JP4385265B2 - Method for manufacturing external electrode in piezoelectric element unit - Google Patents

Method for manufacturing external electrode in piezoelectric element unit Download PDF

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Publication number
JP4385265B2
JP4385265B2 JP17211399A JP17211399A JP4385265B2 JP 4385265 B2 JP4385265 B2 JP 4385265B2 JP 17211399 A JP17211399 A JP 17211399A JP 17211399 A JP17211399 A JP 17211399A JP 4385265 B2 JP4385265 B2 JP 4385265B2
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Prior art keywords
piezoelectric element
piezoelectric
base
element unit
external electrode
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JP2001001529A (en
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茂良 梅宮
修 谷口
剛 三田
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Fujifilm Corp
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Fujifilm Corp
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Description

【０００１】
【発明の属する技術分野】
本発明は、インクジェット記録ヘッドに用いる圧電素子ユニットにおける外部電極の製造方法に関する。
【０００２】
【従来の技術】
積層する圧電部材の上下に配設する内部電極の一方を外部電極の共通電極に、内部電極の他方を外部電極の個別電極に、交互に接続され、共通電極と個別電極の間に電圧を印加することにより積層する圧電部材の積層方向に変位が発生する積層型圧電素子を複数個成形可能な圧電素子ユニットへの従来の共通電極と個別電極の形成方法を以下に説明する。
【０００３】
図1 は、圧電素子ユニットに共通電極1 と個別電極2 を形成後、個別電極2 の形成部が互いに独立した積層型圧電素子の駆動部とするために、スリット4 を加工した後の斜視図である。図2 は、図1 における個別電極2 の形成部の断面図であり、内部電極3aと共通電極1 および内部電極3bと個別電極2 の接続状況を示している。圧電素子ユニットがインクジェット記録ヘッドの一部として機能するためには、図示はしていないが、図1 のスリット4 の加工面上に、圧力板を介して個別電極2 の形成部の駆動部に対応した位置に複数の圧力室を備えた流路板と、圧力室に対応した位置にノズルを有するノズル板を積層する。そして、共通電極1 と個別電極2 の間に電圧を印加することにより駆動部に変位が発生し、その変位が、圧力板を介して圧力室に伝わり、圧力室内のインクをノズルからインク粒として吐出させる。
【０００４】
このような圧電素子ユニットへの共通電極1 と個別電極2 の従来の形成方法は、電極形成面以外の面に、紫外光の照射により容易に接着力が消滅して剥がれ、かつ、接着材の粘着物が被接着物に付着しないＵＶテープで成形したシールドマスクを接着した圧電素子ユニットを準備し、これをスパッター処理装置の真空チャンバー内にセットし、シールドマスクを接着した面以外の面にスパッタ法により導電性金属膜を形成していた。
【０００５】
【発明が解決しようとする課題】
しかしながら、上述の方法では、圧電素子ユニット一個毎に共通電極1 と個別電極2 の形成面以外の面にシールドマスクを手作業により接着しなければならない。特に、個別電極2 形成面のシールドマスクは、上述の圧力室との相対位置が重要となるため、その接着位置の精度が求められる。これは、多大な工数を必要とし、安価なインクジェット記録ヘッドを提供するための弊害となっている。さらに、ダウンサイジングによりインクジェット記録ヘッドも小型化が求められており、人手による取り扱いが困難な大きさになってきている。
