JP4342327B2 - Single wafer coating method - Google Patents

Single wafer coating method Download PDF

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JP4342327B2
JP4342327B2 JP2004016924A JP2004016924A JP4342327B2 JP 4342327 B2 JP4342327 B2 JP 4342327B2 JP 2004016924 A JP2004016924 A JP 2004016924A JP 2004016924 A JP2004016924 A JP 2004016924A JP 4342327 B2 JP4342327 B2 JP 4342327B2
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coating
film
coating liquid
slit nozzle
chromaticity
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JP2005205363A (en
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力也 松本
昭雄 酒井
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Tokyo Ohka Kogyo Co Ltd
Sumitomo Chemical Co Ltd
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Tokyo Ohka Kogyo Co Ltd
Sumitomo Chemical Co Ltd
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Priority to JP2004016924A priority Critical patent/JP4342327B2/en
Priority to TW094101445A priority patent/TWI293581B/en
Priority to KR1020050006493A priority patent/KR101092136B1/en
Priority to CNB2005100063247A priority patent/CN100478083C/en
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    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06J—PLEATING, KILTING OR GOFFERING TEXTILE FABRICS OR WEARING APPAREL
    • D06J1/00—Pleating, kilting or goffering textile fabrics or wearing apparel
    • D06J1/10—Pleating, kilting or goffering textile fabrics or wearing apparel continuously and longitudinally to the direction of feed
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06C—FINISHING, DRESSING, TENTERING OR STRETCHING TEXTILE FABRICS
    • D06C23/00—Making patterns or designs on fabrics
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06C—FINISHING, DRESSING, TENTERING OR STRETCHING TEXTILE FABRICS
    • D06C7/00—Heating or cooling textile fabrics
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06J—PLEATING, KILTING OR GOFFERING TEXTILE FABRICS OR WEARING APPAREL
    • D06J1/00—Pleating, kilting or goffering textile fabrics or wearing apparel
    • D06J1/12—Forms of pleats or the like

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  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Coating Apparatus (AREA)
  • Materials For Photolithography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

本発明は、板状被処理物表面に形成した被膜の膜厚、色度および／または光学濃度を測定し、この測定結果をフィードバックし、所定の膜厚、色度および／または光学濃度に達していない場合には、所定の処置を行う枚葉塗膜形成装置及び枚葉塗膜形成方法に関する。   The present invention measures the film thickness, chromaticity and / or optical density of the coating formed on the surface of the plate-shaped workpiece, feeds back the measurement results, and reaches a predetermined film thickness, chromaticity and / or optical density. If not, the present invention relates to a single-wafer coating film forming apparatus and a single-wafer coating film forming method for performing a predetermined treatment.

従来にあって、半導体ウェーハやガラス基板等の板状被処理物表面にレジスト液等を塗布するには、スピンナー上に載置した被処理物の中心部にノズルから塗布液を滴下して供給し、スピンナーによって被処理物を回転させることで発生する遠心力で塗布液を外方に向けて拡散せしめ、その後ベークして完成することとしている。この方法では、均一な塗布膜を安定して形成することができ、一度塗布条件を設定してしまえば、塗布膜の厚みを一枚毎測定しなくても、均一な塗布膜を形成することができた。   Conventionally, in order to apply a resist solution or the like to the surface of a plate-like workpiece such as a semiconductor wafer or a glass substrate, the coating solution is dropped from a nozzle and supplied to the center of the workpiece placed on the spinner. Then, the coating liquid is diffused outward by centrifugal force generated by rotating the object to be processed by a spinner, and then baked to complete. With this method, a uniform coating film can be stably formed. Once the coating conditions are set, a uniform coating film can be formed without measuring the thickness of each coating film. I was able to.

