JP4361828B2 - 樹脂封止型半導体装置 - Google Patents
樹脂封止型半導体装置 Download PDFInfo
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- JP4361828B2 JP4361828B2 JP2004136249A JP2004136249A JP4361828B2 JP 4361828 B2 JP4361828 B2 JP 4361828B2 JP 2004136249 A JP2004136249 A JP 2004136249A JP 2004136249 A JP2004136249 A JP 2004136249A JP 4361828 B2 JP4361828 B2 JP 4361828B2
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
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- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
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- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
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- H01L2924/181—Encapsulation
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
該半導体素子の第1の電極パッドに接続されたボンディングワイヤと、
前記半導体素子及び前記ボンディングワイヤを封止する封止樹脂と
を有する樹脂封止型半導体装置であって、
前記半導体素子は、前記第1の電極パッドとは異なる第2の電極パッド前記表面に有し、該第2の電極パッドは半導体装置に組み込まれた際に外部と電気的に接続されない電極パッドであって、前記第2の電極パッド上に突起状部材が接合されたことを特徴とする樹脂封止型半導体装置。
前記突起状部材はワイヤの先端の球状部を前記第2の電極パッドに押圧しながら接合して形成されたバンプであることを特徴とする樹脂封止型半導体装置。
前記バンプは、前記第1の電極パッドに接合されたボンディングワイヤの接合部の形状及び寸法と実質的に同じ形状及び寸法を有することを特徴とする樹脂封止型半導体装置。
前記バンプは、前記第1の電極パッドに接合されたボンディングワイヤの接合部の形状及び寸法より大きい形状及び寸法を有することを特徴とする樹脂封止型半導体装置。
前記バンプの上に重ねて接合されたバンプを更に有することを特徴とする樹脂封止型半導体装置。
前記突起状部材は、互いに隣接した前記第2の電極パッド同士を接続するワイヤであることを特徴とする樹脂封止型半導体装置。
前記ワイヤは前記ボンディングワイヤと同じ材料よりなることを特徴とする樹脂封止型半導体装置。
前記第2の電極パッドは、前記半導体素子の動作機能としては必要のないダミー電極であることを特徴とする樹脂封止型半導体装置。
前記第2の電極パッドは、前記半導体素子の位置認識マークであることを特徴とする樹脂封止型半導体装置。
該半導体素子の電極パッドに接続されたボンディングワイヤと、
前記半導体素子及び前記ボンディングワイヤを封止する封止樹脂と
を有する樹脂封止型半導体装置であって、
前記電極パッド上に前記ボンディングワイヤとは別個の突起状部材が接合されたことを特徴とする樹脂封止型半導体装置。
前記突起状部材はワイヤの先端の球状部を前記電極パッドに押圧しながら接合して形成されたバンプであることを特徴とする樹脂封止型半導体装置。
前記バンプは、前記電極パッドに接合されたボンディングワイヤの接合部の形状及び寸法と実質的に同じ形状及び寸法を有することを特徴とする樹脂封止型半導体装置。
前記バンプは、前記電極パッドに接合されたボンディングワイヤの接合部の形状及び寸法より大きい形状及び寸法を有することを特徴とする樹脂封止型半導体装置。
前記バンプの上に重ねて接合されたバンプを更に有することを特徴とする樹脂封止型半導体装置。
4 電極パッド
4A 試験用電極パッド
4B 電極パッド
6 ボンディングワイヤ
8 窒化膜
10 ポリイミド膜
12 バンプ
20,22,24,26 スタッドバンプ
21 アンダーカット部
28 ボンディングワイヤ
30 アライメントメーク
32 ダミー電極パッド
Claims (3)
- 外部と電気的に接続される第1の電極パッドと、外部と電気的に接続されない第2の電極パッドとを表面に有する半導体素子と、
前記第1の電極パッドに接続されたボンディングワイヤと、
前記第2の電極パッド上に形成された突起状部材と、
前記半導体素子及び前記ボンディングワイヤ及び前記突起状部材を封止する封止樹脂と
を有し、
前記突起状部材は前記第2の電極パッド上に形成された第1のバンプと、前記第1のバンプ上に形成された第2のバンプとの積層構造であることを特徴とする樹脂封止型半導体装置。 - 請求項1記載の樹脂封止型半導体装置であって、
前記第1のバンプはワイヤの先端の球状部を前記第2の電極パッドに押圧しながら接合して形成されたバンプであることを特徴とする樹脂封止型半導体装置。 - 請求項1記載の樹脂封止型半導体装置であって、
前記第2の電極パッドは、前記半導体素子の動作機能としては必要のないダミー電極であることを特徴とする樹脂封止型半導体装置。
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JP2004136249A JP4361828B2 (ja) | 2004-04-30 | 2004-04-30 | 樹脂封止型半導体装置 |
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JP2005317860A JP2005317860A (ja) | 2005-11-10 |
JP4361828B2 true JP4361828B2 (ja) | 2009-11-11 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4956048B2 (ja) * | 2006-05-19 | 2012-06-20 | 株式会社テラミクロス | 半導体装置およびその製造方法 |
JP2009038145A (ja) * | 2007-07-31 | 2009-02-19 | Toshiba Components Co Ltd | リード端子型半導体装置 |
JP6125332B2 (ja) * | 2013-05-31 | 2017-05-10 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2017092212A (ja) * | 2015-11-09 | 2017-05-25 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP2023037280A (ja) * | 2021-09-03 | 2023-03-15 | 株式会社デンソー | 半導体装置 |
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