JP4301096B2 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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JP4301096B2
JP4301096B2 JP2004190675A JP2004190675A JP4301096B2 JP 4301096 B2 JP4301096 B2 JP 4301096B2 JP 2004190675 A JP2004190675 A JP 2004190675A JP 2004190675 A JP2004190675 A JP 2004190675A JP 4301096 B2 JP4301096 B2 JP 4301096B2
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control circuit
circuit board
outer case
power circuit
resin plate
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JP2006013273A (en
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伸 征矢野
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Fuji Electric Co Ltd
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Fuji Electric Device Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

本発明は半導体装置に関し、特にケース内にパワー回路及び制御回路を二階建て式に内装して構成された半導体装置に関する。   The present invention relates to a semiconductor device, and more particularly to a semiconductor device configured with a power circuit and a control circuit housed in a two-story structure in a case.

インバータ装置，無停電電源装置，工作機械，産業用ロボットなどで使用される半導体装置には、例えば絶縁ゲート型バイポーラトランジスタ（Insulated Gate Bipolar Transistor：以下「ＩＧＢＴ」と表記する）などの各種のパワー半導体素子が使用されている。また、このパワー半導体素子に加え、その駆動回路や、電流センシング，温度センシングのためのトランジスタやダイオードからなる制御回路などを一つのモジュール内に集積して高性能、高機能化したインテリジェントパワーモジュール（Intelligent Power Module：以下「ＩＰＭ」と表記する）も実用化されている（例えば、特許文献１参照。）。   Semiconductor devices used in inverter devices, uninterruptible power supply devices, machine tools, industrial robots, etc. include various power semiconductors such as insulated gate bipolar transistors (hereinafter referred to as “IGBT”). The element is used. In addition to this power semiconductor element, its drive circuit, control circuit consisting of transistors and diodes for current sensing and temperature sensing, etc. are integrated in a single module, which is an intelligent power module with high performance and high functionality ( Intelligent Power Module (hereinafter referred to as “IPM”) has also been put into practical use (for example, see Patent Document 1).

図８は、このような従来のＩＰＭの構成例を表す斜視図であり、図９及び図１０は、この従来のＩＰＭの組立構造を表す分解斜視図である。
図８に示すように、このＩＰＭは、樹脂成形品で作られた外囲ケース１０１の内部に、ＩＧＢＴなどのパワー半導体素子が実装されたパワー回路基板と、そのパワー半導体素子の駆動回路や制御回路が実装された制御回路基板を備えている。また、外囲ケース１０１の外部には、パワー回路に対する入出力の外部導出端子である主端子１０２や、制御回路に対する制御信号の入出力用の外部導出端子である制御端子１０３が露出して設けられている。 FIG. 8 is a perspective view showing a configuration example of such a conventional IPM, and FIGS. 9 and 10 are exploded perspective views showing an assembly structure of this conventional IPM.
As shown in FIG. 8, this IPM has a power circuit board in which a power semiconductor element such as IGBT is mounted inside an enclosing case 101 made of a resin molded product, and a drive circuit and control of the power semiconductor element. A control circuit board on which the circuit is mounted is provided. In addition, the main terminal 102 which is an external derivation terminal for input / output of the power circuit and the control terminal 103 which is an external derivation terminal for input / output of control signals for the control circuit are exposed outside the outer casing 101. It has been.

このＩＰＭの組立工程においては、図９（Ａ）に示すように、パワー半導体素子を実装したパワー回路基板１０４が半田付けされた金属ベース１０５に、端子一体形の外囲ケース１０１を重ねて接着し、図９（Ｂ）に示すように、主端子１０２とパワー回路基板１０４との間、及び中継端子１０６とパワー回路基板１０４との間に、ボンディングワイヤ１０７を接続して内部配線を施す。この状態で外囲ケース１０１内にゲル状充填剤（例えばシリコーンゲル）を注入してパワー回路を封止して絶縁する。   In this IPM assembly process, as shown in FIG. 9A, a terminal integrated outer case 101 is bonded to a metal base 105 to which a power circuit board 104 mounted with a power semiconductor element is soldered. Then, as shown in FIG. 9B, bonding wires 107 are connected between the main terminals 102 and the power circuit board 104 and between the relay terminals 106 and the power circuit board 104 to provide internal wiring. In this state, a gel filler (for example, silicone gel) is injected into the outer case 101 to seal and insulate the power circuit.

続いて、図１０に示すように、充填剤の上方で外囲ケース１０１を架け渡すように制御端子ブロック１０８を配置し、さらに、その上から制御回路を実装した制御回路基板１０９を重ねて配置し、ねじ１１０を用いて固定する。この状態で、制御回路基板１０９の下方に露出した中継端子１０６及び制御端子１０３を、それぞれ制御回路の導体パターンにフロー半田付けする。最後に上蓋１１１を接着して組み立てる。
特開２００３−２４９６２４号公報（段落〔０００４〕，図１３） Subsequently, as shown in FIG. 10, the control terminal block 108 is arranged so as to bridge the enclosing case 101 above the filler, and further, the control circuit board 109 on which the control circuit is mounted is placed thereon. Then, it is fixed using the screw 110. In this state, the relay terminal 106 and the control terminal 103 exposed below the control circuit board 109 are flow soldered to the conductor pattern of the control circuit. Finally, the upper lid 111 is bonded and assembled.
Japanese Patent Laying-Open No. 2003-249624 (paragraph [0004], FIG. 13)

しかしながら、上述したＩＰＭにおいて、パワー回路を封止するために外囲ケース１０１内に注入された充填剤は、注入後にゲル状に硬化するものであって、硬化した後も剛性が比較的小さい。そのため、例えばＩＰＭが外部から振動を受けたときに変位し、内部のボンディングワイヤ１０７を動かしてボンディング部を剥離させたりワイヤを切断してしまうことがあった。   However, in the IPM described above, the filler injected into the outer case 101 for sealing the power circuit is hardened in a gel form after the injection, and the rigidity is relatively small even after the hardening. For this reason, for example, the IPM is displaced when receiving vibration from the outside, and the bonding wire 107 inside may be moved to peel off the bonding portion or cut the wire.

