JP4044832B2 - Electronic component storage container lid member and electronic component storage container using the same - Google Patents

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体素子や圧電振動子等の電子部品を気密に封止して収納するための蓋部材およびこれを用いた電子部品収納用容器に関し、特に封止材に低融点合金を用いて封止を行なう蓋部材およびこれを用いた電子部品収納用容器に関する。
【０００２】
【従来の技術】
従来、半導体素子等の電子部品を収容するための電子部品収納用容器は、例えば酸化アルミニウム質焼結体等の電気絶縁材料から成り、その上面の略中央部に電子部品を収容するための凹部およびその周辺から下面にかけて導出したタングステンやモリブデン等の高融点金属から成る複数個のメタライズ配線層を有し、上面の外周部に封止用のメタライズ金属層が被着された絶縁基体と、金属材料から成り、下面の外周部に封止材が被着されている蓋体とから構成されている。そして、絶縁基体の凹部底面に半導体素子等の電子部品を接着剤を介して接着するとともに電子部品の各電極をボンディングワイヤ等を介してメタライズ配線層に接続し、しかる後、絶縁基体のメタライズ金属層に、蓋体をその下面に被着させておいた封止材が相対するように位置合わせを行ない、窒素雰囲気等の不活性雰囲気中でメタライズ金属層と封止材とを溶融一体化させ、絶縁基体と蓋体とから成る容器を気密に封止することによって最終製品としての電子装置となる。
なお、このような従来の電子装置においては、絶縁基体と蓋体とを接合する封止材として、鉛を主成分とする半田が使用されていた。
【０００３】
しかしながら、封止材に含有される鉛が環境汚染物質に指定され、例えば、鉛を含有する半田を使用した電子装置が屋外に廃棄もしくは放置され風雨に曝された場合、環境中に鉛が溶け出し環境を汚染する危険性があり、近年、地球環境保護運動の高まりの中で鉛を含有しない封止材が要求されるようになってきた。
【０００４】
そこで、人体に対して有害である鉛を用いない各種封止材が開発・提案されてきた。このような封止材として、例えば錫やビスマス−銀、亜鉛−アルミニウム等を主成分とする各種半田が採用されている。
【０００５】
【特許文献１】
特開2000−307228号公報
【０００６】
【発明が解決しようとする課題】
しかしながら錫や銀・亜鉛を含有した合金から成る半田は、温度が−55〜125℃の温度サイクル条件下での耐熱疲労性には優れた信頼性を示すものの、これらの半田は、その融点がいずれも225℃以下であり、この半田を絶縁基体と蓋体とを気密に封止する封止材として使用した場合、封止材に電子装置を外部電気回路等に実装する際の230〜240℃の熱履歴が加わり封止材自体が溶融してしまい、電子装置内部の気密封止が破れてしまうという問題点を有していた。
【０００７】
また、ビスマス−銀を主成分とする半田は、−55〜125℃の温度サイクル条件下での耐熱疲労特性に劣り気密信頼性に欠けるため、電子装置の気密封止用に用いるには不適当であるという課題を有していた。
【０００８】
さらに、亜鉛−アルミニウムを主成分とする半田は、空気中に放置した場合に、腐食が進行しやすく長期の気密信頼性に欠け、電子装置の気密封止用に用いるには、これもまた不適当であるという課題を有していた。
【０００９】
本発明は、このような従来の問題点に鑑み完成されたもので、その目的は、電子装置を外部電気回路等に実装する際に230〜240℃の熱履歴が加わっても電子装置の気密性が確保でき、封止材自体の耐食性にも優れ、さらに、鉛を含有しない地球環境に優しい蓋部材およびこれを用いた電子部品収納用容器を提供することにある。
【００１０】
【課題を解決するための手段】
本発明の電子部品収納用容器用蓋部材は、蓋体と、この蓋体の表面に被着形成された封止材とから成る電子部品収納用容器用蓋部材であって、前記封止材は、前記蓋体側から順に配置された第１層および第２層から成る２層構造を有しており、前記第２層を融点が２２５℃以下の錫−銀半田または錫−銀−銅半田で形成し、前記第１層を前記第２層の半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金で形成したことを特徴とするものである。
【００１１】
本発明の電子部品収納用容器用蓋部材によれば、封止材の第２層を融点が２２５℃以下の錫−銀半田または錫−銀−銅半田で形成し、第１層を第２層の半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金で形成したことから、この電子部品収納用容器用蓋部材と封止面に枠状のメタライズ金属層を有する絶縁基体とを用いて電子部品収納用容器を製作した場合、封止材の第２層は、その融点が２２５℃以下と低く封止工程で良好な流動性を示し、封止工程中の温度の上昇による容器内部の圧力増加および一定圧力の封止荷重によって容器の外側に押し出されて蓋体の周囲にフィレットを良好に形成し、その結果、容器の気密封止を良好なものとすることができ、温度サイクル等の耐熱疲労試験においても気密信頼性の高い電子部品収納用容器を得ることができる。また、封止工程の熱履歴により封止材の第２層が容器の外側に押し出されるために、絶縁基体のメタライズ金属層と蓋体とが第１層の金属と第２層の半田とから成る、融点が２５０℃以上の合金を介して接合されることとなるので、その結果、封止材に電子装置を外部電気回路等に実装する際に２３０〜２４０℃の熱履歴が加わったとしても、封止材が溶融して容器内部の気密封止が破れてしまうことはない。
【００１３】
本発明の電子部品収納用容器用蓋部材によれば、上記構成において、封止材の第１層を第２層の半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金で、第２層を融点が２２５℃以下の錫−銀半田または錫−銀−銅半田で形成したことから、第１層の銀が第２層の半田の主成分である錫と容易に反応して固相線温度が２５０℃以上の合金層を良好に形成し、気密信頼性の高い電子部品収納用容器を得ることができる。
【００１４】
本発明の電子部品収納用容器は、上面に電子部品が搭載される搭載部およびこの搭載部を取り囲む枠状のメタライズ金属層を有する絶縁基体と、上記構成の電子部品収納用容器用蓋部材とから成り、前記枠状のメタライズ金属層に、前記封止材を介して前記蓋体を接合させ、前記絶縁基体と前記蓋体とで構成される容器の内部に電子部品を気密に収容することを特徴とするものである。
【００１５】
本発明の電子部品収納用容器によれば、絶縁基体のメタライズ金属層と蓋体とが第１層の銀または銀−銅合金と第２層の融点が２２５℃以下の錫−銀半田または錫−銀−銅半田とから成る、融点が２５０℃以上の合金を介して接合されることとなるので、その結果、封止材に電子装置を外部電気回路等に実装する際に２３０〜２４０℃の熱履歴が加わったとしても、封止材が溶融して容器内部の気密封止が破れてしまうことはなく、気密信頼性の高い電子部品収納用容器とすることができる。
【００１６】
【発明の実施の形態】
