JP4432341B2 - Ceramic plate firing method - Google Patents

Ceramic plate firing method Download PDF

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Publication number
JP4432341B2
JP4432341B2 JP2003080873A JP2003080873A JP4432341B2 JP 4432341 B2 JP4432341 B2 JP 4432341B2 JP 2003080873 A JP2003080873 A JP 2003080873A JP 2003080873 A JP2003080873 A JP 2003080873A JP 4432341 B2 JP4432341 B2 JP 4432341B2
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ceramic plate
ceramic
firing
holding member
plate
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JP2004284900A (en
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誠志 佐々木
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TDK Corp
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TDK Corp
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Priority to TW093106953A priority patent/TW200502194A/en
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Description

【0001】
【発明の属する技術分野】
本発明は、圧電アクチュエータや圧電センサ等に用いられる積層型圧電基板等のセラミック板の焼成方法に関する。
【0002】
【従来の技術】
従来におけるセラミック板の焼成方法は、例えば下記の特許文献1に開示されている。この特許文献1記載の焼成方法においては、対面するセッターの下側のセッター上にセラミック板を載置し、セラミック板と上側のセッターとの間に所定間隔の隙間が形成されるよう、セラミック板と同じ収縮特性を有する支柱によって上側のセッターを下側のセッター上に支持する。この状態で焼成を行うと、セラミック板と共に支柱も収縮するため、セラミック板と上側のセッターとの間の隙間を所定間隔に保つことができる。
【0003】
【特許文献1】
特開平10−324574号公報
【0004】
【発明が解決しようとする課題】
しかしながら、上述した焼成方法にあっては、対面するセッター間におけるセラミック板の周囲部が開放されているため、セラミック板と上側のセッターとの間における雰囲気の濃度が焼成中均一に保たれず、セラミック板の収縮が場所によって不均一となり、焼成後のセラミック板に反りやうねりが生じるおそれがある。この問題は、セラミック板の厚さが薄型化されるほど顕著になる。
【0005】
そこで、本発明は、このような事情に鑑みてなされたものであり、焼成後のセラミック板に反りやうねりが生じるのを防止することのできるセラミック板の焼成方法を提供する。
【0006】
【課題を解決するための手段】
上記目的を達成するために、本発明に係るセラミック板の焼成方法は、第1の保持部材と第2の保持部材との間にセラミック板を配置して焼成するセラミック板の焼成方法であって、第1の保持部材上に載置されたセラミック板と第2の保持部材との間に、セラミック板の厚さ以下の隙間が設けられるように、第1の保持部材と第2の保持部材との間におけるセラミック板の周囲部に、第1の保持部材と第2の保持部材との間隙を保持するスペーサを複数配置すると共に、セラミック板から所定の距離が設けられるように、隣り合うスペーサ間に、セラミック板と同一組成のセラミック材料により形成され且つセラミック板の厚さと同一の高さを有する包囲部材を配置して、セラミック板を脱脂及び焼成することを特徴とする。
【0007】
このセラミック板の焼成方法においては、第1の保持部材と第2の保持部材との間におけるセラミック板の周囲部が、セラミック板とほぼ同一組成のセラミック材料により形成された包囲部材によって包囲されているため、セラミック板が配置された雰囲気の濃度が焼成中均一に保持される。したがって、焼成によるセラミック板の収縮が均一化されて、焼成後のセラミック板に反りやうねりが生じるのを防止することができる。
【0008】
なお、セラミック板とは、セラミックシートの単板は勿論、複数のセラミックシートを積層してなる板状の積層体を含む意味であり、セラミックシートを基板として電極等が形成されたものも含む。
【0009】
そして、本発明に係るセラミック板の焼成方法は、セラミック板を形成するセラミック材料が鉛を含有する化合物を含んでいる場合に特に有効である。チタン酸鉛やチタン酸ジルコン酸鉛等、鉛を含有する化合物中の鉛は焼成により蒸発し易いが、包囲部材がセラミック板とほぼ同一組成のセラミック材料により形成されているため、セラミック板が配置された雰囲気中には、鉛を含有する化合物中の鉛が包囲部材から放出される。これにより、鉛を含有する化合物中の鉛がセラミック板から蒸発することが抑制され、しかも、セラミック板が配置された雰囲気中における鉛の濃度が焼成中均一に保たれる。したがって、焼成によるセラミック板の収縮が一定化されて、焼成後のセラミック板に反りやうねりが生じるのを防止することができる。
【0010】
また、セラミック板は第1の保持部材上に載置され、セラミック板と第2の保持部材との間には、セラミック板の厚さ以下の隙間が設けられる。このように、セラミック板と第2の保持部材との間にセラミック板の厚さ以下の隙間を設けて焼成を行うと、セラミック板が配置された雰囲気の濃度の均一化が促進されるため、セラミック板に反りやうねりが生じるのをより一層抑制することができる。
【0011】
また、包囲部材は、セラミック板の厚さと同一の高さを有する。このような状態で焼成を行うと、上記と同様に、セラミック板が配置された雰囲気の濃度の均一化が促進され、セラミック板に反りやうねりが生じるのをより一層抑制することができる。しかも、第2の保持部材をセラミック板に近付けるに際し、包囲部材が障害となることがないため、セラミック板と第2の保持部材との間の隙間をセラミック板の厚さ以下に設定する場合に特に有効である。
【0012】
また、包囲部材は、セラミック板から所定の距離をもって配置される。セラミック板と包囲部材と間に所定の距離をとることで、セラミック板の厚さや組成等に応じて当該セラミック板における反りやうねりの発生が抑制されるよう、セラミック板が配置される雰囲気の濃度を調節することができる。
【0013】
また、セラミック板の周囲部には、第1の保持部材と第2の保持部材との間隙を保持するスペーサが複数配置され、隣り合うスペーサ間には包囲部材が配置される。このように、隣り合うスペーサ間に包囲部材を配置することで、保持部材の小型化、ひいては省スペース化を図ることができる。
【0014】
また、セラミック板は、セラミック素材から取り出され、包囲部材は、セラミック板が取り出されたセラミック素材の残余部分により形成されることが好ましい。例えば、グリーンシートの単板やグリーンシートの積層体等のセラミック素材から、打ち抜き等によりセラミック板を取り出した際に、セラミック素材の残余部分により包囲部材を形成すれば、セラミック板とほぼ同一組成のセラミック材料を含む包囲部材を効率良く形成することができる。しかも、一般に廃材となるセラミック素材の残余部分を利用することで、セラミック板の焼成に要するコストの低廉化を図ることがきる。
【0015】
【発明の実施の形態】
以下、本発明の好適な実施形態について、図面を参照して詳細に説明する。
【0016】
[第1実施形態]
図1及び図2に示すように、10mm×10mmの正方形状に形成された緻密質(気孔率3%以下、より好ましくは気孔率1%以下)のジルコニアセッター(第1の保持部材)1上にセラミック板2を載置する。ジルコニアセッター1は、焼成中におけるセラミック板2との反応性が低く且つ耐久性が良好であることから、3mol%〜8mol%のイットリア(Y203)で安定化されたものが好ましい。また、セラミック板2は、チタン酸ジルコン酸鉛を含む圧電セラミック(より詳細には、PbTiO3−PbZrO3−Pb(Mg1/3 Nb2/3)O3−Pb(Zn1/3 Nb2/3)O3の4成分系圧電セラミック)により形成された単板であり、次のように作製されたものである。
【0017】
すなわち、酸化物又は炭酸塩の形態の材料をボールミルにより湿式混合し、混合後950℃にて仮焼成を行う。この仮焼成後の材料をボールミルにて湿式粉砕して圧電セラミック粉体を用意する。続いて、この圧電セラミック粉体にバインダや溶剤等を加えてスラリー化し、押し出し成形法によって厚さ0.15mmのグリーンシート(セラミック素材)を成形する。このグリーンシートを押し切り切断して、「80mm×80mm,厚さ0.15mm」の正方形薄板状のセラミック板2を得る。
【0018】
このように作製されたセラミック板2をジルコニアセッター1の中央に配置し、これにより形成されるジルコニアセッター1上の余白部の四隅に、高さ0.30mmのスペーサ3を載置する。さらに、ジルコニアセッター1上の隣り合うスペーサ3,3間に棒状の包囲部材4を載置する。このとき、4本の包囲部材4のそれぞれを、セラミック板2の4つ側面2aのそれぞれから一定距離離間させる。このように、隣り合うスペーサ3,3間に包囲部材4を配置することで、ジルコニアセッター1の小型化を図ることができる。なお、スペーサ3は、ジルコニアセッター1と同材質で構成されていることが好ましいが、アルミナやマグネシア等の材質で構成されていてもよい。そして、スペーサ3の形状は、角柱状に限らず、例えば円柱状でもあってもよい。また、各包囲部材4は、上述したセラミック板2の作製において、セラミック板2が切り出されたグリーンシートの残余部分から形成されたものである。
【0019】
