JP4298096B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP4298096B2
JP4298096B2 JP33757299A JP33757299A JP4298096B2 JP 4298096 B2 JP4298096 B2 JP 4298096B2 JP 33757299 A JP33757299 A JP 33757299A JP 33757299 A JP33757299 A JP 33757299A JP 4298096 B2 JP4298096 B2 JP 4298096B2
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Japan
Prior art keywords
light
light emitting
emitting element
guide plate
lead
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JP33757299A
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JP2001155532A (en
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博志 満田
均 石川
卓生 村井
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Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
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Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
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Description

【０００１】
【発明の属する技術分野】
この発明は、発光素子を用いた発光装置に関し、特に発光素子の放熱構造に関する。
【０００２】
【従来の技術】
図９は従来の発光装置の部分破断斜視図、図１０は図９の断面図である。図において１は発光素子、３は発光素子のリード、４は導光板、５はケースである。１０は発光素子１の鉛直上方に設けられ、発光素子１がリード３を介して接続された発光素子基板であり、図示してないがリード３が接続される面の反対側には放熱シートや放熱部材が一体に設けられている場合もある。１１は点灯回路等の回路基板である。
【０００３】
この構成において発光素子１が点灯されると発光素子１の直射光は導光板４を通過して放射される。このとき発光素子１は発熱するが、リード３を介して発光素子基板１０に放熱される。
【０００４】
【発明が解決しようとする課題】
上記のような従来の発光装置では、発光素子１の発熱はリード３を介して発光素子基板１０から放熱されるものの、リード３からの自然対流による放熱については熱が鉛直上方向に向かおうとしても発光素子基板１０に遮られ、熱が発光素子１と発光素子基板１０の間に滞留してしまい自然対流による放熱は殆どできず、放熱が悪いという問題があった。
また、図９は発光方向が下向きの場合を示しているが、発光方向が上向きの場合は、リード３からの自然対流による熱が鉛直上方向に向かおうとしても発光素子１に遮られ、自然対流による放熱が悪いという問題があった。
【０００５】
また、発光素子基板１０での放熱効果を高めるために発光素子基板１０を大きくすると、発光装置のケース５の厚さＴと幅Ｗが大きくなってしまうという問題があり、発光装置のケース５をコンパクトにするには発光素子基板１０の幅等を小さくして、点灯回路等を別の回路基板１１として分散させる必要があり構成が複雑になるという問題があった。
【０００６】
この発明は上記のような問題点を解消するためになされたもので、発光素子の発熱を簡単な構成により放熱させ放熱効果が高く、また、コンパクトな発光装置を得ることを目的とする。
【０００７】
【課題を解決するための手段】
この発明に係わる発光装置は、上面に放熱穴が設けられ、一側壁に開口部が設けられた直方体状のケースと、前記ケース内に収納され、前記一側壁の開口部に配置された直方体状の導光板と、前記ケースの前記一側壁と対向する側壁と前記導光板の間であって、前記導光板の上面よりも本体の上端が高くなるように該側壁に沿って配された発光素子基板と、前記導光板の上方に前記導光板の上部から内部に光を照射するように並んで設けられた複数の発光素子と、前記放熱穴と前記発光素子の間であって、一端が前記複数の発光素子と接続され、他端が前記発光素子よりも高い位置で前記発光素子基板と接続される複数のリードとを有するものである。
