JP4358189B2 - Substrate processing method - Google Patents

Substrate processing method Download PDF

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JP4358189B2
JP4358189B2 JP2006008940A JP2006008940A JP4358189B2 JP 4358189 B2 JP4358189 B2 JP 4358189B2 JP 2006008940 A JP2006008940 A JP 2006008940A JP 2006008940 A JP2006008940 A JP 2006008940A JP 4358189 B2 JP4358189 B2 JP 4358189B2
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substrate
plate
resist
exposure
light
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JP2007192918A (en
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等 大久保
淳 赤川
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TDK Corp
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本発明は、柔軟性を有する基板の加工方法に関する。   The present invention relates to a method for processing a flexible substrate.

電子部品を搭載する基板の加工におけるリソグラフィでは、所定パターンのマスクを用いて、基板の表面に形成したレジストの露光が行われる。かかる基板の中には、例えばフレキシブル基板のように柔軟性を有するものも存在する。柔軟性を有する基板は、基板表面のうねりや歪みが生じ易いため、露光パターンの精度低下が問題となる。   In lithography for processing a substrate on which an electronic component is mounted, a resist formed on the surface of the substrate is exposed using a mask having a predetermined pattern. Some of these substrates have flexibility such as a flexible substrate. Since a flexible substrate tends to cause undulation and distortion of the substrate surface, there is a problem that the accuracy of the exposure pattern is lowered.

そこで、このような基板における露光パターンの精度向上を図る技術として、例えば特許文献１に記載の露光装置がある。この従来の露光装置では、柔軟性を有するプリント基板材をワーク保持板に吸着させた後、高圧空気によってワーク保持板をガラスマスクに押圧している。これにより、プリント基板材をワーク保持板とガラスマスクとで挟み込み、プリント基板材とガラスマスクとの密着性を高めている。
特開平１１−８４６７７号公報 Thus, as a technique for improving the accuracy of the exposure pattern on such a substrate, for example, there is an exposure apparatus described in Patent Document 1. In this conventional exposure apparatus, after a flexible printed circuit board material is adsorbed to a work holding plate, the work holding plate is pressed against a glass mask by high-pressure air. Thereby, the printed board material is sandwiched between the work holding plate and the glass mask, and the adhesion between the printed board material and the glass mask is enhanced.
Japanese Patent Laid-Open No. 11-84777

しかしながら、上述した従来の露光装置は、基板の形状をガラスマスクの表面形状に追従させるものであり、基板自体の平坦化を図ったものではない。そのため、露光パターンの精度向上には限界があった。また、従来の露光装置では、高圧空気を供給するためのコンプレッサやノズル等が必要であり、構成が非常に複雑となっている。その上、ワーク保持板には多数の吸気孔が設けられているので、例えば貫通孔などが加工された基板など、露光しようとする基板の加工状態によっては、プリント基板材とガラスマスクとの密着性を確保できず、露光パターンの精度向上を図ることが困難であった。   However, the above-described conventional exposure apparatus makes the shape of the substrate follow the surface shape of the glass mask, and does not attempt to flatten the substrate itself. For this reason, there has been a limit to improving the accuracy of the exposure pattern. Further, the conventional exposure apparatus requires a compressor, a nozzle, and the like for supplying high-pressure air, and the configuration is very complicated. In addition, since the work holding plate is provided with a large number of air intake holes, depending on the processing state of the substrate to be exposed, such as a substrate on which through holes are processed, the printed circuit board material and the glass mask are in close contact with each other. Therefore, it has been difficult to improve the accuracy of the exposure pattern.

本発明は、上記課題の解決のためになされたものであり、基板の加工状態によらずに、簡単な構成で露光パターンの精度を向上させることができる基板の加工方法を提供することを目的とする。   The present invention has been made to solve the above problems, and an object of the present invention is to provide a substrate processing method capable of improving the accuracy of an exposure pattern with a simple configuration regardless of the processing state of the substrate. And

上記課題の解決のため、本発明に係る基板の加工方法は、柔軟性を有する基板の加工方法であって、基板の表面にレジスト層を形成するレジスト形成工程と、レジストに所定パターンを形成するパターン形成工程とを備え、パターン形成工程は、載置板を用意し、レジスト層が形成された基板を載置板上に載置する載置工程と、載置板に載置した基板上に、露光光に対して透過性を有する光透過板を載置し、載置板と光透過板とによって基板を挟持する挟持工程と、所定パターンが設けられたマスクを介し、挟持された基板のレジスト層に光透過板側から露光光を照射する照射工程とを含むことを特徴としている。   In order to solve the above-mentioned problems, a substrate processing method according to the present invention is a flexible substrate processing method, in which a resist layer is formed on a surface of a substrate, and a predetermined pattern is formed on the resist. A pattern forming step, wherein the pattern forming step prepares a mounting plate and places the substrate on which the resist layer is formed on the mounting plate; and on the substrate placed on the mounting plate. A sandwiching step of placing a light transmissive plate that is transmissive to exposure light, sandwiching the substrate between the placement plate and the light transmissive plate, and a substrate sandwiched via a mask provided with a predetermined pattern And an irradiation step of irradiating the resist layer with exposure light from the light transmitting plate side.

