JP4315004B2 - Release film and method for producing flexible printed wiring board using the same - Google Patents
Release film and method for producing flexible printed wiring board using the same Download PDFInfo
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- JP4315004B2 JP4315004B2 JP2004015135A JP2004015135A JP4315004B2 JP 4315004 B2 JP4315004 B2 JP 4315004B2 JP 2004015135 A JP2004015135 A JP 2004015135A JP 2004015135 A JP2004015135 A JP 2004015135A JP 4315004 B2 JP4315004 B2 JP 4315004B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229920000306 polymethylpentene Polymers 0.000 claims description 15
- 239000011116 polymethylpentene Substances 0.000 claims description 15
- 229920005992 thermoplastic resin Polymers 0.000 claims description 15
- 239000004743 Polypropylene Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 239000004711 α-olefin Substances 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 6
- -1 polypropylene Polymers 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 3
- 239000002313 adhesive film Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 36
- 239000012790 adhesive layer Substances 0.000 description 9
- 230000037303 wrinkles Effects 0.000 description 9
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
本発明は、フレキシブルプリント配線板（以下、ＦＰＣという）の製造工程において用いられる離型フィルム及びそれを用いたＦＰＣの製造方法に関するものである。 The present invention relates to a release film used in a manufacturing process of a flexible printed wiring board (hereinafter referred to as FPC) and a method of manufacturing an FPC using the release film.
ＦＰＣの製造工程においては、絶縁基材、例えば、ポリイミド樹脂フィルム表面に所定の回路を有するフレキシブル回路板上を、絶縁及び回路保護を目的として接着剤付き耐熱樹脂フィルムであるカバーレイ（以下、ＣＬという）で被覆し、特許文献１のように離型フィルムを用いて、プレスラミネートすることが通常行われている。この製造工程においては、ＦＰＣと当板との離型性、ＦＰＣの凹凸に十分追従することによるＣＬ端面からの接着剤フロー抑制及び導体部汚染防止、更にＦＰＣ全体にかかる圧力の均一化、即ち離型性、対形状追従性、ＦＰＣ全体への均一な圧力による脱ボイド性（以下、成形性という）、ＦＰＣの仕上がり外観シワ、プレス時のフィルム端面シミ出し量が少ない他に、後工程での回路へのメッキ付き等に優れた離型フィルムが求められている。
本発明は、対形状追従性、均一な成形性、メッキ付き性、ＦＰＣ仕上がり外観シワに優れた特性を維持しながら、従来の離型フィルムでは満足でなかった離型性を向上させた離型フィルム及びそれを用いたＦＰＣの製造方法を提供するものである。 The present invention has improved mold release properties that are not satisfactory with conventional release films, while maintaining excellent properties such as anti-shape followability, uniform moldability, plating properties, and FPC finished appearance wrinkles. A film and a method for producing an FPC using the film are provided.
本発明は、
（１）第１の熱可塑性樹脂で構成される第１の層を有する離型フィルムであって、前記第１の層と第２の熱可塑性樹脂で構成される第２の層とのラミネート強度が２００〜２０００ｇ／25mm幅であることを特徴とする離型フィルム、
（２）前記第１の熱可塑性樹脂は、エチレンとメチルメタクリレートの共重合樹脂（ａ）、ポリプロピレン（ｂ）、ポリメチルペンテン又はポリメチルペンテンとαオレフィンとの共重合体（ｃ）の混合物を含むものである（１）項記載の離型フィルム、
（３）前記第２の熱可塑性樹脂は、ポリメチルペンテンを含むものである（１）又は（２）項記載の離型フィルム、
（４）前記第１の層を介し、前記第１及び２の熱可塑性樹脂と異なる第３の熱可塑性樹脂で構成されるものである（１）〜（３）項のいずれかに記載の離型フィルム、
（５）前記第３の熱可塑性樹脂の軟化点が５０〜１６０℃である（４）項記載の離型フィルム、
（６）フレキシブルプリント配線板の製造方法であって、（１）〜（５）項のいずれかに記載の離型フィルムと接着フィルムと積層板とをこの順に積層することを特徴とするフレキシブルプリント配線板の製造方法、
である。
The present invention
(1) A release film having a first layer composed of a first thermoplastic resin, the laminate strength of the first layer and a second layer composed of a second thermoplastic resin A release film characterized by having a width of 200 to 2000 g / 25 mm,
(2) The first thermoplastic resin is a copolymer of ethylene and methyl methacrylate (a), polypropylene (b), polymethylpentene or a mixture of polymethylpentene and α-olefin (c). The release film according to item (1),
(3) The release film according to (1) or (2), wherein the second thermoplastic resin contains polymethylpentene.