また、上面に放熱穴が設けられ、一側壁に開口部が設けられた直方体状のケースと、前記ケース内に収納され、前記一側壁の開口部に配置された直方体状の導光板と、前記ケースの前記一側壁と対向する側壁と前記導光板の間であって、前記導光板の上面よりも本体の上端が高くなるように該側壁に沿って配された発光素子基板と、前記導光板の上方に前記導光板の上部から内部に光を照射するように並んで設けられた複数の発光素子と、
一端が前記発光素子の正極に接続され、他端が前記発光素子基板に接続される第１のリードと、前記放熱穴と前記発光素子の間であって、一端が前記発光素子の負極に接続され、他端が前記発光素子よりも高い位置で前記発光素子基板に接続され、前記第１のリードよりも長い第２のリードとを有するものである。
【０００８】
また、リードの曲部を発光素子基板近傍に配設したものである。
【０００９】
また、リードに放熱板を設けたものである。
【００１０】
また、放熱板はリードを挟むように対向して配設された一対の金属板と、この金属板の間に充填された熱伝導性材と、を備える。
【００１２】
【発明の実施の形態】
以下、この発明の実施の形態に係わる発光装置を図に基づいて説明する。
実施の形態１．
図１はこの発明の実施の形態１に係わるを示す発光装置を示す部分破断斜視図、図２は図１の断面図である。図において１は発光素子、２は発光素子１の発光方向と略平行に配設された発光素子基板であり、後述のリード３の鉛直上方を避けて配設されている。３は発光素子基板２と発光素子１との間に接続された略Ｌ字形状の曲部を有するリードであり、曲部をできるだけ発光素子基板２に近接させて配設し、曲部から発光素子１までの長さを長くしている。
４は導光板、５はケース、５ａは放熱穴である。なお、発光素子基板２は図示してないがリード３が接続される面の反対側には放熱シートや放熱部材が一体に設けられている場合がある。
【００１３】
この構成において発光素子１が点灯されると発光素子１の光が導光板４を通り下方向に放射される。このとき発光素子１は発熱するが、この熱の一部はリード３を介して基板２に放熱され、一部はリード３から放熱される。リード３の鉛直上方にはリード３からの放熱による自然対流を妨げる発光素子基板２もなく、自然対流による放熱が行われる。
また、発光素子基板２は発光素子１のリード３がＬ字形状となっているので長さを長くとることができ放熱面積が大きいので、放熱効果がよい。
【００１４】
なお、図１、２では発光素子１の発光方向が下方向の場合を示したが、図３に示すように上向きでもよく、図４に示すように水平方向でもよい。水平方向の場合、発光素子基板２の下方に発光素子１があるときでも、発光素子基板２の端部に接続されたリード３の鉛直上方を避けて発光素子基板２を配設すればよい。
また、図１、２ではリード３の曲部は略Ｌ字形状のものを示したが、リード３を湾曲させたものでもよい。
【００１５】
以上のように、発光素子１の発熱を簡単な構成により放熱させ、放熱効果を高くすることができる。
また、リード３は曲部があるので長さを長くして放熱効果を高くすることができる。
また、装置をコンパクトにして、基板を大きくでき、回路を同一基板上に構成することができる。
【００１６】
実施の形態２．
図５はこの発明の実施の形態２に係わるを示す発光装置を示す部分破断斜視図、図６は図５の断面図である。図において実施の形態１の図１と同じ部分には同一の符号を付し、説明を省略する。９はリードであり、発光素子１の負極に接続され、くの字状に曲げられて発光素子基板２に密接して配設された第２のリード９ｂと発光素子１の正極に接続され、発光素子基板２に密接して配設された第１のリード９ａからなる。
【００１７】
この構成において、発光素子１から放熱される熱は、リード９を介して発光素子基板２への放熱と自然対流による放熱が行われる。
そして、発光素子１の発熱の多い方の負極が曲部を有する第２のリード９ｂに接続されているので第２のリード９ｂの長さを長くとることができ、放熱面積が大きく、放熱効率がよい。
【００１８】
以上のように、発光素子１の発熱を簡単な構成で、放熱効果をより高くすることができる。