この基板の加工方法では、柔軟性を有する基板を載置板と光透過板とによって挟持し、基板を平坦化する。これにより、基板表面のうねりや歪みが解消されるため、マスクの画像が基板に忠実に再現され、露光パターンの精度の向上を図ることができる。また、この基板の加工方法では、基板の平坦化にあたり、光透過板の自重を利用して基板を載置板側に押し付けるので、従来のように高圧空気を供給する手段は不要であり、構成を極めて簡単化できる。さらには、載置板に吸気孔等を設ける必要もないため、基板の加工状態によらずに露光パターンの精度向上を実現できる。   In this substrate processing method, a flexible substrate is sandwiched between a mounting plate and a light transmission plate to flatten the substrate. This eliminates the undulation and distortion of the substrate surface, so that the mask image is faithfully reproduced on the substrate, and the accuracy of the exposure pattern can be improved. Further, in this substrate processing method, when flattening the substrate, the substrate is pressed against the mounting plate side using the weight of the light transmitting plate, so there is no need for a means for supplying high-pressure air as in the prior art. Can be greatly simplified. Furthermore, since it is not necessary to provide an intake hole or the like on the mounting plate, it is possible to improve the accuracy of the exposure pattern regardless of the processing state of the substrate.

また、本発明に係る基板の加工方法は、柔軟性を有する基板の加工方法であって、基板の表面にレジスト層を形成するレジスト形成工程と、レジストに所定パターンを形成するパターン形成工程とを備え、パターン形成工程は、粘着性を有するシート体が設けられた載置板を用意し、シート体を介してレジスト層が形成された基板を載置板に載置する載置工程と、所定パターンが設けられたマスクを介し、載置された基板のレジスト層に露光光を照射する照射工程とを含むことを特徴としている。   The substrate processing method according to the present invention is a flexible substrate processing method comprising: a resist forming step of forming a resist layer on the surface of the substrate; and a pattern forming step of forming a predetermined pattern on the resist. The pattern forming step includes a mounting step in which a mounting plate provided with a sticky sheet body is provided, and a substrate on which a resist layer is formed via the sheet body is mounted on the mounting plate; And an irradiation step of irradiating the resist layer of the placed substrate with exposure light through a mask provided with a pattern.

この基板の加工方法では、粘着性を有するシート体を介して柔軟性を有する基板を載置板に載置することで、基板を平坦化する。これにより、基板表面のうねりや歪みが解消されるため、マスクの画像が基板に忠実に再現され、露光パターンの精度の向上を図ることができる。また、この基板の加工方法では、基板の平坦化にあたり、シート体の粘着性を利用して基板を載置板に固定するので、従来のように高圧空気を供給する手段は不要であり、構成を極めて簡単化できる。さらには、載置板に吸気孔等を設ける必要もないため、基板の加工状態によらずに露光パターンの精度向上を実現できる。   In this substrate processing method, the substrate is flattened by placing the flexible substrate on the placement plate via the adhesive sheet. This eliminates the undulation and distortion of the substrate surface, so that the mask image is faithfully reproduced on the substrate, and the accuracy of the exposure pattern can be improved. Further, in this substrate processing method, when the substrate is flattened, the substrate is fixed to the mounting plate by using the adhesiveness of the sheet body, so there is no need for a means for supplying high-pressure air as in the prior art. Can be greatly simplified. Furthermore, since it is not necessary to provide an intake hole or the like on the mounting plate, it is possible to improve the accuracy of the exposure pattern regardless of the processing state of the substrate.