そして、ジルコニアセッター1と同形状のジルコニアセッター(第2の保持部材)5を、ジルコニアセッター1と対面するようスペーサ3上に載置する。これにより、セラミック板2の上面2bとジルコニアセッター5の下面5aとの間に、間隔0.15mmの隙間Sが形成される。
【0020】
以上のように構成された焼成ユニット10を、図3に示すように密閉匣鉢7内に収容して加熱する。これにより、セラミック板2の焼結反応が起こり、セラミック板2の焼成体が得られる。なお、焼成温度は1100℃、安定時間は2時間である。また、このセラミック板2の焼成前に、ジルコニアセッター1上の上記所定の位置にセラミック板1及び各包囲部材4を載置した状態で350℃にて加熱を行い、セラミック板1及び各包囲部材4の脱脂を行った。
【0021】
本第1実施形態に係るセラミック板の焼成方法においては、ジルコニアセッター1,5間におけるセラミック板2の周囲部(周囲空間)が、セラミック板2とほぼ同一組成のセラミック材料からなる包囲部材4によって包囲されているため、セラミック板2とジルコニアセッター5との隙間Sにチタン酸ジルコン酸鉛中の鉛が各包囲部材4から放出される。これにより、セラミック板2からのチタン酸ジルコン酸鉛中の鉛の蒸発が抑制され、しかも、隙間Sにおける鉛の濃度が焼成中均一に保たれることになる。したがって、焼成によるセラミック板2の収縮が均一化されて、焼成後のセラミック板2に反りやうねりが生じるのを防止することができる。
【0022】
そして、隙間Sの間隔をセラミック板2の厚さ以下にすると、焼成後のセラミック板2の反りを極めて小さくし得ることが、次に示す実験結果から明らかとなった。その主な理由としては、隙間Sの間隔をセラミック板2の厚さ以下にして焼成を行うと、隙間Sにおける鉛の濃度の均一化が促進されるため、ということを挙げることができる。
【0023】
まず、上述のように隙間Sの間隔を0.15mm(=セラミック板2の厚さ)にすると、反り量は15.7μmであり、さらに、隙間Sの間隔を0.10mm(<セラミック板2の厚さ)にすると、反り量は15.5μmであった。これらに対し、隙間Sの間隔を0.30mm(>セラミック板2の厚さ)にすると、反り量は95.5μmであった。このように、隙間Sの間隔をセラミック板2の厚さ以下にすると、反り量を6分の1程度にまで抑えることができる。ここで、反り量とは、レーザ式の非接触3次元形状測定装置を用いて測定したセラミック板2の最大高低差であり、100枚のセラミック板2についての平均値である。
【0024】
なお、隙間Sの間隔を0.10mm以下とすると、正方形状であったセラミック板2が台形や平行四辺形等に歪んだり、セラミック板2に割れや欠けが発生したりする傾向が若干確認された。したがって、隙間Sの間隔を0.10mmより大きくすることがより好ましい。また、緻密質のジルコニアセッター1,5に換えて、多孔質(気孔率約15%)のジルコニアセッターを用いた場合には、反り量が増加する傾向が若干確認された。
【0025】
また、本第1実施形態に係るセラミック板の焼成方法においては、包囲部材4の高さがセラミック板2の厚さとほぼ同一であるため、スペーサ3の高さを調節してジルコニアセッター5をセラミック板2に近付ける場合に、包囲部材4が障害となることがない。
【0026】
また、各包囲部材4がセラミック板2の側面2aから一定距離離間しているため、セラミック板2上の隙間Sにおける鉛の濃度の均一化を図ることができる。しかも、セラミック板2の側面2aと包囲部材4との距離を調節することで、セラミック板2の厚さや組成等に応じて当該セラミック板2における反りやうねりの発生が抑制されるよう、隙間Sにおける鉛の濃度を調節することができる。
【0027】
さらに、包囲部材4は、セラミック板2を切り出したグリーンシートの残余部分であるため、セラミック板2とほぼ同一組成のセラミック材料からなる包囲部材4を効率良く形成することができる。しかも、一般に廃材となるグリーンシートの残余部分を利用するため、セラミック板2の焼成に要するコストの低廉化、及び廃材の発生量の減少化を図ることができる。
【0028】
[第2実施形態]
第2実施形態に係るセラミック板の焼成方法においては、セラミック板2として、電極がパターン形成されたセラミックシートの積層体を用いた。このセラミック板2は、プレス処理後のグリーンシートの積層体(セラミック素材)から押し切りにより10枚取り出されたものであり、「33mm×12mm,厚さ0.375mm」の長方形薄板状に形成されている。なお、セラミック板2は、以下に示す焼成後、分極処理等が施されて積層型圧電素子となる。
【0029】
図4及び図5に示すように、グリーンシートの積層体から切り出された10枚のセラミック板2をジルコニアセッター1上に載置し、ジルコニアセッター1の中央に2行5列のマットリックス状に配置する。そして、セラミック板2の集合の周囲部を包囲するように、4本の棒状の包囲部材4をジルコニアセッター1上に載置する。さらに、ジルコニアセッター1上の余白部の四隅に、高さ0.75mmのスペーサ3を載置する。なお、各包囲部材4は、セラミック板2が切り出されたグリーンシートの積層体の残余部分から形成されたものである。
【0030】
そして、ジルコニアセッター1と同形状のジルコニアセッター5を、ジルコニアセッター1と対面するようスペーサ3上に載置する。これにより、各セラミック板2の上面2bとジルコニアセッター5の下面5aとの間に、間隔0.375mmの隙間Sが形成される。
【0031】
以上のように構成された焼成ユニット10を、350℃で脱脂後、上述した第1実施形態と同様に密閉匣鉢7内に収容して加熱する。これにより、セラミック板2の焼結反応が起こり、セラミック板2の焼成体が得られる。なお、焼成温度は1100℃、安定時間は2時間である。
【0032】
本第2実施形態に係るセラミック板の焼成方法においても、上述した第1実施形態と同様に、ジルコニアセッター1,5間における各セラミック板2の周囲部が、セラミック板2とほぼ同一組成のセラミック材料からなる包囲部材4によって包囲されていることから、焼成による各セラミック板2の収縮が均一化されて、焼成後の各セラミック板2に反りやうねりが生じるのを防止することができる。
【0033】
そして、第1の実施形態と同様の実験による実験結果は次の通りである。まず、上述のように隙間Sの間隔を0.375mm(=セラミック板2の厚さ)にすると、反り量は13.5μmであり、さらに、隙間Sの間隔を0.10mm(<セラミック板2の厚さ)にすると、反り量は13.3μmであった。これらに対し、隙間Sの間隔を0.825mm(>セラミック板2の厚さ)にすると、反り量は92.6μmであった。このように、隙間Sの間隔をセラミック板2の厚さ以下にすると、反り量を7分の1程度にまで抑えることができる。
【0034】
本発明は、上記第1及び第2実施形態には限定されない。例えば、包囲部材は、セラミック板とほぼ同一組成のセラミック材料により形成されたものであれば、セラミック板が取り出されたセラミック素材の残余部分でなくてもよい。なお、包囲部材とセラミック板とを同一組成のセラミック材料から形成しても、ほぼ同一組成のセラミック材料から形成した場合と同等又はそれ以上の効果が奏されることは勿論である。また、上記第1及び第2実施形態は、複数の包囲部材によってセラミック板の周囲部を包囲する場合であったが、リング状の包囲部材によってセラミック板の周囲部を包囲してもよい。また、包囲部材の高さとセラミック板の厚さとがほぼ同一でなくとも(例えば、包囲部材の高さがセラミック板の厚さより小さくても)、焼成後のセラミック板に反りやうねりが生じるのを防止することが可能である。さらに、図6に示すように、第1実施形態に係る焼成ユニットや第2実施形態に係る焼成ユニットを複数段(例えば10段)積み重ねて密閉匣鉢に収容し、複数のセラミック板の焼成を同時に行ってもよい。
【0035】
【発明の効果】
以上説明したように本発明によれば、焼成後のセラミック板に反りやうねりが生じるのを防止することができる。
【図面の簡単な説明】
【図1】第1実施形態に係る焼成ユニットの部分断面正面図である。
【図2】図1に示す焼成ユニットの一部を切り欠いた平面図である。
【図3】図1に示す焼成ユニットを密閉匣鉢に収容した状態を示す部分断面正面図である。
【図4】第2実施形態に係る焼成ユニットの部分断面正面図である。
【図5】図4に示す焼成ユニットの一部を切り欠いた平面図である。
【図6】焼成ユニットを複数段積み重ねて密閉匣鉢に収容した状態を示す部分断面正面図である。
【符号の説明】
1…ジルコニアセッター(第1の保持部材)、2…セラミック板、3…スペーサ、4…包囲部材、5…ジルコニアセッター(第2の包囲部材)。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for firing a ceramic plate such as a laminated piezoelectric substrate used for a piezoelectric actuator, a piezoelectric sensor, or the like.
[0002]
[Prior art]
A conventional method for firing a ceramic plate is disclosed, for example, in Patent Document 1 below. In the firing method described in Patent Document 1, the ceramic plate is placed on the lower setter of the setter facing the ceramic plate so that a gap of a predetermined interval is formed between the ceramic plate and the upper setter. The upper setter is supported on the lower setter by struts having the same shrinkage properties. When firing in this state, the struts contract together with the ceramic plate, so that the gap between the ceramic plate and the upper setter can be kept at a predetermined interval.