また、リード９が発光素子基板２に密接しているので、発光素子基板２から発光素子１までの距離を小さくできるので、装置をよりコンパクトにすることができる。
【００１９】
実施の形態３．
図７はこの発明の実施の形態３に係わるを示す発光装置を示す部分破断斜視図、図８（ａ）は要部拡大側面図、図８（ｂ）は図８（ａ）の断面図である。図において実施の形態１の図１と同じ部分には同一の符号を付し、説明を省略する。６はリード３を銅板等の金属板７で挟み、その間をはんだ等の熱伝導性材８を充填した放熱板である。
【００２０】
この構成において、リード３から放熱される熱は、熱伝導性材８、金属板７を介して自然対流による放熱が行われる。
リード３を金属板７で挟んだときはリード３と金属板７は線接触の熱伝導となるが、本実施の形態は熱伝導材性８を充填してあるので、リード３の全周からの熱伝導となる。
【００２１】
以上のように、リード３は略Ｌ字形状となっているので長さを長くとることができるので、放熱板６の放熱面積を大きくして広い面積から放熱でき、また、リード３の全周から熱伝導されるので、放熱効果をより高くすることができる。
【００２２】
【発明の効果】
以上のように、この発明によれば、上面に放熱穴が設けられ、一側壁に開口部が設けられた直方体状のケースと、前記ケース内に収納され、前記一側壁の開口部に配置された直方体状の導光板と、前記ケースの前記一側壁と対向する側壁と前記導光板の間であって、前記導光板の上面よりも本体の上端が高くなるように該側壁に沿って配された発光素子基板と、前記導光板の上方に前記導光板の上部から内部に光を照射するように並んで設けられた複数の発光素子と、前記放熱穴と前記発光素子の間であって、一端が前記複数の発光素子と接続され、他端が前記発光素子よりも高い位置で前記発光素子基板と接続される複数のリードとを有するので、発光素子の発熱を簡単な構成により放熱させ、放熱効果を高くすることができ、また、装置をコンパクトにすることができる。
また、上面に放熱穴が設けられ、一側壁に開口部が設けられた直方体状のケースと、前記ケース内に収納され、前記一側壁の開口部に配置された直方体状の導光板と、前記ケースの前記一側壁と対向する側壁と前記導光板の間であって、前記導光板の上面よりも本体の上端が高くなるように該側壁に沿って配された発光素子基板と、前記導光板の上方に前記導光板の上部から内部に光を照射するように並んで設けられた複数の発光素子と、
一端が前記発光素子の正極に接続され、他端が前記発光素子基板に接続される第１のリードと、前記放熱穴と前記発光素子の間であって、一端が前記発光素子の負極に接続され、他端が前記発光素子よりも高い位置で前記発光素子基板に接続され、前記第１のリードよりも長い第２のリードとを有するので、発熱の多い方の負極の放熱面積が大きく、放熱効果がよい。
【００２３】
また、リードの曲部を発光素子基板近傍に配設したので、発光素子基板面から発光素子までの高さを低くして装置をコンパクトにすることができる。
【００２４】
また、リードに放熱板を設けたので、リードからの放熱をより大きくすることができる。
【００２５】
また、放熱板はリードを挟むように対向して配設された一対の金属板と、この金属板の間に充填された熱伝導性材と、を備えたので、リードからの放熱をより大きくすることができる。
【図面の簡単な説明】
【図１】 この発明の実施の形態１を示す発光装置の部分破断斜視図である。
【図２】 図１の断面図である。
【図３】 この発明の実施の形態１を示す発光装置の断面図である。
【図４】 この発明の実施の形態１を示す発光装置の断面図である。
【図５】 この発明の実施の形態２を示す発光装置の部分破断斜視図である。
【図６】 図５の断面図である。
【図７】 この発明の実施の形態３を示す発光装置の部分破断斜視図である。
【図８】 図８の要部拡大図である。
【図９】 従来の発光装置の部分破断斜視図である。
【図１０】 図９の断面図である。
【符号の説明】
１ 発光素子、２ 発光素子基板、３、９ リード、９ａ 第１のリード、９ｂ 第２のリード、４ 導光板、５ ケース、６ 放熱板、７金属板、８ 熱導電性材。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light emitting device using a light emitting element, and more particularly to a heat dissipation structure for a light emitting element.
