JP4336617B2 - Printed wiring board and manufacturing method thereof - Google Patents
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- JP4336617B2 JP4336617B2 JP2004145159A JP2004145159A JP4336617B2 JP 4336617 B2 JP4336617 B2 JP 4336617B2 JP 2004145159 A JP2004145159 A JP 2004145159A JP 2004145159 A JP2004145159 A JP 2004145159A JP 4336617 B2 JP4336617 B2 JP 4336617B2
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Description
本発明は、各種電子機器等に使用されるプリント配線基板およびその製造方法に関する。 The present invention relates to a printed wiring board used for various electronic devices and the like and a method for manufacturing the same.
従来より、各種電子機器間の電気的接続等にプリント配線基板が多用されている。 Conventionally, printed wiring boards have been frequently used for electrical connection between various electronic devices.
先ず、従来のプリント配線基板の構造の一例を説明する。 First, an example of the structure of a conventional printed wiring board will be described.
従来のプリント配線基板は、ポリイミドやポリエステル等の樹脂材により形成された絶縁基板を有しており、この絶縁基板上には銀ペースト等により複数の導電パターンが形成されている。そして、前記導電パターン上にはレジスト膜やカバーフィルム等からなる保護層が前記導電パターンを被覆するように形成されている。また、前記保護層の前記各導電パターンの端部に対応する位置には、前記各導電パターンを露出させるようにして開口部が形成されている。そして、前記開口部から露出する各導電パターンの端部には、銅やリン青銅などの下地金属に銀や半田などのめっき加工を施した導電性の金属箔が導電性接着材によって貼着された構造とされている。 A conventional printed wiring board has an insulating substrate formed of a resin material such as polyimide or polyester, and a plurality of conductive patterns are formed on the insulating substrate with silver paste or the like. A protective layer made of a resist film, a cover film or the like is formed on the conductive pattern so as to cover the conductive pattern. An opening is formed at a position corresponding to the end of each conductive pattern of the protective layer so as to expose each conductive pattern. A conductive metal foil obtained by plating a base metal such as copper or phosphor bronze with silver or solder is attached to the end of each conductive pattern exposed from the opening with a conductive adhesive. Structure.
次に、前述の構成のプリント配線基板の製造方法の一例を説明する。 Next, an example of a method for manufacturing a printed wiring board having the above-described configuration will be described.
先ず、複数の導電パターンを絶縁基板に別工程で形成する。そのためには、先ず最初に、ポリエチレン等の可撓性を有する絶縁基板を用意し、次に、これにスクリーン印刷法により導電ペーストを印刷して乾燥させ、複数の導電パターンを絶縁基板に印刷形成する。 First, a plurality of conductive patterns are formed on an insulating substrate in a separate process. To do so, first prepare a flexible insulating substrate such as polyethylene, and then print and dry a conductive paste on the insulating substrate by screen printing to form a plurality of conductive patterns on the insulating substrate. To do.
一方で、所定形状にパターニングされた金属箔を保有する金属箔シートを用意する。そのためには、まず最初に、離型シートの一方の面に異方性導電接着剤をコートし、接着層を形成する。そして、その接着層の上面に、めっき加工を施した1枚の導電性の銅箔からなる金属箔をラミネート加工により貼り付ける。次に、ケミカルエッチング技術やプレス加工技術を用いて1枚の金属箔を部分的に除去し、異方性導電接着剤からなる接着層の上面に、所定形状で金属箔を残存させる。残存した金属箔は、これを後工程において貼着すべき絶縁基板の導電パターンの配置に対し位置的対応関係をもって配設された状態となる。続いて、弱粘着性の接着剤をPETフィルムの一面にコートした微粘着シートを各金属箔を被覆するように接着層の上面に熱ロール加工により貼り付け、圧着用金属箔を形成する。 On the other hand, a metal foil sheet having a metal foil patterned into a predetermined shape is prepared. For this purpose, first, an anisotropic conductive adhesive is coated on one surface of the release sheet to form an adhesive layer. And the metal foil which consists of one electroconductive copper foil which performed the plating process is affixed on the upper surface of the contact bonding layer by a lamination process. Next, one piece of metal foil is partially removed using a chemical etching technique or a press working technique, and the metal foil is left in a predetermined shape on the upper surface of the adhesive layer made of an anisotropic conductive adhesive. The remaining metal foil is in a state of being disposed with a positional correspondence with the arrangement of the conductive pattern of the insulating substrate to be pasted in a subsequent process. Subsequently, a slightly pressure-sensitive adhesive sheet coated on one surface of the PET film with a weak adhesive is attached to the upper surface of the adhesive layer by hot roll processing so as to cover each metal foil, thereby forming a metal foil for pressure bonding.
