JP4239370B2 - Manufacturing method of flat heat pipe - Google Patents
Manufacturing method of flat heat pipe Download PDFInfo
- Publication number
- JP4239370B2 JP4239370B2 JP2000202761A JP2000202761A JP4239370B2 JP 4239370 B2 JP4239370 B2 JP 4239370B2 JP 2000202761 A JP2000202761 A JP 2000202761A JP 2000202761 A JP2000202761 A JP 2000202761A JP 4239370 B2 JP4239370 B2 JP 4239370B2
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- flat
- flat heat
- metal pipe
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、ノートパソコンに代表される携帯用電子機器等に使用されている発熱電子部品を冷却するのに適したフラットヒートパイプの製造方法に関し、特に、小型かつ製造容易で、伝熱性に優れ、取り付けが容易なフラットヒートパイプの製造方法に関する。
【0002】
【従来の技術】
従来、銅管等の金属管内に凝縮性の流体を作動流体として封入したヒートパイプは、その熱伝導率が銅やアルミニウム等の金属単体に比較して数倍から数百倍程度優れていることから、冷却用素子として各種電子機器や熱関連機器等に多用されている。
【0003】
そして、このヒートパイプの形状としては、一般に断面円形管のものがほとんどであるが、ノートパソコン等の携帯用小型電子機器に組み込まれる場合には、小型・軽量化のためにその形状が断面扁平型をしたヒートパイプが用いられることが多い。このようなフラットヒートパイプの利用において、ヒートシンク等の放熱部品(発熱部品)との接合には、接着剤を用いて接合させている。
【0004】
【発明が解決しようとする課題】
しかし、従来のフラットヒートパイプによると、放熱部品との接合に接着剤を用いているので、接着面を清浄化する手間を要し、取り付けが容易ではなく、接着の強度は接着剤の仕様により左右される。また、放熱部品とフラットヒートパイプとの間に接着剤が介在することにより、接触熱抵抗が上昇し、冷却装置としての性能が低下するおそれがある。
【0005】
従って、本発明の目的は、小型かつ製造容易で、伝熱性に優れ、取り付けが容易なフラットヒートパイプの製造方法を提供することにある。
【0006】
【課題を解決するための手段】
本発明は、上記目的を達成するため、金属パイプにメッシュ材を挿入する工程と、前記メッシュ材が挿入された前記金属パイプを扁平加工する工程と、前記扁平加工された前記金属パイプの長手方向の一方の側を溶接する工程と、作動液を前記扁平加工された前記金属パイプに封入する工程と、前記作動液が封入された前記金属パイプの他方の側を溶接する工程と、前記溶接した部分より外側の前記金属パイプの部分を押し潰して取付部を形成する工程と、前記取付部に取付孔を形成する工程とを含むことを特徴とするフラットヒートパイプの製造方法を提供する。
【0009】
【発明の実施の形態】
図1および図2は、本発明の実施の形態に係るフラットヒートパイプを示し、図1は斜視図、図2は断面図である。このフラットヒートパイプ1は、偏平化された形状を有し、内部に作動液8が封入されたヒートパイプ部1aと、ヒートパイプ部1aの長手方向の両端に形成された取付部2,3とを有する。
【0010】
取付部2,3は、少なくとも一方の面が平坦面2a,3aとなっており、それれ2つの孔6が形成されている。
【0011】
このように構成されたフラットヒートパイプ1は、例えば、次のように製作される。まず、内面にメッシュ材7が挿入された直径9.52mm程度の銅管を準備する。次に、その銅管に厚み2mm程度まで扁平加工を施す。片側が平坦となるように図中4又は5に示す部位を抵抗溶接し、長さ15mm程度を有する取付部2又は3を形成する。抵抗溶接した部位4又は5は、ヒートパイプ部1aと取付部2又は3の境界となる。部位4,5の溶接は、TIG(tungsten inert gas)溶接等他の方法を用いてもよい。次に、作動液8をヒートパイプ部1a内に注入し、部位5又は4を溶接することで作動液8を封入し、取付部2,3の隙間のみを押しつぶし、各取付部2,3にボルト等の取付が可能となる直径3mm程度の孔6をドリルでそれぞれ2ヶ所加工する。
【0012】
この実施の形態のラットヒートパイプ1によれば、取付部2,3を設けることにより、ボルト等を用いてヒートパイプ1を直接冷却装置に取り付けることが可能となるので、接触熱抵抗が小さくなり、冷却装置としての性能向上を図ることができる。
また、銅管を溶接し、押し潰すことによってヒートパイプ1aに取付部2,3を設けることができるので、フラットヒートパイプ1を取り付けるための部品を別個に設ける必要がなく、小型なフラットヒートパイプを容易に製造することができる。
なお、フラットヒートパイプ1の内面に、メッシュ材7の代わりに溝加工を形成してもよい。
【0013】
また、本発明の他の実施の形態として、上記実施の形態のフラットヒートパイプ1と、フラットヒートパイプ1に空気流を供給する供給手段としてのファンとからヒートパイプ式冷却装置を構成してもよい。これにより、小型なフラットヒートパイプ1によってパーソナルコンピュータのCPU等の発熱部品やヒートシンク等の放熱部品を冷却することができる。また、フラットヒートパイプ1は小型で取付部を有しているので、冷却装置への実装が容易となる。
【0013】
【発明の効果】
以上説明したように、本発明によれば、取付部を設けているので、取り付けが容易となり、ヒートパイプを直接取り付けることができるので、接触熱抵抗が小さくなり、伝熱性が向上する。
また、フラットヒートパイプを取り付けるための部品を別個に設ける必要がないので、フラットヒートパイプを小型化でき、容易に製造することができる。
【図面の簡単な説明】
【図1】本発明の実施の形態に係るフラットヒートパイプの斜視図である。
【図2】本発明の実施例に係るフラットヒートパイプの断面図である。
【符号の説明】
1 フラットヒートパイプ
2,3 取付部
2a,3a 平坦面
4,5 抵抗溶接部
6 孔
7 メッシュ材
8 作動液[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a flat heat pipe suitable for cooling a heat-generating electronic components used in portable electronic devices typified by a notebook computer, in particular, small and easy manufacture, the heat transfer excellent, a method of manufacturing a mounting easy flat heat pipe.
[0002]
[Prior art]
Conventionally, a heat pipe in which a condensable fluid is sealed as a working fluid in a metal pipe such as a copper pipe has a thermal conductivity that is several to several hundred times better than that of a single metal such as copper or aluminum. Therefore, it is widely used as a cooling element in various electronic devices and heat-related devices.
[0003]
The shape of this heat pipe is generally a circular tube in cross section, but when incorporated in a small portable electronic device such as a notebook computer, the shape of the heat pipe is flat in order to reduce the size and weight. A shaped heat pipe is often used. In the use of such a flat heat pipe, an adhesive is used for bonding to a heat radiating component (heat generating component) such as a heat sink.
[0004]
[Problems to be solved by the invention]
However, according to the conventional flat heat pipe, since the adhesive is used for joining with the heat radiating parts, it takes time and effort to clean the adhesive surface, it is not easy to install, and the adhesive strength depends on the specifications of the adhesive It depends. Moreover, when an adhesive agent is interposed between the heat dissipating component and the flat heat pipe, the contact thermal resistance increases, and the performance as a cooling device may be reduced.
[0005]
Accordingly, an object of the present invention is compact and easy to manufacture, excellent in heat conductivity, in that the mounting is to provide a method of manufacturing easy flat heat pipes.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the present invention includes a step of inserting a mesh material into a metal pipe, a step of flattening the metal pipe with the mesh material inserted therein, and a longitudinal direction of the flattened metal pipe A step of welding one side of the metal pipe, a step of sealing the working fluid in the flattened metal pipe, a step of welding the other side of the metal pipe filled with the working fluid, and the welding A flat heat pipe manufacturing method comprising: a step of crushing a portion of the metal pipe outside the portion to form an attachment portion; and a step of forming an attachment hole in the attachment portion .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
1 and 2 show a flat heat pipe according to an embodiment of the present invention, FIG. 1 is a perspective view, and FIG. 2 is a cross-sectional view. The flat heat pipe 1 has a flattened shape, a
[0010]
At least one surface of the mounting portions 2 and 3 is flat surfaces 2a and 3a, and two
[0011]
The flat heat pipe 1 configured as described above is manufactured, for example, as follows. First, a copper tube having a diameter of about 9.52 mm in which the
[0012]
According to the rat heat pipe 1 of this embodiment, by providing the attachment portions 2 and 3, the heat pipe 1 can be directly attached to the cooling device using bolts or the like, so that the contact thermal resistance is reduced. The performance as a cooling device can be improved.
Moreover, since the attachment parts 2 and 3 can be provided in the
In addition, you may form a groove process in the inner surface of the flat heat pipe 1 instead of the
[0013]
Further, as another embodiment of the present invention, a heat pipe type cooling device may be constituted by the flat heat pipe 1 of the above embodiment and a fan as a supply means for supplying an air flow to the flat heat pipe 1. Good. Thereby, heat generating components such as a CPU of a personal computer and heat radiating components such as a heat sink can be cooled by the small flat heat pipe 1. Moreover, since the flat heat pipe 1 is small and has an attachment portion, it can be easily mounted on a cooling device.
[0013]
【The invention's effect】
As described above, according to the present invention, since the attachment portion is provided, the attachment becomes easy and the heat pipe can be directly attached, so that the contact thermal resistance is reduced and the heat transfer property is improved.
Moreover, since it is not necessary to separately provide components for attaching the flat heat pipe, the flat heat pipe can be reduced in size and easily manufactured.
[Brief description of the drawings]
FIG. 1 is a perspective view of a flat heat pipe according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of a flat heat pipe according to an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Flat heat pipe 2, 3 Attachment part 2a, 3a Flat surface 4, 5
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000202761A JP4239370B2 (en) | 2000-07-04 | 2000-07-04 | Manufacturing method of flat heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000202761A JP4239370B2 (en) | 2000-07-04 | 2000-07-04 | Manufacturing method of flat heat pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002022375A JP2002022375A (en) | 2002-01-23 |
JP4239370B2 true JP4239370B2 (en) | 2009-03-18 |
Family
ID=18700245
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000202761A Expired - Fee Related JP4239370B2 (en) | 2000-07-04 | 2000-07-04 | Manufacturing method of flat heat pipe |
Country Status (1)
Country | Link |
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JP (1) | JP4239370B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105091644A (en) * | 2015-08-10 | 2015-11-25 | 中国航天空气动力技术研究院 | Modular regenerative cooling device |
CN110149784A (en) * | 2019-06-03 | 2019-08-20 | Oppo广东移动通信有限公司 | Radiating subassembly and electronic equipment |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101846471B (en) * | 2010-05-15 | 2012-10-17 | 中山伟强科技有限公司 | Soaking plate |
-
2000
- 2000-07-04 JP JP2000202761A patent/JP4239370B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105091644A (en) * | 2015-08-10 | 2015-11-25 | 中国航天空气动力技术研究院 | Modular regenerative cooling device |
CN110149784A (en) * | 2019-06-03 | 2019-08-20 | Oppo广东移动通信有限公司 | Radiating subassembly and electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
JP2002022375A (en) | 2002-01-23 |
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