JP4116606B2 - Mounting method of image sensor and adhesive tape used therefor - Google Patents

Mounting method of image sensor and adhesive tape used therefor Download PDF

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JP4116606B2
JP4116606B2 JP2004316103A JP2004316103A JP4116606B2 JP 4116606 B2 JP4116606 B2 JP 4116606B2 JP 2004316103 A JP2004316103 A JP 2004316103A JP 2004316103 A JP2004316103 A JP 2004316103A JP 4116606 B2 JP4116606 B2 JP 4116606B2
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adhesive tape
image sensor
adhesive
tape
mounting
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JP2005340752A (en
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広行 近藤
均 高野
正 寺島
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to TW94109066A priority patent/TWI407560B/en
Priority to SG200902893-7A priority patent/SG152276A1/en
Priority to SG200502444A priority patent/SG116634A1/en
Priority to KR1020050035040A priority patent/KR100922663B1/en
Priority to MYPI20051850 priority patent/MY140165A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of mounting an image sensor with high workability, safety and productivity, while an image sensor surface is protected, and a protective adhesive tape having high heat shrinkability, proper adhesion, visibility and fissile property on the entire tape applicable in mounting of these image sensors. <P>SOLUTION: In the mounting process of the image sensors using solid image devices, an adhesive tape with polyethylene naphthalate (PEN) as a base material having a protrusion for exfoliation on at least a part of the periphery and having an adhesive layer on at least one surface is affixed to the light receiving section of the image sensor. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

本発明は、固体撮像デバイスを用いた映像センサの実装工程に関するものである。   The present invention relates to a mounting process of a video sensor using a solid-state imaging device.

現在、固体撮像デバイスの製造工程において、実装および製造工程における映像センサ表面へのゴミの付着、傷つきを防止するために、映像センサの受光部側に対して粘着層を有する表面保護フィルムを貼り合せる手法が採られている。   Currently, in the manufacturing process of solid-state imaging devices, a surface protective film having an adhesive layer is attached to the light receiving part side of the image sensor in order to prevent dust from adhering to the surface of the image sensor during mounting and manufacturing processes. The technique is taken.

このとき、部品実装工程は、映像センサの端子部と実装基板を位置合わせした状態で半田リフロー炉へ投入することによって、一度に実装処理する方法が用いられることが多くなり、半田付け等の高温領域での工程が含まれるため、保護フィルムおよび粘着層には、耐熱性が要求される。しかし、現状の表面保護粘着テープの多くは、上記工程に相当する耐熱性を有さないため、部品の実装工程の際に一度表面保護粘着テープが剥され、部品実装工程後に、再度、別途表面保護粘着テープを貼り合せることになる。   At this time, in the component mounting process, a method of mounting processing at a time is often used by putting it in a solder reflow furnace in a state where the terminal portion of the video sensor and the mounting substrate are aligned, and high temperature such as soldering is used. Since the process in the region is included, the protective film and the adhesive layer are required to have heat resistance. However, since most of the current surface protective adhesive tapes do not have the heat resistance equivalent to the above process, the surface protective adhesive tape is peeled off once during the component mounting process, and again after the component mounting process, A protective adhesive tape will be attached.

また、ポリイミドを主成分とした高耐熱性を有するフィルムを用いた表面保護用粘着テープを用いる手法も採用されているが、ポリイミドフィルムが茶褐色の色相を有するために、視認性が悪く、部品実装後の光学検査を行う際の全光線透過率が低い。そのため、テープ貼付形態での光学検査は困難である。   In addition, a method using a surface-protective adhesive tape using a high heat-resistant film mainly composed of polyimide has also been adopted, but since the polyimide film has a brownish hue, the visibility is poor and component mounting Low total light transmittance when performing subsequent optical inspection. For this reason, optical inspection in a tape application form is difficult.

さらに、ポリエチレンテレフタレート（以下「ＰＥＴ」という。）のような透明性に秀でたフィルムを使用する手法も取られているが、１８０℃といった高温条件では、フィルムの熱収縮よって粘着テープが剥離してしまうため、粘着テープの持つ粘着力を高くする必要がある。しかし、この方法では、加熱後冷却された粘着テープの被着体である映像センサ受光部のガラス表面への粘着力が上昇するため、粘着テープの粘着層の破壊が生じ、被着体表面に粘着層を残してしまい不具合となる。   In addition, a technique using a film having excellent transparency such as polyethylene terephthalate (hereinafter referred to as “PET”) is also used, but the adhesive tape peels off due to heat shrinkage of the film under high temperature conditions such as 180 ° C. Therefore, it is necessary to increase the adhesive strength of the adhesive tape. However, in this method, since the adhesive force to the glass surface of the image sensor light receiving portion which is the adherend of the adhesive tape cooled after heating is increased, the adhesive layer of the adhesive tape is broken, and the adherend surface is exposed. The adhesive layer is left and becomes a problem.

従って、本発明は、固体撮像デバイスの製造工程において、映像センサの受光側に粘着テープを貼りあわせたままの状態で半田リフローのための加熱工程を経ることで、半田リフロー工程前後での粘着テープの貼り替え作業を必要としないことを可能とすることが重要な課題であり、映像センサ表面を異物による汚染、傷つきから保護するとともに、半田付け等の加熱条件下での部品実装工程および部品実装後の内部検査工程においてもテープの剥離を行わずに作業が可能な、作業性、安全性、生産性の高い映像センサの実装方法を提供することを目的とする。併せて、こうした映像センサの実装時に使用が可能な、熱収縮性が小さく、適正な粘着力を有するとともに、テープ全体が優れた視認性、かつ剥離性を有する保護用粘着テープを提供することを目的とする。   Therefore, the present invention provides a pressure-sensitive adhesive tape before and after the solder reflow process by performing a heating process for solder reflow in a state where the pressure-sensitive adhesive tape is stuck to the light receiving side of the image sensor in the manufacturing process of the solid-state imaging device. It is important to make it possible to eliminate the need for re-attachment of the image sensor. The image sensor surface is protected from contamination and scratches by foreign matter, and the component mounting process and component mounting under heating conditions such as soldering It is an object of the present invention to provide a mounting method of a video sensor with high workability, safety, and productivity that can be performed without peeling the tape in a later internal inspection process. In addition, the present invention provides a protective adhesive tape that can be used when mounting such a video sensor, has low heat shrinkability, has an appropriate adhesive force, and has excellent visibility and peelability of the entire tape. Objective.

本発明者らは、前記課題を解決すべく鋭意検討を重ねた結果、以下に示す実装方法あるいは粘着テープの使用により前記目的を達成することができることを見出し、本発明を完成するに至った。   As a result of intensive studies to solve the above problems, the present inventors have found that the object can be achieved by using a mounting method or an adhesive tape described below, and have completed the present invention.

すなわち、本発明は、映像センサの実装方法であって、固体撮像デバイスを用いた映像センサの実装工程において、ポリエチレンナフタレートを基材とし、その外周の少なくとも一部に剥離用の突起部を有し、かつ、少なくとも片面に粘着層を有する粘着テープであって、映像センサの端面と平行し、前記突起部の末底と繋がる辺部を有するとともに、突起部の先端から末底に繋がる側部が、斜線状、折れ線状、曲線状あるいはこれらの組み合わせのいずれかの形状を有するものを、前記映像センサの受光部に貼り合せた状態で、映像センサの端子部を基板側と半田接続リフローすることを特徴とする。 That is, the present invention is a video sensor mounting method in which a polyethylene naphthalate is used as a base material and a peeling projection is provided on at least a part of the outer periphery in a video sensor mounting process using a solid-state imaging device. And an adhesive tape having an adhesive layer on at least one side, having a side parallel to the end face of the image sensor and connected to the terminal bottom of the protrusion, and a side connected to the terminal bottom from the tip of the protrusion However, in a state where a diagonal line, a broken line, a curved line, or a combination thereof is bonded to the light receiving part of the video sensor, the terminal part of the video sensor is soldered to the substrate side and reflowed. It is characterized by that.

上記方法によれば、従来の機能である部品搬送時における異物による汚染や傷からガラス面を保護する性能を有するとともに、ＰＥＴが有する耐熱性によって、従前のような部品実装前のテープ剥しを行う必要をなくすことができる。また、基材の収縮率が小さいために、粘着テープの熱収縮による剥離を防ぐことができるとともに、従来のテープよりも低い粘着力でのテープ設計が可能となり、部品実装後のテープの剥離の際に、被着体表面に粘着剤を残存させることがなく作業効率が上昇する。   According to the above method, the conventional function is to protect the glass surface from contamination and scratches caused by foreign matters during component transportation, and the heat resistance of PET removes the tape before mounting the component as before. You can eliminate the need. In addition, since the shrinkage rate of the base material is small, it is possible to prevent peeling due to thermal shrinkage of the adhesive tape, and it is possible to design a tape with a lower adhesive force than conventional tapes. At this time, the working efficiency is increased without leaving the adhesive on the surface of the adherend.

