JP4150647B2 - 電子部品の冷却装置 - Google Patents
電子部品の冷却装置 Download PDFInfo
- Publication number
- JP4150647B2 JP4150647B2 JP2003316868A JP2003316868A JP4150647B2 JP 4150647 B2 JP4150647 B2 JP 4150647B2 JP 2003316868 A JP2003316868 A JP 2003316868A JP 2003316868 A JP2003316868 A JP 2003316868A JP 4150647 B2 JP4150647 B2 JP 4150647B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- electronic component
- liquid refrigerant
- fin
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第5の発明に係る電子部品の冷却装置は、第1〜4のいずれかの発明の構成に加えて、空冷フィンは、コルゲートフィンである。
Claims (5)
- 液冷媒管路および空冷フィンを用いて、電子部品を冷却する装置であって、
被冷却体である電子部品の側面に接するように設けられ、液冷媒を流通させる液冷媒管路と、
液冷媒管路の側面であって、前記電子部品とは反対側の側面に設けられた空冷フィンとを含み、
前記液冷媒管路および前記空冷フィンの少なくともいずれか一方は、前記液冷媒管路と前記電子部品とが並べられた方向とは垂直な方向に弾性力を発生させる、電子部品の冷却装置。 - 複数の液冷媒管路および複数の空冷フィンを用いて、両面冷却電子部品を冷却する装置であって、
被冷却体である電子部品の両側面に接するように設けられ、液冷媒を流通させる一対の液冷媒管路と、
前記一対の液冷媒管路のそれぞれの側面であって、前記電子部品とは反対側の側面に設けられた一対の空冷フィンとを含み、
前記液冷媒管路および前記空冷フィンの少なくともいずれか一方は、前記液冷媒管路と前記電子部品とが並べられた方向とは垂直な方向に弾性力を発生させる、電子部品の冷却装置。 - 両面冷却電子部品は複数個が併設され、
前記一対の液冷媒管路および前記一対の空冷フィンは、予め定められた個数だけ併設される、請求項2に記載の電子部品の冷却装置。 - 両面冷却電子部品は複数個が併設され、
前記空冷フィン、前記液冷媒管路、前記両面冷却電子部品、前記液冷媒管路および前記空冷フィンの順序で並べられて構成されたユニットが予め定められた個数だけ併設され、
複数の前記ユニットが併設された両端には、前記液冷媒管路が設けられる、請求項2に記載の電子部品の冷却装置。 - 前記空冷フィンは、コルゲートフィンである、請求項1〜4のいずれかに記載の電子部品の冷却装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003316868A JP4150647B2 (ja) | 2003-09-09 | 2003-09-09 | 電子部品の冷却装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003316868A JP4150647B2 (ja) | 2003-09-09 | 2003-09-09 | 電子部品の冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005085998A JP2005085998A (ja) | 2005-03-31 |
JP4150647B2 true JP4150647B2 (ja) | 2008-09-17 |
Family
ID=34416632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003316868A Expired - Fee Related JP4150647B2 (ja) | 2003-09-09 | 2003-09-09 | 電子部品の冷却装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4150647B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4725536B2 (ja) * | 2007-03-05 | 2011-07-13 | 株式会社デンソー | 電力変換装置 |
JP5162518B2 (ja) * | 2009-04-10 | 2013-03-13 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP2013033773A (ja) * | 2009-11-24 | 2013-02-14 | Bosch Corp | 電子部品用冷却装置 |
JP5699659B2 (ja) * | 2011-02-10 | 2015-04-15 | トヨタ自動車株式会社 | 半導体素子の冷却構造 |
CN110517997A (zh) * | 2019-09-23 | 2019-11-29 | 常州常发制冷科技有限公司 | 电子元器件冷却装置 |
WO2022075199A1 (ja) * | 2020-10-08 | 2022-04-14 | 日立Astemo株式会社 | 発熱体冷却構造および電力変換装置 |
-
2003
- 2003-09-09 JP JP2003316868A patent/JP4150647B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2005085998A (ja) | 2005-03-31 |
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