そして、圧着用金属箔から離型シートを剥離し、複数の金属箔を保持した微粘着シートを、最外層に位置する接着層を絶縁基板に向けて当該絶縁基板に重ね合わせ、各金属箔を各導電パターンの端部に夫々対向させる。 Then, the release sheet is peeled off from the metal foil for pressure bonding, the fine adhesive sheet holding a plurality of metal foils is superposed on the insulating substrate with the adhesive layer positioned at the outermost layer facing the insulating substrate, and each metal foil is It is made to oppose the edge part of each conductive pattern, respectively.
この状態で所定温度に加熱した熱圧着用の治具を微粘着シートの上面に押し当て、微粘着シートを介して前記接着層の異方性導電接着剤を加熱・加圧することによって、各金属箔を夫々対応する各導電パターンの端部に一括転写する。 In this state, a thermocompression bonding jig heated to a predetermined temperature is pressed against the upper surface of the fine pressure-sensitive adhesive sheet, and the anisotropic conductive adhesive of the adhesive layer is heated and pressurized via the fine pressure-sensitive adhesive sheet, thereby each metal. The foil is collectively transferred to the end of each corresponding conductive pattern.
その後に、微粘着シートを剥離し、最後に外形抜きのプレス加工を施して、所定形状の配線構造を有するプリント配線基板を最終切断する。 Thereafter, the slightly adhesive sheet is peeled off, and finally, press working without external shape is performed to finally cut a printed wiring board having a wiring structure of a predetermined shape.
このようにして製造され、構成されたプリント配線基板は、前記各導電パターンの端部に貼着された金属箔部分が、当該プリント配線基板の外部接続端子となる。そして、例えば、電子機器のコネクタに差し込み、前記該電子機器の端子片を当該外部接続端子に弾接させることで電気的な接続を確保したり、または、端子パネルのような他の電子機器の接続端子部と異方性導電材を用いて電気的に接続して電気的に接続させるようにして用いられる。 In the printed wiring board manufactured and configured as described above, the metal foil portion attached to the end of each conductive pattern serves as an external connection terminal of the printed wiring board. And, for example, it is inserted into a connector of an electronic device, and the electrical connection is ensured by elastically contacting the terminal piece of the electronic device to the external connection terminal, or other electronic device such as a terminal panel. The connecting terminal portion and the anisotropic conductive material are used for electrical connection and electrical connection.
ところで、前述のようにしてパターン形成された金属箔はその切断面から下地金属が露出するため腐食が発生し易く、電気的安定性が損なわれることがあった。 By the way, in the metal foil patterned as described above, since the base metal is exposed from the cut surface, corrosion is likely to occur, and electrical stability may be impaired.
そこで、本発明は、外部接続端子を形成する金属箔の腐食を防止し、電気的な接続の信頼性を高めることができるプリント配線基板とその製造方法を提供することを目的とするものである。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a printed wiring board capable of preventing corrosion of a metal foil forming an external connection terminal and enhancing the reliability of electrical connection and a method for manufacturing the same. .
前述した目的を達成するため、本発明のプリント配線基板は、絶縁基板上に、所定形状にパターン形成された金属箔を前記絶縁基板に形成された導電パターンと対応させて電気的接続可能に貼着し、外部接続端子とするプリント配線基板であって、所定形状にパターン形成された前記金属箔の表面のみがめっき処理されており、前記金属箔の側面は、前記絶縁基板上の外部接続端子の形成領域における前記金属箔の非配設領域に配設された異方性導電樹脂材により被覆されていることを特徴とする。 In order to achieve the above-described object, the printed wiring board of the present invention is attached to an insulating substrate so that a metal foil patterned in a predetermined shape can be electrically connected in association with the conductive pattern formed on the insulating substrate. A printed wiring board to be attached and used as an external connection terminal, wherein only the surface of the metal foil patterned in a predetermined shape is plated, and the side surface of the metal foil is an external connection terminal on the insulating substrate It is covered with an anisotropic conductive resin material disposed in a non-arranged region of the metal foil in the formation region.