(4) The separation according to any one of (1) to (3), wherein the separation is made of a third thermoplastic resin different from the first and second thermoplastic resins through the first layer. Mold film,
(5) The release film according to (4), wherein the softening point of the third thermoplastic resin is 50 to 160 ° C.
(6) A method for producing a flexible printed wiring board, wherein the release film according to any one of (1) to (5), an adhesive film, and a laminated board are laminated in this order. Manufacturing method of wiring board,
It is.
本発明は、対形状追従性、均一な成形性、メッキ付き性、ＦＰＣの外観仕上がりシワに優れた特性を維持しながら、従来の離型フィルムでは達成できなかった離型性を向上させた離型フィルム及びそれを用いたＦＰＣの製造方法を提供するものである。 In the present invention, the mold release property that has not been achieved with a conventional release film is improved while maintaining excellent characteristics in conformity to shape, uniform moldability, plating property, and FPC appearance finish wrinkles. The present invention provides a mold film and a method for producing an FPC using the mold film.
本発明の離型フィルムは、第一の熱可塑性樹脂で構成される第一の層（接着層と言う）と第二の層熱可塑性樹脂で構成される第二の層（離型層と言う）とのラミネート強度が２００〜２０００ｇ／25mm幅である。２００ｇ／25mm幅未満だとＦＰＣ製造条件により離型層のみＦＰＣに残ってしまう現象がある。離型層に用いる樹脂は、非常に接着しにくいために既存の接着樹脂では、２０００ｇ／25mm幅を超える事はない。 The release film of the present invention is a first layer (referred to as an adhesive layer) composed of a first thermoplastic resin and a second layer (referred to as a release layer) composed of a second layer thermoplastic resin. And a laminate strength of 200 to 2000 g / 25 mm. When the width is less than 200 g / 25 mm, there is a phenomenon that only the release layer remains in the FPC due to FPC manufacturing conditions. Since the resin used for the release layer is very difficult to adhere, the existing adhesive resin does not exceed 2000 g / 25 mm width.
本発明の離型層に用いる樹脂は、ポリメチルペンテン又はポリメチルペンテンとαオレフィンとの共重合体を使用する。ポリメチルペンテンとは、以下の式（１）で示されるものである。ポリメチルペンテンとαオレフィンとの共重合体の共重合の比率、αオレフィンの種類については特に限定しない。 The resin used for the release layer of the present invention uses polymethylpentene or a copolymer of polymethylpentene and α-olefin. Polymethylpentene is represented by the following formula (1). There are no particular limitations on the copolymerization ratio of the copolymer of polymethylpentene and α-olefin and the type of α-olefin.
本発明に使用する接着層は、エチレンとメチルメタクリレートの共重合樹脂（ａ）、ポリプロピレン（ｂ）、ポリメチルペンテン又はポリメチルペンテンとαオレフィンとの共重合体（ｃ）の混合物である。これら（ａ）〜（ｃ）の３種類の樹脂の混合比は特に限定しない。 The adhesive layer used in the present invention is a copolymer resin (a) of ethylene and methyl methacrylate, polypropylene (b), polymethylpentene or a mixture of polymethylpentene and α-olefin (c). The mixing ratio of these three types of resins (a) to (c) is not particularly limited.
離型層の厚みは、１０〜１００μｍである。好ましくは１５〜５０μｍが望ましい。１０μｍ未満だとプレスラミネート後に離型層に用いる樹脂が破れ、ＦＰＣと離型フィルムを分離する際に、ＦＰＣ側に離型層に用いる樹脂が残ってしまう。１００μｍを越えると対形状追従性が悪くなりＣＬに付着している接着剤のフロー量が多くなる。 The thickness of the release layer is 10 to 100 μm. Preferably it is 15-50 micrometers. When the thickness is less than 10 μm, the resin used for the release layer is broken after press lamination, and when the FPC and the release film are separated, the resin used for the release layer remains on the FPC side. When the thickness exceeds 100 μm, the shape following ability is deteriorated, and the flow amount of the adhesive adhering to the CL increases.
