JP2005178323A - Mold releasable film, its manufacturing method, and manufacturing method for flexible print circuit using it - Google Patents
Mold releasable film, its manufacturing method, and manufacturing method for flexible print circuit using it Download PDFInfo
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Abstract
Description
本発明は、フレキシブルプリント配線板（以下、ＦＰＣという）の製造工程において用いられる離型フィルムとその製造方法及びそれを用いたＦＰＣの製造方法に関するものである。 The present invention relates to a release film used in a manufacturing process of a flexible printed wiring board (hereinafter referred to as FPC), a manufacturing method thereof, and a manufacturing method of an FPC using the same.
ＦＰＣの製造工程においては、絶縁基材、例えば、ポリイミド樹脂フィルム表面に所定の回路を有するフレキシブル回路板上を、絶縁及び回路保護を目的として接着剤付き耐熱樹脂フィルムであるカバーレイ（以下、ＣＬという）で被覆し、特許文献１のように離型フィルムを用いて、プレスラミネートすることが通常行われている。この製造工程においては、ＦＰＣと当板との離型性、ＦＰＣの凹凸に十分追従することによるＣＬ端面からの接着剤フロー抑制及び導体部汚染防止、更にＦＰＣ全体にかかる圧力の均一化、即ち離型性、対形状追従性、ＦＰＣ全体への均一な圧力による脱ボイド性（以下、成形性という）、ＦＰＣの仕上がり外観シワ、プレス時のフィルム端面シミ出し量が少ない他に、後工程での回路へのメッキ付き等に優れた離型フィルムが求められている。
本発明は、対形状追従性、均一な成形性、メッキ付き性、ＦＰＣ仕上がり外観シワに優れた特性を維持しながら、従来の離型フィルムでは満足でなかった離型性を向上させた離型フィルムとその製造方法及びそれを用いたＦＰＣの製造方法を提供するものである。 The present invention has improved mold release properties that are not satisfactory with conventional release films, while maintaining excellent properties such as anti-shape followability, uniform moldability, plating properties, and FPC finished appearance wrinkles. A film, a method for producing the film, and a method for producing an FPC using the film are provided.
本発明は、
（１）第１の熱可塑性樹脂で構成される第１の層を有する離型フィルムであって、前記第１の層の表面自由エネルギーが２３〜２８[ｍＮ／ｍ]であることを特徴とする離型フィルム、
（２）前記第１の層の少なくとも片面側に、さらに第２の層を有するものである（１）項記載の離型フィルム、
（３）前記第２の層は、前記第１の熱可塑性樹脂と異なる第２の熱可塑性樹脂で構成されるものである（２）項記載の離型フィルム、
（４）前記第１の熱可塑性樹脂は、ポリメチルペンテンを含むものである（１）項記載ないし（３）項記載のいずれかの離型フィルム、
（５）第２の熱可塑性樹脂の軟化点が５０〜１６０℃で構成される（３）項記載の離型フィルム、
（６）第１の熱可塑性樹脂を溶融押し出し機により離型フィルムに製造する方法であって、前記溶融押し出し機の先端部の前記第１の熱可塑性樹脂の温度を２４０〜３１０℃にすることを特徴とする離型フィルムの製造方法、
（７）フレキシブルプリント配線板の製造方法であって、（１）項記載ないし（４）項記載のいずれかの離型フィルムと、接着フィルムと、積層板とをこの順に積層することを特徴とするフレキシブルプリント配線板の製造方法、
である。
The present invention
(1) A release film having a first layer composed of a first thermoplastic resin, wherein the surface free energy of the first layer is 23 to 28 [mN / m]. Release film,
(2) The release film according to item (1), further comprising a second layer on at least one side of the first layer,
(3) The release film according to (2), wherein the second layer is composed of a second thermoplastic resin different from the first thermoplastic resin,
(4) The release film according to any one of (1) to (3), wherein the first thermoplastic resin contains polymethylpentene.
(5) The release film according to (3), wherein the second thermoplastic resin has a softening point of 50 to 160 ° C.
(6) A method for producing a first thermoplastic resin into a release film using a melt extruder, wherein the temperature of the first thermoplastic resin at the tip of the melt extruder is 240 to 310 ° C. A method for producing a release film characterized by
(7) A method for producing a flexible printed wiring board, wherein the release film according to any one of (1) to (4), an adhesive film, and a laminate are laminated in this order. Manufacturing method of flexible printed wiring board,
It is.