次に、本発明の電子部品収納用容器用蓋部材および電子部品収納用容器を添付の図面に基づいて詳細に説明する。
図１は、本発明の電子部品収納用容器用蓋部材の実施の形態の一例を示す断面図、図２はその要部拡大断面図であり、これらの図において２は蓋体、３は封止材、３ａは封止材の第１層、３ｂは封止材の第２層であり、主にこれらで本発明の電子部品収納用容器用蓋部材１が構成されている。
【００１７】
電子部品収納用容器用蓋部材１を構成する蓋体２は、例えば４２アロイや鉄・ニッケル・コバルト合金等の金属、あるいは酸化アルミニウムやムライト・窒化アルミニウム・炭化珪素・ガラスセラミックス等を主成分とする焼結体等のセラミックスから成り、蓋体２が金属から成る場合は、蓋体２と成る母材を蓋体２に対応した形状を有する打抜き金型で打抜くことによって製作され、また、蓋体２がセラミックス、例えば酸化アルミニウム質焼結体から成る場合は、先ず、アルミナ（Ａｌ_２Ｏ_３）やシリカ（ＳｉＯ_２）・カルシア（ＣａＯ）・マグネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤・溶媒を添加混合して泥漿状と成し、これを従来周知のドクターブレード法やカレンダーロール法等を採用してシート状に成形しセラミックグリーンシートを得、その後、セラミックグリーンシートを所定形状に打ち抜き加工するとともに複数枚積層し、約１６００℃の温度で焼成することにより製作される。
【００１８】
なお、封止材３が被着される領域には、各種金属によるメタライズ層やめっき層が形成されている。なお、蓋体２が金属から成る場合においても、封止材３が被着される領域に各種金属によるメタライズ層やめっき層を形成してもよい。
【００１９】
そして本発明の電子部品収納用容器用蓋部材１においては、封止材３は蓋体２側から順に配置された第１層３ａおよび第２層３ｂから成る２層構造を有しており、第２層３ｂが錫を主成分とする半田で形成され、第１層３ａが第２層３ｂの半田と共に融点が２５０℃以上の合金を形成する金属を主成分とする金属で形成されている。また、本発明においてはこのことが重要である。
【００２０】
本発明の電子部品収納用容器用蓋部材１によれば、封止材３の第２層３ｂを融点が２２５℃以下の錫−銀半田または錫−銀−銅半田で形成し、第１層３ａを第２層３ｂの半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金で形成したことから、この電子部品収納用容器用蓋部材１と封止面に枠状のメタライズ金属層を有する絶縁基体とを用いて電子部品収納用容器を製作した場合、封止材３の第２層３ｂは、その融点が２２５℃以下と低く封止工程で良好な流動性を示し、封止工程中の温度の上昇による容器内部の圧力増加および一定圧力の封止荷重によって容器の外側に押し出されて蓋体２の周囲にフィレットを良好に形成し、その結果、容器の気密封止を良好なものとすることができ、温度サイクル等の耐熱疲労試験においても気密信頼性の高い電子部品収納用容器を得ることができる。また、封止工程の熱履歴により封止材３の第２層３ｂが容器の外側に押し出されるために、絶縁基体のメタライズ金属層と蓋体２とが第１層３ａの金属と第２層３ｂの半田とから成る、融点が２５０℃以上の合金を介して接合されることとなるので、その結果、封止材３に電子装置を外部電気回路等に実装する際に２３０〜２４０℃の熱履歴が加わったとしても、封止材３が溶融して容器内部の気密封止が破れてしまうことはない。
【００２１】
また、このような封止材３の第１層３ａを第２層３ｂの半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金で、第２層３ｂを融点が２２５℃以下の錫−銀半田または錫−銀−銅半田で形成することが必要である。
本発明の電子部品収納用容器用蓋部材１によれば、封止材３の第１層３ａを第２層３ｂの半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金で、第２層３ｂを融点が２２５℃以下の錫−銀半田または錫−銀−銅半田で形成したことから、封止材３の第１層３ａの銀が第２層３ｂの半田の主成分である錫と容易に反応して固相線温度が２５０℃以上の合金層領域３ｃを形成し、より気密信頼性の高い電子部品収納用容器４を得ることができる。
【００２２】
このような第１層３ａに用いる第２層３ｂの半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金としては、例えば、７２質量％の銀と２８質量％の銅とから成る共晶銀ろうが用いられる。
【００２３】
また、第２層３ｂに用いられる融点が２２５℃以下の錫−銀半田または錫−銀−銅半田としては、例えば、９６．５質量％の錫と３．５質量％の銀とから成る共晶や、９５．７５質量％の錫と３．５質量％の銀と０．７５質量％の銅とから成る共晶、あるいは共晶に近い組成で鉛を含有しない各種半田が用いられる。なお、このような融点が２２５℃以下の錫−銀半田または錫−銀−銅半田としては、電子部品の熱的保護や残留応力の観点からは、できる限り低温で溶融可能なものが好ましく、例えば、９６．５質量％の錫と３．５質量％の銀とから成る共晶は、その溶融温度が約２２１℃であり、耐熱性に優れた合金を良好に形成することから、好適に用いられる。
【００２４】
また、封止材３の第１層３ａの厚みは１〜100μｍが好ましく、１μｍ未満では封止時の熱履歴により第１層３ａの金属が第２層３ｂの半田に食われてしまい耐熱性が劣化する傾向があり、厚みが100μｍを超えると、蓋体２との熱膨張差によって、蓋体２に反りが発生しやすくなり、気密封止性が不完全となる傾向がある。従って、第１層３ａの厚みは、１〜100μｍが好ましい。
【００２５】
さらに、封止材３の第２層３ｂの厚みは10〜100μｍが好ましく、10μｍ未満では気密封止性が不完全と成る傾向があり、100μｍを超えると封止時に、半田が外側に溢れ出し、製品の外観を損なう傾向がある。従って、第２層３ｂの厚みは10〜100μｍが好ましい。
【００２６】
このような封止材３は次に述べる方法により、蓋体２に被着される。まず、銀もしくは銀−銅合金の粉末に有機溶剤・溶媒を添加混合して得た金属ペーストを蓋体２に、厚みが１〜100μｍとなるようにスクリーン印刷する方法、あるいは銀もしくは銀−銅合金から成る、厚みが１〜100μｍのフィルムやシートを打ち抜き、還元ガス中、温度850℃で基体１に溶融密着させる方法等の方法により第１層３ａを形成する。次に、第１層３ａの上に、めっきにより錫を主成分とする半田を生成させる方法により第２層３ｂを形成する。
【００２７】
あるいは他の方法として、蓋体２の材料リボンに、予め適切な厚みにした銀−銅合金リボン、錫主成分の半田リボンを重ねあわせ、全体を加圧圧延することにより得られた３層金属を蓋体２の形状に金型で打ち抜くことにより電子部品収納用容器用蓋部材１が得られ、これにより第１層３ａの厚みが１〜１００μｍ、第２層３ｂの厚みが１０〜１００μｍの封止材３が電子部品収納用容器用蓋部材１表面に形成される。
【００２８】