しかしながら、供給する塗布液量に比べて実際塗布膜として基板上に残る塗布液量が少なすぎる。つまり、塗布液として使用されないまま捨てられてしまう塗布液量が多すぎる。更に、基板のサイズが大きくなるにつれて捨てられる塗布液量も多くなり、その量は無視できないものになった。そこで、スピンナー塗布の代わりにノズル自体に所定幅の塗布液吐出口を開口せしめ、ノズルを移動することで被処理物表面に所定幅で塗布液を塗布することが考えられている。   However, the amount of the coating liquid remaining on the substrate as the actual coating film is too small compared to the amount of the coating liquid to be supplied. That is, the amount of the coating liquid that is discarded without being used as the coating liquid is too large. Furthermore, as the size of the substrate increases, the amount of coating solution discarded increases, and the amount cannot be ignored. Therefore, it is considered that a coating liquid discharge port having a predetermined width is opened in the nozzle itself instead of spinner coating, and the coating liquid is applied to the surface of the object to be processed with a predetermined width by moving the nozzle.

上述した所定幅の塗布液吐出口を有するスリットノズルを用いれば、塗布液の無駄をなくし且つ効率的に塗布を行えるのであるが、被処理基板を回転させないので、最初に塗布した塗膜の厚みがそのまま膜厚となる。よって、供給する塗布液量も配管等のエアによって塗膜の厚みが不均一になることがある。また、この膜厚の不均一が色度もしくは光学濃度の不均一を発生することになる。したがって、スリットノズルで塗布する場合には、塗膜の厚み、色度および／または光学濃度が設定する条件を満たしているか否かを検査して制御しなければならない。   If the slit nozzle having the coating liquid discharge port of the predetermined width described above is used, the coating liquid is not wasted and the coating can be performed efficiently, but the substrate to be processed is not rotated, so the thickness of the coating film first applied. Becomes the film thickness as it is. Therefore, the amount of the coating liquid to be supplied may be uneven due to the air such as piping. In addition, this non-uniform film thickness causes non-uniform chromaticity or optical density. Therefore, when applying with a slit nozzle, it is necessary to inspect and control whether the thickness, chromaticity, and / or optical density of the coating film satisfy the set conditions.

そこで、スリットノズル下方向近傍に配備された吐出膜厚寸法測定センサーからの信号により、制御手段が予めインプットされた吐出膜厚寸法値と帯板走行速度との関係プログラムを介して帯材表面塗工膜厚寸法値を算出し、操作盤上の表示パネル等に送信してスリットノズルの吐出膜厚を制御する。また、走行する帯材表面上の塗工膜厚寸法は、スリットノズル後方側に設けられて帯材の板幅方向に連続的にトラバースしながら測定を行う塗工膜厚測定センサーにより確認される。その設定誤差が確認された場合に、ラインを停止することなく操作盤の運転によって微調整を行うことが提案されている。（特許文献１）   In view of this, the belt surface coating is performed through a program for the relationship between the discharge film thickness dimension value previously input by the control means and the strip travel speed based on a signal from a discharge film thickness measurement sensor provided in the vicinity of the slit nozzle downward direction. The processed film thickness dimension value is calculated and transmitted to a display panel or the like on the operation panel to control the discharge film thickness of the slit nozzle. In addition, the coating film thickness dimension on the traveling strip material surface is confirmed by a coating film thickness measurement sensor provided on the rear side of the slit nozzle and continuously traversing in the strip width direction of the strip material. . When the setting error is confirmed, it is proposed that fine adjustment is performed by operating the operation panel without stopping the line. (Patent Document 1)

特開平０７−２０４５６１号公報（第２頁〜第３頁、図２）Japanese Patent Application Laid-Open No. 07-204561 (2nd to 3rd pages, FIG. 2)

