JP4415477B2 - Electronic components - Google Patents

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Publication number
JP4415477B2
JP4415477B2 JP2000314863A JP2000314863A JP4415477B2 JP 4415477 B2 JP4415477 B2 JP 4415477B2 JP 2000314863 A JP2000314863 A JP 2000314863A JP 2000314863 A JP2000314863 A JP 2000314863A JP 4415477 B2 JP4415477 B2 JP 4415477B2
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Japan
Prior art keywords
terminal
electronic component
static electricity
gnd
induction
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Expired - Fee Related
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JP2000314863A
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Japanese (ja)
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JP2002122411A (en
Inventor
幹啓 大島
義典 高嶋
修 三ツ村
一幸 辻岡
人司 酒井
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Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2000314863A priority Critical patent/JP4415477B2/en
Priority to CNB011355859A priority patent/CN1238723C/en
Publication of JP2002122411A publication Critical patent/JP2002122411A/en
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Publication of JP4415477B2 publication Critical patent/JP4415477B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Elimination Of Static Electricity (AREA)
  • Electronic Switches (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、静電気に対して電子部品の内部を保護することが可能な電子部品に関するものである。
【０００２】
【従来の技術】
従来のこの種の電子部品としては特開平７−１４７３７８号公報に開示されたものが知られている。
【０００３】
以下、従来の電子部品について、図面を参照しながら説明する。
【０００４】
図７は従来の電子部品に関する斜視図である。
【０００５】
図７において、１は樹脂部で、この樹脂部１の一端からは電源端子２、出力端子３およびＧＮＤ端子４を外方へ突出するように設けている。５は電子部品を実装する回路基板（図示せず）に設けられた配線部で、この配線部５は各々の前記電源端子２、出力端子３およびＧＮＤ端子４の一端とはんだにより電気的に接続されている。６は静電気誘導部で、この静電気誘導部６は前記配線部５の上面にこの配線部５と別体に設けられるとともに、配線部５を介して前記ＧＮＤ端子４と電気的に接続されており、さらにこの静電気誘導部６は電子部品における樹脂部１よりも高い位置まで先端部７が配設されている。
【０００６】
以上のように構成された従来の電子部品について、次に、その動作を説明する。
【０００７】
電子部品の上部に静電気が発生した場合、この静電気は電子部品における樹脂部１よりも高い位置にある配線部５と別体に設けた静電気誘導部６の先端部７に到達し、静電気誘導部６から配線部５を介してＧＮＤ（図示せず）に到達するものである。この場合、静電気が電子部品における電源端子２および出力端子３に到達するということはないため、静電気が電子部品における内部の機能部（図示せず）に到達するということはなくなり、その結果として、電子部品が故障するということはないという構成になっていた。