【０００６】
このように、本発明は、人手を必要とする作業をできるだけなくし、しかも一度に多数の圧電素子ユニットの外部電極を形成する製造方法を提供することを目的としている。
【０００７】
【課題を解決するための手段】
上記目的を達成するため、請求項１の圧電素子ユニットにおける外部電極の製造方法では、積層する圧電部材の上下に配設する内部電極の一方を外部電極の共通電極に、内部電極の他方を外部電極の個別電極に、交互に接続され、共通電極と個別電極の間に電圧を印加することにより積層する圧電部材の積層方向に変位が発生する積層型圧電素子を複数個成形可能な圧電素子ユニットにおける外部電極の製造方法において、圧電素子ユニットを複数個成形可能な圧電基板の圧電部材積層方向の一方の面と基台を接着する工程と、圧電基板の圧電部材積層方向の他方の面にシールド板を接着する工程と、基台上の圧電基板を複数の圧電素子ユニットに切断し、各圧電素子ユニットの外部電極の形成面を露出させる工程と、個別電極の形成面に個別電極形成用の開口部を有するシールドマスクを配設する工程と、基台上の複数の圧電素子ユニットの全てに対して個別電極と共通電極を同時に導電性金属膜で形成する工程と、から成ることを特徴としたものである。上記目的を達成するため、請求項２の圧電素子ユニットにおける外部電極の製造方法では、請求項１記載の圧電素子ユニットにおける外部電極の製造方法において、基台上の圧電基板を複数の圧電素子ユニットに切断されてできた両対向面には、共通電極同士または個別電極同士を形成することを特徴としたものである。
【０００８】
【発明の実施の形態】
本発明の実施の形態について図3 〜図13により製造工程順に説明する。図3 において、基台5 は紫外光を透過させることを目的に石英ガラスを材料とし、片側面にダイシングソーの逃げ溝5a、5bが設けられている。基台5 に圧電素子ユニットを複数個成形可能な圧電基板7 を接着するため、両面に接着層を持つＵＶテープ6 を基台5 と圧電基板7 の間に介在させる。次に圧電基板7 の上面の全面にスパッタ処理による導電性金属膜の形成を避けるために、片面に接着層を持つＵＶテープから成るシールド板8 を接着する。このことにより、基台5 、ＵＶテープ6 、圧電基板7 、シールド板8 が一体化されたことになる。
【０００９】
ＵＶテープを使用する理由は、接着を剥がす場合、ＵＶテープに紫外光を照射することにより接着力が消滅することと、接着材の粘着物が被接着物に付着しないことにある。
【００１０】
図4 は、圧電基板7 の断面図である。同図において、圧電部材11の上下に内部電極3a、3bが配設され、それが複数段積層されている。また、図中の点線12a 、12b は、ダイシングソーによる切断位置を表し、切断後は個々の圧電素子ユニット13になる。さらに、この切断時に内部電極3a、3bも同時に切断され、切断断面が外部電極との接続部を担うこととなる。ここで、外部電極の個別電極と共通電極の形成面は点線12a 、12b の切断面のいずれでもよいが、本実施の形態では個別電極は点線12b の切断面に、共通電極は点線12a の切断面に形成することとする。
【００１１】
図5 は、基台5 、ＵＶテープ6 、圧電基板7 、シールド板8 が一体化された後、各圧電素子ユニットの外部電極形成面を露出させるため、ダイシングソーで切断する工程を説明する図である。同図において、矢印14の位置をダイシングソーで切断する。この切断位置は図4 における点線12a 、12b の位置に相当する。基台5 にはダイシングソーの逃げ溝5bが設けられているため、ダイシングソーが石英ガラス材の基台5 と接触することがないので、ダイシングソーの破損が防止される。
【００１２】
次に、外部電極の個別電極を形成するための準備工程について説明する。図6 は、個別電極を形成する図4 における点線12b に相当する位置にシールドマスク15の配設を説明する図である。同図においてシールドマスク15を配設する切断面の両対向面が個別電極形成面となり、その他の切断面の両対向面と両端面16a 、16b が共通電極形成面となる。図7 は、シールドマスク15を切断面内に配設後の断面図である。同図において、シールドマスク15は、圧電素子ユニット13の両対向面に密着させるため、下端部を切断面幅より大きいＵ字状に成形して弾性をもたせるため、厚さ約100 μｍのインバー合金を使用し、同時に熱膨張による寸法変化を抑えている。図8 は、シールドマスク15の正面図、図9 は、シールドマスク15の開口部16の断面図である。同図において開口部16が、両切断面の個別電極の形成される面となり、その他の面はシールドされる。
【００１３】
