JP4408295B2 - ポリイミド樹脂前駆体溶液を用いた電子部品用基材及びその基材の製造方法 - Google Patents
ポリイミド樹脂前駆体溶液を用いた電子部品用基材及びその基材の製造方法 Download PDFInfo
- Publication number
- JP4408295B2 JP4408295B2 JP2007041807A JP2007041807A JP4408295B2 JP 4408295 B2 JP4408295 B2 JP 4408295B2 JP 2007041807 A JP2007041807 A JP 2007041807A JP 2007041807 A JP2007041807 A JP 2007041807A JP 4408295 B2 JP4408295 B2 JP 4408295B2
- Authority
- JP
- Japan
- Prior art keywords
- polyimide resin
- substrate
- resin precursor
- layer
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Description
2 ポリイミド基材
5 メッキ下地核
6 メッキ下地金属層
7 表面メッキ層
Claims (3)
- ポリイミド基材に表面メッキ層を形成した電子部品用基材であって、このポリイミド基材上にパラジウム化合物を含有するポリイミド樹脂前駆体溶液を用いてポリイミド樹脂前駆体層が形成され、次いで紫外線が照射されてメッキ下地核が形成された後、無電解メッキ処理によりメッキ下地金属が形成され、さらに表面メッキ層が形成された後、又は形成される前に前記ポリイミド樹脂前駆体層が加熱イミド化されて形成されたポリイミド樹脂層を有することを特徴とする電子部品用基材。
- ポリイミド基材上にパラジウム化合物を含有するポリイミド樹脂前駆体溶液を塗布・乾燥させてポリイミド樹脂前駆体層を形成し、次いで水素供与体の存在下において紫外線を照射してメッキ下地核を形成した後、無電解メッキ処理によってメッキ下地金属層を形成し、さらに表面メッキ層を形成した後、又は形成する前に前記ポリイミド樹脂前駆体層を加熱イミド化してポリイミド樹脂層にすることを特徴とする電子部品用基材の製造方法。
- 水素供与体として、水、アルコール又はアルコール水溶液を使用することを特徴とする請求項2に記載の電子部品用基材の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007041807A JP4408295B2 (ja) | 2000-05-12 | 2007-02-22 | ポリイミド樹脂前駆体溶液を用いた電子部品用基材及びその基材の製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000139367 | 2000-05-12 | ||
JP2007041807A JP4408295B2 (ja) | 2000-05-12 | 2007-02-22 | ポリイミド樹脂前駆体溶液を用いた電子部品用基材及びその基材の製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001016339A Division JP2002030216A (ja) | 2000-05-12 | 2001-01-24 | ポリイミド樹脂前駆体溶液、その溶液を用いた電子部品用基材、およびその基材の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007165931A JP2007165931A (ja) | 2007-06-28 |
JP4408295B2 true JP4408295B2 (ja) | 2010-02-03 |
Family
ID=38248375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007041807A Expired - Lifetime JP4408295B2 (ja) | 2000-05-12 | 2007-02-22 | ポリイミド樹脂前駆体溶液を用いた電子部品用基材及びその基材の製造方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4408295B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101688308B (zh) | 2007-07-02 | 2012-10-10 | 荏原优莱特科技股份有限公司 | 金属层叠聚酰亚胺底座及其制造方法 |
JP5291008B2 (ja) * | 2008-02-13 | 2013-09-18 | 新日鉄住金化学株式会社 | 回路配線基板の製造方法 |
CN112437724A (zh) * | 2018-09-05 | 2021-03-02 | 株式会社有泽制作所 | 层叠体 |
-
2007
- 2007-02-22 JP JP2007041807A patent/JP4408295B2/ja not_active Expired - Lifetime
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JP2007165931A (ja) | 2007-06-28 |
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