また、パターン形成工程は、載置板に載置した基板上に、露光光に対して透過性を有する光透過板を載置し、載置板と光透過板とによって基板を挟持する挟持工程を更に含み、照射工程において、所定パターンが設けられたマスクを介し、挟持された基板のレジスト層に光透過板側から露光光を照射することが好ましい。この場合、粘着性を有するシート体を介して柔軟性を有する基板を載置板に載置した上で、更に載置板と光透過板とによって基板を挟持するので、当該基板をより平坦化できる。したがって、露光パターンの精度を一層向上させることができる。   In the pattern forming step, a light transmission plate having transparency to exposure light is placed on the substrate placed on the placement plate, and the substrate is sandwiched between the placement plate and the light transmission plate. In the irradiation step, it is preferable to irradiate the resist layer of the sandwiched substrate with exposure light from the light transmitting plate side through a mask provided with a predetermined pattern. In this case, after placing the flexible substrate on the placement plate via the adhesive sheet, the substrate is further sandwiched between the placement plate and the light transmission plate, so that the substrate is further flattened. it can. Therefore, the accuracy of the exposure pattern can be further improved.

以上説明したように、本発明に係る基板の加工方法によれば、基板の加工状態によらずに、簡単な構成で露光パターンの精度を向上させることができる。   As described above, according to the substrate processing method of the present invention, it is possible to improve the accuracy of the exposure pattern with a simple configuration regardless of the processing state of the substrate.

以下、図面を参照しながら、本発明に係る基板の加工方法の好適な実施形態について詳細に説明する。   Hereinafter, preferred embodiments of a substrate processing method according to the present invention will be described in detail with reference to the drawings.

［第１実施形態］
図１は、本発明に係る基板の加工方法の一実施形態を用いて製造される基板の一例として示すコイル基板の平面図である。図１に示すように、コイル基板１は、一辺が数ｍｍの略正方形状の絶縁板２を有している。絶縁板２は、いわゆるフレキシブル基板であり、例えばポリイミド樹脂によって厚さ約６０μｍに形成され、折り曲げ可能な程度の柔軟性を有している。 [First Embodiment]
FIG. 1 is a plan view of a coil substrate shown as an example of a substrate manufactured using an embodiment of a substrate processing method according to the present invention. As shown in FIG. 1, the coil substrate 1 has a substantially square-shaped insulating plate 2 having a side of several millimeters. The insulating plate 2 is a so-called flexible substrate, and is formed with a thickness of about 60 μm using, for example, a polyimide resin, and has flexibility enough to be bent.

絶縁板２の略中央には、コイル基板１を収容するフェライトコアの内脚部（図示しない）を挿通させるための円形の開口３が形成されている。絶縁板２の両面の各隅部には、導出端電極４がそれぞれ形成されている。   A circular opening 3 through which an inner leg portion (not shown) of a ferrite core that accommodates the coil substrate 1 is inserted is formed substantially at the center of the insulating plate 2. Derived end electrodes 4 are formed at the respective corners on both sides of the insulating plate 2.

また、コイル基板１の両面には、例えばＣｕなどの導体材料をめっき成長させることにより、開口３を囲む渦巻状のコイル５ａ，５ｂが形成されている。この両面のコイル５ａ，５ｂの一端部同士は、開口３の周縁部に設けられたコンタクト部６を介して電気的に接続され、各コイル５ａ，５ｂの他端部は、絶縁板２の一方の辺側に設けられた導出端電極４と、他方の辺側に設けられた導出端電極４とにそれぞれ電気的に接続されている。   Further, spiral coils 5 a and 5 b surrounding the opening 3 are formed on both surfaces of the coil substrate 1 by plating and growing a conductive material such as Cu. One end portions of the coils 5 a and 5 b on both sides are electrically connected via a contact portion 6 provided on the peripheral edge of the opening 3, and the other end portions of the coils 5 a and 5 b are connected to one side of the insulating plate 2. The lead-out end electrode 4 provided on the other side and the lead-out end electrode 4 provided on the other side are respectively electrically connected.

したがって、絶縁板２の一方の辺側に設けられた導出端電極４と、他方の辺側に設けられた導出端電極４との間に所定の電圧を印加すると、絶縁板２の両面に形成されているコイル５ａ，５ｂ間に電流が生じるようになっている。   Therefore, when a predetermined voltage is applied between the leading end electrode 4 provided on one side of the insulating plate 2 and the leading end electrode 4 provided on the other side, the insulating plate 2 is formed on both surfaces. A current is generated between the coils 5a and 5b.

次に、上述したコイル基板１の加工方法について、図２〜図４を参照しながら説明する。   Next, the processing method of the coil board | substrate 1 mentioned above is demonstrated, referring FIGS.