次に、上述のシールドマスク15を切断面に配設した状態でスパッタ処理装置の真空チャンバー内にセットし、外部電極の個別電極と共通電極を同時に、一括してスパッター法により導電性金属膜の形成を行う。導電性金属膜は、本発明の実施の形態では、Cr、Ni、Auの順で三層から成り、各々の膜厚は、0.3 μｍ、0.3 μｍ、0.4 μｍとした。
【００１４】
次に、上述の導電性金属膜の形成後の工程について説明する。図10に示すように、シールドマスク15を取外し、さらに、ダイシングソーによって切断されたシールド板8 の上面より紫外光を照射して、これを取外す。
【００１５】
次に、図11において、本発明の実施の形態では、同時に導電性金属膜の形成する数を多くするために圧電素子ユニット13が二個一体につなげてあるため、これを矢印17部でダイシングソーによって切断する。また、圧電素子ユニット13の長手方向の寸法精度を出すために矢印18a 、18b 部をダイシングソーによって切断する。この時、圧電素子ユニット13の端面20a 、20b に形成されていた不要な導電性金属膜が切り取られる。ダイシングソーによる切断時は、基台5 にはダイシングソーの逃げ溝5aが設けてあるため、ダイシングソーが石英ガラス材の基台5 と接触することがないため、ダイシングソーの破損が防止される。
【００１６】
次に、図12において、圧電素子ユニット13の表面にダイシングソーによってスリット4 を加工する。図13はスリット4 の加工後の個別電極形成面側からみた圧電素子ユニット13の正面図である。同図において、個別電極形成面の両側にスリット4 が加工されている。個別電極形成面の部分が積層型圧電素子の駆動部20となり、個別電極が形成されていない部分が非駆動部21となる。
【００１７】
次に、基台5 の圧電素子ユニット13の取付け面の裏側面に紫外光を照射して、ＵＶテープ6 の接着力を消滅させて、圧電素子ユニット13を基台5 から取り外す。この時点での圧電素子ユニット13の斜視図は、図1 と同一のものとなる。
【００１８】
以上説明した製造工程を経た結果、本発明の実施の形態では、一個の圧電基板7 から圧電素子ユニット13が合計16個同時にできたことになる。
【００１９】
【発明の効果】
以上説明したように、請求項１の圧電素子ユニットにおける外部電極の製造方法によれば、圧電素子ユニット一個毎にシールドマスクを接着する必要がなく、複数の圧電素子ユニットに対して一括してシールド可能なシールド板の接着および個別電極形成用のシールドマスクを配設することにより、複数の圧電素子ユニットの外部電極である共通電極と個別電極を同時に一括して成形可能となる。さらに、スパッター処理のための真空チャンバーへの出し入れも一度に一括して可能なため、作業工数が削減可能となり、コストも低減できる。
【００２０】
請求項２の圧電素子ユニットにおける外部電極の製造方法によれば、同一切断面の両対向面に個別電極同士を形成するため、一個のシールドマスクで両端面の個別電極形成対応が可能となるため、部品点数が半減可能となり、さらにシールドマスクの配設箇所が半減するため、作業工数も削減可能となり、コストも低減できる。
【図面の簡単な説明】
【図１】圧電素子ユニットの斜視図
【図２】圧電素子ユニットの個別電極形成部の断面図
【図３】本発明の実施の形態の一部工程を示す斜視図
【図４】図3 内の圧電基板の断面図
【図５】本発明の実施の形態の一部工程を示す斜視図
【図６】本発明の実施の形態の一部工程を示す斜視図
【図７】図6 のシールドマスクを切断面に配設後の断面図
【図８】本発明の実施の形態で使用するシールドマスクの正面図
【図９】図8 のシールドマスクの開口部の断面図
【図１０】本発明の実施の形態の一部工程を示す斜視図
【図１１】本発明の実施の形態の一部工程を示す斜視図
【図１２】本発明の実施の形態の一部工程を示す斜視図
【図１３】本発明の実施の形態によってできた圧電素子ユニットの正面図
【符号の説明】
1 ・・・・・・・共通電極
2 ・・・・・・・個別電極
3a、3b・・・・・内部電極
4 ・・・・・・・スリット
5 ・・・・・・・基台
5a、5b・・・・・逃げ溝
6 ・・・・・・・ＵＶテープ
7 ・・・・・・・圧電基板
8 ・・・・・・・シールド板
11・・・・・・・圧電部材
13・・・・・・・圧電素子ユニット
15・・・・・・・シールドマスク
16・・・・・・・開口部
20・・・・・・・駆動部
21・・・・・・・非駆動部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing an external electrode in a piezoelectric element unit used in an ink jet recording head.
[0002]
[Prior art]
One of the internal electrodes placed above and below the laminated piezoelectric member is connected to the common electrode of the external electrode, the other of the internal electrodes is connected to the individual electrode of the external electrode, and a voltage is applied between the common electrode and the individual electrode A conventional method for forming common electrodes and individual electrodes in a piezoelectric element unit capable of forming a plurality of stacked piezoelectric elements that are displaced in the stacking direction of the piezoelectric members to be stacked will be described below.
[0003]
FIG. 1 is a perspective view after processing the slit 4 to form a drive unit for a laminated piezoelectric element in which the formation part of the individual electrode 2 is independent from each other after the common electrode 1 and the individual electrode 2 are formed in the piezoelectric element unit. It is. FIG. 2 is a cross-sectional view of a portion where the individual electrode 2 is formed in FIG. 1, and shows a connection state between the internal electrode 3a and the common electrode 1 and the internal electrode 3b and the individual electrode 2. In order for the piezoelectric element unit to function as a part of the ink jet recording head, although not shown in the figure, on the processed surface of the slit 4 in FIG. A flow path plate having a plurality of pressure chambers at corresponding positions and a nozzle plate having nozzles at positions corresponding to the pressure chambers are stacked. Then, when a voltage is applied between the common electrode 1 and the individual electrode 2, a displacement is generated in the drive unit, and the displacement is transmitted to the pressure chamber through the pressure plate, and the ink in the pressure chamber is transferred from the nozzle as ink particles. Discharge.
[0004]
In the conventional method of forming the common electrode 1 and the individual electrode 2 on such a piezoelectric element unit, the adhesive force disappears easily by irradiation with ultraviolet light on the surface other than the electrode formation surface, and the adhesive material is peeled off. Prepare a piezoelectric element unit to which a shield mask molded with UV tape that does not adhere to the adherend is bonded, set it in the vacuum chamber of the sputtering equipment, and sputter it on the surface other than the surface to which the shield mask is bonded. A conductive metal film was formed by this method.
[0005]
[Problems to be solved by the invention]
However, in the above-described method, the shield mask must be manually bonded to a surface other than the surface on which the common electrode 1 and the individual electrode 2 are formed for each piezoelectric element unit. In particular, since the relative position of the shield mask on the surface on which the individual electrode 2 is formed with respect to the pressure chamber described above is important, the accuracy of the bonding position is required. This requires a great number of man-hours and is an adverse effect for providing an inexpensive ink jet recording head. Further, downsizing of the ink jet recording head is also demanded, and the size is difficult to handle manually.
