JP3983609B2 - Component mounting tool and component mounting method and apparatus using the same - Google Patents

Component mounting tool and component mounting method and apparatus using the same Download PDF

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Publication number
JP3983609B2
JP3983609B2 JP2002183304A JP2002183304A JP3983609B2 JP 3983609 B2 JP3983609 B2 JP 3983609B2 JP 2002183304 A JP2002183304 A JP 2002183304A JP 2002183304 A JP2002183304 A JP 2002183304A JP 3983609 B2 JP3983609 B2 JP 3983609B2
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Prior art keywords
suction
suction nozzle
component
polishing
ultrasonic vibration
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JP2003017534A (en
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和司 東
昌三 南谷
真司 金山
健治 高橋
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、部品を実装対象物に金属接合部どうしの摩擦接合を伴い実装する部品実装ツールと、これを用いた部品実装方法およびその装置に関するものであり、ベアＩＣチップなどの電子部品をプリント配線された回路基板などに、超音波接合による電気接合を伴って実装し、電子回路基板を製造するような場合に利用される。
【０００２】
【従来の技術】
ベアＩＣチップは、例えば、半導体ウエハの上に回路パターンが薄膜技術を駆使して形成されたもので、プリント基板に実装して電子回路基板を製造するのに用いられる。ベアＩＣチップは、回路基板にプリント配線などして形成された導体ランドに電気接合するための電極が回路パターンとともに形成され、パッケージが施されないまま電極を持った接合面を回路基板の導体ランドを持った接合面に対向させて、導体ランドおよび電極間の電気接合を図った状態で固定するいわゆる面実装が行われる。
【０００３】
このような実装を行うのに本出願人は、ベアＩＣチップの電極の上に金属製のバンプをワイヤボンディングなどによって形成し、このベアＩＣチップを吸着ノズルによって吸着、保持して取り扱い、位置決めされた回路基板の上の所定位置に対向させて、前記バンプを回路基板の導体ランドに押し当てた状態で、吸着ノズルの揺動できるように支持された支持点と吸着面との間に超音波振動を与えてベアＩＣチップを振動させることにより、バンプおよび導体ランドどうしを摩擦させて超音波接合し、ベアＩＣチップを回路基板に実装する方法を先に提案している。
【０００４】
これにより、ベアＩＣチップなどの部品を金属結合を伴う接合により、確実な電気接合と高い実装強度を満足して、しかも迅速に回路基板に実装することができる。その際、吸着ノズルにステンレス鋼製のものを用いると振動特性がよく、部品と実装対象物の金属接合部どうしを超音波接合するのに好適である。また、吸着面を所定の面粗度を持った粗面にしておくことで、部品との間の滑りを抑えて振動の伝達性をよくし超音波接合の作業効率と接合品質を向上することができる。
【０００５】
ところで、ステンレス鋼製の吸着ノズルで超音波接合を好適に行えるのは比較的短時間である。これは吸着ノズルの吸着面が部品との超音波振動状態での接触によって摩耗し、当初表面粗さ３μｍ〜５μｍ程度の面粗度を持った平面が荒れて、凹凸の高さが変化したり平面性が低下したりすることに原因している。この摩耗にはステンレス鋼とＩＣチップ側のＧａＡｓやＳｉなどとの間の電気化学反応、あるいは吸着面とＩＣチップとの間に噛み込んでいる異物による傷つきなども関係している。接合部品がＳＡＷフィルタであるような場合はＬｉＴａＯ3 やＬｉＮｂＯ3 、水晶が用いられていて固く吸着面が特に荒れやすい。
【０００６】
そこで、従来、例えばＳＵＳ４２０Ｊ２といった硬度の高いステンレス鋼を用い、しかも吸着面を焼き入れ処理しているが、それでも、５００ケ程度の接合回数で接合不良が生じ始めることがある。接合不良はＩＣチップが割れたり、接合時のシェア強度が得られないと云った状態が生じる。これら接合不良の発生によって超音波接合が好適に行えなくなったと人が判断したとき、吸着ノズルを装置から取り外して吸着面を研磨して再生し、再使用するようにしている。
【０００７】
【発明が解決しようとする課題】
しかし、上記のような再生処理を頻繁に行うのでは手間であるし、装置の休止時間が長くなって生産性に影響する。また、研磨による再生が頻繁になり吸着ノズルの寿命が短い。一例を示すと、吸着ノズルは３０回の研磨で使用限界まで短くなり月１本消費している。
【０００８】
そこで、ステンレス鋼よりも耐摩耗性に優れた材料でできた吸着ノズルを用いることが考えられる。しかし、これでは振動特性が悪く超音波接合が好適に行えない。
【０００９】
本発明の目的は、振動特性の低下なく吸着面の耐摩耗性が向上する吸着ノズルと、これを用いて部品の金属接合部どうしの超音波接合を伴う実装を行い、必要に応じて超音波接合のための超音波振動で吸着面の再生を短時間で図って部品の接合を続けられる部品実装方法、および部品実装装置を提供することにある。
【００１０】
【課題を解決するための手段】
上記のような目的を達成するため、本発明の吸着ノズルは、ステンレス鋼よりなり、吸着面に硬化処理層を有するものとし、あるいは、吸着面を持った吸着ヘッド部だけを超硬金属製とするのに併せ、吸着面の表面が所定の面粗度を持つ粗面に形成されていることを特徴としている。
【００１１】
これらを用いて、吸着面で吸着した部品を、実装対象物に対し互いの金属接合部を対向させて加圧しながら、吸着ノズルに超音波振動を与えて、この振動により金属接合部どうしを摩擦させて、溶融を伴い、または電子間結合を伴うなどして、超音波接合し部品を実装対象物に実装するのに、吸着ノズルがステンレス鋼で、その吸着面が所定の面粗度を持つ粗面に形成されていることにより、硬化処理層や一端部だけの超硬金属よりなる吸着ヘッド部の影響なく、好適な振動特性と、部品への好適な振動伝達特性とを発揮して、前記超音波接合を短時間で高品質に達成することができ、しかも、硬化処理や超硬金属により、粗面とした吸着面の面粗度が超音波接合時の摩耗や電気化学反応、異物の影響により低下するのを抑えて前記良好な接合特性を長い時間安定して発揮させ、再生処理の必要頻度を低くすることができる。従って、吸着ノズルの寿命が長くなるとともに、再生処理の手間が軽減し、金属接合部の超音波接合を伴い部品を実装する作業の休止時間が短くなって生産性が向上する。
【００１２】
硬化処理層は種々に設けることができるが、改質処理層で代表することができる。
【００１３】
上記のような吸着ノズルによる超音波接合を伴う部品の実装を繰り返しながら、所定の時期に、吸着面を研磨材に接触させた状態で吸着ノズルに前記同様に超音波振動を与えて、吸着面と研磨材とを摩擦させ、吸着面を所定の面粗度に再生する再生処理を行う部品実装方法によれば、再生のための研磨が超音波振動による振動的摩擦で効率よく短時間で達成できるので、再生処理のための時間を短縮することができ、部品実装作業中に吸着ノズルを交換しないで再生処理を行うのに有効である。
【００１４】
研磨材に連続したものを用い、吸着面との接触位置を更新するように送ると、研磨材をいちいち交換せずに前記特徴ある再生処理を安定して繰り返し行える。
【００１５】
送りは１回あるいは所定回数再生処理を終える都度行ってもよいし、研磨中に間欠に、あるいは連続して行ってもよい。
【００１６】
前記研磨の再生処理に代えて、吸着面を洗浄液に浸漬させた状態で吸着ノズルに前記同様に超音波振動を与えて洗浄することにより、吸着面に部品の接合で詰まった付着物を効率よく除去することができ、場合によってはこれだけでも、吸着面を所定の面粗度に再生する再生処理になり、研磨しないで再生できるし、この洗浄を、吸着面を研磨した後に行うと、吸着面の研磨により再生された表面に付着し、詰まっている研磨粉などを除去して、それらによる振動伝達特性への影響をなくせる。洗浄の後、吸着面をブローすることにより、洗浄液を早期に乾燥させられるので、洗浄後早期に再使用することができ、部品実装作業中に吸着ノズルを交換しないで再生処理を行うのに有効である。ブローは冷風によるのが熱の影響や消費がなく好適である。
【００１７】
上記のような部品実装方法において、吸着ノズルに与える超音波振動は、吸着面を粗面にする研磨方向、つまりすじ状の研磨痕ができる方向と交差する方向で与えると、吸着面が研磨されたときのすじ状の研磨痕と交差する方向に振動されて、研磨痕による部品との引っ掛かり性が高くなるので、振動伝達特性が向上する。この意味で研磨方向と振動方向は直交する方向であるのがより好適である。
【００１８】
上記のような部品実装方法を達成する装置としては、部品を供給する部品供給部と、部品を実装する実装対象物を取り扱い位置に位置決めして部品の実装に供する実装対象物取り扱い手段と、供給される部品を吸着ノズルの吸着面に吸着、保持して取り扱い、位置決めされた実装対象物との間で金属接合部どうしを対向させて加圧しながら超音波振動による超音波接合を伴い部品を実装対象物に実装する部品取り扱い手段と、吸着ノズルに超音波振動を与える超音波振動手段と、研磨材と吸着面との摩擦接触にて吸着面を所定の面粗度の粗面に研磨する研磨手段と、部品を実装対象物に超音波接合を伴い実装するのに併せ、所定の時期に、吸着ノズルの吸着面を研磨手段の研磨材に接触させながら超音波振動手段を働かせて、吸着面と研磨材を摩擦させ、吸着面を研磨させる制御手段とを備えればよい。
【００１９】
これによると、１つの装置で、上記のような吸着ノズルを装着して金属接合部どうしの超音波接合を伴って部品を実装対象物に実装することを繰り返しながら、制御手段が予め定められるなどした所定の時期において、吸着ノズルの吸着面と研磨材を接触させながら超音波振動手段を働かせて吸着ノズルに超音波振動を与えて摩擦させ、研磨による再生処理を自動的に効率よく行うので、吸着ノズルが再生処理の繰り返しにより研磨代が無くなって寿命に達するまで 使用し続け、吸着ノズルを再生処理する都度いちいち着脱するような手間を省き、装置が長く休止して生産性が低下するのを防止することができる。
【００２０】
超音波接合時の吸着面と部品との間の滑り状態を検出する滑り検出手段を備え、制御手段は滑り検出手段の検出結果に応じて所定の時期を設定し研磨を行うようにすると、所定の時期が予め定めた一定の時期である場合に比し、必要の都度対応できるので、再生処理が遅れて接合品質が低下したり、再生処理が早すぎて研磨代の無駄な減少を招いて吸着ノズルの寿命を徒に短くするようなことを防止することができる。
【００２１】
洗浄液を貯留した洗浄槽を備え、制御手段は吸着ノズルの吸着面を研磨した後、吸着ノズルの吸着面を洗浄槽内の洗浄液に浸漬させるとともに、超音波振動手段を働かせて、研磨後の吸着面を洗浄するようにすれば、研磨と洗浄による再生処理が部品実装を行う１つの装置で自動的に効率よく行えるし、ブロー手段を備え、制御手段は洗浄後の吸着面をブロー手段によりブローして乾燥させるようにすれば、研磨、洗浄および乾燥による再生処理が部品実装を行う１つの装置で自動的に効率よく行える。
【００２２】
研磨手段は、研磨材を吸着面との摩擦位置に支持し、または案内する支持面の水平状態を調整する水平調整手段を備えていると、吸着ノズルを部品取り扱い手段が取り扱うときの装置上の吸着ノズルの軸線に対し直角となる水平状態が得られるので、吸着面を吸着ノズルの軸線に対し直角な向きに研磨することができ、吸着面を自動的に研磨して再生処理をすることによって吸着面の向きに狂いが生じるようなことを防止することができる。
【００２３】
研磨手段が、水平調整される定盤の上に吸着保持されたガラス板にて支持面を形成していると、研磨材に超音波振動する吸着ノズルが押しつけられて研磨するときに研磨材の支持面に金属部材の場合のような弾性変形による逃げが生じないので、研磨材の支持面を水平調整した正しい向きのまま吸着面を研磨することができる。
【００２４】
研磨手段が、長尺の研磨材を支持面上を移動させる送り手段を備え、制御手段は研磨中適宜に送り手段を働かせると、研磨材を１回あるいは必要回数再生処理を終える都度搬送したり、研磨中に間欠に、あるいは連続して搬送したりして、研磨材の吸着面を研磨している部分を順次更新していくことが自動的に達成される。
【００２５】
本発明のそれ以上の目的および特徴は以下の詳細な説明と図面の記載によって明らかになる。本発明の各特徴は、可能な限りにおいて、それ単独で、あるいは種々な組み合わせで複合して用いることができる。
【００２６】
【発明の実施の形態】
以下、本発明の部品実装のための吸着ノズルと、これを用いた部品実装方法およびその装置の実施の形態について、実施例とともに図１〜図１０を参照しながら説明し、本発明の理解に供する。
【００２７】
本実施の形態は、図６に示すように半導体ウエハ１がダイシングシート２上で個々のベアＩＣチップ３にダイシングされたものを部品として吸着ノズル１４により吸着して取り扱い、図３に示すようにプリント配線板などの回路基板４を実装対象物とし、双方の金属接合部５、６の溶融を伴い、あるいは電子間結合を伴うなどした、超音波接合による電気接合を伴ってベアＩＣチップ３を回路基板４に実装する場合の一例であり、１つの実施例としてベアＩＣチップ３の金属接合部５は半導体ウエハ１の上に薄膜技術によって形成された電極７にワイヤボンディング技術で形成した金属製のバンプ８とし、回路基板４の金属接合部６はその表面に形成された導体ランド９としてある。もっとも、本発明はこれに限られることはなく、他の電子部品や電子部品以外の種々な部品を種々な金属部分の超音波接合を伴って、回路基板や回路基板以外の板状物、他の形態のものを含む種々な実装対象物に各種に部品実装する全ての場合に適用できる。