かくして本発明の電子部品収納用容器用蓋部材１によれば、封止材３の第２層３ｂを融点が２２５℃以下の錫−銀半田または錫−銀−銅半田で形成し、第１層３ａを第２層３ｂの半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金で形成したことから、この電子部品収納用容器用蓋部材１と封止面に枠状のメタライズ金属層を有する絶縁基体とを用いて電子部品収納用容器を製作した場合、封止材３の第２層３ｂは、その融点が２２５℃以下と低く封止工程で良好な流動性を示し、封止工程中の温度の上昇による容器内部の圧力増加および一定圧力の封止荷重によって容器の外側に押し出されて蓋体の周囲にフィレットを良好に形成し、その結果、容器の気密封止を良好なものとすることができ、温度サイクル等の耐熱疲労試験においても気密信頼性の高い電子部品収納用容器を得ることができる。また、封止工程の熱履歴により封止材３の第２層３ｂが容器の外側に押し出されるために、絶縁基体のメタライズ金属層と蓋体２とが第１層３ａの金属と第２層３ｂの半田とから成る、融点が２５０℃以上の合金を介して接合されることとなるので、その結果、封止材３に電子装置を外部電気回路等に実装する際に２３０〜２４０℃の熱履歴が加わったとしても、封止材３が溶融して容器内部の気密封止が破れてしまうことはない。
【００２９】
次に、本発明の電子部品収納用容器用蓋部材１を用いた電子部品収納用容器について、図３および図４に基づいて詳細に説明する。
【００３０】
図３は、本発明の電子部品収納用容器の実施の形態の一例を示す断面図、図４はその要部拡大断面図であり、これらの図において、４は電子部品収納用容器、５は絶縁基体である。なお、図３には、電子部品収納用容器に電子部品６を実装して電子装置とした例を示している。
【００３１】
絶縁基体５は、その上面中央部に電子部品６を収容するための凹部が設けられており、この凹部の底面には電子部品６がガラスや樹脂・ろう材等の接着剤を介して接着固定される。
【００３２】
また、絶縁基体５凹部の底面より外周部にかけて、複数のメタライズ配線層(図示せず)が被着形成されており、このメタライズ配線層の凹部の底面に位置する部位には電子部品６の各電極がボンディングワイヤ８を介して電気的に接続され、外部に導出する部位は外部電気回路基板の配線導体（図示せず）に導電性接続部材を介して電気的に接続される。
【００３３】
さらに、絶縁基体５の上面の凹部外周部には、本発明の電子部品収納用容器用蓋部材１との接合用の枠状のメタライズ金属層７が被着されている。
絶縁基体５は、酸化アルミニウムやムライト・窒化アルミニウム・炭化珪素・ガラスセラミックス等を主成分とする焼結体等の電気絶縁材料から成り、例えば、酸化アルミニウム質焼結体から成る場合であれば、先ずアルミナ（Ａｌ_２Ｏ_３）やシリカ（ＳｉＯ_２）・カルシア（ＣａＯ）・マグネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤・溶媒を添加混合して泥漿状と成し、これを従来周知のドクターブレード法やカレンダーロール法等を採用してシート状に成形しセラミックグリーンシートを得、その後、セラミックグリーンシートを所定形状に打ち抜き加工するとともに複数枚積層し、約１６００℃の温度で焼成することにより製作される。
【００３４】
また、メタライズ配線層および枠状のメタライズ金属層７は、タングステンやモリブデン・マンガン等の高融点金属から成り、これらの粉末に有機溶剤・溶媒を添加混合した金属ペーストをそれぞれセラミックグリーンシートの所定位置に従来周知のスクリーン印刷法により所定パターンに被着形成させておき、セラミックグリーンシートと同時に焼成することにより形成される。なお、枠状のメタライズ金属層７には、その表面に耐食性に優れ、半田等のろう材との濡れ性の良好な金等の貴金属をめっき法等により、0.1〜１μｍの厚さに被着させておくと、フラックスを用いることなく蓋体２と接合することが可能となる。
【００３５】
なお、フラックスは電子部品収納用容器４の内部に飛散すると、電子部品６の電極を腐蝕し断線を発生させる原因となることから、枠状のメタライズ金属層７の表面には、金等の貴金属をめっき法等により被着させておき、メタライズ金属層７と電子部品収納用容器用蓋部材１との接合をフラックスを用いず行なうことが好ましい。
【００３６】
そして、絶縁基体５の上面の凹部外周部に形成されたメタライズ金属層７に、電子部品収納用容器用蓋部材１がその下面に被着形成された金属から成る封止材３を介して接合される。
また、絶縁基体５と電子部品収納用容器用蓋部材１との接合は、絶縁基体５の枠状のメタライズ金属層７と蓋体２との間に封止材３が挟まるように電子部品収納用容器用蓋部材１を絶縁基体５上に載置し、しかる後、蓋体２を絶縁基体５側に一定圧力で押圧しながらピーク温度が約２６０〜３００℃の温度で窒素雰囲気のシール炉に０．５〜１０分間保持して封止材３を溶融させることにより、封止材３の第２層３ｂの半田が外側に流れ出しフィレットを形成するとともに、第１層３ａと第２層３ｂとの間に合金層３ｃが絶縁基体５のメタライズ金属層７側に成長し、絶縁基体５の上面に蓋体２が封止材３の第１層３ａと第２層３ｂとを介して気密に接合されることとなる。
【００３７】
なお、合金層３ｃの合金は、電子装置を外部電気回路等に実装する際の２３０〜２４０℃の加熱温度を超える固相線温度を有することが必要である。それにより封止材３が電子装置を外部電気回路に実装する際の加熱温度に曝されても、第１層３ａの第２層３ｂの半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金と第２層３ｂの融点が２２５℃以下の錫−銀半田または錫−銀−銅半田間に形成された合金層３ｃで形状を保ち、外周部に融点が２２５℃以下の錫−銀半田または錫−銀−銅半田の第２層３ｂが存在することになる。従って、たとえ融点が２２５℃以下の錫−銀半田または錫−銀−銅半田の第２層３ｂが溶融したとしても、合金層３ｃによって、溶融した第２層３ｂが保持されて容器の気密性が損なわれることはない。
【００３８】
かくして本発明の電子部品収納用容器用蓋部材１およびこれを用いた電子部品収納用容器４によれば、絶縁基体５の凹部底面に半導体素子等の電子部品６を接着剤等を介して接着するとともに電子部品６の各電極をボンディングワイヤ８等を介してメタライズ配線層に接続し、しかる後、絶縁基体５と相対向する蓋体２の主面に被着させておいた封止材３を加熱・溶融させ、絶縁基体５と蓋体２とから成る容器を封止することによって最終製品としての電子装置となる。
【００３９】
なお、本発明は上記実施例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更は可能であり、上述の実施例では電子部品として半導体素子を例に挙げ、これを収容した電子装置について詳述したが、圧電振動子や弾性表面波素子等の電子部品を収容した電子装置にも適用可能である。また、図４では、封止材が第１層、合金層および第２層の３層構造から成る例を示したが、封止材が第１層がすべて合金層となり、合金層および第２層から成る２層構造となってもよい。さらに、上述の実施例では、蓋体を平板状とし、絶縁基体を上面中央部に凹部を有する形状として説明したが、蓋体を、例えば絶縁基体と対向する面に凹部を有する形状とし、絶縁基体を平板状の形状としてもよいことはもちろんである。
【００４０】
【発明の効果】