[0006]
Thus, an object of the present invention is to provide a manufacturing method that eliminates work requiring human labor as much as possible and that forms external electrodes of a large number of piezoelectric element units at once.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, in the method of manufacturing an external electrode in the piezoelectric element unit according to claim 1, one of the internal electrodes disposed above and below the laminated piezoelectric member is a common electrode of the external electrode, and the other internal electrode is the external Piezoelectric element unit capable of forming a plurality of stacked piezoelectric elements that are alternately connected to the individual electrodes of the electrode and generate displacement in the stacking direction of the stacked piezoelectric members by applying a voltage between the common electrode and the individual electrodes In the method for manufacturing an external electrode in the method, a step of bonding one surface of a piezoelectric substrate in which a plurality of piezoelectric element units can be formed and a base in the piezoelectric member stacking direction and a shield on the other surface of the piezoelectric substrate in the piezoelectric member stacking direction Bonding the plates, cutting the piezoelectric substrate on the base into a plurality of piezoelectric element units, exposing the formation surface of the external electrode of each piezoelectric element unit, A step of disposing a shield mask having an opening for electrode formation, and a step of simultaneously forming an individual electrode and a common electrode with a conductive metal film for all of the plurality of piezoelectric element units on the base. It is characterized by that. In order to achieve the above object, in the method for manufacturing an external electrode in the piezoelectric element unit according to claim 2, the method for manufacturing an external electrode in the piezoelectric element unit according to claim 1, wherein the piezoelectric substrate on the base is divided into a plurality of piezoelectric element units. Common electrodes or individual electrodes are formed on both opposing surfaces formed by cutting into two.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described in the order of manufacturing steps with reference to FIGS. In FIG. 3, the base 5 is made of quartz glass for the purpose of transmitting ultraviolet light, and is provided with relief grooves 5a and 5b for a dicing saw on one side. In order to bond a piezoelectric substrate 7 capable of forming a plurality of piezoelectric element units to the base 5, a UV tape 6 having an adhesive layer on both sides is interposed between the base 5 and the piezoelectric substrate 7. Next, in order to avoid the formation of a conductive metal film by sputtering on the entire upper surface of the piezoelectric substrate 7, a shield plate 8 made of UV tape having an adhesive layer on one side is bonded. As a result, the base 5, the UV tape 6, the piezoelectric substrate 7, and the shield plate 8 are integrated.
[0009]
The reason for using the UV tape is that when the adhesive is peeled off, the adhesive force disappears by irradiating the UV tape with ultraviolet light, and the adhesive of the adhesive does not adhere to the adherend.
[0010]
FIG. 4 is a cross-sectional view of the piezoelectric substrate 7. In the figure, internal electrodes 3a and 3b are arranged above and below the piezoelectric member 11, and are stacked in a plurality of stages. In addition, dotted lines 12a and 12b in the drawing represent cutting positions by a dicing saw, and become individual piezoelectric element units 13 after cutting. Further, the internal electrodes 3a and 3b are also cut at the same time, and the cut cross section serves as a connection portion with the external electrode. Here, the formation surface of the individual electrode and the common electrode of the external electrode may be either the cut surface of the dotted lines 12a and 12b, but in this embodiment, the individual electrode is the cut surface of the dotted line 12b and the common electrode is the cut surface of the dotted line 12a. It shall be formed on the surface.
[0011]
FIG. 5 is a diagram for explaining a process of cutting with a dicing saw to expose the external electrode forming surface of each piezoelectric element unit after the base 5, the UV tape 6, the piezoelectric substrate 7 and the shield plate 8 are integrated. It is. In the figure, the position of the arrow 14 is cut with a dicing saw. This cutting position corresponds to the positions of dotted lines 12a and 12b in FIG. Since the base 5 is provided with the dicing saw relief groove 5b, the dicing saw does not come into contact with the base 5 of the quartz glass material, thereby preventing the dicing saw from being damaged.
[0012]
Next, a preparation process for forming the individual electrodes of the external electrodes will be described. FIG. 6 is a diagram for explaining the arrangement of the shield mask 15 at a position corresponding to the dotted line 12b in FIG. 4 for forming the individual electrodes. In the figure, both opposing surfaces of the cut surface on which the shield mask 15 is disposed are individual electrode forming surfaces, and both opposing surfaces of the other cutting surfaces and both end surfaces 16a and 16b are common electrode forming surfaces. FIG. 7 is a cross-sectional view after the shield mask 15 is disposed in the cut surface. In this figure, the shield mask 15 is intimately bonded to both opposing surfaces of the piezoelectric element unit 13 so that the lower end portion is formed in a U shape larger than the cut surface width and has elasticity, so that an invar alloy having a thickness of about 100 μm is used. At the same time, dimensional changes due to thermal expansion are suppressed. FIG. 8 is a front view of the shield mask 15, and FIG. 9 is a cross-sectional view of the opening 16 of the shield mask 15. In the figure, the opening 16 is a surface on which the individual electrodes of both cut surfaces are formed, and the other surfaces are shielded.
