JP4426996B2 - 半導体装置および半導体装置の製造方法 - Google Patents
半導体装置および半導体装置の製造方法 Download PDFInfo
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- JP4426996B2 JP4426996B2 JP2005096276A JP2005096276A JP4426996B2 JP 4426996 B2 JP4426996 B2 JP 4426996B2 JP 2005096276 A JP2005096276 A JP 2005096276A JP 2005096276 A JP2005096276 A JP 2005096276A JP 4426996 B2 JP4426996 B2 JP 4426996B2
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- 239000004065 semiconductor Substances 0.000 title claims description 141
- 238000004519 manufacturing process Methods 0.000 title description 28
- 239000012535 impurity Substances 0.000 claims description 286
- 238000009792 diffusion process Methods 0.000 claims description 181
- 239000000758 substrate Substances 0.000 claims description 83
- 238000005513 bias potential Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 346
- 238000000034 method Methods 0.000 description 34
- 238000000926 separation method Methods 0.000 description 29
- 238000010586 diagram Methods 0.000 description 24
- 238000002474 experimental method Methods 0.000 description 13
- 238000002955 isolation Methods 0.000 description 12
- 150000002500 ions Chemical class 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0928—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising both N- and P- wells in the substrate, e.g. twin-tub
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823878—Complementary field-effect transistors, e.g. CMOS isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823892—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Description
また、上記の半導体装置100では、前記トランジスタ200と前記トランジスタ300が隣接するようにして形成されているが、このような構造に限定されるものではない。すなわち、前記分離層500には、必ずしもトランジスタ(ウェル)が形成されている必要はない。
前記半導体基板に形成された第1の導電型のウェルに形成されたトランジスタと、
前記ウェルの側面及び底面を囲う第2の導電型の不純物拡散層と、
前記半導体基板上であって前記不純物拡散層の外側に形成された端子と、
前記ウェルに接するように形成された導電層と、を有し
前記ウェルは前記導電層と前記半導体基板を介して前記端子にオーミック接続され、前記導電層の不純物濃度は前記半導体基板の不純物濃度より高いことを特徴とする半導体装置。
前記ウェルの側面及び底面を囲う第2の導電型の不純物拡散層と、
前記半導体基板上であって前記不純物拡散層の外側に形成された端子と、
前記ウェルに接するように形成された導電層と、を有し
前記ウェルは前記導電層と前記半導体基板を介して前記端子にオーミック接続され、前記導電層の不純物濃度は前記半導体基板の不純物濃度より高い半導体装置の製造方法であって、
前記半導体基板に第1の導電型の不純物を打ち込んで前記導電層を形成する導電層形成工程と、
前記半導体基板に第2の導電型の不純物を打ち込んで前記不純物拡散層を形成する不純物拡散層形成工程と、を含むことを特徴とする半導体装置の製造方法。
11,101 基板
12 開口部
13,102,103,102A,102B,103B,102a,102b,103a,103b 導電層
14,104 絶縁膜
20,30,200,300 トランジスタ
21,201 pウェル
31,301 nウェル
202A,302A ソース領域
202B,302B ドレイン領域
203,303 ゲート絶縁膜
204,304 ゲート電極
205,305 絶縁膜
501,502,503,504,505,506,501A,502A レジストパターン
Claims (7)
- 第1の導電型の半導体基板に形成された半導体装置であって、
前記半導体基板に形成された前記第1の導電型のウェルに形成されたトランジスタと、
前記ウェルの側面及び底面を囲う第2の導電型の不純物拡散層であり、前記ウェルの底面側で開口部を有する不純物拡散層と、
前記半導体基板上であって前記不純物拡散層の外側に形成された端子と、
前記不純物拡散層の前記開口部に前記ウェルの底面及び前記半導体基板に接するように形成された前記第1の導電型の第1導電層と、を有し
前記ウェルは、前記第1導電層と前記半導体基板を介して前記端子にオーミック接続されて、前記不純物拡散層に対する逆バイアス電位を与えられ、前記第1導電層の幅は0.01μm〜20μmであり、前記第1導電層の不純物濃度は前記半導体基板の不純物濃度より3×1015cm−3以上高いことを特徴とする半導体装置。 - 前記第1導電層は、前記不純物拡散層に接するように形成されることを特徴とする請求項1記載の半導体装置。
- 前記第1導電層と前記不純物拡散層の間には、前記ウェルに接続され且つ前記第1導電層より不純物濃度が低い、前記半導体基板の一部である前記第1の導電型の第2導電層があることを特徴とする請求項1記載の半導体装置。
- 前記第1導電層は、前記第1の導電型の不純物と前記第2の導電型の不純物を含み、当該第1の導電型の不純物の濃度が当該第2の導電型の不純物の濃度より高いことを特徴とする請求項1または2記載の半導体装置。
- 前記ウェルの不純物濃度は、前記半導体基板の不純物濃度より高いことを特徴とする請求項1乃至4のうち、いずれか1項記載の半導体装置。
- 前記ウェルに隣接して形成された第2の導電型の別のウェルに形成された別のトランジスタを、さらに有することを特徴とする請求項1乃至5のうち、いずれか1項記載の半導体装置。
- 前記別のウェルは前記不純物拡散層に形成されることを特徴とする請求項6記載の半導体装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005096276A JP4426996B2 (ja) | 2005-03-29 | 2005-03-29 | 半導体装置および半導体装置の製造方法 |
EP05015045A EP1708273A3 (en) | 2005-03-29 | 2005-07-12 | Semiconductor device and fabrication process thereof |
US11/180,786 US7282770B2 (en) | 2005-03-29 | 2005-07-14 | Semiconductor device and fabrication process thereof |