さらに、テープの透過率が高いために、部品実装後の内部検査を行う際にも、テープの剥離を伴うことなく検査を行うことができる。従って、固体撮像デバイスの部品実装後の検査工程において、粘着テープによる透過率の減衰による検査工程への障害が軽減され、粘着テープを貼り合せた状態での検査が可能となる。その結果、検査後粘着テープの再貼り付け等の工程が不要となる。また、検査後搬送等の工程においても、粘着テープを貼り合わせた状態での出荷が可能となることで、安全性が確保される。さらに、粘着テープを貼り合わせた状態での一貫工程が可能となることで、生産性の向上が実現できる。また、その外周の少なくとも一部に剥離用の突起部を有することによって、検査などの製作工程終了後あるいは使用直前において、非常に容易にテープを剥すことができる。このとき、映像センサの実装状態において、粘着テープが隣接する部品の実装あるいは半田付けなどに支障とならないことが好ましい。   Furthermore, since the transmittance of the tape is high, the inspection can be performed without peeling of the tape when performing the internal inspection after mounting the components. Therefore, in the inspection process after mounting the components of the solid-state imaging device, the obstacle to the inspection process due to the attenuation of the transmittance due to the adhesive tape is reduced, and the inspection with the adhesive tape attached can be performed. As a result, a process such as re-sticking of the adhesive tape after the inspection becomes unnecessary. Moreover, also in processes such as post-inspection transport, safety is ensured by enabling shipment with the adhesive tape attached. Furthermore, productivity can be improved by enabling an integrated process with the adhesive tape attached. Further, by having a peeling projection on at least a part of the outer periphery, the tape can be peeled off very easily after the production process such as inspection or just before use. At this time, it is preferable that the adhesive tape does not interfere with the mounting or soldering of adjacent components in the mounted state of the video sensor.

前記粘着テープは、映像センサの端面と平行し、前記突起部の末底と繋がる辺部を有するとともに、突起部の先端から末底に繋がる側部が、斜線状、折れ線状、曲線状あるいはこれらの組み合わせのいずれかの形状を有することを特徴とする。The adhesive tape has a side portion that is parallel to the end face of the image sensor and is connected to the bottom end of the projection portion, and a side portion that is connected from the tip end of the projection portion to the bottom end is an oblique line, a broken line shape, a curved line shape, It has a shape of any combination of the above.

上記のように、粘着テープは、検査などの製作工程終了後あるいは使用直前において容易に剥離できることが好ましい。しかしながら、粘着テープの固定には、所定の粘着力を必要とする一方、あまりに粘着力が強いと粘着テープを剥離するときに粘着剤の残留のおそれがあることから、粘着力の条件は特定の範囲に限定される。特に、突起部を設けた粘着テープの剥離においては、突起部を挟み引き上げることとなり、その際に粘着テープの亀裂が生じやすくなることから、本発明においては、突起部の先端から末底に繋がる側部が、斜線状、折れ線状、曲線状あるいはこれらの組み合わせのいずれかの形状を有することによって、映像センサからの円滑なテープの剥離が可能となることを見出したものである。As described above, it is preferable that the adhesive tape can be easily peeled off after the production process such as inspection or just before use. However, fixing the adhesive tape requires a predetermined adhesive strength, but if the adhesive strength is too strong, the adhesive may remain when the adhesive tape is peeled off. Limited to range. In particular, in the peeling of the adhesive tape provided with the protruding portion, the protruding portion is sandwiched and pulled up, and the adhesive tape is liable to crack at that time, and in the present invention, the leading end of the protruding portion is connected to the bottom. It has been found that the tape can be smoothly peeled off from the image sensor by having the side portion having any one of a diagonal line shape, a broken line shape, a curved line shape, or a combination thereof.

本発明は、上記映像センサの実装方法であって、前記粘着テープが、映像センサの受光部全体を被覆するとともに、その外周部の少なくとも一部が映像センサの端面から中心側に所定の距離を有するように、前記受光部に貼り合せることを特徴とする。   The present invention is the mounting method of the video sensor, wherein the adhesive tape covers the entire light receiving portion of the video sensor, and at least a part of the outer peripheral portion has a predetermined distance from the end surface of the video sensor to the center side. It is characterized by being bonded to the light receiving part.

映像センサの保護には、受光部を全面的に覆うテープの形状であることが必要である一方、テープの外周部が映像センサの端面を大きくはみ出る場合には粘着テープが隣接する部品の実装あるいは半田付けなどに支障となる。つまり、粘着テープは受光部を全面的に覆う必要があるとともに、極力最小であることが好ましい。従って、上記突起部以外の粘着テープの外周部は、少なくともその一部、好ましくはその多くの部分が映像センサの端面から中心側に所定の距離を有するように、前記受光部に貼り合せることが好ましい。   In order to protect the image sensor, it is necessary to have the shape of a tape that covers the entire surface of the light receiving unit. This will hinder soldering. That is, the adhesive tape needs to cover the entire light receiving portion and is preferably as small as possible. Therefore, the outer peripheral portion of the adhesive tape other than the protrusions may be bonded to the light receiving portion so that at least a part thereof, preferably a large portion thereof, has a predetermined distance from the end face of the image sensor to the center side. preferable.

また、映像センサの端面と受光部の外周部との間は、通常非常に短い距離となることから、映像センサの実装においては、粘着テープの貼り付け位置が重要となり、自動的に貼り付けられた場合であっても、貼り付け位置の確認は必要となる。従って、映像センサの端面と平行し前記突起部の末底と繋がる辺部を有する粘着テープによって、テープの貼り付け位置を明確にすることができることから、正確かつ効率的な映像センサの実装を確保することができる。   Also, since the distance between the end face of the image sensor and the outer periphery of the light receiving unit is usually a very short distance, the mounting position of the adhesive tape is important in mounting the image sensor and is automatically applied. Even in such a case, it is necessary to confirm the pasting position. Therefore, the tape attachment position can be clarified by an adhesive tape having a side part that is parallel to the end face of the image sensor and connected to the bottom of the projection, thus ensuring accurate and efficient image sensor mounting. can do.

本発明は、上記映像センサの実装方法であって、前記粘着テープにおいて、前記映像センサの受光部に掛かる部分に粘着層を設けないことを特徴とする。   The present invention is the above video sensor mounting method, wherein an adhesive layer is not provided on a portion of the adhesive tape that covers a light receiving portion of the video sensor.

本発明においては、映像センサの保護用粘着テープに関し、基材および粘着層を工夫することで粘着テープを貼り合わせた状態での一貫工程を図るものであり、さらに、当該粘着テープの受光部に対応する部分に粘着層を設けないことにより、部品実装後のテープ剥離の際に被着体表面に粘着剤を残存することがなく作業効率が上昇することを案出したものである。つまり、映像センサの実装工程において、映像センサの受光部側に少なくとも耐熱性のあるフィルムを基材構成材料として用い、かつ受光部分には粘着層を設けない構成の粘着テープを貼りあわせた状態で、１７０℃以上の加熱工程を経ることによって、作業性、安全性、生産性の高い映像センサの実装方法を提供することが可能となる。   In the present invention, the adhesive tape for protecting the image sensor is intended to perform an integrated process in a state in which the adhesive tape is bonded by devising the base material and the adhesive layer, and further to the light receiving portion of the adhesive tape. By not providing the adhesive layer in the corresponding part, it has been devised that the working efficiency is increased without the adhesive remaining on the surface of the adherend when the tape is peeled after the component mounting. In other words, in the mounting process of the image sensor, at least a heat-resistant film is used as the base material constituting the light receiving part side of the image sensor, and an adhesive tape having a structure in which an adhesive layer is not provided on the light receiving part is attached. By passing through a heating process at 170 ° C. or higher, it is possible to provide a mounting method for a video sensor with high workability, safety, and productivity.

また、本発明は、上記映像センサの実装方法であって、前記粘着テープに用いる基材の１５０℃における熱収縮率が、１．０％以下であることを特徴とする。   In addition, the present invention is a method for mounting the above-described image sensor, characterized in that a base material used for the adhesive tape has a heat shrinkage rate at 150 ° C. of 1.0% or less.

つまり、上記のように、粘着テープの熱収縮による剥離を防ぐには基材の収縮率が小さいことが好ましく、映像センサの実装においては基材の収縮率を上記の範囲にすることが好適であるとの知見を得たもので、これによって、従来のテープよりも低い粘着力でのテープ設計が可能となり、部品実装後のテープの剥離の際に、被着体表面に粘着剤を残存させることがなく作業効率が上昇する。   That is, as described above, the shrinkage rate of the base material is preferably small in order to prevent peeling due to thermal shrinkage of the adhesive tape, and the shrinkage rate of the base material is preferably within the above range in mounting an image sensor. With this knowledge, it is possible to design a tape with a lower adhesive strength than conventional tapes, and leave the adhesive on the surface of the adherend when the tape is peeled off after component mounting. Work efficiency is improved without any problems.