【０００８】
【発明が解決しようとする課題】
しかしながら、上記従来の構成においては、配線部５と静電気誘導部６とを別体に構成しているため、配線部５に静電気誘導部６を別個に固着するということが必要となり、電子部品の組み立てが困難であるという課題を有していた。
【０００９】
本発明は上記従来の課題を解決するもので、部品点数が少なくかつ組立性の向上した電子部品を提供することを目的とするものである。
【００１０】
【課題を解決するための手段】
上記目的を達成するために本発明は、機能部を表面に設けた載置部と、この載置部における機能部と電気的に接続された電源端子、出力端子、ＧＮＤ端子からなる端子部と、前記載置部および端子部の一端を内部に埋設するとともに前記端子部の他端を外方へ向かって突出するように一体に形成したモールド樹脂部と、前記モールド樹脂部から外方へ突出するとともに前記端子部におけるＧＮＤ端子と一体に設けることによりＧＮＤ端子と電気的に接続されるように設けた静電気誘導部とを備え、前記載置部における端部に樹脂成形時における成形金型固定用のタイバーを設け、かつこのタイバーを折り曲げることにより前記静電気誘導部を構成したもので、この構成によれば、部品点数が少なくかつ組立性の向上した電子部品を提供することができるものである。
【００１１】
【発明の実施の形態】
本発明の請求項１に記載の発明は、機能部を表面に設けた載置部と、この載置部における機能部と電気的に接続された電源端子、出力端子、ＧＮＤ端子からなる端子部と、前記載置部および端子部の一端を内部に埋設するとともに前記端子部の他端を外方へ向かって突出するように一体に形成したモールド樹脂部と、前記モールド樹脂部から外方へ突出するとともに前記端子部におけるＧＮＤ端子と一体に設けることによりＧＮＤ端子と電気的に接続されるように設けた静電気誘導部とを備え、前記載置部における端部に樹脂成形時における成形金型固定用のタイバーを設け、かつこのタイバーを折り曲げることにより前記静電気誘導部を構成したもので、この構成によれば、モールド樹脂部から外方へ突出するように静電気誘導部を設けるとともに、この静電気誘導部は端子部におけるＧＮＤ端子と一体に設けることによりＧＮＤ端子と電気的に接続されるようにしているため、静電気誘導部をＧＮＤ端子に確実に接続することができ、これにより、電子部品を静電気から確実に保護することができるとともに、前記静電気誘導部は前記載置部における端部に設けた樹脂成形時における成形金型固定用のタイバーを折り曲げることにより構成しているため、成形金型固定用のタイバーが静電気誘導部として使用されることになり、その結果、電子部品に別個に静電気誘導部を設けるという必要はなくなるため、部品点数の少ない安価な電子部品を提供することができるという作用を有するものである。
【００１２】
以下、本発明の一実施の形態における電子部品について、図面を参照しながら説明する。
【００１３】
図１は本発明の一実施の形態における回転数センサの側断面図、図２は同要部である電子部品の近傍を示す側断面図、図３は同要部である電子部品の側断面図である。
【００１４】
図１〜図３において、１１は電子部品で、この電子部品１１は、図３に示すように、載置部１２と、この載置部１２の上面にＳｉからなる絶縁層１３を介して設けた一対の磁気抵抗素子からなる機能部１４とを設けている。また、電子部品１１は端子部１５を設けており、この端子部１５を電源端子１６、出力端子１７およびＧＮＤ端子１８から構成するとともに、この電源端子１６、出力端子１７およびＧＮＤ端子１８を一対の機能部１４と各々ワイヤー線１９を介して電気的に接続している。また、電子部品１１における載置部１２および端子部１５における電源端子１６、出力端子１７およびＧＮＤ端子１８の一端はモールド樹脂部２０に埋設され、さらにこのモールド樹脂部２０の一端部からは静電気誘導部２１が載置部１２と一体に成形され、かつこの静電気誘導部２１はＧＮＤ端子１８と電気的に接続している。
【００１５】
そして、前記モールド樹脂部２０から外方へ突出するように静電気誘導部２１を設け、かつこの静電気誘導部２１は端子部１５におけるＧＮＤ端子１８と電気的に接続しているため、静電気誘導部２１を別体に設けるという必要はなくなり、その結果、部品点数の少ない組立性の向上した電子部品１１を提供することができるという効果を有するものである。
【００１６】
また、端子部１５におけるＧＮＤ端子１８および静電気誘導部２１を載置部１２に一体に設けているため、静電気誘導部２１をＧＮＤ端子１８に確実に接続することができ、これにより、電子部品を静電気から確実に保護することができるという効果を有するものである。
【００１７】