そしてさらに、前記外部接続端子の形成領域における先端部は平面形状櫛歯状とされ、前記先端部を構成する各凸部および各凹部における先端面には、側面を前記異方性導電樹脂材により被覆された前記金属箔の端面を1つづつ位置させるように切断形成されていることを特徴とする。 Further, the tip end portion in the external connection terminal forming region has a planar comb-tooth shape, and the side surfaces of the tip portions of the convex portions and the concave portions constituting the tip portion are made of the anisotropic conductive resin material. It is cut and formed so that the end faces of the coated metal foils are positioned one by one.
また、本発明のプリント配線基板の製造方法は、表面をめっき加工された金属箔に、絶縁基板に形成された導電パターンの配置に対し位置的対応関係をもった所定形状の外部接続端子のパターンを形成し、前記金属箔の外部接続端子の形成領域における裏面に異方性導表面をめっき加工された金属箔に、絶縁基板に形成された導電パターンの配置に対し位置的対応関係をもった所定形状の外部接続端子のパターンを形成し、前記金属箔の外部接続端子の形成領域における裏面に異方性導電樹脂材を仮圧着させた後、当該金属箔を所定形状に切断して圧着用金属箔を形成し、前記圧着用金属箔と前記導電パターンとを対向するように重ね合わせて前記圧着用金属箔を介して前記異方性導電樹脂材を加圧することにより、前記導電パターンに前記圧着用金属箔を本圧着させるとともに、前記外部接続端子の間隙に前記異方性導電樹脂材を入り込ませた後、前記絶縁基板および圧着用金属箔を所望の外形状に最終切断することを特徴とする。 Further, the printed wiring board manufacturing method of the present invention is a pattern of external connection terminals having a predetermined shape having a positional correspondence with the arrangement of the conductive pattern formed on the insulating substrate on the metal foil whose surface is plated. The metal foil having an anisotropic conductive surface plated on the back surface in the formation region of the external connection terminal of the metal foil has a positional correspondence to the arrangement of the conductive pattern formed on the insulating substrate. forming a pattern of the external connection terminals having a predetermined shape, after the back surface is provisionally crimped anisotropic conductive Denju fat material in the formation area of the external connection terminals of the metal foil, by cutting the metal foil into a predetermined shape forming a crimping metal foil, by pressurizing the anisotropic conductive resin material through said crimping metal foil superposed so as to face the said crimping metal foil and the conductive pattern, before Kishirube The electric pattern Rutotomoni to the crimping worn metal foil, wherein after entering the external connection the anisotropic conductive resin material in a gap terminals, characterized in that the final cutting said insulating substrate and crimping the metal foil into a desired outer shape And
そしてさらに、前記外部接続端子が形成された領域における先端部の形状が、各凸部および各凹部における先端面に側面を前記異方性導電樹脂材により被覆された前記金属箔の端面を1つづつ位置させた平面形状櫛歯状となるように、最終切断することを特徴とする。 Further, the shape of the tip in the region where the external connection terminal is formed is one end face of the metal foil whose side surface is coated with the anisotropic conductive resin material on the tip face of each convex part and each concave part. It is characterized in that it is finally cut so as to form a planar comb-like shape positioned one by one.
本発明のプリント配線基板によれば、外部接続端子を構成する金属箔の側面を異方性導電樹脂材により被覆することにより、金属箔の露出する面における腐食を防止するとともに、金属箔から析出する金属類のマイグレーション現象による、隣位する外部接続端子間の短絡を防止し、電気的接続の安定性を確保することが可能となる。 According to the printed wiring board of the present invention, by covering the side surface of the metal foil constituting the external connection terminal with the anisotropic conductive resin material, corrosion on the exposed surface of the metal foil is prevented and the metal foil is precipitated from the metal foil. It is possible to prevent a short circuit between adjacent external connection terminals due to a metal migration phenomenon, and to ensure the stability of electrical connection.