しかしながら、上記特開平０７−２０４５６１号公報に開示されているスリットノズル塗装装置は、スリットノズル下方向近傍に配備された吐出膜厚寸法測定センサー及びスリットノズル後方側に設けられて帯材の板幅方向にトラバースしながら測定を行う塗工膜厚測定センサーにより、帯材を走行させながら帯材の膜厚をコントロールしているので、枚葉塗布で問題となる塗膜開始位置に近い部分の膜厚変動や色度変動および／または光学濃度変動を検出することが難しい。とくに塗工液供給配管内に気泡が存在すると、塗工開始直後の膜厚や色度および／または光学濃度のバラツキが大きくなる問題もある。   However, the slit nozzle coating apparatus disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 07-204561 is provided on the back side of the slit film thickness measurement sensor and the slit nozzle provided in the vicinity of the slit nozzle, and the width of the strip material is provided. The coating film thickness sensor that measures while traversing in the direction controls the film thickness of the strip while the strip is running. It is difficult to detect thickness variation, chromaticity variation and / or optical density variation. In particular, when air bubbles are present in the coating liquid supply pipe, there is a problem that variations in film thickness, chromaticity and / or optical density immediately after the start of coating increase.

本発明は、上記の問題に鑑みてなされたものであり、塗膜開始位置近傍の塗膜の厚みのバラツキがなく、板状被処理物上に所定厚の被膜を形成する枚葉塗膜形成装置及び枚葉塗膜形成方法を提供することを目的とする。   The present invention has been made in view of the above problems, and there is no variation in the thickness of the coating film in the vicinity of the coating film starting position, and a single-wafer coating film formation that forms a coating film of a predetermined thickness on a plate-like object to be processed It is an object of the present invention to provide an apparatus and a sheet-fed coating film forming method.

上記課題を解決すべく本願発明の塗膜形成装置は、板状被処理物の表面にスリットノズルで塗布液を供給する塗布装置と、前記板状被処理物の表面に塗布した塗布液をある程度乾燥（搬送中に波打ったり、流れたりしない程度）せしめる減圧乾燥装置と、このある程度乾燥せしめられた塗布液を更に乾燥せしめて被膜とする加熱装置とを備える枚葉塗膜形成装置において、前記加熱によって形成された被膜の膜厚、色度および／または光学濃度を測定装置で測定し、その測定結果を前記塗布装置にフィードバックする膜厚測定装置を設けた構成とした。   In order to solve the above problems, the coating film forming apparatus of the present invention comprises a coating device for supplying a coating liquid to the surface of a plate-like object to be processed with a slit nozzle, and a coating liquid applied to the surface of the plate-like object to some extent. In the single-wafer coating film forming apparatus, comprising: a reduced-pressure drying apparatus that dries (to the extent that it does not wave or flow during conveyance); and a heating apparatus that further dries the coating liquid that has been dried to some extent to form a film. The thickness, chromaticity and / or optical density of the film formed by heating was measured with a measuring device, and a film thickness measuring device for feeding back the measurement result to the coating device was provided.

また、本発明に係る枚葉塗膜形成方法は、板状被処理物の表面にスリットノズルで塗布液を供給し、次に前記板状被処理物表面の塗布液を減圧乾燥して塗布液をある程度乾燥せしめ、次いで加熱することで更に塗布液を乾燥させて被膜とし、この被膜の膜厚、色度および／または光学濃度を測定装置で測定し、この測定結果が所定の値に達していない場合に、前記塗布装置を一時停止し、スリットノズルからエア抜き及び／又は先端洗浄を行った後に、再び塗布装置を稼動させるようにした。   Further, the sheet coating film forming method according to the present invention supplies the coating liquid to the surface of the plate-like object to be processed with a slit nozzle, and then the coating liquid on the surface of the plate-like object to be dried under reduced pressure. The coating solution is further dried by heating to a certain degree to form a film, and the film thickness, chromaticity and / or optical density of the film is measured with a measuring device, and the measurement result reaches a predetermined value. If not, the coating device was temporarily stopped, and after removing air from the slit nozzle and / or cleaning the tip, the coating device was operated again.