また、ゲル状の充填材は、硬化前は液状であって、毛細管現象により壁面を伝って流動する性質を有するため、注入の際に外囲ケース１０１の内壁を伝って中継端子１０６を這い上がってこれに付着し、その結果、制御回路基板１０９と中継端子１０６との間の半田付けが不良になるという問題がある。   Further, since the gel-like filler is in a liquid state before being cured and has a property of flowing along the wall surface by capillary action, the relay terminal 106 is crawled up along the inner wall of the outer casing 101 at the time of injection. As a result, the soldering between the control circuit board 109 and the relay terminal 106 becomes defective.

さらに、スペース上の都合から、制御回路基板１０９の中央部の２点を外囲ケース１０１に直接ねじ接合する構造であるため、そのねじの締結時の局所的な力により制御回路基板１０９の本体が反り、それにより中継端子１０６と制御回路基板１０９の導体パターンとの間の接合部が傾き、中継端子１０６と制御回路の導体パターンとの間の半田付けが不良になり、外部振動によりその半田接合部にクラックが発生しやすくなるといった問題があった。   Furthermore, because of space limitations, the control circuit board 109 has a structure in which two points at the center of the control circuit board 109 are directly screwed to the outer casing 101. As a result, the joint between the relay terminal 106 and the conductor pattern of the control circuit board 109 is inclined, resulting in poor soldering between the relay terminal 106 and the conductor pattern of the control circuit. There was a problem that cracks were likely to occur at the joint.

本発明はこのような点に鑑みてなされたものであり、外部振動による配線部の断線や端子接合部の破損を防止できる半導体装置を提供することを目的とする。   The present invention has been made in view of these points, and an object of the present invention is to provide a semiconductor device capable of preventing disconnection of a wiring portion and damage to a terminal joint portion due to external vibration.

本発明では上記問題を解決するために、主回路の外部導出端子を一体形成した端子一体形の外囲ケース内に、パワー回路及び制御回路を二階建て式に内装し、上蓋にて封止して構成される半導体装置において、前記パワー回路を構成するパワー半導体素子が実装され、前記外囲ケースの底部に配置されたパワー回路基板と、前記制御回路を構成する回路部品が実装された制御回路基板と、前記外囲ケースの内壁部に、前記パワー回路基板及び前記制御回路基板とは別に設けられ、前記パワー回路と前記制御回路とを相互接続するために並設された複数のピン端子からなる中継端子と、前記パワー回路基板と前記制御回路基板との間に介装されて絶縁物として機能するとともに、前記パワー回路基板の前記パワー回路を覆うように注入されて固着したゲル状充填剤を、前記制御回路基板とは反対側の面にて押える樹脂プレートと、前記制御回路の複数のピン端子からなる外部導出端子を一体形成して構成され、前記制御回路基板の前記樹脂プレートとは反対側に配置され、前記樹脂プレートとの間に前記制御回路基板を挟むように固定する制御端子ブロックと、を備え、前記中継端子は、少なくとも前記制御回路に接続される部分近傍が、前記外囲ケースの内壁部に対して所定間隔の間隙をあけて起立するとともに、前記外囲ケースの内方に露出して設けられ、前記樹脂プレートは、その板状の本体を厚み方向に貫通する一又は複数の貫通孔が設けられ、凝固した前記充填剤の一部を露出させることができるように構成されるとともに、前記本体の端縁において一段下がって前記内壁部側に延出し、その先端に、起立した前記中継端子を内方から定位置に支持する複数の支持溝が形成されたこと、を特徴とする半導体装置が提供される。
In the present invention, in order to solve the above problem, a power circuit and a control circuit are housed in a two-story structure in a terminal-integrated outer case integrally formed with an external lead-out terminal of the main circuit and sealed with an upper lid. In the semiconductor device configured as described above, the power semiconductor element that constitutes the power circuit is mounted, the power circuit board that is disposed at the bottom of the outer case, and the control circuit that is mounted with the circuit components that constitute the control circuit A plurality of pin terminals provided separately from the power circuit board and the control circuit board on the inner wall portion of the board and the surrounding case, and arranged in parallel to interconnect the power circuit and the control circuit. The relay terminal is interposed between the power circuit board and the control circuit board and functions as an insulator, and is injected and fixed so as to cover the power circuit of the power circuit board. A resin plate for pressing the gel-like filler on the surface opposite to the control circuit board and an external lead-out terminal composed of a plurality of pin terminals of the control circuit. A control terminal block disposed on the opposite side of the resin plate and fixed so as to sandwich the control circuit board between the resin plate, and the relay terminal is at least a portion connected to the control circuit The vicinity stands up with a predetermined gap from the inner wall portion of the outer case, and is exposed to the inner side of the outer case. The resin plate has a plate-like main body having a thickness. One or a plurality of through-holes penetrating in the direction are provided so that a part of the solidified filler can be exposed, and the inner wall is lowered one step at the edge of the main body Extending on the side, at the tip, a plurality of support grooves for supporting the relay terminals erected from the inside in place is formed, the semiconductor device is provided which is characterized in.

このような半導体装置においては、パワー回路を覆う充填剤が、樹脂プレートにより押えられ、外部振動を受けたときの充填材の変位が防止される。また、制御回路基板が制御端子ブロックと樹脂プレートとの間に挟まれるように固定されるため、これらの接合時に外部から付与される力が制御端子ブロックにて分散される。   In such a semiconductor device, the filler covering the power circuit is pressed by the resin plate, and the displacement of the filler when subjected to external vibration is prevented. Further, since the control circuit board is fixed so as to be sandwiched between the control terminal block and the resin plate, the force applied from the outside at the time of joining is dispersed by the control terminal block.

本発明の半導体装置によれば、樹脂プレートの押え力によりパワー回路を覆う充填剤の変位が防止されるため、外部振動によるパワー回路の配線部の断線を防止することができる。また、制御回路基板が制御端子ブロックを介して接合されるため、その接合時における制御回路基板の変形を防止することができ、その結果、制御回路と中継端子との接合部の破損を防止することができる。   According to the semiconductor device of the present invention, since the displacement of the filler covering the power circuit is prevented by the pressing force of the resin plate, it is possible to prevent disconnection of the wiring portion of the power circuit due to external vibration. In addition, since the control circuit board is joined via the control terminal block, deformation of the control circuit board at the time of joining can be prevented, and as a result, damage to the joint between the control circuit and the relay terminal can be prevented. be able to.