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-324574 [0004]
[Problems to be solved by the invention]
However, in the firing method described above, since the peripheral portion of the ceramic plate between the setters facing each other is open, the concentration of the atmosphere between the ceramic plate and the upper setter is not kept uniform during firing, There is a possibility that the ceramic plate shrinks unevenly depending on the location, and the fired ceramic plate is warped or swelled. This problem becomes more prominent as the thickness of the ceramic plate is reduced.
[0005]
Therefore, the present invention has been made in view of such circumstances, and provides a method for firing a ceramic plate that can prevent warping and undulation from occurring in the fired ceramic plate.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a method for firing a ceramic plate according to the present invention is a method for firing a ceramic plate in which a ceramic plate is disposed between a first holding member and a second holding member for firing. The first holding member and the second holding member are provided so that a gap equal to or less than the thickness of the ceramic plate is provided between the ceramic plate placed on the first holding member and the second holding member. A plurality of spacers that hold a gap between the first holding member and the second holding member are disposed around the ceramic plate between the adjacent spacers, and adjacent spacers are provided at a predetermined distance from the ceramic plate. The ceramic plate is degreased and fired by disposing an enclosing member made of a ceramic material having the same composition as the ceramic plate and having the same height as the thickness of the ceramic plate.
[0007]
In this method of firing a ceramic plate, the peripheral portion of the ceramic plate between the first holding member and the second holding member is surrounded by an enclosing member formed of a ceramic material having substantially the same composition as the ceramic plate. Therefore, the concentration of the atmosphere in which the ceramic plate is disposed is kept uniform during firing. Accordingly, the shrinkage of the ceramic plate due to firing can be made uniform, and warpage and undulation can be prevented from occurring in the fired ceramic plate.
[0008]
The ceramic plate means not only a single plate of a ceramic sheet but also a plate-like laminate formed by laminating a plurality of ceramic sheets, and includes those in which electrodes and the like are formed using the ceramic sheet as a substrate.
[0009]
And the firing method of the ceramic board which concerns on this invention is especially effective when the ceramic material which forms a ceramic board contains the compound containing lead. Lead in lead-containing compounds such as lead titanate and lead zirconate titanate is easy to evaporate by firing, but the ceramic plate is placed because the surrounding member is made of a ceramic material with almost the same composition as the ceramic plate In the atmosphere, lead in the lead-containing compound is released from the surrounding member. Thereby, it is suppressed that the lead in the compound containing lead evaporates from the ceramic plate, and the lead concentration in the atmosphere in which the ceramic plate is arranged is kept uniform during firing. Therefore, the shrinkage of the ceramic plate due to firing is made constant, and it is possible to prevent warping and undulation from occurring in the fired ceramic plate.
[0010]
Further, the ceramic plate is placed on the first holding member, is provided between the ceramic plate and the second holding member, Ru thickness following clearance of the ceramic plate is provided. In this way, when firing is performed by providing a gap equal to or less than the thickness of the ceramic plate between the ceramic plate and the second holding member, the uniformity of the concentration of the atmosphere in which the ceramic plate is disposed is promoted. It is possible to further suppress the warpage and undulation of the ceramic plate.
[0011]
Furthermore, the enclosing member is that having a thickness the same height as the ceramic plate. When firing in such a state, similarly to the above, the concentration of the atmosphere in which the ceramic plate is arranged is promoted, and the warpage and undulation of the ceramic plate can be further suppressed. In addition, when the second holding member is brought close to the ceramic plate, the surrounding member does not become an obstacle, and therefore, when the gap between the ceramic plate and the second holding member is set to be equal to or less than the thickness of the ceramic plate. It is particularly effective.
[0012]
Furthermore, the enclosing member is Ru are arranged at a predetermined distance from the ceramic plate. The concentration of the atmosphere in which the ceramic plate is arranged so that the occurrence of warpage and undulation in the ceramic plate is suppressed according to the thickness and composition of the ceramic plate by taking a predetermined distance between the ceramic plate and the surrounding member Can be adjusted.
[0013]
Around part of the ceramic plate, a spacer for holding the gap between the first holding member and the second holding member is more disposed, between adjacent spacers Ru is arranged enclosing member. As described above, by arranging the surrounding member between the adjacent spacers, the holding member can be reduced in size and space-saving.