まず、図２（ａ）に示すように、絶縁板２を準備する。絶縁板２は、厚さが６０μｍのポリイミド樹脂であり、折り曲げ可能な程度の柔軟性を有している。絶縁板２の略中央には、上述した円形の開口３（図２においては図示しない）が既に形成されている。この絶縁板２の両面に、図２（ｂ）に示すように、例えば無電解めっき法によって銅からなる下地層１０，１０をそれぞれ形成する。   First, as shown in FIG. 2A, an insulating plate 2 is prepared. The insulating plate 2 is a polyimide resin having a thickness of 60 μm, and has flexibility enough to be bent. The above-described circular opening 3 (not shown in FIG. 2) is already formed in the approximate center of the insulating plate 2. As shown in FIG. 2B, base layers 10 and 10 made of copper are formed on both surfaces of the insulating plate 2 by, for example, an electroless plating method.

次に、図２（ｃ）に示すように、例えば感光性ドライフィルムをラミネートし、絶縁板２の両面に形成した下地層１０，１０の表面に、ネガ型のレジスト層１１，１１をそれぞれ形成する。これにより、レジスト付絶縁板１２が形成される。このレジスト付絶縁板１２も、絶縁板２と同程度の柔軟性を有しており、折り曲げ自在となっている。   Next, as shown in FIG. 2C, for example, a photosensitive dry film is laminated, and negative resist layers 11 and 11 are formed on the surfaces of the underlayers 10 and 10 formed on both surfaces of the insulating plate 2, respectively. To do. Thereby, the insulating board 12 with a resist is formed. This resist-attached insulating plate 12 also has the same degree of flexibility as the insulating plate 2 and can be bent.

続いて、図３に示すように、ステンレス製の露光用搬送板（載置板）１３を用意する。この露光用搬送板１３の表面の平坦度は、レジスト付絶縁板１２の表面の平坦度よりも高くなっている。   Subsequently, as shown in FIG. 3, a stainless steel exposure transport plate (mounting plate) 13 is prepared. The flatness of the surface of the exposure transport plate 13 is higher than the flatness of the surface of the insulating plate 12 with resist.

次に、図４（ａ）に示すように、レジスト付絶縁板１２を露光用搬送板１３上に載置する。さらに、図４（ｂ）に示すように、露光用搬送板１３に載置したレジスト付絶縁板１２上に、露光光に対する透過性を有するガラス製の光透過板１４を載置し、露光用搬送板１３と光透過板１４とによってレジスト付絶縁板１２を挟持する。   Next, as shown in FIG. 4A, the resist-equipped insulating plate 12 is placed on the exposure transport plate 13. Further, as shown in FIG. 4B, a light transmission plate 14 made of glass having transparency to exposure light is placed on the insulating insulating plate 12 placed on the exposure transport plate 13 and exposed. The insulating plate 12 with resist is sandwiched between the transport plate 13 and the light transmission plate 14.

この光透過板１４の表面の平坦度も、露光用搬送板１３と同様に、レジスト付絶縁板１２の表面の平坦度よりも高くなっている。したがって、光透過板１４をレジスト付絶縁板１２上に載置すると、光透過板１４の自重がレジスト付絶縁板１２の全面に略均等に加わることにより、露光用搬送板１３及び光透過板１４の表面形状に沿って柔軟性を有するレジスト付絶縁板１２が平坦化される。   The flatness of the surface of the light transmission plate 14 is also higher than the flatness of the surface of the insulating plate 12 with resist, as is the case with the exposure transport plate 13. Therefore, when the light transmission plate 14 is placed on the resist-insulated insulating plate 12, the light transmission plate 14 is substantially evenly applied to the entire surface of the resist insulating plate 12, thereby exposing the transport plate 13 and the light transmitting plate 14. The insulating plate 12 with resist having flexibility along the surface shape is flattened.

レジスト付絶縁板１２を露光用搬送板１３と光透過板１４とによって挟持した後、図４（ｃ）に示すように、所定パターンが設けられたマスク１５を光透過板１４の上面側に近接配置し、このマスク１５を介してレジスト付絶縁板１２の一面側のレジスト層１１に光透過板１４側から露光光Ｐを照射する。露光光Ｐとしては、例えばフライアイレンズ及び放物面鏡（図示しない）の組み合わせにより、水銀アークランプからの出射光を平行光としたものを用いる。   After the insulating insulating plate 12 is sandwiched between the exposure transport plate 13 and the light transmitting plate 14, a mask 15 provided with a predetermined pattern is brought close to the upper surface side of the light transmitting plate 14 as shown in FIG. The resist layer 11 on one side of the resist-coated insulating plate 12 is irradiated with the exposure light P from the light transmission plate 14 side through the mask 15. As the exposure light P, for example, a combination of a fly-eye lens and a parabolic mirror (not shown) and the light emitted from the mercury arc lamp as parallel light is used.

