JP2003204617A - Circuit board, method of manufacturing the same, and electric junction box - Google Patents
Circuit board, method of manufacturing the same, and electric junction boxInfo
- Publication number
- JP2003204617A JP2003204617A JP2002027511A JP2002027511A JP2003204617A JP 2003204617 A JP2003204617 A JP 2003204617A JP 2002027511 A JP2002027511 A JP 2002027511A JP 2002027511 A JP2002027511 A JP 2002027511A JP 2003204617 A JP2003204617 A JP 2003204617A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductor pattern
- terminal
- insulating base
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connection Or Junction Boxes (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動車の電気接続
箱などに用いられる回路基板、該回路基板の製造方法、
および該回路基板を用いた電気接続箱に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board used for an electric connection box of an automobile, a method for manufacturing the circuit board,
And an electric junction box using the circuit board.
【０００２】[0002]
【従来の技術】従来、制御回路部と負荷回路部を備えた
電気接続箱は、例えば図６に示すように、マザーボード
１に、マイコン４を有する制御回路部と、受動電子部品
５、コンデンサ６、およびリレー３などからなる負荷回
路部とを設け、このマザーボード１を内部に収容して構
成されている。２は外部ハーネスなどと接続するコネク
タであり、コネクタ２は支持部材７でマザーボード１に
支持され、接続端子２ａでマザーボード１に電気的に接
続している。上記マザーボード１は、銅箔を加工して形
成された導体パターンを回路導体として絶縁基材上に積
層した回路基板からなる。また、受動電子部品５は、主
にＳＷ入力回路を構成する抵抗などからなる。さらに、
リレー３はモーターやアクチュエータなどの負荷を駆動
する。2. Description of the Related Art Conventionally, an electric junction box having a control circuit section and a load circuit section has, for example, as shown in FIG. 6, a control circuit section having a microcomputer 4, a passive electronic component 5 and a capacitor 6 on a mother board 1. , And a load circuit section including a relay 3 and the like, and the motherboard 1 is housed inside. Reference numeral 2 is a connector for connecting to an external harness or the like, and the connector 2 is supported by the mother board 1 by the supporting member 7 and electrically connected to the mother board 1 by the connection terminals 2a. The mother board 1 is composed of a circuit board in which a conductor pattern formed by processing a copper foil is laminated on an insulating base material as a circuit conductor. In addition, the passive electronic component 5 is mainly composed of a resistor or the like that constitutes the SW input circuit. further,
The relay 3 drives a load such as a motor or an actuator.
【０００３】上記マザーボード１において、負荷回路部
に流れる電流は、制御回路部に流れる電流に比較して数
１０〜数１００倍になっている。負荷回路部の導体パタ
ーンと制御回路部の導体パターンは同じ厚さになってい
るために、負荷回路部の導体パターンは、制御回路部の
導体パターンに比して線幅が広く、粗になっている。ま
た、負荷回路部は、駆動する負荷部品（リレーなど）か
らの発熱を導体パターンで効率よく放散させるために
も、導体パターンを広くしている。In the mother board 1, the current flowing through the load circuit section is several tens to several hundred times the current flowing through the control circuit section. Since the conductor pattern of the load circuit section and the conductor pattern of the control circuit section have the same thickness, the conductor pattern of the load circuit section has a wider and coarser line width than the conductor pattern of the control circuit section. ing. In addition, the load circuit portion has a wide conductor pattern in order to efficiently dissipate heat generated from a load component (such as a relay) to be driven by the conductor pattern.