また、前記外部接続端子の形成領域における先端部を、その平面形状が櫛歯状となるように切断形成し、前記先端部を構成する各凸部および各凹部における先端面に、側面を前記異方性導電樹脂材により被覆された前記金属箔の端面を1つづつ位置させることにより、隣位する外部接続端子を構成する金属箔の露出する端面を前後にずらして配置し、沿面距離を長くすることにより、金属箔から析出する金属類のマイグレーション現象による、隣位する外部接続端子間の短絡を完全に防止することができる。 In addition, the distal end portion in the external connection terminal formation region is cut and formed so that the planar shape thereof is a comb shape, and the side surface is different from the distal end surface of each convex portion and each concave portion constituting the distal end portion. By positioning the end faces of the metal foils coated with the isotropic conductive resin material one by one, the exposed end faces of the metal foils constituting the adjacent external connection terminals are shifted back and forth to increase the creepage distance. By doing so, it is possible to completely prevent a short circuit between adjacent external connection terminals due to a migration phenomenon of metals deposited from the metal foil.
そして、本発明のプリント配線基板の製造方法によれば、圧着用金属箔の外部接続端子の形成領域における裏面に仮圧着された異方性導電性樹脂シートの異方性導電樹脂材を、絶縁基板の導電パターンに前記圧着用金属箔を本圧着する際に、所定形状とされた前記金属箔の外部接続端子間の間隙に入り込ませることで、金属箔の側面を簡単に被覆させることができる。 According to the method for manufacturing a printed wiring board of the present invention, the anisotropic conductive resin material of the anisotropic conductive resin sheet temporarily bonded to the back surface in the formation region of the external connection terminal of the metal foil for crimping is insulated. When the pressure-bonding metal foil is finally pressure-bonded to the conductive pattern of the substrate, the side surface of the metal foil can be easily covered by entering the gap between the external connection terminals of the metal foil having a predetermined shape. .
そして、前記絶縁基板の導電パターンに前記圧着用金属箔を本圧着させた後、所望の外形状に最終切断する際に、前記外部接続端子が形成された領域における先端部の形状が、各凸部および各凹部における先端面に側面を前記異方性導電樹脂材により被覆された前記金属箔の端面を1つづつ位置させた平面形状櫛歯状となるように切断することで、隣位する外部接続端子を構成する金属箔の端面を前後にずらして配置し、隣位する外部接続端子間の沿面距離を長くすることが可能となる。 When the metal foil for crimping is finally crimped to the conductive pattern of the insulating substrate and then finally cut into a desired outer shape, the shape of the tip in the region where the external connection terminal is formed is Next to each other by cutting to form a planar comb-like shape in which the end surfaces of the metal foil whose side surfaces are coated with the anisotropic conductive resin material are positioned one by one on the tip surfaces of the portions and the respective recesses It is possible to increase the creepage distance between the adjacent external connection terminals by shifting the end faces of the metal foil constituting the external connection terminals back and forth.
まず、本発明のプリント配線基板の構造について、図1乃至図5を用いて説明する。 First, the structure of the printed wiring board of the present invention will be described with reference to FIGS.
図1は本発明のプリント配線基板の第1実施形態の構造を説明するための要部斜視図であり、図2はその同じく要部平面図である。 FIG. 1 is a perspective view of an essential part for explaining the structure of the first embodiment of the printed wiring board of the present invention, and FIG.
これらの図に示すように、第1実施形態のプリント配線基板は、ポリイミドやポリエチレン等の樹脂材からなる可撓性を有する絶縁基板1を備えている。この絶縁基板1上には銀ペーストにより複数の導電パターン2が形成されている。前記各導電パターンの先端部には、下地金属としての銅3に金めっき4を施した導電性の金属箔5が、略等間隔に並列する所定パターンを形成するようにして、それぞれ接着材としての異方性導電樹脂材8によって貼着され、当該プリント配線基板における外部接続端子6として形成されている。 As shown in these drawings, the printed wiring board according to the first embodiment includes a flexible insulating substrate 1 made of a resin material such as polyimide or polyethylene. A plurality of conductive patterns 2 are formed on the insulating substrate 1 with silver paste. A conductive metal foil 5 obtained by applying gold plating 4 to copper 3 as a base metal is formed at the tip of each conductive pattern so as to form a predetermined pattern arranged in parallel at substantially equal intervals. The anisotropic conductive resin material 8 is used as an external connection terminal 6 in the printed wiring board.