本発明の電子部品収納用容器用蓋部材によれば、封止材の第２層を融点が２２５℃以下の錫−銀半田または錫−銀−銅半田で形成し、第１層を第２層の半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金で形成したことから、この電子部品収納用容器用蓋部材と封止面に枠状のメタライズ金属層を有する絶縁基体とを用いて電子部品収納用容器を製作した場合、封止材の第２層は、その融点が２２５℃以下と低く封止工程で良好な流動性を示し、封止工程中の温度の上昇による容器内部の圧力増加および一定圧力の封止荷重によって容器の外側に押し出されて蓋体の周囲にフィレットを良好に形成し、その結果、容器の気密封止を良好なものとすることができ、温度サイクル等の耐熱疲労試験においても気密信頼性の高い電子部品収納用容器を得ることができる。また、封止工程の熱履歴により封止材の第２層が容器の外側に押し出されるために、絶縁基体のメタライズ金属層と蓋体とが第１層の金属と第２層の半田とから成る、融点が２５０℃以上の合金を介して接合されることとなるので、その結果、封止材に電子装置を外部電気回路等に実装する際に２３０〜２４０℃の熱履歴が加わったとしても、封止材が溶融して容器内部の気密封止が破れてしまうことはない。
【００４１】
また、本発明の電子部品収納用容器用蓋部材によれば、封止材の第１層を第２層の半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金で、第２層を融点が２２５℃以下の錫−銀半田または錫−銀−銅半田で形成したことから、第１層の銀が第２層の半田の主成分である錫と容易に反応して固相線温度が２５０℃以上の合金層を良好に形成し、気密信頼性の高い電子部品収納用容器を得ることができる。
【００４２】
本発明の電子部品収納用容器によれば、絶縁基体のメタライズ金属層と蓋体とが第１層の銀または銀−銅合金と第２層の融点が２２５℃以下の錫−銀半田または錫−銀−銅半田とから成る、融点が２５０℃以上の合金を介して接合されることとなるので、その結果、封止材に電子装置を外部電気回路等に実装する際に２３０〜２４０℃の熱履歴が加わったとしても、封止材が溶融して容器内部の気密封止が破れてしまうことはなく、気密信頼性の高い電子部品収納用容器とすることができる。
【図面の簡単な説明】
【図１】 本発明の電子部品収納用容器用蓋部材の実施の形態の一例を示す断面図である。
【図２】 図１の要部拡大断面図である。
【図３】 本発明の電子部品収納用容器の実施の形態の一例を示す断面図である。
【図４】 図３の要部拡大断面図である。
【符号の説明】
１・・・・・・・電子部品収納用容器用蓋部材
２・・・・・・・蓋体
３・・・・・・・封止材
３ａ・・・・・・第１層
３ｂ・・・・・・第２層
３ｃ・・・・・・合金層
４・・・・・・・電子部品収納用容器
５・・・・・・・絶縁基体
６・・・・・・・電子部品
７・・・・・・・メタライズ金属層[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a lid member for hermetically sealing and storing electronic components such as semiconductor elements and piezoelectric vibrators, and an electronic component storage container using the lid member, and particularly using a low-melting-point alloy as a sealing material. The present invention relates to a lid member for sealing and an electronic component storage container using the lid member.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, an electronic component storage container for storing an electronic component such as a semiconductor element is made of an electrically insulating material such as an aluminum oxide sintered body, and a concave portion for storing the electronic component at a substantially central portion on the upper surface thereof. And an insulating substrate having a plurality of metallized wiring layers made of a refractory metal such as tungsten or molybdenum derived from the periphery to the lower surface, and a metallized metal layer for sealing deposited on the outer periphery of the upper surface, and a metal The cover is made of a material and has a sealing member attached to the outer peripheral portion of the lower surface. Then, an electronic component such as a semiconductor element is bonded to the bottom surface of the concave portion of the insulating substrate through an adhesive, and each electrode of the electronic component is connected to the metallized wiring layer through a bonding wire or the like. The layers are aligned so that the encapsulant with the lid attached to the lower surface faces it, and the metallized metal layer and encapsulant are melted and integrated in an inert atmosphere such as a nitrogen atmosphere. Then, an electronic device as a final product is obtained by hermetically sealing a container composed of an insulating base and a lid.