[0013]
Next, the shield mask 15 described above is placed in the vacuum chamber of the sputtering apparatus with the cut surface disposed, and the individual electrodes and the common electrode of the external electrode are simultaneously and collectively formed by the sputtering method. Form. In the embodiment of the present invention, the conductive metal film is composed of three layers in the order of Cr, Ni, and Au, and the respective film thicknesses are 0.3 μm, 0.3 μm, and 0.4 μm.
[0014]
Next, the process after the formation of the conductive metal film will be described. As shown in FIG. 10, the shield mask 15 is removed, and further, ultraviolet light is irradiated from the upper surface of the shield plate 8 cut by the dicing saw, and this is removed.
[0015]
Next, in FIG. 11, in the embodiment of the present invention, two piezoelectric element units 13 are connected together to increase the number of conductive metal films formed at the same time. Cut with a saw. Further, in order to obtain the dimensional accuracy in the longitudinal direction of the piezoelectric element unit 13, the portions of the arrows 18a and 18b are cut by a dicing saw. At this time, unnecessary conductive metal films formed on the end faces 20a and 20b of the piezoelectric element unit 13 are cut off. When cutting with a dicing saw, the base 5 is provided with a relief groove 5a for the dicing saw so that the dicing saw does not come into contact with the base 5 of the quartz glass material, thereby preventing the dicing saw from being damaged. .
[0016]
Next, in FIG. 12, the slit 4 is processed on the surface of the piezoelectric element unit 13 by a dicing saw. FIG. 13 is a front view of the piezoelectric element unit 13 as viewed from the individual electrode forming surface side after the slit 4 is processed. In the figure, slits 4 are machined on both sides of the individual electrode forming surface. The portion of the individual electrode forming surface becomes the driving unit 20 of the stacked piezoelectric element, and the portion where the individual electrode is not formed becomes the non-driving unit 21.
[0017]
Next, the back surface of the mounting surface of the piezoelectric element unit 13 of the base 5 is irradiated with ultraviolet light, the adhesive force of the UV tape 6 is extinguished, and the piezoelectric element unit 13 is removed from the base 5. The perspective view of the piezoelectric element unit 13 at this time is the same as FIG.
[0018]
As a result of the manufacturing steps described above, in the embodiment of the present invention, a total of 16 piezoelectric element units 13 can be formed simultaneously from one piezoelectric substrate 7.
[0019]
【The invention's effect】
As described above, according to the manufacturing method of the external electrode in the piezoelectric element unit according to claim 1, it is not necessary to attach a shield mask to each piezoelectric element unit, and the plurality of piezoelectric element units are collectively shielded. By arranging a shield mask for bonding the possible shield plates and forming the individual electrodes, the common electrode and the individual electrodes, which are the external electrodes of the plurality of piezoelectric element units, can be simultaneously formed. Furthermore, since it can be put into and out of the vacuum chamber at one time for the sputtering process, the number of work steps can be reduced and the cost can be reduced.
[0020]
According to the method for manufacturing an external electrode in the piezoelectric element unit according to claim 2, since the individual electrodes are formed on both opposing surfaces of the same cut surface, it is possible to form the individual electrodes on both end surfaces with a single shield mask. The number of parts can be halved, and the number of locations where the shield mask is disposed is halved, so that the number of work steps can be reduced and the cost can be reduced.
[Brief description of the drawings]
1 is a perspective view of a piezoelectric element unit. FIG. 2 is a cross-sectional view of an individual electrode forming portion of the piezoelectric element unit. FIG. 3 is a perspective view showing a partial process of an embodiment of the invention. FIG. 5 is a perspective view showing a part of the process according to the embodiment of the present invention. FIG. 6 is a perspective view showing a part of the process according to the embodiment of the present invention. FIG. 8 is a front view of a shield mask used in the embodiment of the present invention. FIG. 9 is a sectional view of an opening of the shield mask in FIG. FIG. 11 is a perspective view showing a partial process of the embodiment of the present invention. FIG. 12 is a perspective view showing a partial process of the embodiment of the invention. 13 is a front view of a piezoelectric element unit made according to an embodiment of the present invention.