さらに、本発明は、上記映像センサの実装方法であって、１８０℃の加熱を１時間実施した後の前記粘着テープの熱収縮率が、１．０％以下であることを特徴とする。   Furthermore, the present invention is the above video sensor mounting method, characterized in that the heat shrinkage rate of the adhesive tape after heating at 180 ° C. for 1 hour is 1.0% or less.

つまり、上記のように、映像センサの実装においては基材の収縮率が小さいことが好ましく、特に半田付け等の高温領域での工程を含むことから、高温条件下での基材の収縮率を上記の範囲にすることが好適であるとの知見を得たもので、こうした付加的条件を明確にすることで、さらに作業効率が上昇する。   In other words, as described above, in the mounting of the image sensor, it is preferable that the shrinkage rate of the base material is small, and in particular, since it includes a process in a high temperature region such as soldering, the shrinkage rate of the base material under high temperature conditions is reduced. The knowledge that it is suitable to be in the above range has been obtained, and by clarifying such additional conditions, the working efficiency is further increased.

また、本発明は、上記映像センサの実装方法であって、１８０℃の加熱を１時間実施した後の前記粘着テープの粘着力が、０．１〜８．０Ｎ／１９ｍｍ幅であることを特徴とする。   Further, the present invention is the above-described image sensor mounting method, wherein the adhesive strength of the adhesive tape after heating at 180 ° C. for 1 hour is 0.1 to 8.0 N / 19 mm width. And

つまり、粘着テープの剥離を防ぐには、所定以上の粘着力が必要である一方、被着体からテープを剥離した後の粘着層の残存を防ぐには、所定以下の粘着力とする必要がある。特に、高温領域での実装工程を含む場合にあっては、加熱条件下での粘着テープの粘着力を上記の範囲にすることが好適であるとの知見を得たもので、これによって、粘着テープの機能を損なわず、かつ、部品実装後のテープの剥離の際に、被着体表面に粘着剤を残存させることがなく作業効率が上昇する。   That is, in order to prevent peeling of the adhesive tape, an adhesive force of a predetermined level or more is required. On the other hand, in order to prevent the adhesive layer from remaining after the tape is peeled from the adherend, it is necessary to have an adhesive force of a predetermined level or less. is there. In particular, in the case of including a mounting process in a high temperature region, it has been found that the adhesive strength of the adhesive tape under heating conditions is preferably within the above range. The work efficiency is increased without deteriorating the function of the tape and without leaving the adhesive on the surface of the adherend when the tape is peeled off after mounting the components.

また、本発明は、上記映像センサの実装方法であって、前記粘着テープの光透過率が、５０％以上であることを特徴とする。   In addition, the present invention is the above-described video sensor mounting method, wherein the light transmittance of the adhesive tape is 50% or more.

上記のように、映像センサの実装においては、部品実装後の内部を光学検査する際にも、粘着テープの剥離を伴うことなく検査を行うことが好ましい。つまり、粘着テープの光透過率を所定値以上確保することで、光学検査する際にも、こうした機能を保持することができる。その結果、検査後粘着テープの再貼り付け等の工程が不要となり、検査後搬送等の工程にも粘着テープを貼り合わせた状態での出荷が可能となることで、安全性が確保される。また、粘着テープを貼り合わせた状態での一貫工程が可能となることで、生産性の向上が実現できる。   As described above, in mounting the video sensor, it is preferable to perform the inspection without peeling off the adhesive tape even when the inside after the component mounting is optically inspected. In other words, by securing the light transmittance of the adhesive tape to a predetermined value or more, such a function can be maintained even during optical inspection. As a result, a process such as re-adhesion of the adhesive tape after the inspection is not required, and the shipment in a state where the adhesive tape is bonded to the process such as the conveyance after the inspection is possible, thereby ensuring safety. Further, productivity can be improved by enabling an integrated process with the adhesive tape attached.

本発明は、上記のいずれかの映像センサの実装方法に用いる粘着テープであって、ポリエチレンナフタレートを基材とし、その外周の少なくとも一部に剥離用の突起部を有し、かつ、少なくとも片面に粘着層を有すると共に、前記映像センサの端面と平行し、前記突起部の末底と繋がる辺部を有するとともに、突起部の先端から末底に繋がる側部が、斜線状、折れ線状、曲線状あるいはこれらの組み合わせのいずれかの形状を有することを特徴とする。 The present invention is an adhesive tape for use in any of the above video sensor mounting methods , comprising polyethylene naphthalate as a base material, having a peeling projection on at least a part of its outer periphery, and at least one side And having a side portion that is parallel to the end face of the image sensor and that is connected to the terminal bottom of the protrusion, and a side portion that is connected from the tip of the protrusion to the terminal bottom is an oblique line, a polygonal line, or a curved line. Or a combination of these .

上記の実装方法には、映像センサ表面を異物による汚染、傷つきから保護するとともに、半田付け等の加熱条件下での部品実装工程および部品実装後の内部検査工程においてもテープの剥離を行わずに作業が可能な粘着テープが要求される。本発明では、ポリエチレンナフタレートを基材とする、優れた熱収縮性、粘着性、かつ視認性を有する表面保護用の粘着テープを提供することによって、こうした要求を満たすことが可能となる。   In the above mounting method, the surface of the image sensor is protected from contamination and scratches by foreign substances, and the tape is not peeled off during the component mounting process under heating conditions such as soldering and the internal inspection process after mounting the component. An adhesive tape capable of working is required. In the present invention, it is possible to satisfy these demands by providing a surface protecting pressure-sensitive adhesive tape having polyethylene naphthalate as a base material and having excellent heat shrinkability, adhesiveness and visibility.

以上のように、本発明によれば、固体撮像デバイスの部品などの実装工程あるいは検査工程などにおいて、粘着テープを貼り合わせた状態で一貫工程が可能となることで、映像センサ表面を保護しつつ、作業性、安全性、生産性の高い映像センサの実装方法を提供することが可能となる。併せて、こうした映像センサの実装時に使用が可能な、熱収縮性が小さく、適正な粘着力を有するとともに、テープ全体が優れた視認性、かつ剥離性を有する保護用粘着テープを提供することが可能となる。   As described above, according to the present invention, in the mounting process or the inspection process of the components of the solid-state imaging device, the integrated process can be performed in a state where the adhesive tape is bonded, thereby protecting the surface of the video sensor. Therefore, it is possible to provide a mounting method of a video sensor with high workability, safety, and productivity. In addition, it is possible to provide a protective pressure-sensitive adhesive tape that can be used when mounting such a video sensor, has low heat shrinkability, has an appropriate adhesive force, and has excellent visibility and peelability as a whole. It becomes possible.

以下、本発明の実施の形態について説明する。   Embodiments of the present invention will be described below.

本発明の粘着テープは、基本的に、テープ基材および基材の片面に設けられた粘着層から形成されるが、粘着テープの基材に対し離型フィルムを貼り合わせていてもよい。つまり、少なくとも１つの面に離型処理を施した離型フィルムを、粘着層を介して粘着テープの基材に貼りつけることで、粘着層を保護し映像センサ表面の保護を図ることができる。   The pressure-sensitive adhesive tape of the present invention is basically formed from a tape base material and a pressure-sensitive adhesive layer provided on one side of the base material, but a release film may be bonded to the base material of the pressure-sensitive adhesive tape. That is, by attaching a release film having a release treatment on at least one surface to a base material of an adhesive tape via an adhesive layer, the adhesive layer can be protected and the image sensor surface can be protected.

このとき、粘着テープの外周の少なくとも一部に剥離用の突起部を有することが好ましい。具体的には、図１に例示するように映像センサ１の受光部２に粘着テープ３が貼り合された状態において、粘着テープ３の一部を形成する突起部３ａが映像センサ１の端面１ａをはみ出すような形態となっている。こうした形態で、映像センサ１が基板に取り付けられ、高温の半田リフローを通過して実装処理した後、映像センサ１の動作あるいは実装基板の機能を検査される。製作工程終了後あるいは使用直前において、自動的にあるいは手動によって非常に容易に粘着テープ３を剥すことができる。   At this time, it is preferable to have a protrusion for peeling on at least a part of the outer periphery of the adhesive tape. Specifically, as illustrated in FIG. 1, in a state where the adhesive tape 3 is bonded to the light receiving portion 2 of the video sensor 1, the protrusion 3 a that forms a part of the adhesive tape 3 is the end surface 1 a of the video sensor 1. It has a form that protrudes. In such a form, the video sensor 1 is attached to the board, and after passing through high-temperature solder reflow and mounting processing, the operation of the video sensor 1 or the function of the mounting board is inspected. The adhesive tape 3 can be peeled off very easily automatically or manually after the production process is completed or immediately before use.