In such a conventional electronic device, solder mainly composed of lead is used as a sealing material for joining the insulating base and the lid.
[0003]
However, when lead contained in the sealing material is designated as an environmental pollutant, for example, when an electronic device using solder containing lead is discarded or left outdoors and exposed to wind and rain, lead is dissolved in the environment. In recent years, there has been a demand for a sealing material that does not contain lead in the growing global environmental protection movement.
[0004]
Accordingly, various sealing materials that do not use lead, which is harmful to the human body, have been developed and proposed. As such a sealing material, for example, various solders mainly composed of tin, bismuth-silver, zinc-aluminum, or the like are employed.
[0005]
[Patent Document 1]
Japanese Patent Laid-Open No. 2000-307228
[Problems to be solved by the invention]
However, solders made of alloys containing tin, silver and zinc show excellent reliability in thermal fatigue resistance under temperature cycle conditions of -55 to 125 ° C, but these solders have a melting point of In any case, the temperature is 225 ° C. or lower, and when this solder is used as a sealing material for hermetically sealing the insulating base and the lid, 230 to 240 when the electronic device is mounted on the external electrical circuit or the like on the sealing material. The sealing material itself melts due to the heat history at 0 ° C., and the hermetic sealing inside the electronic device is broken.
[0007]
Also, solder containing bismuth-silver as the main component is inferior in heat-resistant fatigue properties under temperature cycle conditions of -55 to 125 ° C and lacks hermetic reliability. Had the problem of being.
[0008]
Furthermore, a solder composed mainly of zinc-aluminum is prone to corrosion when left in the air and lacks long-term hermetic reliability, which is also unsuitable for use in hermetic sealing of electronic devices. It had the problem of being appropriate.
[0009]
The present invention has been completed in view of such conventional problems, and the object of the present invention is to achieve the airtightness of the electronic device even when a heat history of 230 to 240 ° C. is applied when the electronic device is mounted on an external electric circuit or the like. It is an object of the present invention to provide a lid member friendly to the global environment that does not contain lead and that is excellent in corrosion resistance of the sealing material itself and does not contain lead, and an electronic component storage container using the same.
[0010]
[Means for Solving the Problems]
Electronic component storing container closure member of the present invention is a a lid, a lid for the container member for electronic parts housing comprising a sealing material which is deposited and formed on the surface of the lid, the sealing material Has a two-layer structure composed of a first layer and a second layer arranged in order from the lid side, and the second layer is made of tin-silver solder or tin-silver-copper solder having a melting point of 225 ° C. or lower. The first layer is formed of silver or a silver-copper alloy that forms an alloy having a melting point of 250 ° C. or more together with the solder of the second layer.
[0011]
According to the lid member for an electronic component storage container of the present invention, the second layer of the sealing material is formed of tin-silver solder or tin-silver-copper solder having a melting point of 225 ° C. or less , and the first layer is the second layer. Insulating substrate having a metallized metal layer having a frame shape on the sealing member and a lid member for a container for storing electronic parts , since it is formed of silver or a silver-copper alloy that forms an alloy having a melting point of 250 ° C. or more together with the solder of the layer When the container for storing electronic parts is manufactured using the above, the second layer of the sealing material has a low melting point of 225 ° C. or less and exhibits good fluidity in the sealing process, and the temperature rises during the sealing process. Due to the pressure increase inside the container and the sealing load at a constant pressure, it is pushed out of the container and forms a fillet around the lid, resulting in a good hermetic seal of the container Even in heat cycle tests such as temperature cycles It can be obtained component housing container. Further, since the second layer of the sealing material is pushed out of the container due to the thermal history of the sealing process, the metallized metal layer and the lid of the insulating base are separated from the metal of the first layer and the solder of the second layer. made, since the melting point is to be joined by via 250 ° C. or more alloys, resulting the application of heat history of 230-240 ° C. when mounting an electronic device in the sealing material to an external electrical circuit and the like However, the sealing material does not melt and the hermetic sealing inside the container is not broken.
[0013]
According to the electronic component storage container lid member of the present invention, in the above configuration, the first layer of the sealing material is made of silver or a silver-copper alloy that forms an alloy having a melting point of 250 ° C. or more together with the solder of the second layer. , the second layer having a melting point 225 ° C. or less of tin - silver solder or tin - silver - because it is formed by copper solder, silver of the first layer is readily react with tin solder of the main component of the second layer solidus temperature Te can be an alloy layer over 250 ° C. satisfactorily formed to obtain a high airtight reliable electronic component storing container.
[0014]
An electronic component storage container according to the present invention includes a mounting portion on which an electronic component is mounted on an upper surface, an insulating base having a frame-like metallized metal layer surrounding the mounting portion, and an electronic component storage container lid member having the above-described configuration. The lid is joined to the frame-like metallized metal layer via the sealing material, and an electronic component is hermetically accommodated in a container constituted by the insulating base and the lid. It is characterized by.
[0015]
According to the container for storing electronic parts of the present invention, the metallized metal layer and the lid of the insulating base are the first layer of silver or silver-copper alloy and the second layer has a melting point of 225 ° C. or lower. - silver - made of copper solder Prefecture, since the melting point is to be joined by via 250 ° C. or more alloys, the result, when mounting the electronic device to an external electric circuit such as a sealing material 230-240 Even if a heat history of 0 ° C. is applied, the sealing material does not melt and the hermetic sealing inside the container is not broken, and a container for storing electronic components with high hermetic reliability can be obtained.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Next, the electronic component storage container lid member and the electronic component storage container of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a cross-sectional view showing an example of an embodiment of a lid member for an electronic component storage container according to the present invention, FIG. 2 is an enlarged cross-sectional view of an essential part thereof, and in these drawings, 2 is a lid and 3 is a sealing member. The stop material, 3a is the first layer of the sealing material, 3b is the second layer of the sealing material, and these mainly constitute the lid member 1 for an electronic component storage container of the present invention.