以下、本発明の実施の形態を図面を参照して詳細に説明する。
本実施の形態は、本発明の半導体装置をインバータ装置に適用するＩＰＭとして構成したものであり、図１は当該半導体装置の外観を表す斜視図であり、図２は当該半導体装置の構成を表す分解斜視図である。なお、以下の説明においては、便宜上、各図に示される状態を基準に上下と表現することがある。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In the present embodiment, the semiconductor device of the present invention is configured as an IPM applied to an inverter device, FIG. 1 is a perspective view showing the appearance of the semiconductor device, and FIG. 2 shows the configuration of the semiconductor device. It is a disassembled perspective view. In the following description, for convenience, it may be expressed as upper and lower with reference to the states shown in the drawings.

図１に示すように、本実施の形態のＩＰＭは、樹脂成形品からなる外囲ケース１０の内部に、後述するパワー回路基板及び制御回路基板を収容して構成されている。外囲ケース１０の外部には、後述する主端子１２や制御端子５１が露出して設けられている。   As shown in FIG. 1, the IPM of the present embodiment is configured by accommodating a power circuit board and a control circuit board, which will be described later, in an outer case 10 made of a resin molded product. A main terminal 12 and a control terminal 51, which will be described later, are exposed outside the outer case 10.

すなわち、図２に示すように、このＩＰＭは、端子一体形の枠状の外囲ケース１０，外囲ケース１０の底部を構成する放熱用の金属ベース２０，制御回路３１を構成する回路部品が実装された制御回路基板３０，制御回路基板３０と金属ベース２０との間に介装されて絶縁物として機能する樹脂プレート４０，インバータ装置に接続する制御端子５１を一体形成した制御端子ブロック５０，及び上蓋６０を備えている。   That is, as shown in FIG. 2, the IPM is composed of a terminal-integrated frame-shaped outer case 10, a heat dissipating metal base 20 that forms the bottom of the outer case 10, and circuit components that form the control circuit 31. A control terminal block 50 integrally formed with a mounted control circuit board 30, a resin plate 40 interposed between the control circuit board 30 and the metal base 20 and functioning as an insulator, and a control terminal 51 connected to the inverter device; And an upper lid 60.

金属ベース２０は、正方形板状の銅板からなり、その上面には、パワー回路２１を構成するＩＧＢＴ等のパワー半導体素子を複数並列に実装したパワー回路基板２２が半田付けされている。   The metal base 20 is made of a square plate-like copper plate, and a power circuit board 22 on which a plurality of power semiconductor elements such as IGBTs constituting the power circuit 21 are mounted in parallel is soldered on the upper surface thereof.

制御回路基板３０は、略正方形板状のプリント基板に上記パワー半導体素子の駆動回路や制御回路３１を実装して構成されている。この制御回路基板３０の中央位置には、制御端子ブロック５０の後述する複数の突状部をマウントさせる空領域からなる複数のマウント部３２と、制御端子ブロック５０から下方に延出した複数の制御端子５１を挿通させる複数の端子挿通孔３５が設けられている。さらに、その制御回路基板３０の中央位置の両端縁には、制御端子ブロック５０の両端に設けられた後述する着座部５８を挿通するスリット３４が形成され、その両端縁に沿って後述する中継端子１３の各ピン端子を挿通させる複数の端子挿通孔３３が設けられている。   The control circuit board 30 is configured by mounting the drive circuit of the power semiconductor element and the control circuit 31 on a substantially square plate-like printed board. At the central position of the control circuit board 30, a plurality of mount portions 32 each including an empty region for mounting a plurality of protrusions to be described later of the control terminal block 50, and a plurality of controls extending downward from the control terminal block 50. A plurality of terminal insertion holes 35 through which the terminals 51 are inserted are provided. Further, slits 34 are formed at both end edges of the center position of the control circuit board 30 so as to pass through seating portions 58 provided at both ends of the control terminal block 50, which will be described later, and relay terminals described later along the both end edges. A plurality of terminal insertion holes 33 through which the 13 pin terminals are inserted are provided.

図３は外囲ケース１０の構造を表す説明図であり、（Ａ）はその正面図であり、（Ｂ）は図２のＡ−Ａ矢視断面図であり、（Ｃ）は図２のＢ−Ｂ矢視断面図である。
この外囲ケース１０は、ポリフェニレンサルファイド樹脂（以下「ＰＰＳ樹脂」と表記する）などの樹脂材料からなる略正方形枠形状の本体１１を有し、その本体１１の一対の対向する側部には、パワー回路２１に接続される外部導出端子である複数の主端子１２がモールド成形され、残る一対の対向する側部には、パワー回路２１と制御回路３１とを相互接続するために並設された複数のピン端子からなる中継端子１３がモールド成形されている。また、本体１１の中継端子１３が設けられた側の一対の側壁には、その上半部において側方に開口した切欠部１４がそれぞれ形成されている。 3A and 3B are explanatory views showing the structure of the enclosing case 10, wherein FIG. 3A is a front view thereof, FIG. 3B is a cross-sectional view taken along the line A-A in FIG. 2, and FIG. It is BB arrow sectional drawing.
The surrounding case 10 has a substantially square frame-shaped main body 11 made of a resin material such as polyphenylene sulfide resin (hereinafter referred to as “PPS resin”), and a pair of opposing side portions of the main body 11 includes A plurality of main terminals 12 which are external lead-out terminals connected to the power circuit 21 are molded, and the remaining pair of opposite side portions are arranged in parallel to interconnect the power circuit 21 and the control circuit 31. A relay terminal 13 composed of a plurality of pin terminals is molded. Further, a pair of side walls on the side of the main body 11 on which the relay terminals 13 are provided are formed with cutouts 14 that are open laterally in the upper half.

主端子１２は、当該ＩＰＭの組み付け前においては外囲ケース１０の側部にモールドされた断面Ｌ字状の本体を有し、その一端部１２ａが、外囲ケース１０の側壁下部から内方に延出したフランジ部１０ａの上面に露出し、他端部１２ｂが外囲ケース１０の上端縁から上方に延出している。   The main terminal 12 has a main body having an L-shaped cross section molded on the side of the outer casing 10 before the IPM is assembled, and one end 12a thereof is inward from the lower part of the side wall of the outer casing 10. It is exposed on the upper surface of the extended flange portion 10 a and the other end portion 12 b extends upward from the upper end edge of the outer case 10.