レジスト層１１の露光が終了した後、レジスト付絶縁板１２の上下を反転させ、再びレジスト付絶縁板１２を露光用搬送板１３と光透過板１４とによって挟持し、図４（ｃ）と同様の状態で、レジスト付絶縁板１２の他面側のレジスト層１１に光透過板１４側から露光光Ｐを照射する。   After the exposure of the resist layer 11 is finished, the insulating plate 12 with resist is turned upside down, and the insulating plate 12 with resist is sandwiched again by the exposure transport plate 13 and the light transmission plate 14, as in FIG. In this state, the exposure light P is irradiated from the light transmission plate 14 side to the resist layer 11 on the other surface side of the insulating plate 12 with resist.

露光光Ｐの照射の後、例えば炭酸ナトリウム水溶液などの現像液を用いてレジスト付絶縁板１２の両面を同時に現像する。これにより、図５（ａ）に示すように、レジスト層１１，１１において、コイル５ａ，５ｂ（図１参照）を形成する領域に対応する位置に開口部１１ａがそれぞれパターン形成される。   After the exposure light P is irradiated, both surfaces of the resist-coated insulating plate 12 are simultaneously developed using a developer such as an aqueous sodium carbonate solution. Thereby, as shown in FIG. 5A, in the resist layers 11 and 11, openings 11a are formed in patterns at positions corresponding to regions where the coils 5a and 5b (see FIG. 1) are formed.

次に、開口部１１ａがパターン形成されたレジスト層１１，１１をマスクとして、例えば電解めっき法により、図５（ｂ）に示すように、レジスト付絶縁板１２の両面にコイル導体用めっき層１６ａ，１６ｂを形成する。コイル導体用めっき層１６ａ，１６ｂをそれぞれ所定の高さまで成長させた後、例えば水酸化ナトリウム水溶液を用いて、図５（ｃ）に示すように、絶縁板２の両面に残るレジスト層１１，１１を剥離する。   Next, using the resist layers 11 and 11 with the openings 11a formed as a mask, as shown in FIG. 5B, for example, by electroplating, the coil conductor plating layers 16a are formed on both surfaces of the insulating insulating plate 12 as shown in FIG. , 16b. After the coil conductor plating layers 16a and 16b are grown to a predetermined height, the resist layers 11 and 11 remaining on both surfaces of the insulating plate 2 are formed using, for example, an aqueous sodium hydroxide solution as shown in FIG. Peel off.

そして、図５（ｄ）に示すように、例えばアルカリエッチャントによって下地層１０，１０をエッチングし、コイル導体用めっき層１６ａ，１６ｂの頂面を研磨してコイル５ａ，５ｂを形成すると、図１に示したコイル基板１が完成する。   Then, as shown in FIG. 5D, when the base layers 10 and 10 are etched by, for example, an alkali etchant and the top surfaces of the coil conductor plating layers 16a and 16b are polished to form the coils 5a and 5b, FIG. The coil substrate 1 shown in FIG.

この基板の加工方法では、柔軟性を有するレジスト付絶縁板１２を露光用搬送板１３と光透過板１４とによって挟持し、レジスト付絶縁板１２を平坦化する。これにより、レジスト付絶縁板１２の表面のうねりや歪みが解消されるため、マスク１５の画像がレジスト付絶縁板１２に忠実に再現され、露光パターンの精度の向上を図ることができる。   In this substrate processing method, the resist-equipped insulating plate 12 having flexibility is sandwiched between the exposure transport plate 13 and the light transmission plate 14 to flatten the resist-equipped insulating plate 12. As a result, undulation and distortion of the surface of the resist-coated insulating plate 12 are eliminated, so that the image of the mask 15 is faithfully reproduced on the resist-coated insulating plate 12 and the accuracy of the exposure pattern can be improved.

また、この基板の加工方法では、レジスト付絶縁板１２の平坦化にあたり、光透過板１４の自重を利用してレジスト付絶縁板１２を露光用搬送板１３側に押し付けるので、従来のように高圧空気を供給する手段は不要であり、構成を極めて簡単化できる。さらには、露光用搬送板１３に吸気孔等を設ける必要もないため、上述したレジスト付絶縁板１２のように、円形の開口３が設けられているような基板に対しても、露光パターンの精度向上を実現できる。   Further, in this substrate processing method, when the insulating plate 12 with resist is flattened, the resist-insulating plate 12 is pressed against the exposure transport plate 13 side by utilizing the weight of the light transmitting plate 14, so that a high pressure is applied as in the prior art. No means for supplying air is required, and the configuration can be greatly simplified. Furthermore, since it is not necessary to provide an intake hole or the like in the exposure transport plate 13, the exposure pattern can be applied to a substrate having a circular opening 3 as in the above-described insulating plate 12 with resist. Improve accuracy.