[0002]
[Prior art]
9 is a partially broken perspective view of a conventional light emitting device, and FIG. 10 is a cross-sectional view of FIG. In the figure, 1 is a light emitting element, 3 is a lead of the light emitting element, 4 is a light guide plate, and 5 is a case. Reference numeral 10 denotes a light emitting element substrate which is provided vertically above the light emitting element 1 and to which the light emitting element 1 is connected via a lead 3. Although not shown, a heat radiation sheet or the like is provided on the opposite side of the surface to which the lead 3 is connected. The heat radiating member may be provided integrally. Reference numeral 11 denotes a circuit board such as a lighting circuit.
[0003]
In this configuration, when the light emitting element 1 is turned on, direct light from the light emitting element 1 is emitted through the light guide plate 4. At this time, the light emitting element 1 generates heat, but is radiated to the light emitting element substrate 10 through the leads 3.
[0004]
[Problems to be solved by the invention]
In the conventional light-emitting device as described above, the heat generated by the light-emitting element 1 is radiated from the light-emitting element substrate 10 via the lead 3, but the heat radiates from the lead 3 due to natural convection and the heat tends to move vertically upward. However, since the heat is blocked by the light emitting element substrate 10 and the heat stays between the light emitting element 1 and the light emitting element substrate 10, heat radiation by natural convection can hardly be performed, and there is a problem that heat radiation is poor.
FIG. 9 shows the case where the light emission direction is downward. However, when the light emission direction is upward, even if the heat due to natural convection from the lead 3 is directed vertically upward, the light emitting element 1 blocks the heat. There was a problem that heat dissipation by convection was bad.
[0005]
Further, if the light emitting element substrate 10 is enlarged in order to enhance the heat dissipation effect in the light emitting element substrate 10, there is a problem that the thickness T and the width W of the light emitting device case 5 are increased. In order to make it compact, it is necessary to reduce the width of the light emitting element substrate 10 and disperse the lighting circuit and the like as another circuit substrate 11, and there is a problem that the configuration becomes complicated.
[0006]
The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a compact light-emitting device that has a high heat-dissipating effect by dissipating heat generated by a light-emitting element with a simple configuration.
[0007]
[Means for Solving the Problems]
The light-emitting device according to the present invention has a rectangular parallelepiped case provided with a heat dissipation hole on the upper surface and an opening on one side wall, and a rectangular parallelepiped shape housed in the case and disposed on the opening on the one side wall. A light emitting element substrate disposed between the light guide plate, the side wall of the case opposite to the one side wall, and the light guide plate, the upper end of the main body being higher than the upper surface of the light guide plate. A plurality of light emitting elements provided side by side so as to irradiate light from above the light guide plate above the light guide plate, and between the heat dissipation hole and the light emitting element, one end of the plurality of light emitting elements And a plurality of leads connected to the light emitting element substrate at a position higher than the light emitting element .
In addition, a rectangular parallelepiped case provided with a heat dissipation hole on the upper surface and an opening on one side wall, a rectangular parallelepiped light guide plate housed in the case and disposed on the opening on the one side wall, A light emitting element substrate disposed between the side wall of the case facing the one side wall and the light guide plate, and arranged along the side wall so that an upper end of the main body is higher than an upper surface of the light guide plate; A plurality of light emitting elements provided side by side so as to irradiate light from the top to the inside of the light guide plate,
One end is connected to the positive electrode of the light emitting element, the other end is connected to the light emitting element substrate, and between the heat dissipation hole and the light emitting element, and one end is connected to the negative electrode of the light emitting element. The other end is connected to the light emitting element substrate at a position higher than the light emitting element, and has a second lead longer than the first lead.
[0008]
Further, the bent portion of the lead is disposed in the vicinity of the light emitting element substrate.
[0009]
Further, a heat radiating plate is provided on the lead.
[0010]
The heat radiating plate includes a pair of metal plates disposed so as to face each other with the leads interposed therebetween, and a heat conductive material filled between the metal plates.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a light emitting device according to an embodiment of the present invention will be described with reference to the drawings.
