JP4426943B2 - 筐体の内部の冷却装置を備える電子機器 - Google Patents
筐体の内部の冷却装置を備える電子機器 Download PDFInfo
- Publication number
- JP4426943B2 JP4426943B2 JP2004311873A JP2004311873A JP4426943B2 JP 4426943 B2 JP4426943 B2 JP 4426943B2 JP 2004311873 A JP2004311873 A JP 2004311873A JP 2004311873 A JP2004311873 A JP 2004311873A JP 4426943 B2 JP4426943 B2 JP 4426943B2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- temperature
- heat
- heat sink
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
τ=8k・D・P/(πn・D3) ・・・(1)
γ=k・d・σ/(πn・D2) ・・・(2)
k:応力修正係数、k=c/(c-1)+1/2c、c=D/d (woodの式)
d:コイル線の径、D:コイル平均の径(図6参照)
τH=8k・D・PH /(πn・d3)・・・(3)
τL=8k・D・PL /(πn・d3)・・・(4)
σ=πn・D2・γ/(k・d) ・・・(5)
σH=πn・D2・γ/(k・d) ・・・(6)
σL=πn・D2・γ/(k・d) ・・・(7)
したがって、図6の形状記憶合金コイルのストローク量(変化量)Hは、
H=σH―σL
=πn・D2・(τH―τL)/(k・d)・・(8)
となる。
d:コイル線径(mm)
D:コイル平均径(mm)
n:コイル有効巻数
L:コイル自由長(mm)
τ:ねじれ応力(kg/mm2)
γ:ねじれ歪
P:荷重(Kg)
σ:たわみ(mm)
C:バネ指数
k:応力修正係数
クレードル筐体14に、コア筐体12を接続したときのCPUの温度、筐体内部の温度、筐体表面の温度を、従来技術と本発明について測定したデータを下記に示す。
(1) (2)
CPUの温度 : 72.0℃ 68.1℃
筐体内部の温度 : 62.7℃ 59.3℃
筐体表面の温度 : 53.7℃ 54.1℃
(1):従来技術(50角ファンの40%動作、放熱板と筐体は非接触)
(2):本発明(50角ファンの40%動作、放熱板と筐体は接触)
12 コア筐体
14 クレードル筐体
16 プリント配線板
18 CPU
19 熱弾性体
20、44 放熱板
21、22 接続手段(バネ)
26、28、36 開口
30、42 ファン
32 エアーフロー
33 コア筐体の底部
40 ノート型PC
Claims (6)
- 筐体と、
前記筐体内に配置された、基板、当該基板に取り付けられた電子部品、前記電子部品に接続する放熱板、前記筐体内の温度に応じて前記放熱板を前記筐体に接続して前記電子部品から前記筐体への熱伝導路を形成するための接続手段、およびファンを備え、
前記筐体は、第1開口と第2開口を有し、
前記ファンは、前記第1開口から筐体内に取り入れたエアーを、前記基板と前記放熱板の間のスペースおよび前記放熱板と前記筐体の間のスペースに流して、前記第2開口から排出する、電子機器。 - 前記接続手段は、前記基板と前記放熱板の端部領域に接続し、かつ温度に応じて形状が変化する部材を含み、当該部材の変化する力により前記放熱板の端部領域の前記接続手段が接続する表面の裏側の表面を前記筐体に接続あるいは非接続にして、
前記接続手段は、前記筐体内の温度が予め決められた温度よりも高いか又は低いかに応じて、前記放熱板の少なくとも一部を前記筐体に接続又は非接続にする、請求項1の電子機器。 - 前記部材は形状記憶合金からなるコイルバネを含む、請求項2の電子機器。
- 前記形状記憶合金は、Ni−Ti系の形状記憶合金である、請求項3の電子機器。
- 前記筐体は、前記基板、前記電子部品、前記放熱板、および前記接続手段を内蔵するコア筐体部と、前記ファンを内蔵するクレードル筐体部を含み、
前記第1開口は前記コア筐体部に、前記第2開口は前記クレードル筐体部にそれぞれ設けられる、請求項1の電子機器。 - 前記電子部品はCPUを含み、前記電子機器はパーソナル・コンピュータ(PC)である、請求項5の電子機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004311873A JP4426943B2 (ja) | 2004-10-27 | 2004-10-27 | 筐体の内部の冷却装置を備える電子機器 |
US11/259,314 US7301767B2 (en) | 2004-10-27 | 2005-10-26 | Electronic equipment including an apparatus for cooling interior of housing |
US11/837,637 US7480141B2 (en) | 2004-10-27 | 2007-08-13 | Electronic device for cooling interior of housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004311873A JP4426943B2 (ja) | 2004-10-27 | 2004-10-27 | 筐体の内部の冷却装置を備える電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006128243A JP2006128243A (ja) | 2006-05-18 |
JP4426943B2 true JP4426943B2 (ja) | 2010-03-03 |
Family
ID=36583552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004311873A Expired - Fee Related JP4426943B2 (ja) | 2004-10-27 | 2004-10-27 | 筐体の内部の冷却装置を備える電子機器 |
Country Status (2)
Country | Link |
---|---|
US (2) | US7301767B2 (ja) |
JP (1) | JP4426943B2 (ja) |
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JP5801848B2 (ja) * | 2013-06-07 | 2015-10-28 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器用スタンド |
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-
2004
- 2004-10-27 JP JP2004311873A patent/JP4426943B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-26 US US11/259,314 patent/US7301767B2/en not_active Expired - Fee Related
-
2007
- 2007-08-13 US US11/837,637 patent/US7480141B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7480141B2 (en) | 2009-01-20 |
JP2006128243A (ja) | 2006-05-18 |
US7301767B2 (en) | 2007-11-27 |
US20060126289A1 (en) | 2006-06-15 |
US20070291451A1 (en) | 2007-12-20 |
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