1 ・ ・ ・ ・ ・ ・ ・ Common electrode
2 ・ ・ ・ ・ ・ ・ ・ Individual electrode
3a, 3b ・ ・ ・ ・ ・ Internal electrode
4 ・ ・ ・ ・ ・ ・ ・ Slit
5 ・ ・ ・ ・ ・ ・ ・ Base
5a, 5b ... Escape groove
6 ・ ・ ・ ・ ・ ・ ・ UV tape
7 ・ ・ ・ ・ ・ ・ ・ Piezoelectric substrate
8 ・ ・ ・ ・ ・ ・ ・ Shield plate
11. ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Piezoelectric member
13. ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Piezoelectric element unit
15 ・ ・ ・ ・ ・ ・ ・ Shield mask
16 ・ ・ ・ ・ ・ ・ ・ Opening
20 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Driver
21 ...

Claims (4)

積層する圧電部材の上下に配設する内部電極の一方を外部電極の共通電極に、内部電極の他方を外部電極の個別電極に、交互に接続され、共通電極と個別電極の間に電圧を印加することにより積層する圧電部材の積層方向に変位が発生する積層型圧電素子を複数個成形可能な圧電素子ユニットにおける外部電極の製造方法において、
圧電素子ユニットを複数個成形可能な圧電基板の圧電部材積層方向の一方の面と基台を接着する工程と、
圧電基板の圧電部材積層方向の他方の面にシールド板を接着する工程と、
基台上の圧電基板を複数の圧電素子ユニットに切断し、各圧電素子ユニットの外部電極の形成面を露出させる工程と、
個別電極の形成面に個別電極形成用の開口部を有するシールドマスクを配設する工程と、基台上の複数の圧電素子ユニットの全てに対して個別電極と共通電極を同時に導電性金属膜で形成する工程と、から成り、
基台は紫外光を透過させる材料で構成されており、基台と圧電基板の接着は両面に接着層を持つＵＶテープを介して行われ、
さらに、基台の圧電素子ユニットの取付け面の裏面側に紫外光を照射して、圧電素子ユニットを基台から取り外す工程を含むことを特徴とする圧電素子ユニットにおける外部電極の製造方法。One of the internal electrodes placed above and below the laminated piezoelectric member is connected to the common electrode of the external electrode, the other of the internal electrodes is connected to the individual electrode of the external electrode, and a voltage is applied between the common electrode and the individual electrode In the method of manufacturing an external electrode in a piezoelectric element unit capable of forming a plurality of stacked piezoelectric elements in which displacement occurs in the stacking direction of the piezoelectric members to be stacked,
Bonding one surface of the piezoelectric member stacking direction of the piezoelectric substrate capable of forming a plurality of piezoelectric element units and the base;
Bonding a shield plate to the other surface of the piezoelectric substrate in the piezoelectric member stacking direction;
Cutting the piezoelectric substrate on the base into a plurality of piezoelectric element units, exposing the formation surface of the external electrode of each piezoelectric element unit;
A process of disposing a shield mask having openings for forming individual electrodes on the surface on which the individual electrodes are formed, and a conductive metal film for the individual electrodes and the common electrode for all of the plurality of piezoelectric element units on the base. a step of forming, Ri consists,
The base is made of a material that transmits ultraviolet light, and the base and the piezoelectric substrate are bonded via UV tape having an adhesive layer on both sides.