そして、第1実施形態のプリント配線基板においては、前記絶縁基板1上の外部接続端子6の形成領域(以下、外部接続端子部7という)における前記金属箔5の非配設領域に、異方性導電樹脂材8が、少なくとも各外部接続端子6を構成する金属箔5の側面を被覆するようにして配設されている。 And in the printed wiring board of 1st Embodiment, it is anisotropic in the arrangement | positioning area | region of the said metal foil 5 in the formation area (henceforth the external connection terminal part 7) of the external connection terminal 6 on the said insulated substrate 1. FIG. The conductive conductive resin material 8 is disposed so as to cover at least the side surface of the metal foil 5 constituting each external connection terminal 6.
そして、第1実施形態においては、前記外部接続端子部7の先端部の形状は、先端面を面一とするように切断形成されている。 And in 1st Embodiment, the shape of the front-end | tip part of the said external connection terminal part 7 is cut and formed so that a front-end | tip surface may become flush.
このような構成とされたプリント配線基板は、前記異方性導電樹脂材が外部接続端子6を構成する金属箔5の側面を被覆して、金属箔5の露出面における腐食を防止するとともに、金属箔5から析出する金属類のマイグレーション現象による、隣位する外部接続端子6間の短絡を防止することとなる。よって、このような構成を有するプリント配線基板は、電気的接続の安定性を確保することが可能となる。 In the printed wiring board having such a configuration, the anisotropic conductive resin material covers the side surface of the metal foil 5 constituting the external connection terminal 6, and prevents corrosion on the exposed surface of the metal foil 5, The short circuit between the adjacent external connection terminals 6 due to the migration phenomenon of metals deposited from the metal foil 5 is prevented. Therefore, the printed wiring board having such a configuration can ensure the stability of electrical connection.
また、図3は本発明のプリント配線基板の第2実施形態の構造を説明するための要部斜視図であり、図4はその同じく要部平面図である。 FIG. 3 is a perspective view of a principal part for explaining the structure of a second embodiment of the printed wiring board of the present invention, and FIG. 4 is a plan view of the principal part.
この第2実施形態においても、プリント配線基板の基本的な構造は前記第1実施形態と同様であるが、第2実施形態においては、前記外部接続端子部7の先端部は平面形状櫛歯状とされており、前記櫛歯状の先端部を構成する各凸部9および各凹部10における先端面の前記外部接続端子6の配列方向(幅方向)中央部に、側面を前記異方性導電樹脂材8により被覆された前記金属箔5の端面を1つづつ位置させるようにして切断形成されている。 Also in the second embodiment, the basic structure of the printed wiring board is the same as that of the first embodiment. However, in the second embodiment, the distal end portion of the external connection terminal portion 7 has a planar comb-like shape. The side surfaces of the convex portions 9 and the concave portions 10 constituting the comb-tooth-shaped tip portions are arranged at the center in the arrangement direction (width direction) of the external connection terminals 6 on the tip surfaces. The end surfaces of the metal foils 5 covered with the resin material 8 are cut and formed so as to be positioned one by one.
このような構成とされたプリント配線基板は、平面形状が櫛歯状となるように切断形成された外部接続端子部7の先端部においては、隣位する外部接続端子6を構成する金属箔5の露出する先端面を前後にずらして配置させ、沿面距離を長くすることができるので、金属箔5から析出する金属類のマイグレーション現象による、隣位する外部接続端子6間の短絡を完全に防止することができ、電気的接続の安定性をより確実に確保することが可能となる。 In the printed wiring board having such a configuration, the metal foil 5 constituting the adjacent external connection terminal 6 is formed at the front end portion of the external connection terminal portion 7 that is cut and formed so that the planar shape is comb-like. The exposed tip surface can be shifted back and forth to increase the creeping distance, so that the short circuit between adjacent external connection terminals 6 due to the migration phenomenon of metals deposited from the metal foil 5 is completely prevented. It is possible to ensure the stability of the electrical connection more reliably.
次に、本実施形態のプリント配線基板の製造方法について説明する。 Next, the manufacturing method of the printed wiring board of this embodiment is demonstrated.
