JP4374317B2 - 電子部品用接着テープ組成物 - Google Patents
電子部品用接着テープ組成物 Download PDFInfo
- Publication number
- JP4374317B2 JP4374317B2 JP2005004187A JP2005004187A JP4374317B2 JP 4374317 B2 JP4374317 B2 JP 4374317B2 JP 2005004187 A JP2005004187 A JP 2005004187A JP 2005004187 A JP2005004187 A JP 2005004187A JP 4374317 B2 JP4374317 B2 JP 4374317B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- adhesive tape
- adhesive
- parts
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L13/00—Compositions of rubbers containing carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1476—Release layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
Description
(特性評価方法)
〔接着力評価〕
〔熱分解温度評価〕
〔電気的信頼性評価〕
Claims (1)
- 10〜60重量%のアクリロニトリルと1〜20重量%のカルボキシル基とを含み、重量平均分子量が3,000〜200,000であるNBR100重量部と、
5〜300重量部のエポキシ樹脂と、
50〜200重量部のフェノール樹脂と、
2〜50重量部の酸無水物系硬化剤と、を含み、
前記フェノール樹脂は、リング・アンド・ボール法(ring and ball method)によって測定され、軟化点が50〜120℃であり、下記式1で表されるフェノール樹脂を含有することを特徴とする、接着テープ組成物。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040084712A KR100637322B1 (ko) | 2004-10-22 | 2004-10-22 | 전자부품용 접착테이프 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006117899A JP2006117899A (ja) | 2006-05-11 |
JP4374317B2 true JP4374317B2 (ja) | 2009-12-02 |
Family
ID=36206977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005004187A Expired - Fee Related JP4374317B2 (ja) | 2004-10-22 | 2005-01-11 | 電子部品用接着テープ組成物 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20060089465A1 (ja) |
JP (1) | JP4374317B2 (ja) |
KR (1) | KR100637322B1 (ja) |
CN (1) | CN100352880C (ja) |
SG (1) | SG121926A1 (ja) |
TW (1) | TWI283263B (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100635053B1 (ko) * | 2005-06-21 | 2006-10-16 | 도레이새한 주식회사 | 전자부품용 접착테이프 |
KR100637322B1 (ko) * | 2004-10-22 | 2006-10-20 | 도레이새한 주식회사 | 전자부품용 접착테이프 조성물 |
CN100434490C (zh) * | 2006-07-04 | 2008-11-19 | 上海市合成树脂研究所 | 一种阻尼钢板用胶粘剂的制备方法 |
KR100831153B1 (ko) | 2006-10-26 | 2008-05-20 | 제일모직주식회사 | 반도체 조립용 접착 필름 조성물, 이에 의한 접착 필름 및이를 포함하는 다이싱 다이본드 필름 |
KR100818501B1 (ko) * | 2006-12-06 | 2008-03-31 | 김범진 | 속경화성 접착조성물 및 이를 이용한 전자소재용접착테이프 |
KR100844383B1 (ko) * | 2007-03-13 | 2008-07-07 | 도레이새한 주식회사 | 반도체 칩 적층용 접착 필름 |
JP2009029843A (ja) * | 2007-07-24 | 2009-02-12 | Sekisui Chem Co Ltd | 半導体用接着剤及び半導体用接着テープ |
US20090253834A1 (en) * | 2008-04-08 | 2009-10-08 | E. I. Du Pont De Nemours And Company | Adhesive compositions useful in flexible circuit substrate applications and methods relating thereto |
DE102009025641A1 (de) * | 2009-06-17 | 2010-12-23 | Tesa Se | Verwendung von hitzeaktivierbaren Klebebändern für die Verklebung von flexiblen Leiterplatten |
KR101171352B1 (ko) | 2010-06-23 | 2012-08-10 | 도레이첨단소재 주식회사 | 내열성과 접착력이 우수한 열경화성 양면 접착 필름 |
KR101332176B1 (ko) * | 2011-05-31 | 2013-11-22 | 넥센타이어 주식회사 | 타이어 카카스용 인너 코팅 조성물 |
KR101208082B1 (ko) * | 2011-08-02 | 2012-12-05 | 도레이첨단소재 주식회사 | 반도체 공정용 점착테이프 및 이를 이용한 반도체 장치의 제조방법 |