中継端子１３の各ピン端子は、断面Ｌ字状の板状ベース部１３ａと、板状ベース部１３ａに連設された断面Ｌ字状のピン状接続部１３ｂとを備えている。この板状ベース部１３ａは、その一端が外囲ケース１０の側壁下部から内方に延出したフランジ部１０ｂの上面に露出し、他端が外囲ケース１０の側壁に埋設されている。ピン状接続部１３ｂは、その一端が板状ベース部１３ａに連設され、他端部が外囲ケース１０の側壁とほぼ平行に上方に起立している。このピン状接続部１３ｂと外囲ケース１０の側壁との間には、所定間隔の間隙があけられている。   Each pin terminal of the relay terminal 13 includes a plate-like base portion 13a having an L-shaped cross section, and a pin-shaped connecting portion 13b having an L-shaped cross section that is connected to the plate-like base portion 13a. One end of the plate-like base portion 13 a is exposed on the upper surface of the flange portion 10 b that extends inwardly from the lower portion of the side wall of the outer case 10, and the other end is embedded in the side wall of the outer case 10. One end of the pin-like connecting portion 13 b is connected to the plate-like base portion 13 a, and the other end stands up substantially parallel to the side wall of the outer case 10. A gap of a predetermined interval is provided between the pin-shaped connecting portion 13b and the side wall of the outer case 10.

また、中継端子１３の各ピン端子が並設される側の内周縁部の中央寄りには、樹脂プレート４０を着座させて支持する支持部１５が設けられている。この支持部１５の中央には、ねじ孔１５ａが形成されている。   Further, a support portion 15 for supporting the resin plate 40 by being seated is provided near the center of the inner peripheral edge portion on the side where the pin terminals of the relay terminal 13 are juxtaposed. A screw hole 15 a is formed in the center of the support portion 15.

図４は樹脂プレート４０の構造を表す説明図であり、（Ａ）はその平面図であり、（Ｂ）は（Ａ）のＣ方向からみた側面図であり、（Ｃ）はそのＤ−Ｄ矢視図である。
この樹脂プレート４０は、ＰＰＳ樹脂等の樹脂材料からなる略正方形板状の外形を有し、格子状（田の字状）に形成された本体４１を備える。すなわち、この本体４１の前後左右の４箇所には、これを厚み方向に貫通する貫通孔４２が設けられている。各貫通孔４２の下側（金属ベース２０側）の内周縁部は、丸みを帯びた形状に形成してもよい。
また、本体４１の中央を架け渡すように外周部よりも幅の大きな中央支持部４３が形成され、その両端には、外囲ケース１０の支持部１５にそのねじ孔１５ａを避けて着座するマウント部４４が形成されている。この両端部に形成されたマウント部４４は、支持部１５に対応して、本体４１の中心線（図中二点鎖線）を基準に互いに反対側にずれて形成され、樹脂プレート４０が外囲ケース１０に対して誤って表裏逆に取り付けられることがないようにされている。また、本体４１においてマウント部４４がない側の一対の外周縁の中央からは外向きに延出した三角状のマウント部４５が形成され、樹脂プレート４０を外囲ケース１０に取り付けた際には、上記フランジ部１０ａに支持されるように構成されている。 4A and 4B are explanatory views showing the structure of the resin plate 40, FIG. 4A is a plan view thereof, FIG. 4B is a side view seen from the direction C of FIG. It is an arrow view.
The resin plate 40 has a substantially square plate-like outer shape made of a resin material such as PPS resin, and includes a main body 41 formed in a lattice shape (field shape). That is, through holes 42 that penetrate the main body 41 in the thickness direction are provided at four locations on the front, rear, left, and right sides. The inner peripheral edge on the lower side (metal base 20 side) of each through hole 42 may be formed in a rounded shape.
Further, a central support portion 43 having a width wider than the outer peripheral portion is formed so as to bridge the center of the main body 41, and at both ends thereof, mounts that are seated on the support portion 15 of the outer case 10 while avoiding the screw holes 15a. A portion 44 is formed. The mount portions 44 formed at both ends correspond to the support portion 15 and are formed so as to be shifted to the opposite sides with respect to the center line of the main body 41 (two-dot chain line in the figure). The case 10 is not attached to the case 10 by mistake. In addition, a triangular mounting portion 45 extending outward from the center of the pair of outer peripheral edges on the side of the main body 41 where the mounting portion 44 is not provided is formed, and when the resin plate 40 is attached to the surrounding case 10 , And is configured to be supported by the flange portion 10a.

また、本体４１のマウント部４４が形成された側の両端縁には、下方に傾斜しつつ一段下がって本体４１に平行に外側（外囲ケース１０の内壁部側）に延びる延出部４６が形成されている。この延出部４６の先端には、外囲ケース１０の側方で起立した中継端子１３のピン状接続部１３ｂの下部を内方から定位置に支持する複数の支持溝４６ａが形成されている。   Further, at both end edges on the side where the mount portion 44 of the main body 41 is formed, extending portions 46 that extend downward and extend outward (inner wall portion side of the outer casing 10) parallel to the main body 41 while being inclined downward. Is formed. A plurality of support grooves 46 a that support the lower part of the pin-like connection part 13 b of the relay terminal 13 erected on the side of the outer case 10 from the inside to a fixed position are formed at the tip of the extension part 46. .

図５は制御端子ブロック５０の構造を表す説明図であり、（Ａ）はその平面図であり、（Ｂ）は（Ａ）のＥ方向からみた側面図である。
この制御端子ブロック５０は、ＰＰＳ樹脂等の樹脂材料からなる本体５２を有し、その本体５２は、制御回路３１と外部のインバータ装置とを接続する複数の制御端子５１を収容して支持する直方体状の端子収容部５３と、この端子収容部５３を下方で支持する支持ベース５４とを備えている。 5A and 5B are explanatory views showing the structure of the control terminal block 50. FIG. 5A is a plan view of the control terminal block 50, and FIG.
The control terminal block 50 has a main body 52 made of a resin material such as PPS resin, and the main body 52 accommodates and supports a plurality of control terminals 51 that connect the control circuit 31 and an external inverter device. The terminal accommodating part 53 of a shape and the support base 54 which supports this terminal accommodating part 53 below are provided.

制御端子５１は、起立した本体の下部が端子収容部５３にモールドされており、その本体の両端部はそれぞれ制御端子ブロック５０の外方に延出している。
端子収容部５３は、その高さ方向の中央部を側方に貫通して、その内部に制御端子５１を収容する収容部５５を有する。 In the control terminal 51, the lower portion of the upstanding main body is molded in the terminal accommodating portion 53, and both end portions of the main body extend outward from the control terminal block 50.
The terminal accommodating portion 53 has an accommodating portion 55 that penetrates the central portion in the height direction laterally and accommodates the control terminal 51 therein.