【０００４】また、電気接続箱として、制御回路部ある
いは負荷回路部をマザーボードとは別の回路基板上に構
成し、前記別回路基板をマザーボードに接続端子あるい
はコネクタなどで接続し、搭載する構造のものも提案さ
れている。In addition, as an electric connection box, a control circuit section or a load circuit section is formed on a circuit board different from the mother board, and the different circuit board is connected to the mother board by connecting terminals or connectors, etc., and mounted. Things are also proposed.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述の
電気接続箱には以下の問題があった。即ち、
１）電気接続箱の小型化が要請されているが、マザーボ
ード上に制御回路部と負荷回路部を設ける構成では、負
荷回路部の導体パターンを広くして粗にする必要がある
ために、電気接続箱の小型化には限界があった。
２）制御回路部あるいは負荷回路部をマザーボードとは
別の回路基板で構成し、前記別回路基板をマザーボード
に搭載する場合には、前記別回路基板をマザーボードに
接続端子あるいはコネクタなどで電気的に接続する必要
があり、部品数が増加し、コストアップの要因になる。However, the above-mentioned electric junction box has the following problems. That is, 1) downsizing of the electrical junction box is required, but in the configuration in which the control circuit section and the load circuit section are provided on the mother board, it is necessary to widen and roughen the conductor pattern of the load circuit section. However, there was a limit to miniaturization of the electric junction box. 2) When the control circuit section or the load circuit section is configured on a circuit board different from the motherboard and the separate circuit board is mounted on the motherboard, the separate circuit board is electrically connected to the motherboard by connecting terminals or connectors. It is necessary to connect them, which increases the number of parts and causes a cost increase.
【０００６】[0006]
【課題を解決するための手段】本発明は上記問題点を解
決すべくなされたもので、請求項１記載の発明は、絶縁
基材に銅箔からなる導体パターンが積層された回路基板
において、前記導体パターンは所要部に電気的接続のた
めの端子部を有し、該端子部は前記絶縁基材の外側に延
設されていることを特徴とするものである。ここで、銅
箔は、厚さが比較的厚い銅板を含むものとする。The present invention has been made to solve the above-mentioned problems, and the invention according to claim 1 is a circuit board in which a conductor pattern made of a copper foil is laminated on an insulating base material. The conductor pattern has a terminal portion for electrical connection in a required portion, and the terminal portion is extended to the outside of the insulating base material. Here, the copper foil includes a copper plate having a relatively large thickness.
【０００７】また、請求項２記載の発明は、前記導体パ
ターンの厚さは、該導体パターンに電気的に接続される
電気部品との接続に要する端子の厚さの略２分の１であ
り、前記端子部は前記導体パターンが部分的に折重ねら
れて形成されていることを特徴とする請求項１記載の回
路基板である。According to a second aspect of the present invention, the thickness of the conductor pattern is approximately one half of the thickness of the terminal required for connection with an electrical component electrically connected to the conductor pattern. The circuit board according to claim 1, wherein the terminal portion is formed by partially folding the conductor pattern.
【０００８】また、請求項３記載の発明は、絶縁基材と
銅箔を積層してなる積層板の前記銅箔を加工して、前記
銅箔の所要部に端子形状部を有する導体パターンを作製
し、次いで前記絶縁基材の前記端子形状部下の部分を除
去する工程を有することを特徴とする、請求項１または
２記載の回路基板の製造方法である。Further, the invention according to claim 3 is to process the copper foil of a laminated plate obtained by laminating an insulating base material and a copper foil to form a conductor pattern having a terminal-shaped portion at a required portion of the copper foil. 3. The method for manufacturing a circuit board according to claim 1, further comprising a step of manufacturing the insulating base material and then removing a portion of the insulating base material under the terminal-shaped portion.
【０００９】また、請求項４記載の発明は、請求項１ま
たは２記載の回路基板を有する電気接続箱であって、前
記回路基板の端子部は前記回路基板の絶縁基材面に対し
て略直角に曲げられて、他の回路基板に電気的に接続し
ていることを特徴とするものである。According to a fourth aspect of the present invention, there is provided an electrical connection box having the circuit board according to the first or second aspect, wherein the terminal portion of the circuit board is substantially in contact with an insulating base surface of the circuit board. It is characterized in that it is bent at a right angle and is electrically connected to another circuit board.
【００１０】また、請求項５記載の発明は、請求項１ま
たは２記載の回路基板を有する電気接続箱であって、前
記回路基板の端子部は、前記回路基板のコの字状に曲げ
られた、絶縁基材の対向する側端部に二列に並列配置さ
れ、外部接続端子となっていることを特徴とするもので
ある。According to a fifth aspect of the present invention, there is provided an electric junction box having the circuit board according to the first or second aspect, wherein the terminal portion of the circuit board is bent into a U-shape of the circuit board. Further, it is characterized in that it is arranged in parallel in two rows at opposite side ends of the insulating base material to serve as external connection terminals.