［第２実施形態］
続いて、本発明に係る基板の加工方法の第２実施形態について説明する。この実施形態は、露光用搬送板１３と光透過板１４とによってレジスト付絶縁板１２を挟持するにあたり、粘着性を有するシート体２０を更に用いる点で、上述した第１実施形態と相違している。 [Second Embodiment]
Next, a second embodiment of the substrate processing method according to the present invention will be described. This embodiment is different from the above-described first embodiment in that an adhesive sheet body 20 is further used when the resist-carrying insulating plate 12 is sandwiched between the exposure transport plate 13 and the light transmission plate 14. Yes.

すなわち、第２実施形態においては、図６に示すように、粘着性を有するシート体２０を設けた露光用搬送板１３を準備する。このシート体２０は、例えばシリコンによって形成されており、接着剤等によって露光用搬送板１３の上面側に強固に固定されている。シート体２０の粘着性は、レジスト付絶縁板１２を着脱可能に固定（仮固定）できる程度の微弱なものとなっている。   That is, in the second embodiment, as shown in FIG. 6, an exposure transport plate 13 provided with an adhesive sheet 20 is prepared. The sheet body 20 is made of silicon, for example, and is firmly fixed to the upper surface side of the exposure transport plate 13 with an adhesive or the like. The adhesiveness of the sheet 20 is so weak that the resist-attached insulating plate 12 can be detachably fixed (temporarily fixed).

次に、図７（ａ）に示すように、レジスト付絶縁板１２をシート体２０上に載置する。このとき、レジスト付絶縁板１２は、図７（ｂ）に示すように、シート体２０の粘着性により、シート体２０の表面形状に沿って平坦化された状態でシート体２０の上面側に仮固定される。   Next, as shown in FIG. 7A, the resist-equipped insulating plate 12 is placed on the sheet body 20. At this time, as shown in FIG. 7B, the resist-attached insulating plate 12 is flattened along the surface shape of the sheet body 20 due to the adhesiveness of the sheet body 20, on the upper surface side of the sheet body 20. Temporarily fixed.

さらに、図７（ｃ）に示すように、シート体２０に載置したレジスト付絶縁板１２上に、光透過板１４を載置し、露光用搬送板１３と光透過板１４とによってレジスト付絶縁板１２を挟持する。これにより、光透過板１４の自重がレジスト付絶縁板１２の全面に略均等に加わり、柔軟性を有するレジスト付絶縁板１２が一層平坦化される。   Further, as shown in FIG. 7C, a light transmission plate 14 is placed on the resist insulating plate 12 placed on the sheet body 20, and the resist is attached by the exposure transport plate 13 and the light transmission plate 14. The insulating plate 12 is sandwiched. As a result, the weight of the light transmission plate 14 is applied to the entire surface of the resist-insulated plate 12 almost evenly, and the resist-insulated plate 12 having flexibility is further flattened.

レジスト付絶縁板１２を露光用搬送板１３と光透過板１４とによって挟持した後、図７（ｄ）に示すように、所定パターンが設けられたマスク１５を光透過板１４の上面側に近接配置し、このマスク１５を介してレジスト付絶縁板１２の一面側のレジスト層１１に光透過板１４側から露光光Ｐを照射する。   After the insulating insulating plate 12 is sandwiched between the exposure transport plate 13 and the light transmitting plate 14, a mask 15 provided with a predetermined pattern is brought close to the upper surface side of the light transmitting plate 14 as shown in FIG. The resist layer 11 on one side of the resist-coated insulating plate 12 is irradiated with the exposure light P from the light transmission plate 14 side through the mask 15.

レジスト層１１の露光が終了した後、レジスト付絶縁板１２の上下を反転させ、再びレジスト付絶縁板１２を露光用搬送板１３上のシート体２０に仮固定する。さらに、レジスト付絶縁板１２を露光用搬送板１３と光透過板１４とによって挟持し、図７（ｄ）と同様の状態で、レジスト付絶縁板１２の他面側のレジスト層１１に光透過板１４側から露光光Ｐを照射する。   After the exposure of the resist layer 11 is completed, the resist-coated insulating plate 12 is turned upside down, and the resist-coated insulating plate 12 is temporarily fixed to the sheet body 20 on the exposure transport plate 13 again. Further, the insulating insulating plate 12 is sandwiched between the exposure transport plate 13 and the light transmitting plate 14, and light is transmitted to the resist layer 11 on the other surface side of the insulating insulating plate 12 in the same state as in FIG. The exposure light P is irradiated from the plate 14 side.