支持ベース５４は、長尺板状の本体５６を有し、その本体５６の片側端部上に端子収容部５３が連設されている。本体５６の中央には、これを厚み方向に貫通する長方形状の露出孔５７が形成されており、その下方に実装した回路部品を露出させることが可能に構成されている。本体５６の両端には、一段下がって本体５６に平行に外側（外囲ケース１０の内壁部側）に延びる着座部５８がそれぞれ形成されている。この着座部５８は、その中央にねじ挿通孔５８ａが設けられ、当該ＩＰＭの組立時に制御回路基板３０のスリット３４を挿通して、樹脂プレート４０のマウント部４４に載置される。また、支持ベース５４の下面からは押圧部としての複数の突状部５９が設けられており、制御回路基板３０への組み付け時にそれぞれ上述した制御回路基板３０のマウント部３２に着座するように構成されている。   The support base 54 has a long plate-like main body 56, and a terminal accommodating portion 53 is continuously provided on one end portion of the main body 56. A rectangular exposure hole 57 is formed in the center of the main body 56 so as to penetrate the main body 56 in the thickness direction, so that circuit components mounted therebelow can be exposed. At both ends of the main body 56, seating portions 58 are formed which extend one step downward and extend outward (inner wall portion side of the outer case 10) in parallel to the main body 56. The seat portion 58 is provided with a screw insertion hole 58a at the center thereof, and is placed on the mount portion 44 of the resin plate 40 through the slit 34 of the control circuit board 30 when the IPM is assembled. Further, a plurality of protruding portions 59 as pressing portions are provided from the lower surface of the support base 54, and are configured to be seated on the mount portion 32 of the control circuit board 30 described above when assembled to the control circuit board 30, respectively. Has been.

図６は上蓋６０の構造を表す説明図であり、（Ａ）はその平面図であり、（Ｂ）は（Ａ）のＦ−Ｆ矢視図である。
この上蓋６０は、ＰＰＳ樹脂等の樹脂材料からなり、外囲ケース１０の上端縁に沿った略正方形板状の本体６１を有する。その６１の外囲ケース１０の切欠部１４に対向する両端縁から、切欠部１４と相補形状の側壁６２が延出して設けられている。このため、上蓋６０を外囲ケース１０に取り付けた際には、外囲ケース１０の内部が上蓋６０により完全に封止される。また、このように側壁６２を設けたことにより、上蓋６０の強度アップが図られている。 6A and 6B are explanatory views showing the structure of the upper lid 60. FIG. 6A is a plan view thereof, and FIG. 6B is a view taken along the line FF in FIG.
The upper lid 60 is made of a resin material such as PPS resin and has a substantially square plate-shaped main body 61 along the upper edge of the outer casing 10. A side wall 62 having a shape complementary to the cutout portion 14 is provided to extend from both end edges of the 61 surrounding case 10 facing the cutout portion 14. For this reason, when the upper lid 60 is attached to the outer case 10, the inside of the outer case 10 is completely sealed by the upper lid 60. Further, by providing the side wall 62 in this manner, the strength of the upper lid 60 is increased.

また、本体６１の側壁６２が設けられていない側の一対の周縁部には、外囲ケース１０から延出した主端子１２を組み付ける複数のベース部６３がやや突出して設けられている。さらに、本体６１の中央部のやや周縁部よりには、外囲ケース１０内に組み付けられた制御端子ブロック５０の端子収容部５３を挿通して外部に露出させる長方形状の挿通孔６４が形成されている。   In addition, a plurality of base portions 63 for assembling the main terminals 12 extending from the outer casing 10 are provided on the pair of peripheral portions on the side where the side wall 62 of the main body 61 is not provided. Further, a rectangular insertion hole 64 that is inserted through the terminal accommodating portion 53 of the control terminal block 50 assembled in the outer casing 10 and exposed to the outside is formed from a slightly peripheral portion of the central portion of the main body 61. ing.

次に、本実施の形態のＩＰＭの組立手順について、図２及び図７を参照して説明する。図７はＩＰＭの組立工程の途中の半完成品を表す断面図である。
図２に示すように、まず、パワー回路２１を構成するパワー半導体素子が実装されたパワー回路基板２２を金属ベース２０上に半田付けし、これに外囲ケース１０を重ねて接着する。続いて、外囲ケース１０内に露出した主端子１２の一端部１２ａとパワー回路２１との間、及び中継端子１３の板状ベース部１３ａとパワー回路２１との間に、図示しないボンディングワイヤを接続して内部配線を施す。そして、この状態で外囲ケース１０内のパワー回路基板２２上にゲル状充填剤（例えばシリコーンゲル）を注入してパワー回路２１を封止して絶縁する。上述したように、中継端子１３のピン状接続部１３ｂと外囲ケース１０の側壁との間には所定間隔の間隙があけられているため（図３（Ｃ）参照）、このとき注入されたゲル状充填剤は、板状ベース部１３ａの上面までにとどまり、ピン状接続部１３ｂを這い上がることはない。このゲル状充填剤は、その後に熱硬化される。 Next, the procedure for assembling the IPM according to the present embodiment will be described with reference to FIGS. FIG. 7 is a cross-sectional view showing a semi-finished product during the IPM assembly process.
As shown in FIG. 2, first, the power circuit board 22 on which the power semiconductor elements constituting the power circuit 21 are mounted is soldered onto the metal base 20, and the outer case 10 is overlapped and bonded thereto. Subsequently, bonding wires (not shown) are connected between the one end portion 12a of the main terminal 12 exposed in the outer casing 10 and the power circuit 21 and between the plate-like base portion 13a of the relay terminal 13 and the power circuit 21. Connect and apply internal wiring. In this state, a gel filler (for example, silicone gel) is injected onto the power circuit board 22 in the surrounding case 10 to seal and insulate the power circuit 21. As described above, there is a predetermined gap between the pin-like connecting portion 13b of the relay terminal 13 and the side wall of the outer case 10 (see FIG. 3C). The gel filler stays up to the upper surface of the plate-like base portion 13a and does not scoop up the pin-like connecting portion 13b. This gel filler is then thermally cured.