粘着テープ３の貼り付け位置は、その外周部の一部が映像センサ１の端面と受光部２の中間にあることが好ましい。つまり、粘着テープ３の幅が受光部２の幅よりも大きく、かつ映像センサ１の幅よりも小さいことが好ましい。さらには、図１に示すように、突起部３ａが覆う映像センサ１の辺部１ｂを除く粘着テープ３の全ての外周部において、映像センサ１の端面と受光部２の中間にあることが好ましい。粘着テープ３によって受光部２を全面的に覆うことができるとともに、映像センサ１実装時に、周辺の部材への粘着テープのカバーを防止することができる。ただし、映像センサ１の基板などの実装状態において、基板周囲に他の実装部分がなく半田付けを必要としない空間がある場合には、その外周部の一部が映像センサ１の端面と受光部２の中間にあれば十分であり、必ずしも全周に要求されるものではない。   It is preferable that a part of the outer peripheral part of the adhesive tape 3 is attached between the end face of the image sensor 1 and the light receiving part 2. That is, the width of the adhesive tape 3 is preferably larger than the width of the light receiving unit 2 and smaller than the width of the image sensor 1. Furthermore, as shown in FIG. 1, it is preferable that the outer peripheral portion of the adhesive tape 3 except the side portion 1 b of the video sensor 1 covered by the protruding portion 3 a is intermediate between the end face of the video sensor 1 and the light receiving portion 2. . The light receiving unit 2 can be covered entirely with the adhesive tape 3, and the cover of the adhesive tape on the peripheral members can be prevented when the image sensor 1 is mounted. However, in the mounted state of the image sensor 1 such as the substrate, when there is a space around the substrate that does not require other mounting and does not require soldering, a part of the outer peripheral portion is the end surface of the image sensor 1 and the light receiving portion. It is sufficient if it is in the middle of 2 and is not necessarily required for the entire circumference.

また、粘着テープ３の形状を図２に例示する。上記のような条件から、基本的には、映像センサ１あるいは受光部２と略相似形のテープの主要部分に突起部３ａを付加した形状や、映像センサ１あるいは受光部２を包含するテープの主要部分に突起部３ａを付加した形状であれば特に限定されないが、例えば、図２（Ａ）のような略正方形や図２（Ｂ）のような略長方形などの一辺に突起部３ａが設けた形状などが挙げられる。また、円や楕円状のテープの主要部分の一部に突起部３ａを設けた形状など、映像センサ１あるいは受光部２の形状にあった形状を適用することができる。   Moreover, the shape of the adhesive tape 3 is illustrated in FIG. From the above conditions, basically, a shape in which a protrusion 3a is added to a main part of a tape that is substantially similar to the image sensor 1 or the light receiving unit 2 or a tape including the image sensor 1 or the light receiving unit 2 is used. Although it will not specifically limit if it is the shape which added the projection part 3a to the main part, For example, the projection part 3a is provided in one side, such as a substantially square like FIG. 2 (A) and a substantially rectangular shape like FIG. 2 (B). Shape. In addition, a shape suitable for the shape of the image sensor 1 or the light receiving portion 2, such as a shape in which a protruding portion 3a is provided on a part of a main part of a circular or elliptical tape, can be applied.

突起部３ａの形状は、特に限定されるものではないが、自動あるいは手動を問わず挟持可能な形状が好ましい。また、加工が容易な形状が好ましい。例えば、図２（Ａ）や（Ｂ）のような方形を挙げることができるが、半円状あるいは図２（Ｃ）のような台形状や、図２（Ｄ）のような方形と台形の組み合わせなどの形状も可能である。   The shape of the protrusion 3a is not particularly limited, but a shape that can be clamped regardless of whether it is automatic or manual is preferable. Further, a shape that can be easily processed is preferable. For example, squares such as those shown in FIGS. 2A and 2B can be cited, but a semicircular shape, a trapezoidal shape such as FIG. 2C, or a square and a trapezoidal shape such as FIG. Combination shapes are also possible.

このとき、突起部３ａの近傍は、図１に示すような映像センサ１の端面１ａ、より正確には端面１ａを構成する辺部１ｂ、と平行するように、突起部３ａの末底に繋がる辺部３ｂを有することが好ましい。明確な貼り付け位置の確保が可能となり粘着の確認が容易となる。また、映像センサ１が図１に例示するような方形でなく、角部のない方形状あるいは長円状や楕円状の場合にあっては、その端面を構成する辺部と平行する相似形状の辺部を有することが好ましい。   At this time, the vicinity of the protruding portion 3a is connected to the bottom of the protruding portion 3a so as to be parallel to the end surface 1a of the image sensor 1 as shown in FIG. 1, more precisely, the side portion 1b constituting the end surface 1a. It is preferable to have the side 3b. A clear pasting position can be secured, and confirmation of adhesion becomes easy. In addition, when the image sensor 1 is not a square as illustrated in FIG. 1 but a square shape without an angular portion, an oval shape, or an oval shape, the image sensor 1 has a similar shape parallel to the side portion constituting the end face. It is preferable to have a side part.

さらに、突起部３ａにおいて、その先端３ｄから末底に繋がる側部３ｃが、斜線状、折れ線状、曲線状あるいはこれらの組み合わせのいずれかの形状を有することが好ましい。粘着テープ３を剥離するときに、突起部３ａの中心線に対し最も強い力が働くことから、図２（Ａ）の破線に示すような形状３ｅでは、粘着テープ３の亀裂あるいはそれに伴う受光部２への粘着剤の残存を生じるおそれがある。従って、側部３ｃは剥離時の力の分散を図ることができる形状であることが好適である。   Furthermore, in the protrusion 3a, it is preferable that the side part 3c connected from the front-end | tip 3d to a terminal bottom has any shape of diagonal line shape, broken line shape, curve shape, or these combination. When the pressure-sensitive adhesive tape 3 is peeled off, the strongest force acts on the center line of the protrusion 3a. Therefore, in the shape 3e as shown by the broken line in FIG. There is a risk of causing the adhesive to remain in No. 2. Therefore, it is preferable that the side portion 3c has a shape that can achieve the dispersion of force during peeling.

具体的な形状は力の分散機能を有していれば特に限定する必要はないが、例えば、図２（Ａ）〜（Ｄ）に示すような側部３ｃの形状を挙げることができる。つまり、側部３ｃの形状を、斜線状（図２（Ｃ））、折れ線状（図２（Ｄ））、曲線状（図２（Ａ）および（Ｂ））あるいはこれらの組み合わせ（図示せず）とすることで、粘着テープ３の剥離時に、側部３ｃを円滑に剥がすことができ、次に、突起部３ａ全体を略均等な力で剥がすことができる。さらに受光部２を被覆しているテープの主要部分を、剥離方向Ｘの面内垂直方向に略均等な力で剥がすことができる。なお、斜線や折れ線の傾斜角や、曲線の曲率などは、映像センサ１の形状、粘着テープ３全体や突起部３ａの形状などによって任意に設定することができる。   The specific shape is not particularly limited as long as it has a force distribution function, and examples thereof include the shape of the side portion 3c as shown in FIGS. That is, the shape of the side portion 3c is a slanted line shape (FIG. 2C), a broken line shape (FIG. 2D), a curved line shape (FIGS. 2A and 2B), or a combination thereof (not shown). ), The side portion 3c can be smoothly peeled off when the pressure-sensitive adhesive tape 3 is peeled off, and then the entire protruding portion 3a can be peeled off with a substantially uniform force. Furthermore, the main part of the tape covering the light receiving portion 2 can be peeled off with a substantially uniform force in the in-plane vertical direction of the peeling direction X. The inclination angle of the oblique line or the broken line, the curvature of the curve, and the like can be arbitrarily set depending on the shape of the video sensor 1, the entire adhesive tape 3, the shape of the protruding portion 3a, and the like.

また、粘着テープ３は、映像センサ１の受光部２に掛かる部分に粘着層を設けないことが好ましい。部品実装後のテープ剥離の際に被着体表面に粘着剤を残存することがなく作業効率が上昇するためである。   Moreover, it is preferable that the adhesive tape 3 does not provide an adhesive layer in the part which covers the light-receiving part 2 of the video sensor 1. This is because the pressure-sensitive adhesive does not remain on the surface of the adherend when the tape is peeled after component mounting, and the work efficiency is increased.