TW094123909A TWI261924B (en) | 2005-03-29 | 2005-07-14 | Semiconductor device and fabrication process thereof |
KR1020050070826A KR100688273B1 (ko) | 2005-03-29 | 2005-08-03 | 반도체 장치 및 반도체 장치의 제조 방법 |
CNB2005100895968A CN100492641C (zh) | 2005-03-29 | 2005-08-05 | 半导体器件及其制造方法 |
Applications Claiming Priority (1)
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JP2005096276A JP4426996B2 (ja) | 2005-03-29 | 2005-03-29 | 半導体装置および半導体装置の製造方法 |
Publications (2)
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JP2006278775A JP2006278775A (ja) | 2006-10-12 |
JP4426996B2 true JP4426996B2 (ja) | 2010-03-03 |
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JP2005096276A Expired - Fee Related JP4426996B2 (ja) | 2005-03-29 | 2005-03-29 | 半導体装置および半導体装置の製造方法 |
Country Status (6)
Country | Link |
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US (1) | US7282770B2 (ja) |
EP (1) | EP1708273A3 (ja) |
JP (1) | JP4426996B2 (ja) |
KR (1) | KR100688273B1 (ja) |
CN (1) | CN100492641C (ja) |
TW (1) | TWI261924B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007005763A (ja) * | 2005-05-26 | 2007-01-11 | Fujitsu Ltd | 半導体装置及びその製造方法及びに半導体装置の設計方法 |
JP4819548B2 (ja) * | 2006-03-30 | 2011-11-24 | 富士通セミコンダクター株式会社 | 半導体装置 |
JP5081030B2 (ja) * | 2008-03-26 | 2012-11-21 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
CN104425568B (zh) * | 2013-09-06 | 2017-11-07 | 立锜科技股份有限公司 | 半导体结构与具有该半导体结构的半导体组件 |
JP6425985B2 (ja) * | 2014-12-03 | 2018-11-21 | 国立研究開発法人産業技術総合研究所 | 半導体装置及びその製造方法 |
CN110176490B (zh) * | 2019-06-11 | 2020-04-21 | 长江存储科技有限责任公司 | 一种半导体器件及其制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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KR950009893B1 (ko) * | 1990-06-28 | 1995-09-01 | 미쓰비시 뎅끼 가부시끼가이샤 | 반도체기억장치 |
JPH0955483A (ja) * | 1995-06-09 | 1997-02-25 | Mitsubishi Electric Corp | 半導体記憶装置 |
US5818099A (en) * | 1996-10-03 | 1998-10-06 | International Business Machines Corporation | MOS high frequency switch circuit using a variable well bias |
JPH10199993A (ja) * | 1997-01-07 | 1998-07-31 | Mitsubishi Electric Corp | 半導体回路装置及びその製造方法、半導体回路装置製造用マスク装置 |
US6300819B1 (en) * | 1997-06-20 | 2001-10-09 | Intel Corporation | Circuit including forward body bias from supply voltage and ground nodes |
JP3758366B2 (ja) * | 1998-05-20 | 2006-03-22 | 富士通株式会社 | 半導体装置 |
US7060566B2 (en) * | 2004-06-22 | 2006-06-13 | Infineon Technologies Ag | Standby current reduction over a process window with a trimmable well bias |
US7285828B2 (en) * | 2005-01-12 | 2007-10-23 | Intersail Americas Inc. | Electrostatic discharge protection device for digital circuits and for applications with input/output bipolar voltage much higher than the core circuit power supply |
-
2005
- 2005-03-29 JP JP2005096276A patent/JP4426996B2/ja not_active Expired - Fee Related
- 2005-07-12 EP EP05015045A patent/EP1708273A3/en not_active Withdrawn
- 2005-07-14 US US11/180,786 patent/US7282770B2/en active Active
- 2005-07-14 TW TW094123909A patent/TWI261924B/zh not_active IP Right Cessation
- 2005-08-03 KR KR1020050070826A patent/KR100688273B1/ko active IP Right Grant
- 2005-08-05 CN CNB2005100895968A patent/CN100492641C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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KR20060105401A (ko) | 2006-10-11 |
EP1708273A2 (en) | 2006-10-04 |
KR100688273B1 (ko) | 2007-03-02 |
US20060220139A1 (en) | 2006-10-05 |
EP1708273A3 (en) | 2006-10-11 |
CN100492641C (zh) | 2009-05-27 |
TWI261924B (en) | 2006-09-11 |
US7282770B2 (en) | 2007-10-16 |
CN1841738A (zh) | 2006-10-04 |
JP2006278775A (ja) | 2006-10-12 |
TW200635040A (en) | 2006-10-01 |
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