続いて、熱硬化した充填剤の上方から樹脂プレート４０を挿入して外囲ケース１０に組み付ける。このとき、樹脂プレート４０の端縁に設けられたマウント部４４，４５が、それぞれ外囲ケース１０の支持部１５、フランジ部１０ａに着座して支持され、樹脂プレート４０が充填剤を上方から押圧する。充填剤の上面は、この押圧力により樹脂プレート４０の貫通孔４２から部分的に盛り上がるように露出し、その反力によって下面側でパワー回路２１を安定に固定する。この充填剤は盛り上がる際に、貫通孔４２の下側内周縁部を部分的に通過するが、上述のようにこの下側内周縁部が丸みを帯びているため、充填剤を損傷させることがない。この組み付けの際、樹脂プレート４０の両端縁に設けられた支持溝４６ａが、中継端子１３のピン状接続部１３ｂを内方から押圧するように支持するため、そのピン状接続部１３ｂの先端は定位置に整列されて固定される。また、樹脂プレート４０の両端縁の延出部４６が充填剤側に一段下がっているため、特に中継端子１３近傍での充填剤の盛り上がりを阻止している。   Subsequently, the resin plate 40 is inserted from above the thermally cured filler and assembled to the outer case 10. At this time, mount portions 44 and 45 provided at the edge of the resin plate 40 are seated and supported on the support portion 15 and the flange portion 10a of the outer case 10, respectively, and the resin plate 40 presses the filler from above. To do. The upper surface of the filler is exposed so as to partially swell from the through hole 42 of the resin plate 40 by this pressing force, and the power circuit 21 is stably fixed on the lower surface side by the reaction force. When the filler swells, it partially passes through the lower inner peripheral edge of the through hole 42. However, as described above, the lower inner peripheral edge is rounded, which may damage the filler. Absent. At the time of this assembly, since the support grooves 46a provided at both end edges of the resin plate 40 support the pin-like connecting portion 13b of the relay terminal 13 so as to press from the inside, the tip of the pin-like connecting portion 13b is Aligned and fixed in place. In addition, since the extending portions 46 at both end edges of the resin plate 40 are lowered by one step toward the filler side, the swelling of the filler particularly in the vicinity of the relay terminal 13 is prevented.

続いて、樹脂プレート４０の上方から制御回路基板３０を組み付ける。この制御回路基板３０は、予め制御端子ブロック５０が組み付けられている。制御端子ブロック５０の突状部５９が制御回路基板３０のマウント部３２に当接し、制御端子ブロック５０の下方に延出した制御端子５１の先端が、制御回路基板３０の端子挿通孔３５を挿通してその下面に露出して制御回路基板３０の下面の導体パターンに半田付けされている。   Subsequently, the control circuit board 30 is assembled from above the resin plate 40. The control circuit board 30 has a control terminal block 50 assembled in advance. The protruding portion 59 of the control terminal block 50 contacts the mount portion 32 of the control circuit board 30, and the tip of the control terminal 51 extending below the control terminal block 50 is inserted through the terminal insertion hole 35 of the control circuit board 30. Then, it is exposed on the lower surface and soldered to the conductor pattern on the lower surface of the control circuit board 30.

そして、制御回路基板３０の端子挿通孔３３に中継端子１３の各ピン端子を挿通させるように組み付けられ、その本体全体が、樹脂プレート４０によって安定に支持される。このとき、制御端子ブロック５０の着座部５８が、制御回路基板３０のスリット３４を挿通して樹脂プレート４０のマウント部４４に載置される。   Then, it is assembled so that each pin terminal of the relay terminal 13 is inserted into the terminal insertion hole 33 of the control circuit board 30, and the entire main body is stably supported by the resin plate 40. At this time, the seat 58 of the control terminal block 50 is inserted through the slit 34 of the control circuit board 30 and placed on the mount 44 of the resin plate 40.

そして、ねじ７１を制御端子ブロック５０の各ねじ挿通孔５８ａに挿通して外囲ケース１０のねじ孔１５ａに螺合させることにより、制御端子ブロック５０を外囲ケース１０に対して締結固定する。このとき、制御端子ブロック５０の下方の制御回路基板３０及び樹脂プレート４０も同時に固定される。この場合、制御回路基板３０は、ねじ７１により直接締結されるわけではなく、制御端子ブロック５０を介して間接的に固定される。このため、制御回路基板３０には、ねじ７１による局所的な力が加わることがなく、その力が制御端子ブロック５０の支持ベース５４により分散されて伝わる。そのため、ねじ７１の締結時に制御回路基板３０が反る等の問題も発生しない。   Then, the control terminal block 50 is fastened and fixed to the outer casing 10 by inserting the screws 71 into the screw insertion holes 58 a of the control terminal block 50 and screwing them into the screw holes 15 a of the outer casing 10. At this time, the control circuit board 30 and the resin plate 40 below the control terminal block 50 are also fixed simultaneously. In this case, the control circuit board 30 is not directly fastened by the screws 71 but is indirectly fixed via the control terminal block 50. Therefore, a local force due to the screw 71 is not applied to the control circuit board 30, and the force is distributed and transmitted by the support base 54 of the control terminal block 50. Therefore, the problem that the control circuit board 30 warps when the screw 71 is fastened does not occur.

このようにして組み付けられた半完成品は、図７のような状態になっており、この半完成品に対してフロー半田付け処理を行って、制御回路基板３０の表面の中継端子１３のピン状接続部１３ｂを半田付けする。この場合、樹脂プレート４０の支持により制御回路基板３０の下面が外囲ケース１０の切欠部１４の下端縁よりも高い位置にあるため、制御回路基板３０の裏面の半田付け部の半田フィレットを容易に確認することができ、半田付け不良を防止することができる。   The semi-finished product assembled in this way is in a state as shown in FIG. 7. The semi-finished product is subjected to a flow soldering process, and the pins of the relay terminal 13 on the surface of the control circuit board 30 are processed. The solder-like connecting portion 13b is soldered. In this case, since the lower surface of the control circuit board 30 is positioned higher than the lower end edge of the cutout portion 14 of the outer case 10 due to the support of the resin plate 40, the solder fillet of the soldered portion on the back surface of the control circuit board 30 can be easily provided. Thus, it is possible to prevent a soldering failure.