具体的には、図３に例示するように、粘着層５を基材４上に形成するに際し、粘着テープの中央の映像センサの受光部に掛かる部分に、幅ａの未塗布部分ができるように、両端に幅ｂの粘着層５を形成し、粘着テープを作製する方法などを挙げることができる。ただし、粘着層５の形状は、基本的に映像センサの受光部に掛かる部分に未塗布部分ができるようになれば、特に限定されるものではなく、例えば、図４に例示するように、（Ａ）円形状、（Ｂ）角状、など任意の形状の刳り抜きを設ける方法や、（Ｃ）基材４の四隅に粘着層５を形成する方法、（Ｄ）所定幅の傾斜状の未塗布部分を形成する方法、など種々の方法を適用することが可能である。図４の斜線部は、粘着剤塗布部分を示している。   Specifically, as illustrated in FIG. 3, when the adhesive layer 5 is formed on the base material 4, an uncoated portion having a width a is formed at a portion of the adhesive tape that covers the light receiving portion of the video sensor. In addition, a method of forming a pressure-sensitive adhesive layer 5 having a width b at both ends and producing a pressure-sensitive adhesive tape can be exemplified. However, the shape of the adhesive layer 5 is not particularly limited as long as an uncoated portion can be formed in a portion that is applied to the light receiving portion of the image sensor. For example, as illustrated in FIG. A) A method of providing a hollow shape of an arbitrary shape such as a circular shape, (B) a square shape, (C) a method of forming the adhesive layer 5 at the four corners of the base material 4, (D) a slanted shape having a predetermined width Various methods such as a method of forming a coated portion can be applied. The hatched portion in FIG. 4 indicates the adhesive application portion.

以上の方法によって、粘着層５を映像センサ表面に対し偏りなく、かつ被着面積を確保するように形成することによって、映像センサ表面への貼り付け強度を十分確保しながら受光部への影響を防止することができる。   By the above method, the adhesive layer 5 is formed so as not to be biased with respect to the surface of the image sensor and to secure a coating area, thereby ensuring the sufficient adhesion strength to the surface of the image sensor and affecting the light receiving portion. Can be prevented.

粘着テープの基材は、１８０℃の温度条件下での耐熱性を有するフィルムであれば、特に限定されない。例えば、ＰＥＴフィルム、ポリエチレンナフタレートフィルム（ＰＥＮ）、ポリエーテルサルフォン（ＰＥＳ）フィルム、ポリエーテルイミド（ＰＥＩ）フィルム、ポリサルフォン（ＰＳＦ）フィルム、ポリフェニレンサルファイド（ＰＰＳ）フィルム、ポリエーテルエーテルケトン（ＰＥＥＫ）フィルム、ポリアリレート（ＰＡＲ）フィルム、アラミドフィルム、ポリイミドフィルム、又は液晶ポリマー（ＬＣＰ）フィルムからなることが好ましい。特に、基材の収縮率、映像センサへの貼り合せを鑑みると、上記耐熱性と、貼り合せの際の視認性を併せ持つポリエチレンナフタレートを主成分とする基材からなることが好ましい。   The base material of an adhesive tape will not be specifically limited if it is a film which has the heat resistance under the temperature conditions of 180 degreeC. For example, PET film, polyethylene naphthalate film (PEN), polyethersulfone (PES) film, polyetherimide (PEI) film, polysulfone (PSF) film, polyphenylene sulfide (PPS) film, polyetheretherketone (PEEK) The film is preferably composed of a film, a polyarylate (PAR) film, an aramid film, a polyimide film, or a liquid crystal polymer (LCP) film. In particular, in view of the shrinkage rate of the base material and bonding to the image sensor, the base material is preferably made of a base material mainly composed of polyethylene naphthalate having both the heat resistance and the visibility at the time of bonding.

粘着テープの厚みは、折れや裂けを防止するため少なくとも５μｍ以上が好ましく、さらに、好適なハンドリング性に鑑みると１０〜１００μｍが好ましい。   The thickness of the adhesive tape is preferably at least 5 [mu] m or more in order to prevent breakage or tearing, and more preferably 10 to 100 [mu] m in view of suitable handling properties.

また、粘着剤については、耐熱性を有するものであれば特に限定されない。具体的にはアクリル系粘着剤、あるいはシリコーン系粘着剤などが挙げられる。特に、シリコーン系粘着剤は耐熱性に優れるばかりでなく、粘着力の調整も容易であることから、最終的に実装が完了した後にテープを剥離する際の粘着力を任意に調整することで、ハンドリングに優れた粘着テープの設計が可能となり、特に適した粘着材料であるといえる。   Moreover, about an adhesive, if it has heat resistance, it will not specifically limit. Specifically, an acrylic pressure-sensitive adhesive or a silicone pressure-sensitive adhesive can be used. In particular, silicone adhesives are not only excellent in heat resistance, but also easy to adjust the adhesive strength, so by arbitrarily adjusting the adhesive strength when peeling the tape after the mounting is finally completed, It is possible to design an adhesive tape excellent in handling, and it can be said that it is a particularly suitable adhesive material.

例えば、アクリル系粘着剤としては、少なくともアルキル（メタ）アクリレートを含むモノマーの共重合から得られたアクリル系共重合体からなる粘着剤である。ここでいうアルキル（メタ）アクリレートの例としては、メチル（メタ）アクリレート，エチル（メタ）アクリレート，ブチル（メタ）アクリレート，イソアミル（メタ）アクリレート，ｎ−ヘキシル（メタ）アクリレート，２−エチルヘキシル（メタ）アクリレート，イソオクチル（メタ）アクリレート，イソノニル（メタ）アクリレート，デシシル（メタ）アクリレート，ドデシル（メタ）アクリレートなどが挙げられる。また、これらのアクリル系粘着剤には適宜な架橋剤を含有しうる。例えば一例として、イソシアネート架橋剤、エポキシ架橋剤、アジリジン系化合物、キレート系架橋剤などである。   For example, the acrylic pressure-sensitive adhesive is a pressure-sensitive adhesive made of an acrylic copolymer obtained by copolymerization of a monomer containing at least an alkyl (meth) acrylate. Examples of the alkyl (meth) acrylate herein include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isoamyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) ) Acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate, and the like. Further, these acrylic pressure-sensitive adhesives can contain an appropriate crosslinking agent. For example, an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine-based compound, a chelate-based crosslinking agent and the like are examples.

さらに、必要に応じて他の添加剤として、例えば、充填剤、老化防止剤、顔料、染料、シランカップリング剤等の各種添加剤を添加することができる。アクリル系粘着剤は比較的耐熱性も高く、本発明に最も好適な粘着剤である。   Furthermore, as necessary, various additives such as a filler, an anti-aging agent, a pigment, a dye, and a silane coupling agent can be added as necessary. The acrylic pressure-sensitive adhesive has a relatively high heat resistance and is the most suitable pressure-sensitive adhesive for the present invention.

粘着テープの粘着層の厚さは、１μｍ以上５０μｍ以下、好ましくは３μｍ以上３０μｍ以下、さらに好ましくは５μｍ以上２０μｍ以下であることが望ましい。粘着層の確保には、基材表面に対して少しでも段差を生じれば有効であるが、１μｍ未満の場合、表面保護テープの撓みによって受光部分へ接触して傷付ける可能性があり、貼付け性も低下する。また、加熱中のフィルムの熱収縮により粘着テープの剥離を生じる可能性がある。５０μｍを超える場合には、テープのスリット加工及び打ち抜き加工時の粘着剤の変形、または、デ一プ貼付け時の加圧、輸送時等のテープへの圧力及び実装時の加熱による粘着剤の変形により受光部分に粘着剤が掛かる可能性がある。また、透過性を考慮すると薄層である方が好ましい。   The thickness of the adhesive layer of the adhesive tape is 1 μm or more and 50 μm or less, preferably 3 μm or more and 30 μm or less, more preferably 5 μm or more and 20 μm or less. In order to secure the adhesive layer, it is effective if even a slight level difference is generated on the surface of the base material. However, if it is less than 1 μm, it may be damaged by contact with the light receiving part due to the bending of the surface protection tape. Also decreases. Further, the adhesive tape may be peeled off due to heat shrinkage of the film being heated. If it exceeds 50μm, deformation of the adhesive during slitting and punching of the tape, or pressure applied to the tape at the time of attaching the tape, pressure on the tape during transportation, etc., and deformation of the adhesive due to heating during mounting This may cause the adhesive to be applied to the light receiving portion. In view of permeability, a thin layer is preferable.

つまり、映像センサの保護のためには、粘着テープとして所定の実装上の強度が要求されるとともに、映像センサとの調和した貼り合せ状態を保持する必要があり、また加工性も需要である。従って、本発明における粘着テープは、実測の結果、上記範囲が最適範囲であることを見出したものである。従って、こうした粘着層の厚みを有する粘着テープによって、作業性、安全性、生産性の高い映像センサの実装方法を提供することが可能となる。   In other words, in order to protect the image sensor, it is necessary to have a predetermined mounting strength as an adhesive tape, and it is necessary to maintain a bonded state in harmony with the image sensor, and workability is also in demand. Therefore, the pressure-sensitive adhesive tape of the present invention has been found that the above range is the optimum range as a result of actual measurement. Therefore, it is possible to provide a video sensor mounting method with high workability, safety, and productivity by using an adhesive tape having such a thickness of the adhesive layer.