Embodiment 1 FIG.
1 is a partially broken perspective view showing a light emitting device according to Embodiment 1 of the present invention, and FIG. 2 is a sectional view of FIG. In the figure, reference numeral 1 denotes a light emitting element, and 2 denotes a light emitting element substrate disposed substantially parallel to the light emitting direction of the light emitting element 1, and is disposed so as to avoid a vertically upper side of a lead 3 to be described later. Reference numeral 3 denotes a lead having a substantially L-shaped curved portion connected between the light-emitting element substrate 2 and the light-emitting element 1. The lead is disposed as close as possible to the light-emitting element substrate 2 and emits light from the curved portion. The length to the element 1 is increased.
4 is a light guide plate, 5 is a case, and 5a is a heat dissipation hole. In addition, although the light emitting element substrate 2 is not illustrated, a heat radiating sheet and a heat radiating member may be integrally provided on the opposite side of the surface to which the lead 3 is connected.
[0013]
In this configuration, when the light emitting element 1 is turned on, the light of the light emitting element 1 is emitted downward through the light guide plate 4. At this time, the light emitting element 1 generates heat, but part of this heat is radiated to the substrate 2 through the leads 3, and part of the heat is radiated from the leads 3. There is no light emitting element substrate 2 that obstructs natural convection due to heat radiation from the lead 3 vertically above the lead 3, and heat radiation by natural convection is performed.
In addition, since the light emitting element substrate 2 has the L-shaped lead 3 of the light emitting element 1, the light emitting element substrate 2 can take a long length and has a large heat radiation area, so that the heat radiation effect is good.
[0014]
1 and 2 show the case where the light emitting direction of the light emitting element 1 is downward, it may be upward as shown in FIG. 3, or may be horizontal as shown in FIG. In the horizontal direction, even when the light emitting element 1 is below the light emitting element substrate 2, the light emitting element substrate 2 may be disposed avoiding the vertical upper side of the lead 3 connected to the end of the light emitting element substrate 2.
1 and 2, the curved portion of the lead 3 is substantially L-shaped, but the lead 3 may be curved.
[0015]
As described above, the heat generation of the light emitting element 1 can be dissipated with a simple configuration, and the heat dissipating effect can be enhanced.
In addition, since the lead 3 has a curved portion, the length can be increased to increase the heat dissipation effect.
Further, the apparatus can be made compact, the substrate can be enlarged, and the circuit can be formed on the same substrate.
[0016]
Embodiment 2. FIG.
FIG. 5 is a partially broken perspective view showing a light emitting device according to Embodiment 2 of the present invention, and FIG. 6 is a cross-sectional view of FIG. In the figure, the same portions as those in FIG. 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted. 9 is a lead, connected to the negative electrode of the light emitting element 1, connected to the second lead 9 b bent in a U-shape and in close contact with the light emitting element substrate 2 and the positive electrode of the light emitting element 1, The first lead 9 a is disposed in close contact with the light emitting element substrate 2.
[0017]
In this configuration, the heat radiated from the light emitting element 1 is radiated to the light emitting element substrate 2 through the leads 9 and radiated by natural convection.
Further, since the negative electrode of the light emitting element 1 that generates more heat is connected to the second lead 9b having a curved portion, the length of the second lead 9b can be increased, the heat dissipation area is large, and the heat dissipation efficiency is increased. Is good.
[0018]
As described above, the heat generation effect of the light emitting element 1 can be further enhanced with a simple configuration.
Further, since the lead 9 is in close contact with the light emitting element substrate 2, the distance from the light emitting element substrate 2 to the light emitting element 1 can be reduced, so that the apparatus can be made more compact.
[0019]
Embodiment 3 FIG.
7 is a partially broken perspective view showing a light emitting device according to Embodiment 3 of the present invention, FIG. 8 (a) is an enlarged side view of the main part, and FIG. 8 (b) is a sectional view of FIG. 8 (a). is there. In the figure, the same parts as those in FIG. 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Reference numeral 6 denotes a heat radiating plate in which the lead 3 is sandwiched between metal plates 7 such as copper plates and a heat conductive material 8 such as solder is filled therebetween.
