JP4143666B2 - Icチップ実装パッケージ、及びこれを備えた画像表示装置 - Google Patents
Icチップ実装パッケージ、及びこれを備えた画像表示装置 Download PDFInfo
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- JP4143666B2 JP4143666B2 JP2006332593A JP2006332593A JP4143666B2 JP 4143666 B2 JP4143666 B2 JP 4143666B2 JP 2006332593 A JP2006332593 A JP 2006332593A JP 2006332593 A JP2006332593 A JP 2006332593A JP 4143666 B2 JP4143666 B2 JP 4143666B2
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- interposer substrate
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- liquid crystal
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Description
本発明に係る他の実施の形態について、図9に基づいて説明すれば以下の通りである。尚、本実施の形態では、上記実施の形態1との相違点について説明するため、説明の便宜上、実施の形態1で説明した部材と同一の機能を有する部材には同一の部材番号を付し、その説明を省略する。
2 フィルム基材(パッケージ基材)
3,3’ 液晶ドライバ(ICチップ)
3a 駆動信号出力用端子(電極)
3b 信号入力用端子(電極)
4a,4b インターポーザ基板
5,6 フィルム上配線
7 ソルダーレジスト
8 デバイスホール
11 第1アライメントマーク(第1位置決め部材)
12 第2アライメントマーク(第2位置決め部材)
12a マーク部材
12a−1〜12a−4 マーク部材
13 第1ギャップ測定用部材
14 第2ギャップ測定用部材
15 充填材
20 ガラス基板
21 信号配線
21a データ電極線
21b ゲート電極線
22 TFT
22 薄膜トランジスタ
23 画素電極
24 画素
25 アクティブマトリクス基板
26 液晶層
27 対向基板
30a 入力バンプ
30b 出力バンプ
40 液晶ドライバ接続用バンプ
41 フィルム基材接続用バンプ
45 出力端子部
46 入力端子部
47 外部配線基板
51 液晶ドライバ実装表示装置(画像表示装置)
52 液晶表示手段(画像表示体)
Claims (19)
- ICチップを、インターポーザ基板を介してパッケージ基材に実装したICチップ実装パッケージであって、
上記ICチップは、上記インターポーザ基板との対向面に、電極と、ICチップとインターポーザ基板との貼り合わせ位置を示す第1位置決め部材とを有しており、
上記インターポーザ基板は、上記ICチップとの対向面に、上記電極と電気的に接続するICチップ側接続端子と、上記パッケージ基材と電気的に接続するパッケージ基材側接続端子とを有する配線導体、及び上記第1位置決め部材と対を成す第2位置決め部材を有しており、
上記第1位置決め部材は、上記電極と同じ層に、該電極と同じ材料で形成されており、
上記第1位置決め部材と上記第2位置決め部材とは異なる形状であり、
上記ICチップとインターポーザ基板とが最適な位置で貼り合わされたときにICチップとインターポーザ基板との対向面に対して垂直な方向からみると、上記第1位置決め部材及び第2位置決め部材は、互いが、上記貼り合わせ位置として許容できる範囲の距離ほど離間した位置で観察されるように設けられており、
上記第1位置決め部材と第2位置決め部材との間の上記距離は少なくとも2種類あり、そのうちの一方は位置決めの許容誤差の限界を示しており、他方は一方の距離よりも短いことを特徴とするICチップ実装パッケージ。 - 上記第2位置決め部材は、上記配線導体と同じ層に、該配線導体と同じ材料で形成されていることを特徴とする請求項1に記載のICチップ実装パッケージ。
- ICチップを、インターポーザ基板を介してパッケージ基材に実装したICチップ実装パッケージであって、
上記ICチップは、上記インターポーザ基板との対向面に、電極と、ICチップとインターポーザ基板との貼り合わせ位置を示す第1位置決め部材とを有しており、
上記インターポーザ基板は、上記ICチップとの対向面に、上記電極と電気的に接続するICチップ側接続端子と、上記パッケージ基材と電気的に接続するパッケージ基材側接続端子とを有する配線導体、及び上記第1位置決め部材と対を成す第2位置決め部材を有しており、
上記第2位置決め部材は、上記配線導体と同じ層に、該配線導体と同じ材料で形成されており、
上記第1位置決め部材と上記第2位置決め部材とは異なる形状であり、
上記ICチップとインターポーザ基板とが最適な位置で貼り合わされたときにICチップとインターポーザ基板との対向面に対して垂直な方向からみると、上記第1位置決め部材及び第2位置決め部材は、互いが、上記貼り合わせ位置として許容できる範囲の距離ほど離間した位置で観察されるように設けられており、
上記第1位置決め部材と第2位置決め部材との間の上記距離は少なくとも2種類あり、そのうちの一方は位置決めの許容誤差の限界を示しており、他方は一方の距離よりも短いことを特徴とするICチップ実装パッケージ。 - 上記ICチップにおける上記インターポーザ基板との対向面は、四角形であり、
上記第1位置決め部材は、上記四角形の4つの角領域内に設けられていることを特徴とする請求項1から3の何れか1項に記載のICチップ実装パッケージ。 - 上記ICチップにおける上記インターポーザ基板との対向面は、四角形であり、