【００２８】
ここに、本実施の形態の吸着ノズル１４は、金属接合部５、６の超音波接合を伴う部品実装のためのもので、図６に示すような部品実装装置に適用される。この部品実装装置は、図６に示すように、ベアＩＣチップ３などの部品を所定位置Ａに供給する部品供給部２１と、ベアＩＣチップ３を金属接合部５、６どうしの超音波接合による電気接合を伴って実装する回路基板４などの実装対象物を部品実装位置Ｂに供給して部品の実装に供した後、これを他へ移す実装対象物取り扱い手段２２と、部品供給部２１で供給される部品を吸着ノズル１４などの部品実装ツールで保持して取り扱い、図３に示すようにベアＩＣチップ３のバンプ８などの金属接合部５を有した接合面３ａを回路基板４の導体ランド９などの金属接合部６を有した接合面４ａに対向させて、双方の金属接合部５、６どうしが対向するように位置合わせして加圧し実装に供する部品取り扱い手段２３と、吸着ノズル１４の揺動できるように支持された揺動点と吸着面との間に超音波振動を与える超音波振動手段２４と、部品実装位置Ｂにて、実装対象物取り扱い手段２２が取り扱う回路基板４の金属接合部６である導体ランド９などに、部品取り扱い手段２３が取り扱うベアＩＣチップ３などの部品の金属接合部５であるバンプ８などを対向させた状態にして、加圧しながら超音波振動手段２４を働かせて、それらバンプ８および導体ランド９である金属接合部５、６どうしを超音波接合させる制御手段２５とを備えている。しかし、吸着ノズル１４の超音波振動のための揺動機構はこれに限られることはなく、往復移動を含む種々な振動支持方式を採用することができる。
【００２９】
図６に示す実施例では、基台の前部に実装対象物取り扱い手段２２が設けられ、回路基板４をそのベアＩＣチップ３との接合面４ａが上向きとなるように取り扱い、上方から簡易に実装されるようにしている。実装対象物取り扱い手段２２はレール３２に沿って回路基板４を一端のローダ部３３から他端のアンローダ部３４までＸ方向に搬送する搬送手段をなしている。しかし、回路基板４が小さいなど実装対象物の大きさや形状、形態などによっては、これを持ち運ぶタイプの手段とすることもできる。レール３２はローダ部３３の下流側直ぐに定められた部品実装位置Ｂの範囲の部分が、図６、図８に示すように独立したレール３２ａとされ、このレール３２ａと、このレール３２ａに受け入れた回路基板４を下方から吸着保持するボンディングステージ３５とを、前記Ｘ方向と直行するＹ方向に移動させるＹ方向テーブル３６で支持して設け、レール３２と並ぶ回路基板４の受け渡し位置Ｂ１と、これよりも後方の部品の実装作業を行う図６に示す実装作業位置Ｂ２との間で往復移動させる。
【００３０】
これにより、ローダ部３３から部品実装位置Ｂのレール３２ａ上に回路基板４が到達する都度、ボンディングステージ３５ではその回路基板４をストッパ３０ａが所定位置に受止めた後、受け止めた回路基板４を押圧子３０ｂによりレール３２ａの一方に押圧して位置規正する。位置規正後の回路基板４はボンディングステージ３５で吸着保持する。これに併せ、ボンディングステージ３５を前記実装作業位置Ｂ２に移動して位置決めし、吸着保持している回路基板４への部品の実装に供する。実装作業位置Ｂ２で部品の実装が終了する都度ボンディングステージ３５はレール３２と並ぶ受け渡し位置Ｂ１に移動されて、回路基板４の吸着を解除するとともに部品実装後の回路基板４をレール３２ａからレール３２の下流側に送りだしてアンローダ部３４まで搬送し他への搬出を図る。以上で多数の回路基板４を順次にベアＩＣチップ３などの部品の実装に供して電子回路基板を連続的に製造することができる。
【００３１】
一方、ローダ部３３およびボンディングステージ３５にはヒータを埋蔵するなどした予備加熱部３３ａおよび本加熱部３５ａが設けられ、部品の実装に供される回路基板４をそれぞれの位置にある間予備加熱、および本加熱して、回路基板４とベアＩＣチップ３との間に充満される図３に示すような封止材１１を２５℃程度に加熱できるようにする。
【００３２】
このように低温の加熱でよいのは、本実施の形態の場合、封止材１１は回路基板４の上に図３に仮想線で示すように予め供与しておき、前記ベアＩＣチップ３を回路基板４に実装する際のベアＩＣチップ３が回路基板４に近づく過程で、双方の接合面３ａ、４ａで圧迫して双方間に拡充させ図３に示すように充満させていくので、通常の流し込みの場合のような低粘度の封止材を用いる場合のような、６５℃前後と云った高温に加熱する必要がないことによる。
【００３３】
このように、比較的低温な加熱であるのでベアＩＣチップ３を回路基板４に超音波接合する作業のうちに封止材１１をほぼ硬化させることができ予備加熱を省略することはできる。しかし、予備加熱を行えばより無理なく加熱できる。もっとも、封止材１１を硬化させるのに紫外線など光を用いることもできる。
【００３４】
レール３２の部品実装位置Ｂの下流側でレール３２の後方に部品供給部２１が設けられ、ダイシングシート２上で半導体ウエハ１が個々のベアＩＣチップ３にダイシングされた部品をストックする部品マガジン３８を装着して昇降させるマガジンリフタ４１と、部品マガジン３８にストックされた所定の種類のベアＩＣチップ３が、マガジンリフタ４１による部品マガジン３８の高さ設定によって図示しない出し入れ手段に対向させることで、ダイシングシート２ごと押し出され、または引き出されるのを保持し、ダイシングシート２をエキスパンドして各ベアＩＣチップ３の間隔を広げてピックアップされやすくするエキスパンド台３７とを設置している。
【００３５】
エキスパンド台３７はＸ方向テーブル４２によりＸ方向に、Ｙ方向テーブル４３によりＹ方向に移動されて、ダイシングシート２上のベアＩＣチップ３のうちの供給するものをダイシングシート２の下方から突き上げられる突き上げ棒４４のある部品供給位置Ａに順次に位置決めして、必要なだけ供給できるようにする。ベアＩＣチップ３の供給を終えるか、供給するベアＩＣチップ３の種類を変えるような場合、エキスパンド台３７上のダイシングシート２を必要なものと交換する。これにより、各種のベアＩＣチップ３を必要に応じて順次自動的に供給して実装されるようにすることができる。もっとも、部品供給部２１は実装する部品の種類や形態に応じた構成にすればよいし、各種の構成の部品供給部２１をこれに対応する部品取り扱い手段２３などと共に、１組あるいはそれ以上の組み合わせ数で併設することができる。
【００３６】
上記のように、回路基板４をその接合面４ａが上向きとなるようにしてベアＩＣチップ３などの部品の実装に供し、部品供給部２１が接合面３ａを上にしたベアＩＣチップ３を供給して前記上向きの回路基板４への実装に供するものであるのに対応して、本実施の形態では部品取り扱い手段２３を、接合面３ａが上向きとなったこのベアＩＣチップ３などの部品を部品実装ツールの１例である吸着ノズル４５などによって上方から保持してピックアップした後、接合面３ａが下向きとなるように反転させるように、具体的には、部品取り扱い側の、部品取り扱い端である吸着面４５ａから離れた位置Ｃ、あるいは吸着面４５ａ上を中心に旋回させて接合面３ａを下向きに反転させるように、ベアＩＣチップ３などの部品を取り扱う図６、図９に示すような部品反転手段２３ａと、超音波振動手段２４を装備し、部品反転手段２３ａにより接合面３ａを下にされたベアＩＣチップ３などの部品を上方から保持してピックアップした後、実装対象物取り扱い手段２２によって部品実装位置Ｂで接合面４ａが上向きにされている回路基板４などの実装対象物との超音波接合に供するように部品を取り扱う図７、図１０に示すような接合手段２３ｂとで構成している。しかし、ベアＩＣチップ３の上記反転方式以外の種々な運動方式を採用して反転させてもよい。
【００３７】
ここで、回路基板４にベアＩＣチップ３を実装するのは接合手段２３ｂであって、この接合手段２３ｂに前記の吸着ノズル１４を装備している。回路基板４にベアＩＣチップ３などの部品の実装を行わない部品反転手段２３ａに装着した吸着ノズル４５は吸着ノズル１４とは異なったものである。
【００３８】
これにより、半導体ウエハ１が、ダイシングシート２上でダイシングされて接合面３ａが上に向いたベアＩＣチップ３などで、所定位置にてエキスパンド台３７によりダイシングシート２をエキスパンドした荷姿状態で供給され、それを図の実施例のように専用して、あるいは別の荷姿の部品と複合して供給される場合でも多数を繰り返し用いて、繰り返し実装するようなときに、ダイシングシート２上のベアＩＣチップ３などを反転手段２３ａによって上方からピックアップして接合面３ａが下向きとなるように反転させた後、これを接合手段２３ｂにより上方からピックアップして、実装対象物取り扱い手段２２によって取り扱われ部品実装位置Ｂで接合面４ａが上向きにされている回路基板４などの実装対象物に上方から接触させて加圧し双方の金属接合部５、６であるバンプ８および導体ランド９どうしを超音波接合する。このように、反転手段２３ａと接合手段２３ｂとが協働したベアＩＣチップ３などの部品の取り扱いによって、ベアＩＣチップ３などの上向きで供給される部品を上向きで取り扱われる回路基板４などの実装対象に順次混乱なく多数繰り返し実装することができる。
【００３９】
図に示す実施例では、反転手段２３ａは供給されるベアＩＣチップ３などの部品をピックアップする部品供給位置Ａと、ピックアップしたベアＩＣチップ３の接合面３ａが下向きとなるように反転させた後、接合手段２３ｂによる接合のためのピックアップに供する受け渡し位置Ｄとの間をＸ方向テーブル５６により往復移動される基台５７に、モータ５１およびこれによって回転駆動される横軸５２を設け、この横軸５２のまわりに部品取り扱いツールの一例である吸着ノズル４５が１本、あるいは複数本放射状方向に装備した部品反転ヘッド５４を持ち、吸着ノズル４５は部品反転ヘッド５４上でエアシリンダ５５により軸線方向に進退させられる。
【００４０】
これにより、反転手段２３ａは下向きにされた吸着ノズル４５が部品供給位置Ａにて昇降して、そこに供給されているベアＩＣチップ３を吸着してピックアップした後、吸着ノズル４５を前記位置Ｃの回りに回動させて上向きにすることで、前記ピックアップしたベアＩＣチップ３の接合面３ａを上向きから下向きに反転させて、受け渡し位置Ｄに移動して接合手段２３ｂによるピックアップに供する。
【００４１】
接合手段２３ｂは上記吸着ノズル１４を持ったもので、Ｘ方向テーブル５８により受け渡し位置Ｄと実装位置Ｂとの間を往復移動されて、受け渡し位置Ｄで接合面３ａが下向きにされたベアＩＣチップ３を吸着してピックアップし、これを実装位置Ｂの実装位置Ｂ１へ移動されて、そこに位置決めされている回路基板４の所定位置に圧接させて上記のように超音波接合を行うことを繰り返す。従って、反転手段２３ａと接合手段２３ｂの協働により、部品供給部２１で接合面３ａが上向きで供給されるベアＩＣチップ３を回路基板４の上に必要なだけ実装することができる。もっともこれには、反転手段２３ａの側はＸ方向に移動せず部品供給位置Ａに定置されていても、接合手段２３ｂが部品供給位置Ａと実装位置Ｂとの間を往復移動できればよい。また、逆であってもよい。
【００４２】
接合手段２３ｂのＸ方向の移動と、前記ボンディングステージ３５のＹ方向の移動との複合で、回路基板４のどの位置にもベアＩＣチップ３などの部品を実装できる。しかし、そのための移動方式も必要に応じて種々に変更することができる。
【００４３】
もっとも、これら反転手段２３ａや接合手段２３ｂは、直線往復移動されるものに限らず、非直線移動を含む各種の移動を複合した動きをするものとすることができる。
【００４４】
さらに、本実施の形態の装置は、実装対象物取り扱い手段２２が取り扱う回路基板４などの実装対象物と、部品取り扱い手段２３が取り扱うベアＩＣチップ３などの部品との接合面３ａ、４ａの少なくとも一方に、それらが前記位置合わせされるまでの段階で制御手段２５により働かされて封止材１１を供与する封止材供与手段６１を備えている。これにより、ベアＩＣチップ３などの部品および回路基板４などの実装対象物の少なくとも一方への封止材１１の供与も含めて、１つの装置でベアＩＣチップ３などの部品の実装を自動的に達成することができる。
【００４５】
図に示す実施例では、図６に示すようにＸ方向テーブル５８により、接合手段２３ｂとともにＸ方向に移動されるように封止材供与手段６１を装備し、例えば実装位置Ｂに移動してディスペンサ６２をシリンダ６３で下降させて回路基板４の接合面４ａの側に図３に仮想線で示すように封止材１１を供与し、供与が終了すればディスペンサ６２を上動させて封止材供与手段６１を側方に退避させるのと同時に、接合手段２３ｂを部品実装位置Ｂに移動させて吸着ノズル１４が保持しているベアＩＣチップ３などの部品を供与された封止材１１の上から回路基板４に圧接させて超音波接合を行うようにしてある。
【００４６】
図６に示す部品の実装装置では、吸着ノズル１４を昇降させるボイスコイルモータ１５による荷重５００ｇ〜５Ｋｇ程度の磁気加圧力で前記加圧を行い、吸着ノズル１４に圧電素子１６での発振により超音波振動するホーン１７を接続して、吸着ノズル１４に、振動数６０ＫＨｚ、振幅１〜２μｍ程度の超音波振動を与えて、前記圧接されているバンプ８と導体ランド９とに摩擦を生じさせて、双方の溶融または電子間結合を伴い超音波接合するようにしている。吸着ノズル１４には図７に示すように、上記超音波振動が与えられたときに折損しないように、これの支持軸８１に弾性チューブ８２を介して接続されている。しかし、吸着ノズル１４の支持構造や支持位置は種々に変更することができる。吸着ノズル１４には弾性チューブ８２を通じて支持軸８１側からの吸引作用が吸着ノズル１４に及ぶようにしている。しかし、そのための具体的な構成は特に問うものではなく種々に設計することができる。
【００４７】
図３に示す実施例の電極７上のバンプ８に代えて、あるいは別に回路基板４の導体ランド９にバンプを形成してもよく、ベアＩＣチップ３などの部品や回路基板４などの実装対象物の電気接合部の少なくとも一方にバンプを用いると、ベアＩＣチップ３などの部品と回路基板４などの実装対象物との局部的な電気接合部での超音波接合が、十分な量の金属部分で確実に、また、他の部分での干渉や損傷なしに容易に達成できる。
【００４８】
制御手段２５にはマイクロコンピュータを用いるのが好適であるが、これに限られることはなく、種々な構成および制御形式を採用することができる。プログラムデータ２６は制御手段２５の内部または外部のメモリに記憶されたもの、あるいはハード回路で構成されたシーケンス制御によるものなど、どの様な形態および構成のものでもよい。
【００４９】
本実施の形態の吸着ノズル１４は、ステンレス鋼よりなり、図１の（ａ）（ｂ）に示すように吸着面１４ａに硬化処理層１４ｂを有するものとし、あるいは、図２に示すように吸着ノズル１４の先端の一部に設ける吸着面１４ａを持った吸着ヘッド部１４ｃだけを超硬金属製とするのに併せ、表面が所定の面粗度、例えば３μｍ〜５μｍ程度の表面粗さを持つ粗面に形成されている。
【００５０】
硬化処理には大別して、表面に超硬金属や超硬物質をコーティングするコーティング処理と、表面層を改質する改質処理とがある。コーティング処理には、超硬質クロームメッキ、ニボクロンといわれる硬質クローム＋各種セラミック含浸メッキといった高機能メッキ、金属セラミックなどの溶射による耐摩耗溶射、ダダイヤモンド状カーボン皮膜などを形成するダイヤモンドコーティングで代表される真空中での各種薄膜処理などがある。改質処理には、特殊ガス室化による特殊硬化法であるカナック処理またはニューカナック処理などがある。
【００５１】
セラミックハードコーティングでは、コーティング材料が例えばＴｉＮの場合、硬度が２，３００ＨＶ、膜厚が２〜３μｍ、耐熱温度６００℃、摩擦係数０．４、処理温度３００〜５００℃、ＴｉＣＮの場合、硬度が３，３００ＨＶ、膜厚が３〜５μｍ、耐熱温度４００℃、摩擦係数０．３、処理温度４５０〜５００℃であり、いずれも耐摩耗性が向上する。
【００５２】
カナック処理は、真空窒化処理法の一種で、高真空中の炉内にＮＨ3 を主成分とした窒化促進ガスを送り、持続剤、窒素発生剤、粘着防止剤を含む活性物質の働きにより、母材に拡散させて表面改質を行い、その硬度を著しく上げていく。
【００５３】
これによると、優れた耐摩耗性を有し、ステンレス鋼の表面についてはマイクロビッカーズＨＶ１５００までに上げられる。拡散層は２０μｍ〜８０μｍである。脆弱層がないので、拡散硬化層の欠損、剥離やピンホールもなく安定している。処理温度は５００℃〜５４０℃であるが、反り、膨張などの寸法変化は極少である。
【００５４】
これら表面処理は、基本的に吸着面１４ａにだけ施せばよいが、処理層の万一の剥離を防止するために、吸着ノズル１４の吸着面１４ａに続く側周面にも連続して及んでいるのが好適である。しかし、振動特性に影響しないように吸着ノズル１４の先端部範囲に止めておくのが好適である。
【００５５】
また、図１、図２に示すいずれのタイプの吸着ノズル１４も、ステンレス鋼部分は前記ＳＵＳ４２０Ｊ２で焼き入れ、焼き戻しを行ったものを基本体とし、吸着ヘッド部１４ｃは超硬合金製で、ステンレス鋼製の基本体１４ｄに図２に示すような嵌め合いを行って銀ろうなどによるろう接接合したものとしてある。超硬合金にはＷＣ−Ｃｏ系とＷＣ−Ｔｉ（Ｔａ，Ｎｂ）Ｃ−Ｃｏ系がある。
【００５６】
これら図１、図２に示す吸着ノズル１４を用いて、上記したように、吸着面１４ａで吸着したベアＩＣチップ３を、回路基板４に対し互いの金属接合部５、６を対向させて加圧しながら、吸着ノズル１４に超音波振動手段２４から超音波振動を与えて、この振動により金属接合部５、６どうしを摩擦させて超音波接合しベアＩＣチップ３を回路基板４に実装する部品実装方法において、吸着ノズル１４がステンレス鋼で、その吸着面１４ａが所定の面粗度を持つ粗面に形成されていることにより、硬化処理層１４ｂや一端部だけの超硬金属よりなる吸着ヘッド部１４ｃの影響なく、好適な振動特性と、ベアＩＣチップ３への好適な振動伝達特性とを発揮して、前記超音波接合を短時間で高品質に達成することができ、しかも、硬化処理や超硬金属により、粗面とした吸着面１４ａの面粗度が超音波接合時の摩耗や電気化学反応、異物などにより低下するのを従来の数分の１程度に抑えて前記良好な接合特性を従来の数倍長い時間安定して発揮させ、再生処理の必要頻度を数分の１程度に低くすることができる。従って、吸着ノズル１４の寿命が長くなるとともに、再生処理の手間が軽減し、金属接合部の超音波接合を伴い部品を実装する作業の休止時間が短くなって生産性が向上する。
【００５７】
さらに本実施の形態の部品実装方法では、上記のような吸着ノズルによる超音波接合を繰り返しながら、所定の時期に、吸着面１４ａを図４の（ａ）、図５に示すように研磨材１０１に接触させた状態で吸着ノズル１４に前記同様に超音波振動を与えて、吸着面１４ａと研磨材１０１とを摩擦させ、吸着面１４ａを所定の面粗度に再生する再生処理を行う。このようにすると、再生のための研磨が超音波振動による振動的摩擦で効率よく短時間で達成できるので、再生処理のための時間を短縮することができ、部品実装作業中に吸着ノズルを交換しないで再生処理を行うのに有効である。
【００５８】
研磨材１０１に、図５に示すラッピングテープのように連続したものを用い、供給ローラ１０２と巻取りローラ１０３との間で吸着面１４ａとの接触位置を更新するように搬送するなどして移動させると、研磨材１０１をいちいち交換せずに前記特徴ある再生処理を安定して繰り返し行える。移動は１回あるいは必要回数再生処理を終える都度行ってもよいし、研磨中に間欠に、あるいは連続して行ってもよい。
【００５９】
ここで、実施例データを示すと、摩擦接触させるときの荷重が３００〜５００ｇで、超音波振動は周波数が６０ＫＨｚ、振動の振幅を１〜２μｍ、粗さの番手が♯８０００〜♯１００００の研磨材１０１を１０〜５０ｍｍ／ｓｅｃの速度で１０〜２０ｍｍ移動させた場合において、約３０秒の短い時間で十分な面粗度に再生することができた。
【００６０】
本実施の形態の部品実装装置は、この研磨材１０１による再生を行うのに、前記研磨材１０１を支持し、または案内して吸着面１４ａの研磨による再生に供する研磨手段１０４が部品実装位置Ｂ２の横に設けられ、制御手段２５はベアＩＣチップ３などの部品を回路基板４などの実装対象物に超音波接合する部品実装動作に併せ、所定の時期に、吸着ノズル１４の吸着面１４ａを研磨手段１０４の研磨材１０１に接触させながら超音波振動手段２４を働かせて、吸着面１４ａと研磨材１０１を摩擦させ、吸着面１４ａを研磨する。
【００６１】
このようにすると、１つの装置で、上記のような吸着ノズル１４を装着して部品実装することを繰り返しながら、制御手段２５が所定の時期において、吸着ノズル１４の吸着面１４ａと研磨材１０１を接触させながら超音波振動手段２４を働かせて吸着ノズル１４に超音波振動を与えて摩擦させ、研磨による再生処理を自動的に行うので、吸着ノズル１４が再生処理の繰り返しにより使用限界まで短くなって寿命に達するまで使用し続け、吸着ノズル１４を再生処理する都度いちいち着脱するような手間を省き、装置が長く休止して生産性が低下するのを防止することができる。
【００６２】
研磨手段１０４は、研磨材１０１を支持するのに、図４、図５に示すような研磨材１０１を支持し、案内する支持面１０６ａの水平状態を調整する水平調整手段１０５を備えたものとしている。水平調整手段１０５はステンレス鋼よりなる定盤１０６をスタンド１０９によって支持して設けてある。定盤１０６はその途中部分にまわりからのくびれ部による首振り部１０６ｂを有し、くびれ部で上下に２分された支持面１０６ａを持った上部盤１０６ｃが、下部盤１０６ｄに対し前記首振り部１０６ｂを中心に若干首振りでき、首振りの向きおよび量によって支持面１０６ａの水平調整ができる。
【００６３】
そこで、上部盤１０６ｃおよび下部盤１０６ｄの一方、図の実施例では下部盤１０６ｄに下方から螺合させて、他方の上部盤１０６ｃに下方から当接させた調節ボルト１０７を、首振り部１０６ｂのまわり３ケ所あるいは図の実施例のように４ケ所設け、これら各部分の調節ボルト１０７のねじ込みやねじ戻しにより、下部盤１０６ｄに対する上部盤１０６ｃの間隔を首振り部１０６ｂのまわりで調整することにより、支持面１０６ａが装置上定められた吸着ノズル１４の軸線に対して直角となる水平状態が得られるように水平調整ができる。しかし、このような水平状態の具体的な調整方法や調整手段は種々に変更することができる。
【００６４】
このように、吸着ノズル１４を部品取り扱い手段２３が取り扱うときの装置上の吸着ノズル１４の軸線に対し直角となる水平状態が得られると、吸着面１４ａを吸着ノズル１４の軸線に対し直角な向きに研磨することができ、吸着面１４ａを自動的に研磨して再生処理をすることによって吸着面１４ａの向きに狂いが生じるようなことを防止することができる。
【００６５】
さらに、研磨手段１０４が、水平調整される上部盤１０６ｃの上に図４の（ａ）に示すように吸着保持されたガラス板１０８にて支持面１０６ａを形成していると、研磨材１０１に超音波振動する吸着ノズル１４が押しつけられて研磨するときに研磨材１０１の支持面１０６ａに金属部材の場合のような弾性変形による逃げが生じないので、研磨材１０１の支持面１０６ａを水平調整した正しい向きのまま吸着面１４ａを研磨することができる。もっとも、ガラス板１０８は磨きガラスで平面度の高いものを用いるのが好適であるし、必ずしもガラス板に限られることはなく同様な効果が得られる他のものと代替することができる。
【００６６】
なお、制御手段２５が研磨手段１０４による研磨を行うのに、研磨材１０１を移動させる供給ローラ１０２や巻取りローラ１０３よりなる送り手段１１１を適宜働かせるようにする。これにより、１回あるいは必要回数研磨による再生処理を終える都度、搬送したり、研磨中に間欠に、あるいは連続して搬送したりして、研磨材１０１の吸着面１４ａを研磨している部分を順次更新していくことが自動的に達成できる。
【００６７】
前記研磨の再生処理に代えて、図４の（ｂ）に示すように吸着面１４ａを洗浄液１１２に浸漬させた状態で吸着ノズル１２に前記同様に超音波振動を与えて洗浄することもできる。これにより、吸着面１４ａに部品の接合で詰まった付着物を除去しても、吸着面１４ａを所定の面粗度に再生する再生処理になるし、この洗浄を、前記のように研磨手段１０４によって吸着面１４ａを研磨した後に行うと、吸着面１４ａの研磨により再生された粗面に付着し、詰まっている研磨粉などを除去して振動伝達特性への影響をなくせるので、好都合である。洗浄液１１２はアルコール類がよく、Ｃ2 Ｈ5 ＯＨなどがある。しかし、これに限られることはなく、他の適当なものを採用してもよい。
【００６８】
洗浄の後、図４の（ｃ）に示すように吸着面１４ａをブロー手段１１３によりブローすると、洗浄液１１２を早期に乾燥させられるので、洗浄後早期に再使用することができ、部品実装作業中に吸着ノズル１４を交換しないで再生処理を行うのに有効である。
【００６９】
本実施の形態の部品実装装置は、これら、洗浄およびブローを研磨手段１０４による研磨に併せ行うのに、洗浄液１１２を貯留しておく洗浄槽１１４、および前記ブロー手段１１３を研磨手段１０４に併置しており、制御手段２５は研磨手段１０４による研磨の後、上記洗浄槽１１４による洗浄およびブロー手段１１３によるブローを所定時間ずつ行う。いずれも数秒程度でよい。ブローは冷風で行うと、熱の影響や熱の消費がないので有利である。本実施の形態の部品実装装置によると、研磨、洗浄および乾燥による再生処理が部品実装を行う１つの装置で自動的に行える。
【００７０】
本実施の形態の部品実装装置は、さらに、図３に示すように、超音波接合時の吸着面１４ａとベアＩＣチップ３などの部品との間の滑り状態を検出する滑り検出手段１１５を備え、制御手段２５は滑り検出手段１１５の検出結果に応じて研磨を行うようにしている。これにより、所定の時期が予め定めた一定の時期である場合に比し、必要の都度対応できるので、再生処理が遅れて接合品質が低下したり、再生処理が早すぎて吸着ノズル１４の研磨回数が無駄に多くなり寿命を徒に短くするようなことを防止することができる。滑り検出手段１１５は超音波振動源である圧電素子１６の発振により超音波振動するホーン１７の振動状態をモニタして検出する。具体的には、吸着面１４ａとベアＩＣチップ３などの部品との摩擦が大きいほどホーン１７の超音波振動が大きく、摩擦が小さいほど超音波振動が小さくなる違いで判定すればよく、これが電流の変化としてモニタでき、滑り検出ができる。また、そのような変化はオシロスコープ１１６などを用いると目視もできる。
【００７１】
さらに、上記のような部品実装方法において、超音波接合のために吸着ノズル１４に与える超音波振動は、吸着面１４ａを粗面にする研磨方向、つまり研磨によるすじ状の研磨痕ができる方向であり、本実施の形態の装置では研磨のための超音波振動の方向と、交差する向きで与える。これにより、吸着面１４ａが研磨されたときのすじ状の研磨痕と交差する方向に超音波振動されて部品との引っ掛かり性が高くなるので、部品への振動伝達特性が向上する。この意味で研磨方向と振動方向は直交する方向であるのがより好適である。
【００７２】
【発明の効果】
本発明の吸着ノズルによれば、部品と実装対象物の金属部分どうしを超音波接合するのに、吸着ノズルがステンレス鋼で、その吸着面が所定の面粗度を持つ粗面に形成されていることにより、硬化処理層や一端部だけの超硬金属よりなる吸着ヘッド部の影響なく、好適な振動特性と、部品への好適な振動伝達特性とを発揮して、前記超音波接合を短時間で高品質に達成することができ、しかも、硬化処理や超硬金属により、粗面とした吸着面の面粗度が摩耗や電気化学反応、異物の影響などで低下するのを抑えて前記良好な接合特性を安定して長い時間保ち、再生処理の必要頻度を低くすることができる。従って、吸着ノズルの寿命が長くなるとともに、再生処理の手間が軽減し、接合作業の休止時間が短くなって生産性が向上する。
【００７３】
本発明の部品実装方法によれば、吸着ノズルによる超音波接合を繰り返しながら、所定の時期に、吸着面を研磨材に接触させた状態で吸着ノズルに前記同様に超音波振動を与えて、吸着面と研磨材とを摩擦させ、吸着面を所定の面粗度に再生する再生処理を行う部品実装方法によれば、再生のための研磨が超音波振動による振動的摩擦で効率よく短時間で達成できるので、再生処理のための時間を短縮することができ、部品実装作業中に吸着ノズルを交換しないで再生処理を行うのに有効である。
【００７４】
本発明の部品実装装置によれば、１つの装置で、金属接合部の超音波接合を伴い部品実装することを繰り返しながら、所定の時期において、吸着ノズルの吸着面を研磨材に接触させながら超音波振動手段を働かせて研磨し再生処理することを自動的に行うので、吸着ノズルが再生処理の繰り返しにより研磨代が無くなって寿命に達するまで 使用し続け、吸着ノズルを再生処理する都度いちいち着脱するような手間を省き、装置が長く休止して生産性が低下するのを防止することができる。しかも、吸着面と部品との間の滑り状態を検出するのに応じて研磨を行うことにより、所定の時期が予め定めた一定の時期である場合に比し、必要の都度対応できるので、再生処理が遅れて接合品質が低下したり、再生処理が早すぎて吸着ノズルの寿命を徒に短くするようなことを防止することができる。
【図面の簡単な説明】
【図１】本発明の実施の形態における吸着ノズルの１つの実施例で、その（ａ）は一部を断面で見た全体図、その（ｂ）は先端部の断面図である。
【図２】本発明の実施の形態における吸着ノズルの他の実施例を示す一部を断面して見た吸着面側の一部の側面図である。
【図３】ベアＩＣチップを図１、図２に示す吸着ノズルによって回路基板に金属接合を伴って実装する状態の１つの実施例説明図である。
【図４】図３に示す実装操作に併せ行う再生処理の状態を示し、その（ａ）は吸着ノズルの吸着面の研磨、その（ｂ）は洗浄、その（ｃ）はブローの各操作の状態の説明図である。
【図５】図４の（ａ）の研磨を行う研磨手段を示す斜視図である。
【図６】本発明の図３の実装操作と、図４の（ａ）〜（ｃ）の再生処理操作とを行う、代表的な実施の形態としての部品実装装置の全体の概略構成を示す斜視図である。
【図７】図６の装置の部品取り扱い手段の一部である接合手段の断面図である。
【図８】図６の装置の部品実装位置にあるボンディングステージの斜視図である。
【図９】図６の装置の部品取り扱い手段における反転手段を示す斜視図である。
【図１０】図６の装置の部品取り扱い手段における接合手段を示す斜視図である。
【符号の説明】
３ ベアＩＣチップ
４ 回路基板
３ａ、４ａ 接合面
５、６ 金属接合部
７ 電極
８ バンプ
９ 導体ランド
１０ 溶接接合部
１４ 吸着ノズル（部品実装ツール）
１４ａ 吸着面
１４ｂ 硬化処理層
１４ｃ 吸着ヘッド部
１４ｄ 基本体
１５ ボイスコイルモータ
２１ 部品供給部
２２ 実装対象物取り扱い手段
２３ 部品取り扱い手段
２３ａ 反転手段
２３ｂ 接合手段
２４ 超音波振動手段
２５ 制御手段
２６ プログラムデータ
３３ ローダ部
３５ ボンディングステージ
３７ エキスパンド台
１０１ 研磨材
１０４ 研磨手段
１０５ 水平調整手段
１０６ 定盤
１０６ａ 支持面
１０６ｂ 首振り部
１０７ 調節ボルト
１０８ ガラス板
１１１ 送り手段
１１２ 洗浄液
１１３ ブロー手段
１１４ 洗浄槽
１１５ 滑り検出手段[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting tool for mounting a component on an object to be mounted with frictional bonding between metal joints, a component mounting method using the tool, and an apparatus therefor, which prints electronic components such as bare IC chips. It is used when an electronic circuit board is manufactured by mounting on a wired circuit board or the like with electrical bonding by ultrasonic bonding.
[0002]
[Prior art]
In the bare IC chip, for example, a circuit pattern is formed on a semiconductor wafer by using a thin film technique, and is used for manufacturing an electronic circuit board by mounting on a printed board. In the bare IC chip, electrodes for electrical bonding to conductor lands formed by printed wiring etc. on the circuit board are formed with the circuit pattern, and the bonding surface with the electrodes is formed on the circuit board conductor lands without being packaged. So-called surface mounting is performed in such a manner that the conductor lands and the electrodes are electrically connected to each other so as to oppose the held joint surface.
[0003]
In order to carry out such mounting, the present applicant forms a metal bump on the bare IC chip electrode by wire bonding or the like, and the bare IC chip is sucked and held by a suction nozzle to be handled and positioned. Ultrasonic waves between a support point and a suction surface that are supported so that the suction nozzle can swing in a state where the bump is pressed against a conductor land of the circuit board facing a predetermined position on the circuit board. A method for mounting a bare IC chip on a circuit board has been previously proposed in which a bare IC chip is vibrated by applying vibration to cause friction between bumps and conductor lands and ultrasonic bonding.
[0004]
As a result, a component such as a bare IC chip can be mounted on the circuit board quickly while satisfying reliable electrical bonding and high mounting strength by bonding with metal bonding. At that time, if the suction nozzle is made of stainless steel, the vibration characteristics are good, and it is suitable for ultrasonic bonding between the parts and the metal joints of the mounting object. In addition, by making the suction surface a rough surface with a predetermined surface roughness, it is possible to improve the work efficiency and quality of ultrasonic bonding by suppressing vibration between parts and improving the transmission of vibration. Can do.
[0005]
By the way, it is a comparatively short time that ultrasonic bonding can be suitably performed with a stainless steel suction nozzle. This is because the suction surface of the suction nozzle is worn by contact with the component in an ultrasonic vibration state, the plane having a surface roughness of about 3 μm to 5 μm at the beginning is rough, and the height of the unevenness is changed. This is due to the decrease in flatness. This wear is also related to an electrochemical reaction between the stainless steel and GaAs or Si on the IC chip side, or a damage caused by a foreign matter biting between the adsorption surface and the IC chip. LiTaO when the joining part is a SAW filter Three And LiNbO Three Quartz is used and it is hard and the adsorption surface is particularly rough.
[0006]
Therefore, conventionally, for example, stainless steel having a high hardness such as SUS420J2 has been used and the adsorption surface has been subjected to a quenching process. Bonding failure occurs when the IC chip is broken or the shear strength at the time of bonding cannot be obtained. When a person determines that ultrasonic bonding cannot be performed properly due to the occurrence of these bonding defects, the suction nozzle is removed from the apparatus, the suction surface is polished and regenerated, and reused.
[0007]
[Problems to be solved by the invention]
However, it is troublesome to frequently perform the reproduction process as described above, and the downtime of the apparatus becomes longer, which affects productivity. Also, the regeneration by polishing is frequent and the life of the suction nozzle is short. As an example, the suction nozzle is shortened to the limit of use after 30 times of polishing and consumed once a month.
[0008]
Therefore, it is conceivable to use a suction nozzle made of a material having higher wear resistance than stainless steel. However, in this case, the vibration characteristics are poor and ultrasonic bonding cannot be suitably performed.
[0009]
The object of the present invention is to perform the suction nozzle that improves the wear resistance of the suction surface without deteriorating the vibration characteristics, and to perform mounting with ultrasonic bonding between the metal joints of the parts using the nozzle. An object of the present invention is to provide a component mounting method and a component mounting apparatus capable of continuing the bonding of components by regenerating the adsorption surface in a short time by ultrasonic vibration for bonding.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the suction nozzle of the present invention is made of stainless steel and has a hardened layer on the suction surface, or only the suction head portion having the suction surface is made of cemented carbide. In addition, the surface of the suction surface is formed into a rough surface having a predetermined surface roughness.
[0011]
Using these components, ultrasonic vibration is applied to the suction nozzle while pressing the parts sucked on the suction surface with the metal joints facing each other to be mounted, and the vibrations cause friction between the metal joints. In order to mount the component on the object to be mounted by ultrasonic bonding, such as with melting or inter-electron coupling, the suction nozzle is made of stainless steel, and the suction surface has a predetermined surface roughness. By being formed on the rough surface, it exerts suitable vibration characteristics and suitable vibration transmission characteristics to the parts without the influence of the hardened layer and the adsorption head part made of super hard metal only at one end, The ultrasonic bonding can be achieved in high quality in a short time, and the surface roughness of the adsorbed surface, which is a rough surface due to the hardening treatment or the hard metal, is worn, electrochemical reaction, foreign matter during ultrasonic bonding. The good contact is suppressed by suppressing the decrease due to the influence of Characteristics were exhibited long time stable, it is possible to reduce the required frequency of the regeneration process. Therefore, the life of the suction nozzle is lengthened, the labor of the regeneration process is reduced, and the downtime of the work for mounting the component with the ultrasonic joining of the metal joint portion is shortened, thereby improving the productivity.
[0012]
The curing treatment layer can be provided in various ways, and can be represented by a modification treatment layer.
[0013]
While repeating the mounting of components with ultrasonic bonding using the suction nozzle as described above, the suction surface is subjected to ultrasonic vibration in the same manner as described above in a state where the suction surface is in contact with the abrasive at a predetermined time. According to the component mounting method that regenerates the suction surface to the specified surface roughness, the polishing for regeneration is efficiently and quickly achieved by vibrational friction due to ultrasonic vibration. Therefore, the time for the regeneration process can be shortened, which is effective for performing the regeneration process without replacing the suction nozzle during the component mounting operation.
[0014]
If a continuous abrasive material is used and the contact position with the suction surface is updated, the characteristic regeneration process can be repeated stably without changing the abrasive material one by one.
[0015]
The feeding may be performed once or every time the regeneration process is completed, or may be performed intermittently or continuously during polishing.
[0016]
Instead of the above-mentioned polishing regeneration treatment, the suction surface is immersed in a cleaning solution and cleaned by applying ultrasonic vibration to the suction nozzle in the same manner as described above, thereby efficiently removing the deposits clogged by joining parts to the suction surface. In some cases, this can be removed, and this alone is a regeneration process that regenerates the adsorption surface to a predetermined surface roughness, and can be regenerated without polishing, and if this washing is performed after the adsorption surface is polished, the adsorption surface This removes clogged polishing powder that adheres to the surface regenerated by polishing and eliminates the effect on vibration transmission characteristics. After cleaning, the cleaning liquid can be dried quickly by blowing the suction surface, so it can be reused early after cleaning, and it is effective for reprocessing without replacing the suction nozzle during component mounting work. It is. Blowing is preferably carried out by cold air because there is no influence or consumption of heat.
[0017]
In the component mounting method as described above, if the ultrasonic vibration applied to the suction nozzle is applied in a polishing direction that makes the suction surface rough, that is, a direction that intersects with a direction in which a streak-like polishing mark is formed, the suction surface is polished. The vibration transmission characteristics are improved because the abrasive is vibrated in a direction intersecting with the streak-shaped polishing marks and the catching property of the parts with the polishing marks is increased. In this sense, the polishing direction and the vibration direction are more preferably orthogonal.
[0018]
As an apparatus for achieving the component mounting method as described above, a component supply unit that supplies a component, a mounting object handling means that positions a mounting object on which the component is mounted at a handling position, and is used for mounting the component, a supply The parts to be picked up and held on the suction surface of the suction nozzle, and the parts are mounted with ultrasonic bonding by ultrasonic vibration while pressing the metal joints facing each other with the positioned mounting object. Part handling means mounted on the object, ultrasonic vibration means for applying ultrasonic vibration to the suction nozzle, and polishing for polishing the suction surface to a rough surface with a predetermined surface roughness by frictional contact between the abrasive and the suction surface In addition to mounting the device and the component to the mounting object with ultrasonic bonding, at a predetermined time, the ultrasonic vibration device is operated while the suction surface of the suction nozzle is in contact with the polishing material of the polishing device. And abrasives It is friction, it Sonaere and control means for polishing the suction surface.
[0019]
According to this, with one apparatus, the control means is determined in advance while mounting the suction nozzle as described above and repeatedly mounting the component on the mounting object with ultrasonic bonding between the metal bonding portions. At the predetermined time, the ultrasonic vibration means is applied to the suction nozzle while it is in contact with the suction surface of the suction nozzle and the abrasive material, and the suction nozzle is rubbed by applying ultrasonic vibration. Use the suction nozzle until it reaches the end of its life due to repeated reprocessing and eliminates the trouble of detaching each time the suction nozzle is reprocessed. Can be prevented.
[0020]
A slip detection means for detecting a slip state between the suction surface and the component during ultrasonic bonding is provided, and the control means sets a predetermined time according to the detection result of the slip detection means to perform polishing, and performs predetermined polishing. Compared to the case where the time is a predetermined time, it is possible to cope with it whenever necessary, so that the regeneration process is delayed and the joining quality deteriorates, or the regeneration process is too early, leading to a wasteful reduction in the polishing allowance. It is possible to prevent shortening the life of the suction nozzle.
[0021]
The cleaning unit is equipped with a cleaning tank in which the cleaning liquid is stored.After the suction surface of the suction nozzle is polished, the suction surface of the suction nozzle is immersed in the cleaning liquid in the cleaning tank, and the ultrasonic vibration means is used to perform the suction after polishing. If the surface is cleaned, the recycling process by polishing and cleaning can be automatically and efficiently performed by a single device that mounts the components, and it is equipped with a blow unit, and the control unit blows the suction surface after the cleaning by the blow unit. If it is made to dry, the reproduction | regeneration processing by grinding | polishing, washing | cleaning, and drying can be automatically and efficiently performed with one apparatus which mounts components.
[0022]
The polishing means supports the abrasive in a frictional position with the suction surface, or has a level adjustment means for adjusting the horizontal state of the support surface to be guided. Since a horizontal state that is perpendicular to the axis of the suction nozzle is obtained, the suction surface can be polished in a direction perpendicular to the axis of the suction nozzle, and the suction surface is automatically polished and regenerated. It is possible to prevent a deviation in the direction of the suction surface.
[0023]
If the polishing means forms a support surface with a glass plate that is held by suction on a leveling plate that is leveled, when the polishing nozzle is pressed against the polishing material by ultrasonic vibration vibration, Since the support surface does not escape due to elastic deformation as in the case of a metal member, the adsorption surface can be polished while the support surface of the abrasive is levelly adjusted.
[0024]
The polishing means is provided with a feeding means for moving a long abrasive on the support surface, and the control means can transport the abrasive once or every time the regeneration process is completed if the feeding means is operated appropriately during polishing. It is automatically achieved that the portions where the adsorbing surface of the abrasive is being polished are sequentially updated by being conveyed intermittently or continuously during the polishing.
[0025]
Further objects and features of the present invention will become apparent from the following detailed description and drawings. Each feature of the present invention can be used alone or in combination in various combinations as much as possible.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the suction nozzle for component mounting of the present invention, the component mounting method using the same, and the embodiment of the apparatus will be described with reference to FIGS. 1 to 10 together with examples to understand the present invention. Provide.
[0027]
In this embodiment, as shown in FIG. 6, a semiconductor wafer 1 diced into individual bare IC chips 3 on a dicing sheet 2 is picked up and handled as a part by a suction nozzle 14, and as shown in FIG. A circuit board 4 such as a printed wiring board is an object to be mounted, and the bare IC chip 3 is accompanied by electrical bonding by ultrasonic bonding such as melting of both metal bonding parts 5 and 6 or bonding between electrons. This is an example of mounting on the circuit board 4. As an example, the metal joint 5 of the bare IC chip 3 is made of a metal formed by wire bonding technology on an electrode 7 formed on the semiconductor wafer 1 by thin film technology. The bumps 8 and the metal joints 6 of the circuit board 4 are conductor lands 9 formed on the surface thereof. However, the present invention is not limited to this, and other electronic parts and various parts other than electronic parts are accompanied by ultrasonic bonding of various metal parts, circuit boards, plate-like objects other than circuit boards, and the like. The present invention can be applied to all cases where various parts are mounted on various mounting objects including those of the form.
[0028]
Here, the suction nozzle 14 of the present embodiment is for component mounting involving ultrasonic bonding of the metal bonding portions 5 and 6, and is applied to a component mounting apparatus as shown in FIG. As shown in FIG. 6, the component mounting apparatus includes a component supply unit 21 that supplies components such as a bare IC chip 3 to a predetermined position A, and ultrasonic bonding between the bare IC chip 3 and the metal joints 5 and 6. A mounting object handling means 22 for supplying a mounting object such as a circuit board 4 to be mounted with electrical bonding to the component mounting position B and mounting the component, and then moving the mounting object to the other. A component to be supplied is held and handled by a component mounting tool such as a suction nozzle 14, and a bonding surface 3 a having a metal bonding portion 5 such as a bump 8 of a bare IC chip 3 as shown in FIG. A component handling means 23 for positioning and pressurizing so as to oppose a joint surface 4a having a metal joint 6 such as a land 9 so that both metal joints 5 and 6 face each other, and a suction nozzle 14 swings The ultrasonic vibration means 24 for applying ultrasonic vibration between the swing point and the suction surface supported in such a manner, and the metal joint portion of the circuit board 4 handled by the mounting object handling means 22 at the component mounting position B The ultrasonic vibration means 24 is operated while applying pressure while the bumps 8 as the metal joints 5 of the components such as the bare IC chip 3 handled by the component handling means 23 are opposed to the conductor lands 9 such as 6. And a control means 25 for ultrasonically bonding the bumps 8 and the metal joints 5 and 6 which are the conductor lands 9 to each other. However, the swing mechanism for ultrasonic vibration of the suction nozzle 14 is not limited to this, and various vibration support methods including reciprocal movement can be employed.
[0029]
In the embodiment shown in FIG. 6, mounting object handling means 22 is provided at the front of the base, and the circuit board 4 is handled so that the joint surface 4a with the bare IC chip 3 faces upward. To be implemented. The mounting object handling means 22 is a conveying means for conveying the circuit board 4 along the rail 32 from the loader portion 33 at one end to the unloader portion 34 at the other end in the X direction. However, depending on the size, shape, form, etc. of the mounting object such as the circuit board 4 being small, it may be a means for carrying it. The part of the range of the component mounting position B defined immediately on the downstream side of the loader unit 33 is an independent rail 32a as shown in FIGS. 6 and 8, and the rail 32 is received by the rail 32a and the rail 32a. A bonding stage 35 that sucks and holds the circuit board 4 from below is supported by a Y-direction table 36 that moves in the Y direction perpendicular to the X direction, and the transfer position B1 of the circuit board 4 aligned with the rails 32 is provided. Further, it is moved back and forth between the mounting work position B2 shown in FIG.
[0030]
Thus, each time the circuit board 4 reaches the rail 32a at the component mounting position B from the loader unit 33, the circuit board 4 is received by the stopper 30a at a predetermined position on the bonding stage 35, and then the received circuit board 4 is received. The position is adjusted by pressing against one side of the rail 32a by the pressing element 30b. The circuit board 4 after the position adjustment is sucked and held by the bonding stage 35. At the same time, the bonding stage 35 is moved and positioned to the mounting work position B2, and used for mounting components on the circuit board 4 that is sucked and held. The bonding stage 35 is moved to the transfer position B1 aligned with the rail 32 every time the mounting of the component is finished at the mounting work position B2, and the suction of the circuit board 4 is released and the circuit board 4 after mounting the component is moved from the rail 32a to the rail 32. It is sent to the downstream side of the sheet and conveyed to the unloader section 34 to be carried out to the other. As described above, a large number of circuit boards 4 can be sequentially used for mounting components such as the bare IC chip 3 to continuously manufacture electronic circuit boards.
[0031]
On the other hand, the loader unit 33 and the bonding stage 35 are provided with a preheating unit 33a and a main heating unit 35a in which a heater is embedded, for example, to preheat the circuit board 4 used for component mounting while being in each position. And this heating is performed so that the sealing material 11 as shown in FIG. 3 filled between the circuit board 4 and the bare IC chip 3 can be heated to about 25 ° C.
[0032]
In the case of the present embodiment, the low temperature heating may be performed in this way. In this embodiment, the sealing material 11 is provided on the circuit board 4 in advance as indicated by a virtual line in FIG. Since the bare IC chip 3 when mounted on the circuit board 4 approaches the circuit board 4, it is compressed with both the joint surfaces 3 a and 4 a so as to expand between the two and fill as shown in FIG. This is because it is not necessary to heat to a high temperature of about 65 ° C. as in the case of using a low-viscosity sealing material such as in the case of casting.
[0033]
Thus, since the heating is relatively low temperature, the sealing material 11 can be substantially cured during the operation of ultrasonically bonding the bare IC chip 3 to the circuit board 4, and the preliminary heating can be omitted. However, if preheating is performed, it can be heated more easily. However, light such as ultraviolet rays can be used to cure the sealing material 11.
[0034]
A component supply unit 21 is provided on the downstream side of the component mounting position B of the rail 32 and behind the rail 32, and a component magazine 38 that stocks components obtained by dicing the semiconductor wafer 1 into individual bare IC chips 3 on the dicing sheet 2. By mounting the magazine lifter 41 that moves up and down and the bare IC chip 3 of a predetermined type stocked in the component magazine 38 to oppose a loading / unloading means (not shown) by setting the height of the component magazine 38 by the magazine lifter 41, An expanding table 37 is provided which holds the dicing sheet 2 pushed out or pulled out, expands the dicing sheet 2 and widens the interval between the bare IC chips 3 to facilitate picking up.
[0035]
The expand base 37 is moved in the X direction by the X direction table 42 and moved in the Y direction by the Y direction table 43, so that the supply of the bare IC chips 3 on the dicing sheet 2 is pushed up from below the dicing sheet 2. The components are sequentially positioned at the component supply position A where the rod 44 is located so that the supply can be made as much as necessary. When the supply of the bare IC chip 3 is completed or the type of the bare IC chip 3 to be supplied is changed, the dicing sheet 2 on the expand base 37 is replaced with a necessary one. As a result, various types of bare IC chips 3 can be automatically supplied and mounted as needed. However, the component supply unit 21 may be configured according to the type and form of the component to be mounted, and the component supply unit 21 having various configurations, together with the corresponding component handling means 23, etc. It can be installed in combination.
[0036]
As described above, the circuit board 4 is used for mounting components such as the bare IC chip 3 with the bonding surface 4a facing upward, and the component supply unit 21 supplies the bare IC chip 3 with the bonding surface 3a facing upward. Corresponding to being provided for mounting on the upward circuit board 4, in the present embodiment, the component handling means 23 is used to replace the components such as the bare IC chip 3 with the bonding surface 3a facing upward. Specifically, it is picked up by holding the pick-up nozzle 45 or the like as an example of a component mounting tool from the upper side and then reversing so that the joint surface 3a faces downward. FIG. 6 and FIG. 9 handle parts such as the bare IC chip 3 so as to turn around the position C away from a certain suction surface 45a or on the suction surface 45a to invert the bonding surface 3a downward. The component reversing means 23a and the ultrasonic vibration means 24 as shown in the figure are mounted, and the components such as the bare IC chip 3 whose bonding surface 3a is lowered by the component reversing means 23a are picked up from above and then mounted. 7 and 10 as shown in FIGS. 7 and 10 for handling components so as to be used for ultrasonic bonding with a mounting object such as a circuit board 4 whose bonding surface 4a is directed upward at the component mounting position B by the object handling means 22. 23b. However, various motion methods other than the above-described reversal method of the bare IC chip 3 may be adopted and reversed.
[0037]
Here, it is the joining means 23 b that mounts the bare IC chip 3 on the circuit board 4, and the joining nozzle 23 is equipped with the suction nozzle 14. The suction nozzle 45 mounted on the component reversing unit 23a that does not mount the components such as the bare IC chip 3 on the circuit board 4 is different from the suction nozzle 14.
[0038]
As a result, the semiconductor wafer 1 is supplied in a packaged state in which the dicing sheet 2 is expanded by the expand base 37 at a predetermined position with the bare IC chip 3 or the like that is diced on the dicing sheet 2 and the bonding surface 3a faces upward. In the case where it is repeatedly mounted by repeatedly using a large number even if it is supplied exclusively as in the embodiment shown in the figure or combined with parts in different packing forms, The bare IC chip 3 or the like is picked up from above by the reversing means 23a and reversed so that the joining surface 3a faces downward, and then picked up from above by the joining means 23b and handled by the mounting object handling means 22. At the component mounting position B, contact is made from above with a mounting object such as the circuit board 4 with the joint surface 4a facing upward. And ultrasonically bonding was what bumps 8 and conductive land 9 is both metal surfaces 5, 6. In this way, mounting of the circuit board 4 or the like in which the components supplied upward such as the bare IC chip 3 are handled upward by the handling of the components such as the bare IC chip 3 in which the inverting means 23a and the joining means 23b cooperate. It can be implemented repeatedly on the target repeatedly without any confusion.
[0039]
In the embodiment shown in the figure, the reversing means 23a is reversed so that the component supply position A for picking up the components such as the bare IC chip 3 to be fed and the bonding surface 3a of the picked-up bare IC chip 3 are directed downward. The base 57 that is reciprocated by the X-direction table 56 between the delivery position D to be used for the pickup for joining by the joining means 23b is provided with a motor 51 and a horizontal shaft 52 that is rotationally driven by this. Around the shaft 52, there is a component reversing head 54 equipped with one or a plurality of suction nozzles 45 as an example of a component handling tool in the radial direction. The suction nozzle 45 is axially moved by an air cylinder 55 on the component reversing head 54. To be moved forward and backward.
[0040]
As a result, the reversing means 23a moves up and down the suction nozzle 45 that is directed downward at the component supply position A, picks up and picks up the bare IC chip 3 supplied thereto, and then moves the suction nozzle 45 to the position C. , The joint surface 3a of the picked-up bare IC chip 3 is inverted from upward to downward, moved to the delivery position D, and provided for pick-up by the joining means 23b.
[0041]
The joining means 23b has the suction nozzle 14 and is reciprocated between the delivery position D and the mounting position B by the X-direction table 58, and the bare IC chip with the joining surface 3a facing downward at the delivery position D. 3 is picked up, picked up, moved to the mounting position B1 of the mounting position B, and repeatedly brought into pressure contact with a predetermined position of the circuit board 4 positioned there and performing ultrasonic bonding as described above. . Therefore, by the cooperation of the reversing unit 23a and the joining unit 23b, the bare IC chip 3 supplied with the joining surface 3a facing upward in the component supply unit 21 can be mounted on the circuit board 4 as necessary. However, even if the reversing means 23a side does not move in the X direction and is fixed at the component supply position A, the joining means 23b only needs to reciprocate between the component supply position A and the mounting position B. Moreover, the reverse may be sufficient.
[0042]
By combining the movement of the bonding means 23b in the X direction and the movement of the bonding stage 35 in the Y direction, components such as the bare IC chip 3 can be mounted at any position on the circuit board 4. However, the moving system for that purpose can be changed variously as required.
[0043]
However, the reversing means 23a and the joining means 23b are not limited to those reciprocally moved linearly, and can be combined with various movements including non-linear movements.
[0044]
Furthermore, the apparatus according to the present embodiment includes at least joint surfaces 3a and 4a between a mounting object such as the circuit board 4 handled by the mounting object handling means 22 and a component such as the bare IC chip 3 handled by the component handling means 23. On the other hand, there is provided sealing material supply means 61 which is operated by the control means 25 and supplies the sealing material 11 until they are aligned. This automatically mounts the components such as the bare IC chip 3 in one device, including the provision of the sealing material 11 to at least one of the components such as the bare IC chip 3 and the mounting target such as the circuit board 4. Can be achieved.
[0045]
In the embodiment shown in the figure, as shown in FIG. 6, the X-direction table 58 is equipped with the sealing material supply means 61 so as to be moved in the X direction together with the joining means 23b. 62 is lowered by the cylinder 63, and the sealing material 11 is dispensed on the side of the joint surface 4a of the circuit board 4 as shown by the phantom line in FIG. 3, and when the dispensing is completed, the dispenser 62 is moved up to encapsulate the sealing material. Simultaneously with retracting the donating means 61 to the side, the joining means 23b is moved to the component mounting position B and the parts such as the bare IC chip 3 held by the suction nozzle 14 are provided on the encapsulating material 11 Then, ultrasonic bonding is performed by pressing the circuit board 4 to the circuit board 4.
[0046]
In the component mounting apparatus shown in FIG. 6, the pressure is applied with a magnetic pressure of about 500 g to 5 kg by a voice coil motor 15 that raises and lowers the suction nozzle 14, and ultrasonic waves are applied to the suction nozzle 14 by oscillation of the piezoelectric element 16. A vibrating horn 17 is connected, and the suction nozzle 14 is subjected to ultrasonic vibration having a vibration frequency of 60 KHz and an amplitude of about 1 to 2 μm, and friction is generated between the pressed bumps 8 and the conductor lands 9. Ultrasonic bonding is performed with both melting or electron-bonding. As shown in FIG. 7, the suction nozzle 14 is connected to the support shaft 81 via an elastic tube 82 so as not to be broken when the ultrasonic vibration is applied. However, the support structure and support position of the suction nozzle 14 can be variously changed. A suction action from the support shaft 81 side is applied to the suction nozzle 14 through the elastic tube 82 to the suction nozzle 14. However, the specific configuration for that purpose is not particularly questioned and can be designed in various ways.
[0047]
Instead of the bumps 8 on the electrodes 7 of the embodiment shown in FIG. 3, or alternatively, bumps may be formed on the conductor lands 9 of the circuit board 4, and components such as the bare IC chip 3 and mounting objects such as the circuit board 4 may be mounted. When bumps are used for at least one of the electrical junctions of the object, a sufficient amount of metal is used for ultrasonic bonding at the local electrical junction between the component such as the bare IC chip 3 and the mounting object such as the circuit board 4. It can be achieved reliably in parts and easily without interference or damage in other parts.
[0048]
Although it is preferable to use a microcomputer as the control means 25, the present invention is not limited to this, and various configurations and control formats can be adopted. The program data 26 may have any form and configuration, such as data stored in an internal or external memory of the control means 25, or data based on sequence control configured with a hardware circuit.
[0049]
The suction nozzle 14 of the present embodiment is made of stainless steel and has a hardened layer 14b on the suction surface 14a as shown in FIGS. 1 (a) and 1 (b). Alternatively, as shown in FIG. Only the suction head portion 14c having the suction surface 14a provided at a part of the tip of the nozzle 14 is made of cemented carbide, and the surface has a predetermined surface roughness, for example, a surface roughness of about 3 μm to 5 μm. It is formed on a rough surface.
[0050]
The curing process is roughly classified into a coating process for coating the surface with a super hard metal or a super hard material and a reforming process for modifying the surface layer. The coating process is typified by ultra-hard chrome plating, high-functional plating such as hard chrome called nibokuron + various ceramic impregnation plating, wear-resistant thermal spraying by thermal spraying of metal ceramics, diamond coating that forms a diamond-like carbon film, etc. There are various thin film processing in vacuum. The reforming process includes a Kanak process or a New Kanak process, which is a special curing method using a special gas chamber.
[0051]
In ceramic hard coating, for example, when the coating material is TiN, the hardness is 2,300 HV, the film thickness is 2 to 3 μm, the heat resistance temperature is 600 ° C., the friction coefficient is 0.4, the processing temperature is 300 to 500 ° C., and the hardness is TiCN. 3,300 HV, film thickness is 3 to 5 μm, heat resistance temperature is 400 ° C., friction coefficient is 0.3, and processing temperature is 450 to 500 ° C. All of which improve wear resistance.
[0052]
The Kanak process is a type of vacuum nitriding process, and NH is placed in a high vacuum furnace. Three A nitriding promotion gas containing a main component is sent and the surface is reformed by diffusing it into the base material by the action of an active substance containing a sustaining agent, a nitrogen generator and an anti-adhesive agent, and its hardness is remarkably increased.
[0053]
According to this, it has excellent wear resistance, and the surface of stainless steel is raised to Micro Vickers HV1500. The diffusion layer is 20 μm to 80 μm. Since there is no fragile layer, the diffusion hardened layer is stable without defects, peeling or pinholes. The processing temperature is 500 ° C. to 540 ° C., but dimensional changes such as warpage and expansion are minimal.
[0054]
These surface treatments are basically performed only on the suction surface 14a, but in order to prevent the treatment layer from being peeled off, the surface treatment continuously extends to the side peripheral surface following the suction surface 14a of the suction nozzle 14. It is suitable. However, it is preferable to keep the suction nozzle 14 at the tip end region so as not to affect the vibration characteristics.
[0055]
In addition, in any type of suction nozzle 14 shown in FIG. 1 and FIG. 2, the stainless steel portion is a basic body that is tempered and tempered with the SUS420J2, and the suction head portion 14c is made of cemented carbide. The base body 14d made of stainless steel is fitted as shown in FIG. Cemented carbides include WC-Co and WC-Ti (Ta, Nb) C-Co.
[0056]
Using the suction nozzles 14 shown in FIGS. 1 and 2, as described above, the bare IC chip 3 sucked by the suction surface 14 a is applied with the metal joints 5 and 6 facing the circuit board 4. A component for mounting the bare IC chip 3 on the circuit board 4 by applying ultrasonic vibration from the ultrasonic vibration means 24 to the suction nozzle 14 while applying pressure, and frictionally bonding the metal joints 5 and 6 with this vibration. In the mounting method, the suction nozzle 14 is made of stainless steel, and the suction surface 14a is formed to be a rough surface having a predetermined surface roughness, so that the suction head is made of a hardened layer 14b or a super hard metal only at one end. It is possible to achieve the ultrasonic bonding with high quality in a short time by exhibiting suitable vibration characteristics and suitable vibration transmission characteristics to the bare IC chip 3 without the influence of the portion 14c, and further, a curing process Or carbide According to the genus, the surface roughness of the suction surface 14a, which is a rough surface, is reduced to about a fraction of the conventional level by reducing wear, electrochemical reaction, foreign matter, and the like during ultrasonic bonding, and the above-described favorable bonding characteristics are achieved. The time required for the reproduction process can be reduced to about a fraction of the time. Therefore, the life of the suction nozzle 14 is lengthened, the labor of the regeneration process is reduced, and the downtime of the work for mounting the components with the ultrasonic joining of the metal joining portion is shortened, thereby improving the productivity.
[0057]
Furthermore, in the component mounting method according to the present embodiment, the suction surface 14a is set to the abrasive 101 as shown in FIGS. 4A and 5 at a predetermined time while repeating ultrasonic bonding by the suction nozzle as described above. The ultrasonic vibration is applied to the suction nozzle 14 in the same manner as described above in a state where the suction surface 14 is in contact with the suction nozzle 14 to cause the suction surface 14a and the abrasive 101 to rub, thereby regenerating the suction surface 14a to a predetermined surface roughness. In this way, polishing for regeneration can be achieved efficiently and in a short time with vibrational friction due to ultrasonic vibration, so the time for regeneration processing can be shortened and the suction nozzle is replaced during component mounting work. This is effective for performing the reproduction process without using the program.
[0058]
As the abrasive 101, a continuous material such as the wrapping tape shown in FIG. 5 is used, and the abrasive 101 moves between the supply roller 102 and the take-up roller 103 so as to update the contact position with the suction surface 14a. Then, the characteristic regeneration process can be stably and repeatedly performed without changing the abrasive 101 one by one. The movement may be performed once or every time the regeneration process is completed, or may be performed intermittently or continuously during polishing.
[0059]
Here, the data of the example shows that the load for frictional contact is 300 to 500 g, the ultrasonic vibration has a frequency of 60 kHz, the vibration amplitude is 1 to 2 μm, and the roughness count is # 8000 to # 10000. When the material 101 was moved 10 to 20 mm at a speed of 10 to 50 mm / sec, it could be regenerated to a sufficient surface roughness in a short time of about 30 seconds.
[0060]
In the component mounting apparatus of the present embodiment, in order to perform the regeneration using the abrasive 101, the polishing means 104 that supports or guides the abrasive 101 and uses it for the regeneration by polishing the suction surface 14a includes the component mounting position B2. The control means 25 is configured to adjust the suction surface 14a of the suction nozzle 14 at a predetermined time in conjunction with a component mounting operation for ultrasonically bonding a component such as the bare IC chip 3 to a mounting target such as the circuit board 4. The ultrasonic vibration means 24 is operated while being in contact with the polishing material 101 of the polishing means 104 to rub the suction surface 14a and the polishing material 101 to polish the suction surface 14a.
[0061]
In this way, the control means 25 can remove the suction surface 14a of the suction nozzle 14 and the abrasive 101 at a predetermined time while repeating the mounting of the suction nozzle 14 and mounting the components as described above with a single device. Since the ultrasonic vibration means 24 is applied to the suction nozzle 14 while it is in contact with the suction nozzle 14 to cause friction, and the regeneration process by polishing is automatically performed, the suction nozzle 14 is shortened to the use limit by repeating the regeneration process. It can be used until it reaches the end of its life, and the trouble of detaching each time the suction nozzle 14 is reclaimed can be saved, so that the apparatus can be prevented from being stopped for a long time to reduce the productivity.
[0062]
The polishing means 104 includes a level adjustment means 105 for supporting the abrasive 101 and adjusting the horizontal state of the supporting surface 106a for guiding and supporting the abrasive 101 as shown in FIGS. Yes. The horizontal adjustment means 105 is provided with a surface plate 106 made of stainless steel supported by a stand 109. The surface plate 106 has a swinging portion 106b due to a constricted portion from the periphery in the middle of the surface plate 106, and the upper plate 106c having a support surface 106a divided into two vertically at the constricted portion is swung with respect to the lower plate 106d. The support surface 106a can be horizontally adjusted depending on the direction and amount of the swing.
[0063]
Therefore, in the embodiment shown in the figure, one of the upper board 106c and the lower board 106d, the adjustment bolt 107 screwed into the lower board 106d from below and brought into contact with the other upper board 106c from below is attached to the swinging portion 106b. 3 places or 4 places as in the embodiment shown in the figure, and adjusting the distance of the upper board 106c relative to the lower board 106d around the swinging part 106b by screwing or unscrewing the adjusting bolt 107 in each part. The horizontal adjustment can be performed so that a horizontal state is obtained in which the support surface 106a is perpendicular to the axis of the suction nozzle 14 determined on the apparatus. However, the specific adjustment method and adjustment means for such a horizontal state can be variously changed.
[0064]
Thus, when a horizontal state is obtained that is perpendicular to the axis of the suction nozzle 14 on the apparatus when the component handling means 23 handles the suction nozzle 14, the suction surface 14 a is oriented perpendicular to the axis of the suction nozzle 14. It is possible to prevent the deviation of the orientation of the suction surface 14a by automatically polishing the suction surface 14a and performing the regeneration process.
[0065]
Further, when the polishing means 104 forms the support surface 106a with the glass plate 108 held by suction on the upper plate 106c to be leveled as shown in FIG. When the suction nozzle 14 that is ultrasonically vibrated is pressed and polished, the support surface 106a of the abrasive 101 does not escape due to elastic deformation as in the case of a metal member. Therefore, the support surface 106a of the abrasive 101 is horizontally adjusted. The suction surface 14a can be polished with the correct orientation. However, it is preferable to use a glass plate having a high degree of flatness, and the glass plate 108 is not necessarily limited to a glass plate and can be replaced with another glass plate having the same effect.
[0066]
In order for the control means 25 to perform the polishing by the polishing means 104, the feeding means 111 including the supply roller 102 and the take-up roller 103 for moving the abrasive 101 is appropriately operated. Thus, each time the regeneration process by polishing is completed once or necessary times, the portion where the suction surface 14a of the abrasive 101 is polished is conveyed or intermittently or continuously conveyed during polishing. It can be automatically achieved to update sequentially.
[0067]
Instead of the regeneration process of the polishing, as shown in FIG. 4B, the suction nozzle 12 can be cleaned by applying ultrasonic vibration to the suction nozzle 12 in the state where the suction surface 14a is immersed in the cleaning liquid 112 as described above. Thus, even if the adhering matter clogged to the suction surface 14a is removed by the joining of the parts, the regeneration processing is performed to regenerate the suction surface 14a to a predetermined surface roughness, and this cleaning is performed by the polishing means 104 as described above. When the suction surface 14a is polished by the method, it is advantageous because it adheres to the rough surface regenerated by polishing the suction surface 14a and removes clogged polishing powder and the like, thereby eliminating the influence on the vibration transmission characteristics. . The cleaning liquid 112 is preferably alcohol, and C 2 H Five There are OH and the like. However, the present invention is not limited to this, and other appropriate ones may be adopted.
[0068]
After cleaning, if the suction surface 14a is blown by the blowing means 113 as shown in FIG. 4C, the cleaning liquid 112 can be dried at an early stage. It is effective to perform the regeneration process without replacing the suction nozzle 14.
[0069]
In the component mounting apparatus of the present embodiment, the cleaning tank 114 for storing the cleaning liquid 112 and the blowing unit 113 are disposed in the polishing unit 104 in order to perform the cleaning and blowing together with the polishing by the polishing unit 104. The control unit 25 performs the cleaning by the cleaning tank 114 and the blowing by the blowing unit 113 for each predetermined time after the polishing by the polishing unit 104. Both may take a few seconds. Blowing with cold air is advantageous because there is no heat effect or heat consumption. According to the component mounting apparatus of the present embodiment, the regeneration processing by polishing, cleaning, and drying can be automatically performed by one apparatus that performs component mounting.
[0070]
As shown in FIG. 3, the component mounting apparatus according to the present embodiment further includes slip detection means 115 that detects a slip state between the suction surface 14 a and the components such as the bare IC chip 3 during ultrasonic bonding. The control means 25 performs polishing according to the detection result of the slip detection means 115. As a result, compared to the case where the predetermined time is a predetermined time, it can be dealt with whenever necessary. Therefore, the regeneration process is delayed and the bonding quality is deteriorated, or the regeneration process is too early and the suction nozzle 14 is polished. It can be prevented that the number of times is unnecessarily increased and the life is shortened. The slip detection means 115 monitors and detects the vibration state of the horn 17 that vibrates ultrasonically by the oscillation of the piezoelectric element 16 that is an ultrasonic vibration source. Specifically, the determination may be made based on the difference that the ultrasonic vibration of the horn 17 increases as the friction between the suction surface 14a and the components such as the bare IC chip 3 increases, and the ultrasonic vibration decreases as the friction decreases. It is possible to monitor as a change in the amount of slip and to detect slippage. Further, such a change can be visually observed using an oscilloscope 116 or the like.
[0071]
Furthermore, in the component mounting method as described above, the ultrasonic vibration applied to the suction nozzle 14 for ultrasonic bonding is in a polishing direction in which the suction surface 14a is roughened, that is, in a direction in which a streak-like polishing mark is formed by polishing. Yes, in the apparatus of the present embodiment, it is given in the direction intersecting with the direction of ultrasonic vibration for polishing. As a result, ultrasonic vibration is performed in a direction intersecting with the streak-shaped polishing marks when the suction surface 14a is polished, and the catching property with the component is improved, so that the vibration transmission characteristic to the component is improved. In this sense, the polishing direction and the vibration direction are more preferably orthogonal.
[0072]
【The invention's effect】
According to the suction nozzle of the present invention, in order to ultrasonically join the parts and the metal parts of the mounting target, the suction nozzle is made of stainless steel, and the suction surface is formed into a rough surface having a predetermined surface roughness. Therefore, the ultrasonic bonding is shortened by exhibiting suitable vibration characteristics and suitable vibration transmission characteristics to the parts without the influence of the hardened layer or the suction head portion made of a hard metal of only one end. It can be achieved with high quality in time, and the surface roughness of the adsorbed surface, which is a rough surface, is reduced by wear, electrochemical reaction, influence of foreign matter, etc. due to hardening treatment or cemented carbide. Good bonding characteristics can be maintained stably for a long time, and the frequency of regeneration treatment can be reduced. Accordingly, the life of the suction nozzle is increased, the labor of the regeneration process is reduced, and the downtime of the joining operation is shortened, thereby improving the productivity.
[0073]
According to the component mounting method of the present invention, the ultrasonic vibration is applied to the suction nozzle in the same manner as described above while the ultrasonic bonding by the suction nozzle is repeated and the suction surface is in contact with the abrasive at a predetermined time. According to the component mounting method in which the surface and the abrasive are rubbed and the adsorption surface is regenerated to a predetermined surface roughness, the regrinding is efficiently and quickly performed by vibrational friction due to ultrasonic vibration. Therefore, the time for the regeneration process can be shortened, which is effective for performing the regeneration process without replacing the suction nozzle during the component mounting operation.
[0074]
According to the component mounting apparatus of the present invention, while repeating the component mounting with ultrasonic bonding of the metal joint portion in one device, the suction surface of the suction nozzle is kept in contact with the abrasive at a predetermined time. Since the sonic vibration means is used to perform polishing and regeneration processing automatically, the suction nozzle will continue to be used until it reaches its end of life due to repeated regeneration processing, and it is removed and attached each time the suction nozzle is regenerated. Such a trouble can be saved, and the apparatus can be prevented from being paused for a long time to reduce the productivity. In addition, by performing polishing according to the detection of the sliding state between the suction surface and the part, it is possible to cope with the required time as compared with the case where the predetermined time is a predetermined time. It is possible to prevent the joining quality from being deteriorated due to the processing delay, or the regeneration processing from being too early to shorten the life of the suction nozzle.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an example of a suction nozzle according to an embodiment of the present invention, in which FIG. 1 (a) is an overall view showing a part in cross section, and FIG.
FIG. 2 is a side view of a part on the suction surface side, which is a partial cross-sectional view showing another example of the suction nozzle in the embodiment of the present invention.
FIG. 3 is an explanatory diagram of an embodiment in a state where a bare IC chip is mounted on a circuit board with metal bonding by the suction nozzle shown in FIGS. 1 and 2;
4A and 4B show the state of regeneration processing performed in conjunction with the mounting operation shown in FIG. 3, wherein (a) shows the polishing of the suction surface of the suction nozzle, (b) shows cleaning, and (c) shows each operation of blowing. It is explanatory drawing of a state.
FIG. 5 is a perspective view showing a polishing means for performing the polishing of FIG.
6 shows an overall schematic configuration of a component mounting apparatus as a typical embodiment that performs the mounting operation of FIG. 3 of the present invention and the reproduction processing operations of (a) to (c) of FIG. It is a perspective view.
7 is a cross-sectional view of a joining unit that is a part of the component handling unit of the apparatus of FIG. 6. FIG.
8 is a perspective view of a bonding stage in a component mounting position of the apparatus of FIG.
9 is a perspective view showing reversing means in the component handling means of the apparatus of FIG. 6. FIG.
10 is a perspective view showing joining means in the component handling means of the apparatus of FIG.
[Explanation of symbols]
3 Bare IC chip
4 Circuit board
3a, 4a Joint surface
5, 6 Metal joint
7 electrodes
8 Bump
9 Conductor land
10 Welded joint
14 Suction nozzle (component mounting tool)
14a Adsorption surface
14b Hardened layer
14c Suction head
14d basic body
15 Voice coil motor
21 Parts supply department
22 Mounting object handling means
23 Parts handling means
23a Inversion means
23b Joining means
24 Ultrasonic vibration means
25 Control means
26 Program data
33 Loader section
35 Bonding stage
37 Expanding stand
101 abrasive
104 Polishing means
105 Leveling means
106 Surface plate
106a Support surface
106b Swing part
107 Adjustment bolt
108 glass plate
111 Feeding means
112 Cleaning solution
113 Blow means
114 Washing tank
115 Slip detection means

Claims (18)

超音波振動を働かせ部品を実装する部品実装ツールであって、ステンレス鋼よりなり、吸着面に改質処理による硬化処理層を有するとともに表面が超音波振動による摩擦接合のための所定の面粗度に形成され、硬化処理層は、改質処理層であることを特徴とする部品実装ツール。A component mounting tool that uses ultrasonic vibration to mount a component, which is made of stainless steel, has a hardened layer by modification treatment on the adsorption surface, and the surface has a predetermined surface roughness for friction bonding by ultrasonic vibration A component mounting tool, wherein the hardened layer is a modified layer. 超音波振動を働かせ部品を実装する部品実装ツールであって、吸着面を持った吸着ヘッド部を除く他の部分をステンレス鋼製とし、前記吸着ヘッド部をステンレス鋼に比し超硬の金属製とし、吸着面が超音波振動による摩擦接合のための所定の面粗度に形成されていることを特徴とする部品実装ツール。A component mounting tool that uses ultrasonic vibrations to mount components. The other parts except for the suction head with the suction surface are made of stainless steel, and the suction head is made of super hard metal compared to stainless steel. A component mounting tool, wherein the suction surface is formed to have a predetermined surface roughness for friction bonding by ultrasonic vibration. ステンレス鋼よりなり、吸着面が硬化処理による改質処理層が形成され、かつ吸着面が超音波振動による摩擦接合のための所定の面粗度とした吸着ノズルを用い、この吸着ノズルの吸着面で吸着した部品を、実装対象物に対し互いの金属接合部を対向させて加圧しながら、吸着ノズルに超音波振動を与えて、この振動により金属接合部どうしを摩擦させて超音波接合し部品を実装対象物に実装することを特徴とする部品実装方法。The suction surface of the suction nozzle is made of stainless steel, and the suction surface is formed with a modified treatment layer formed by a hardening process, and the suction surface has a predetermined surface roughness for friction welding by ultrasonic vibration. Applying ultrasonic vibration to the suction nozzle while applying pressure to the parts to be picked up against each other with the metal joints facing each other, and ultrasonically joining the metal joints by this vibration. A component mounting method characterized in that the component is mounted on a mounting object. 吸着面を持った吸着ヘッドを除く他の部分がステンレス鋼よりなり、前記吸着ヘッドが超硬の金属製で、吸着面が超音波振動による摩擦接合のための所定の面粗度に形成された吸着ノズルを用い、この吸着ノズルの吸着面で吸着した部品を、実装対象物に対し互いの金属接合部を対向させて加圧しながら、吸着ノズルに超音波振動を与えて、この振動により金属接合部どうしを摩擦させて超音波接合し部品を実装対象物に実装することを特徴とする部品実装方法。The other parts except the suction head having the suction surface are made of stainless steel, the suction head is made of a hard metal, and the suction surface is formed to a predetermined surface roughness for frictional joining by ultrasonic vibration. Using the suction nozzle, ultrasonic vibration is applied to the suction nozzle while pressing the parts sucked on the suction surface of the suction nozzle with the metal joints facing each other to be mounted, and this vibration causes metal bonding. A component mounting method, wherein parts are rubbed and ultrasonically bonded to mount a component on a mounting target. 吸着ノズルの超音波振動による摩擦接合のための所定の面粗度とした吸着面に吸着した部品を、実装対象物に対し互いの金属接合部を対向させて加圧しながら、吸着ノズルに超音波振動を与えて、この振動により金属接合部どうしを摩擦させて超音波接合し、部品を実装対象物に実装することを繰り返す工程と、吸着面を研磨材に接触させた状態で吸着ノズルに超音波振動を与えて、吸着面と研磨材とを摩擦させ、吸着面を所定の面粗度に研磨して再生する再生処理を行う工程とを備えたことを特徴とする部品実装方法。Ultrasonic waves are applied to the suction nozzle while pressing the parts adsorbed on the suction surface with a predetermined surface roughness for friction welding by ultrasonic vibration of the suction nozzle against each other with the metal joints facing each other. Applying vibration, friction between the metal joints by this vibration, ultrasonic bonding, and repeated mounting of the component on the mounting target, and superposition of the suction nozzle with the suction surface in contact with the abrasive A component mounting method comprising: a step of applying a sound wave vibration to rub the adsorbing surface and an abrasive and polishing the adsorbing surface to a predetermined surface roughness for regeneration. 研磨材は連続したものを用い、吸着面との接触位置を更新するように送る請求項５に記載の部品実装方法。The component mounting method according to claim 5, wherein a continuous abrasive is used so as to update a contact position with the suction surface. 吸着ノズルの超音波振動による摩擦接合のための所定の面粗度とした吸着面に吸着した部品を、実装対象物に対し互いの金属接合部を対向させて加圧しながら、吸着ノズルに超音波振動を与えて、この振動により金属接合部どうしを摩擦させて超音波接合し部品を実装対象物に実装することを繰り返す工程と、吸着面を洗浄液に浸漬させた状態で吸着ノズルに超音波振動を与えて洗浄し、吸着面を所定の面粗度に再生する再生処理を行う工程とを備え、再生処理は吸着面を研磨した後に洗浄することにより行うことを特徴とする部品実装方法。Ultrasonic waves are applied to the suction nozzle while pressing the parts adsorbed on the suction surface with a predetermined surface roughness for friction welding by ultrasonic vibration of the suction nozzle against each other with the metal joints facing each other. Applying vibration, rubbing the metal joints by this vibration and ultrasonic bonding to repeatedly mount the component on the mounting object, and ultrasonic vibration to the suction nozzle with the suction surface immersed in the cleaning liquid And a step of performing a regeneration process for regenerating the suction surface to a predetermined surface roughness, and the regeneration process is performed by polishing and then cleaning the suction surface. 研磨は、吸着ノズルに与える超音波振動の方向と交差する方向で研磨材と吸着面とを摩擦させて行う請求項７に記載の部品実装方法。The component mounting method according to claim 7, wherein the polishing is performed by rubbing the abrasive and the suction surface in a direction crossing a direction of ultrasonic vibration applied to the suction nozzle. 吸着ノズルに与える超音波振動は、吸着面を超音波振動による摩擦接合のための所定の面粗度にする研磨方向と交差する方向で与える請求項５、７のいずれか一項に記載の部品実装方法。The component according to any one of claims 5 and 7, wherein the ultrasonic vibration applied to the suction nozzle is applied in a direction intersecting with a polishing direction that makes the suction surface have a predetermined surface roughness for friction bonding by ultrasonic vibration. Implementation method. 部品を供給する部品供給部と、部品を実装する実装対象物を取り扱い位置決めして部品の実装に供する実装対象物取り扱い手段と、供給される部品を吸着ノズルの吸着面に吸着、保持して取り扱い、位置決めされた実装対象物との間で金属接合部どうしを対向させて加圧しながら超音波振動による超音波接合を伴い部品を実装対象物に実装する部品取り扱い手段と、吸着ノズルに超音波振動を与える超音波振動手段と、研磨材と吸着面との摩擦接触にて吸着面を超音波振動による摩擦接合のための所定の面粗度に研磨する研磨手段と、部品を実装対象物に超音波接合を伴い実装するのに併せ、予め定められ、または滑り検出結果に応じた時期に、吸着ノズルの吸着面を研磨手段の研磨材に接触させながら超音波振動手段を働かせて、吸着面と研磨材を摩擦させ、吸着面を研磨させる制御手段とを備えたことを特徴とする部品実装装置。A component supply unit for supplying components, a mounting object handling means for handling and positioning a mounting object on which the component is mounted, and mounting the component, and a component to be supplied being sucked and held on the suction surface of the suction nozzle , Component handling means for mounting components on the mounting object with ultrasonic bonding while pressing the metal joints facing each other with the mounted mounting object, and ultrasonic vibration on the suction nozzle An ultrasonic vibration means for imparting friction, a polishing means for polishing the suction surface to a predetermined surface roughness for friction welding by ultrasonic vibration by frictional contact between the abrasive and the suction surface, In addition to mounting with sonic bonding, the ultrasonic vibration means is operated while the suction surface of the suction nozzle is in contact with the polishing material of the polishing means at a predetermined time or according to the slip detection result. Migakuzai to friction, the component mounting apparatus characterized by comprising a control means for polishing the suction surface. 超音波接合時の吸着面と部品との間の滑り状態を検出する滑り検出手段を備え、制御手段は滑り検出手段の検出結果に応じて吸着面を研磨させる請求項１０に記載の部品実装装置。The component mounting apparatus according to claim 10, further comprising a slip detection unit that detects a slip state between the suction surface and the component during ultrasonic bonding, wherein the control unit polishes the suction surface according to a detection result of the slip detection unit. . 洗浄液を貯留した洗浄槽を備え、制御手段は吸着ノズルの吸着面を研磨した後、吸着ノズルの吸着面を洗浄槽内の洗浄液に浸漬させるとともに、超音波振動手段を働かせて、研磨後の吸着面を洗浄させる請求項１０、１１のいずれか一項に記載の部品実装装置。The cleaning unit is equipped with a cleaning tank in which the cleaning liquid is stored.After the suction surface of the suction nozzle is polished, the suction surface of the suction nozzle is immersed in the cleaning liquid in the cleaning tank, and the ultrasonic vibration means is used to perform the suction after polishing. The component mounting apparatus according to claim 10, wherein the surface is cleaned. ブロー手段を備え、制御手段は洗浄後の吸着面をブロー手段によりブローして乾燥させる請求項１２に記載の部品実装装置。The component mounting apparatus according to claim 12, further comprising a blowing unit, wherein the control unit blows and drys the suction surface after the cleaning by the blowing unit. 研磨手段は、研磨材を吸着面との接触位置に支持し、または案内する支持面の水平状態を調整する水平調整手段を備えている請求項１０〜１３のいずれか一項に記載の部品実装装置。The component mounting according to any one of claims 10 to 13, wherein the polishing means includes a horizontal adjusting means for adjusting the horizontal state of the supporting surface that supports or guides the abrasive at a position in contact with the suction surface. apparatus. 研磨手段は、水平調整される定盤の上に吸着保持されたガラス板にて支持面を形成している請求項１４に記載の部品実装装置。The component mounting apparatus according to claim 14, wherein the polishing means forms a support surface with a glass plate held by suction on a horizontally adjusted surface plate. 研磨手段は、長尺の研磨材を支持面上を送る送り手段を備え、制御手段は研磨に際し適宜に送り手段を働かせる請求項１０〜１５のいずれか一項に記載の部品実装装置。The component mounting apparatus according to any one of claims 10 to 15, wherein the polishing unit includes a feeding unit that feeds a long abrasive on the support surface, and the control unit appropriately operates the feeding unit during polishing. 吸着ノズルに吸着された部品と実装対象物との金属接合部を対向させ、超音波振動による超音波接合を行う部品実装装置であって、前記吸着ノズルの吸着面を超音波振動による摩擦接合のための所定の面粗度に研磨する研磨手段と、予め定められた、または滑り検出結果に応じた時期に吸着ノズルの吸着面を研磨させる制御手段とを備えたことを特徴とする部品実装装置。A component mounting apparatus that performs ultrasonic bonding by ultrasonic vibration by facing a metal bonding portion between a component sucked by a suction nozzle and a mounting object, and the suction surface of the suction nozzle is subjected to friction bonding by ultrasonic vibration. And a control means for polishing the suction surface of the suction nozzle at a predetermined time or in accordance with a slip detection result. . 吸着ノズルに吸着された部品と実装対象物との金属接合部を対向させ、超音波振動による超音波接合を行う部品実装装置であって、研磨材と、予め定められた、または滑り検出結果に応じた時期に吸着ノズルの吸着面を前記研磨材に接触させながら超音波振動を働かせ、前記吸着ノズルの吸着面を超音波振動による摩擦接合のための所定の面粗度に研磨させる制御手段を備えたことを特徴とする部品実装装置。A component mounting apparatus that performs ultrasonic bonding by ultrasonic vibration by facing a metal bonded portion between a component sucked by a suction nozzle and a mounting object, and a polishing material and a predetermined or slip detection result. Control means for applying ultrasonic vibration while bringing the suction surface of the suction nozzle into contact with the abrasive at a suitable time, and polishing the suction surface of the suction nozzle to a predetermined surface roughness for friction welding by ultrasonic vibration. A component mounting apparatus comprising:
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