TW201336955A (zh) * | 2012-03-02 | 2013-09-16 | Tang-Chieh Huang | 接著劑組合物及其應用 |
WO2014172128A1 (en) * | 2013-04-19 | 2014-10-23 | Dow Global Technologies Llc | Adhesive compositions, manufacture and use thereof |
WO2017091974A1 (en) * | 2015-12-01 | 2017-06-08 | 3M Innovative Properties Company | B-stageable adhesive composition |
JP6864471B2 (ja) * | 2016-12-26 | 2021-04-28 | マクセルホールディングス株式会社 | 熱接着テープおよび熱接着テープの製造方法 |
JP7088423B1 (ja) | 2020-07-17 | 2022-06-21 | 東洋紡株式会社 | 接着剤組成物、接着シート、積層体およびプリント配線板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4473674A (en) * | 1983-11-03 | 1984-09-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for improving mechanical properties of epoxy resins by addition of cobalt ions |
DE69026219T2 (de) * | 1989-12-19 | 1996-09-05 | Mitsubishi Chem Corp | Epoxyharz imprägnierte Glasmatte mit einer Kleberschicht |
EP1048709A1 (en) * | 1998-10-30 | 2000-11-02 | Mitsui Chemicals, Inc. | Adhesive composition |
EP1026217B1 (en) * | 1999-02-08 | 2003-04-23 | Toray Saehan Inc. | Method of producing adhesive tape for electronic parts |
KR100931744B1 (ko) * | 2000-02-15 | 2009-12-14 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
ATE317881T1 (de) * | 2000-12-01 | 2006-03-15 | 3M Innovative Properties Co | Vernetzte haftklebemittelzusammensetzungen sowie auf diesen basierende, für hochtemperaturanwendungen verwendbare klebende gegenstände |
KR100707732B1 (ko) * | 2001-10-29 | 2007-04-16 | 주식회사 코오롱 | 전자부품용 접착액 및 접착테이프 |
JP2004231932A (ja) * | 2002-12-02 | 2004-08-19 | Nitto Denko Corp | 接着剤組成物、接着フィルムおよびこれを用いた半導体装置 |
KR100633849B1 (ko) * | 2002-04-03 | 2006-10-13 | 가부시키가이샤 도모에가와 세이시쇼 | 반도체 장치 제조용 접착 시트 |
US7247683B2 (en) * | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
KR100637322B1 (ko) * | 2004-10-22 | 2006-10-20 | 도레이새한 주식회사 | 전자부품용 접착테이프 조성물 |
KR100844383B1 (ko) * | 2007-03-13 | 2008-07-07 | 도레이새한 주식회사 | 반도체 칩 적층용 접착 필름 |
-
2004
- 2004-10-22 KR KR1020040084712A patent/KR100637322B1/ko active IP Right Grant
-
2005
- 2005-01-04 SG SG200500281A patent/SG121926A1/en unknown
- 2005-01-07 TW TW94100472A patent/TWI283263B/zh not_active IP Right Cessation
- 2005-01-11 JP JP2005004187A patent/JP4374317B2/ja not_active Expired - Fee Related
- 2005-03-07 CN CNB2005100530935A patent/CN100352880C/zh not_active Expired - Fee Related
- 2005-04-18 US US11/107,894 patent/US20060089465A1/en not_active Abandoned
-
2008
- 2008-08-12 US US12/190,241 patent/US20090011166A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TWI283263B (en) | 2007-07-01 |
US20090011166A1 (en) | 2009-01-08 |
TW200613497A (en) | 2006-05-01 |
KR100637322B1 (ko) | 2006-10-20 |
CN100352880C (zh) | 2007-12-05 |
US20060089465A1 (en) | 2006-04-27 |
JP2006117899A (ja) | 2006-05-11 |
KR20060035285A (ko) | 2006-04-26 |
CN1763145A (zh) | 2006-04-26 |
SG121926A1 (en) | 2006-05-26 |
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