【００１１】さらに、請求項６記載の発明は、請求項１
または２記載の回路基板であって、絶縁基材はエポキシ
系からなることを特徴とするものである。Further, the invention according to claim 6 is the same as claim 1.
Alternatively, the circuit board according to the item 2, wherein the insulating base material is made of epoxy.
【００１２】請求項１記載の発明によれば、回路基板の
端子部は絶縁基材の外側に延設されているため、その厚
さを接続端子やコネクタ端子などの厚さと同等にする
と、回路基板をその端子部で他の回路基板などの電気部
品に電気的に直接接続することができるので、接続端子
あるいはコネクタなどの部品数を減らし、コストダウン
を図ることができる。According to the first aspect of the present invention, since the terminal portion of the circuit board is extended to the outside of the insulating base material, if the thickness thereof is made equal to the thickness of the connection terminal or the connector terminal, the circuit is formed. Since the board can be electrically connected directly to an electric component such as another circuit board at its terminal portion, the number of components such as connection terminals or connectors can be reduced, and the cost can be reduced.
【００１３】また、請求項１記載の発明によれば、回路
基板がその端子部で容易に電気的に接続可能であるた
め、電流容量に応じて回路基板を作り分けして、回路基
板同士を接続することができる。そうすると、比較的大
きな電流を流す回路基板の導体パターンの厚さを厚くす
ることにより、導体パターンを密にして、大電流容量の
回路基板を小型化することができるので、回路基板を有
する電気接続箱をも小型化することができる。According to the first aspect of the invention, since the circuit boards can be easily electrically connected at their terminal portions, the circuit boards are made separately according to the current capacity, and the circuit boards are connected to each other. Can be connected. Then, by increasing the thickness of the conductor pattern of the circuit board that allows a relatively large current to flow, the conductor pattern can be made dense and the circuit board having a large current capacity can be downsized. The box can also be made smaller.
【００１４】また、請求項２記載の発明のように、請求
項１記載の発明において、導体パターンの厚さを、電気
的に接続される電気部品との接続に要する端子の厚さの
略２分の１とし、前記導体パターンを部分的に折重ねて
端子部を形成すると、導体パターンの厚さを接続端子や
コネクタ端子の厚さよりも薄くしても、導体パターンに
形成された端子部をそのまま接続部品と同様に扱うこと
ができる。Further, as in the invention described in claim 2, in the invention described in claim 1, the thickness of the conductor pattern is approximately 2 times the thickness of the terminal required for connection with an electrical component to be electrically connected. If the conductor pattern is partially folded to form the terminal portion, the terminal portion formed on the conductor pattern can be formed even if the thickness of the conductor pattern is thinner than the thickness of the connection terminal or the connector terminal. It can be handled as it is as a connection component.
【００１５】[0015]
【発明の実施の形態】以下、図面に基づいて本発明の実
施の形態を詳細に説明する。図１（ａ）〜（ｃ）は、本
発明にかかる回路基板の一実施形態の製作手順を説明す
る図である。本実施形態は以下のようにして製作され
る。即ち、
１）図１（ａ）に示すように、銅箔１２と絶縁基材１３
とを積層してなる積層板１１を用意する。この積層板１
１の銅箔１２をエッチングないし機械加工して、所要部
分に端子形状部１４ａを有する導体パターン１４を形成
する（図１（ｂ））。
２）次いで、端子形状部１４ａの下側の絶縁基材１３を
部分的に削り、端子形状部１４ａを絶縁基材１３の外側
に延設した状態にして、平板な端子部１４ｂと、必要に
応じて絶縁基材１３面に対して直角に曲げた端子部１４
ｃを形成し、回路基板１５とする（図１（ｃ））。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. 1A to 1C are views for explaining a manufacturing procedure of an embodiment of a circuit board according to the present invention. This embodiment is manufactured as follows. 1) As shown in FIG. 1A, the copper foil 12 and the insulating base material 13
A laminated plate 11 formed by laminating and is prepared. This laminated board 1
The copper foil 12 of No. 1 is etched or machined to form a conductor pattern 14 having a terminal-shaped portion 14a at a required portion (FIG. 1 (b)). 2) Next, the insulating base material 13 on the lower side of the terminal-shaped portion 14a is partially shaved so that the terminal-shaped portion 14a is extended to the outside of the insulating base material 13, and a flat terminal portion 14b and, if necessary, Accordingly, the terminal portion 14 bent at a right angle to the surface of the insulating base material 13
c is formed to be the circuit board 15 (FIG. 1C).