[0020]
In this configuration, the heat radiated from the lead 3 is radiated by natural convection through the heat conductive material 8 and the metal plate 7.
When the lead 3 is sandwiched between the metal plates 7, the lead 3 and the metal plate 7 are in thermal contact with each other, but in this embodiment, the heat conductive material 8 is filled. It becomes the heat conduction.
[0021]
As described above, since the lead 3 has a substantially L shape, the length can be increased. Therefore, the heat radiation area of the heat sink 6 can be increased to dissipate heat from a wide area. Therefore, the heat dissipation effect can be further increased.
[0022]
【The invention's effect】
As described above, according to the present invention, a rectangular parallelepiped case having a heat radiating hole provided on the upper surface and an opening provided on one side wall, and housed in the case and disposed in the opening on the one side wall. A rectangular parallelepiped light guide plate, a side wall facing the one side wall of the case, and the light guide plate, and arranged along the side wall so that the upper end of the main body is higher than the upper surface of the light guide plate A light-emitting element substrate; a plurality of light-emitting elements provided side by side so as to irradiate light from above the light guide plate above the light guide plate; and between the heat dissipation hole and the light-emitting element, Is connected to the plurality of light emitting elements, and the other end has a plurality of leads connected to the light emitting element substrate at a position higher than the light emitting elements. The effect can be increased and the equipment It can be made compact.
In addition, a rectangular parallelepiped case provided with a heat dissipation hole on the upper surface and an opening on one side wall, a rectangular parallelepiped light guide plate housed in the case and disposed on the opening on the one side wall, A light emitting element substrate disposed between the side wall of the case facing the one side wall and the light guide plate, and arranged along the side wall so that an upper end of the main body is higher than an upper surface of the light guide plate; A plurality of light emitting elements provided side by side so as to irradiate light into the inside from above the light guide plate;
One end is connected to the positive electrode of the light emitting element, the other end is connected to the light emitting element substrate, and between the heat dissipation hole and the light emitting element, and one end is connected to the negative electrode of the light emitting element. And the other end is connected to the light emitting element substrate at a position higher than the light emitting element, and has a second lead that is longer than the first lead. Good heat dissipation effect.
[0023]
In addition, since the bent portion of the lead is disposed in the vicinity of the light emitting element substrate, the height from the light emitting element substrate surface to the light emitting element can be reduced to make the apparatus compact.
[0024]
Further, since the heat radiating plate is provided on the lead, the heat radiation from the lead can be further increased.
[0025]
Moreover, since the heat radiating plate includes a pair of metal plates disposed so as to sandwich the lead and a heat conductive material filled between the metal plates, heat radiation from the lead is further increased. Can do.
[Brief description of the drawings]
FIG. 1 is a partially broken perspective view of a light-emitting device showing Embodiment 1 of the present invention.
FIG. 2 is a cross-sectional view of FIG.
FIG. 3 is a cross-sectional view of the light-emitting device showing Embodiment 1 of the present invention.
FIG. 4 is a cross-sectional view of the light-emitting device showing Embodiment 1 of the present invention.
FIG. 5 is a partially broken perspective view of a light-emitting device showing Embodiment 2 of the present invention.
6 is a cross-sectional view of FIG.
FIG. 7 is a partially broken perspective view of a light-emitting device showing Embodiment 3 of the present invention.
FIG. 8 is an enlarged view of a main part of FIG.
FIG. 9 is a partially broken perspective view of a conventional light emitting device.
FIG. 10 is a cross-sectional view of FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Light emitting element, 2 Light emitting element board | substrate, 3, 9 lead, 9a 1st lead, 9b 2nd lead, 4 Light guide plate, 5 Case, 6 Heat sink, 7 Metal plate, 8 Thermal conductive material.