２２は回路基板で、この回路基板２２は上面に電子部品１１を実装するとともに、下面に処理回路２３を実装しており、この処理回路２３により電子部品１１における一対の機能部１４から出力される正弦波形をパルス波形に変換している。２４は樹脂製のケースで、このケース２４は回路基板２２を内側に収納するとともに、３つのコネクタ端子２５を一体に設けており、このコネクタ端子２５を電子部品１１における電源端子１６、出力端子１７およびＧＮＤ端子１８と電気的に接続している。２６は金属製の蓋で、この蓋２６はケース２４における開口部を閉塞している。そして、電子部品１１における静電気誘導部２１の先端部と蓋２６との間隙を電子部品における電源端子１６、出力端子１７およびＧＮＤ端子１８と蓋２６との間隙よりも小となるように構成している。
【００１８】
以上のように構成された本発明の一実施の形態における電子部品について、次に、その組立方法について説明する。
【００１９】
まず、載置部１２の上面にＳｉからなる絶縁層１３を固着する。
【００２０】
次に、前記Ｓｉからなる絶縁層１３の上面に一対の磁気抵抗素子からなる機能部１４を蒸着により形成する。
【００２１】
次に、一対の機能部１４と電源端子１６、出力端子１７およびＧＮＤ端子１８をワイヤー線１９によりボンディングした後、電源端子１６、出力端子１７およびＧＮＤ端子１８とさらには載置部１２を成形金型（図示せず）に設置するとともに、図４に示すように、タイバー１２ａを成形金型（図示せず）により挟持した後、成形金型に樹脂を流し込み、電子部品１１を形成する。
【００２２】
次に、成形金型に支持されたタイバー１２ａからなる静電気誘導部２１を上方に向かって折り曲げる。
【００２３】
この場合、載置部１２における端部に樹脂成形時における成形金型固定用のタイバー１２ａを設けるとともに、このタイバー１２ａを折り曲げることにより静電気誘電部２１を構成しているため、成形金型固定用のタイバー１２ａが静電気誘導部２１として使用されることになり、その結果、電子部品に別個に静電気誘導部２１を設ける必要がないから、部品点数の少ない安価な電子部品を提供できるという効果を有するものである。
【００２４】
次に、回路基板２２の上面に前記電子部品１１を実装した後、回路基板２２の下面に処理回路２３を実装する。
【００２５】
次に、予め、コネクタ端子２５を一体に設けたケース２４の内部に回路基板２２を収納した後、ケース２４におけるコネクタ端子２５を電子部品１１における電源端子１６、出力端子１７およびＧＮＤ端子１８とはんだによりそれぞれ電気的に接続する。
【００２６】
最後に、ケース２４の開口部をあらかじめ絞り加工により形成した金属製の蓋２６で覆うとともに、この蓋２６の絞った先端部を折り曲げることにより蓋２６をケース２４に固着する。
【００２７】
以上のように構成され、かつ組み立てられた本発明の一実施の形態における回転数センサについて、次に、その動作を説明する。
【００２８】
蓋２６に対向する側に相手側の歯車（図示せず）が設けられており、この歯車（図示せず）における凹凸部の回転により、磁石２７の上面に設けた機能部１４に対する磁束密度が変化し、そしてこの磁束密度の変化を正弦波形の出力信号として出力する。さらに、この正弦波形の出力信号は処理回路２３により変換されてパルス信号として処理され、コネクタ端子２５を介して相手側のコンピュータに入力され、回転数として検出されるものである。
【００２９】
ここで、回転数センサにおける蓋２６に外部から静電気が印加された場合を考えると、本発明の一実施の形態における回転数センサにおいては、蓋２６に到達した静電気は静電気誘導部２１に到達することになり、そして、この静電気誘導部２１を介してＧＮＤ端子１８に、さらにはＧＮＤに到達するため、電源端子１６および出力端子１７に静電気が到達するということはなく、その結果、静電気により機能部１４の特性が劣化することのない電子部品およびそれを用いた回転数センサを提供することができるという効果を有するものである。
【００３０】
なお、上記本発明の一実施の形態における回転数センサにおいては、電子部品１１における静電気誘導部２１の先端部と蓋２６との間隙を電子部品における電源端子１６、出力端子１７およびＧＮＤ端子１８と蓋２６との間隙よりも小にする構成としているが、図５に示すように、静電気誘導部２８を折り曲げることにより静電気誘導部２８が蓋２６と垂直な方向に撓む形状とし、さらに静電気誘導部２８の端部が蓋２６に直接当接する構成としてもよいもので、この構成によれば、静電気誘導部２８を折り曲げることにより前記静電気誘導部２８が蓋２６と垂直な方向に撓む形状とし、さらに静電気誘導部２８の端部が蓋２６に当接することにより静電気誘導部２８を蓋２６に電気的に接続しているため、蓋２６に外部から到達した静電気が誤って電源端子１６あるいは出力端子１７に極めて少ない確率で到達するということはなくなり、その結果として、確実に静電気を蓋２６から静電気誘導部２８に到達させるということになるため、機能部１４の特性が変動するということのない回転数センサを確実に提供することができるという効果を有するものである。
【００３１】