【００１６】本実施形態の特徴は、導体パターン１４の
端子部１４ｂ、１４ｃが絶縁基材１３の外側に延設され
ていることである。したがって、導体パターン１４の厚
さを、接続する相手側の部品に挿入される端子の厚さと
等しくすると、端子部１４ｂ、１４ｃを直接相手側のメ
スコネクタなどの部品に挿入して、回路基板１５と他の
回路基板とを容易に電気的に接続することができる。A feature of this embodiment is that the terminal portions 14b and 14c of the conductor pattern 14 are extended to the outside of the insulating base material 13. Therefore, if the thickness of the conductor pattern 14 is made equal to the thickness of the terminal inserted into the mating component to be connected, the terminal portions 14b and 14c are directly inserted into the mating female connector or other component, and the circuit board 15 is inserted. And other circuit boards can be easily electrically connected.
【００１７】図２（ａ）〜（ｆ）は、本発明にかかる回
路基板の他の実施形態の製作手順を説明する図である。
本実施形態は以下のようにして製作される。即ち、
１）図２（ａ）に示すように、積層板２１は、厚さ１．
２ｍｍのエポキシ系の絶縁基材１３の両面に厚さ０．３
２ｍｍの圧延銅箔１２が積層されたものである。ここ
で、本実施形態の回路基板に接続されるメスコネクタ
は、オス端子の厚さ０．６４ｍｍを必要とするため、銅
箔１２の厚さはそのおよそ２分の１に設定されている。
２）先ず、図２（ｂ）に示すように、上記積層板２１の
銅箔１２にエッチング加工を施して、導体パターン２４
を形成する。また、積層板２１の両側端部に位置する導
体パターン２４の所要部分には、端子形状部２４ａを設
ける。
３）次いで、図２（ｃ）に示すように、両面の導体パタ
ーン２４を貫通する穴２５を所要箇所に開ける。
４）次いで、図２（ｄ）に示すように、銅ピン２６を穴
２５に挿入あるいは圧入して、半田２７を両面に施し、
両面の導体パターン２４を電気的に接続する。
５）その後、図２（ｅ）に示すように、絶縁基材１３の
うち、導体パターン２４の端子形状部２４ａ下側に位置
する部分を取り除く。
６）次いで、図２（ｆ）に示すように、導体パターン２
４の端子形状部２４ａを折重ねて端子部２４ｂを形成す
る。また、絶縁基材１３を部分的に除去した絶縁基材除
去部１３ａで、端子部２４ｂが内側に位置するように、
導体パターン２４をコの字状に曲げる。最後に、端子部
２４ｂには必要に応じてすずメッキなどの防錆処理を施
して回路基板２８とする。図３は、このようにして作製
された回路基板２８の斜視図であって、端子部２４ｂ
は、コの字状に曲げられた回路基板２８の対向する側端
部で二列に並列配置されている。FIGS. 2A to 2F are views for explaining a manufacturing procedure of another embodiment of the circuit board according to the present invention.
This embodiment is manufactured as follows. 1) As shown in FIG. 2A, the laminated plate 21 has a thickness of 1.
0.3 mm thick on both sides of 2 mm epoxy insulating base material 13.
The rolled copper foil 12 of 2 mm is laminated. Here, the female connector connected to the circuit board of the present embodiment requires the thickness of the male terminal to be 0.64 mm, and therefore the thickness of the copper foil 12 is set to about ½ thereof. 2) First, as shown in FIG. 2B, the copper foil 12 of the laminate 21 is subjected to an etching process to form a conductor pattern 24.
To form. In addition, terminal-shaped portions 24a are provided at required portions of the conductor pattern 24 located at both ends of the laminated plate 21. 3) Next, as shown in FIG. 2 (c), holes 25 penetrating the conductor patterns 24 on both sides are formed at required locations. 4) Next, as shown in FIG. 2 (d), copper pins 26 are inserted or press-fitted into the holes 25, solder 27 is applied to both sides,
The conductor patterns 24 on both surfaces are electrically connected. 5) Thereafter, as shown in FIG. 2E, the portion of the insulating base material 13 located below the terminal-shaped portion 24a of the conductor pattern 24 is removed. 6) Next, as shown in FIG.