この後、第１実施形態と同様に、レジスト層１１，１１の現像処理を行い、このレジスト層１１，１１をマスクとして、レジスト付絶縁板１２の両面にコイル導体用めっき層１６ａ，１６ｂを形成する。そして、コイル導体用めっき層１６ａ，１６ｂの頂面を研磨してコイル５ａ，５ｂを形成すると、図１に示したコイル基板１が完成する。   Thereafter, similarly to the first embodiment, the resist layers 11 and 11 are developed, and the coil conductor plating layers 16a and 16b are formed on both surfaces of the resist-coated insulating plate 12 using the resist layers 11 and 11 as a mask. To do. When the top surfaces of the coil conductor plating layers 16a and 16b are polished to form the coils 5a and 5b, the coil substrate 1 shown in FIG. 1 is completed.

この基板の加工方法では、粘着性を有するシート体２０上にレジスト付絶縁板１２を載置し、シート体２０の表面形状に沿ってレジスト付絶縁板１２を平坦化した上で、露光用搬送板１３と光透過板１４とによってレジスト付絶縁板１２を挟持する。したがって、レジスト付絶縁板１２をより確実に平坦化でき、露光パターンの精度の一層向上を実現できる。   In this substrate processing method, the resist-coated insulating plate 12 is placed on the adhesive sheet body 20, the resist-coated insulating plate 12 is flattened along the surface shape of the sheet body 20, and then transported for exposure. The insulating plate 12 with resist is sandwiched between the plate 13 and the light transmitting plate 14. Therefore, the insulating insulating plate 12 can be flattened more reliably, and the exposure pattern accuracy can be further improved.

また、第１実施形態と同様に、レジスト付絶縁板１２の平坦化にあたり、光透過板１４の自重を利用してレジスト付絶縁板１２を露光用搬送板１３側に押し付けるので、構成を極めて簡単化できると共に、レジスト付絶縁板１２の加工状態によらずに露光パターンの精度向上を実現できる。   Further, as in the first embodiment, when the insulating insulating plate 12 with the resist is flattened, the resist insulating plate 12 is pressed against the exposure transport plate 13 side by utilizing the weight of the light transmitting plate 14, so that the configuration is very simple. In addition, the accuracy of the exposure pattern can be improved regardless of the processing state of the insulating plate with resist 12.

本発明は、上記実施形態に限られるものではない。本発明に係る基板の加工方法は、柔軟性を有する基板であれば、材質、厚さ、層数などに関わらず適用可能である。また、シート体２０の材料は、基板を着脱可能に固定できる程度の粘着性を有しているものであればよく、上述したシリコンに限られない。このような材料としては、例えばポリプロピレン、ポリイミド、ポリブチレンテレフタラートなどが挙げられる。   The present invention is not limited to the above embodiment. The substrate processing method according to the present invention is applicable to any flexible substrate, regardless of the material, thickness, number of layers, and the like. Moreover, the material of the sheet | seat body 20 should just have adhesiveness of the grade which can fix a board | substrate so that attachment or detachment is possible, and is not restricted to the silicon | silicone mentioned above. Examples of such a material include polypropylene, polyimide, polybutylene terephthalate, and the like.

また、第２実施形態では、シート体２０に載置したレジスト付絶縁板１２上に、更に光透過板１４を載置しているが、図８に示すように、光透過板１４を載置せず、レジスト付絶縁板１２の上面側にマスク１５を近接配置して露光を行うようにしてもよい。この場合、光透過板１４を載置する工程を省略できるので、加工コストの低減化を図りつつ、十分な露光パターン精度が得られる。   In the second embodiment, the light transmission plate 14 is further placed on the resist-equipped insulating plate 12 placed on the sheet body 20, but the light transmission plate 14 is placed as shown in FIG. Instead, exposure may be performed by placing the mask 15 close to the upper surface of the resist-equipped insulating plate 12. In this case, since the step of placing the light transmission plate 14 can be omitted, sufficient exposure pattern accuracy can be obtained while reducing the processing cost.