また、本発明の一実施の形態における回転数センサにおいては、回路基板２２の上面に電子部品１１を設けるとともに、前記回路基板２２の下面に処理回路２３を設けた構成としているが、図６に示すように、モールド樹脂部２０の内部に磁気抵抗素子からなる機能部１４およびこの機能部１４の出力信号を変換する処理回路２９を埋設した静電気保護ＩＣ３０からなる構成としても同様の効果を有するものである。
【００３２】
さらに、本発明の一実施の形態における回転数センサにおいては、電子部品として、磁気抵抗素子からなる機能部１４をモールド樹脂部２０に埋設する構成としているが、機能部１４をコンデンサ、抵抗、あるいはコイルとしてモールド樹脂部２０に埋設した電子部品としても同様の効果を有するものである。
【００３３】
以上のように、本発明においては、載置部と、前記載置部の表面に設けられた機能部と、前記載置部に設けられるとともに、前記機能部とそれぞれ電気的に接続された電源端子、出力端子、ＧＮＤ端子とを含む端子部と、前記載置部および前記端子部の一端を内部に埋設するモールド樹脂部とを備え、一端が前記モールド樹脂部に埋設されるとともに前記ＧＮＤ端子と電気的に接続され、かつ他端が前記モールド樹脂部の外部に位置する静電気誘導部を設けた構成の電子部品としているため、単体として静電気に強い電子部品を得ることができるものである。
【００３４】
さらに、上記構成に加え、前記静電気誘導部の他端は、前記載置部を基準として他の構成要素より最も遠方に位置する構成の電子部品とすることにより、静電気誘導部が最も静電気を流し易くなるため、より静電気に強い電子部品を得ることができるものである。
【００３５】
また、本発明は、前記電子部品と、前記電子部品からの出力信号をパルス信号に変換する処理回路と、前記電子部品および前記処理回路を表面に実装した回路基板と、前記回路基板を保持する樹脂ケースと、前記樹脂ケースと一体になって前記電子部品を内部に有する金属製の蓋とを有し、前記蓋から前記静電気誘導部までの距離を、前記蓋から前記電源端子、前記出力端子および前記ＧＮＤ端子までのいずれの距離よりも短くした構成の回転数センサとしているため、ケースとして最も静電気を受けやすい金属製の蓋に静電気誘導部が最も近接することになり、これにより、静電気に強い回転数センサを得ることができるものである。
【００３６】
【発明の効果】
以上のように本発明は、機能部を表面に設けた載置部と、この載置部における機能部と電気的に接続された電源端子、出力端子、ＧＮＤ端子からなる端子部と、前記載置部および端子部の一端を内部に埋設するとともに前記端子部の他端を外方へ向かって突出するように一体に形成したモールド樹脂部と、前記モールド樹脂部から外方へ突出するとともに前記端子部におけるＧＮＤ端子と一体に設けることによりＧＮＤ端子と電気的に接続されるように設けた静電気誘導部とを備え、前記載置部における端部に樹脂成形時における成形金型固定用のタイバーを設け、かつこのタイバーを折り曲げることにより前記静電気誘導部を構成したもので、この構成によれば、モールド樹脂部から外方へ突出するように静電気誘導部を設けるとともに、この静電気誘導部は端子部におけるＧＮＤ端子と一体に設けることによりＧＮＤ端子と電気的に接続されるようにしているため、静電気誘導部をＧＮＤ端子に確実に接続することができ、これにより、電子部品を静電気から確実に保護することができるとともに、前記静電気誘導部は前記載置部における端部に設けた樹脂成形時における成形金型固定用のタイバーを折り曲げることにより構成しているため、成形金型固定用のタイバーが静電気誘導部として使用されることになり、その結果、電子部品に別個に静電気誘導部を設けるという必要はなくなるため、部品点数の少ない安価な電子部品を提供することができるという効果を有するものである。
【図面の簡単な説明】
【図１】 本発明の一実施の形態における回転数センサの側断面図
【図２】 同要部である電子部品の近傍の状態を示す側断面図
【図３】 同要部である電子部品の側断面図
【図４】 同要部である電子部品を樹脂成形する前の載置部の上面図
【図５】 本発明の他の実施の形態における回転数センサの側断面図
【図６】 本発明の他の実施の形態における回転数センサの側断面図
【図７】 従来の電子部品の斜視図
【符号の説明】
１１ 電子部品
１２ 載置部
１２ａ タイバー
１４ 機能部
１５ 端子部
１６ 電源端子
１７ 出力端子
１８ ＧＮＤ端子
２０ モールド樹脂部
２１，２８ 静電気誘導部
２２ 回路基板
２３，２９ 処理回路
２４ ケース
２５ コネクタ端子
２６ 蓋
３０ 静電気保護ＩＣ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component capable of protecting the inside of the electronic component against static electricity .
