の一方の面に接触させる際に、前記金属溶湯を前記セラミックス基板の他方の面に接触させ、冷却して固化させることにより前記セラミックス基板の他方の面に金属部材を接合することを特徴とする、請求項1乃至6のいずれかに記載の金属−セラミックス接合回路基板の製造方法。
- 前記金属溶湯がアルミニウムを主成分とする溶湯であることを特徴とする、請求項1乃至7のいずれかに記載の金属−セラミックス接合回路基板の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003329278A JP4441671B2 (ja) | 2003-09-22 | 2003-09-22 | 金属−セラミックス接合回路基板の製造方法 |
EP04022435.4A EP1517370B1 (en) | 2003-09-22 | 2004-09-21 | Method for producing a metal/ceramic bonded circuit board |
US10/948,695 US7340828B2 (en) | 2003-09-22 | 2004-09-22 | Method for producing metal/ceramic bonding circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2003329278A JP4441671B2 (ja) | 2003-09-22 | 2003-09-22 | 金属−セラミックス接合回路基板の製造方法 |
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JP2007314181A Division JP2008098662A (ja) | 2007-12-05 | 2007-12-05 | 金属−セラミックス接合回路基板の製造方法 |
Publications (2)
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JP2005093965A JP2005093965A (ja) | 2005-04-07 |
JP4441671B2 true JP4441671B2 (ja) | 2010-03-31 |
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JP2003329278A Expired - Lifetime JP4441671B2 (ja) | 2003-09-22 | 2003-09-22 | 金属−セラミックス接合回路基板の製造方法 |
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US (1) | US7340828B2 (ja) |
EP (1) | EP1517370B1 (ja) |
JP (1) | JP4441671B2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4543279B2 (ja) * | 2004-03-31 | 2010-09-15 | Dowaメタルテック株式会社 | アルミニウム接合部材の製造方法 |
JP5214546B2 (ja) * | 2009-07-01 | 2013-06-19 | Dowaメタルテック株式会社 | 端子付き金属−セラミックス回路基板の製造方法 |
JP5554599B2 (ja) * | 2010-03-24 | 2014-07-23 | Dowaメタルテック株式会社 | 金属−セラミックス接合回路基板の製造方法 |
JP5637719B2 (ja) * | 2010-03-31 | 2014-12-10 | Dowaメタルテック株式会社 | 金属セラミックス接合回路基板の製造方法 |
TWI502709B (zh) * | 2011-08-26 | 2015-10-01 | Viking Tech Corp | Metallographic Ceramic Plate Method |
CN103338588B (zh) * | 2013-06-04 | 2016-04-20 | 苏州晶品光电科技有限公司 | 高导热绝缘金属基印刷电路板 |
CN103327736B (zh) * | 2013-06-04 | 2015-12-23 | 苏州晶品光电科技有限公司 | 高导热绝缘金属基印刷电路板 |
CN103327735B (zh) * | 2013-06-04 | 2015-12-23 | 苏州晶品光电科技有限公司 | 高导热绝缘金属基印刷电路板 |
CN103354697B (zh) * | 2013-06-17 | 2016-04-20 | 苏州晶品光电科技有限公司 | 用于光学和电子器件的图案化复合陶瓷层印刷线路基板 |
CN103354698B (zh) * | 2013-06-17 | 2016-02-24 | 苏州晶品光电科技有限公司 | 用于光学和电子器件的图案化陶瓷层印刷线路基板 |
CN103354220B (zh) * | 2013-06-17 | 2016-04-20 | 苏州晶品光电科技有限公司 | 用于光学和电子器件的图案化结构基板 |
CN103354222B (zh) * | 2013-06-17 | 2016-01-13 | 苏州晶品光电科技有限公司 | 用于光学和电子器件的多层复合陶瓷层图案化结构基板 |
JP6345957B2 (ja) * | 2014-03-24 | 2018-06-20 | Dowaメタルテック株式会社 | 金属−セラミックス回路基板およびその製造方法 |
DE202014106063U1 (de) * | 2014-12-16 | 2015-02-12 | Danfoss Silicon Power Gmbh | Kühlwanne, Kühler und Leistungsmodulbaugruppe |
JP6566586B2 (ja) * | 2018-04-11 | 2019-08-28 | Dowaメタルテック株式会社 | 金属−セラミックス回路基板およびその製造方法 |
JP7157609B2 (ja) * | 2018-09-27 | 2022-10-20 | Dowaメタルテック株式会社 | 金属-セラミックス接合基板およびその製造方法 |
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JPS58180094A (ja) * | 1982-04-16 | 1983-10-21 | 株式会社日立製作所 | 多層プリント配線板の製造方法 |
JPH03102892A (ja) * | 1989-09-18 | 1991-04-30 | Denki Kagaku Kogyo Kk | 回路基板の製造方法 |
JP4756200B2 (ja) * | 2000-09-04 | 2011-08-24 | Dowaメタルテック株式会社 | 金属セラミックス回路基板 |
JP4028452B2 (ja) * | 2003-08-27 | 2007-12-26 | Dowaホールディングス株式会社 | 電子部品搭載基板およびその製造方法 |
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JP2005093965A (ja) | 2005-04-07 |
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US20050060887A1 (en) | 2005-03-24 |
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