[0014]
Further, it is preferable that the ceramic plate is taken out from the ceramic material, and the surrounding member is formed by the remaining portion of the ceramic material from which the ceramic plate is taken out. For example, if the surrounding member is formed by the remaining part of the ceramic material when the ceramic plate is removed by punching from a ceramic material such as a single sheet of green sheets or a laminate of green sheets, the composition of the ceramic plate is almost the same. The surrounding member containing the ceramic material can be efficiently formed. In addition, the cost required for firing the ceramic plate can be reduced by utilizing the remaining portion of the ceramic material that is generally a waste material.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
[0016]
[First Embodiment]
As shown in FIGS. 1 and 2, on a dense zirconia setter (first holding member) 1 formed in a 10 mm × 10 mm square shape (porosity 3% or less, more preferably 1% or less). The ceramic plate 2 is placed on the surface. The zirconia setter 1 is preferably stabilized with 3 mol% to 8 mol% of yttria (Y203) because of its low reactivity with the ceramic plate 2 during firing and good durability. Further, the ceramic plate 2, the piezoelectric ceramic (more details, including lead zirconate titanate, PbTiO 3 -PbZrO 3 -Pb (Mg1 / 3 Nb2 / 3) O 3 -Pb (Zn1 / 3 Nb2 / 3) O 3 is a single plate formed by the following method.
[0017]
That is, materials in the form of oxides or carbonates are wet-mixed by a ball mill, and after the mixing, preliminary firing is performed at 950 ° C. The pre-fired material is wet pulverized with a ball mill to prepare a piezoelectric ceramic powder. Subsequently, a binder, a solvent, or the like is added to the piezoelectric ceramic powder to form a slurry, and a green sheet (ceramic material) having a thickness of 0.15 mm is formed by an extrusion method. The green sheet is cut and cut to obtain a ceramic sheet 2 having a square thin plate shape of “80 mm × 80 mm, thickness 0.15 mm”.
[0018]
The ceramic plate 2 produced in this way is arranged in the center of the zirconia setter 1, and the spacers 3 having a height of 0.30 mm are placed at the four corners of the blank portion on the zirconia setter 1 formed thereby. Further, a bar-shaped surrounding member 4 is placed between the adjacent spacers 3 on the zirconia setter 1. At this time, each of the four surrounding members 4 is separated from each of the four side surfaces 2 a of the ceramic plate 2 by a certain distance. Thus, the zirconia setter 1 can be reduced in size by arranging the surrounding member 4 between the adjacent spacers 3 and 3. The spacer 3 is preferably made of the same material as the zirconia setter 1, but may be made of a material such as alumina or magnesia. The shape of the spacer 3 is not limited to a prismatic shape, and may be a cylindrical shape, for example. Moreover, each surrounding member 4 is formed from the remaining part of the green sheet from which the ceramic plate 2 was cut out in the production of the ceramic plate 2 described above.
[0019]
Then, a zirconia setter (second holding member) 5 having the same shape as the zirconia setter 1 is placed on the spacer 3 so as to face the zirconia setter 1. As a result, a gap S with an interval of 0.15 mm is formed between the upper surface 2 b of the ceramic plate 2 and the lower surface 5 a of the zirconia setter 5.
[0020]
The firing unit 10 configured as described above is housed and heated in a closed bowl 7 as shown in FIG. Thereby, the sintering reaction of the ceramic plate 2 occurs, and a fired body of the ceramic plate 2 is obtained. The firing temperature is 1100 ° C. and the stabilization time is 2 hours. Before firing the ceramic plate 2, the ceramic plate 1 and the surrounding members 4 are heated at 350 ° C. with the ceramic plate 1 and the surrounding members 4 placed at the predetermined positions on the zirconia setter 1. 4 was degreased.
[0021]
In the method for firing a ceramic plate according to the first embodiment, the surrounding portion (surrounding space) of the ceramic plate 2 between the zirconia setters 1 and 5 is surrounded by the surrounding member 4 made of a ceramic material having substantially the same composition as the ceramic plate 2. Since it is surrounded, lead in the lead zirconate titanate is released from each surrounding member 4 into the gap S between the ceramic plate 2 and the zirconia setter 5. Thereby, evaporation of lead in the lead zirconate titanate from the ceramic plate 2 is suppressed, and the lead concentration in the gap S is kept uniform during firing. Accordingly, the shrinkage of the ceramic plate 2 due to firing can be made uniform, and the ceramic plate 2 after firing can be prevented from warping or waviness.
[0022]
And it became clear from the experimental result shown next that the curvature of the ceramic board 2 after baking can be made very small if the space | interval of the clearance gap S is made into the thickness of the ceramic board 2 or less. The main reason for this is that if firing is performed with the gap S being equal to or less than the thickness of the ceramic plate 2, the uniform concentration of lead in the gap S is promoted.