本発明の第３の層（クッション層と言う）に用いる樹脂は、軟化点が５０〜１６０℃である。５０℃未満だとプレス時に離型フィルムの端面より樹脂がシミ出してきて、プレス熱盤等に付着して、次工程への２次汚染の懸念がある。１６０℃を超えると成形性が悪く、ＦＰＣの細部にボイドが発生する。クッション層の厚みは特に規定はしない。
更にクッション層に積層する場合、接着層を介したほうが両面とも差がなく使用できようになるが、コスト的に安く設計する場合は、介さなくても使用するときに間違わなければ問題ない。離型反対層（離型層の最外層を離型反対層と言う）は、プレス方式により必要な場合に積層する。主にポリメチルペンテン又はポリメチルペンテンとαオレフィンとの共重合体とポリプロピレンを使用する。
The resin used for the third layer (referred to as a cushion layer) of the present invention has a softening point of 50 to 160 ° C. When the temperature is lower than 50 ° C., the resin comes out from the end face of the release film during pressing, adheres to the press hot platen, etc., and there is a concern of secondary contamination in the next process. If it exceeds 160 ° C., the moldability is poor and voids are generated in the details of the FPC. The thickness of the cushion layer is not particularly specified.
Further, when laminated on the cushion layer, the adhesive layer can be used with no difference on both sides. However, in the case of designing at a low cost, there is no problem if it is not mistaken when used without using the adhesive layer. The release opposite layer (the outermost layer of the release layer is referred to as the release opposite layer) is laminated when necessary by a press method. Mainly, polymethylpentene or a copolymer of polymethylpentene and α-olefin and polypropylene are used.
本発明に用いる離型フィルムの製法は、共押出ラミネート工法、押出ラミネート工法、ドライラミネート工法等のいずれの工法でもよい。 The method for producing the release film used in the present invention may be any method such as a coextrusion laminating method, an extrusion laminating method, or a dry laminating method.
本発明の離型フィルムをＦＰＣの製造工程において、ＣＬのプレスラミネートに用い、加圧積層する成形方法としては、例えば、熱盤の間に、離型フィルム、片面ＦＰＣの順に重ねた構成物を置き、所定の条件で加熱加圧後、後硬化をすればよい。一般的には、離型フィルム、接着フィルム、積層板を多数回積層することができる。 In the FPC manufacturing process, the release film of the present invention is used for CL press lamination, and as a molding method for pressure lamination, for example, a structure in which a release film and a single-sided FPC are stacked in this order between hot plates are used. Then, after heating and pressing under predetermined conditions, post-curing may be performed. In general, a release film, an adhesive film, and a laminate can be laminated many times.
以下に本発明を実施例によって、更に詳細に説明するが、本発明はこれらの実施例に限定されるものではない。以下に示す実施例及び比較例において使用した原材料の特性は、以下の通りである。
・ ポリメチルペンテンとαオレフィンとの共重合体（ＴＰＸ）：品番ＭＸ００４（三井化学（株）製）
・ エチレン−メチルアクリレート共重合体（ＥＭＭＡ）：品番アクリフトＷＨ１０２［軟化点６０℃］（住友化学工業（株）製）
・ ポリエチレン（ＰＥ）：スミカセンＬ２１１［軟化点１００℃］（住友化学工業（株）製）
・ エチレン−酢酸ビニル共重合体（ＥＶＡ）；ＶＡＣ１０％ エバフレックスＶ５７１６ＲＣ［軟化点６５℃］（三井デュポンポリケミカル（株）製）
・ ポリプロピレン（ＰＰ）：ノーブレンＦＨ１０１６（住友化学工業（株）製）
EXAMPLES The present invention will be described in more detail with reference to examples below, but the present invention is not limited to these examples. The characteristics of the raw materials used in the following examples and comparative examples are as follows.
-Copolymer of polymethylpentene and α-olefin (TPX): Part No. MX004 (manufactured by Mitsui Chemicals, Inc.)