本発明における粘着テープの基材の熱収縮率は、１５０℃で３０分間加熱した場合の収縮率が１．０％以下であることが好ましく、さらには０．５％以下であることが好ましい。熱収縮による剥離を防ぐためである。ここでいう熱収縮率とは、ＪＩＳ Ｃ２３１８に準じて測定した値が基準となる。   The heat shrinkage rate of the base material of the pressure-sensitive adhesive tape in the present invention is preferably 1.0% or less, more preferably 0.5% or less when heated at 150 ° C. for 30 minutes. This is to prevent peeling due to heat shrinkage. The value measured according to JIS C2318 is a standard for the heat shrinkage here.

さらに、本発明では、１８０℃の加熱を１時間実施した後の粘着テープの熱収縮率が、１．０％以下、より好ましくは０．５％以下、さらに好ましくは０．３％以下であることが望まれる。高温条件下での基材の収縮率について付加的条件を明確にすることで、さらに作業効率を上げるためである。ここでいう熱収縮率は、粘着テープ形態にて、ＢＡ板に貼り合せ、１８０℃の温度条件下にて１時間放置した後の値が基準となる。具体的な熱収縮率の測定方法は、粘着テープを２０ｍｍ角にカットし、ＢＡ板に貼付け、１８０℃の温度条件下で加熱し、その加熱前後のテープのサイズを、投影機（ミツトヨ製：ＰＲＯＦＩＬＥ ＰＲＯＪＥＣＴＯＲ ＰＪ−Ｈ３０００Ｆ）を用いてＭＤ方向およびＴＤ方向のいずれもについて測定した。なお、ＢＡ板とは、ＪＩＳ「ＢＡ仕上げ」に準じ、ＢＡ５号に表面仕上げしたＳＵＳ３０４板（日本金属（株）製ＢＡ５号仕上げＳＵＳ３０４）をいう。   Furthermore, in the present invention, the heat shrinkage rate of the adhesive tape after heating at 180 ° C. for 1 hour is 1.0% or less, more preferably 0.5% or less, and further preferably 0.3% or less. It is hoped that. This is to further improve the working efficiency by clarifying additional conditions regarding the shrinkage ratio of the base material under high temperature conditions. The heat shrinkage referred to here is based on the value after bonding to a BA plate in the form of an adhesive tape and leaving it at 180 ° C. for 1 hour. A specific method for measuring the heat shrinkage rate is to cut an adhesive tape into 20 mm square, affix to a BA plate, heat under a temperature condition of 180 ° C., and measure the size of the tape before and after the heating by a projector (manufactured by Mitutoyo: Both MD direction and TD direction were measured using PROFILE PROJECTOR PJ-H3000F). The BA plate refers to a SUS304 plate (BA5 finish SUS304 manufactured by Nippon Metal Co., Ltd.) surface-finished to BA5 in accordance with JIS “BA finish”.

また、本発明においては、１８０℃の加熱を１時間実施した後の粘着テープの粘着力が、０．１〜８．０Ｎ／１９ｍｍ幅であることが好ましく、また０．２Ｎ〜５．０Ｎ／１９ｍｍ幅がより好ましく、さらに０．３Ｎ〜４．０Ｎ／１９ｍｍ幅がより一層好ましい。８．０Ｎ／１９ｍｍ幅を超える粘着力では被着体からのテープ剥離が工程上困難かつ、被着体表面に粘着層を残存させる可能性があり、０．１Ｎ／１９ｍｍ幅を下回る加熱中のフィルムの熱収縮により粘着テープの剥離を生じる可能性があるからである。ここでいう粘着力は、ＪＩＳ Ｚ０２３７に準じて測定した値が基準となる。   Moreover, in this invention, it is preferable that the adhesive force of the adhesive tape after implementing a heating at 180 degreeC for 1 hour is 0.1-8.0N / 19mm width, Moreover, 0.2N-5.0N / A width of 19 mm is more preferable, and a width of 0.3 N to 4.0 N / 19 mm is even more preferable. With an adhesive strength exceeding 8.0 N / 19 mm width, tape peeling from the adherend is difficult in the process, and the adhesive layer may remain on the adherend surface. During heating below 0.1 N / 19 mm width, This is because the adhesive tape may peel off due to the heat shrinkage of the film. The adhesive force here is based on a value measured according to JIS Z0237.

本発明における粘着テープの光透過率は、５０％以上であることが好ましく、より好ましくは７０％以上であることが望まれる。部品実装後の内部を光学検査する際にも、粘着テープの光透過率を所定値以上確保することで、粘着テープの剥離を伴うことなく検査を行うことができるためである。ここでいう光透過率とは、可視光領域での光透過性を示しており、波長領域としては４００〜７００ｎｍでの透過率を意味する。本発明においては、この波長領域でのいずれの透過率も５０％以上であることが好ましい。５０％を下回る透過率の場合は、粘着テープを介しての固体撮像デバイスの有する結線工程等の確認が困難になるためである。ここでいう光透過率は以下の測定方法による値が基準となる。   The light transmittance of the pressure-sensitive adhesive tape in the present invention is preferably 50% or more, and more preferably 70% or more. This is because, even when optically inspecting the interior after component mounting, the optical tape can be inspected without peeling of the adhesive tape by securing the light transmittance of the adhesive tape to a predetermined value or more. Here, the light transmittance means light transmittance in the visible light region, and means a light transmittance in the wavelength range of 400 to 700 nm. In the present invention, any transmittance in this wavelength region is preferably 50% or more. This is because, when the transmittance is less than 50%, it is difficult to confirm the connection process or the like of the solid-state imaging device via the adhesive tape. The light transmittance here is based on the value measured by the following measurement method.

＜光透過率の測定方法＞
（１）測定装置：分光光度計（島津製作所製、ＭＰＳ−２０００）
（２）測定範囲：波長域４００ｎｍ〜７００ｎｍの範囲
（３）サンプルサイズ：測定装置に対し適切な大きさに切断
（４）粘着テープの測定は粘着剤側から測定を行った。なお、基材の測定については、粘着剤が塗布あるいは存在する側から測定を行った。 <Measurement method of light transmittance>
(1) Measuring apparatus: spectrophotometer (manufactured by Shimadzu Corporation, MPS-2000)
(2) Measurement range: Wavelength range of 400 nm to 700 nm (3) Sample size: Cut to an appropriate size for the measuring device (4) Measurement of the adhesive tape was performed from the adhesive side. In addition, about the measurement of a base material, it measured from the side in which an adhesive was apply | coated or exists.

また、粘着テープに離型フィルムを使用する場合、離型フィルムは、公知のいずれのものを使用してもよい。具体的には、離型フィルムの基材の粘着層との接合面に離型コート層、例えばシリコーン層が形成されたものを用いることができる。離型フィルムの基材としては、例えば、グラシン紙のような紙材や、ポリエチレン、ポリプロピレン、ポリエステル等よりなる樹脂フィルムが挙げられる。   Moreover, when using a release film for an adhesive tape, you may use any well-known thing as a release film. Specifically, a release coating layer, for example, a silicone layer formed on the bonding surface of the release film with the adhesive layer of the base material can be used. Examples of the substrate for the release film include paper materials such as glassine paper and resin films made of polyethylene, polypropylene, polyester, and the like.

また、本粘着テープはその用途、例えば対象とする固体撮像デバイスのサイズに応じて加工されていてもよい。加工方法に関しては、均一な形状が保たれ、かつ、加工断面部に粘着剤を残さない方法であれば、特に限定されないが、生産性を鑑みて打ち抜き加工が好ましい。   Moreover, this adhesive tape may be processed according to the use, for example, the size of the target solid-state imaging device. The processing method is not particularly limited as long as it is a method that maintains a uniform shape and does not leave a pressure-sensitive adhesive in the processed cross section, but punching is preferable in view of productivity.

以下、本発明の構成と効果を具体的に示す実施例等について説明する。また、実施例等における評価方法は下記のように行った。なお、本発明がかかる実施例、評価方法に限定されるものでないことはいうまでもない。   Examples and the like specifically showing the configuration and effects of the present invention will be described below. Moreover, the evaluation method in an Example etc. was performed as follows. In addition, it cannot be overemphasized that this invention is not limited to this Example and evaluation method.