The method of manufacturing an external electrode in the piezoelectric element unit further includes the step of irradiating the back surface side of the mounting surface of the piezoelectric element unit of the base with ultraviolet light to remove the piezoelectric element unit from the base . 積層する圧電部材の上下に配設する内部電極の一方を外部電極の共通電極に、内部電極の他方を外部電極の個別電極に、交互に接続され、共通電極と個別電極の間に電圧を印加することにより積層する圧電部材の積層方向に変位が発生する積層型圧電素子を複数個成形可能な圧電素子ユニットにおける外部電極の製造方法において、
圧電素子ユニットを複数個成形可能な圧電基板の圧電部材積層方向の一方の面と基台を接着する工程と、
圧電基板の圧電部材積層方向の他方の面にシールド板を接着する工程と、
基台上の圧電基板を複数の圧電素子ユニットに切断し、各圧電素子ユニットの外部電極の形成面を露出させる工程と、
個別電極の形成面に個別電極形成用の開口部を有するシールドマスクを配設する工程と、基台上の複数の圧電素子ユニットの全てに対して個別電極と共通電極を同時に導電性金属膜で形成する工程と、から成り、
基台上の圧電基板を複数の圧電素子ユニットに切断されてできた両対向面には、共通電極同士または個別電極同士を形成し、
基台は紫外光を透過させる材料で構成されており、基台と圧電基板の接着は両面に接着層を持つＵＶテープを介して行われ、
さらに、基台の圧電素子ユニットの取付け面の裏面側に紫外光を照射して、圧電素子ユニットを基台から取り外す工程を含むことを特徴とする圧電素子ユニットにおける外部電極の製造方法。One of the internal electrodes placed above and below the laminated piezoelectric member is connected to the common electrode of the external electrode, the other of the internal electrodes is connected to the individual electrode of the external electrode, and a voltage is applied between the common electrode and the individual electrode In the method of manufacturing an external electrode in a piezoelectric element unit capable of forming a plurality of stacked piezoelectric elements in which displacement occurs in the stacking direction of the piezoelectric members to be stacked,
Bonding one surface of the piezoelectric member stacking direction of the piezoelectric substrate capable of forming a plurality of piezoelectric element units and the base;
Bonding a shield plate to the other surface of the piezoelectric substrate in the piezoelectric member stacking direction;
Cutting the piezoelectric substrate on the base into a plurality of piezoelectric element units, exposing the formation surface of the external electrode of each piezoelectric element unit;
A process of disposing a shield mask having openings for forming individual electrodes on the surface on which the individual electrodes are formed, and a conductive metal film for the individual electrodes and the common electrode for all of the plurality of piezoelectric element units on the base. a step of forming, Ri consists,
On both opposing surfaces made by cutting the piezoelectric substrate on the base into a plurality of piezoelectric element units, common electrodes or individual electrodes are formed,
The base is made of a material that transmits ultraviolet light, and the base and the piezoelectric substrate are bonded via UV tape having an adhesive layer on both sides.
The method of manufacturing an external electrode in the piezoelectric element unit further includes the step of irradiating the back surface side of the mounting surface of the piezoelectric element unit of the base with ultraviolet light to remove the piezoelectric element unit from the base . 請求項１又は２記載の圧電素子ユニットにおける外部電極の製造方法において、
基台には、切断手段が基台と接触することがないように逃げ溝が形成されていることを特徴とする圧電素子ユニットにおける外部電極の製造方法。In the manufacturing method of the external electrode in the piezoelectric element unit according to claim 1 or 2 ,
A method of manufacturing an external electrode in a piezoelectric element unit, wherein a relief groove is formed in the base so that the cutting means does not come into contact with the base. 請求項１乃至３のいずれか１項記載の圧電素子ユニットにおける外部電極の製造方法において、
前記シールドマスクは断面Ｕ字状の形状であり、基台上の圧電基板を複数の圧電素子ユニットに切断されてできた両対向面に前記シールドマスクの開口部が形成される面が密着する構造であることを特徴とする圧電素子ユニットにおける外部電極の製造方法。In the manufacturing method of the external electrode in the piezoelectric element unit of any one of Claims 1 thru | or 3 ,
The shield mask has a U-shaped cross section, and has a structure in which a surface on which the opening of the shield mask is formed closely contacts both opposing surfaces formed by cutting a piezoelectric substrate on a base into a plurality of piezoelectric element units. A method of manufacturing an external electrode in a piezoelectric element unit, characterized in that:
JP17211399A 1999-06-18 1999-06-18 Method for manufacturing external electrode in piezoelectric element unit Expired - Fee Related JP4385265B2 (en)

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