-Ethylene-methyl acrylate copolymer (EMMA): product number ACRIFTH WH102 [softening point 60 ° C] (manufactured by Sumitomo Chemical Co., Ltd.)
-Polyethylene (PE): Sumikasen L211 [softening point 100 ° C] (manufactured by Sumitomo Chemical Co., Ltd.)
-Ethylene-vinyl acetate copolymer (EVA); VAC 10% EVAFLEX V5716RC [softening point 65 ° C] (manufactured by Mitsui DuPont Polychemical Co., Ltd.)
-Polypropylene (PP): Nobrene FH1016 (manufactured by Sumitomo Chemical Co., Ltd.)
＜実施例１＞
３台の押出機それぞれに、離型層としてＴＰＸ、接着層にＴＰＸとＰＰとＥＭＭＡの混合物、クッション層としてＥＭＭＡを供給することにより３層ダイス共押出し、表１に示した構成内容の離型フィルムを作成した。
＜実施例２〜４＞
５台の押出機それぞれに、離型層としてＴＰＸ、接着層にＴＰＸとＰＰとＥＭＭＡの混合物、クッション層としてＰＥ、ＥＭＭＡ、ＥＶＡ、接着層にＴＰＸとＰＰとＥＭＭＡの混合物、離型反対層としてＴＰＸを供給することにより５層ダイス共押出し、表１に示した構成内容の離型フィルムを作成した。
その離型フィルムとＦＰＣとを多段型プレス機を用い、１７５℃、５ＭＰａ、真空状態で６０分加熱・加圧・冷却後、取り出して、以下の評価項目で評価した。評価結果を表１に示した。
<Example 1>
Each of the three extruders was co-extruded with a three-layer die by supplying TPX as a release layer, a mixture of TPX, PP and EMMA as an adhesive layer, and EMMA as a cushion layer, and having the composition shown in Table 1 A film was created.
<Examples 2 to 4>
Each of the five extruders has TPX as the release layer, a mixture of TPX, PP, and EMMA as the adhesive layer, PE, EMMA, EVA as the cushion layer, a mixture of TPX, PP, and EMMA as the adhesive layer, and as an opposite release layer By supplying TPX, a five-layer die was coextruded to prepare a release film having the composition shown in Table 1.
The release film and FPC were taken out using a multi-stage press machine, heated, pressurized and cooled at 175 ° C., 5 MPa in a vacuum for 60 minutes, and then evaluated according to the following evaluation items. The evaluation results are shown in Table 1.
＜比較例１〜３＞
３台の押出機にそれぞれ離型層としてＴＰＸ、クッション層としてＥＭＭＡ、ＰＥ、ＥＶＡ、離型反対層としてＴＰＸを供給することにより３層ダイスに供給することにより共押出し、表１に示した構成内容の離型フィルムを作成した。
その離型フィルムとＦＰＣとを１段型プレス機を用い、１８５℃、５ＭＰａで２分加熱・加圧後、取り出して、以下の評価項目で評価した。評価結果を表１に示した。
尚、評価はＪＰＣＡ規格（デザインガイドマニュアル・片面及び両面フレキシブルプリント配線板・ＪＰＣＡ―ＤＧ０２）に準拠し、以下のような項目と基準で行った。
<Comparative Examples 1-3>
Each of the three extruders was co-extruded by supplying TPX as a release layer, EMMA, PE, EVA as a cushion layer, and TPX as a release layer, and supplying them to a three-layer die, as shown in Table 1. A release film of content was created.
The release film and the FPC were taken out using a one-stage press, heated and pressurized at 185 ° C. and 5 MPa for 2 minutes, and then evaluated according to the following evaluation items. The evaluation results are shown in Table 1.
The evaluation was made according to the JPCA standard (design guide manual, single-sided and double-sided flexible printed wiring board, JPCA-DG02) and the following items and standards.