＜評価方法＞
上記条件によって作製したテープについて、下記の項目について評価を行った。
（１）加熱後のテープの形状
ガラス面に下記実施例・比較例のサンプルを貼り合せた後、１８０℃の温度条件下に一時間放置した後のテープの形状
（２）パッケージ形成後形成後の内部の光学検査を想定した視認性
アクリル板にて高さ５ｍｍのボックスを形成し、その内部に結線工程を行った半導体素子を入れる。かつ、アクリル板上部に粘着テープを貼り合わせ、テープ越しにアクリル板内部にある半導体素子の結線の有無の確認を行った。効果の確認は、５人の目視により行った。なお、評価基準については、次の３段階にて類別を行った。
○：結線工程の有無を明確に確認できるもの。
△：結線工程をかろうじて確認できるもの。
×：結線工程を確認できないもの。
（３）剥離性
ガラス面に下記実施例・比較例のサンプルを貼り合せた後、１８０℃の温度条件下に１時間放置した後の剥離の容易性。 <Evaluation method>
About the tape produced on the said conditions, the following item was evaluated.
(1) Shape of the tape after heating After the samples of the following examples and comparative examples were bonded to the glass surface, the shape of the tape after being left for 1 hour at a temperature of 180 ° C. (2) After formation after the package was formed A box having a height of 5 mm is formed with an acrylic plate and a semiconductor element subjected to a wiring process is placed inside the box. And the adhesive tape was stuck on the acrylic board upper part, and the presence or absence of the connection of the semiconductor element in an acrylic board was confirmed through the tape. The effect was confirmed by visual observation of five people. The evaluation criteria were classified in the following three stages.
○: A device that can clearly confirm the presence or absence of the wiring process.
Δ: The wire connection process can be barely confirmed.
X: The connection process cannot be confirmed.
(3) Peelability Ease of peeling after the samples of the following examples and comparative examples were bonded to the glass surface and left for 1 hour at 180 ° C.

＜実施例１＞
厚さが２５μｍのポリエチレンナフタレート（基材の熱収縮率０．４％：１５０℃−３０分）からなる基材上に、アクリル系粘着剤の溶液塗布、乾燥して、厚さが１０μｍの粘着層を形成した粘着テープを作成した。この粘着テープを１８０℃の加熱を１時間程実施した後、ＪＩＳ Ｚ０２３７に準じて粘着力を測定すると２．０Ｎ／１９ｍｍであり、熱収縮率は０．１５％、粘着テープの４００〜７００ｎｍでの光透過率はいずれも５０％以上（平均８８．０％）であった。 <Example 1>
On the base material made of polyethylene naphthalate having a thickness of 25 μm (thermal shrinkage ratio of base material 0.4%: 150 ° C.-30 minutes), an acrylic pressure-sensitive adhesive solution was applied and dried, and the thickness was 10 μm. An adhesive tape having an adhesive layer was prepared. After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.0 N / 19 mm, the thermal shrinkage was 0.15%, and the adhesive tape was 400 to 700 nm. The light transmittance of each was 50% or more (average 88.0%).

＜実施例２＞
厚さが２５μｍのポリエチレンナフタレートからなる基材上に、アクリル系粘着剤の溶液を幅１０ｍｍの塗布部と幅１０ｍｍの未塗布部を交互にストライプ状に塗布、乾燥して、厚さが５μｍの粘着層を形成した粘着テープを作製した。この粘着テープを未塗布部分がテープの中央になる様に２０ｍｍ幅でスリットして粘着テープとした。図１におけるａ＝１０ｍｍ、ｂ＝５ｍｍの粘着テープとなる。この粘着テープを１８０℃の加熱を１時間程実施した後、ＪＩＳ Ｚ０２３７に準じて粘着力を測定すると１．０Ｎ／１９ｍｍであり、熱収縮率は０．１５％であった。 <Example 2>
On a base material made of polyethylene naphthalate having a thickness of 25 μm, an acrylic adhesive solution is applied in a stripe shape alternately with a coated part having a width of 10 mm and an uncoated part having a width of 10 mm, and dried to have a thickness of 5 μm. An adhesive tape having an adhesive layer was prepared. This adhesive tape was slit with a width of 20 mm so that the uncoated portion was in the center of the tape to obtain an adhesive tape. The adhesive tape has a = 10 mm and b = 5 mm in FIG. After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 1.0 N / 19 mm and the thermal shrinkage was 0.15%.

＜実施例３＞
厚さが３０μｍの粘着層を形成する以外は、実施例２と同様な方法にて作製した粘着テープを得た。この粘着テープを１８０℃の加熱を１時間程実施した後、ＪＩＳ Ｚ０２３７に準じて粘着力を測定すると３．０Ｎ／１９ｍｍであり、熱収縮率は０．１５％であった。 <Example 3>
An adhesive tape produced in the same manner as in Example 2 was obtained except that an adhesive layer having a thickness of 30 μm was formed. After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 3.0 N / 19 mm, and the thermal shrinkage was 0.15%.

＜実施例４＞
上述の図２（Ａ）に示すように、粘着テープを１１ｍｍ×１２ｍｍ角の被覆部分から、Ｒ＝２（ｍｍ）の円弧形状の側部を経て、突出長さが４ｍｍの突起部を有するテープ形状とした以外は、実施例１と同様の粘着テープを作成した。 <Example 4>
As shown in FIG. 2A described above, the adhesive tape is a tape having a protruding portion with a protruding length of 4 mm from a covered portion of 11 mm × 12 mm square, passing through an arc-shaped side portion of R = 2 (mm). An adhesive tape similar to that in Example 1 was prepared except that the shape was changed.

＜実施例５＞
上述の図２（Ｃ）に示すように、粘着テープを６ｍｍ×７ｍｍ角の被覆部分から、両端外側に各々１ｍｍ（図２（Ｃ）の３ｂおよび３ｆが１ｍｍとなる）開いたハの字型の傾斜を有する側部を経て、突出長さが２．５ｍｍの突起部を有するテープ形状とした以外は、実施例１と同様の粘着テープを作成した。 <Example 5>
As shown in FIG. 2 (C) described above, the adhesive tape is opened from the 6 mm × 7 mm square covering portion by 1 mm to the outer sides of both ends (3b and 3f in FIG. 2 (C) are 1 mm). A pressure-sensitive adhesive tape similar to that of Example 1 was prepared, except that a tape-like shape having a protruding portion with a protrusion length of 2.5 mm was passed through the inclined side portion.

＜比較例１＞
厚さが２５μｍのＰＥＴフィルム（基材の熱収縮率１．５％：１５０℃−３０分）からなる以外は、実施例１と同様な方法にて作製した粘着テープを得た。この粘着テープを１８０℃の加熱を１時間程実施した後、ＪＩＳ Ｚ０２３７に準じて粘着力を測定すると２．０Ｎ／１９ｍｍであり、熱収縮率は１．３％、この粘着テープの４００〜７００ｎｍでの光透過率はいずれも５０％以上（平均は９１．０％）であった。 <Comparative Example 1>
An adhesive tape produced in the same manner as in Example 1 was obtained except that it was made of a PET film having a thickness of 25 μm (base material thermal shrinkage ratio 1.5%: 150 ° C.-30 minutes). After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.0 N / 19 mm, the heat shrinkage rate was 1.3%, and the adhesive tape was 400 to 700 nm. The light transmittance was 50% or more (average was 91.0%).

＜比較例２＞
厚さが２５μｍのポリイミドフィルム（基材の熱収縮率０．２％：１５０℃−３０分）からなる以外は、実施例１と同様な方法にて粘着テープを得た。この粘着テープの光透過率は波長５１０ｎｍ以下の領域では５０％未満の光透過率であった。この粘着テープを１８０℃の加熱を１時間程実施した後、ＪＩＳ Ｚ０２３７に準じて粘着力を測定すると２．０Ｎ／１９ｍｍであり、熱収縮率は０．１％であった。 <Comparative example 2>
A pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that it was made of a polyimide film having a thickness of 25 μm (base material thermal shrinkage 0.2%: 150 ° C.-30 minutes). The light transmittance of this adhesive tape was less than 50% in the wavelength region of 510 nm or less. After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.0 N / 19 mm, and the heat shrinkage rate was 0.1%.

＜比較例３＞
アクリル系粘着剤の溶液をストライプ状に塗布しない以外は、実施例２と同様な方法にて作製した粘着テープを得た。この粘着テープを１８０℃の加熱を１時間程実施した後、ＪＩＳ Ｚ０２３７に準じて粘着力を測定すると２．０Ｎ／１９ｍｍであり、熱収縮率は０．１５％であった。 <Comparative Example 3>
An adhesive tape produced in the same manner as in Example 2 was obtained except that the acrylic adhesive solution was not applied in a stripe shape. After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.0 N / 19 mm, and the thermal shrinkage was 0.15%.

＜比較例４＞
突起部の側部が、直角状の末底形状（図２（Ａ）の破線に示すような形状３ｅ）を有する以外は、実施例４と同様の粘着テープを作成した。 <Comparative example 4>
An adhesive tape similar to that in Example 4 was prepared except that the side portion of the protrusion had a right-angled bottom shape (shape 3e as shown by the broken line in FIG. 2A).