The four terminal-shaped portions 24a are folded and overlapped to form the terminal portion 24b. Further, in the insulating base material removing portion 13a in which the insulating base material 13 is partially removed, the terminal portion 24b is located inside,
The conductor pattern 24 is bent into a U shape. Finally, the terminal portion 24b is subjected to rust preventive treatment such as tin plating as required to form the circuit board 28. FIG. 3 is a perspective view of the circuit board 28 manufactured in this manner, which shows the terminal portion 24b.
Are arranged in parallel in two rows at opposite side ends of the circuit board 28 bent in a U shape.
【００１８】上記回路基板２８は、導体パターン２４の
厚さが（電流容量から）それほどの厚さを要せず、回路
基板２８に接続するコネクタなどの部品（図示されず）
に挿入される端子の厚さよりも薄くてもよい場合に、導
体パターン２４の厚さをコネクタなどに挿入される端子
の厚さの略２分の１に設定し、導体パターン２４を部分
的に折重ねて端子部２４ｃを形成しているため、端子部
２４ｂをそのままコネクタなどの部品に挿入して接続す
ることができる。In the circuit board 28, the conductor pattern 24 does not need to be so thick (from the current capacity), and components such as a connector (not shown) connected to the circuit board 28 are provided.
When the thickness of the conductor pattern 24 may be smaller than the thickness of the terminal to be inserted into the connector, the thickness of the conductor pattern 24 is set to about ½ of the thickness of the terminal to be inserted into the connector, and the conductor pattern 24 is partially Since the terminal portion 24c is formed by folding the terminal portion 24c, the terminal portion 24b can be directly inserted into a component such as a connector for connection.
【００１９】次に、図１に示した回路基板１５を用い
た、電気接続箱を構成する電子制御ユニットについて説
明する。上記電子制御ユニットは、図４に示すように、
マイコン３４を含む制御回路部と、主にＳＷ入力回路部
を構成する抵抗などの電子部品３５と、コンデンサ３６
を上面に設けたマザーボード３１と、負荷（モーター或
いはアクチュエータなど）を駆動するリレー３３や駆動
ＩＣ（図示せず）などを含む負荷回路部を下面に設けた
回路基板１５と、コネクタ３２とで構成されている。回
路基板１５はマザーボード３１に搭載されている。ま
た、コネクタ３２は外部ハーネス（図示されず）に接続
するためのもので、マザーボード３１に支持部材３７
（例えばボルト）で支持され、マザーボード３１と回路
基板１５に電気的に接続している。Next, an electronic control unit that constitutes the electrical junction box using the circuit board 15 shown in FIG. 1 will be described. The electronic control unit, as shown in FIG.
A control circuit unit including a microcomputer 34, electronic components 35 such as a resistor mainly constituting the SW input circuit unit, and a capacitor 36.
Is composed of a motherboard 31 provided on the upper surface, a circuit board 15 provided on the lower surface with a load circuit section including a relay 33 for driving a load (motor or actuator, etc.) and a drive IC (not shown), and a connector 32. Has been done. The circuit board 15 is mounted on the motherboard 31. Further, the connector 32 is for connecting to an external harness (not shown), and is provided on the motherboard 31 with a support member 37.
It is supported by (for example, bolts) and is electrically connected to the mother board 31 and the circuit board 15.
【００２０】マザーボード３１は、ガラスエポキシ絶縁
基材の両面に厚さ３５μｍの銅箔からなる導体パターン
を設けたものである。なお、絶縁基材の材質はガラスエ
ポキシに限定される必要はない。The mother board 31 is formed by providing a conductor pattern made of a copper foil having a thickness of 35 μm on both surfaces of a glass epoxy insulating base material. The material of the insulating base material need not be limited to glass epoxy.