そして、この半田付け処理終了後の半完成品に対して上方から上蓋６０を被せて接着し、この外囲ケース１０の上方に延出した主端子１２を内方に折り曲げてベース部６３に密着させる。これにより、上蓋６０が外囲ケース１０に対して固定されるとともに、外囲ケース１０内が封止される。   Then, the semi-finished product after the soldering process is bonded to the semi-finished product by covering the upper lid 60 from above, and the main terminal 12 extending above the outer case 10 is bent inward to adhere to the base portion 63. Let Thus, the upper lid 60 is fixed to the outer case 10 and the inside of the outer case 10 is sealed.

以上に説明したように、本実施の形態のＩＰＭは、パワー回路２１を覆う充填剤が、樹脂プレート４０により押えられ、外部振動を受けたときの変位が防止されるため、外部振動によるパワー回路２１に接続されるボンディングワイヤ等の配線部の断線を防止することができる。   As described above, in the IPM according to the present embodiment, the filler that covers the power circuit 21 is pressed by the resin plate 40 to prevent displacement when subjected to external vibration. It is possible to prevent disconnection of a wiring part such as a bonding wire connected to 21.

また、制御回路基板３０が制御端子ブロック５０と樹脂プレート４０との間に挟まれるように固定されるため、これらのねじ接合時における制御回路基板３０の変形を防止することができ、その結果、制御回路３１と中継端子１３との半田接合部の破損を防止することができる。   Further, since the control circuit board 30 is fixed so as to be sandwiched between the control terminal block 50 and the resin plate 40, the deformation of the control circuit board 30 at the time of screw joining can be prevented. Breakage of the solder joint between the control circuit 31 and the relay terminal 13 can be prevented.

以上、本発明の好適な実施の形態について説明したが、本発明はその特定の実施の形態に限定されるものではなく、本発明の精神の範囲内での変化変形が可能であることはいうまでもない。   The preferred embodiment of the present invention has been described above, but the present invention is not limited to the specific embodiment, and it can be changed and modified within the spirit of the present invention. Not too long.

例えば、上記実施の形態では、樹脂プレート４０に貫通孔４２を設けて田の字状に形成した例を示したが、樹脂プレート４０がその他の格子状になるように貫通孔の形状及び数を変更してもよいし、貫通孔ではなく、下方に開口した溝部を形成してもよい。また、下方の充填剤を十分に押えられる場合には、貫通孔や溝部を設けなくてもよい。   For example, in the above-described embodiment, an example in which the resin plate 40 is provided with the through holes 42 and formed in the shape of a square is shown. However, the shape and number of the through holes are set so that the resin plate 40 has another lattice shape. It may be changed, and not a through-hole but a groove opening downward may be formed. In addition, when the lower filler can be sufficiently pressed, the through hole and the groove need not be provided.

また、制御端子ブロック５０の下面に複数の突状部５９を突設した例を示したが、制御端子ブロック５０の本体の下面の比較的大きな領域で制御回路基板３０に当接するような構成としてもよい。また、制御回路基板３０をその中央部で固定する態様としたが、スペース状の問題がなければ、制御回路基板３０の隅部で固定するようにしてもよい。   Moreover, although the example which protruded and provided the some protrusion part 59 in the lower surface of the control terminal block 50 was shown, it is set as the structure which contact | abuts to the control circuit board 30 in the comparatively big area | region of the lower surface of the main body of the control terminal block 50. Also good. In addition, although the control circuit board 30 is fixed at the center, the space may be fixed at the corner of the control circuit board 30 if there is no problem with the space.

実施の形態の半導体装置の外観を表す斜視図である。It is a perspective view showing the external appearance of the semiconductor device of an embodiment. 半導体装置の構成を表す分解斜視図である。It is a disassembled perspective view showing the structure of a semiconductor device. 外囲ケースの構造を表す説明図である。It is explanatory drawing showing the structure of an enclosing case. 樹脂プレートの構造を表す説明図である。It is explanatory drawing showing the structure of a resin plate. 制御端子ブロックの構造を表す説明図である。It is explanatory drawing showing the structure of a control terminal block. 上蓋の構造を表す説明図である。It is explanatory drawing showing the structure of an upper cover. ＩＰＭの組立工程の途中の半完成品を表す断面図である。It is sectional drawing showing the semi-finished product in the middle of the assembly process of IPM. 従来のＩＰＭの構成例を表す斜視図である。It is a perspective view showing the structural example of the conventional IPM. 従来のＩＰＭの組立構造を表す分解斜視図である。It is a disassembled perspective view showing the assembly structure of the conventional IPM. 従来のＩＰＭの組立構造を表す分解斜視図である。It is a disassembled perspective view showing the assembly structure of the conventional IPM.

符号の説明Explanation of symbols

１０ 外囲ケース
１０ａ，１０ｂ フランジ部
１２ 主端子
１３ 中継端子
１３ａ 板状ベース部
１３ｂ ピン状接続部
１４ 切欠部
２０ 金属ベース
２１ パワー回路
２２ パワー回路基板
３０ 制御回路基板
３１ 制御回路
４０ 樹脂プレート
４２ 貫通孔
４４，４５ マウント部
４６ 延出部
４６ａ 支持溝
５０ 制御端子ブロック
５１ 制御端子
５４ 支持ベース
５８ 着座部
５９ 突状部
６０ 上蓋
６２ 側壁 DESCRIPTION OF SYMBOLS 10 Outer case 10a, 10b Flange part 12 Main terminal 13 Relay terminal 13a Plate-shaped base part 13b Pin-shaped connection part 14 Notch part 20 Metal base 21 Power circuit 22 Power circuit board 30 Control circuit board 31 Control circuit 40 Resin plate 42 Through Hole 44, 45 Mount part 46 Extension part 46a Support groove 50 Control terminal block 51 Control terminal 54 Support base 58 Seating part 59 Projection part 60 Upper lid 62 Side wall

Claims (4)