＜結果＞
（１）加熱後のテープの形状
ポリエチレンナフタレートを基材に使用した実施例１〜５、比較例３および比較例４、ポリイミド基材を使用した比較例２に関しては、テープのガラス面からの浮き・剥離が確認されなかったのに対して、ＰＥＴを使用した比較例１に関しては、テープ端面が熱収縮により剥離していることが確認された。
（２）視認性
表１にパッケージ形成後の内部の視認性について検討を行った結果を記載する。 <Result>
(1) Shape of tape after heating For Examples 1 to 5, Comparative Example 3 and Comparative Example 4 using polyethylene naphthalate as a base material, and Comparative Example 2 using a polyimide base material, from the glass surface of the tape While no lifting / peeling was confirmed, in Comparative Example 1 using PET, it was confirmed that the tape end face was peeled off due to heat shrinkage.
(2) Visibility Table 1 describes the results of studies on the internal visibility after package formation.

Figure 0004116606
（３）剥離性
１８０℃の加熱を１時間程実施した後にガラス面からの剥離性を確認したところ、実施例１〜５および比較例２の粘着テープについては、テープ剥離後のガラス表面に粘着剤に由来する異物が確認されなかったが、比較例３に関しては、テープ剥離後のガラス表面に粘着剤に由来する異物が確認された。また、実施例３および４については、テープが切れることなく突起部から容易に剥離することができたが、比較例４については突起部末底の角の部分から亀裂が生じテープが切れて、突起部からテープ全体を容易に剥離することができなかった。
（４）まとめ
以上の結果より、耐熱性、視認性、かつ剥離性に優れたＣＣＤパッケージ成型時に使用される表面保護粘着テープを提供することができた。
Figure 0004116606
 (3) Peelability When the peelability from the glass surface was confirmed after heating at 180 ° C. for about 1 hour, the adhesive tapes of Examples 1 to 5 and Comparative Example 2 were stuck to the glass surface after tape peeling. Although the foreign material originating in an agent was not confirmed, regarding the comparative example 3, the foreign material derived from an adhesive was confirmed on the glass surface after tape peeling. In addition, for Examples 3 and 4, the tape could be easily peeled off from the protrusion without breaking, but for Comparative Example 4, the tape was broken due to a crack from the corner portion of the protrusion bottom, The entire tape could not be easily peeled from the protrusion.
(4) Summary From the above results, it was possible to provide a surface protective adhesive tape used in molding a CCD package having excellent heat resistance, visibility, and peelability.

本発明に係る粘着テープの映像センサへの貼り合せ状態を示す説明図。Explanatory drawing which shows the bonding state to the video sensor of the adhesive tape which concerns on this invention. 本発明に係る粘着テープの形状を例示する説明図。Explanatory drawing which illustrates the shape of the adhesive tape which concerns on this invention. 本発明の実施例２に係る粘着テープの基本的な構成を示す説明図。Explanatory drawing which shows the basic composition of the adhesive tape which concerns on Example 2 of this invention. 本発明に実施例２に係る粘着テープの他の構成を示す説明図。Explanatory drawing which shows the other structure of the adhesive tape which concerns on Example 2 at this invention.

符号の説明Explanation of symbols

１ 映像センサ
２ 受光部
３ 粘着テープ
３ａ 突起部
３ｂ 辺部
３ｃ 側部
３ｄ 先端
４ 基材
５ 粘着層
Ｘ 中心線 DESCRIPTION OF SYMBOLS 1 Image sensor 2 Light-receiving part 3 Adhesive tape 3a Protrusion part 3b Side part 3c Side part 3d Tip 4 Base material 5 Adhesive layer X Center line

Claims (8)

固体撮像デバイスを用いた映像センサの実装工程において、ポリエチレンナフタレートを基材とし、その外周の少なくとも一部に剥離用の突起部を有し、かつ、少なくとも片面に粘着層を有する粘着テープであって、映像センサの端面と平行し、前記突起部の末底と繋がる辺部を有するとともに、突起部の先端から末底に繋がる側部が、斜線状、折れ線状、曲線状あるいはこれらの組み合わせのいずれかの形状を有するものを、前記映像センサの受光部に貼り合せた状態で、映像センサの端子部を基板側と半田接続リフローすることを特徴とする映像センサの実装方法。 In the mounting process of the image sensor which uses a solid-state image pickup device, a polyethylene naphthalate as a substrate, has a projection portion for peeling at least a portion of its periphery, and met adhesive tape having at least one surface adhesive layer In addition, the side portion that is parallel to the end face of the image sensor and that is connected to the terminal bottom of the protruding portion, and the side portion that is connected to the terminal bottom from the tip of the protruding portion is an oblique line shape, a broken line shape, a curved shape, or a combination thereof. A mounting method for a video sensor, comprising reflowing a terminal portion of the video sensor with a substrate side in a state in which any shape is bonded to a light receiving portion of the video sensor. 前記粘着テープが、映像センサの受光部全体を被覆するとともに、その外周部の少なくとも一部が映像センサの端面から中心側に所定の距離を有するように、前記受光部に貼り合せることを特徴とする請求項１記載の映像センサの実装方法。   The adhesive tape covers the entire light receiving part of the video sensor, and is bonded to the light receiving part so that at least a part of the outer peripheral part has a predetermined distance from the end surface of the video sensor to the center side. The video sensor mounting method according to claim 1. 前記粘着テープにおいて、前記映像センサの受光部に掛かる部分に粘着層を設けないことを特徴とする請求項１又は２記載の映像センサの実装方法。 In the adhesive tape, the mounting method of the image sensor according to claim 1 or 2, wherein the provided with no adhesive layer on the portion applied to the light receiving portion of the image sensor. 前記粘着テープに用いる基材の１５０℃における熱収縮率が、１．０％以下であることを特徴とする請求項１〜３いずれかに記載の映像センサの実装方法。 The method for mounting a video sensor according to any one of claims 1 to 3, wherein a base material used for the adhesive tape has a heat shrinkage rate at 150 ° C of 1.0% or less. １８０℃の加熱を１時間実施した後の前記粘着テープの熱収縮率が、１．０％以下であることを特徴とする請求項１〜４いずれかに記載の映像センサの実装方法。 The method for mounting a video sensor according to any one of claims 1 to 4 , wherein a heat shrinkage rate of the adhesive tape after heating at 180 ° C for 1 hour is 1.0% or less. １８０℃の加熱を１時間実施した後の前記粘着テープの粘着力が、０．１〜８．０Ｎ／１９ｍｍ幅であることを特徴とする請求項１〜５のいずれかに記載の映像センサの実装方法。 Adhesive strength of the adhesive tape after 1 h the heating of 180 ° C. is, the image sensor according to any one of claims 1 to 5, characterized in that a 0.1~8.0N / 19mm width Implementation method. 前記粘着テープの光透過率が、５０％以上であることを特徴とする請求項１〜６のいずれかに記載の映像センサの実装方法。 The light transmittance of the adhesive tape, the mounting method of the image sensor according to any one of claims 1 to 6, wherein 50% or more. 請求項１〜７のいずれか記載の映像センサの実装方法に用いる粘着テープであって、
ポリエチレンナフタレートを基材とし、その外周の少なくとも一部に剥離用の突起部を有し、かつ、少なくとも片面に粘着層を有すると共に、
前記映像センサの端面と平行し、前記突起部の末底と繋がる辺部を有するとともに、突起部の先端から末底に繋がる側部が、斜線状、折れ線状、曲線状あるいはこれらの組み合わせのいずれかの形状を有することを特徴とする粘着テープ。 A pressure-sensitive adhesive tape used in the implementation of the image sensor according to any one of claims 1-7,
With polyethylene naphthalate as a base material, it has a protrusion for peeling on at least a part of its outer periphery, and has an adhesive layer on at least one side,
The side part that is parallel to the end face of the image sensor and is connected to the terminal bottom of the protruding part, and the side part connected to the terminal bottom from the tip of the protruding part is any one of a diagonal line, a broken line, a curved line, or a combination thereof. An adhesive tape having the shape of
JP2004316103A 2004-04-28 2004-10-29 Mounting method of image sensor and adhesive tape used therefor Expired - Fee Related JP4116606B2 (en)

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TW94109066A TWI407560B (en) 2004-04-28 2005-03-24 Package method for photo sensor and sticking tape therefor
SG200902893-7A SG152276A1 (en) 2004-04-28 2005-04-22 Mounting method for image sensor and adhesive tape used therefor
SG200502444A SG116634A1 (en) 2004-04-28 2005-04-22 Mounting method for image sensor and adhesive tap e used therefor.
KR1020050035040A KR100922663B1 (en) 2004-04-28 2005-04-27 A method for mounting image sensor and a pressure-sensitive adhesive tape used therefor
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