【００２１】回路基板１５は、ガラスコンポジット絶縁
基材の片面に厚さ６４０μｍの銅箔からなる導体パター
ン１４を設けたものである。導体パターン１４の厚さ
は、オスコネクタ３２に挿入、接続される端子の厚みと
同等であることが好ましく、６４０μｍに限定されるべ
きものではない。The circuit board 15 is a glass composite insulating substrate provided with a conductor pattern 14 made of copper foil having a thickness of 640 μm on one surface. The thickness of the conductor pattern 14 is preferably equal to the thickness of the terminals inserted and connected to the male connector 32, and should not be limited to 640 μm.
【００２２】なお、リレー３３を含む負荷回路部を回路
基板１６の下面側に設け、導体パターン１４を回路基板
１５の上側に設けることにより、導体パターン１４の放
熱性を良くするとともに、回路基板１５を搭載した電子
制御ユニットの高さを低くしている。ただし、負荷回路
部の配置は回路基板１６の下側に限定されることはな
い。The load circuit section including the relay 33 is provided on the lower surface side of the circuit board 16 and the conductor pattern 14 is provided on the upper side of the circuit board 15 so that the heat dissipation of the conductor pattern 14 is improved and the circuit board 15 is improved. The height of the electronic control unit equipped with is low. However, the arrangement of the load circuit unit is not limited to the lower side of the circuit board 16.
【００２３】上記電子制御ユニットが従来と異なる特徴
的なことは、以下の通りである。即ち、
１）回路基板１５の銅箔の厚さ（６４０μｍ）がマザー
ボード３１の銅箔の厚さ（３５μｍ）よりも厚くなって
いる。
２）回路基板１５は端子部１４ｃでマザーボード３１
に、端子部１４ｂでコネクタ３２にそれぞれ電気的に直
接接続している。The characteristic features of the electronic control unit different from the conventional ones are as follows. That is, 1) The thickness of the copper foil of the circuit board 15 (640 μm) is thicker than the thickness of the copper foil of the mother board 31 (35 μm). 2) The circuit board 15 has the terminal portion 14c and the mother board 31.
The terminals 14b are electrically connected to the connectors 32, respectively.
【００２４】上記電子制御ユニットは、大電流が流れる
負荷回路部が設けられた回路基板１５の銅箔の厚さがマ
ザーボード３１の銅箔の厚さよりも厚くなっているた
め、回路基板１５の導体パターン１４を小型化し、した
がって、電気接続箱を小型化することができる。また、
回路基板１５は導体パターン１４の端子部１４ｃでマザ
ーボード３１に、また端子部１４ｂでコネクタ３２に電
気的に接続しているため、接続部品を別に要せず、部品
数が少なくなり、コストを低減することができる。上記
電子制御ユニットを有する電気接続箱を実際に車両内に
取り付け、動作確認を行ったところ、異常は認められ
ず、また、負荷回路の異常な発熱も認められなかった。In the electronic control unit, since the thickness of the copper foil of the circuit board 15 provided with the load circuit section through which a large current flows is thicker than the thickness of the copper foil of the mother board 31, the conductor of the circuit board 15 is formed. The pattern 14 can be downsized, and thus the electrical junction box can be downsized. Also,
Since the circuit board 15 is electrically connected to the mother board 31 at the terminal portion 14c of the conductor pattern 14 and to the connector 32 at the terminal portion 14b, a separate connecting component is not required, the number of components is reduced, and the cost is reduced. can do. When the electric connection box having the electronic control unit was actually installed in the vehicle and the operation was checked, no abnormality was found and no abnormal heat generation of the load circuit was found.
【００２５】次に、図３に示した回路基板２８を用いた
電気接続箱について、図５を用いて説明する。この電気
接続箱は、回路基板２８がケース４０に嵌め込まれお
り、端子部２４ｂは二列に並列配置されて、外部のコネ
クタなどに接続する外部接続端子となっている。Next, an electric junction box using the circuit board 28 shown in FIG. 3 will be described with reference to FIG. In this electrical connection box, the circuit board 28 is fitted in the case 40, and the terminal portions 24b are arranged in parallel in two rows to serve as external connection terminals for connecting to an external connector or the like.