Claims (5)

上面に放熱穴が設けられ、一側壁に開口部が設けられた直方体状のケースと、
前記ケース内に収納され、前記一側壁の開口部に配置された直方体状の導光板と、
前記ケースの前記一側壁と対向する側壁と前記導光板の間であって、前記導光板の上面よりも本体の上端が高くなるように該側壁に沿って配された発光素子基板と、
前記導光板の上方に前記導光板の上部から内部に光を照射するように並んで設けられた複数の発光素子と、
前記放熱穴と前記発光素子の間であって、一端が前記複数の発光素子と接続され、他端が前記発光素子よりも高い位置で前記発光素子基板と接続される複数のリードとを有する発光装置。 A rectangular parallelepiped case provided with a heat dissipation hole on the upper surface and an opening on one side wall;
A rectangular parallelepiped light guide plate housed in the case and disposed in the opening of the one side wall;
A light emitting element substrate disposed between the side wall of the case facing the one side wall and the light guide plate, and disposed along the side wall so that an upper end of the main body is higher than an upper surface of the light guide plate;
A plurality of light emitting elements provided side by side so as to irradiate light from above the light guide plate above the light guide plate;
Light emission having a plurality of leads between the heat dissipation hole and the light emitting element, one end connected to the plurality of light emitting elements and the other end connected to the light emitting element substrate at a position higher than the light emitting elements. apparatus. 上面に放熱穴が設けられ、一側壁に開口部が設けられた直方体状のケースと、A rectangular parallelepiped case with a heat dissipation hole on the top surface and an opening on one side wall;
前記ケース内に収納され、前記一側壁の開口部に配置された直方体状の導光板と、  A rectangular parallelepiped light guide plate housed in the case and disposed in the opening of the one side wall;
前記ケースの前記一側壁と対向する側壁と前記導光板の間であって、前記導光板の上面よりも本体の上端が高くなるように該側壁に沿って配された発光素子基板と、  A light emitting element substrate disposed between the side wall of the case facing the one side wall and the light guide plate, and arranged along the side wall so that an upper end of the main body is higher than an upper surface of the light guide plate;
前記導光板の上方に前記導光板の上部から内部に光を照射するように並んで設けられた複数の発光素子と、  A plurality of light emitting elements provided side by side so as to irradiate light from the upper part of the light guide plate above the light guide plate;
一端が前記発光素子の正極に接続され、他端が前記発光素子基板に接続される第１のリードと、  A first lead having one end connected to the positive electrode of the light emitting element and the other end connected to the light emitting element substrate;
前記放熱穴と前記発光素子の間であって、一端が前記発光素子の負極に接続され、他端が前記発光素子よりも高い位置で前記発光素子基板に接続され、前記第１のリードよりも長い第２のリードとを有する発光装置。  Between the heat dissipation hole and the light-emitting element, one end is connected to the negative electrode of the light-emitting element, the other end is connected to the light-emitting element substrate at a position higher than the light-emitting element, and more than the first lead A light emitting device having a long second lead. リードに曲部を有し、前記曲部は発光素子基板近傍に配設されることを特徴とする請求項１または請求項２に記載の発光装置。 Has a curved portion in the lead, the bent portion is emitting device according to claim 1 or claim 2, characterized that you are disposed near the light emitting element substrate. リードに放熱板を設けたことを特徴とする請求項１〜請求項３のいずれかに記載の発光装置。The light-emitting device according to any one of claims 1 to 3 , wherein a heat radiating plate is provided on the lead. 放熱板はリードを挟むように対向して配設された一対の金属板と、この金属板の間に充填された熱伝導性材と、を備えたことを特徴とする請求項４記載の発光装置。The light-emitting device according to claim 4, wherein the heat radiating plate includes a pair of metal plates disposed so as to face each other with a lead interposed therebetween, and a heat conductive material filled between the metal plates.
JP33757299A 1999-11-29 1999-11-29 Light emitting device Expired - Lifetime JP4298096B2 (en)

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