主回路の外部導出端子を一体形成した端子一体形の外囲ケース内に、パワー回路及び制御回路を二階建て式に内装し、上蓋にて封止して構成される半導体装置において、
前記パワー回路を構成するパワー半導体素子が実装され、前記外囲ケースの底部に配置されたパワー回路基板と、
前記制御回路を構成する回路部品が実装された制御回路基板と、
前記外囲ケースの内壁部に、前記パワー回路基板及び前記制御回路基板とは別に設けられ、前記パワー回路と前記制御回路とを相互接続するために並設された複数のピン端子からなる中継端子と、
前記パワー回路基板と前記制御回路基板との間に介装されて絶縁物として機能するとともに、前記パワー回路基板の前記パワー回路を覆うように注入されて固着したゲル状充填剤を、前記制御回路基板とは反対側の面にて押える樹脂プレートと、
前記制御回路の複数のピン端子からなる外部導出端子を一体形成して構成され、前記制御回路基板の前記樹脂プレートとは反対側に配置され、前記樹脂プレートとの間に前記制御回路基板を挟むように固定する制御端子ブロックと、
を備え、
前記中継端子は、少なくとも前記制御回路に接続される部分近傍が、前記外囲ケースの内壁部に対して所定間隔の間隙をあけて起立するとともに、前記外囲ケースの内方に露出して設けられ、
前記樹脂プレートは、その板状の本体を厚み方向に貫通する一又は複数の貫通孔が設けられ、凝固した前記充填剤の一部を露出させることができるように構成されるとともに、前記本体の端縁において一段下がって前記内壁部側に延出し、その先端に、起立した前記中継端子を内方から定位置に支持する複数の支持溝が形成されたこと、
を特徴とする半導体装置。 In a semiconductor device constituted by embedding a power circuit and a control circuit in a two-storey type in a terminal-integrated outer case integrally formed with an external lead-out terminal of a main circuit, and sealed with an upper lid,
A power circuit board on which a power semiconductor element constituting the power circuit is mounted and disposed at the bottom of the outer case, and
A control circuit board on which circuit components constituting the control circuit are mounted;
A relay terminal comprising a plurality of pin terminals provided in parallel to interconnect the power circuit and the control circuit on the inner wall of the outer case, separately from the power circuit board and the control circuit board. When,
A gel-like filler that is interposed between the power circuit board and the control circuit board and functions as an insulator, and is injected and fixed so as to cover the power circuit of the power circuit board. A resin plate to hold on the opposite side of the substrate;
An external lead-out terminal comprising a plurality of pin terminals of the control circuit is integrally formed, arranged on the opposite side of the control circuit board from the resin plate, and the control circuit board is sandwiched between the resin plate A control terminal block to be fixed,
Equipped with a,
The relay terminal is provided at least in the vicinity of a portion connected to the control circuit with a predetermined gap from the inner wall of the outer case and exposed to the inner side of the outer case. And
The resin plate is provided with one or a plurality of through-holes penetrating the plate-shaped main body in the thickness direction, and is configured to expose a part of the solidified filler. A plurality of support grooves are formed at one end of the end edge to extend to the inner wall portion side and support the raised relay terminal at a fixed position from the inside at the tip .
A semiconductor device characterized by the above. 前記外囲ケースは、前記中継端子が並設された側の側部に、前記制御回路基板の下面よりも低い位置まで切り欠かれた切欠部を有し、The outer case has a cutout portion cut out to a position lower than the lower surface of the control circuit board on the side portion where the relay terminals are arranged side by side,
前記樹脂プレートの先端と前記制御回路基板との間に延びる前記中継端子の部分が外部から視認可能に構成されたこと、  The portion of the relay terminal extending between the tip of the resin plate and the control circuit board is configured to be visible from outside.
を特徴とする請求項１記載の半導体装置。  The semiconductor device according to claim 1. 前記上蓋は、The upper lid is
前記外囲ケースの上端縁に支持される本体と、  A main body supported by the upper edge of the outer case;
前記本体の前記外囲ケースの前記切欠部に対向する端縁から、前記切欠部を封止するように延出した側壁と、  A side wall extending from the edge of the outer case facing the notch of the main body so as to seal the notch;
を備えたことを特徴とする請求項２記載の半導体装置。  The semiconductor device according to claim 2, further comprising: 主回路の外部導出端子を一体形成した端子一体形の外囲ケース内に、パワー回路及び制御回路を二階建て式に内装し、上蓋にて封止して構成される半導体装置において、In a semiconductor device constituted by embedding a power circuit and a control circuit in a two-story manner in a terminal-integrated outer case integrally formed with an external lead-out terminal of a main circuit, and sealed with an upper lid,
前記パワー回路を構成するパワー半導体素子が実装され、前記外囲ケースの底部に配置されたパワー回路基板と、  A power circuit board on which a power semiconductor element constituting the power circuit is mounted and disposed at the bottom of the outer case, and
前記制御回路を構成する回路部品が実装された制御回路基板と、  A control circuit board on which circuit components constituting the control circuit are mounted;
前記外囲ケースの内壁部に、前記パワー回路基板及び前記制御回路基板とは別に設けられ、前記パワー回路と前記制御回路とを相互接続するために並設された複数のピン端子からなる中継端子と、  A relay terminal comprising a plurality of pin terminals provided on the inner wall of the outer case separately from the power circuit board and the control circuit board and arranged in parallel to interconnect the power circuit and the control circuit. When,
前記パワー回路基板と前記制御回路基板との間に介装されて絶縁物として機能するとともに、前記パワー回路基板の前記パワー回路を覆うように注入されて固着したゲル状充填剤を、前記制御回路基板とは反対側の面にて押える樹脂プレートと、  A gel-like filler that is interposed between the power circuit board and the control circuit board and functions as an insulator, and is injected and fixed so as to cover the power circuit of the power circuit board. A resin plate to hold on the opposite side of the substrate;
前記制御回路の複数のピン端子からなる外部導出端子を一体形成して構成され、前記制御回路基板の前記樹脂プレートとは反対側に配置され、前記樹脂プレートとの間に前記制御回路基板を挟むように固定する制御端子ブロックと、  An external lead-out terminal composed of a plurality of pin terminals of the control circuit is integrally formed, arranged on the opposite side of the control circuit board from the resin plate, and the control circuit board is sandwiched between the resin plate A control terminal block to be fixed,
を備え、  With
前記制御端子ブロックは、前記外囲ケース内部の中央寄りの位置を架け渡すように延びる本体を有し、  The control terminal block has a main body extending so as to bridge a position near the center inside the outer case,
前記本体の下面に、前記制御回路基板の上面の所定の空領域に当接し、前記制御端子ブロックの接合時に前記制御回路基板を前記樹脂プレートに対して押圧する突状部が設けられたことを特徴とする半導体装置。  The lower surface of the main body is provided with a protruding portion that contacts a predetermined empty area on the upper surface of the control circuit board and presses the control circuit board against the resin plate when the control terminal block is joined. A featured semiconductor device.
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