【００２６】上記電気接続箱では、回路基板２８の銅箔
の厚さがそれほどの厚さを要せず、回路基板２８に接続
するコネクタ（図示されず）に挿入される端子の厚さよ
りも薄くてもよい場合に、銅箔１２の厚さをコネクタに
挿入される端子の厚さの略２分の１に設定し、銅箔１２
を折重ねて端子部２４ｂを形成しているため、端子部２
４ｂをそのまま（本実施形態では、２列配列の多芯）コ
ネクタに挿入して接続することができる。In the above electric connection box, the thickness of the copper foil of the circuit board 28 does not need to be so thick and is thinner than the thickness of the terminals inserted into the connector (not shown) connected to the circuit board 28. If it is acceptable, set the thickness of the copper foil 12 to about one half of the thickness of the terminal to be inserted into the connector.
Since the terminal portion 24b is formed by folding the
4b can be inserted as it is (in the present embodiment, a multi-core in a two-row arrangement) and connected.
【００２７】なお、回路基板および該回路基板を有する
電気接続箱に係わる上記実施形態は本発明を具体化した
例であって、本願発明の技術的範囲を限定するものでは
ない。The above embodiments relating to the circuit board and the electric junction box having the circuit board are examples embodying the present invention and do not limit the technical scope of the present invention.
【００２８】[0028]
【発明の効果】以上説明したように、請求項１、２に記
載の回路基板を用いて電気接続箱を構成すると、接続部
品数を減らしてコストを低下させることができととも
に、小型化することができるという優れた効果がある。As described above, when the electric connection box is constructed by using the circuit board according to the first and second aspects, the number of connecting parts can be reduced, the cost can be reduced, and the size can be reduced. It has the excellent effect that
【図１】（ａ）〜（ｃ）は、本発明にかかる回路基板の
一実施形態の製作手順を説明する図である。1A to 1C are diagrams illustrating a manufacturing procedure of an embodiment of a circuit board according to the present invention.
【図２】（ａ）〜（ｆ）は、本発明にかかる回路基板の
他の実施形態の製作手順を説明する図である。2A to 2F are views for explaining a manufacturing procedure of another embodiment of the circuit board according to the present invention.
【図３】図２に示した回路基板の斜視図である。FIG. 3 is a perspective view of the circuit board shown in FIG.
【図４】図１に示した回路基板を用いた、電気接続箱を
構成する電子制御ユニットの説明図である。FIG. 4 is an explanatory diagram of an electronic control unit that forms an electrical junction box using the circuit board shown in FIG. 1.
【図５】図３に示した回路基板を用いた電気接続箱の斜
視図である。5 is a perspective view of an electrical junction box using the circuit board shown in FIG.
【図６】従来の電気接続箱に用いられた電子制御ユニッ
トの説明図である。FIG. 6 is an explanatory diagram of an electronic control unit used in a conventional electrical junction box.
１１、２１ 積層板 １２ 銅箔 １３ 絶縁基材 １３ａ 絶縁基材除去部 １４、２４ 導体パターン １４ａ、２４ａ 端子形状部 １４ｂ、１４ｃ、２４ｂ 端子部 １５、２８ 回路基板 ２５ 穴 ２６ 銅ピン ２７ 半田 ３１ マザーボード ３２ オスコネクタ ３３ リレー ３４ マイコン ３５ 電子部品 ３６ コンデンサ ３７ 支持部材 ４０ ケース 11,21 Laminated board 12 Copper foil 13 Insulating material 13a Insulating base material removing section 14, 24 conductor pattern 14a, 24a Terminal shape part 14b, 14c, 24b Terminal part 15, 28 circuit board 25 holes 26 copper pins 27 Solder 31 Motherboard 32 male connector 33 relays 34 Microcomputer 35 electronic components 36 capacitors 37 Support member 40 cases
フロントページの続き (72)発明者 原 昇司 東京都千代田区丸の内２丁目６番１号 古 河電気工業株式会社内 Ｆターム(参考） 5E338 BB51 BB55 CD32 EE22 EE31 5E344 AA08 AA10 AA26 BB06 CC11 CC17 CC23 EE12 EE21 5G361 BA01 BB01 BB03 Continued front page (72) Inventor Shoji Hara 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Kawa Electric Industry Co., Ltd. F term (reference) 5E338 BB51 BB55 CD32 EE22 EE31 5E344 AA08 AA10 AA26 BB06 CC11 CC17 CC23 EE12 EE21 5G361 BA01 BB01 BB03
Claims (6)
積層された回路基板において、前記導体パターンは所要
部に電気的接続のための端子部を有し、該端子部は前記
絶縁基材の外側に延設されていることを特徴とする回路
基板。1. A circuit board in which a conductor pattern made of copper foil is laminated on an insulating base material, wherein the conductor pattern has a terminal portion for electrical connection at a required portion, and the terminal portion is the insulating base material. A circuit board, which is extended to the outside of the.
