JP4340890B2 - 発熱検出装置 - Google Patents
発熱検出装置 Download PDFInfo
- Publication number
- JP4340890B2 JP4340890B2 JP2004227151A JP2004227151A JP4340890B2 JP 4340890 B2 JP4340890 B2 JP 4340890B2 JP 2004227151 A JP2004227151 A JP 2004227151A JP 2004227151 A JP2004227151 A JP 2004227151A JP 4340890 B2 JP4340890 B2 JP 4340890B2
- Authority
- JP
- Japan
- Prior art keywords
- heat generation
- temperature
- igbt
- heat
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (4)
- 通電により発熱し液体の流体により冷却される発熱素子と、該発熱素子に配置され該発熱素子の発熱状況を検出する少なくとも一つの感温素子と、を備えてなる発熱検出装置であって、
前記流体の流れ方向において、少なくとも一つの前記感温素子の中央は、前記発熱素子の中央よりも下流側となるように前記発熱素子に配置され、少なくとも一つの前記感温素子は、前記発熱素子の温度分布における最高温度部分に配置されていることを特徴とする発熱検出装置。 - 前記発熱素子は、半導体チップである請求項1に記載の発熱検出装置。
- 前記流体は、冷却管の内部に区画された冷却通路を流れ、
前記発熱素子は、該冷却管の管壁を介して、該流体により冷却される請求項1に記載の発熱検出装置。 - 前記感温素子は、サーマルダイオードである請求項1に記載の発熱検出装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004227151A JP4340890B2 (ja) | 2004-08-03 | 2004-08-03 | 発熱検出装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004227151A JP4340890B2 (ja) | 2004-08-03 | 2004-08-03 | 発熱検出装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006049515A JP2006049515A (ja) | 2006-02-16 |
JP4340890B2 true JP4340890B2 (ja) | 2009-10-07 |
Family
ID=36027742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004227151A Expired - Fee Related JP4340890B2 (ja) | 2004-08-03 | 2004-08-03 | 発熱検出装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4340890B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5167728B2 (ja) * | 2007-08-31 | 2013-03-21 | 株式会社デンソー | 電力変換装置 |
JP2009293986A (ja) * | 2008-06-03 | 2009-12-17 | Denso Corp | 半導体装置 |
FR3022687B1 (fr) * | 2014-06-20 | 2018-02-09 | Valeo Systemes Thermiques | Procede de gestion de la temperature d'un circuit de commande d'un rechauffeur electrique |
JP7056622B2 (ja) * | 2019-04-05 | 2022-04-19 | 株式会社デンソー | 半導体装置 |
-
2004
- 2004-08-03 JP JP2004227151A patent/JP4340890B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006049515A (ja) | 2006-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6164304B2 (ja) | 半導体モジュール用冷却器の製造方法、半導体モジュール用冷却器、半導体モジュール及び電気駆動車両 | |
JP5579234B2 (ja) | 電子回路部品の冷却構造及びそれを用いたインバータ装置 | |
US7687901B2 (en) | Heat dissipating fins opposite semiconductor elements | |
CN104425408B (zh) | 用于3d ic的冷却*** | |
JP4952094B2 (ja) | 半導体モジュール | |
JP2010153785A (ja) | 半導体冷却装置 | |
JP2008172024A (ja) | 発熱体冷却構造及びその構造を備えた駆動装置 | |
JPWO2012105160A1 (ja) | 電池モジュール | |
JP5129942B2 (ja) | 半導体装置 | |
KR20110077486A (ko) | 차량용 배기열 회수 열전 발전 장치 | |
JP6637812B2 (ja) | 半導体装置 | |
JP4340890B2 (ja) | 発熱検出装置 | |
JP5549611B2 (ja) | 炭化珪素半導体装置 | |
US20130186592A1 (en) | Device for detecting temperature of cooling liquid | |
CN216528872U (zh) | 功率装置、变频***和空调设备 | |
JP2007089256A (ja) | Dc−dcコンバータ、半導体モジュール及びその温度検出装置 | |
JP6040656B2 (ja) | 半導体装置 | |
CN114171473A (zh) | 功率装置及其控制方法、变频***和空调设备 | |
JP2013194919A (ja) | 自励振動ヒートパイプ及びプログラム | |
US20190189886A1 (en) | Power supplying device and heating system | |
JP7436237B2 (ja) | モータ駆動システム | |
KR101619626B1 (ko) | 수/공냉 통합형 열전소자 장치 | |
JP2015207670A (ja) | 冷却器 | |
JP4293090B2 (ja) | 冷却装置 | |
JP2008028293A (ja) | 熱電変換素子及びそれを用いた熱電変換モジュール並びに熱電発電装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061003 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081106 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081216 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090202 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090312 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090408 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20090522 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090610 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090623 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120717 Year of fee payment: 3 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 4340890 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120717 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120717 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130717 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |