JP4183008B2 - Micro relay - Google Patents

Micro relay Download PDF

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Publication number
JP4183008B2
JP4183008B2 JP2007050098A JP2007050098A JP4183008B2 JP 4183008 B2 JP4183008 B2 JP 4183008B2 JP 2007050098 A JP2007050098 A JP 2007050098A JP 2007050098 A JP2007050098 A JP 2007050098A JP 4183008 B2 JP4183008 B2 JP 4183008B2
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armature
movable contact
longitudinal direction
fixed
base substrate
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JP2007180047A (en
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慎一 岸本
健 橋本
勉 下村
英樹 榎本
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/22—Polarised relays
    • H01H51/2272—Polarised relays comprising rockable armature, rocking movement around central axis parallel to the main plane of the armature
    • H01H51/2281—Contacts rigidly combined with armature

Description

本発明は、マイクロリレーに関するものである。   The present invention relates to a micro relay.

従来から、静電駆動型のマイクロリレーに比べて駆動力を大きくできるマイクロリレーとして、電磁石装置の電磁力を利用してアーマチュアを駆動し接点を開閉するようにしたマイクロリレーが知られている（例えば、特許文献１参照）。   2. Description of the Related Art Conventionally, as a microrelay that can increase the driving force compared to an electrostatically driven microrelay, a microrelay that uses an electromagnetic force of an electromagnet device to drive an armature to open and close a contact is known ( For example, see Patent Document 1).

以下、この種のマイクロリレーの一例について、図２〜図７を参照しながら説明する。   Hereinafter, an example of this type of microrelay will be described with reference to FIGS.

このマイクロリレーは、ヨーク２０に巻回されたコイル２２，２２への励磁電流に応じて磁束を発生する電磁石装置２と、矩形板状のガラス基板からなり厚み方向の一面側において長手方向の両端部それぞれに各一対の固定接点１４が設けられたベース基板１と、ベース基板１の上記一表面側に固着される枠状（矩形枠状）のフレーム部３１およびフレーム部３１の内側に配置されて４本の支持ばね部３２を介してフレーム部３１に揺動自在に支持され電磁石装置２により駆動されるアーマチュア３０およびアーマチュア３０にそれぞれ２本の接圧ばね部３５を介して支持されそれぞれ可動接点３９が設けられた２つの可動接点基台部３４を有するアーマチュアブロック３と、アーマチュアブロック３におけるベース基板１とは反対側で周部がフレーム部３１に固着された矩形板状のガラス基板からなるカバー４とを備えている。   This micro relay is composed of an electromagnet device 2 that generates a magnetic flux in response to an exciting current applied to coils 22 and 22 wound around a yoke 20, and both ends in the longitudinal direction on one surface side in the thickness direction. The base substrate 1 provided with a pair of fixed contacts 14 on each of the parts, a frame-shaped (rectangular frame-shaped) frame portion 31 fixed to the one surface side of the base substrate 1, and an inner side of the frame portion 31. The armature 30 and the armature 30 driven by the electromagnet device 2 are swingably supported by the frame portion 31 via the four support spring portions 32, and are respectively supported by the two contact pressure spring portions 35 and movable. An armature block 3 having two movable contact base portions 34 provided with contacts 39, and a peripheral portion on the side opposite to the base substrate 1 in the armature block 3 And a cover 4 made of a rectangular plate-shaped glass substrate which is fixed to the frame portion 31.

電磁石装置２におけるヨーク２０は、２つのコイル２２，２２が直接巻回される細長の矩形板状のコイル巻回部２０ａと、コイル巻回部２０ａの長手方向の両端部それぞれからアーマチュア３０に近づく向きに延設されコイル２２，２２への励磁電流に応じて互いの先端面が異極に励磁される一対の脚片２０ｂ，２０ｂと、ヨーク２０の両脚片２０ｂ，２０ｂの間でコイル巻回部２０ａの長手方向の中央部に重ねて配置された矩形板状の永久磁石２１と、細長の矩形板状であってヨーク２０のコイル巻回部２０ａにおける永久磁石２１との対向面とは反対側でコイル巻回部２０ａと直交するようにコイル巻回部２０ａに固着されるプリント基板２３とを備えている。なお、ヨーク２０は、電磁軟鉄などの鉄板を曲げ加工、鋳造加工、プレス加工などにより加工することによって形成されており、両脚片２０ｂ，２０ｂの断面が矩形状に形成されている。   The yoke 20 in the electromagnet device 2 approaches the armature 30 from each of the elongated rectangular plate-shaped coil winding part 20a around which the two coils 22 and 22 are directly wound, and both ends in the longitudinal direction of the coil winding part 20a. Coil winding between a pair of leg pieces 20b, 20b extending in the direction and excited at opposite ends according to the excitation current to the coils 22, 22, and both leg pieces 20b, 20b of the yoke 20 A rectangular plate-like permanent magnet 21 disposed on the central portion in the longitudinal direction of the portion 20a and an elongated rectangular plate shape opposite to the surface of the coil winding portion 20a of the yoke 20 facing the permanent magnet 21 And a printed circuit board 23 fixed to the coil winding portion 20a so as to be orthogonal to the coil winding portion 20a. The yoke 20 is formed by processing an iron plate such as electromagnetic soft iron by bending, casting, pressing, or the like, and the cross sections of both leg pieces 20b, 20b are formed in a rectangular shape.

永久磁石２１は、コイル巻回部２０ａとの重ね方向（厚み方向）の両面それぞれの磁極面２１ａ，２１ｂが異極に着磁されており、一方の磁極面２１ｂがヨーク２０のコイル巻回部２０ａに当接し、他方の磁極面２１ａがヨーク２０の両脚片２０ｂ，２０ｂの先端面と同一平面上に位置するように厚み寸法を設定してある。   In the permanent magnet 21, the magnetic pole surfaces 21a and 21b on both surfaces in the overlapping direction (thickness direction) with the coil winding portion 20a are magnetized in different polarities, and one magnetic pole surface 21b is the coil winding portion of the yoke 20. The thickness dimension is set so that the other magnetic pole surface 21a is in contact with 20a and is located on the same plane as the tip surfaces of both leg pieces 20b, 20b of the yoke 20.

また、各コイル２２，２２はそれぞれ、永久磁石２１とヨーク２０の脚片２０ｂ，２０ｂとによって口軸方向（つまり、コイル巻回部２０ａの長手方向）への移動が規制される。プリント基板２３は、絶縁基板２３ａの一表面における長手方向の両端部に導体パターン２３ｂが形成されており、各導体パターン２３ｂにおいて円形状に形成された部位が外部接続用電極を構成し、矩形状に形成された部位がコイル接続部を構成している。ここにおいて、コイル接続部には、コイル２２，２２の端末が接続されるが、コイル２２，２２は、外部接続用電極間に電源を接続してコイル２２，２２へ励磁電流を流したときにヨーク２０の両脚片２０ｂ，２０ｂの先端面が互いに異なる磁極となるように接続されている。なお、各導体パターン２３ｂにおける外部接続用電極には、導電性材料（例えば、Ａｕ，Ａｇ，Ｃｕ，半田など）からなるバンプ２４が適宜固着されるが、バンプ２４を固着する代わりに、ボンディングワイヤをボンディングしてもよい。   Further, the movement of each of the coils 22 and 22 in the mouth axis direction (that is, the longitudinal direction of the coil winding portion 20a) is restricted by the permanent magnet 21 and the leg pieces 20b and 20b of the yoke 20, respectively. In the printed circuit board 23, conductor patterns 23b are formed at both ends in the longitudinal direction on one surface of the insulating substrate 23a, and the circularly formed portions of the conductor patterns 23b constitute external connection electrodes, and are rectangular. The site | part formed in comprises the coil connection part. Here, the terminals of the coils 22 and 22 are connected to the coil connecting portion, but the coils 22 and 22 are connected when a power source is connected between the external connection electrodes and an excitation current is passed through the coils 22 and 22. The leg surfaces 20b, 20b of the yoke 20 are connected so that the tip surfaces of the leg pieces 20b are different from each other. Note that bumps 24 made of a conductive material (for example, Au, Ag, Cu, solder, etc.) are appropriately fixed to the external connection electrodes in each conductor pattern 23b. Instead of fixing the bumps 24, bonding wires are bonded. May be bonded.

ベース基板１は、パイレックス（登録商標）のような耐熱ガラスにより形成されており、外周形状が矩形状であって、中央部には厚み方向に貫通し電磁石装置２を収納する収納孔１６が貫設され、四隅の各近傍には厚み方向に貫通するスルーホール１０が貫設されている。また、ベース基板１の厚み方向の両面であって各スルーホール１０それぞれの周縁にはランド１２が形成されている。ここに、ベース基板１の厚み方向において重なるランド１２同士はスルーホール１０の内周面に被着された導電性材料（例えば、Ｃｕ，Ｃｒ，Ｔｉ，Ｐｔ，Ｃｏ，Ｎｉ，Ａｕ，あるいはこれらの合金など）からなる導体層（図示せず）により電気的に接続されている。また、ベース基板１の厚み方向の他表面側の各ランド１２にはバンプ１３が適宜固着されており、バンプ１３をランド１２に固着することによって、ベース基板１の上記他表面側ではスルーホール１０の開口面がバンプ１３により覆われる。スルーホール１０の開口面は円形状であって、ベース基板１の上記一表面には、それぞれスルーホール１０の開口面およびランド１２を覆う４枚のシリコン薄膜からなる蓋体１９が固着されている。   The base substrate 1 is made of heat-resistant glass such as Pyrex (registered trademark), and has a rectangular outer peripheral shape. A storage hole 16 that penetrates in the thickness direction and stores the electromagnet device 2 passes through the center portion. A through hole 10 penetrating in the thickness direction is provided in the vicinity of each of the four corners. Also, lands 12 are formed on both sides of the base substrate 1 in the thickness direction and on the periphery of each through hole 10. Here, the lands 12 that overlap in the thickness direction of the base substrate 1 are electrically conductive materials (for example, Cu, Cr, Ti, Pt, Co, Ni, Au, or the like) deposited on the inner peripheral surface of the through hole 10. They are electrically connected by a conductor layer (not shown) made of an alloy or the like. Further, bumps 13 are appropriately fixed to the lands 12 on the other surface side in the thickness direction of the base substrate 1, and the through holes 10 are formed on the other surface side of the base substrate 1 by fixing the bumps 13 to the lands 12. The opening surface is covered with the bump 13. The opening surface of the through hole 10 has a circular shape, and a lid 19 made of four silicon thin films covering the opening surface of the through hole 10 and the land 12 is fixed to the one surface of the base substrate 1. .

また、上述の各一対の固定接点１４は、ベース基板１の長手方向の両端部においてベース基板１の短手方向に離間して形成された２つのスルーホール１０の間で上記短手方向に並設されており、上記短手方向において隣り合うスルーホール１０の周縁に形成されたランド１２と導電パターン１８を介して電気的に接続されている。ここに、固定接点１４および導電パターン１８およびランド１２の材料としては、例えば、Ｃｒ，Ｔｉ，Ｐｔ，Ｃｏ，Ｃｕ，Ｎｉ，Ａｕ，あるいはこれらの合金などの導電性材料を採用すればよく、バンプ１３の材料としては、例えば、Ａｕ，Ａｇ，Ｃｕ，半田などの導電性材料を採用すればよい。なお、上述のスルーホール１０および収納孔１６は、例えば、サンドブラスト法やエッチング法などによって形成すればよく、上述の導体層は、例えば、めっき法、蒸着法、スパッタ法などによって形成すればよい。   In addition, each of the pair of fixed contacts 14 described above is arranged in parallel in the short direction between two through holes 10 that are spaced apart in the short direction of the base substrate 1 at both ends in the longitudinal direction of the base substrate 1. And is electrically connected to the lands 12 formed on the periphery of the adjacent through holes 10 in the short direction via the conductive patterns 18. Here, as the material of the fixed contact 14, the conductive pattern 18 and the land 12, for example, a conductive material such as Cr, Ti, Pt, Co, Cu, Ni, Au, or an alloy thereof may be employed. For example, a conductive material such as Au, Ag, Cu, or solder may be employed as the material 13. The through hole 10 and the storage hole 16 described above may be formed by, for example, a sand blast method or an etching method, and the above-described conductor layer may be formed by, for example, a plating method, a vapor deposition method, a sputtering method, or the like.

また、収納孔１６の開口面は十字状であって、ベース基板１の上記一表面側には、収納孔１６を閉塞するシリコン薄膜からなる蓋体１７が固着されている。すなわち、電磁石装置２は、ヨーク２０の両脚片２０ｂ，２０ｂの各先端面が蓋体１７と対向する形で収納孔１６に挿入される。なお、本例では、収納孔１６の内周面と蓋体１７とで囲まれる空間が電磁石装置２を収納する収納部を構成しており、電磁石装置２０は、永久磁石２１がベース基板１の厚み寸法内でアーマチュア３０とヨーク２０とにより形成される磁路中に設けられ、プリント基板２３における絶縁基板２３ａの表面がベース基板１の上記他表面と略面一となっている。なお、蓋体１７，１９は、シリコン基板をエッチングや研磨などで薄膜化することにより形成したシリコン薄膜により構成されており、厚み寸法を２０μｍに設定してある。ここに、蓋体１７の厚み寸法は２０μｍに限定するものではなく、例えば、５μｍ〜５０μｍ程度の範囲内で適宜設定すればよい。また、蓋体１７，１９は、シリコン薄膜に限らず、ガラス基板をエッチングや研磨などで薄膜化することにより形成したガラス薄膜により構成してもよい。   The opening surface of the storage hole 16 has a cross shape, and a lid 17 made of a silicon thin film that closes the storage hole 16 is fixed to the one surface side of the base substrate 1. That is, the electromagnet device 2 is inserted into the storage hole 16 so that the front end surfaces of the leg pieces 20 b and 20 b of the yoke 20 face the lid body 17. In this example, the space surrounded by the inner peripheral surface of the storage hole 16 and the lid body 17 constitutes a storage unit that stores the electromagnet device 2, and the electromagnet device 20 includes the permanent magnet 21 of the base substrate 1. Within the thickness dimension, it is provided in a magnetic path formed by the armature 30 and the yoke 20, and the surface of the insulating substrate 23 a in the printed circuit board 23 is substantially flush with the other surface of the base substrate 1. The lids 17 and 19 are made of a silicon thin film formed by thinning a silicon substrate by etching or polishing, and the thickness dimension is set to 20 μm. Here, the thickness dimension of the lid 17 is not limited to 20 μm, and may be appropriately set within a range of about 5 μm to 50 μm, for example. The lids 17 and 19 are not limited to the silicon thin film, and may be formed of a glass thin film formed by thinning a glass substrate by etching or polishing.

収納孔１６は、ベース基板１の上記一表面から上記他表面に近づくにつれて徐々に開口面積が大きくなるテーパ形状となっており、ベース基板１の上記他表面側から電磁石装置２を挿入しやすく、且つ、ベース基板１の上記一表面における収納孔１６の開口面積を比較的小さくすることができる。   The storage hole 16 has a tapered shape in which the opening area gradually increases from the one surface of the base substrate 1 toward the other surface, and the electromagnetic device 2 can be easily inserted from the other surface side of the base substrate 1. In addition, the opening area of the accommodation hole 16 on the one surface of the base substrate 1 can be made relatively small.

アーマチュアブロック３は、シリコン基板からなる半導体基板を半導体微細加工プロセスにより加工することによって、上述の矩形枠状のフレーム部３１と、上述の４本の支持ばね３２と、フレーム部３１の内側に配置されアーマチュア３０の一部を構成する矩形板状の可動基台部３０ａと、上述の４本の接圧ばね部３５と、上述の２つの可動接点基台部３４とを形成してあり、可動基台部３０ａと、可動基台部３０ａにおけるベース基板１との対向面に固着された磁性体（例えば、軟鉄、電磁ステンレス、パーマロイなど）からなる矩形板状の磁性体部３０ｂとでアーマチュア３０を構成している。したがって、アーマチュア３０が４本の支持ばね部３２を介してフレーム部３１に揺動自在に支持されている。なお、可動基台部３０ａはフレーム部３１よりも薄肉であり、アーマチュア３０の厚み寸法は、アーマチュアブロック３とベース基板１とを固着した状態においてアーマチュア３０の磁性体部３０ｂと蓋体１７との間に所定のギャップが形成されるように設定されている。   The armature block 3 is disposed on the inside of the above-described rectangular frame-shaped frame portion 31, the above-described four support springs 32, and the frame portion 31 by processing a semiconductor substrate made of a silicon substrate by a semiconductor microfabrication process. The movable base portion 30a having a rectangular plate shape constituting a part of the armature 30, the above-described four contact pressure spring portions 35, and the above-described two movable contact base portions 34 are formed. The armature 30 includes a base 30a and a rectangular plate-shaped magnetic body 30b made of a magnetic material (for example, soft iron, electromagnetic stainless steel, permalloy, etc.) fixed to the surface of the movable base 30a facing the base substrate 1. Is configured. Accordingly, the armature 30 is swingably supported by the frame portion 31 via the four support spring portions 32. The movable base portion 30a is thinner than the frame portion 31, and the thickness of the armature 30 is such that the armature block 3 and the base substrate 1 are fixed to each other between the magnetic body portion 30b of the armature 30 and the lid body 17. A predetermined gap is set between them.

上述の支持ばね部３２は、可動基台部３０ａの短手方向の両側面側で可動基台部３０ａの長手方向に離間して２箇所に形成されている。各支持ばね部３２は、一端部がフレーム部３１に連続一体に連結され他端部が可動基台部３０ａに連続一体に連結されている。なお、各支持ばね部３２は、平面形状において上記一端部と上記他端部との間の部位を同一面内で蛇行した形状に形成することにより長さ寸法を長くしてあり、アーマチュア３０が揺動する際に各支持ばね部３２にかかる応力を分散させることができ、各支持ばね部３２が破損するのを防止することができる。   The above-described support spring portions 32 are formed at two locations on both sides in the short direction of the movable base portion 30a so as to be separated from each other in the longitudinal direction of the movable base portion 30a. Each support spring portion 32 has one end portion connected to the frame portion 31 continuously and integrally, and the other end portion connected to the movable base portion 30a continuously and integrally. In addition, each support spring part 32 is lengthened by forming the site | part between the said one end part and the said other end part in the planar shape in the meandering shape in the same surface, and the armature 30 is made into the shape. It is possible to disperse the stress applied to each support spring portion 32 when swinging, and to prevent each support spring portion 32 from being damaged.

また、可動基台部３０ａは、短手方向の両側縁の中央部から矩形状の突片３６が連続一体に延設され、フレーム部３１の内周面において突片３６に対応する部位からも矩形状の突片３７が連続一体に延設されている。すなわち、可動基台部３０ａから延設された突片３６とフレーム部３１から延設された突片３７とは互いの先端面同士が対向している。ここに、可動基台部３０ａから延設された各突片３６の先端面には凸部３６ａが形成されており、フレーム部３１から延設された各突片３７の先端面には、凸部３６ａが入り込む凹部３７ａが形成されている。したがって、凸部３６ａが凹部３７ａの内周面に当接することでフレーム部３１の厚み方向に直交する面内におけるアーマチュア３０の移動が規制される。なお、アーマチュア３０の同一の側縁側に配設される２つの支持ばね部３２は、突片３６の両側に位置している。   In addition, the movable base portion 30a has a rectangular protruding piece 36 extending continuously and integrally from the center of both side edges in the lateral direction, and also from a portion corresponding to the protruding piece 36 on the inner peripheral surface of the frame portion 31. A rectangular projecting piece 37 is continuously extended. In other words, the projecting piece 36 extending from the movable base portion 30a and the projecting piece 37 extending from the frame portion 31 are opposed to each other at their front end surfaces. Here, a convex portion 36a is formed on the tip surface of each protruding piece 36 extending from the movable base portion 30a, and the protruding surface of each protruding piece 37 extended from the frame portion 31 is convex. A recess 37a into which the portion 36a enters is formed. Therefore, the movement of the armature 30 in the plane orthogonal to the thickness direction of the frame portion 31 is restricted by the convex portion 36a contacting the inner peripheral surface of the concave portion 37a. The two support spring portions 32 disposed on the same side edge side of the armature 30 are located on both sides of the projecting piece 36.

また、アーマチュアブロック３は、アーマチュア３０の長手方向においてアーマチュア３０の両端部とフレーム部３１との間にそれぞれ可動接点基台部３４が配置されており、各可動接点基台部３４におけるベース基板１との対向面に導電性材料からなる可動接点３９が固着されている。ここに、可動接点基台部３４は上述の２本の接圧ばね部３５を介して可動基台部３０ａに支持されている。なお、可動基台部３０ａは上述のように矩形板状に形成されており、磁性体部３０ｂの変位量を制限するストッパ部３３が四隅それぞれから連続一体に延設されており、接圧ばね部３５の平面形状は、ストッパ部３３の外周縁の３辺に沿ったコ字状に形成されている。このストッパ部３３は、ベース基板１の上記一表面と接触することにより磁性体部３０ｂの変位量を制限する。   In the armature block 3, movable contact base portions 34 are arranged between both end portions of the armature 30 and the frame portion 31 in the longitudinal direction of the armature 30, and the base substrate 1 in each movable contact base portion 34. A movable contact 39 made of a conductive material is fixed to the surface facing the surface. Here, the movable contact base portion 34 is supported by the movable base portion 30a via the two contact pressure spring portions 35 described above. The movable base portion 30a is formed in a rectangular plate shape as described above, and the stopper portions 33 that limit the displacement amount of the magnetic body portion 30b are continuously extended from the four corners, and the contact pressure spring. The planar shape of the portion 35 is formed in a U shape along three sides of the outer peripheral edge of the stopper portion 33. The stopper portion 33 limits the amount of displacement of the magnetic body portion 30 b by coming into contact with the one surface of the base substrate 1.

なお、アーマチュアブロック３は、上述の説明から分かるように、フレーム部３１、可動基台部３０ａ、支持ばね部３２、可動接点保持部３４、接圧ばね部３５が上述の半導体基板の一部により構成されている。半導体基板としては、例えば厚み寸法が２００μｍ程度のシリコン基板を用いればよいが、当該厚み寸法は特に限定するものではなく、例えば、５０μｍ〜３００μｍ程度の範囲で適宜設定すればよい。   As can be seen from the above description, the armature block 3 includes the frame portion 31, the movable base portion 30a, the support spring portion 32, the movable contact holding portion 34, and the contact pressure spring portion 35, which are part of the semiconductor substrate described above. It is configured. As the semiconductor substrate, for example, a silicon substrate having a thickness dimension of about 200 μm may be used. However, the thickness dimension is not particularly limited, and may be appropriately set in a range of, for example, about 50 μm to 300 μm.

また、可動接点基台部３４の厚み寸法と可動接点３９の厚み寸法との合計寸法についても、接点開成状態において可動接点３９と固定接点１４との間の距離が所定距離となるように設定されている。   Further, the total dimension of the thickness dimension of the movable contact base portion 34 and the thickness dimension of the movable contact 39 is also set so that the distance between the movable contact 39 and the fixed contact 14 is a predetermined distance in the contact open state. ing.

カバー４は、パイレックス（登録商標）のような耐熱ガラスにより構成されており、アーマチュアブロック３との対向面にアーマチュア３０の揺動空間を確保する凹所４ａが形成されている。   The cover 4 is made of heat-resistant glass such as Pyrex (registered trademark), and a recess 4 a that secures a swinging space of the armature 30 is formed on the surface facing the armature block 3.

ところで、上述のアーマチュアブロック３のフレーム部３１におけるベース基板１との対向面の周部には全周に亙って接合用金属薄膜３８ｂが形成され、カバー４との対向面の周部には全周に亙って接合用金属薄膜３８ａが形成されている。また、ベース基板１におけるアーマチュアブロック３との対向面の周部にも全周に亙って接合用金属薄膜１５が形成され、カバー４におけるアーマチュアブロック３との対向面の周部にも全周に亙って接合用金属薄膜４２が形成されている。したがって、アーマチュアブロック３とベース基板１およびカバー４とを圧接または陽極接合により気密的に接合することができ、ベース基板１とカバー４とフレーム部３１とで囲まれる空間の気密性を向上できる。   By the way, a metal thin film 38b for bonding is formed over the entire periphery of the surface of the frame portion 31 of the armature block 3 facing the base substrate 1 over the entire periphery. A bonding metal thin film 38a is formed over the entire circumference. Also, a metal thin film 15 for bonding is formed over the entire periphery of the surface of the base substrate 1 facing the armature block 3, and the entire periphery of the periphery of the cover 4 facing the armature block 3 is also formed. Accordingly, the bonding metal thin film 42 is formed. Therefore, the armature block 3, the base substrate 1 and the cover 4 can be hermetically bonded by pressure welding or anodic bonding, and the airtightness of the space surrounded by the base substrate 1, the cover 4 and the frame portion 31 can be improved.

その結果、上記のマイクロリレーは、ベース基板１と、カバー４と、ベース基板１とカバー４との間に介在するフレーム部３１とで囲まれる気密空間（密閉空間）内に、アーマチュア３０、可動接点３３、固定接点１４が収納される。なお、上述の接合用金属薄膜１５，３８ａ，３８ｂ，４２の材料としては、例えば、Ａｕ，Ａｌ−Ｓｉなどを採用すればよい。   As a result, the above-described microrelay has the armature 30 movable in an airtight space (sealed space) surrounded by the base substrate 1, the cover 4, and the frame portion 31 interposed between the base substrate 1 and the cover 4. The contact 33 and the fixed contact 14 are accommodated. In addition, as a material of the above-described bonding metal thin films 15, 38a, 38b, 42, for example, Au, Al-Si, or the like may be employed.

以上説明したマイクロリレーをプリント基板のような実装基板に実装する際には、例えばベース基板１の上記他表面側において露出した２個のバンプ２４および４個のバンプ１３それぞれを上記実装基板の一表面側に形成された導体パターンに接続すればよい。   When the micro relay described above is mounted on a mounting board such as a printed circuit board, for example, the two bumps 24 and the four bumps 13 exposed on the other surface side of the base board 1 are respectively connected to the mounting board. What is necessary is just to connect to the conductor pattern formed in the surface side.

次に、上記のマイクロリレーの動作について説明する。   Next, the operation of the micro relay will be described.

上記のマイクロリレーでは、コイル２２，２２への通電が行われると、磁化の向きに応じて磁性体部３０ｂの長手方向の一端部がヨーク２０の一方の脚片２０ｂに吸引されてアーマチュア３０が揺動しアーマチュア３０の一端側の可動接点基台部３４に固着された可動接点３９が対向する一対の固定接点１４，１４に所定の接点圧で接触する（つまり、一対の固定接点１４，１４間が可動接点３９を介して短絡される）。この状態で通電を停止しても、永久磁石２１の発生する磁束により、吸引力が維持され、そのままの状態が保持される。   In the micro relay described above, when the coils 22 are energized, one end of the magnetic body portion 30b in the longitudinal direction is attracted to one leg piece 20b of the yoke 20 according to the direction of magnetization, and the armature 30 is The movable contact 39 that swings and is fixed to the movable contact base 34 on one end of the armature 30 contacts the pair of fixed contacts 14 and 14 facing each other with a predetermined contact pressure (that is, the pair of fixed contacts 14 and 14). Are short-circuited via the movable contact 39). Even if energization is stopped in this state, the attractive force is maintained by the magnetic flux generated by the permanent magnet 21, and the state is maintained as it is.

また、コイル２２，２２への通電方向を逆向きにすると、アーマチュア３０の磁性体部３０ｂがヨーク２０の他方の脚片２０ｂに吸引されてアーマチュア３０が揺動しアーマチュア３０の他端側の可動接点基台部３４に保持された可動接点３９が対向する一対の固定接点１４，１４に所定の接点圧で接触する。この状態で通電を停止しても、永久磁石２１の発生する磁束により、吸引力が維持され、そのままの状態が保持される。   Further, when the energization direction to the coils 22 and 22 is reversed, the magnetic body portion 30b of the armature 30 is attracted to the other leg piece 20b of the yoke 20, and the armature 30 swings to move the other end side of the armature 30. The movable contact 39 held by the contact base 34 contacts the pair of fixed contacts 14 and 14 facing each other with a predetermined contact pressure. Even if energization is stopped in this state, the attractive force is maintained by the magnetic flux generated by the permanent magnet 21, and the state is maintained as it is.

なお、上記のマイクロリレーは、永久磁石２１による磁性体部３０ｂの吸引力が支持ばね３２による復帰力よりも強くなるように支持ばね３２のばね定数を設定してあるが、永久磁石２１による磁性体部３０ｂの吸引力が支持ばね３２による復帰力よりも弱くなるように支持ばね３２のばね定数を設定してもよい。   In the micro relay, the spring constant of the support spring 32 is set so that the attractive force of the magnetic body portion 30b by the permanent magnet 21 is stronger than the return force by the support spring 32. The spring constant of the support spring 32 may be set so that the suction force of the body part 30 b is weaker than the return force by the support spring 32.

以上説明したマイクロリレーによれば、アーマチュアブロック３におけるベース基板１とは反対側で周部がフレーム部３１に固着されたカバー４を備えていることにより、アーマチュア３および固定接点１４および可動接点３９が密閉空間内に配置されるので、可動接点３９と固定接点１４との間に異物が侵入するのを防止できて可動接点３９と固定接点１４との接触信頼性を向上させることができる。また、リレー全体の厚み寸法をベース基板１の厚み寸法とアーマチュアブロック３のフレーム部３１の厚み寸法とカバー４の厚み寸法との合計寸法によって規定することができ、ベース基板１とカバー４とフレーム部３１とで構成される器体の薄型化が可能となる。   According to the micro relay described above, the armature 3, the fixed contact 14, and the movable contact 39 are provided with the cover 4 having a peripheral portion fixed to the frame portion 31 on the opposite side of the base substrate 1 in the armature block 3. Is disposed in the sealed space, foreign matter can be prevented from entering between the movable contact 39 and the fixed contact 14, and the contact reliability between the movable contact 39 and the fixed contact 14 can be improved. Moreover, the thickness dimension of the whole relay can be defined by the total dimension of the thickness dimension of the base substrate 1, the thickness dimension of the frame portion 31 of the armature block 3, and the thickness dimension of the cover 4. The container composed of the portion 31 can be made thinner.

また、上記のマイクロリレーでは、永久磁石２１がコイル巻回部２０ａの長手方向の中央部におけるアーマチュア３０側に重ねて配置され重ね方向の両面が異極に着磁されているので、アーマチュア３０の長手方向の中心部を中心としてアーマチュア３０が揺動可能となり、耐衝撃性が向上する。また、アーマチュア３０の可動基台部３０ａから延設した各突片３６におけるベース基板１との対向面から支点突起３６ｂを突設してあるので、このような一対の支点突起３６ｂを設けることでアーマチュア３０の揺動動作をより安定させることができる。   Further, in the micro relay described above, the permanent magnet 21 is disposed so as to overlap the armature 30 side in the longitudinal center of the coil winding portion 20a, and both surfaces in the overlapping direction are magnetized with different polarities. The armature 30 can swing around the center in the longitudinal direction, and impact resistance is improved. In addition, since the fulcrum protrusions 36b are provided so as to protrude from the surface of each protrusion 36 extending from the movable base portion 30a of the armature 30 so as to face the base substrate 1, by providing such a pair of fulcrum protrusions 36b. The swinging motion of the armature 30 can be further stabilized.

ところで、上記のマイクロリレーでは、図２（ｂ）に示すように、可動接点３９における固定接点１４との対向面を固定接点１４側へ突出する凸曲面に形成しているので、従来のように固定接点と可動接点との互いの対向面が平面状に形成されている場合に比べて、可動接点３９と固定接点１４との接触信頼性をより向上させることができ、しかも、アーマチュア３０に２本の接圧ばね部３５を介して支持された可動接点基台部３４に可動接点３９が設けられているので、所望の接点圧を得ることができるとともに接触信頼性の更なる向上を図れる。なお、上記凸曲面については所望の曲率半径を設定した曲面としてもよいし、仮想的な球面の一部を構成する曲面（いわゆるＳＲ形状）としてもよい。   By the way, in the micro relay described above, as shown in FIG. 2B, the surface of the movable contact 39 that faces the fixed contact 14 is formed as a convex curved surface that protrudes toward the fixed contact 14 side. The contact reliability between the movable contact 39 and the fixed contact 14 can be further improved as compared with the case where the opposing surfaces of the fixed contact and the movable contact are formed in a planar shape. Since the movable contact 39 is provided on the movable contact base 34 supported through the contact pressure spring 35, a desired contact pressure can be obtained and contact reliability can be further improved. The convex curved surface may be a curved surface having a desired radius of curvature, or may be a curved surface constituting a part of a virtual spherical surface (so-called SR shape).

なお、可動接点３９における固定接点１４との対向面を固定接点１４側へ突出する凸曲面に形成する代わりに、図８に示すように固定接点１４における可動接点３９との対向面を可動接点３９側へ突出する凸曲面に形成してもよいし、固定接点１４と可動接点３９との互いの対向面を他方側へ突出する凸曲面に形成してもよい。
特開平５−１１４３４７号公報 Instead of forming the surface of the movable contact 39 facing the fixed contact 14 as a convex curved surface protruding toward the fixed contact 14, the surface of the fixed contact 14 facing the movable contact 39 as shown in FIG. It may be formed in a convex curved surface projecting to the side, or the opposing surfaces of the fixed contact 14 and the movable contact 39 may be formed in a convex curved surface projecting to the other side.
Japanese Patent Laid-Open No. 5-114347

ここで、可動接点３９の平面形状において幅が狭くなる部分（電路の断面積が小さくなる部分）が形成されていると、一対の固定接点１４，１４間を短絡する可動接点３９の抵抗値が高くなってしまう。 Here, when a portion with a narrow width (a portion with a small cross-sectional area of the electric circuit) is formed in the planar shape of the movable contact 39, the resistance value of the movable contact 39 that short-circuits between the pair of fixed contacts 14 and 14 is It will be high.

本発明は、上記事由に鑑みて為されたものであり、その目的は、一対の固定接点間を短絡する可動接点の抵抗値を小さくすることができるマイクロリレーを提供することにある。 This invention is made | formed in view of the said reason, The objective is to provide the micro relay which can make small the resistance value of the movable contact which short-circuits between a pair of fixed contacts .

請求項１の発明は、電磁石装置を収納する収納部が形成され且つ厚み方向の一表面側に一対の固定接点が設けられたベース基板と、ベース基板の前記一表面側に固着される枠状のフレーム部、および、フレーム部の内側に配置されて支持ばね部を介してフレーム部に揺動自在に支持され電磁石装置により駆動されるアーマチュア、および、アーマチュアに接圧ばね部を介して支持された可動接点基台部、および、可動接点基台部に設けられて一対の固定接点に跨って接離する可動接点を有するアーマチュアブロックと、アーマチュアブロックにおけるベース基板とは反対側で周部がフレーム部に固着されたカバーとを備え、アーマチュアはフレーム部に囲まれる面内での形状が長方形状であって、可動接点基台部は、アーマチュアの短手方向を長手方向とし、長手方向での両端部においてそれぞれ接圧ばね部に連結され、一対の固定接点はアーマチュアの長手方向に並設されていて、可動接点基台部の長手方向の両端部には、それぞれ、平面形状が矩形状で一対の固定接点に跨って配置される可動接点が設けられ、可動接点基台部の長手方向の中間部は両端部に比べて細幅に形成されていることを特徴とする。 According to the first aspect of the present invention, there is provided a base substrate having an accommodating portion for accommodating an electromagnet device and having a pair of fixed contacts provided on one surface side in the thickness direction, and a frame shape fixed to the one surface side of the base substrate. A frame portion, an armature disposed inside the frame portion and supported by the frame portion through a support spring portion so as to be swingable, and supported by the armature via a contact pressure spring portion. Armature block having a movable contact base portion, a movable contact provided on the movable contact base portion and contacting and separating over a pair of fixed contacts, and a peripheral portion framed on the opposite side of the base substrate in the armature block a anchored cover part, the armature is a rectangular shape in a plane surrounded by the frame portion, the movable contact base portion, the lateral direction of the armature And longitudinally, are connected to the respective contact pressure spring portion at both ends in the longitudinal direction, a pair of fixed contacts have been arranged in the longitudinal direction of the armature, the longitudinal ends of the movable contact base portion, each movable contact is provided a planar shape is disposed across the pair of fixed contacts in a rectangular shape, the longitudinal direction of the intermediate portion of the movable contact base portion that you have been formed on the narrow than both end portions Features.

この発明によれば、可動接点の平面形状において幅が狭くなる部分（電路の断面積が小さくなる部分）が形成されているものに比べて、一対の固定接点間を短絡する可動接点の抵抗値を小さくすることができる。 According to the present invention, the resistance value of the movable contact that short-circuits the pair of fixed contacts as compared to the portion in which the width of the movable contact is reduced (the portion in which the cross-sectional area of the electric circuit is reduced) is formed. Can be reduced.

請求項１の発明は、可動接点基台部の長手方向の両端部には、それぞれ、平面形状が矩形状で一対の固定接点に跨って配置される可動接点が設けられ、可動接点基台部の長手方向の中間部は両端部に比べて細幅に形成されているので、可動接点の平面形状において幅が狭くなる部分（電路の断面積が小さくなる部分）が形成されているものに比べて、一対の固定接点間を短絡する可動接点の抵抗値を小さくすることができる。 According to the first aspect of the present invention , the movable contact base portion is provided with movable contacts disposed on both ends of the movable contact base portion in the longitudinal direction and having a rectangular planar shape and arranged across a pair of fixed contacts. Since the middle part in the longitudinal direction is narrower than both ends, compared to the part where the width of the movable contact is narrower (the part where the cross-sectional area of the electric circuit is smaller) is formed. Thus, the resistance value of the movable contact that short-circuits the pair of fixed contacts can be reduced.

以下、本発明を実施するための最良の形態について、図面を参照しながら説明する。   The best mode for carrying out the present invention will be described below with reference to the drawings.

本実施形態のマイクロリレーの基本構成は図２〜図８の例と略同じであって、図１に示すように一対の固定接点１４，１４がアーマチュア３０の長手方向（図１の左右方向）に並設されている点、可動接点基台部３４の形状、可動接点基台部３４に一対の固定接点１４，１４に接離可能な可動接点３９を２つ設けている点が相違する。他の構成は従来例と同様なので図示および説明を省略する。なお、本実施形態においても、図２〜図８の例と同様に、可動接点３９と固定接点１４との互いの対向面の一方に他方側へ突出する凸曲面を形成してあるので、従来例と同様に可動接点３９と固定接点１４との接触信頼性を向上できる。   The basic configuration of the microrelay of this embodiment is substantially the same as the example of FIGS. 2 to 8, and as shown in FIG. 1, the pair of fixed contacts 14, 14 is the longitudinal direction of the armature 30 (the left-right direction in FIG. 1). Are different from each other in that the movable contact base 34 is provided with two movable contacts 39 that can be connected to and separated from the pair of fixed contacts 14 and 14. Since other configurations are the same as those of the conventional example, illustration and description thereof are omitted. In the present embodiment as well, as in the examples of FIGS. 2 to 8, a convex curved surface protruding to the other side is formed on one of the opposing surfaces of the movable contact 39 and the fixed contact 14. As in the example, the contact reliability between the movable contact 39 and the fixed contact 14 can be improved.