[0017]
The lid body 2 constituting the electronic component storage container lid member 1 is mainly composed of, for example, a metal such as 42 alloy, iron, nickel, or cobalt alloy, or aluminum oxide, mullite, aluminum nitride, silicon carbide, glass ceramics, or the like. When the lid body 2 is made of metal such as a sintered body, the base material to be the lid body 2 is manufactured by punching with a punching die having a shape corresponding to the lid body 2, and When the lid 2 is made of ceramics, for example, an aluminum oxide sintered body, first, it is suitable for a raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), and magnesia (MgO). An organic solvent / solvent is added and mixed to form a slurry, which is then formed into a sheet by using a conventionally known doctor blade method, calendar roll method, etc. To obtain a green sheet, then, plural stacked with punching a ceramic green sheet into a predetermined shape, it is manufactured by firing at a temperature of about 1600 ° C..
[0018]
Note that metallized layers and plated layers of various metals are formed in the region where the sealing material 3 is applied. Even when the lid 2 is made of metal, a metallized layer or a plating layer made of various metals may be formed in a region where the sealing material 3 is applied.
[0019]
In the electronic component storage container lid member 1 of the present invention, the sealing material 3 has a two-layer structure including a first layer 3a and a second layer 3b arranged in this order from the lid body 2 side. The second layer 3b is formed of a solder mainly composed of tin, and the first layer 3a is formed of a metal mainly composed of a metal that forms an alloy having a melting point of 250 ° C. or more together with the solder of the second layer 3b. . This is important in the present invention.
[0020]
According to the lid member 1 for an electronic component storage container of the present invention, the second layer 3b of the sealing material 3 is formed of tin-silver solder or tin-silver-copper solder having a melting point of 225 ° C. or less. Since 3a is formed of silver or a silver-copper alloy that forms an alloy having a melting point of 250 ° C. or more together with the solder of the second layer 3b, a frame-like metallization is formed on the sealing member and the lid member 1 for a container for storing electronic components. When an electronic component storage container is manufactured using an insulating substrate having a metal layer, the second layer 3b of the sealing material 3 has a low melting point of 225 ° C. or less and exhibits good fluidity in the sealing step, Due to the increase in pressure inside the container due to temperature rise during the sealing process and the sealing load of a constant pressure, it is pushed out of the container to form a fillet well around the lid 2, and as a result, the container is hermetically sealed For thermal fatigue testing such as temperature cycling There it is possible to obtain a highly air-tight reliable electronic component storing container also. Further, since the second layer 3b of the sealing material 3 is pushed out of the container due to the thermal history of the sealing process, the metallized metal layer and the lid 2 of the insulating base are made of the metal of the first layer 3a and the second layer. made of solder Prefecture of 3b, since the melting point is to be joined by via 250 ° C. or more alloys, resulting, 230-240 ° C. at the time of mounting the electronic device to an external electric circuit such as the sealing material 3 Even if the heat history is added, the sealing material 3 does not melt and the hermetic sealing inside the container is not broken.
[0021]
Further, the first layer 3a of the sealing material 3 is made of silver or a silver-copper alloy which forms an alloy having a melting point of 250 ° C. or more together with the solder of the second layer 3b, and the second layer 3b has a melting point of 225 ° C. or less. tin - silver solder or tin - silver - it is necessary to form a copper solder.
According to the electronic component storage container lid member 1 of the present invention, the first layer 3a of the sealing material 3 is made of silver or a silver-copper alloy that forms an alloy having a melting point of 250 ° C. or more together with the solder of the second layer 3b. tin melting point of 225 ° C. or less and the second layer 3b - silver solder or tin - silver - because it is formed by copper solder, silver of the first layer 3a of the sealing material 3 is a solder of the second layer 3b composed mainly tin and readily react with the solidus temperature to form a 250 ° C. or more alloy layer region 3c is, it is possible to obtain a more airtight reliable electronic component storing container 4.
[0022]
Examples of the silver or silver -copper alloy that forms an alloy having a melting point of 250 ° C. or more together with the solder of the second layer 3b used for the first layer 3a include, for example, 72% by mass of silver and 28% by mass of copper. used co Akiragin filtration UGA made.
[0023]
In addition, as the tin-silver solder or tin-silver-copper solder having a melting point of 225 ° C. or lower used for the second layer 3b, for example, a co-forming of 96.5% by mass of tin and 3.5% by mass of silver. Akiraya, eutectic consisting of 95.75% by weight of tin and 3.5 wt% silver and 0.75 wt% copper, Oh Rui various solder containing no lead in composition close to the eutectic used . In addition, as such a tin-silver solder or tin-silver-copper solder having a melting point of 225 ° C. or less, from the viewpoint of thermal protection of electronic components and residual stress, a solder that can be melted at the lowest possible temperature is preferable. For example, a eutectic composed of 96.5% by mass of tin and 3.5% by mass of silver has a melting temperature of about 221 ° C., and forms an alloy excellent in heat resistance. Used.
[0024]
The thickness of the first layer 3a of the sealing material 3 is preferably 1 to 100 μm, and if it is less than 1 μm, the metal of the first layer 3a is eroded by the solder of the second layer 3b due to the thermal history during sealing. When the thickness exceeds 100 μm, the lid 2 tends to warp due to a difference in thermal expansion from the lid 2, and the hermetic sealing property tends to be incomplete. Therefore, the thickness of the first layer 3a is preferably 1 to 100 μm.
[0025]
Furthermore, the thickness of the second layer 3b of the sealing material 3 is preferably 10 to 100 μm, and if it is less than 10 μm, the hermetic sealing property tends to be incomplete, and if it exceeds 100 μm, the solder overflows to the outside during sealing. , Tends to impair the appearance of the product. Accordingly, the thickness of the second layer 3b is preferably 10 to 100 μm.
[0026]
Such a sealing material 3 is attached to the lid body 2 by the method described below. First, a metal paste obtained by adding and mixing an organic solvent / solvent to silver or a silver-copper alloy powder is screen-printed on the lid 2 to a thickness of 1 to 100 μm, or silver or silver-copper The first layer 3a is formed by a method such as a method of punching a film or sheet made of an alloy and having a thickness of 1 to 100 μm and melt-adhering to the substrate 1 at a temperature of 850 ° C. in a reducing gas. Next, the second layer 3b is formed on the first layer 3a by a method of generating solder mainly composed of tin by plating.
[0027]
Alternatively, as another method, a three-layer metal obtained by overlaying a material ribbon of the lid 2 with a silver-copper alloy ribbon having a suitable thickness in advance and a solder ribbon mainly composed of tin and press-rolling the whole. Is punched into the shape of the lid body 2 with a mold to obtain the lid member 1 for a container for storing electronic components , whereby the thickness of the first layer 3a is 1 to 100 μm and the thickness of the second layer 3b is 10 to 100 μm. The sealing material 3 is formed on the surface of the electronic component storage container lid member 1.