本発明は、対形状追従性、均一な成形性、メッキ付き性、ＦＰＣの外観仕上がりシワに優れた特性を維持しながら、従来の離型フィルムでは達成できなかった離型性を向上させた離型フィルムとその製造方法及びそれを用いたＦＰＣの製造方法を提供するものである。 In the present invention, the mold release property that has not been achieved with a conventional release film is improved while maintaining excellent characteristics in conformity to shape, uniform moldability, plating property, and FPC appearance finish wrinkles. A mold film, a manufacturing method thereof, and a manufacturing method of an FPC using the same are provided.
本発明の離型フィルムは、第一の熱可塑性樹脂で構成される第一の層（離型層と言う）の表面自由エネルギーが２３〜２８ｍＮ／ｍである。２８ｍＮ／ｍを超えるとプレス後の解体作業でのＦＰＣと離型フィルムの剥離がしにくくなる。
本発明の離型層に用いる樹脂は、ポリメチルペンテン又はポリメチルペンテンとαオレフィンとの共重合体である。ポリメチルペンテンとは、以下の式（１）で示されるものである。ポリメチルペンテンとαオレフィンとの共重合体の共重合の比率、αオレフィンの種類については特に限定しない。
In the release film of the present invention, the surface free energy of the first layer (referred to as a release layer) composed of the first thermoplastic resin is 23 to 28 mN / m. When it exceeds 28 mN / m, it becomes difficult to separate the FPC and the release film in the dismantling work after pressing.
The resin used for the release layer of the present invention is polymethylpentene or a copolymer of polymethylpentene and α-olefin. Polymethylpentene is represented by the following formula (1). There are no particular limitations on the copolymerization ratio of the copolymer of polymethylpentene and α-olefin and the type of α-olefin.
本発明の離型層に用いる樹脂は、ポリメチルペンテン又はポリメチルペンテンとαオレフィンとの共重合体を押出機で押出する時のスクリュー先端部（スクリュー先端部とは、押出機に使用しているスクリューの先及びＴダイにつながる管を指す）の押出樹脂温度を２４０〜３１０℃で行う。３１０℃を超えると樹脂の劣化または酸化により、表面自由エネルギーが高くなる。２４０℃未満だと温度が低く、離型フィルムの外観が悪くなる。 The resin used for the release layer of the present invention is a screw tip when extruding polymethylpentene or a copolymer of polymethylpentene and α-olefin with an extruder (the screw tip is used in an extruder). The extrusion resin temperature is 240 to 310 ° C. If it exceeds 310 ° C., the surface free energy increases due to deterioration or oxidation of the resin. If it is less than 240 ° C., the temperature is low and the appearance of the release film is deteriorated.
離型層の厚みは、１０〜１００μｍである。好ましくは１５〜５０μｍが望ましい。１０μｍ未満だとプレスラミネート後に離型層に用いる樹脂が破れ、ＦＰＣと離型フィルムを分離する際に、ＦＰＣ側に離型層に用いる樹脂が残ってしまう。１００μｍを越えると対形状追従性が悪くなりＣＬに付着している接着剤のフロー量が多くなる。 The thickness of the release layer is 10 to 100 μm. Preferably it is 15-50 micrometers. When the thickness is less than 10 μm, the resin used for the release layer is broken after press lamination, and when the FPC and the release film are separated, the resin used for the release layer remains on the FPC side. When the thickness exceeds 100 μm, the shape following ability is deteriorated, and the flow amount of the adhesive adhering to the CL increases.
本発明の第２層を構成する樹脂（クッション層と言う）に用いる樹脂は、軟化点が５０〜１６０℃である。５０℃未満だとプレス時に離型フィルムの端面より樹脂がシミ出してきて、プレス熱盤等に付着して、次工程への２次汚染の懸念がある。１６０℃を超えると成形性が悪く、ＦＰＣの細部にボイドが発生する。クッション層の厚みは特に規定はしない。
離型層とクッション層の間に接着樹脂を介しても差し支えはないが、接着樹脂を介さないほうがフィルム端面シミ出しは少なく好ましい。
The resin used for the resin constituting the second layer of the present invention (referred to as a cushion layer) has a softening point of 50 to 160 ° C. When the temperature is lower than 50 ° C., the resin begins to stain from the end face of the release film during pressing, adheres to the press hot platen, etc., and there is a concern of secondary contamination in the next process. If it exceeds 160 ° C., the moldability is poor and voids are generated in the details of the FPC. The thickness of the cushion layer is not particularly specified.