先ず、電極としての導電パターン2が形成された絶縁基板1を作成する。つまり、ポリイミドやポリエチレン等の可撓性を有する絶縁基板1を用意し、これに複数の導電パターン2をスクリーン印刷法により導電ペーストを印刷し、乾燥させる。この際、導電ペーストには銀粉末をバインダ樹脂中に含有する導電インクを用いることができる。また、前記絶縁基板1には、後述する圧着用金属箔11との位置合わせマークを形成しておく。 First, the insulating substrate 1 on which the conductive pattern 2 as an electrode is formed is created. That is, a flexible insulating substrate 1 such as polyimide or polyethylene is prepared, and a plurality of conductive patterns 2 are printed on the conductive paste by a screen printing method and dried. At this time, a conductive ink containing silver powder in a binder resin can be used as the conductive paste. In addition, an alignment mark with a metal foil 11 for crimping described later is formed on the insulating substrate 1.
一方で、所定形状にパターニングされた金属箔5と前記金属箔5のパターンの間隙に介在することとなる異方性導電樹脂材8を保有する圧着用金属箔を用意する。つまり、まず最初に、表面に金めっき4が施された1枚の導電性の銅箔からなる金属箔5からプレス加工技術等を用いて不要な部分を除去し、絶縁基板1に形成された導電パターン2の配置に対し位置的対応関係をもった所定形状の外部接続端子6のパターンを形成する。続いて、前記金属箔5の外部接続端子部7における裏面に異方性導電樹脂材8を配置し、所定温度(例えば80℃)に加熱した熱圧着用の治具(図示せず)を前記金属箔5の表面に押し当て、金属箔5を介して前記異方性導電樹脂材8を加熱・加圧(例えば、1Kpa/5s)して、仮圧着させる。この異方性導電樹脂材8は、接着剤としても機能するものである。その後、この金属箔を所定形状に切断して、絶縁基板1に形成された導電パターン2に圧着させる圧着用金属箔11を形成する。この圧着用金属箔11にも、前述の絶縁基板1との位置合わせ用マークを形成しておく。なお、図5には、圧着用金属箔11の構造を説明するための断面図を示す。 On the other hand, a metal foil for pressure bonding is prepared which has a metal foil 5 patterned into a predetermined shape and an anisotropic conductive resin material 8 which is interposed in a gap between the patterns of the metal foil 5. That is, first, unnecessary portions were removed from the metal foil 5 made of a single conductive copper foil having a gold plating 4 on the surface by using a pressing technique or the like, and formed on the insulating substrate 1. A pattern of the external connection terminal 6 having a predetermined shape having a positional correspondence with the arrangement of the conductive pattern 2 is formed. Subsequently, an anisotropic conductive resin material 8 is disposed on the back surface of the external connection terminal portion 7 of the metal foil 5 and a thermocompression bonding jig (not shown) heated to a predetermined temperature (for example, 80 ° C.) is used. Pressing against the surface of the metal foil 5, the anisotropic conductive resin material 8 is heated and pressurized (for example, 1 Kpa / 5 s) through the metal foil 5 to be temporarily pressure-bonded. This anisotropic conductive resin material 8 also functions as an adhesive. Thereafter, the metal foil 11 is cut into a predetermined shape to form a pressure-bonding metal foil 11 that is pressure-bonded to the conductive pattern 2 formed on the insulating substrate 1. An alignment mark with the insulating substrate 1 is also formed on the metal foil 11 for pressure bonding. In addition, in FIG. 5, sectional drawing for demonstrating the structure of the metal foil 11 for crimping | compression-bonding is shown.
そして、前記圧着用金属箔11を、仮圧着された異方性導電樹脂材8が前記絶縁基板1に対向するように、前記位置合わせマークを利用して前記絶縁基板1に重ね合わせる。この際、各金属箔5からなる外部接続端子6は各導電パターン2の先端部に夫々対向するように重ね合わされている。 Then, the metal foil 11 for pressure bonding is overlaid on the insulating substrate 1 using the alignment mark so that the temporarily bonded anisotropic conductive resin material 8 faces the insulating substrate 1. At this time, the external connection terminals 6 made of the respective metal foils 5 are superposed so as to face the tip portions of the respective conductive patterns 2.