[0028]
Thus, according to the electronic component storage container lid member 1 of the present invention, the second layer 3b of the sealing material 3 is formed of tin-silver solder or tin-silver-copper solder having a melting point of 225 ° C. or less . silver or silver-melting layer 3a with the solder of the second layer 3b to form a 250 ° C. or more alloys - since the formation of copper alloy, of the frame to the electronic component storing container lid member 1 and the sealing surface When an electronic component storage container is manufactured using an insulating substrate having a metallized metal layer, the second layer 3b of the sealing material 3 has a low melting point of 225 ° C. or less and exhibits good fluidity in the sealing process. , The pressure inside the container increases due to the temperature rise during the sealing process, and it is pushed out of the container by the sealing load of constant pressure to form the fillet well around the lid, and as a result, the container is hermetically sealed Heat fatigue such as temperature cycle It is possible to obtain high electronic component storing container airtight reliability even experience. Further, since the second layer 3b of the sealing material 3 is pushed out of the container due to the thermal history of the sealing process, the metallized metal layer and the lid 2 of the insulating base are made of the metal of the first layer 3a and the second layer. made of solder Prefecture of 3b, since the melting point is to be joined by via 250 ° C. or more alloys, resulting, 230-240 ° C. at the time of mounting the electronic device to an external electric circuit such as the sealing material 3 Even if the heat history is added, the sealing material 3 does not melt and the hermetic sealing inside the container is not broken.
[0029]
Next, an electronic component storage container using the electronic component storage container lid member 1 of the present invention will be described in detail with reference to FIGS. 3 and 4.
[0030]
FIG. 3 is a cross-sectional view showing an example of an embodiment of an electronic component storage container according to the present invention. FIG. 4 is an enlarged cross-sectional view of a main part thereof. In these drawings, 4 is an electronic component storage container. It is an insulating substrate. FIG. 3 shows an example in which an electronic device 6 is mounted on an electronic component storage container to form an electronic device.
[0031]
The insulating base 5 is provided with a recess for accommodating the electronic component 6 at the center of the upper surface, and the electronic component 6 is bonded and fixed to the bottom surface of the recess via an adhesive such as glass, resin, or brazing material. Is done.
[0032]
In addition, a plurality of metallized wiring layers (not shown) are deposited from the bottom surface of the concave portion of the insulating base 5 to the outer peripheral portion, and each part of the electronic component 6 is located at the bottom surface of the concave portion of the metallized wiring layer. The electrode is electrically connected via the bonding wire 8 and the portion leading out is electrically connected to the wiring conductor (not shown) of the external electric circuit board via the conductive connecting member.
[0033]
Furthermore, a frame-like metallized metal layer 7 for bonding to the electronic component storage container lid member 1 of the present invention is attached to the outer periphery of the concave portion on the upper surface of the insulating base 5.
The insulating base 5 is made of an electrically insulating material such as a sintered body mainly composed of aluminum oxide, mullite, aluminum nitride, silicon carbide, glass ceramics, etc., for example, if it is made of an aluminum oxide sintered body, First, a suitable organic solvent / solvent is added to and mixed with raw material powders such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), and magnesia (MgO) to form a mud, which has been conventionally known. The ceramic blade is formed into a sheet by using the doctor blade method, the calender roll method, etc., and then a ceramic green sheet is punched into a predetermined shape and stacked, and fired at a temperature of about 1600 ° C. It is manufactured by.
[0034]
The metallized wiring layer and the frame-shaped metallized metal layer 7 are made of a high melting point metal such as tungsten, molybdenum, or manganese, and a metal paste obtained by adding an organic solvent / solvent to these powders is placed at a predetermined position on the ceramic green sheet. In addition, it is formed by depositing in a predetermined pattern by a conventionally known screen printing method and firing at the same time as the ceramic green sheet. The frame-like metallized metal layer 7 is coated with a noble metal such as gold having excellent corrosion resistance on the surface and good wettability with a soldering material such as solder to a thickness of 0.1 to 1 μm by plating or the like. If it keeps it, it will become possible to join with lid 2 without using flux.
[0035]
Note that if the flux scatters inside the electronic component storage container 4, the electrodes of the electronic component 6 are corroded and cause disconnection. Therefore, the surface of the frame-like metallized metal layer 7 has noble metal such as gold. It is preferable that the metallized metal layer 7 and the electronic component housing container lid member 1 are joined without using a flux.
[0036]
The electronic component housing container lid member 1 is bonded to the metallized metal layer 7 formed on the outer periphery of the concave portion on the upper surface of the insulating substrate 5 through the sealing material 3 made of metal formed on the lower surface of the metallized container lid member 1. Is done.
The joining between the insulating substrate 5 and the electronic component storing container lid member 1, the electronic component storing so that the sealing material 3 sandwiched between the frame-shaped metallized metal layer 7 and the cover 2 of the insulating base 5 The container lid member 1 is placed on the insulating substrate 5, and then the lid 2 is pressed against the insulating substrate 5 at a constant pressure while the peak temperature is about 260 to 300 ° C. in a nitrogen atmosphere sealing furnace. For 0.5 to 10 minutes to melt the sealing material 3, the solder of the second layer 3 b of the sealing material 3 flows out to form a fillet, and the first layer 3 a and the second layer 3 b The alloy layer 3c grows on the metallized metal layer 7 side of the insulating base 5, and the lid 2 is airtight on the upper surface of the insulating base 5 via the first layer 3a and the second layer 3b of the sealing material 3. Will be joined.
[0037]
Note that the alloy of the alloy layer 3c needs to have a solidus temperature exceeding the heating temperature of 230 to 240 ° C. when the electronic device is mounted on an external electric circuit or the like. As a result, even if the sealing material 3 is exposed to the heating temperature when mounting the electronic device on the external electric circuit, silver or silver that forms an alloy having a melting point of 250 ° C. or higher together with the solder of the second layer 3b of the first layer 3a The silver-copper alloy and the second layer 3b have a melting point of 225 ° C. or lower, tin-silver solder or an alloy layer 3c formed between the tin-silver-copper solder, and the outer peripheral portion has a melting point of 225 ° C. or lower. There will be a second layer 3b of silver solder or tin-silver-copper solder . Therefore, even if the second layer 3b of tin-silver solder or tin-silver-copper solder having a melting point of 225 ° C. or lower is melted, the molten second layer 3b is held by the alloy layer 3c, and the container is airtight. Will not be damaged.