成形性（７．５．３．３項の気泡による）
○：ボイド発生率 ２．０％未満
×：ボイド発生率 ２．０％以上
ＣＬ接着剤のフロー量（７．５．３．６項のカバーレイの接着剤の流れ及びカバーコートのにじみによる）
○：フロー量 １５０μｍ未満
×：フロー量 １５０μｍ以上
仕上がり外観シワ（７．５．７．２項しわによる）
○：シワ発生率 ２．０％未満
×：シワ発生率 ２．０％以上
離型層樹脂の破れ（７．５．７．１項表面の付着物による）
◎：破れ発生率 １．０％未満
○：破れ発生率 ２．０％未満
×：破れ発生率 ２．０％以上
メッキ付き性（必要メッキ面積の９０％以上にメッキが付いているものを良品：７．５．４項めっきの外観による）
○：良品が９８％以上
×：良品が９８％未満
離型層と接着層とのラミネート強度（２５ｍｍ幅で離型層と接着層との層間ラミネート強度を測定する）
○：２００〜２０００ｇ／25mm
×：２００ｇ／25mm未満
Formability (due to air bubbles in 7.5.3.3)
○: Void generation rate less than 2.0% ×: Void generation rate 2.0% or more CL adhesive flow amount (due to coverlay adhesive flow and cover coat bleeding in 7.5.3.6)
○: Flow amount less than 150 μm ×: Flow amount 150 μm or more Finished appearance wrinkle (according to wrinkles in 7.5.7.2)
○: Wrinkle generation rate less than 2.0% ×: Wrinkle generation rate 2.0% or more Releasing of release layer resin (due to 7.5.7.1 surface deposits)
◎: Breakage rate less than 1.0% ○: Breakage rate less than 2.0% ×: Breakage rate 2.0% or more Plating property (those with 90% or more of the required plating area are plated) : According to the appearance of 7.5.4 plating)
○: Non-defective product is 98% or more ×: Non-defective product is less than 98% Lamination strength between release layer and adhesive layer (measurement of interlayer laminate strength between release layer and adhesive layer at 25 mm width)
○: 200 to 2000 g / 25 mm
×: Less than 200 g / 25 mm
本発明は、対形状追従性、均一な成形性、メッキ付き性、ＦＰＣ仕上がり外観シワに優れた特性を維持しながら、従来の離型フィルムでは満足でなかった離型性を向上させた離型フィルム及びそれを用いたＦＰＣの製造方法を提供するものである。
The present invention has improved mold release properties that were not satisfactory with conventional release films, while maintaining excellent properties such as anti-form following, uniform moldability, plating properties, and FPC finished appearance wrinkles. A film and a method for producing an FPC using the film are provided.
Claims (2)
第１の熱可塑性樹脂で構成される第１の層を介して、
第２の熱可塑性樹脂で構成される第２の層を有する離型フィルムであって、
前記第１の熱可塑性樹脂がエチレンとメチルメタクリレートとの共重合体（ａ）、ポリプロピレン（ｂ）、およびポリメチルペンテン又はポリメチルペンテンとαオレフィンとの共重合体（ｃ）の混合物を含み、
前記第２の熱可塑性樹脂がポリメチルペンテンを含み、
前記第１の層と第２の層とのラミネート強度が２００〜２０００ｇ／２５ｍｍ幅であり、
かつ、前記第３の熱可塑性樹脂の軟化点が５０〜１６０℃であることを特徴とする離型フィルム。 On the side of at least one surface of the third layer composed of the third thermoplastic resin,
Through the first layer composed of the first thermoplastic resin,
A release film having a second layer composed of a second thermoplastic resin ,
The first thermoplastic resin comprises a copolymer of ethylene and methyl methacrylate (a), polypropylene (b), and polymethylpentene or a mixture of polymethylpentene and α-olefin (c);
The second thermoplastic resin comprises polymethylpentene;
The laminate strength of the first layer and the second layer is 200 to 2000 g / 25 mm width,
And the release film characterized by the softening point of said 3rd thermoplastic resin being 50-160 degreeC .
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| JP2004015135A JP4315004B2 (en) | 2004-01-23 | 2004-01-23 | Release film and method for producing flexible printed wiring board using the same |
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| JP5245497B2 (en) * | 2008-03-31 | 2013-07-24 | 住友ベークライト株式会社 | Release film |
| AU2011239305B2 (en) | 2010-11-02 | 2015-11-26 | Aruze Gaming America Inc. | Gaming machine and reel device thereof |
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