[0023]
First, when the gap S is 0.15 mm (= thickness of the ceramic plate 2) as described above, the amount of warpage is 15.7 μm, and the gap S is 0.10 mm (<ceramic plate 2). Thickness), the amount of warpage was 15.5 μm. On the other hand, when the gap S was set to 0.30 mm (> thickness of the ceramic plate 2), the amount of warpage was 95.5 μm. As described above, when the gap S is set to be equal to or smaller than the thickness of the ceramic plate 2, the amount of warpage can be suppressed to about 1/6. Here, the amount of warpage is the maximum height difference of the ceramic plates 2 measured using a laser-type non-contact three-dimensional shape measuring apparatus, and is an average value for 100 ceramic plates 2.
[0024]
When the gap S is set to 0.10 mm or less, there is a slight tendency that the square ceramic plate 2 is distorted into a trapezoid or a parallelogram or the ceramic plate 2 is cracked or chipped. It was. Therefore, it is more preferable to make the gap S larger than 0.10 mm. In addition, when a porous (porosity of about 15%) zirconia setter was used in place of the dense zirconia setters 1 and 5, there was a slight tendency for the amount of warpage to increase.
[0025]
In the ceramic plate firing method according to the first embodiment, since the height of the surrounding member 4 is substantially the same as the thickness of the ceramic plate 2, the height of the spacer 3 is adjusted so that the zirconia setter 5 is ceramic. When approaching the plate 2, the surrounding member 4 does not become an obstacle.
[0026]
Moreover, since each surrounding member 4 is spaced apart from the side surface 2a of the ceramic plate 2 by a certain distance, the lead concentration in the gap S on the ceramic plate 2 can be made uniform. In addition, by adjusting the distance between the side surface 2 a of the ceramic plate 2 and the surrounding member 4, the gap S is controlled so that the warpage or undulation in the ceramic plate 2 is suppressed according to the thickness or composition of the ceramic plate 2. The lead concentration in can be adjusted.
[0027]
Furthermore, since the surrounding member 4 is the remaining part of the green sheet from which the ceramic plate 2 is cut, the surrounding member 4 made of a ceramic material having substantially the same composition as the ceramic plate 2 can be efficiently formed. In addition, since the remaining portion of the green sheet that is generally a waste material is used, the cost required for firing the ceramic plate 2 can be reduced, and the amount of waste material generated can be reduced.
[0028]
[Second Embodiment]
In the method of firing a ceramic plate according to the second embodiment, a ceramic sheet laminate in which electrodes are patterned is used as the ceramic plate 2. This ceramic plate 2 is 10 sheets taken out by pressing from a green sheet laminate (ceramic material) after the press treatment, and is formed in a rectangular thin plate shape of “33 mm × 12 mm, thickness 0.375 mm”. Yes. In addition, the ceramic plate 2 is subjected to a polarization treatment or the like after firing as described below to become a multilayer piezoelectric element.
[0029]
As shown in FIGS. 4 and 5, 10 ceramic plates 2 cut out from the green sheet laminate are placed on the zirconia setter 1 in a matrix of 2 rows and 5 columns in the center of the zirconia setter 1. Deploy. Then, four bar-shaped surrounding members 4 are placed on the zirconia setter 1 so as to surround the periphery of the assembly of ceramic plates 2. Further, the spacers 3 having a height of 0.75 mm are placed at the four corners of the blank portion on the zirconia setter 1. In addition, each surrounding member 4 is formed from the remaining part of the laminated body of the green sheet from which the ceramic board 2 was cut out.
[0030]
Then, a zirconia setter 5 having the same shape as that of the zirconia setter 1 is placed on the spacer 3 so as to face the zirconia setter 1. Thereby, a gap S having an interval of 0.375 mm is formed between the upper surface 2b of each ceramic plate 2 and the lower surface 5a of the zirconia setter 5.
[0031]
The baking unit 10 configured as described above is degreased at 350 ° C., and then accommodated in the sealed mortar 7 and heated as in the first embodiment described above. Thereby, the sintering reaction of the ceramic plate 2 occurs, and a fired body of the ceramic plate 2 is obtained. The firing temperature is 1100 ° C. and the stabilization time is 2 hours.
[0032]
Also in the method of firing the ceramic plate according to the second embodiment, the ceramic plate 2 has a substantially same composition as the ceramic plate 2 in the periphery of each ceramic plate 2 between the zirconia setters 1 and 5 as in the first embodiment. Since it is surrounded by the surrounding member 4 made of a material, shrinkage of each ceramic plate 2 due to firing can be made uniform, and it is possible to prevent warping and undulation from occurring in each ceramic plate 2 after firing.
[0033]
And the experimental result by the same experiment as 1st Embodiment is as follows. First, when the gap S is 0.375 mm (= thickness of the ceramic plate 2) as described above, the amount of warpage is 13.5 μm, and the gap S is 0.10 mm (<ceramic plate 2). ), The amount of warpage was 13.3 μm. On the other hand, when the gap S was 0.825 mm (> thickness of the ceramic plate 2), the amount of warpage was 92.6 μm. As described above, when the gap S is set to be equal to or smaller than the thickness of the ceramic plate 2, the amount of warpage can be suppressed to about 1/7.