[0038]
Thus, according to the electronic component storage container lid member 1 and the electronic component storage container 4 using the same according to the present invention, the electronic component 6 such as a semiconductor element is bonded to the bottom surface of the recess of the insulating base 5 via an adhesive or the like. At the same time, each electrode of the electronic component 6 is connected to the metallized wiring layer via the bonding wires 8 and the like, and then the sealing material 3 adhered to the main surface of the lid 2 facing the insulating substrate 5. Is heated and melted, and the container composed of the insulating base 5 and the lid 2 is sealed to provide an electronic device as a final product.
[0039]
The present invention is not limited to the above-described embodiments, and various modifications are possible as long as they do not depart from the gist of the present invention. In the above-described embodiments, semiconductor elements are exemplified as electronic components, Although the electronic device containing this has been described in detail, it can also be applied to an electronic device containing an electronic component such as a piezoelectric vibrator or a surface acoustic wave element. FIG. 4 shows an example in which the sealing material has a three-layer structure of the first layer, the alloy layer, and the second layer. However, the sealing material has all the first layers as alloy layers, and the alloy layer and the second layer. It may be a two-layer structure composed of layers. Furthermore, in the above-described embodiment, the lid body has a flat plate shape and the insulating base has a shape having a concave portion at the center of the upper surface. However, the lid body has a shape having a concave portion on the surface facing the insulating base, for example. Of course, the substrate may have a flat plate shape.
[0040]
【The invention's effect】
According to the lid member for an electronic component storage container of the present invention, the second layer of the sealing material is formed of tin-silver solder or tin-silver-copper solder having a melting point of 225 ° C. or less , and the first layer is the second layer. Insulating substrate having a metallized metal layer having a frame shape on the sealing member and a lid member for a container for storing electronic parts , since it is formed of silver or a silver-copper alloy that forms an alloy having a melting point of 250 ° C. or more together with the solder of the layer When the container for storing electronic parts is manufactured using the above, the second layer of the sealing material has a low melting point of 225 ° C. or less and exhibits good fluidity in the sealing process, and the temperature rises during the sealing process. Due to the pressure increase inside the container and the sealing load at a constant pressure, it is pushed out of the container and forms a fillet around the lid, resulting in a good hermetic seal of the container Even in heat cycle tests such as temperature cycles It can be obtained component housing container. Further, since the second layer of the sealing material is pushed out of the container due to the thermal history of the sealing process, the metallized metal layer and the lid of the insulating base are separated from the metal of the first layer and the solder of the second layer. made, since the melting point is to be joined by via 250 ° C. or more alloys, resulting the application of heat history of 230-240 ° C. when mounting an electronic device in the sealing material to an external electrical circuit and the like However, the sealing material does not melt and the hermetic sealing inside the container is not broken.
[0041]
According to the lid member for an electronic component storage container of the present invention, the first layer of the sealing material is made of silver or a silver-copper alloy that forms an alloy having a melting point of 250 ° C. or more together with the solder of the second layer . melting point two layers 225 ° C. or less of tin - silver solder or tin - silver - because it is formed by copper solder, solid silver of the first layer is readily react with tin solder of the main component of the second layer it can be phase line temperature of the alloy layer above 250 ° C. with good form, to obtain a highly airtight reliable electronic component storing container.
[0042]
According to the container for storing electronic parts of the present invention, the metallized metal layer and the lid of the insulating base are the first layer of silver or silver-copper alloy and the second layer has a melting point of 225 ° C. or lower. - silver - made of copper solder Prefecture, since the melting point is to be joined by via 250 ° C. or more alloys, the result, when mounting the electronic device to an external electric circuit such as a sealing material 230-240 Even if a heat history of 0 ° C. is applied, the sealing material does not melt and the hermetic sealing inside the container is not broken, and a container for storing electronic components with high hermetic reliability can be obtained.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage container lid member of the present invention.
FIG. 2 is an enlarged cross-sectional view of a main part of FIG.
FIG. 3 is a cross-sectional view showing an example of an embodiment of an electronic component storage container according to the present invention.
4 is an enlarged cross-sectional view of a main part of FIG. 3;
[Explanation of symbols]
1 .... Lid for electronic parts storage container 2 .... Lid 3 ... Sealing material 3a ... 1st layer 3b ... 2nd layer 3c ... Alloy layer 4 ... Container for storing electronic parts 5 ... Insulating substrate 6 ... Electronic parts 7 .... Metallized metal layer

Claims (2)

蓋体と、該蓋体の表面に被着形成された封止材とから成る電子部品収納用容器用蓋部材であって、前記封止材は、前記蓋体側から順に配置された第１層および第２層から成る２層構造を有しており、前記第２層を融点が２２５℃以下の錫−銀半田または錫−銀−銅半田で形成し、前記第１層を前記第２層の半田と共に融点が２５０℃以上の合金を形成する銀または銀−銅合金で形成したことを特徴とする電子部品収納用容器用蓋部材。An electronic component storage container lid member comprising a lid and a sealing material deposited on the surface of the lid, wherein the sealing material is arranged in order from the lid side And the second layer is formed of tin-silver solder or tin-silver-copper solder having a melting point of 225 ° C. or less , and the first layer is the second layer. A lid member for a container for storing electronic components , characterized in that it is formed of silver or a silver-copper alloy that forms an alloy having a melting point of 250 ° C. or higher together with the solder. 上面に電子部品が搭載される搭載部および該搭載部を取り囲む枠状のメタライズ金属層を有する絶縁基体と、請求項１記載の電子部品収納用容器用蓋部材とから成り、前記枠状のメタライズ金属層に前記封止材を介して前記蓋体を接合させ、前記絶縁基体と前記蓋体とで構成される容器の内部に前記電子部品を気密に収容することを特徴とする電子部品収納用容器。A frame-shaped insulating substrate having a metallized metal layer surrounding the mounting portion and the mounting portion on which an electronic component is to be mounted on the upper surface consists of a electronic component storing container closure member according to claim 1 Symbol mounting, the frame-like via the sealing material to the metallized metal layer is bonded to the lid, the electronic component housing, characterized in that housed in airtight the electronic component of the container constituted by the said insulating substrate and the cover Container.

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