Although there is no problem even if an adhesive resin is interposed between the release layer and the cushion layer, it is preferable that no adhesive resin is interposed between the film and the film to prevent the end face from appearing.
本発明に用いる離型フィルムの製法は、共押出ラミネート工法、押出ラミネート工法、ドライラミネート工法等のいずれの工法でもよい。 The method for producing the release film used in the present invention may be any method such as a coextrusion laminating method, an extrusion laminating method, or a dry laminating method.
本発明の離型フィルムをＦＰＣの製造工程において、カバーレイのプレスラミネートに用い、加圧積層する成形方法としては、例えば、熱盤の間に、離型フィルム、接着フィルム、積層板の順に重ねた構成物を置き、所定の条件で加熱加圧後、後硬化をすればよい。一般的には、離型フィルム、接着フィルム、積層板を多数回積層することもできる。 In the FPC manufacturing process, the release film of the present invention is used for press-laying a coverlay, and as a molding method for pressure lamination, for example, a release film, an adhesive film, and a laminate are stacked in this order between hot plates. The post-curing may be carried out after placing the components, heating and pressing under predetermined conditions. In general, a release film, an adhesive film, and a laminate can be laminated many times.
以下に本発明を実施例によって、更に詳細に説明するが、本発明はこれらの実施例に限定されるものではない。以下に示す実施例及び比較例において使用した原材料の特性は、以下の通りである。
・ ポリメチルペンテンとαオレフィンとの共重合体（ＴＰＸ）：品番ＭＸ００４（三井化学（株）製）
・ エチレン−メチルアクリレート共重合体（ＥＭＭＡ）：品番アクリフトＷＨ１０２（住友化学工業（株）製）
EXAMPLES The present invention will be described in more detail with reference to examples below, but the present invention is not limited to these examples. The characteristics of the raw materials used in the following examples and comparative examples are as follows.
-Copolymer of polymethylpentene and α-olefin (TPX): Part No. MX004 (manufactured by Mitsui Chemicals, Inc.)
-Ethylene-methyl acrylate copolymer (EMMA): Part number ACRIFTH WH102 (manufactured by Sumitomo Chemical Co., Ltd.)
＜実施例１〜５＞
実施例１〜４では、２台の押出機のそれぞれに、離型層としてＴＰＸ、クッション層としてＥＭＭＡを供給することにより二層ダイスで共押出し、表１に示した構成内容の離型フィルムを作成した。
実施例５では、１台の押出機にＴＰＸを単層ダイスに供給することにより製膜し、表１に示した構成内容の単層の離型フィルムを作成した。
離型層として使用するＴＰＸのスクリュー先端部の押出樹脂温度は表１に示した温度で押出した。
その離型フィルムとＦＰＣとを多段型プレス機を用い、１７５℃、５ＭＰａ、真空状態で６０分加熱・加圧・冷却後、取り出して、以下の評価項目で評価した。評価結果を表１に示した。
<Examples 1-5>
In Examples 1 to 4, each of the two extruders was coextruded with a two-layer die by supplying TPX as a release layer and EMMA as a cushion layer, and a release film having the composition shown in Table 1 was obtained. Created.
In Example 5, the film was formed by supplying TPX to a single-layer die in one extruder, and a single-layer release film having the composition shown in Table 1 was produced.
The extrusion resin temperature at the screw tip of TPX used as a release layer was extruded at the temperature shown in Table 1.
The release film and FPC were taken out using a multi-stage press machine, heated, pressurized and cooled at 175 ° C., 5 MPa in a vacuum for 60 minutes, and then evaluated according to the following evaluation items. The evaluation results are shown in Table 1.
＜比較例１〜２＞
２台の押出機のそれぞれに、離型層としてＴＰＸ、クッション層としてＥＭＭＡを供給することにより二層ダイスで共押出し、表２に示した構成内容の離型フィルムを作成した。
離型層として使用するＴＰＸのスクリュー先端部の押出樹脂温度は表１に示した温度で押出した。
その離型フィルムとＦＰＣとを多段型プレス機を用い、１７５℃、５ＭＰａ、真空状態で６０分加熱・加圧・冷却後、取り出して、以下の評価項目で評価した。評価結果を表１に示した。
<Comparative Examples 1-2>
By supplying TPX as a release layer and EMMA as a cushion layer to each of the two extruders, coextrusion was performed with a two-layer die, and release films having the contents shown in Table 2 were prepared.