本実施形態における可動接点基台部３４は長手方向の両端部それぞれに平面形状が矩形状で一対の固定接点１４に跨って配置される可動接点３９を設け、長手方向の中間部を両端部に比べて細幅に形成してある。   In the present embodiment, the movable contact base 34 is provided with a movable contact 39 that is disposed across the pair of fixed contacts 14 in a rectangular shape at both ends in the longitudinal direction, and has an intermediate portion in the longitudinal direction at both ends. It is formed narrower than that.

しかして、本実施形態のマイクロリレーでは、可動接点３９の平面形状において幅が狭くなる部分（電路の断面積が小さくなる部分）が形成されているものに比べて、一対の固定接点１４，１４間を短絡する可動接点３９の抵抗値を小さくすることができる。 Thus , in the microrelay of the present embodiment, the pair of fixed contacts 14 and 14 are compared with those in which the portion where the width is narrowed (the portion where the cross-sectional area of the electric circuit is reduced) is formed in the planar shape of the movable contact 39. The resistance value of the movable contact 39 which short-circuits between them can be made small.

本発明の実施形態の要部平面図である。It is a principal part top view of embodiment of this invention. マイクロリレーの一例を示し、（ａ）は分解斜視図、（ｂ）は可動接点が固定接点に接触した状態の要部断面図である。An example of a micro relay is shown, (a) is a disassembled perspective view, (b) is principal part sectional drawing of the state in which the movable contact contacted the fixed contact. 同上を示す斜視図である。It is a perspective view which shows the same as the above. 同上の要部分解斜視図である。It is a principal part exploded perspective view same as the above. 同上におけるアーマチュアブロックを示し、（ａ）は平面図、（ｂ）は下面図である。The armature block in the same as above is shown, (a) is a plan view and (b) is a bottom view. 同上におけるアーマチュアブロックの分解斜視図である。It is a disassembled perspective view of the armature block in the same as the above. 同上に用いるカバーの斜視図である。It is a perspective view of the cover used for the same as the above. 同上の他の構成例において可動接点が固定接点に接触した状態の要部断面図である。It is principal part sectional drawing of the state in which the movable contact contacted the fixed contact in the other structural example same as the above.

符号の説明Explanation of symbols

１ ベース基板
２ 電磁石装置
３ アーマチュアブロック
４ カバー
１４ 固定接点
３０ アーマチュア
３１ フレーム部
３２ 支持ばね部
３４ 可動接点基台部
３５ 接圧ばね部
３９ 可動接点 DESCRIPTION OF SYMBOLS 1 Base substrate 2 Electromagnet apparatus 3 Armature block 4 Cover 14 Fixed contact 30 Armature 31 Frame part 32 Supporting spring part 34 Movable contact base part 35 Contact pressure spring part 39 Movable contact

Claims (1)

電磁石装置を収納する収納部が形成され且つ厚み方向の一表面側に一対の固定接点が設けられたベース基板と、
ベース基板の前記一表面側に固着される枠状のフレーム部、および、フレーム部の内側に配置されて支持ばね部を介してフレーム部に揺動自在に支持され電磁石装置により駆動されるアーマチュア、および、アーマチュアに接圧ばね部を介して支持された可動接点基台部、および、可動接点基台部に設けられて一対の固定接点に跨って接離する可動接点を有するアーマチュアブロックと、
アーマチュアブロックにおけるベース基板とは反対側で周部がフレーム部に固着されたカバーとを備え、
アーマチュアはフレーム部に囲まれる面内での形状が長方形状であって、
可動接点基台部は、アーマチュアの短手方向を長手方向とし、長手方向での両端部においてそれぞれ接圧ばね部に連結され、
一対の固定接点はアーマチュアの長手方向に並設されていて、
可動接点基台部の長手方向の両端部には、それぞれ、平面形状が矩形状で一対の固定接点に跨って配置される可動接点が設けられ、
可動接点基台部の長手方向の中間部は両端部に比べて細幅に形成されていることを特徴とするマイクロリレー。 A base substrate in which a storage portion for storing an electromagnet device is formed and a pair of fixed contacts are provided on one surface side in the thickness direction;
A frame-like frame portion fixed to the one surface side of the base substrate, and an armature disposed inside the frame portion and supported by the frame portion through a support spring portion so as to be swingable and driven by an electromagnet device; And an armature block having a movable contact base portion supported by the armature via a contact pressure spring portion, and a movable contact provided on the movable contact base portion and contacting and separating over a pair of fixed contacts,
The armature block includes a cover on the side opposite to the base substrate and a peripheral portion fixed to the frame portion,
The armature is rectangular in the plane surrounded by the frame part,
The movable contact base portion has the longitudinal direction of the armature as the longitudinal direction, and is connected to the contact pressure spring portion at both ends in the longitudinal direction ,
A pair of fixed contacts are juxtaposed in the longitudinal direction of the armature ,
At both ends in the longitudinal direction of the movable contact base portion, there are provided movable contacts that are arranged across a pair of fixed contacts with a rectangular planar shape,
Longitudinal direction of the intermediate portion microrelay characterized that you have been formed in narrow compared to both end portions of the movable contact base portion.
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