[0002]
[Prior art]
As a conventional electronic component of this kind, one disclosed in JP-A-7-147378 is known.
[0003]
Hereinafter, conventional electronic components will be described with reference to the drawings.
[0004]
FIG. 7 is a perspective view of a conventional electronic component.
[0005]
In FIG. 7, reference numeral 1 denotes a resin portion, and a power supply terminal 2, an output terminal 3, and a GND terminal 4 are provided so as to protrude outward from one end of the resin portion 1. Reference numeral 5 denotes a wiring portion provided on a circuit board (not shown) on which electronic components are mounted. The wiring portion 5 is electrically connected to one end of each of the power supply terminal 2, the output terminal 3 and the GND terminal 4 by solder. Has been. 6 is a static induction unit, together with the static electricity induction unit 6 is provided separately from the wiring portion 5 on the upper surface of the wiring section 5 is connected the GND terminal 4 and electrically via the wiring section 5 Further, the static electricity induction part 6 is provided with a tip part 7 up to a position higher than the resin part 1 in the electronic component.
[0006]
Next, the operation of the conventional electronic component configured as described above will be described.
[0007]
When static electricity is generated in the upper part of the electronic component, the static electricity reaches the distal end portion 7 of the static electricity induction portion 6 provided separately from the wiring portion 5 at a position higher than the resin portion 1 in the electronic component, and the static electricity induction portion. 6 to GND (not shown) via the wiring part 5. As this case, since static electricity is not that reaches the power supply terminal 2 and output terminal 3 of the electronic component, the static electricity is eliminated is that to reach the inside of the functional unit in the electronic component (not shown), as a result, The configuration was such that the electronic component never failed .
[0008]
[Problems to be solved by the invention]
However, in the above-described conventional configuration, since the wiring portion 5 and the static electricity induction portion 6 are configured separately, it is necessary to fix the static electricity induction portion 6 to the wiring portion 5 separately. There was a problem that assembly was difficult.
[0009]
SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object thereof is to provide an electronic component having a small number of components and improved assemblability.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a mounting portion having a functional portion on the surface, and a terminal portion including a power supply terminal, an output terminal, and a GND terminal electrically connected to the functional portion in the mounting portion. A mold resin portion integrally formed so that one end of the mounting portion and the terminal portion is embedded inside and the other end of the terminal portion protrudes outward, and protrudes outward from the mold resin portion. And an electrostatic induction portion provided so as to be electrically connected to the GND terminal by being provided integrally with the GND terminal in the terminal portion, and fixing a molding die at the time of resin molding to the end portion of the placement portion described above the tie bars of use provided, and obtained by forming the electrostatic induction portion by bending the tie bar, this provides the according to the configuration, the electronic component parts are with improved less and assemblability It is those that can.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, there is provided a terminal portion comprising a mounting portion provided with a functional portion on the surface, and a power supply terminal, an output terminal, and a GND terminal electrically connected to the functional portion in the mounting portion. And a mold resin portion integrally formed so that one end of the mounting portion and the terminal portion is embedded inside and the other end of the terminal portion protrudes outward, and outward from the mold resin portion. And a static induction part provided so as to be electrically connected to the GND terminal by being provided integrally with the GND terminal in the terminal part, and a molding die at the time of resin molding at the end part of the mounting part tie bars for fixing is provided, and which was composed of the electrostatic induction portion by bending the tie bar, according to this configuration, provision of the electrostatic induction portion so as to protrude outwardly from the mold resin portion In both cases, since the static electricity induction part is provided integrally with the GND terminal in the terminal part so as to be electrically connected to the GND terminal, the static electricity induction part can be reliably connected to the GND terminal. The electronic parts can be reliably protected from static electricity, and the static electricity induction part is formed by bending a molding die fixing tie bar provided at the end of the mounting part at the time of resin molding. Therefore, the tie bar for fixing the mold is used as the static induction section, and as a result, there is no need to separately provide the static induction section on the electronic component, so that an inexpensive electronic component with a small number of components is provided. It has the effect that it can be.
[0012]
Hereinafter, an electronic component according to an embodiment of the present invention will be described with reference to the drawings.