The extrusion resin temperature at the screw tip of TPX used as a release layer was extruded at the temperature shown in Table 1.
The release film and FPC were taken out using a multi-stage press machine, heated, pressurized and cooled at 175 ° C., 5 MPa in a vacuum for 60 minutes, and then evaluated according to the following evaluation items. The evaluation results are shown in Table 1.
その離型フィルムの離型側層の表面自由エネルギーは、接触角自動測定装置（ＣＡ−Ｖ型、協和界面科学（株）製）で測定した。
尚、評価はＪＰＣＡ規格（デザインガイドマニュアル・片面及び両面フレキシブルプリント配線板・ＪＰＣＡ―ＤＧ０２）に準拠し、以下のような項目と基準で行った。
The surface free energy of the release side layer of the release film was measured with a contact angle automatic measuring device (CA-V type, manufactured by Kyowa Interface Science Co., Ltd.).
The evaluation was made according to the JPCA standard (design guide manual, single-sided and double-sided flexible printed wiring board, JPCA-DG02) and the following items and standards.
成形性（７．５．３．３項の気泡による）
○：ボイド発生率 ２．０％未満
×：ボイド発生率 ２．０％以上
ＣＬ接着剤のフロー量（７．５．３．６項のカバーレイの接着剤の流れ及びカバーコートのにじみによる）
○：フロー量 １５０μｍ未満
×：フロー量 １５０μｍ以上
仕上がり外観シワ（７．５．７．２項しわによる）
○：シワ発生率 ２．０％未満
×：シワ発生率 ２．０％以上
離型層樹脂の破れ（７．５．７．１項表面の付着物による）
○：破れ発生率 ２．０％未満
×：破れ発生率 ２．０％以上
メッキ付き性（必要メッキ面積の９０％以上にメッキが付いているものを良品：７．５．４項めっきの外観による）
○：良品が９８％以上
×：良品が９８％未満
Formability (due to air bubbles in 7.5.3.3)
○: Void generation rate less than 2.0% ×: Void generation rate 2.0% or more CL adhesive flow amount (due to coverlay adhesive flow and cover coat bleeding in 7.5.3.6)
○: Flow amount less than 150 μm ×: Flow amount 150 μm or more Finished appearance wrinkle
○: Wrinkle generation rate less than 2.0% ×: Wrinkle generation rate 2.0% or more Releasing of release layer resin (due to 7.5.7.1 surface deposits)
○: Breakage rate less than 2.0% ×: Breakage rate 2.0% or more Plating property (A product with 90% or more of the necessary plating area is plated: Appearance of 7.5.4 plating) by)
○: Good product is 98% or more ×: Good product is less than 98%
本発明は、対形状追従性、均一な成形性、メッキ付き性、ＦＰＣ仕上がり外観シワに優れた特性を維持しながら、従来の離型フィルムでは満足でなかった離型性を向上させた離型フィルムとその製造方法及びそれを用いたＦＰＣの製造方法を提供するものである。 The present invention has improved mold release properties that are not satisfactory with conventional release films, while maintaining excellent properties such as anti-shape followability, uniform moldability, plating properties, and FPC finished appearance wrinkles. A film, a method for producing the film, and a method for producing an FPC using the film are provided.
Claims (7)
A method for producing a flexible printed wiring board, wherein the release film according to any one of claims 1 to 4, an adhesive film, and a laminated board are laminated in this order. Method.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018097161A1 (en) * | 2016-11-25 | 2018-05-31 | 東レ株式会社 | Multilayer polypropylene film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018097161A1 (en) * | 2016-11-25 | 2018-05-31 | 東レ株式会社 | Multilayer polypropylene film |
| CN110023086A (en) * | 2016-11-25 | 2019-07-16 | 东丽株式会社 | Lamination polypropylene screen |
| JPWO2018097161A1 (en) * | 2016-11-25 | 2019-10-17 | 東レ株式会社 | Laminated polypropylene film |
| JP7070426B2 (en) | 2016-11-25 | 2022-05-18 | 東レ株式会社 | Laminated polypropylene film |
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