この状態で所定温度(例えば、160℃)に加熱した熱圧着用の治具を前記圧着用金属箔11の上面に押し当て、金属箔5を介して前記異方性導電樹脂材8を加熱・加圧(=本圧着、例えば、2Kpa/5s)し、各金属箔5を夫々対応する各導電パターン2の端部に一括転写させる。 In this state, a thermocompression bonding jig heated to a predetermined temperature (for example, 160 ° C.) is pressed against the upper surface of the metal foil 11 for pressure bonding, and the anisotropic conductive resin material 8 is heated via the metal foil 5. Pressurization (= final pressing, for example, 2 Kpa / 5 s) is performed, and the respective metal foils 5 are collectively transferred to the end portions of the corresponding conductive patterns 2.
このとき、圧着用金属箔11に仮圧着された異方性導電樹脂材8は、前記各導電パターン2とそれに対応する金属箔5とを接着させる接着剤として作用するとともに、所定形状とされた前記金属箔5の外部接続端子6間の間隙に入り込み、金属箔5の側面を被覆することとなる。 At this time, the anisotropic conductive resin material 8 temporarily press-bonded to the press-bonding metal foil 11 acts as an adhesive for bonding the conductive patterns 2 and the corresponding metal foil 5 and has a predetermined shape. The metal foil 5 enters the gap between the external connection terminals 6 and covers the side surface of the metal foil 5.
最後に外形抜きのプレス加工を施して、所定形状の配線構造を有するプリント配線基板を最終切断する。 Finally, press working without external shape is performed to finally cut a printed wiring board having a wiring structure with a predetermined shape.
この外形抜きのプレス加工時における抜き型の形状を所望の形状に異ならせることにより、図1および図2に示すように外部接続端子部7の先端面を面一にしたり、または、図3および図4に示すように、外部接続端子部7の先端面を、その幅方向に凸部9と凹部10とが繰り返し配列された、平面形状櫛歯状にしたりすることができる。前記外部接続端子部7における先端部の形状を、平面形状櫛歯状として最終切断する場合は、前記先端部を構成する各凸部9および各凹部10における先端面に、側面を前記異方性導電樹脂材8により被覆された前記金属箔5の端面を1つづつ位置させるように切断する。 By changing the shape of the punching die at the time of press processing of the outer shape to a desired shape, the front end surface of the external connection terminal portion 7 is made flush as shown in FIGS. 1 and 2, or FIG. As shown in FIG. 4, the front end surface of the external connection terminal portion 7 can be formed into a planar comb-like shape in which convex portions 9 and concave portions 10 are repeatedly arranged in the width direction. When the shape of the tip of the external connection terminal portion 7 is finally cut as a planar comb-like shape, the side surfaces of the convex portions 9 and the concave portions 10 constituting the tip portion are arranged on the side surfaces of the anisotropy. Cutting is performed so that the end faces of the metal foils 5 covered with the conductive resin material 8 are positioned one by one.
このような本実施形態のプリント配線基板の製造方法によれば、圧着用金属箔11の外部接続端子部7における裏面に仮圧着された異方性導電樹脂材8を、絶縁基板1の導電パターン2に前記圧着用金属箔11を本圧着する際に、所定形状とされた前記金属箔5の外部接続端子6間の間隙に入り込ませ、前記金属箔5の側面を簡単に被覆することができる。 According to such a method of manufacturing a printed wiring board of the present embodiment, the anisotropic conductive resin material 8 temporarily bonded to the back surface of the external connection terminal portion 7 of the metal foil 11 for crimping is applied to the conductive pattern of the insulating substrate 1. When the pressure-bonding metal foil 11 is finally pressure-bonded to 2, the gap between the external connection terminals 6 of the metal foil 5 having a predetermined shape can be easily covered, and the side surface of the metal foil 5 can be covered easily. .
そして、前記絶縁基板1の導電パターン2に前記圧着用金属箔11を本圧着させた後、所望の外形状に最終切断する際に、前記外部接続端子部7における先端部の形状が、各凸部9および各凹部10における先端面に側面を前記異方性導電樹脂材8により被覆された前記金属箔5の端面を1つづつ位置させた平面形状櫛歯状となるように切断することで、隣位する外部接続端子6を構成する金属箔5の端面を前後にずらして配置し、隣位する外部接続端子6間の沿面距離を長くすることが可能となる。 Then, after the crimping metal foil 11 is finally crimped to the conductive pattern 2 of the insulating substrate 1, the shape of the tip of the external connection terminal portion 7 is convex when the final cut into a desired outer shape. By cutting the end surfaces of the metal foil 5 whose side surfaces are covered with the anisotropic conductive resin material 8 one by one into the flat comb-teeth shape one by one on the tip surfaces of the portions 9 and the recesses 10. The end surfaces of the metal foils 5 constituting the adjacent external connection terminals 6 are arranged so as to be shifted back and forth, and the creepage distance between the adjacent external connection terminals 6 can be increased.