本発明によれば、塗膜形成後の板状被処理物の膜厚、色度および／または光学濃度を測定して、その結果、所定の値と異なった値を測定した場合に、塗膜形成装置を止め、枚葉塗布液供給用配管内のエア抜きやノズルの先端洗浄等の必要な処置を行うことで、異常事態に速やかに対応することができるようになる。   According to the present invention, when the film thickness, chromaticity and / or optical density of the plate-like workpiece after coating film formation is measured, and as a result, a value different from a predetermined value is measured, By stopping the forming apparatus and performing necessary measures such as bleeding of air in the single-wafer coating solution supply pipe and cleaning of the tip of the nozzle, an abnormal situation can be quickly dealt with.

以下に本発明の実施の形態を添付図面に基づいて説明する。ここで、図１は、本発明に係る枚葉塗膜形成装置の構成図であり、図２は、本発明に係る枚葉塗膜形成装置のチャート図である。   Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is a block diagram of the single wafer coating film forming apparatus according to the present invention, and FIG. 2 is a chart diagram of the single wafer coating film forming apparatus according to the present invention.

図１に示すように、枚葉塗膜形成装置は、送込み部と、塗布装置と、減圧乾燥装置と、受取部と、加熱装置及び冷却装置と、搬送部と、分配部とからなる。塗布装置には、スリットノズルが設けられている。このスリットノズルには、ポンプＡを通って塗布液が供給され、エアバルブＡがその供給量をコントロールし、また、エアバルブＢ及びポンプＢを通って、スリットノズル用エア抜きタンクと接続している。なお、エアバルブＢは、スリットノズルのエアを抜く以外には常に閉めている。   As shown in FIG. 1, the sheet coating film forming apparatus includes a feeding section, a coating apparatus, a vacuum drying apparatus, a receiving section, a heating apparatus and a cooling apparatus, a transport section, and a distribution section. The coating apparatus is provided with a slit nozzle. A coating liquid is supplied to the slit nozzle through the pump A, the air valve A controls the supply amount, and the slit nozzle is connected to an air vent tank for the slit nozzle through the air valve B and the pump B. Note that the air valve B is always closed except for removing air from the slit nozzle.

また、減圧乾燥装置では短時間のうちに、塗布液全体から塗布液中の溶媒をある程度除去した生乾き状態とし、搬送中に塗布液が波打ったり、流れ落ちることがないようにする。なお、減圧乾燥せずに、加熱装置でいきなり加熱すると、塗膜の表面のみが固まる現象が生じやすく、塗膜中に溶媒が濃度勾配をもって残存する傾向にあり好ましくない。   Further, in the vacuum drying apparatus, the solvent in the coating solution is removed to some extent from the entire coating solution in a short time so that the coating solution does not wave or flow down during conveyance. In addition, if the heating apparatus is suddenly heated without drying under reduced pressure, a phenomenon that only the surface of the coating film hardens easily occurs, and the solvent tends to remain in the coating film with a concentration gradient.

また、本実施例の加熱装置は、一回３枚の板状被処理物をベークすることができ、冷却装置は、一回１枚の板状被処理物を冷却することができる。更に、搬送部の後部に板状被処理物の膜厚、色度および／または光学濃度を測定する測定装置が設けられている。この測定装置は、コントローラセンサーによって、エアバルブＡ及びＢの開閉をコントロールする。   Moreover, the heating apparatus of a present Example can bake three plate-shaped to-be-processed objects once, and a cooling device can cool one plate-shaped to-be-processed object once. Furthermore, a measuring device for measuring the film thickness, chromaticity and / or optical density of the plate-like workpiece is provided at the rear part of the transport unit. This measuring device controls the opening and closing of the air valves A and B by a controller sensor.

このように、塗布装置に送られてきた板状被処理物上にスリットノズルから塗布液を供給して、そして減圧乾燥装置で減圧乾燥をしてから、受取部を経て、ロボットによって加熱装置に送られる。加熱装置ではベークされた板状被処理物は、冷却装置で冷却した後に搬送部に設けた測定装置によって、膜厚、色度および／または光学濃度を測定する。本実施例で用いた膜厚測定装置は、色度測定機である。この色度測定機は、色で膜厚の厚さを測定する。なお、膜厚測定は、色度測定機に限らない。   In this way, the coating liquid is supplied from the slit nozzle onto the plate-like object to be sent to the coating apparatus, and is dried under reduced pressure by the reduced pressure drying apparatus, and then passed through the receiving section and then transferred to the heating apparatus by the robot. Sent. The plate-like object to be baked in the heating device is cooled by the cooling device, and then measured for film thickness, chromaticity and / or optical density by a measuring device provided in the transport unit. The film thickness measuring apparatus used in this example is a chromaticity measuring machine. This chromaticity measuring machine measures the thickness of the film thickness by color. The film thickness measurement is not limited to a chromaticity measuring machine.

また、板状被処理物の測定場所は、とくに制限はないが、少なくとも塗布開始位置と基板中央部を各１点含むことが必要である。本発明の動作例として、赤色の塗膜の膜厚を面内３点の色度値で管理する例を用いて説明する。ここで、管理規格は、中心値±７／１０００とする。   Further, the measurement location of the plate-like workpiece is not particularly limited, but it is necessary to include at least one application start position and one center of the substrate. As an operation example of the present invention, an example in which the film thickness of a red coating film is managed by chromaticity values at three points in the surface will be described. Here, the management standard is a center value ± 7/1000.

図２に示すように、測定結果が規格中心値±７／１０００を超えていない場合には、板状処理物はそのまま分配部に送り込む。一方、測定結果が規格中心値±７／１０００を超えた場合には、アラーム信号が発生して、塗布装置への板状被処理物の送り込みを停止し、スリットノズルはディップ位置で待機すると同時に、エアバブルＡが閉じ、塗布液の送り込みが停止する。   As shown in FIG. 2, when the measurement result does not exceed the standard center value ± 7/1000, the plate-like processed material is sent to the distributor as it is. On the other hand, when the measurement result exceeds the standard center value ± 7/1000, an alarm signal is generated, the feeding of the plate-like workpiece to the coating apparatus is stopped, and the slit nozzle waits at the dip position at the same time. Then, the air bubble A is closed and the feeding of the coating liquid is stopped.

次に、エアバルブＢを開けると、スリットノズルのエア抜きが開始する。そして、スリットノズルの洗浄を行い、プリディスペンスをしてから、アラームを解除して、通常動作に戻って塗布を再開する。   Next, when the air valve B is opened, bleeding of the slit nozzle starts. Then, after the slit nozzle is cleaned and pre-dispensed, the alarm is canceled and the application is resumed by returning to the normal operation.

即ち、板状被処理物上に塗布液を供給し、ベークすることで塗膜を形成するが、塗布液供給用配管内にエアが存在すると、塗り始めの膜厚が所定膜厚よりも薄くなってしまう。また、供給する塗布液量も配管等のエアによってバラつきが生じ、なかなか安定した塗布膜を連続して形成できない。従来は、塗布液タンクとスリットノズルとの間に脱気装置が付いているが、スリットノズル先端でサックバック等の動作を繰り返しているうちに配管内にエアがスリットノズルにたまる。このエアを自動的に抜くことで、塗り始めの膜厚が所定膜厚よりも薄くなる現象を抑制することができる。   That is, a coating film is formed by supplying a coating liquid onto a plate-like object and baking, but if air is present in the coating liquid supply pipe, the film thickness at the start of coating is thinner than a predetermined film thickness. turn into. In addition, the amount of the coating solution to be supplied varies due to the air in the pipe and the like, and it is difficult to continuously form a stable coating film. Conventionally, a deaeration device is provided between the coating solution tank and the slit nozzle, but air accumulates in the slit nozzle while the operation such as suck back is repeated at the slit nozzle tip. By automatically removing this air, it is possible to suppress the phenomenon that the film thickness at the start of coating becomes thinner than the predetermined film thickness.