本発明に係る基板の加工方法の一実施形態を用いて製造される基板の一例として示すコイル基板の平面図である。It is a top view of the coil board | substrate shown as an example of the board | substrate manufactured using one Embodiment of the processing method of the board | substrate which concerns on this invention. 本発明の第１実施形態に係る基板の加工方法を示す図である。It is a figure which shows the processing method of the board | substrate which concerns on 1st Embodiment of this invention. 露光用搬送板の斜視図である。It is a perspective view of the conveyance board for exposure. 図２の後続の工程を示す図である。FIG. 3 is a diagram showing a step subsequent to FIG. 2. 図３の後続の工程を示す図である。FIG. 4 is a diagram showing a step subsequent to FIG. 3. シート体が設けられた露光用搬送板の斜視図である。It is a perspective view of the conveyance board for exposure provided with the sheet | seat body. 本発明の第２実施形態に係る基板の加工方法を示す図である。It is a figure which shows the processing method of the board | substrate which concerns on 2nd Embodiment of this invention. 本発明の変形例に係る基板の加工方法を示す図である。It is a figure which shows the processing method of the board | substrate which concerns on the modification of this invention.

符号の説明Explanation of symbols

２…絶縁板、１１…レジスト層、１２…レジスト付絶縁板、１３…載置板、１４…光透過板、１５…マスク、２０…シート体。
DESCRIPTION OF SYMBOLS 2 ... Insulating board, 11 ... Resist layer, 12 ... Insulating board with a resist, 13 ... Mounting board, 14 ... Light transmissive board, 15 ... Mask, 20 ... Sheet body.

Claims (3)

柔軟性を有する基板の加工方法であって、
前記基板の表面にレジスト層を形成するレジスト形成工程と、
前記レジストに所定パターンを形成するパターン形成工程とを備え、
前記パターン形成工程は、
載置板を用意し、前記レジスト層が形成された前記基板を前記載置板上に載置する載置工程と、
前記載置板に載置した前記基板上に、露光光に対して透過性を有する光透過板を載置し、前記載置板と前記光透過板とによって前記基板を挟持する挟持工程と、
所定パターンが設けられたマスクを介し、前記挟持された基板の前記レジスト層に前記光透過板側から露光光を照射する照射工程とを含むことを特徴とする基板の加工方法。 A substrate processing method having flexibility,
A resist forming step of forming a resist layer on the surface of the substrate;
A pattern forming step of forming a predetermined pattern on the resist,
The pattern forming step includes
Preparing a mounting plate, and mounting the substrate on which the resist layer is formed on the mounting plate;
A sandwiching step of placing a light transmissive plate having transparency to exposure light on the substrate placed on the placement plate, and sandwiching the substrate by the placement plate and the light transmissive plate,
An irradiation step of irradiating the resist layer of the sandwiched substrate with exposure light from the light transmitting plate side through a mask provided with a predetermined pattern. 柔軟性を有する基板の加工方法であって、
前記基板の表面にレジスト層を形成するレジスト形成工程と、
前記レジストに所定パターンを形成するパターン形成工程とを備え、
前記パターン形成工程は、
粘着性を有するシート体が設けられ、前記基板の平坦度よりも高い平坦度を有する載置板を用意し、前記シート体の表面形状に沿って平坦化した状態で前記レジスト層が形成された前記基板を前記載置板に載置する載置工程と、
所定パターンが設けられたマスクを介し、前記載置された基板の前記レジスト層に露光光を照射する照射工程とを含むことを特徴とする基板の加工方法。 A substrate processing method having flexibility,
A resist forming step of forming a resist layer on the surface of the substrate;
A pattern forming step of forming a predetermined pattern on the resist,
The pattern forming step includes
An adhesive sheet was provided , a mounting plate having a flatness higher than the flatness of the substrate was prepared, and the resist layer was formed in a state of being flattened along the surface shape of the sheet A mounting step of mounting the substrate on the mounting plate;
An irradiation step of irradiating the resist layer of the previously placed substrate with exposure light through a mask provided with a predetermined pattern. 前記パターン形成工程は、
前記載置板に載置した前記基板上に、露光光に対して透過性を有する光透過板を載置し、前記載置板と前記光透過板とによって前記基板を挟持する挟持工程を更に含み、
前記照射工程において、前記所定パターンが設けられたマスクを介し、前記挟持された基板の前記レジスト層に前記光透過板側から露光光を照射することを特徴とする請求項２記載の基板の加工方法。 The pattern forming step includes
A clamping step of placing a light transmissive plate having transparency to exposure light on the substrate placed on the placement plate, and sandwiching the substrate by the placement plate and the light transmission plate; Including
3. The substrate processing according to claim 2, wherein, in the irradiation step, exposure light is irradiated from the light transmitting plate side to the resist layer of the sandwiched substrate through a mask provided with the predetermined pattern. Method.
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