また、本実施形態のプリント配線基板においては、金属箔5に仮圧着させた前記異方性導電樹脂材8を以て、金属箔5と導電パターン2との接着と、金属箔5の露出面を被覆との双方を行うことができ、前述した従来例で用いた圧着用金属箔11のように離型シートや微粘着シート等を使わずにすむので簡便、且つ、安価にプリント配線基板を製造することができる。 In the printed wiring board of the present embodiment, the anisotropic conductive resin material 8 temporarily bonded to the metal foil 5 is used to bond the metal foil 5 and the conductive pattern 2 and to cover the exposed surface of the metal foil 5. The printed wiring board can be manufactured easily and inexpensively because it is not necessary to use a release sheet or a slightly adhesive sheet like the pressure-bonding metal foil 11 used in the conventional example described above. be able to.
なお、前記絶縁基板1には、前記導電パターン2が形成された面の反対側に、当該プリント配線基板をコネクタとして用いる場合などの強度補強を目的として、可撓性の樹脂材からなるバックテープを仮圧着させておく工程を加えてもよい。この場合は、前記本圧着時の加熱・加圧により、前記配線基板に対し本圧着されることとなる。また、配線基板と圧着用金属箔11との本圧着後、前記金属箔5が転写された面の反対面に、同じく当該プリント配線基板をコネクタとして用いる場合などの強度補強を目的として補強テープを仮圧着し、その後本圧着させる工程を加えてもよい。 The insulating substrate 1 has a back tape made of a flexible resin material on the opposite side of the surface on which the conductive pattern 2 is formed for the purpose of reinforcing the strength when the printed wiring board is used as a connector. A step of temporarily press-bonding may be added. In this case, the main pressure is applied to the wiring board by heating and pressurization during the main pressure bonding. Further, after the main pressure bonding between the wiring board and the metal foil 11 for pressure bonding, a reinforcing tape is applied to the opposite surface of the surface to which the metal foil 5 is transferred for the purpose of reinforcing the strength when the printed wiring board is used as a connector. You may add the process of carrying out temporary pressure bonding and carrying out final pressure bonding after that.
なお、本発明は、前述した実施の形態に限定されるものではなく、必要に応じて種々の変更が可能である。 In addition, this invention is not limited to embodiment mentioned above, A various change is possible as needed.
1 絶縁基板
2 導電パターン
3 銅(下地金属)
4 金めっき
5 金属箔
6 外部接続端子
7 外部接続端子部
8 異方性導電樹脂材
9 先端部(凸部)
10 先端部(凹部)
11 圧着用金属箔
1 Insulating substrate 2 Conductive pattern 3 Copper (underlying metal)
4 Gold plating 5 Metal foil 6 External connection terminal 7 External connection terminal part 8 Anisotropic conductive resin material 9 Tip part (convex part)
10 Tip (recess)
11 Metal foil for pressure bonding
Claims (4)
所定形状にパターン形成された前記金属箔の表面のみがめっき処理されており、前記金属箔の側面は、前記絶縁基板上の外部接続端子の形成領域における、前記金属箔の非配設領域に配設された異方性導電樹脂材により被覆されていることを特徴とするプリント配線基板。 On the insulating substrate, a metal foil patterned in a predetermined shape is attached to be electrically connectable in correspondence with the conductive pattern formed on the insulating substrate, and is a printed wiring board as an external connection terminal,
Only the surface of the metal foil patterned in a predetermined shape is plated, and the side surface of the metal foil is arranged in a region where the metal foil is not provided in the external connection terminal formation region on the insulating substrate. A printed wiring board which is covered with an anisotropic conductive resin material provided.
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JP4336617B2 true JP4336617B2 (en) | 2009-09-30 |
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