上記第1位置決め部材は、上記四角形における中心を挟んで対向する2つの角領域内に設けられていることを特徴とする請求項1から3の何れか1項に記載のICチップ実装パッケージ。 - 上記ICチップにおける上記インターポーザ基板との対向面は、長方形であり、
上記角領域内とは、該長方形の角から、長方形の長辺の10分の1の長さまでの範囲であって、且つ、該長方形の角から、長方形の短辺の5分の1の長さまでの範囲で示される領域内であることを特徴とする請求項4または5に記載のICチップ実装パッケージ。 - 上記ICチップの上記対向面における中心を挟んで対向する2つの角領域内に設けられた上記第1位置決め部材の各々は、異なる形状を有していることを特徴とする請求項4に記載のICチップ実装パッケージ。
- 上記2つの角領域内のうちの一方の角領域内に設けられた上記第1位置決め部材の形状は、一方の角領域内に設けられた上記第1位置決め部材と対をなす上記第2位置決め部材と同じ形状であることを特徴とする請求項7に記載のICチップ実装パッケージ。
- 上記第1位置決め部材及び第2位置決め部材のうちの一方は、複数の位置決め体から構成されており、
上記垂直な方向からみると、上記位置決め体が、上記第1位置決め部材及び第2位置決め部材のうちの他方を囲むように配されていることを特徴とする請求項1から8の何れか1項に記載のICチップ実装パッケージ。 - 複数の上記位置決め体は、上記他方の位置決め部材を挟むようにして2対設けられており、
上記2対のうちの一方の対は、位置決めの許容限界を示す距離ほど該他方の位置決め部材から離間しており、他方の対は、該距離よりも短い距離で該他方の位置決め部材から離間していることを特徴とする請求項9に記載のICチップ実装パッケージ。 - 上記位置決め体は正方形であり、上記他方の位置決め部材は2つの長方形がそれぞれの中心で垂直に交差した十字形状であり、
上記位置決め体は、上記十字形状の中心に上記正方形の1つの角を向けるように、上記十字形状の中心から分岐した部分と、該部分と隣り合う同じく該中心から分岐した部分との間のそれぞれに配置されていることを特徴とする請求項9または10に記載のICチップ実装パッケージ。 - 上記第1位置決め部材及び第2位置決め部材は、材質に金属を含み、
上記ICチップ及びインターポーザ基板を上記垂直な方向からみたとき、上記第1位置決め部材及び第2位置決め部材の配設位置においては、材質に金属を含む部材は第1位置決め部材及び第2位置決め部材のみであることを特徴とする請求項11に記載のICチップ実装パッケージ。 - 対をなす上記第1位置決め部材及び第2位置決め部材は、互いが接触するように上記ICチップ及びインターポーザ基板の対向面から突出した導電性の突起を有しており、各突起には外部に続く配線が設けられていることを特徴とする請求項1から12の何れか1項に記載のICチップ実装パッケージ。
- 上記電極と、上記ICチップ側接続端子とはバンプを介して電気的に接続されており
上記第1位置決め部材及び第2位置決め部材は、ICチップとインターポーザ基板との対向面間のギャップを測定するためのギャップ測定用部材を兼ねており、光を反射させる材料から構成され、且つ上記ICチップとインターポーザ基板との対向面に対して垂直な方向からみたときに面積が少なくとも15μm 2 であることを特徴とする請求項1から13の何れか1項に記載のICチップ実装パッケージ。 - 上記電極と、上記ICチップ側接続端子とはバンプを介して電気的に接続されており、
上記ICチップは、上記インターポーザ基板との対向面に、ICチップとインターポーザ基板との対向面間のギャップを測定するための第1ギャップ測定用部材を有しており、
上記インターポーザ基板は、上記ICチップとの対向面に、第1ギャップ測定用部材と対を成す第2ギャップ測定用部材を有しており、
上記第1ギャップ測定用部材及び上記第2ギャップ測定用部材は、光を反射させる材料から構成され、且つ上記ICチップとインターポーザ基板との対向面に対して垂直な方向からみたときに面積が少なくとも15μm 2 であることを特徴とする請求項1から14の何れか1項に記載のICチップ実装パッケージ。 - 上記第1ギャップ測定用部材及び第2ギャップ測定用部材は、ICチップとインターポーザ基板との対向面に対して垂直な方向からみたときに、並んで観察されるように設けられていることを特徴とする請求項15に記載のICチップ実装パッケージ。
- 上記電極と、上記ICチップ側接続端子とはバンプを介して電気的に接続されており、
上記ICチップにおける上記インターポーザ基板との対向位置に、ICチップとインターポーザ基板との対向面間のギャップを測定するための第1ギャップ測定用部材を有しており、
上記インターポーザ基板における上記ICチップとの対向位置に、第1ギャップ測定用部材と対を成す第2ギャップ測定用部材を有しており、
上記第1ギャップ測定用部材及び第2ギャップ測定用部材は、ICチップとインターポーザ基板との対向面に対して垂直な方向からみたときに、上記ICチップにおける上記2つの角領域内とは異なる2つの角領域内で観察される位置に配設されており、
上記第1ギャップ測定用部材及び上記第2ギャップ測定用部材は、光を反射させる材料から構成され、且つ上記ICチップとインターポーザ基板との対向面に対して垂直な方向からみたときに面積が少なくとも15μm 2 であることを特徴とする請求項5に記載のICチップ実装パッケージ。 - 上記インターポーザ基板は、電気回路が形成された半導体基板であり、
上記第1ギャップ測定用部材及び第2ギャップ測定用部材は、半導体を透過する光を反射させる材料から構成されることを特徴とする請求項15から17の何れか1項に記載のICチップ実装パッケージ。 - 請求項1から18の何れか1項に記載のICチップ実装パッケージと、
上記ICチップ実装パッケージの上記パッケージ基材に接続され、上記ICチップから出力される信号を用いて画像表示を行う表示画像表示体とを備えたことを特徴とする画像表示装置。
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