[0013]
1 is a side sectional view of a rotational speed sensor according to an embodiment of the present invention, FIG. 2 is a side sectional view showing the vicinity of an electronic component which is the main part, and FIG. 3 is a side cross section of the electronic part which is the main part. FIG.
[0014]
1 to 3, reference numeral 11 denotes an electronic component. The electronic component 11 is provided with a mounting portion 12 and an insulating layer 13 made of Si on the upper surface of the mounting portion 12 as shown in FIG. 3. And a functional unit 14 including a pair of magnetoresistive elements. The electronic component 11 is provided with a terminal portion 15, the power supply terminal 16 to the terminal portion 15, while an output terminal 17 and the GND terminal 18, the power supply terminal 16, an output terminal 17 and the GND terminal 18 of the pair They are electrically connected to the functional unit 14 via wire wires 19 respectively . In addition, one end of the power supply terminal 16, the output terminal 17, and the GND terminal 18 in the mounting portion 12 and the terminal portion 15 in the electronic component 11 is embedded in the mold resin portion 20, and electrostatic induction is further introduced from one end portion of the mold resin portion 20. The part 21 is formed integrally with the mounting part 12, and the static electricity induction part 21 is electrically connected to the GND terminal 18 .
[0015]
Then, the static electricity induction part 21 is provided so as to protrude outward from the mold resin part 20, and the static electricity induction part 21 is electrically connected to the GND terminal 18 in the terminal part 15. As a result, it is possible to provide the electronic component 11 having a small number of components and improved assembling ability.
[0016]
Moreover, since the GND terminal 18 and the static electricity induction part 21 in the terminal part 15 are integrally provided in the mounting part 12, the static electricity induction part 21 can be reliably connected to the GND terminal 18, and thus the electronic component can be connected. It has the effect that it can protect reliably from static electricity.
[0017]
Reference numeral 22 denotes a circuit board. The circuit board 22 has the electronic component 11 mounted on the upper surface and a processing circuit 23 mounted on the lower surface. The processing circuit 23 outputs the signal from the pair of functional units 14 in the electronic component 11. A sine waveform is converted to a pulse waveform. Reference numeral 24 denotes a resin case. The case 24 accommodates the circuit board 22 inside, and is provided with three connector terminals 25 integrally. The connector terminal 25 is connected to the power supply terminal 16 and the output terminal 17 in the electronic component 11. And is electrically connected to the GND terminal 18 . Reference numeral 26 denotes a metal lid which closes an opening in the case 24. The gap between the tip of the static electricity induction part 21 in the electronic component 11 and the lid 26 is configured to be smaller than the gap between the power supply terminal 16, the output terminal 17 and the GND terminal 18 and the lid 26 in the electronic component. Yes.
[0018]
Next, a method for assembling the electronic component according to the embodiment of the present invention configured as described above will be described.
[0019]
First, the insulating layer 13 made of Si is fixed to the upper surface of the mounting portion 12.
[0020]
Next, a functional part 14 made of a pair of magnetoresistive elements is formed on the upper surface of the insulating layer 13 made of Si by vapor deposition.
[0021]
Next, after bonding the pair of functional units 14 and the power supply terminals 16, the output terminals 17 and the GND terminals 18 with the wire wires 19, the power supply terminals 16, the output terminals 17 and the GND terminals 18, and further the mounting unit 12 are molded. While being installed in a mold (not shown), as shown in FIG. 4, after holding the tie bar 12 a by a molding die (not shown), a resin is poured into the molding die to form the electronic component 11.
[0022]
Next, the static electricity induction part 21 composed of the tie bar 12a supported by the molding die is bent upward.
[0023]
In this case, a tie bar 12a for fixing a molding die at the time of resin molding is provided at the end of the mounting portion 12, and the electrostatic dielectric portion 21 is configured by bending the tie bar 12a. The tie bar 12a is used as the static electricity induction unit 21, and as a result, there is no need to separately provide the static electricity induction unit 21 to the electronic component, so that an inexpensive electronic component with a small number of components can be provided. Is.
[0024]
Next, after mounting the electronic component 11 on the upper surface of the circuit board 22, the processing circuit 23 is mounted on the lower surface of the circuit board 22.
[0025]
Next, after the circuit board 22 is housed in the case 24 in which the connector terminals 25 are integrally provided, the connector terminals 25 in the case 24 are soldered to the power supply terminals 16, the output terminals 17 and the GND terminals 18 in the electronic component 11. Are electrically connected to each other.