ーンに電気的に接続される電気部品との接続に要する端
子の厚さの略２分の１であり、前記端子部は前記導体パ
ターンが部分的に折重ねられて形成されていることを特
徴とする請求項１記載の回路基板。2. The thickness of the conductor pattern is approximately one half of the thickness of a terminal required for connection with an electrical component electrically connected to the conductor pattern, and the terminal portion is the conductor pattern. The circuit board according to claim 1, wherein the circuit board is partially folded and formed.
前記銅箔を加工して、前記銅箔の所要部に端子形状部を
有する導体パターンを作製し、次いで前記絶縁基材の前
記端子形状部下の部分を除去する工程を有することを特
徴とする、請求項１または２記載の回路基板の製造方
法。3. A copper foil of a laminated plate obtained by laminating an insulating base material and a copper foil is processed to produce a conductor pattern having a terminal-shaped portion at a required portion of the copper foil, and then the insulating base material. 3. The method for manufacturing a circuit board according to claim 1, further comprising the step of removing a portion below the terminal-shaped portion.
る電気接続箱であって、前記回路基板の端子部は前記回
路基板の絶縁基材面に対して略直角に曲げられて、他の
回路基板に電気的に接続していることを特徴とする電気
接続箱。4. An electric junction box having the circuit board according to claim 1 or 2, wherein the terminal portion of the circuit board is bent at a substantially right angle to an insulating base surface of the circuit board, and An electrical junction box characterized by being electrically connected to a circuit board.
る電気接続箱であって、前記回路基板の端子部は、前記
回路基板のコの字状に曲げられた絶縁基材の対向する側
端部に二列に並列配置され、外部接続端子となっている
ことを特徴とする電気接続箱。5. An electrical junction box having the circuit board according to claim 1, wherein the terminal portion of the circuit board is a side of the circuit board facing the U-shaped insulating base material facing each other. An electric junction box, which is arranged in two rows in parallel at an end and serves as an external connection terminal.
徴とする、請求項１または２記載の回路基板。6. The circuit board according to claim 1, wherein the insulating base material is made of epoxy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002027511A JP4297318B2 (en) | 2001-10-23 | 2002-02-05 | Circuit board and electrical junction box |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001324525 | 2001-10-23 | ||
| JP2001-324525 | 2001-10-23 | ||
| JP2002027511A JP4297318B2 (en) | 2001-10-23 | 2002-02-05 | Circuit board and electrical junction box |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007143951A Division JP2007267596A (en) | 2001-10-23 | 2007-05-30 | Electrical connection box |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003204617A true JP2003204617A (en) | 2003-07-18 |
| JP4297318B2 JP4297318B2 (en) | 2009-07-15 |
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ID=27666371
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002027511A Expired - Fee Related JP4297318B2 (en) | 2001-10-23 | 2002-02-05 | Circuit board and electrical junction box |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007209146A (en) * | 2006-02-02 | 2007-08-16 | Sumitomo Wiring Syst Ltd | Vehicle junction box |
| JP2023012850A (en) * | 2021-07-14 | 2023-01-26 | 矢崎総業株式会社 | Electric conduction control apparatus |
-
2002
- 2002-02-05 JP JP2002027511A patent/JP4297318B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007209146A (en) * | 2006-02-02 | 2007-08-16 | Sumitomo Wiring Syst Ltd | Vehicle junction box |
| JP4725341B2 (en) * | 2006-02-02 | 2011-07-13 | 住友電装株式会社 | Junction box for vehicles |
| JP2023012850A (en) * | 2021-07-14 | 2023-01-26 | 矢崎総業株式会社 | Electric conduction control apparatus |
| JP7404309B2 (en) | 2021-07-14 | 2023-12-25 | 矢崎総業株式会社 | Energization control device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4297318B2 (en) | 2009-07-15 |
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