[0034]
The present invention is not limited to the first and second embodiments. For example, as long as the surrounding member is formed of a ceramic material having substantially the same composition as the ceramic plate, the surrounding member may not be the remaining portion of the ceramic material from which the ceramic plate is taken out. Of course, even if the surrounding member and the ceramic plate are formed of a ceramic material having the same composition, an effect equal to or greater than that of the case where the surrounding member and the ceramic plate are formed of a ceramic material having substantially the same composition can be obtained. Moreover, although the said 1st and 2nd embodiment was the case where the surrounding part of a ceramic board is surrounded by several surrounding members, you may surround the surrounding part of a ceramic board by a ring-shaped surrounding member. Further, even if the height of the surrounding member and the thickness of the ceramic plate are not substantially the same (for example, even if the height of the surrounding member is smaller than the thickness of the ceramic plate), the ceramic plate after firing is warped or undulated. It is possible to prevent. Furthermore, as shown in FIG. 6, the firing units according to the first embodiment and the firing units according to the second embodiment are stacked in a plurality of stages (for example, 10 stages) and accommodated in a sealed bowl, and firing of the plurality of ceramic plates is performed. You may do it at the same time.
[0035]
【The invention's effect】
As described above, according to the present invention, it is possible to prevent warping and undulation from occurring in the fired ceramic plate.
[Brief description of the drawings]
FIG. 1 is a partial cross-sectional front view of a firing unit according to a first embodiment.
FIG. 2 is a plan view in which a part of the firing unit shown in FIG. 1 is cut away.
FIG. 3 is a partial cross-sectional front view showing a state where the firing unit shown in FIG. 1 is housed in a closed mortar.
FIG. 4 is a partial cross-sectional front view of a firing unit according to a second embodiment.
FIG. 5 is a plan view in which a part of the firing unit shown in FIG. 4 is cut away.
FIG. 6 is a partial cross-sectional front view showing a state in which a plurality of firing units are stacked and accommodated in a closed bowl.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Zirconia setter (1st holding member), 2 ... Ceramic board, 3 ... Spacer, 4 ... Enclosing member, 5 ... Zirconia setter (2nd enclosing member).

Claims (3)

第1の保持部材と第2の保持部材との間にセラミック板を配置して焼成するセラミック板の焼成方法であって、
前記第1の保持部材上に載置された前記セラミック板と前記第2の保持部材との間に、前記セラミック板の厚さ以下の隙間が設けられるように、前記第1の保持部材と前記第2の保持部材との間における前記セラミック板の周囲部に、前記第1の保持部材と前記第2の保持部材との間隙を保持するスペーサを複数配置すると共に、前記セラミック板から所定の距離が設けられるように、隣り合う前記スペーサ間に、前記セラミック板と同一組成のセラミック材料により形成され且つ前記セラミック板の厚さと同一の高さを有する包囲部材を配置して、前記セラミック板を脱脂及び焼成することを特徴とするセラミック板の焼成方法。
A method of firing a ceramic plate in which a ceramic plate is disposed between a first holding member and a second holding member and fired.
The first holding member and the first holding member and the second holding member are provided with a gap equal to or less than the thickness of the ceramic plate between the ceramic plate placed on the first holding member and the second holding member. A plurality of spacers for holding a gap between the first holding member and the second holding member are disposed around the ceramic plate between the second holding member and a predetermined distance from the ceramic plate. The ceramic plate is degreased by disposing an enclosing member formed of a ceramic material having the same composition as the ceramic plate and having the same height as the thickness of the ceramic plate between the adjacent spacers. And firing the ceramic plate, characterized by firing.
前記セラミック板を形成するセラミック材料は、鉛を含有する化合物を含むことを特徴とする請求項1記載のセラミック板の焼成方法。  The method for firing a ceramic plate according to claim 1, wherein the ceramic material forming the ceramic plate contains a lead-containing compound. 前記セラミック板はセラミック素材から取り出され、
前記包囲部材は、前記セラミック板が取り出された前記セラミック素材の残余部分により形成されることを特徴とする請求項1又は2記載のセラミック板の焼成方法。
The ceramic plate is removed from the ceramic material;
The method of firing a ceramic plate according to claim 1 or 2 , wherein the surrounding member is formed by a remaining portion of the ceramic material from which the ceramic plate has been taken out.
JP2003080873A 2003-03-24 2003-03-24 Ceramic plate firing method Expired - Lifetime JP4432341B2 (en)

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