[0026]
Finally, the opening of the case 24 is covered with a metal lid 26 formed in advance by drawing , and the lid 26 is fixed to the case 24 by bending the narrowed tip portion of the lid 26.
[0027]
Next, the operation of the rotational speed sensor according to the embodiment of the present invention constructed and assembled as described above will be described.
[0028]
A mating gear (not shown) is provided on the side facing the lid 26, and the magnetic flux density with respect to the functional unit 14 provided on the upper surface of the magnet 27 is caused by the rotation of the concavo-convex part in the gear (not shown). The magnetic flux density is changed, and the change in the magnetic flux density is output as a sinusoidal output signal. Further, this sine waveform output signal is converted by the processing circuit 23 and processed as a pulse signal, which is input to the counterpart computer via the connector terminal 25 and detected as the rotational speed.
[0029]
Here, considering the case where static electricity from outside the lid 26 in the rotational speed sensor is applied, Oite the rotational speed sensor according to an embodiment of the present invention, static electricity reaches the lid 26 to the electrostatic induction portion 21 Then, the static electricity does not reach the power terminal 16 and the output terminal 17 because it reaches the GND terminal 18 and further reaches the GND via the static electricity induction unit 21 , and as a result, Thus, it is possible to provide an electronic component in which the characteristics of the functional unit 14 are not deteriorated and a rotation speed sensor using the electronic component.
[0030]
In the rotation speed sensor according to the embodiment of the present invention, the gap between the tip of the static electricity induction portion 21 and the lid 26 in the electronic component 11 is connected to the power supply terminal 16, the output terminal 17 and the GND terminal 18 in the electronic component. Although a configuration in which the small than the gap between the lid 26, as shown in FIG. 5, the electrostatic induction portion 28 is shaped to deflect in a direction perpendicular to the lid 26 by bending the electrostatic induction portion 28, further electrostatic induction The end portion of the portion 28 may be in direct contact with the lid 26. According to this configuration, the static electricity induction portion 28 is bent in a direction perpendicular to the lid 26 by bending the static electricity induction portion 28. to further the end portion of the electrostatic induction portion 28 connects the electrostatic induction portion 28 electrically to the lid 26 by contacting the lid 26, the static electricity that has reached from outside the lid 26 Mistake no longer that arrive at very low probability to the power supply terminal 16 or output terminal 17, since as a result, it comes to be reliably reach static electricity from the lid 26 to the electrostatic induction unit 28, characteristics of the functional portion 14 Therefore, it is possible to reliably provide a rotational speed sensor that does not fluctuate.
[0031]
Further, in the rotation speed sensor according to the embodiment of the present invention, the electronic component 11 is provided on the upper surface of the circuit board 22 and the processing circuit 23 is provided on the lower surface of the circuit board 22. FIG. As shown in the figure, the configuration having the same effect can be achieved by a configuration comprising an electrostatic protection IC 30 in which a functional portion 14 made of a magnetoresistive element and a processing circuit 29 for converting an output signal of the functional portion 14 are embedded in the mold resin portion 20. It is.
[0032]
Further, in the rotational speed sensor according to an embodiment of the present invention, as an electronic component has a configuration to embed the function unit 14 comprising a magnetoresistive element in the mold resin portion 20, the function portion 14 capacitors, resistors Alternatively, an electronic component embedded in the mold resin portion 20 as a coil has the same effect.
[0033]
As described above, in the present invention, the mounting unit, the functional unit provided on the surface of the mounting unit, and the power source provided on the mounting unit and electrically connected to the functional unit, respectively. A terminal portion including a terminal, an output terminal, and a GND terminal; and a mold resin portion in which one end of the placement portion and the terminal portion is embedded, and one end is embedded in the mold resin portion and the GND terminal and are electrically connected, and because the other end is to the configuration electronic component provided with the electrostatic induction unit located outside of the mold resin portion, as it can be obtained strong to static electricity as a single is there.
[0034]
Furthermore, in addition to the above configuration, the other end of the electrostatic induction unit, with the configuration electronic components to position the mounting section farthest from the other components as a reference, static electricity induction unit is most static electricity flowed for easily and is able to obtain a strong electronic component more static.