なお、本実施の形態は、測定機を搬送部に設けたが、受取部又はコンベアに設けても良い。   In this embodiment, the measuring machine is provided in the transport unit, but may be provided in the receiving unit or the conveyor.

ベークした後の膜厚、色度および／または光学濃度を測定して、所定値と異なる場合、一旦塗布装置を停止し、スリットノズルのエアを抜いてから、塗布を再開することで、ばらつきのない塗布膜厚、色度および／または光学濃度を形成することができる。   If the film thickness, chromaticity and / or optical density after baking are measured and differ from the predetermined value, the coating device is stopped, the slit nozzle is evacuated, and then the coating is restarted. No coating thickness, chromaticity and / or optical density can be formed.

本発明に係る枚葉塗膜形成装置の構成図Configuration diagram of single-wafer coating film forming apparatus according to the present invention 本発明に係る枚葉塗膜形成装置のチャート図Chart of single wafer coating film forming apparatus according to the present invention

Claims (1)

板状被処理物の表面にスリットノズルで塗布液を供給し、次に前記板状被処理物表面の塗布液を減圧乾燥して塗布液をある程度乾燥せしめ、次いで加熱することで更に塗布液を乾燥させて被膜とし、この被膜の色度を面内の任意の３点の色度値で管理し、測定結果が規格中心値を超えた場合に、前記塗布装置を一時停止し、エア抜き時以外は常に閉じているエアバルブを開としてスリットノズルからエア抜きを行った後に、再び塗布装置を稼動させることを特徴とする枚葉塗膜形成方法。 The coating liquid is supplied to the surface of the plate-shaped object by slit nozzle, and then the coating liquid on the surface of the plate-shaped object is dried under reduced pressure to dry the coating liquid to a certain extent, and then the coating liquid is further heated by heating. The film is dried to form a film, and the chromaticity of this film is managed with the chromaticity values of any three points in the surface. When the measurement result exceeds the standard center value, the coating device is temporarily stopped and the air is released. always close the are air valve after the air bleeding from the slit nozzle is opened, sheet coating film forming method characterized by operating the coating device again, except.
JP2004016924A 2004-01-26 2004-01-26 Single wafer coating method Expired - Fee Related JP4342327B2 (en)

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JP2004016924A JP4342327B2 (en) 2004-01-26 2004-01-26 Single wafer coating method
TW094101445A TWI293581B (en) 2004-01-26 2005-01-18 Single-wafer coating film apparatus and method
KR1020050006493A KR101092136B1 (en) 2004-01-26 2005-01-25 Single-wafer coating film apparatus and method
CNB2005100063247A CN100478083C (en) 2004-01-26 2005-01-26 Device and method for forming single coating membrane

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JP2004016924A JP4342327B2 (en) 2004-01-26 2004-01-26 Single wafer coating method

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JP4342327B2 true JP4342327B2 (en) 2009-10-14

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KR101327148B1 (en) * 2010-12-23 2013-11-07 주식회사 케이씨텍 Appratus and method for setting attitude of slit nozzle for coating substrate
JP6181358B2 (en) * 2012-07-25 2017-08-16 東京エレクトロン株式会社 Baking process system and method for producing laminate of organic functional film of organic EL element
CN110108218B (en) * 2019-05-20 2021-04-20 成都中电熊猫显示科技有限公司 Adjusting system for glue dispensing rate
CN111434390B (en) * 2019-09-29 2021-09-24 杭州纤纳光电科技有限公司 Slit type coating device

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TWI293581B (en) 2008-02-21
KR20050077022A (en) 2005-07-29
CN100478083C (en) 2009-04-15
KR101092136B1 (en) 2011-12-12
JP2005205363A (en) 2005-08-04
TW200529936A (en) 2005-09-16

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