[0035]
Further, the present invention holds the electronic component, a processing circuit that converts an output signal from the electronic component into a pulse signal, a circuit board on which the electronic component and the processing circuit are mounted, and the circuit board. A resin case, and a metal lid that is integrated with the resin case and has the electronic component therein, and the distance from the lid to the static electricity induction unit is determined from the lid to the power supply terminal and the output terminal. Since the rotation speed sensor is configured to be shorter than any distance to the GND terminal, the static electricity induction part is closest to a metal lid that is most susceptible to static electricity as a case . A rotational speed sensor resistant to static electricity can be obtained .
[0036]
【The invention's effect】
As described above, the present invention provides a mounting portion provided with a functional portion on the surface, a terminal portion including a power supply terminal, an output terminal, and a GND terminal electrically connected to the functional portion in the mounting portion, One end of the mounting portion and the terminal portion is embedded inside and the other end of the terminal portion is integrally formed so as to protrude outward, and the mold resin portion protrudes outward from the mold resin portion and A tie bar for fixing a molding die at the time of resin molding at an end portion of the mounting portion provided with an electrostatic induction portion provided so as to be electrically connected to the GND terminal by being provided integrally with the GND terminal in the terminal portion; the provided and obtained by forming the electrostatic induction portion by bending the tie bar, according to this arrangement, provided with a static electricity induction portion so as to protrude outwardly from the mold resin portion, Since the static electricity induction part is provided integrally with the GND terminal in the terminal part so as to be electrically connected to the GND terminal, the static electricity induction part can be reliably connected to the GND terminal. The parts can be reliably protected from static electricity, and the static electricity induction part is formed by bending a tie bar for fixing a molding die at the time of resin molding provided at the end of the mounting part. A die fixing tie bar is used as an electrostatic induction section. As a result, it is not necessary to separately provide an electrostatic induction section for the electronic component. Therefore, an inexpensive electronic component with a small number of components can be provided. It has the effect of being able to.
[Brief description of the drawings]
FIG. 1 is a side sectional view of a rotation speed sensor according to an embodiment of the present invention. FIG. 2 is a side sectional view showing a state in the vicinity of an electronic component which is the main part. FIG. [FIG. 4] A top view of the mounting portion before resin molding of the electronic component which is the main part thereof. [FIG. 5] A side sectional view of the rotational speed sensor according to another embodiment of the present invention. FIG. 7 is a side sectional view of a rotational speed sensor according to another embodiment of the present invention. FIG. 7 is a perspective view of a conventional electronic component.
DESCRIPTION OF SYMBOLS 11 Electronic component 12 Mounting part 12a Tie bar 14 Function part 15 Terminal part 16 Power supply terminal 17 Output terminal 18 GND terminal 20 Mold resin part 21, 28 Static induction part 22 Circuit board 23, 29 Processing circuit 24 Case 25 Connector terminal 26 Cover 30 ESD protection IC

Claims (1)

機能部を表面に設けた載置部と、この載置部における機能部と電気的に接続された電源端子、出力端子、ＧＮＤ端子からなる端子部と、前記載置部および端子部の一端を内部に埋設するとともに前記端子部の他端を外方へ向かって突出するように一体に形成したモールド樹脂部と、前記モールド樹脂部から外方へ突出するとともに前記端子部におけるＧＮＤ端子と一体に設けることによりＧＮＤ端子と電気的に接続されるように設けた静電気誘導部とを備え、前記載置部における端部に樹脂成形時における成形金型固定用のタイバーを設け、かつこのタイバーを折り曲げることにより前記静電気誘導部を構成した電子部品。 A placement part provided on the surface with a functional part, a terminal part composed of a power supply terminal, an output terminal, and a GND terminal electrically connected to the functional part in the placement part, and one end of the placement part and the terminal part. A mold resin portion that is embedded inside and integrally formed so that the other end of the terminal portion protrudes outward, and protrudes outward from the mold resin portion and integrally with a GND terminal in the terminal portion. A static electricity induction portion provided so as to be electrically connected to the GND terminal by providing, a tie bar for fixing a molding die at the time of resin molding is provided at an end portion of the placement portion, and the tie bar is bent The electronic component which comprised the said static electricity induction part by this.
JP2000314863A 2000-10-16 2000-10-16 Electronic components Expired - Fee Related JP4415477B2 (en)

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JP2000314863A JP4415477B2 (en) 2000-10-16 2000-10-16 Electronic components
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